Photovoltaic backboard glass deep processing equipment and processing method

By switching between limit mode and compensation mode, and using a modular compensation mechanism and pressure sensor monitoring, the problem of cutting instability caused by dents in photovoltaic backsheet glass cutting is solved, achieving stability and consistency in cutting depth, reducing waste sheets, and extending the service life of the equipment.

CN122010403APending Publication Date: 2026-05-12CORNUCOPIA GRP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CORNUCOPIA GRP CO LTD
Filing Date
2026-02-04
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

During the cutting of existing photovoltaic backsheet glass, the large size and weight of the entire panel cause local wear and dents in the rubber pads, affecting the stability and consistency of the cutting depth. This may result in the glass substrate losing planar support in certain areas, leading to a decrease in cutting quality and the production of defective sheets.

Method used

By switching between limit mode and compensation mode in a timely manner, the pressure value of the support zone is monitored through a modular compensation mechanism and pressure sensor. The first to fourth compensation rings and the stage are used for limit or compensation to maintain the support force of the glass substrate, prevent the pit area from bulging, and achieve the stability and consistency of the cutting depth.

Benefits of technology

It improves the stability and consistency of glass substrate cutting depth, reduces waste, prevents the edges of pits from blocking the glass substrate, extends the service life of rubber pads, and ensures cutting quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention belongs to the technical field of glass cutting, and particularly relates to photovoltaic back plate glass deep processing equipment and a processing method.The photovoltaic back plate glass deep processing equipment comprises a rack and an elastic liner installed at the top of the rack, a cutting mechanism is arranged outside the elastic liner, and the photovoltaic back plate glass deep processing equipment further comprises a modular compensation mechanism arranged in the rack; the modular compensation mechanism is used for dividing the bottom face of the elastic gasket into a plurality of supporting subareas and monitoring the pressure values of the supporting subareas. The first compensation ring, the second compensation ring, the third compensation ring and the fourth compensation ring are vertically distributed according to the diameter decreasing sequence and are arranged in the supporting subarea, and the fourth compensation ring is connected with the modular compensation mechanism; and when the pressure value is in a process requirement range, the first compensation ring and the second compensation ring are arranged. By means of timely switching of the limiting mode and the compensation mode, compensation operation can be conducted on the pits, the function of improving the stability and consistency of the cutting depth is achieved, the local cutting quality of the glass substrate is guaranteed, and waste pieces are reduced.
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Description

Technical Field

[0001] This invention belongs to the field of glass cutting technology, specifically relating to a deep processing equipment and method for photovoltaic backsheet glass. Background Technology

[0002] Horizontal glass cutting machines are one of the core pieces of equipment in the modern glass deep processing industry. In photovoltaic backsheet glass cutting, multiple pieces of glass can be cut at once. Driven by a servo motor, the cutting head moves along the X, Y, and Z axes, marking lines on the photovoltaic backsheet glass along a preset path to cut grooves of a preset depth. After cutting, the glass is placed on a slitting machine to separate individual pieces.

[0003] When cutting existing photovoltaic backsheet glass, a rubber pad is placed under the glass substrate to cushion it and prevent the risk of cracking caused by rigid placement. Then, the worker aligns the edge with the reference edge of the cutting machine and sets a cutting path that meets the process requirements.

[0004] During the handling of glass substrates, due to their large size (up to 4m × 6m) and high overall weight, the contact friction between the substrate and the rubber pad below is strong during transport and positioning. Long-term operation can easily lead to localized wear of the rubber pad, even forming noticeable dents. These dented areas cause the glass substrate to lose planar support in certain areas, resulting in uneven distribution of support force and subsequently causing slight sinking of the glass substrate at the cutting position. This situation may affect the stability and consistency of the cutting depth, reduce the quality of localized cutting, and even result in scrap. Summary of the Invention

[0005] The purpose of this invention is to provide a photovoltaic backsheet glass deep processing equipment and processing method, which can perform compensation operation for pits by timely switching between limiting mode and compensation mode, thereby improving the stability and consistency of cutting depth, ensuring the quality of local cutting of glass substrates, and reducing waste sheets.

