A heat dissipation platform and a semiconductor laser

Abstract

This utility model belongs to the field of laser technology, specifically disclosing a heat dissipation platform and a semiconductor laser. The heat dissipation platform includes a mounting bracket, a mounting platform, a shock absorber, and a cooling fan. One end of the shock absorber is mounted on the support arm of the mounting bracket, and the other end is connected to the first panel of the mounting platform. A heat dissipation channel is formed between the first and second panels of the mounting platform, and the cooling fan faces the heat dissipation channel. When optoelectronic components mounted on the first and / or second panels require rapid heat dissipation, the cooling fan provides forced air cooling to the heat dissipation channel, rapidly cooling the optoelectronic components. Simultaneously, the shock absorber between the support arm and the first panel absorbs the vibration generated by the rotation of the cooling fan, preventing vibration from interfering with the optoelectronic components and improving their performance. This utility model also provides a semiconductor laser, including the aforementioned heat dissipation platform.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a heat dissipation platform and a semiconductor laser. Background Technology

[0002] Currently, optoelectronic components in semiconductor lasers are generally fixed on a base. A fan or other forced cooling structure is installed on one side of the component to cool it down and ensure it doesn't overheat and can operate normally. However, the vibration generated by the fan during operation is transmitted to the component through the base, affecting its performance. For example, some single-frequency lasers require TEC temperature control to adjust the wavelength of their single-frequency gratings. When excessive heat necessitates forced air cooling with a fan, the fan vibration severely affects the linewidth, degrading the performance of the single-frequency laser. Utility Model Content

[0003] The purpose of this invention is to provide a heat dissipation platform and a semiconductor laser that can ensure good heat dissipation while mitigating the impact of vibrations generated by the fan during operation on optoelectronic components, resulting in good performance of each optoelectronic component.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] On the one hand, this utility model provides a heat dissipation platform, including:

[0006] The mounting frame has a support arm on each of its opposite sides, and the two support arms extend toward each other.

[0007] The mounting platform includes a first panel and a second panel arranged at an interval between the upper and lower parts. The first panel and the second panel are detachably connected. A heat dissipation channel is formed between the end faces of the first panel and the second panel that are close to each other. The end faces of the first panel and the second panel that are far apart from each other are used to mount optoelectronic components.

[0008] The shock absorber has one end mounted on the support arm and the other end connected to the first panel;

[0009] A cooling fan is mounted on the mounting bracket and faces the heat dissipation channel.

[0010] Optionally, the heat dissipation platform includes a first connector, the support arm is provided with a first through hole, one end of the shock absorber is provided with a first threaded hole, and the first connector passes through the first through hole and is threadedly engaged with the first threaded hole.

[0011] And / or, the heat dissipation platform includes a second connector, the first panel has a second through hole, the other end of the shock absorber has a second threaded hole, and the second connector passes through the second through hole and is threaded into the second threaded hole.

[0012] Optionally, the support arm has a limiting groove on the side facing the first panel, and the shock absorber is partially embedded in the limiting groove.

[0013] Optionally, the heat dissipation platform includes a third connector, one of the first panel and the second panel is provided with a third through hole, and the other of the first panel and the second panel is provided with a third threaded hole, and the third connector passes through the third through hole and is threadedly engaged with the third threaded hole.

[0014] Optionally, one of the first panel and the second panel is provided with a plurality of spaced heat dissipation fins, and the plurality of heat dissipation fins extend toward the other of the first panel and the second panel, and the plurality of heat dissipation fins divide the heat dissipation channel into a plurality of sub-channels.

[0015] Optionally, the mounting bracket includes a front panel, a rear panel, and two side panels. The front panel and the rear panel are opposite to each other, and the two side panels are opposite to each other. Each of the two side panels is provided with a support arm on one side that is close to the other. The cooling fan is disposed on the rear panel.

[0016] Optionally, a raised rib is provided on each of the two side panels that are opposite to each other.

