Die cutting equipment for OCA (Optical Clear Adhesive)

Abstract

The invention relates to the technical field of OCA optical cement, in particular to die cutting equipment for the OCA optical cement. Comprising a punching table, a die-cutting knife is installed on the punching table, the adhesive removing mechanism is arranged on the punching table and comprises a U-shaped frame A arranged on the outer side of the die-cutting knife and a U-shaped frame B arranged on the inner side of the die-cutting knife, inclined grooves are formed in the U-shaped frame A and the U-shaped frame B, and guide blocks are connected into the inclined grooves in a sliding mode. Through the design of the glue removing mechanism, after the die-cutting rule completes punching every time, the glue removing roller A can be attached to the outer wall of the die-cutting rule to move and remove an adhesive on the outer wall of the die-cutting rule, and the glue removing roller B can be attached to the inner wall of the die-cutting rule to move and remove an adhesive on the inner wall of the die-cutting rule; through the first control mechanism and the second control mechanism, the glue removing roller A and the glue removing roller B can be far away from the outer wall and the inner wall of the die-cutting knife correspondingly, and the situation that the glue removing roller A and the glue removing roller B extrude OCA optical cement, and consequently the OCA optical cement is damaged is prevented.

Description

Technical Field

[0001] This invention relates to the field of OCA optical adhesive technology, and more particularly to a die-cutting device for OCA optical adhesive. Background Technology

[0002] OCA optical adhesive is mainly used in the manufacture of optical components such as lenses and displays, and has strong applicability and reliability.

[0003] During the die-cutting process of OCA optical adhesive, when the blade cuts into the adhesive layer and withdraws, the adhesive rubs against the surface of the die-cutting blade. Due to the properties of the adhesive, a small amount of adhesive will gradually adhere to and accumulate on the side of the blade, and will be gradually squeezed to the inner and outer walls of the die-cutting blade. After the die-cutting blade has been used for a long time, the adhesive adhering to the die-cutting blade will harden, causing the blade to become dull and increasing the contact area between the die-cutting blade and the OCA optical adhesive. This results in a large amount of adhesive being squeezed out during cutting. Because the die-cutting blade is closed, it is difficult to clean the die-cutting blade in a timely manner without interrupting production during continuous die-cutting operations. Summary of the Invention

[0004] To overcome the shortcomings of the prior art, the present invention provides a die-cutting device for OCA optical adhesive.

[0005] The technical solution of the present invention is: a die-cutting device for OCA optical adhesive, comprising a punching table, a die-cutting blade mounted on the punching table, and an adhesive removal mechanism disposed on the punching table. The adhesive removal mechanism includes a U-shaped frame A disposed outside the die-cutting blade and a U-shaped frame B disposed inside the die-cutting blade. Both the U-shaped frame A and the U-shaped frame B have inclined grooves, and guide blocks are slidably connected in the inclined grooves. Adhesive removal rollers A and B are rotatably connected to the two guide blocks, respectively. A track A is mounted on the punching table, and an electric slider A is slidably connected in the track A. The U-shaped frame A is mounted on the electric slider A. The adhesive removal roller A is provided with a first control mechanism for controlling its position, and the adhesive removal roller B is provided with a second control mechanism for controlling its position.

[0006] Optionally, the first control mechanism includes a telescopic rod A sleeved on the degumming roller A, and a telescopic shaft A is provided on one side of the U-shaped frame A, with the telescopic end of the telescopic shaft A being fixedly connected to the end of the telescopic rod A through it.

[0007] Optionally, the first control mechanism further includes an adjustment assembly, which includes an adjustment seat fixed to the U-shaped frame A, an insert plate slidably connected inside the adjustment seat, and the fixed end of the telescopic shaft A fixed to the insert plate.

[0008] Optionally, the adjustment assembly further includes a pin that is slidably connected through the insert plate, and the adjustment seat has a row of pin holes for the pin to be inserted.

[0009] Optionally, the second control mechanism includes a track B mounted on the punching table, an electric slider B slidably connected within the track B, a U-shaped frame B mounted on the electric slider B, a telescopic shaft B fixedly connected to the punching table, a telescopic rod B rotatably sleeved at the telescopic end of the telescopic shaft B, and the telescopic end of the telescopic rod B rotatably sleeved on the adhesive removal roller B.

[0010] Optionally, when the die-cutting blade is punching, the first control mechanism and the second control mechanism can control the adhesive removal roller A and the adhesive removal roller B to move away from the die-cutting blade, so as to prevent the adhesive removal roller A and the adhesive removal roller B from squeezing the OCA optical adhesive.