[0006] The specific technical solution adopted by this invention is as follows: A photovoltaic backsheet glass deep processing equipment includes a frame and an elastic pad installed on the top of the frame. A cutting mechanism is provided outside the elastic pad. The equipment also includes: A modular compensation mechanism is installed inside the frame. The modular compensation mechanism is used to divide the bottom surface of the elastic pad into multiple support zones and monitor the pressure value of the support zones. The first compensation ring, the second compensation ring, the third compensation ring, and the fourth compensation ring, which are vertically distributed in descending order of diameter, are provided in the support partition, and the fourth compensation ring is connected to the modular compensation mechanism. When the pressure value is within the process requirement range, the first compensation ring, the second compensation ring, the third compensation ring and the fourth compensation ring limit the modular compensation mechanism along the first direction to prevent the elastic pad from bulging locally. When the pressure value is lower than the preset value, the first compensation ring, the second compensation ring, the third compensation ring and the fourth compensation ring support the modular compensation mechanism along the second direction to compensate for the lack of support force of the elastic pad and realize the function of maintaining the support force of the glass substrate.

[0007] As an alternative, the first compensation ring is provided with a multi-headed claw, and the top of the multi-headed claw is provided with a plurality of hooks arranged in a circumferential array. The hooks are fitted with movable rings, and the top of the movable rings are provided with a traction cable connected to an elastic pad. When the elastic pad supports the glass substrate, the multiple hooks pull the traction cable along a set direction to reduce the degree of deformation of the elastic pad and prevent the elastic pad from bulging locally.

[0008] As an alternative, the top of the first compensation ring is fixed with a first column that is connected to the bottom of the multi-head claw, and the outside of the first column is fixed with a first flange plate for sliding connection of the frame. When the first compensation ring moves, the first flange plate horizontally limits the first compensation ring to maintain the first compensation ring facing the support section.

[0009] As an alternative, the first compensation ring has a first through hole, and a second column connected to the second compensation ring is inserted into the first through hole along its axial direction. A second flange plate is fixed to the top of the second column. When the second flange plate contacts the first compensation ring, it is used to limit the first compensation ring along the first direction; When the second flange plate disengages from the first compensation ring, the second compensation ring is used to support the modular compensation mechanism along the second direction.

[0010] As an alternative, the second compensation ring is provided with a second through hole, and a third column connected to the third compensation ring is inserted into the second through hole along its axial direction. A third flange plate is fixed to the top of the third column. When the third flange plate contacts the second compensation ring, it is used to limit the second compensation ring along the first direction; When the third flange plate disengages from the second compensation ring, the third compensation ring is used to support the modular compensation mechanism along the second direction.

[0011] As an optional solution, the third compensation ring is provided with a third through hole, and a fourth column connected to the fourth compensation ring is inserted into the third through hole along its axial direction. A fourth flange plate is fixed to the top of the fourth column. When the fourth flange plate contacts the third compensation ring, it is used to limit the third compensation ring along the first direction; When the fourth flange plate disengages from the third compensation ring, the fourth compensation ring is used to support the modular compensation mechanism along the second direction.

[0012] As an optional solution, the fourth compensation ring is provided with a fourth through hole, and the fourth compensation ring is connected to the fifth column and the platform in sequence through the fourth through hole. The fifth flange plate is fixed to the top of the fifth column. When the fifth flange plate contacts the fourth compensation ring, it is used to limit the fourth compensation ring along the first direction; When the fifth flange plate disengages from the fourth compensation ring, the modular compensation mechanism lifts the platform to compensate for the lack of support force of the elastic gasket.

[0013] As an optional solution, a connecting plate is connected between the bottom of the fifth column and the bottom of the platform, and a central hole and a connecting shaft fixed to the central hole are provided in the middle of the platform; During operation, the platform is connected to the modular compensation mechanism via a connecting shaft. The modular compensation mechanism lifts the platform, enabling power transmission to the first compensation ring, the second compensation ring, the third compensation ring, and the fourth compensation ring.

[0014] As an optional solution, the modular compensation mechanism includes multiple pressure-bearing unit pads spaced apart on the bottom surface of the elastic pad, with a pressure sensor embedded inside each pressure-bearing unit pad for monitoring the pressure signal of the pressure-bearing unit pad, and a vertical telescopic unit provided at the bottom of each pressure-bearing unit pad; When the pressure value is lower than the preset value, the vertical telescopic unit raises the platform, causing the pressure-bearing unit pad to rise locally to compensate for the lack of support force of the elastic pad, until the pressure value enters the process requirement range, at which point the vertical telescopic unit stops operating.