[0017] Optionally, the front panel is provided with interface fixing holes and ventilation holes, the ventilation holes being directly opposite the heat dissipation channel, and the rear panel is provided with mounting holes, the cooling fan being directly opposite the mounting holes.

[0018] On the other hand, the present invention provides a semiconductor laser, including optoelectronic components and a heat dissipation platform as described in any of the above embodiments, wherein the optoelectronic components are arranged on a first panel and / or a second panel of the heat dissipation platform.

[0019] Optionally, the semiconductor laser further includes an upper shell and a lower shell, both of which are connected to the mounting bracket of the heat dissipation platform. The upper shell, the lower shell, and the mounting bracket together form an accommodating space, which is used to place the mounting platform of the heat dissipation platform.

[0020] The beneficial effects of this utility model are as follows:

[0021] This invention provides a heat dissipation platform, including a mounting bracket, a mounting platform, a shock absorber, and a cooling fan. The mounting bracket has a support arm, one end of the shock absorber is mounted on the support arm, and the other end of the shock absorber is connected to a first panel of the mounting platform. The mounting platform also includes a second panel, and a heat dissipation channel is formed between the adjacent end faces of the first and second panels. The cooling fan faces the heat dissipation channel. When optoelectronic components mounted on the first and / or second panels require rapid heat dissipation, the cooling fan provides forced air cooling to the heat dissipation channel, rapidly cooling the optoelectronic components on the first and second panels. Simultaneously, the shock absorber between the support arm and the first panel absorbs the vibration generated by the cooling fan's rotation, preventing interference with the optoelectronic components and improving their performance.

[0022] This invention also provides a semiconductor laser, including optoelectronic components and the aforementioned heat dissipation platform. The optoelectronic components are arranged on a first panel and / or a second panel of the heat dissipation platform. By employing the aforementioned heat dissipation platform, the cooling fan on the mounting bracket can promptly dissipate the heat conducted by the optoelectronic components to the first panel and / or the second panel, resulting in excellent heat dissipation. Simultaneously, the cooling fan is connected to the mounting bracket, while the optoelectronic components are connected to the mounting platform. The mounting bracket and the mounting platform are connected by shock-absorbing components, effectively isolating the cooling fan from vibrations from the external environment. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the mounting bracket, including the side panel, shock absorber, and mounting platform, after assembly in this embodiment of the utility model.

[0025] Figure 2 yes Figure 1 A magnified view of a section at point A in the middle;

[0026] Figure 3 This is a schematic diagram of the structure of the mounting bracket and shock absorber after assembly in the embodiment of this utility model;

[0027] Figure 4 This is a schematic diagram of the heat dissipation platform provided in the embodiments of this utility model;

[0028] Figure 5 This is a schematic diagram of the heat dissipation platform provided in this embodiment of the present invention from another perspective;

[0029] Figure 6 This is a top view of the mounting bracket, its side panel, shock absorbers, and the mounting platform after assembly, as provided in this embodiment of the utility model.

[0030] Figure 7 yes Figure 6 Sectional view of section BB;

[0031] Figure 8 yes Figure 7 A magnified view of a section at point D;

[0032] Figure 9 yes Figure 6 A sectional view of section C-C;

[0033] Figure 10 yes Figure 9 A magnified view of a section at point E in the middle;

[0034] Figure 11 This is an exploded view of the semiconductor laser provided in the embodiments of this utility model.

[0035] In the picture:

[0036] 100. Mounting bracket; 110. Front panel; 111. Interface fixing hole; 112. Ventilation hole; 113. Fourth threaded hole; 114. Sixth threaded hole; 115. Seventh threaded hole; 120. Rear panel; 121. Mounting hole; 122. Fifth threaded hole; 130. Side panel; 1301. Fourth through hole; 1302. Fifth through hole; 131. Support arm; 1311. First through hole; 1312. Limiting groove; 132. Raised rib;

[0037] 200. Mounting platform; 210. First panel; 211. Second through hole; 212. Third threaded hole; 213. Heat dissipation fins; 220. Second panel; 221. Third through hole; 230. Sub-channel;