[0011] Optionally, a guide plate A is fixedly connected to the fixed end of the telescopic rod A via a support rod A, and the guide plate A is attached to the adhesive removal roller A.

[0012] Optionally, a guide plate B is fixedly connected to the telescopic end of the telescopic rod B via a support rod B, and the guide plate B is attached to the adhesive removal roller B.

[0013] Optionally, the guide plate A and the guide plate B can clean the adhesive adhering to the adhesive removal roller A and the adhesive removal roller B, so that the adhesive removal roller A and the adhesive removal roller B can maintain good working condition.

[0014] Optionally, a collection box can be detachably installed on both guide plate A and guide plate B.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] 1. Through the design of the adhesive removal mechanism, after each die-cutting operation, the adhesive removal roller A can move against the outer wall of the die-cutting blade to clean the adhesive on the outer wall of the die-cutting blade, and the adhesive removal roller B can move against the inner wall of the die-cutting blade to clean the adhesive on the inner wall of the die-cutting blade. During the die-cutting process, the first control mechanism and the second control mechanism can respectively keep the adhesive removal roller A and the adhesive removal roller B away from the outer wall and the inner wall of the die-cutting blade, preventing the adhesive removal rollers A and B from squeezing the OCA optical adhesive and causing damage to the OCA optical adhesive.

[0017] 2. Through the design of the adjustment seat and the insert plate, this invention can adjust the position of the telescopic shaft A according to the modulus of the OCA optical adhesive, thereby changing the landing point of the telescopic end of the telescopic shaft A on the OCA optical adhesive product and preventing the OCA optical adhesive product from overflowing.

[0018] 3. Through the design of guide plate A and guide plate B, this invention enables guide plate A to clean the adhesive on the adhesive removal roller A and guide plate B to clean the adhesive on the adhesive removal roller B when the adhesive removal roller A and adhesive removal roller B rotate, so that the adhesive removal roller A and adhesive removal roller B maintain good working condition. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the adhesive removal mechanism of the present invention;

[0021] Figure 3 This is a schematic diagram of the installation at the guide block of the present invention;

[0022] Figure 4 This is a schematic diagram of the installation of the adhesive removal roller at point A of the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of the first control mechanism of the present invention;

[0024] Figure 6 This is a schematic diagram of the installation of the pin of the present invention;

[0025] Figure 7 This is a schematic diagram of the structure of the second control mechanism of the present invention;

[0026] Figure 8 This is a schematic diagram of the installation of the collection box in this invention.

[0027] In the attached diagram: 1-Punching table, 101-Die-cutting blade, 201-U-shaped frame A, 202-U-shaped frame B, 203-Guide block, 204-Removing adhesive roller A, 205-Removing adhesive roller B, 206-Railway A, 207-Electric slider A, 301-Telescopic rod A, 302-Telescopic shaft A, 401-Adjusting seat, 402-Insertion plate, 501-Pin, 601-Railway B, 602-Electric slider B, 603-Telescopic shaft B, 604-Telescopic rod B, 701-Guide plate A, 801-Guide plate B, 901-Collection box. Detailed Implementation

[0028] The present invention will be further described below with reference to specific embodiments. The illustrative embodiments and descriptions herein are used to explain the present invention, but are not intended to limit the present invention.

[0029] Example 1

[0030] A die-cutting device for OCA optical adhesive, such as Figures 1-4As shown, the device includes a punching table 1, a die-cutting blade 101 mounted on the bottom of the punching table 1, and a glue removal mechanism located at the bottom of the punching table 1. The glue removal mechanism includes a U-shaped frame A201 located outside the die-cutting blade 101 and a U-shaped frame B202 located inside the die-cutting blade 101. Both the U-shaped frame A201 and the U-shaped frame B202 have inclined grooves. Guide blocks 203 are slidably connected in the inclined grooves of both the U-shaped frame A201 and the U-shaped frame B202. Glue removal rollers A204 and B205 are rotatably connected to the bottoms of the two guide blocks 203, respectively. A track A206 is mounted at the bottom of the punching table 1. An electric slider A207 is slidably connected in the track A206. The U-shaped frame A201 is mounted at the bottom of the electric slider A207. The glue removal roller A204 is provided with a first control mechanism for controlling its position, and the glue removal roller B205 is provided with a second control mechanism for controlling its position.