[0015] Glass deep processing method, the processing method includes the following steps: Initialization: After the glass substrate is loaded, the CNC system scans the global pressure map once to establish an initial pit distribution map; Cutting begins: The CNC system reads the CNC code or real-time coordinates of the cutting mechanism, controls the cutting mechanism to cut along the X and Y axes, reads pressure data in real time, and calculates based on the position and speed of the cutting mechanism. Dynamic compensation window at any given moment; Based on the pressure within the window, determine whether compensation for the lack of support force is needed; if compensation is needed, call the compensation algorithm to calculate the displacement command of the modular compensation mechanism; if no compensation is needed, continue the cutting action of the current path. Determine whether the displacement command interferes with the cutting mechanism. If there is no interference, issue the displacement command to drive the modular compensation mechanism; if interference occurs, execute the avoidance logic. After the preset time is extended, the feedback pressure value of the compensation area is read and used for PID error calculation and model adaptive correction. Cutting complete: The cutting mechanism resets to the starting position.

[0016] The technical effects achieved by this invention are as follows: This invention, through timely switching between limiting and compensation modes, compensates for the pits under the glass substrate, maintains the support force of the glass substrate, improves the stability and consistency of the cutting depth, ensures the quality of local cutting of the glass substrate, and reduces waste sheets; it also limits the pits at the edge of the glass substrate, preventing the pit edges from protruding and blocking the glass substrate through downward traction; and it modularly replaces the pressure-bearing unit pads in the pit area, avoiding the scrapping of the entire elastic pad.

[0017] This invention, through the above-described processing method, compensates for the support force at the pit in real time during the dynamic process of cutting, anticipates and actively compensates for impending support defects, so that the glass substrate maintains an ideal rigid support state near the cutting point. It can coordinate multiple points, prevent interference between the compensation action and the cutting action, and improve the safety of the compensation process. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the deep processing equipment in Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the supporting partition structure in Embodiment 1 of the present invention; Figure 3 This is a schematic diagram of the cutting mechanism in Embodiment 1 of the present invention; Figure 4 This is a partial bottom view of the deep processing equipment in Embodiment 1 of the present invention; Figure 5 This is a bottom view of the modular compensation mechanism in Embodiment 1 of the present invention; Figure 6 This is an exploded view of the modular compensation mechanism in Embodiment 1 of the present invention; Figure 7 This is a partial structural schematic diagram of the deep processing equipment in Embodiment 1 of the present invention; Figure 8 This is a schematic diagram of the structure of the first compensation ring in Embodiment 1 of the present invention; Figure 9 This is a schematic diagram of the structure of the second compensation ring in Embodiment 1 of the present invention; Figure 10 This is a schematic diagram of the structure of the third compensation ring in Embodiment 1 of the present invention; Figure 11 This is a schematic diagram of the structure of the fourth compensation ring in Embodiment 1 of the present invention; Figure 12 This is a schematic diagram of the stage structure in Embodiment 1 of the present invention; Figure 13 This is a schematic diagram of the multi-headed claw structure in Embodiment 1 of the present invention; Figure 14 This is a schematic diagram of the pressure-bearing unit pad in Embodiment 1 of the present invention; Figure 15 This is a schematic diagram of the pressure sensor structure in Embodiment 1 of the present invention; Figure 16 This is a flowchart of the processing method in Embodiment 2 of the present invention.

[0019] The attached diagram lists the components represented by each number as follows: 1. Frame; 2. X-axis guide rail; 3. Traveling unit; 4. Y-axis guide rail; 5. Cable chain; 6. Cutting mechanism; 7. Cutting blade; 8. Elastic pad; 9. Crossbeam; 10. Pressure-bearing unit pad; 11. Pressure sensor; 12. Vertical telescopic unit; 13. Traction cable; 14. Movable ring; 15. Multi-head claw; 16. First column; 17. First flange plate; 18. First compensation ring; 19. First through hole; 20. Second column; 21. Second flange plate; 22. Second compensation ring; 23. Second through hole; 24. Third column; 25. Third flange plate; 26. Third compensation ring; 27. Third through hole; 28. Fourth column; 29. ​​Fourth flange plate; 30. Fourth compensation ring; 31. Fourth through hole; 32. Fifth column; 33. Fifth flange plate; 34. Connecting plate; 35. Platform; 36. Intermediate hole; 37. Connecting shaft. Detailed Implementation

[0020] To make the objectives and advantages of this invention clearer, the invention will be specifically described below with reference to embodiments. It should be understood that the following text is merely used to describe one or more specific embodiments of the invention and does not strictly limit the scope of protection specifically claimed by the invention.