[0038] 300, shock absorber; 310, first threaded hole; 320, second threaded hole; 400, cooling fan;

[0039] 510. First connecting member; 520. Second connecting member; 530. Third connecting member;

[0040] 600. Upper shell; 610. First fixing hole; 620. Second fixing hole;

[0041] 700, lower shell; 710, third fixing hole; 720, fourth fixing hole. Detailed Implementation

[0042] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0043] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0044] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0045] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0046] like Figures 1-5As shown, this embodiment provides a heat dissipation platform, which includes a mounting frame 100, a mounting platform 200, a shock absorber 300, and a cooling fan 400. The mounting frame 100 has a support arm 131 on each of its opposite sides along a first direction, extending towards each other. The mounting platform 200 includes a first panel 210 and a second panel 220 arranged vertically at intervals along a second direction. The first panel 210 and the second panel 220 are detachably connected, forming an integral structure after connection. A heat dissipation channel is formed between the adjacent end faces of the first panel 210 and the second panel 220, and both the heat dissipation channel and the support arms 131 extend along a third direction. The opposing end faces of the first panel 210 and the second panel 220 are used to mount optoelectronic components. In this embodiment, both the first panel 210 and the second panel 220 have mounting surfaces for mounting optoelectronic components (i.e., the opposing end faces of the first panel 210 and the second panel 220), which is beneficial for improving integration. The aforementioned first direction is... Figure 1 The X-axis direction shown is the second direction. Figure 1 The Z-axis direction shown is the third direction. Figure 1 The Y-axis direction is shown in the figure.

[0047] One end of the shock absorber 300 is mounted on the support arm 131, and the other end is connected to the first panel 210. For example, the shock absorber 300 can be a rubber column. A cooling fan 400 is mounted on the mounting bracket 100 and located on the adjacent side of the support arm 131. The cooling fan 400 and the heat dissipation channel are directly opposite each other along a third direction. When the optoelectronic components mounted on the first panel 210 and / or the second panel 220 require rapid heat dissipation, the cooling fan 400 can be turned on to force-cool the heat dissipation channel. The airflow carries away the heat from the first panel 210 and the second panel 220, thereby rapidly cooling the optoelectronic components and achieving good temperature control. Simultaneously, the shock absorber 300 between the support arm 131 and the first panel 210 absorbs the vibration generated by the rotation of the cooling fan 400, preventing interference with the optoelectronic components and resulting in superior performance.

[0048] As an alternative solution, see Figure 3In this embodiment, the mounting bracket 100 includes a front panel 110, a rear panel 120, and two side panels 130. The front panel 110 and the rear panel 120 are opposite each other along a third direction, and the two side panels 130 are opposite each other along a first direction. A support arm 131 is provided on each side of the two side panels 130 that are close to each other, and the two support arms 131 are close to each other along the first direction. The length direction of both the side panels 130 and the support arms 131 is along the third direction. A cooling fan 400 is disposed on the rear panel 120. Exemplarily, to accelerate air turbulence, multiple cooling fans 400 can be provided on the rear panel 120. This embodiment uses three cooling fans 400 as an example. In other embodiments, depending on the dimensions of the mounting bracket 100 along the first direction, other numbers of cooling fans 400 can be provided, arranged as needed.

[0049] Furthermore, two support arms 131 spaced apart along the first direction are used to support the two ends of the first panel 210 along the first direction, so that the force on the first panel 210 along the first direction is more balanced. Each support arm 131 may also be provided with multiple shock absorbers 300, which are spaced apart along three directions on the support arm 131, so that the force on the first panel 210 along the third direction is more balanced.