[0031] like Figure 4 and Figure 5 As shown, the first control mechanism includes a telescopic rod A301 sleeved on the roller shaft of the de-adhesive roller A204, and a telescopic shaft A302 is provided on one side of the U-shaped frame A201. The telescopic end of the telescopic shaft A302 is fixedly connected to the end of the telescopic rod A301 through it.

[0032] like Figure 4 and Figure 5 As shown, the first control mechanism also includes an adjustment component, which includes an adjustment seat 401 fixedly connected to one side of the U-shaped frame A201. An insert plate 402 is slidably connected in the horizontal direction inside the adjustment seat 401, and the fixed end of the telescopic shaft A302 is fixedly connected to the bottom of the insert plate 402.

[0033] like Figure 5 and Figure 6 As shown, the adjustment assembly also includes a pin 501 that is slidably connected to the insert plate 402. A row of pin holes for the pin 501 to be inserted is provided on the bottom of the inner wall of the adjustment seat 401. When the pin 501 is inserted into the pin hole, it can limit the fixed end of the telescopic shaft A302.

[0034] like Figure 7 As shown, the second control mechanism includes a track B601 installed at the bottom of the punching table 1, an electric slider B602 slidably connected in the track B601, a U-shaped frame B202 installed at the bottom of the electric slider B602, a telescopic shaft B603 fixedly connected to the bottom of the punching table 1, a telescopic rod B604 rotatably sleeved at the telescopic end of the telescopic shaft B603, and a telescopic roller B604 rotatably sleeved on the roller shaft of the adhesive removal roller B205. When the die-cutting knife 101 punches, the first control mechanism and the second control mechanism can control the adhesive removal roller A204 and the adhesive removal roller B205 to move away from the die-cutting knife 101 to prevent the adhesive removal roller A204 and the adhesive removal roller B205 from squeezing the OCA optical adhesive.

[0035] like Figure 8 As shown, the bottom of the fixed end of the telescopic rod A301 is fixed with a guide plate A701 through a support rod A. The guide plate A701 is attached to the adhesive removal roller A204 and is spiral in shape.

[0036] like Figure 8 As shown, a guide plate B801 is fixed to the bottom of the telescopic end of the telescopic rod B604 via a support rod B. The guide plate B801 is attached to the adhesive removal roller B205 and is spiral in shape. The guide plate A701 and the guide plate B801 can clean the adhesive adhering to the adhesive removal roller A204 and the adhesive removal roller B205, so that the adhesive removal roller A204 and the adhesive removal roller B205 can maintain good working condition.

[0037] like Figure 8 As shown, both guide plate A701 and guide plate B801 are detachably equipped with collection boxes 901, and the adhesive on guide plate A701 and guide plate B801 can enter the corresponding collection boxes 901 to complete the collection.

[0038] Initially, the bottom ends of both the adhesive removal rollers A204 and B205 are at the same horizontal level as the bottom end of the die-cutting blade 101. The telescopic end of the telescopic shaft A302 is lower than the bottom end of the adhesive removal roller A204, and the telescopic end of the telescopic shaft B603 is lower than the bottom end of the adhesive removal roller B205. The telescopic ends of the telescopic shafts A302 and B603 are at the same horizontal level. The adhesive removal rollers A204 and B205 are respectively attached to the outer and inner walls of the die-cutting blade 101. During punching, the punching table 1 drives the die-cutting blade 101, track A206, and track... B601 and telescopic shaft B603 descend. Track A206 drives U-shaped frame A201 to descend via electric slider A207. U-shaped frame A201 drives adhesive removal roller A204 to descend via guide block 203, and drives telescopic shaft A302 to descend via adjusting seat 401 and insert plate 402. Track B601 drives U-shaped frame B202 to descend via electric slider B602. U-shaped frame B202 drives adhesive removal roller B205 to descend via guide block 203. Subsequently, the telescopic end of telescopic shaft A302 and telescopic rod B604 extend and retract. Both ends are in contact with OCA optical adhesive. The punching table 1 continues to descend, causing the telescopic end of the telescopic shaft A302 to retract. The telescopic end of the telescopic shaft A302 provides support for the adhesive removal roller A204 through the telescopic rod A301. The U-shaped frame A201 continues to descend and squeezes the guide block 203 inside through the inclined groove on it. The guide block 203 is forced to move the adhesive removal roller A204 away from the outer wall of the die-cutting knife 101. The adhesive removal roller A204 drives the telescopic rod A301 to retract, and at the same time, the telescopic end of the telescopic shaft B603 retracts. The telescopic end of the telescopic shaft B603 passes through The telescopic rod B604 provides support for the adhesive removal roller B205. The U-shaped frame B202 continues to descend and squeezes the guide block 203 inside through the inclined groove on it. The guide block 203 is forced to move the adhesive removal roller B205 away from the inner wall of the die-cutting knife 101. The adhesive removal roller B205 drives the telescopic rod B604 to retract. When the die-cutting knife 101 contacts the surface of the OCA optical adhesive, the adhesive removal rollers A204 and B205 not only move away from the die-cutting knife 101, but also have a gap with the surface of the OCA optical adhesive. The die-cutting knife 101 continues to descend to perform punching.