[0021] Example 1: like Figure 1 - Figure 15As shown, a photovoltaic backsheet glass deep processing equipment includes a frame 1 and an elastic pad 8 mounted on the top of the frame 1. A glass substrate is placed on the elastic pad 8, aligned with a reference edge. Two X-axis guide rails 2 and a traveling unit 3 that travels along the X-axis guide rails 2 are bolted to the outside of the frame 1. A Y-axis guide rail 4 is bolted between the tops of the two traveling units 3. A cutting mechanism 6 moves outside the elastic pad 8 via the two X-axis guide rails 2 and the Y-axis guide rail 4. A drag chain 5 is arranged on the top of the Y-axis guide rail 4 to power the servo motor in the cutting mechanism 6. A cutting blade 7 (e.g., ...) is clamped at the output end of the servo motor. Figure 3 (As shown) rotate, and the cutting blade 7 cuts the upper surface of the glass substrate along the specified path in the CNC system's preset cutting program; Meanwhile, in this embodiment, several crossbeams 9 are installed at equal intervals inside the frame 1 using bolts, dividing the bottom surface of the elastic pad 8 into multiple channels (such as...). Figure 2 As shown), thirteen pressure-bearing unit pads 10 are bonded at equal intervals in each channel (as shown). Figure 4 As shown), a pressure sensor 11 is embedded inside each pressure-bearing unit pad 10 (optional, such as...). Figure 15 The MD30-60 model flexible membrane sensor shown is used to monitor the pressure signal of the pressure unit pad 10. The bottom of the pressure unit pad 10 is equipped with a vertical telescopic unit 12 (a miniature electric cylinder can be selected). When the elastic pad 8 and the pressure unit pad 10 are worn and pitted, the pressure value is lower than the preset value. The CNC system starts the vertical telescopic unit 12. The cylinder rod of the vertical telescopic unit 12 drives the pressure unit pad 10 to rise locally to compensate for the lack of support force of the elastic pad 8 until the pressure value enters the process requirement range. The vertical telescopic unit 12 stops moving to maintain the support force of the glass substrate, thereby improving the stability and consistency of the cutting depth, ensuring the quality of local cutting of the glass substrate, and reducing waste.

[0022] See attached document Figure 5 , Figure 6 and Figure 7 In this embodiment, a first compensation ring 18, a second compensation ring 22, a third compensation ring 26, a fourth compensation ring 30, and a platform 35 are vertically distributed at the bottom of the pressure unit pad 10 in descending order of diameter. The vertical telescopic unit 12 provides power to lift the first compensation ring 18, the second compensation ring 22, the third compensation ring 26, the fourth compensation ring 30, and the platform 35 one by one.

[0023] When the pressure value is within the process requirement range, the vertical telescopic unit 12 enters the limit mode and continuously pulls the first compensation ring 18, the second compensation ring 22, the third compensation ring 26, the fourth compensation ring 30 and the platform 35 downward, so that the first compensation ring 18, the second compensation ring 22, the third compensation ring 26, the fourth compensation ring 30 and the platform 35 are limited to pulling the elastic pad 8 downward, preventing the elastic pad 8 from bulging locally.

[0024] When the pressure value is lower than the preset value, the vertical telescopic unit 12 enters the compensation mode, and its cylinder rod extends segment by segment. The first compensation ring 18, the second compensation ring 22, the third compensation ring 26, the fourth compensation ring 30 and the platform 35 lift the pressure-bearing unit pad 10 upward to compensate for the lack of support force of the elastic pad 8 until the pressure value enters the process requirement range. The vertical telescopic unit 12 stops operating to maintain the support force of the glass substrate.

[0025] By switching between limiting mode and compensation mode in a timely manner, compensation is performed on the pits under the glass substrate to maintain the support force of the glass substrate, thereby improving the stability and consistency of the cutting depth, ensuring the quality of local cutting of the glass substrate, and reducing waste pieces; limiting operation is performed on the pits at the edge of the glass substrate, and the downward traction action prevents the pit edges from protruding and blocking the glass substrate; and the pressure-bearing unit pad 10 is replaced modularly in the pit area to avoid scrapping the entire elastic pad 8.