[0050] See section 2 for further details. Figures 6-8In this embodiment, the heat dissipation platform includes a first connector 510, a first through hole 1311 on the support arm 131, and a first threaded hole 310 at one end of the shock absorber 300. The first connector 510 passes through the first through hole 1311 and is threaded into the first threaded hole 310, thereby fixing the shock absorber 300 to the support arm 131. Further, the heat dissipation platform includes a second connector 520, a second through hole 211 on the first panel 210, and a second threaded hole 320 at the other end of the shock absorber 300. The second connector 520 passes through the second through hole 211 and is threaded into the second threaded hole 320, thereby fixing the shock absorber 300 to the first panel 210. By adopting the above assembly method, the heat dissipation platform is easy to assemble and disassemble, and the assembly efficiency is high. In addition, the mounting bracket 100 and the mounting platform 200 are connected only through the shock absorber 300. After the shock absorber 300 is assembled with the first panel 210 and the support arm 131, there is a first assembly gap between the end of the first panel 210 along the first direction and the end face of the side panel 130 facing the first panel 210, and there is a second assembly gap between the end of the second panel 220 along the first direction and the end face of the side panel 130 facing the second panel 220. This avoids interference between the first panel 210, the second panel 220 and the side panel 130, effectively alleviating the problem of vibration generated when the cooling fan 400 rotates being transmitted to the mounting platform 200 (including the first panel 210 and the second panel 220). The shock absorption effect is good, which helps to ensure that the optoelectronic components installed on the first panel 210 and the second panel 220 remain stable during operation and have excellent performance.

[0051] Optionally, the end face of the support arm 131 facing the first panel 210 is provided with a plurality of limiting grooves 1312, each corresponding to a shock absorber 300, and the first through hole 1311 is located at the bottom of the limiting groove 1312. The end of the shock absorber 300 near the support arm 131 is embedded in the limiting groove 1312. This facilitates the installation and positioning of the shock absorber 300 and the support arm 131, making assembly easy and achieving high assembly accuracy.

[0052] Furthermore, in some alternative solutions, a limiting structure can be provided on the support arm 131 and / or the first panel 210. The limiting structure can be a support rib, a protrusion, etc., to prevent excessive displacement of the installation platform 200 during transportation, which could damage or break the shock absorber 300. Of course, the limiting structure can also be provided on the side panel 130 and / or the second panel 220, which will not be described in detail here.

[0053] See also Figure 6 , Figure 9 and Figure 10The heat dissipation platform includes a third connector 530. One of the first panel 210 and the second panel 220 has a third through hole 221, and the other of the first panel 210 and the second panel 220 has a third threaded hole 212. The third connector 530 passes through the third through hole 221 and is threaded into the third threaded hole 212, thereby fixing the first panel 210 and the second panel 220 together. After the third connector 530 is assembled with the first panel 210 and the second panel 220, the mounting platform 200 forms a whole. The mounting platform 200 can be assembled with the shock absorber 300 on the mounting bracket 100 after assembly. In this embodiment, the first panel 210 has a third threaded hole 212, and the second panel 220 has a third through hole 221. By adopting the above assembly method, the first panel 210 and the second panel 220 are easy to process and convenient to assemble and disassemble.

[0054] Furthermore, one of the first panel 210 and the second panel 220 is provided with a plurality of heat dissipation fins 213 arranged at intervals along a first direction. All the heat dissipation fins 213 extend towards the other of the first panel 210 and the second panel 220, dividing the heat dissipation channel into multiple sub-channels 230. The arrangement of the heat dissipation fins 213 facilitates faster heat dissipation and improves heat dissipation efficiency. In this embodiment, the example given is that the first panel 210 is provided with a plurality of heat dissipation fins 213 arranged at intervals along the first direction, and all the heat dissipation fins 213 extend towards the second panel 220.

[0055] See also Figure 1 and Figure 3 Each of the two side panels 130 has a raised rib 132 on one side facing away from each other. The raised rib 132 can improve the structural strength of the side panel 130, and the rigidity of the side panel 130 after assembly with the front panel 110 and the rear panel 120 is higher, and the mounting bracket 100 is more secure and less prone to deformation.

[0056] Furthermore, the front panel 110 is provided with an interface fixing hole 111 and a ventilation hole 112. The interface fixing hole 111 facilitates the lead-out of the connector of the optoelectronic component, and the ventilation hole 112 is directly opposite to the heat dissipation channel in the third direction. The rear panel 120 is provided with a mounting hole 121, and the cooling fan 400 is directly opposite to the mounting hole 121 in the third direction. Thus, the airflow generated by the cooling fan 400 when it is working can flow through the mounting hole 121, the heat dissipation channel and the ventilation hole 112 in sequence, thereby quickly removing the heat from the first panel 210 and the second panel 220.