[0039] After punching, the punching table 1 is raised, which in turn raises the die-cutting blade 101, track A206, track B601, and telescopic shaft B603. Track A206 raises the U-shaped frame A201 via the electric slider A207. The U-shaped frame A201 is raised via the adjusting seat 401 and the insert plate 402, which in turn raises the fixed end of the telescopic shaft A302. The telescopic end of the telescopic shaft A302 gradually extends. Under its own weight, the guide block 203 inside the U-shaped frame A201 slides along the inclined groove of the U-shaped frame A201 towards the side closer to the die-cutting blade 101, and drives the glue removal roller A204 to approach the outer wall of the die-cutting blade 101. The roller shaft of the glue removal roller A204 drives the telescopic rod A301 to extend. Track B601 raises the U-shaped frame B202, and the telescopic shaft B603... The telescopic end of 03 gradually extends under its own weight. The guide block 203 inside the U-shaped frame B202 slides along the inclined groove of the U-shaped frame B202 towards the side closer to the die-cutting blade 101 under its own weight, causing the glue-removing roller B205 to approach the inner wall of the die-cutting blade 101. The roller shaft of the glue-removing roller B205 drives the telescopic rod B604 to extend until the telescopic ends of the telescopic shaft A302 and the telescopic shaft B603 are fully extended and reset. At this time, the glue-removing rollers A204 and B205 are respectively in contact with the outer and inner walls of the die-cutting blade 101. The punching table 1 continues to rise, thereby raising the glue-removing rollers A204 and B205. At the same time, the electric slider A207 is controlled to slide one revolution along the track A206, and the electric slider B602 is controlled to slide one revolution along the track B600. 1. Sliding one revolution, the electric slider A207 drives the U-shaped frame A201 to move. The U-shaped frame A201 drives the adhesive removal roller A204 to move through the guide block 203 inside. The adhesive removal roller A204 moves against the outer wall of the die-cutting blade 101. Under the action of friction with the outer wall of the die-cutting blade 101, the adhesive removal roller A204 rotates and removes the adhesive adhering to the outer wall of the die-cutting blade 101. The electric slider B602 drives the U-shaped frame B202 to move. The U-shaped frame B202 drives the adhesive removal roller B205 to move through the guide block 203 inside. The adhesive removal roller B205 moves against the inner wall of the die-cutting blade 101. Under the action of friction with the inner wall of the die-cutting blade 101, the adhesive removal roller B205 rotates and removes the adhesive adhering to the inner wall of the die-cutting blade 101. During this process, the adhesive removal roller A205... The adhesive adhering to the die-cutting blade 101 is scraped off by the guide plate A701. Under the rotation of the adhesive removal roller A204, the adhesive on the guide plate A701 gradually moves upward along the surface of the guide plate A701. The adhesive adhering to the adhesive removal roller B205 is scraped off by the guide plate B801. Under the rotation of the adhesive removal roller B205, the adhesive on the guide plate B801 gradually moves upward along the surface of the guide plate B801. Finally, the adhesive on the guide plates A701 and B801 enters the adjacent collection boxes 901 respectively. This completes the cleaning of the outer and inner walls of the die-cutting blade 101, as well as the cleaning of the adhesive removal rollers A204 and B205, ensuring that the die-cutting blade 101, adhesive removal rollers A204 and B205 remain in good working condition.

[0040] When the adhesive in the two collection boxes 901 is full, the staff will remove the two collection boxes 901 for cleaning and then reinstall them.