[0026] See attached document Figure 5 and Figure 7 The bottom of the platform 35 is fixed with six connecting plates 34 by bolts. Each connecting plate 34 has a fifth column 32 welded vertically to the end away from the platform 35. The platform 35 has a central hole 36 and a connecting shaft 37 fixed to the central hole 36. The bottom of the connecting shaft 37 is coaxially connected to the output end of the vertical telescopic unit 12 to realize the transmission between the vertical telescopic unit 12 and the platform 35. During operation, the vertical telescopic unit 12 lifts the platform 35, and the platform 35 transmits power to the first compensation ring 18, the second compensation ring 22, the third compensation ring 26 and the fourth compensation ring 30, thereby gradually compensating for the lack of support force in the pit.

[0027] See attached document Figure 7 , Figure 11 and Figure 12 The fourth compensation ring 30 has a fourth through hole 31. The fourth compensation ring 30 is connected to the fifth column 32 and the platform 35 in sequence through the fourth through hole 31. The fifth flange plate 33 is welded to the top of the fifth column 32. When the fifth flange plate 33 contacts the fourth compensation ring 30, since the fifth flange plate 33 is located above the fourth compensation ring 30, the fifth flange plate 33 can be used to limit the fourth compensation ring 30 downward. When the fifth flange plate 33 disengages from the fourth compensation ring 30, the vertical telescopic unit 12 lifts the platform 35 to begin compensating for the lack of support force of the elastic pad 8, thus realizing the first stage of compensation operation.

[0028] See attached document Figure 6 , Figure 10 and Figure 11The third compensation ring 26 has a third through hole 27, and a fourth column 28, which is welded to the fourth compensation ring 30, is inserted into the third through hole 27 along its axial direction. A fourth flange plate 29 is welded to the top of the fourth column 28. When the fourth flange plate 29 contacts the third compensation ring 26, since the fourth flange plate 29 is located above the third compensation ring 26, the fourth flange plate 29 can be used to limit the third compensation ring 26 downward. After the platform 35 contacts the fourth compensation ring 30, the platform 35 and the fourth compensation ring 30 jointly support the pressure-bearing unit pad 10, continuing the compensation operation of the first stage. When the fourth flange plate 29 detaches from the third compensation ring 26, the platform 35 lifts the fourth compensation ring 30 and the pressure unit pad 10. The fourth compensation ring 30 can support the pressure unit pad 10 upwards to compensate for the lack of support force of the elastic liner 8, thus realizing the second stage of compensation operation.

[0029] See attached document Figure 6 , Figure 9 and Figure 10 The second compensation ring 22 has a second through hole 23, and a third column 24, which is welded to the third compensation ring 26, is inserted into the second through hole 23 along its axial direction. A third flange plate 25 is welded to the top of the third column 24. When the third flange plate 25 contacts the second compensation ring 22, since the third flange plate 25 is located above the second compensation ring 22, the third flange plate 25 can be used to limit the second compensation ring 22 downward. After the fourth compensation ring 30 contacts the third compensation ring 26, the fourth compensation ring 30 and the third compensation ring 26 jointly support the pressure-bearing unit pad 10, continuing the compensation operation of the second stage. When the third flange plate 25 disengages from the second compensation ring 22, the fourth compensation ring 30 lifts the third compensation ring 26. The third compensation ring 26 can support the pressure unit pad 10 upwards to compensate for the lack of support force of the elastic liner 8, thus realizing the compensation operation in the third stage.

[0030] See attached document Figure 6 , Figure 8 and Figure 9 The first compensation ring 18 has a first through hole 19, and a second column 20, which is welded to the second compensation ring 22, is inserted into the first through hole 19 along its axial direction. A second flange plate 21 is welded to the top of the second column 20. When the second flange plate 21 contacts the first compensation ring 18, since the second flange plate 21 is located above the first compensation ring 18, the second flange plate 21 can be used to limit the first compensation ring 18 along the first direction. After the third compensation ring 26 contacts the second compensation ring 22, the third compensation ring 26 and the second compensation ring 22 jointly support the pressure-bearing unit pad 10, continuing the compensation operation of the third stage. When the second flange plate 21 disengages from the first compensation ring 18, the third compensation ring 26 lifts the second compensation ring 22. The second compensation ring 22 can be used to support the pressure unit pad 10 upwards to compensate for the lack of support force of the elastic pad 8, thus realizing the compensation operation in the fourth stage. Until the second compensation ring 22 contacts the first compensation ring 18, the fifth stage of compensation operation begins, reaching the maximum compensation area. This causes the first compensation ring 18, the second compensation ring 22, the third compensation ring 26, the fourth compensation ring 30, and the platform 35 to lift the pressure unit pad 10 together, and finally stop. The staff is then reminded to replace the pressure unit pad 10.