[0057] This embodiment also provides a semiconductor laser, see [link / reference] Figure 11The semiconductor laser includes optoelectronic components and the aforementioned heat dissipation platform. The optoelectronic components are arranged on the first panel 210 and / or the second panel 220 of the heat dissipation platform. By employing this heat dissipation platform, the cooling fan 400 on the mounting bracket 100 can promptly dissipate the heat conducted by the optoelectronic components to the first panel 210 and / or the second panel 220, resulting in excellent heat dissipation. Simultaneously, the cooling fan 400 is connected to the mounting bracket 100, while the optoelectronic components are connected to the mounting platform 200. The mounting bracket 100 and the mounting platform 200 are connected by a vibration damping component 300, effectively isolating the cooling fan 400 from vibrations from the external environment. This heat dissipation platform is suitable for optoelectronic components that require vibration damping and heat dissipation. For example, this heat dissipation platform can also be applied to other types of fiber lasers.

[0058] Furthermore, the semiconductor laser also includes an upper shell 600 and a lower shell 700. Both the upper shell 600 and the lower shell 700 are connected to the mounting bracket 100 of the heat dissipation platform. The upper shell 600, the lower shell 700, and the mounting bracket 100 together form an accommodating space, which is used to place the mounting platform 200 of the heat dissipation platform.

[0059] Optionally, the semiconductor laser includes a fourth connector (not shown in the figure). A fourth through hole 1301 is provided at one end of the side panel 130 along a third direction. The fourth through hole 1301 is located on the side of the rib 132 along a second direction. A corresponding fourth threaded hole 113 is provided on the front panel 110. The fourth connector passes through the fourth through hole 1301 and is threaded into the fourth threaded hole 113, thus fixing the side panel 130 to the front panel 110. Alternatively, the semiconductor laser includes a fifth connector (not shown in the figure). A fourth through hole 1301 is also provided at the other end of the side panel 130 along a third direction. The fourth through hole 1301 is located on the side of the rib 132 along a second direction. A corresponding fifth threaded hole 122 is provided on the rear panel 120. The fifth connector passes through the fourth through hole 1301 and is threaded into the fifth threaded hole 122, thus fixing the side panel 130 to the rear panel 120.

[0060] Furthermore, the semiconductor laser includes a sixth connector (not shown in the figure). Both the upper shell 600 and the lower shell 700 are U-shaped. The upper shell 600 has a first fixing hole 610 on its opposite wall surface along a first direction. The side panel 130 has a fifth through hole 1302 corresponding to the first fixing hole 610. The front panel 110 has a sixth threaded hole 114 corresponding to the fifth through hole 1302. The sixth connector passes through the first fixing hole 610 and the fifth through hole 1302 and then threadedly engages with the sixth threaded hole 114, thus fixing the upper shell 600, side panel 130, and front panel 110. The semiconductor laser includes a seventh connector (not shown in the figure). The upper shell 600 has a second fixing hole 620 on its opposite wall surface along a second direction. The front panel 110 has a seventh threaded hole 115 corresponding to the second fixing hole 620. The seventh connector passes through the second fixing hole 620 and then threadedly engages with the seventh threaded hole 115, thus fixing the upper shell 600 and the front panel 110. The first connector 510, the second connector 520, the third connector 530, the fourth connector, the fifth connector, the sixth connector, and the seventh connector mentioned above can be bolts. The assembly method between the rear panel 120, the side panel 130, and the upper shell 600 is the same as the assembly method between the front panel 110, the side panel 130, and the upper shell 600, and will not be described again here.