[0041] As a further supplement, OCA optical adhesives of different moduli have different resistance to extrusion and different punching intervals. Low-modulus OCA optical adhesives are more prone to overflow when compressed. Initially, the pin 501 is inserted into the pin hole of the adjusting seat 401 near the U-shaped frame A201. When punching low-modulus OCA optical adhesives, the operator lifts the pin 501 to disengage it from the pin hole, and then pulls the insert plate 402 away from the U-shaped frame A201 according to the modulus of the OCA optical adhesive. The sliding plate 402 drives the fixed end of the telescopic shaft A302 to move. The telescopic end of the telescopic shaft A302 drives the telescopic rod A301 to extend. Then, the pin 501 is inserted into the corresponding pin hole. The pin 501 limits the fixed end of the telescopic shaft A302 through the plate 402. When punching is performed again, the landing point of the telescopic end of the telescopic shaft A302 changes. The landing point of the telescopic end of the telescopic shaft A302 is larger than the edge distance of the punched OCA optical adhesive product, thereby preventing the adhesive of OCA optical adhesive from overflowing.

[0042] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A die-cutting device for OCA optical adhesive, comprising a punching table (1), characterized in that: The punching table (1) is equipped with a die-cutting blade (101) and also includes a glue removal mechanism on the punching table (1). The glue removal mechanism includes a U-shaped frame A (201) located outside the die-cutting blade (101) and a U-shaped frame B (202) located inside the die-cutting blade (101). Both the U-shaped frame A (201) and the U-shaped frame B (202) have inclined grooves, and guide blocks (203) are slidably connected in the inclined grooves. The two guide blocks (203) are equipped with... The adhesive removal rollers A (204) and B (205) are rotatably connected. The punching table (1) is equipped with a track A (206). An electric slider A (207) is slidably connected in the track A (206). The U-shaped frame A (201) is installed on the electric slider A (207). The adhesive removal roller A (204) is provided with a first control mechanism for controlling its position. The adhesive removal roller B (205) is provided with a second control mechanism for controlling its position.

2. The die-cutting equipment for OCA optical adhesive according to claim 1, characterized in that: The first control mechanism includes a telescopic rod A (301) sleeved on the degumming roller A (204), and a telescopic shaft A (302) is provided on one side of the U-shaped frame A (201). The telescopic end of the telescopic shaft A (302) is fixedly connected to the end of the telescopic rod A (301) through it.

3. The die-cutting equipment for OCA optical adhesive according to claim 2, characterized in that: The first control mechanism also includes an adjustment component, which includes an adjustment seat (401) fixedly connected to the U-shaped frame A (201), a insert plate (402) slidably connected inside the adjustment seat (401), and the fixed end of the telescopic shaft A (302) fixedly connected to the insert plate (402).

4. The die-cutting equipment for OCA optical adhesive according to claim 3, characterized in that: The adjustment assembly also includes a pin (501) that is slidably connected to the insert plate (402), and the adjustment seat (401) has a row of pin holes for the pin (501) to be inserted.

5. A die-cutting device for OCA optical adhesive according to claim 1, characterized in that: The second control mechanism includes a track B (601) installed on the punching table (1), an electric slider B (602) slidably connected in the track B (601), a U-shaped frame B (202) installed on the electric slider B (602), a telescopic shaft B (603) fixed on the punching table (1), a telescopic rod B (604) rotatably sleeved at the telescopic end of the telescopic shaft B (603), and the telescopic end of the telescopic rod B (604) rotatably sleeved on the adhesive removal roller B (205).

6. A die-cutting device for OCA optical adhesive according to claim 5, characterized in that: When the die-cutting blade (101) is punching, the first control mechanism and the second control mechanism can control the glue removal roller A (204) and the glue removal roller B (205) to move away from the die-cutting blade (101) to prevent the glue removal roller A (204) and the glue removal roller B (205) from squeezing the OCA optical adhesive.

7. A die-cutting device for OCA optical adhesive according to claim 2, characterized in that: A guide plate A (701) is fixedly connected to the fixed end of the telescopic rod A (301) via a support rod A, and the guide plate A (701) is attached to the adhesive removal roller A (204).

8. A die-cutting device for OCA optical adhesive according to claim 5, characterized in that: A guide plate B (801) is fixed to the telescopic end of the telescopic rod B (604) via a support rod B, and the guide plate B (801) is attached to the adhesive removal roller B (205).

9. A die-cutting device for OCA optical adhesive according to claim 7, characterized in that: The guide plate A (701) and the guide plate B (801) can clean the adhesive adhering to the adhesive removal roller A (204) and the adhesive removal roller B (205), so that the adhesive removal roller A (204) and the adhesive removal roller B (205) can maintain good working condition.

10. A die-cutting device for OCA optical adhesive according to claim 9, characterized in that: A collection box (901) can be detachably installed on both guide plate A (701) and guide plate B (801).

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