[0031] See attached document Figure 6 , Figure 7 and Figure 8 The top of the first compensation ring 18 is welded with a first column 16 which is welded to the bottom of the multi-head claw 15. The outer side of the first column 16 is fixed with a first flange plate 17 for sliding connection of the frame 1 by screws, and the first flange plate 17 is slidably supported by the slide rail on the side of the crossbeam 9 inside the frame 1. When the first compensation ring 18 moves, the first flange plate 17 horizontally limits the first compensation ring 18 to maintain the first compensation ring 18 facing the support zone and prevent the first compensation ring 18 from tilting or other risks when pushing the pressure unit pad 10.

[0032] See attached document Figure 7 , Figure 13 and Figure 14 The first compensation ring 18 is connected to a multi-headed claw 15 via a first column 16. The top of the multi-headed claw 15 has three hooks arranged in a circumferential array. The hooks are fitted with movable rings 14. A traction cable 13 connected to the elastic pad 8 is provided between the tops of the movable rings 14. The traction cable 13 is embedded inside the pressure unit pad 10 and fixed with adhesive. The three movable rings 14 are pulled toward the central axis of the first column 16 by the traction cable 13 to form a triangular stable structure, which is used to increase the area of ​​the pressure unit pad 10 pulled downward by the first column 16. When the elastic pad 8 supports the glass substrate, the pressure-bearing unit pads 10 are all bonded to the bottom surface of the elastic pad 8. The six hooks pull the traction cable 13 in a set direction to reduce the degree of deformation of the elastic pad 8 and the pressure-bearing unit pads 10 and prevent the elastic pad 8 from bulging locally.

[0033] Example 2: like Figure 16 As shown, the photovoltaic backsheet glass processing method, applied to the deep processing equipment proposed in Example 1, includes the following steps: Initialization: After the glass substrate is loaded, the CNC system scans the global pressure map once through pressure sensor 11 to establish an initial pit distribution map; Cutting begins: The CNC system reads the CNC code or real-time coordinates of the cutting mechanism 6, and cuts along the X and Y axes. It also reads the pressure data from all pressure sensors 11 in real time and calculates the cutting speed based on the position of the cutting mechanism 6. A dynamic compensation window is set up at any time, and the pressure within the window is used to determine whether compensation for the lack of support force is needed. If compensation is required, the compensation algorithm is invoked to calculate the displacement command of the modular compensation mechanism; if no compensation is required, the cutting action of the current path continues. Determine whether the displacement command interferes with the cutting mechanism 6. If there is no interference, issue a displacement command to drive the modular compensation mechanism. If interference occurs, execute the avoidance logic. After the preset time is extended, the feedback pressure value of the compensation region is read and used for error calculation and model adaptive correction of PID (Proportional-Integral-Derivative) control. Cutting complete: Cutting mechanism 6 resets to the starting position.

[0034] This invention also provides a compensation algorithm, the specific steps of which are as follows: (1) Feedforward control: Compensation can be completed before the cutting mechanism 6 reaches the pit, which requires prediction based on the cutting path; Parameter definition: Set the current position of cutting blade 7 to... The cutting blade 7 moves at a speed of The system response delay is The predicted lead time is ; Real-time algorithm: The predicted cutting point at the distance in front of the cutting blade 7 is calculated in real time, using the following formula (1): Formula (1) in, With the center of the circle, A dynamic compensation window is defined with a radius, and the pressure values ​​within this window are queried in real time to determine whether an average pressure value exists within the window. Is it below the preset pressure value? If a modular compensation mechanism is used, a compensation command for that window area will be triggered.