[0061] Furthermore, the lower shell 700 has a third fixing hole 710 on the wall surface opposite to it in the first direction, and a fourth fixing hole 720 on the wall surface opposite to the second panel 220 in the second direction. The assembly method between the front panel 110, the rear panel 120, the side panel 130, and the lower shell 700 is the same as the assembly method between the front panel 110, the rear panel 120, the side panel 130, and the upper shell 600, and will not be described again here.

[0062] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A heat dissipation platform, characterized in that, include: Mounting bracket (100), wherein a support arm (131) is provided on each of the opposite sides of the mounting bracket (100), and the two support arms (131) extend toward each other; The mounting platform (200) includes a first panel (210) and a second panel (220) arranged at an interval between the upper and lower sides. The first panel (210) and the second panel (220) are detachably connected. A heat dissipation channel is formed between the end faces of the first panel (210) and the second panel (220) that are close to each other. The end faces of the first panel (210) and the second panel (220) that are far apart from each other are used to mount optoelectronic components. The shock absorber (300) has one end mounted on the support arm (131) and the other end connected to the first panel (210); A cooling fan (400) is mounted on the mounting bracket (100) and is directly opposite the heat dissipation channel.

2. The heat dissipation platform according to claim 1, characterized in that, The heat dissipation platform includes a first connector (510), the support arm (131) is provided with a first through hole (1311), one end of the shock absorber (300) is provided with a first threaded hole (310), and the first connector (510) passes through the first through hole (1311) and is threadedly engaged with the first threaded hole (310). And / or, the heat dissipation platform includes a second connector (520), the first panel (210) is provided with a second through hole (211), the other end of the shock absorber (300) is provided with a second threaded hole (320), and the second connector (520) passes through the second through hole (211) and is threadedly engaged with the second threaded hole (320).

3. The heat dissipation platform according to claim 1, characterized in that, The support arm (131) has a limiting groove (1312) on the side facing the first panel (210), and the shock absorber (300) is partially embedded in the limiting groove (1312).

4. The heat dissipation platform according to claim 1, characterized in that, The heat dissipation platform includes a third connector (530). One of the first panel (210) and the second panel (220) is provided with a third through hole (221), and the other of the first panel (210) and the second panel (220) is provided with a third threaded hole (212). The third connector (530) passes through the third through hole (221) and is threaded into the third threaded hole (212).

5. The heat dissipation platform according to claim 1, characterized in that, One of the first panel (210) and the second panel (220) is provided with a plurality of spaced heat dissipation fins (213), and the plurality of heat dissipation fins (213) extend toward the other of the first panel (210) and the second panel (220), and the plurality of heat dissipation fins (213) divide the heat dissipation channel into a plurality of sub-channels (230).

6. The heat dissipation platform according to claim 1, characterized in that, The mounting bracket (100) includes a front panel (110), a rear panel (120), and two side panels (130). The front panel (110) and the rear panel (120) are opposite to each other, and the two side panels (130) are opposite to each other. Each of the two side panels (130) is provided with a support arm (131) on the side that is close to each other. The cooling fan (400) is disposed on the rear panel (120).

7. The heat dissipation platform according to claim 6, characterized in that, Each of the two side panels (130) has a raised rib (132) on one side that is opposite to each other.

8. The heat dissipation platform according to claim 6, characterized in that, The front panel (110) is provided with an interface fixing hole (111) and a ventilation hole (112), the ventilation hole (112) is directly opposite to the heat dissipation channel, and the rear panel (120) is provided with a mounting hole (121), the cooling fan (400) is directly opposite to the mounting hole (121).

9. A semiconductor laser, characterized in that, It includes optoelectronic components and a heat dissipation platform according to any one of claims 1-8, wherein the optoelectronic components are arranged on a first panel (210) and / or a second panel (220) of the heat dissipation platform.

10. The semiconductor laser according to claim 9, characterized in that, The semiconductor laser also includes an upper shell (600) and a lower shell (700). The upper shell (600) and the lower shell (700) are both connected to the mounting bracket (100) of the heat dissipation platform. The upper shell (600), the lower shell (700) and the mounting bracket (100) together form an accommodating space, which is used to place the mounting platform (200) of the heat dissipation platform.

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