[0035] (2) Compensation amount calculation: The goal of the compensation is to restore the pressure within the compensation window to the ideal value. ; Using PID feedback control, assuming the first... The calculation relationship of each modular compensation mechanism to be compensated is as follows: (2) Formula (2) in, for Time of the first The target height compensation amount of each modular compensation agency For pressure deviation, To monitor pressure in real time, , , These are all PID control parameters and require on-site debugging. Establish a relationship model between pressure, displacement, and support height; Record different lifting heights in areas without dents. Corresponding pressure data Fit the functional relationship ; Indentation depth estimation: In the indentation area, the initial pressure is set to... Based on the above relational model, to achieve this... The required compensation height is The following formula (3) is used for calculation: Formula (3) in, The preset proportionality coefficient was obtained through experiments; Composite control: The relational model calculation is used as the feedforward quantity to quickly complete the coarse adjustment, and then PID feedback control is used for fine adjustment to eliminate relational model errors and disturbances. The final command is as follows (4): Formula (4) in, For the first One compensation height, For the first One PID feedback control quantity.

[0036] (3) Multi-point coordination: Since the glass substrate is a continuous body, the lifting of one point will affect the surrounding pressure distribution (seesaw principle), and it is necessary to avoid interference between the lifting point and the cutting blade 7, so coordination compensation is required; Collaborative compensation: When multiple jacking points are involved in the compensation window, the control algorithm needs to perform multivariate optimization with the goal of homogenizing the pressure distribution within the window, rather than independently controlling each jacking point. This can be simplified to a least squares problem, calculated as follows (5): Formula (5) in, The number of pressure sensors 11 inside the window. For the height of the jacking The predicted pressure after the impact can be obtained through an impact coefficient matrix. Modeling, making .

[0037] Avoidance logic: In the control algorithm, an absolute no-go zone is set for the cutting blade 7. When the predicted cutting point enters a certain physical no-go zone of the lifting area (e.g., a circle with a radius of 20mm), the lifting area is immediately instructed to descend to a safe height. After the cutting blade 7 has completely passed through, it will re-engage in the compensation action.

[0038] The present invention, through the above processing method, compensates the support force at the pit in real time during the dynamic process of cutting, predicts and actively compensates for the upcoming support defects, so that the glass substrate maintains an ideal rigid support state near the cutting point, can coordinate multiple points, prevent interference between the compensation action and the cutting action, and improve the safety of the compensation process.

[0039] The above description is merely an optional embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described or explained in this invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A photovoltaic backsheet glass deep processing equipment, comprising a frame (1) and an elastic pad (8) installed on the top of the frame (1), wherein a cutting mechanism (6) is provided on the outside of the elastic pad (8), characterized in that, Also includes: A modular compensation mechanism is installed inside the frame (1). The modular compensation mechanism is used to divide the bottom surface of the elastic pad (8) into multiple support zones and monitor the pressure value of the support zones. The first compensation ring (18), the second compensation ring (22), the third compensation ring (26) and the fourth compensation ring (30) are arranged vertically in descending order of diameter in the support partition, and the fourth compensation ring (30) is connected to the modular compensation mechanism; When the pressure value is within the process requirement range, the first compensation ring (18), the second compensation ring (22), the third compensation ring (26) and the fourth compensation ring (30) are used to limit the modular compensation mechanism along the first direction to prevent the elastic pad (8) from bulging locally; When the pressure value is lower than the preset value, the first compensation ring (18), the second compensation ring (22), the third compensation ring (26) and the fourth compensation ring (30) support the modular compensation mechanism along the second direction to compensate for the lack of support force of the elastic pad (8) and realize the function of maintaining the support force of the glass substrate.

2. The glass deep processing equipment according to claim 1, characterized in that: The first compensation ring (18) is provided with a multi-headed claw (15) on the outside. The top of the multi-headed claw (15) is arranged with a plurality of hooks in a circumferential array. The hooks are fitted with movable rings (14) on the outside. The top of the movable rings (14) is provided with a traction cable (13) connected to the elastic pad (8). When the elastic pad (8) supports the glass substrate, the plurality of hooks pull the traction cable (13) along a set direction to reduce the degree of deformation of the elastic pad (8) and prevent the elastic pad (8) from bulging locally.

3. The glass deep processing equipment according to claim 2, characterized in that: The top of the first compensation ring (18) is fixed with a first column (16) connected to the bottom of the multi-head claw (15), and the outside of the first column (16) is fixed with a first flange plate (17) for sliding connection of the frame (1). When the first compensation ring (18) moves, the first flange plate (17) horizontally limits the first compensation ring (18) to maintain the first compensation ring (18) facing the support section.

4. The glass deep processing equipment according to claim 1, characterized in that: The first compensation ring (18) has a first through hole (19), and a second column (20) connected to the second compensation ring (22) is inserted into the first through hole (19) along its axial direction. A second flange plate (21) is fixed to the top of the second column (20). When the second flange plate (21) contacts the first compensation ring (18), it is used to limit the first compensation ring (18) along the first direction. When the second flange (21) disengages from the first compensation ring (18), the second compensation ring (22) is used to support the modular compensation mechanism along the second direction.

5. The glass deep processing equipment according to claim 1, characterized in that: The second compensation ring (22) has a second through hole (23), and a third column (24) connected to the third compensation ring (26) is inserted into the second through hole (23) along its axial direction. A third flange plate (25) is fixed to the top of the third column (24). When the third flange (25) contacts the second compensation ring (22), it is used to limit the second compensation ring (22) along the first direction. When the third flange (25) disengages from the second compensation ring (22), the third compensation ring (26) is used to support the modular compensation mechanism along the second direction.

6. The glass deep processing equipment according to claim 1, characterized in that: The third compensation ring (26) has a third through hole (27), and a fourth column (28) connected to the fourth compensation ring (30) is inserted into the third through hole (27) along its axial direction. A fourth flange plate (29) is fixed to the top of the fourth column (28). When the fourth flange (29) contacts the third compensation ring (26), it is used to limit the third compensation ring (26) along the first direction. When the fourth flange (29) disengages from the third compensation ring (26), the fourth compensation ring (30) is used to support the modular compensation mechanism along the second direction.

7. The glass deep processing equipment according to claim 1, characterized in that: The fourth compensation ring (30) is provided with a fourth through hole (31), and the fourth compensation ring (30) is connected to the fifth column (32) and the platform (35) in sequence through the fourth through hole (31). The fifth flange plate (33) is fixed on the top of the fifth column (32). When the fifth flange (33) contacts the fourth compensation ring (30), it is used to limit the fourth compensation ring (30) along the first direction. When the fifth flange (33) disengages from the fourth compensation ring (30), the modular compensation mechanism lifts the platform (35) to compensate for the lack of support force of the elastic pad (8).

8. The glass deep processing equipment according to claim 7, characterized in that: A connecting plate (34) is connected between the bottom of the fifth column (32) and the bottom of the platform (35). The platform (35) has a central hole (36) and a connecting shaft (37) fixed to the central hole (36). During operation, the platform (35) is connected to the modular compensation mechanism via the connecting shaft (37). The platform (35) is lifted by the modular compensation mechanism to realize the function of power transmission to the first compensation ring (18), the second compensation ring (22), the third compensation ring (26) and the fourth compensation ring (30).

9. The glass deep processing equipment according to claim 8, characterized in that: The modular compensation mechanism includes multiple pressure-bearing unit pads (10) spaced apart on the bottom surface of the elastic pad (8). A pressure sensor (11) for monitoring the pressure signal of the pressure-bearing unit pad (10) is embedded inside the pressure-bearing unit pad (10). A vertical telescopic unit (12) is provided at the bottom of the pressure-bearing unit pad (10). When the pressure value is lower than the preset value, the vertical telescopic unit (12) lifts the platform (35), causing the pressure-bearing unit pad (10) to rise locally to compensate for the lack of support force of the elastic pad (8) until the pressure value enters the process requirement range, and the vertical telescopic unit (12) stops operating.

10. A method for processing photovoltaic backsheet glass, applied to the glass deep processing equipment according to any one of claims 1-9, characterized in that, The processing method includes the following steps: Initialization: After the glass substrate is loaded, the CNC system scans the global pressure map once to establish an initial pit distribution map; Cutting begins: The CNC system reads the CNC code or real-time coordinates of the cutting mechanism (6), controls the cutting mechanism (6) to cut along the X and Y axes, reads the pressure data in real time, and calculates the cutting mechanism (6) based on its position and speed. Dynamic compensation window at any given moment; Based on the pressure within the window, determine whether compensation for the lack of support force is needed; if compensation is needed, call the compensation algorithm to calculate the displacement command of the modular compensation mechanism; if no compensation is needed, continue the cutting action of the current path. Determine whether the displacement command interferes with the cutting mechanism (6). If there is no interference, issue a displacement command to drive the modular compensation mechanism; if interference occurs, execute the avoidance logic. After the preset time is extended, the feedback pressure value of the compensation area is read and used for PID error calculation and model adaptive correction. Cutting ends: The cutting mechanism (6) is reset to the starting position.