Atomization flushing type electrified cleaning system for high-precision electronic and electrical equipment and cleaning agent of atomization flushing type electrified cleaning system

Abstract

The invention discloses an atomization flushing type electrified cleaning system for high-precision electronic and electrical equipment and a cleaning agent of the atomization flushing type electrified cleaning system, and belongs to the technical field of electrified maintenance of electronic equipment. The cleaning agent comprises the following components in parts by mass: perfluorotriamylamine, Nove7300 and / or Nove7500, a fluoroether auxiliary solvent, a bio-based fluorine surfactant, a metal organic framework stabilizer, an alkaline buffer system and a decontamination auxiliary agent, and can be atomized to form high-insulation fog drops with the particle size D50 of 1-5 microns, so that the coating, stripping and carrying of pollutants are realized. The system comprises a spraying module, a recycling module, a filtering regeneration module, a liquid storage and supply module and a control module, has the functions of automatic spraying, recycling and cyclic regeneration, can adjust spraying parameters in real time according to potential and temperature and humidity signals, realizes directional flushing and safe drying in an electrified state, has no liquid film residue on the surface after cleaning, and is high in cleaning efficiency. The problems that in the prior art, electrified equipment cannot be safely cleaned in a running state, residual liquid is difficult to recycle, and pollutants are re-deposited are solved.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment maintenance and precision electrical system protection, specifically to a high-precision electronic and electrical equipment atomized flushing type live cleaning system and its cleaning agent. Background Technology

[0002] With the rapid development of industrial automation, energy equipment, and communication systems, the integration and precision of electronic and electrical equipment are constantly improving. Their internal components are subjected to high voltage, high frequency, high heat load, and dusty environments for extended periods. During long-term operation, airborne dust, metal oxide particles, oily mist, and flux residue gradually adhere to the surfaces of circuit boards, terminals, heat sinks, and insulation layers. Although these contaminants have weak surface conductivity, they can easily form an extremely thin conductive film under high humidity or high temperature conditions, causing localized electric field distortion and micro-discharge phenomena. This can further lead to signal interference, overheating, leakage, and even component burnout, posing safety hazards.

[0003] In production sites, this type of pollution problem is on the rise year by year. Taking power control cabinets and communication cabinets as examples, their air ducts and heat dissipation structures are complex, and the air circulation system continuously draws external dust into the internal space. In seasons with higher ambient temperatures, airflow containing trace amounts of oil or volatile organic compounds combines with dust, forming a stubborn oily film on metal terminals and connectors. This type of contamination layer not only reduces heat dissipation efficiency but also easily absorbs moisture, leading to a decrease in insulation resistance. For precision equipment requiring high insulation and low noise, this micro-contamination has become one of the main hidden dangers affecting stable operation.

[0004] Current maintenance methods primarily rely on manual wiping or high-pressure gas purging. Manual wiping has significant limitations: the equipment is often powered on, and stopping for cleaning frequently means production interruption; furthermore, it's difficult to reach confined spaces like high-density wiring areas and multi-layered heat dissipation channels manually, resulting in unsatisfactory cleaning outcomes. While gas purging can remove surface dust, it's almost ineffective against oily films, ionic residues, or oxide particles, and can easily cause secondary floating contamination inside enclosed equipment. More importantly, some liquid cleaning methods require power disconnection; otherwise, the conductivity of conventional cleaning fluids can cause short circuits or discharge risks, making them unsafe for use while the equipment is running.

[0005] Some improved solutions attempt to use fluorinated solvents with high insulating properties as cleaning media, but due to the low surface tension of fluorinated liquids, it is difficult to fully wet complex surfaces; at the same time, single-component systems tend to accumulate fine impurities after repeated use, leading to decreased transparency and reduced cleaning efficiency. In addition, most commercially available electrostatic cleaning agents are only suitable for spraying or wiping, and cannot achieve directional spraying and automatic recycling, resulting in high solvent consumption, high costs, and environmental emissions.

[0006] On the other hand, even fluorinated cleaning agents with good insulation properties generally lack mechanisms to address the dynamic generation of contaminants. In continuously operating equipment, the deposition of dust and oil film is a dynamic process. If periodic automatic cleaning is not possible, even if the initial cleaning is thorough, dust will re-accumulate within a short period, leading to high maintenance frequency and high labor costs. Furthermore, in continuously operating equipment such as power systems, communication base stations, and rail transit signaling systems, downtime maintenance costs are high.

[0007] In view of the above problems, a misting flushing type live cleaning system for high-precision electronic and electrical equipment and its cleaning agent are proposed. Summary of the Invention

[0008] The purpose of this invention is to provide a high-precision electronic and electrical equipment atomized flushing type live cleaning system and its cleaning agent to solve the problems mentioned in the background art.

[0009] To achieve the above objectives, the present invention provides the following technical solution: an atomizing rinsing cleaning agent for high-precision electronic and electrical equipment, comprising, by weight: 20-40 parts of perfluorotripentylamine; 30-60 parts of one or a combination of Novec™ 7300 and Novec™ 7500; 1-5 parts of a fluoroether auxiliary solvent (selected from HFE-347mcc or HFE-449sl); 2-5 parts of a bio-based fluorosurfactant; 3-5 parts of a metal-organic framework stabilizer (Hf-MOF and / or Zr-MOF); 0.1-0.3 parts of an alkaline buffer system (lithium carbonate or its anhydrous salt); optionally, 0.5-1.0 parts of a volatility control agent and 0.2-0.5 parts of a rapid drying accelerator; and 0.5-2.0 parts of a detergency agent; the cleaning agent can be atomized to form droplets with a particle size D50 of 1-5 μm and a volume resistivity not lower than... Ω·cm, suitable for batch spraying and recovery cycles under energized conditions.

[0010] Preferably, the detergency agent includes a type of polymeric dispersant used to enhance the ability of atomized particles to coat and carry away pollutants; the dispersant can form an instantaneous elastic interface when droplets collide with pollutant particles, realizing the coating, peeling and simultaneous recovery of particles, and improving the desorption and carrying efficiency of dirt particles.

[0011] Preferably, the cleaning aid includes a type of surface modifier with anti-redeposition function; the surface modifier is used to enhance the suspension stability of particles in droplets and form a low adhesion energy hydrophobic protective film on the cleaned surface after cleaning to prevent the redeposition of dust and oily impurities.

[0012] Preferably, the cleaning aid includes a type of microporous material with the function of adsorbing and complexing oxidizing dust; the material can remove oxidizing particles and polar particles through physical adsorption and weak chemical complexation, while maintaining the high insulation properties and atomization stability of the cleaning agent.

[0013] A method for applying an atomized rinsing cleaning agent to high-precision electronic and electrical equipment, wherein the atomized spraying is carried out in a batch pulse mode: the single spraying time is 0.2-0.5s, the interval time is 0.3-0.6s, the spray distance is 25-45mm, the mist opening angle is 15°-45°, and the residual liquid on the surface is less than 0.1μL / cm² within 20-30s after spraying, so as to achieve electrostatic rinsing without liquid film residue.

[0014] A high-precision electronic and electrical equipment atomized flushing type live-line cleaning system, characterized in that: the system uses the cleaning agent according to any one of claims 1 to 4 as the cleaning medium, and includes: a spraying module for atomizing the cleaning agent into droplets with a particle size D50 of 1 to 5 μm and spraying them in batches according to the parameters described in claim 5; a recovery module, coaxially arranged with the spraying module and forming a negative pressure backflow field, so that the ratio of the recovered amount to the sprayed amount is not less than 0.95; a filter regeneration module for separating particulate impurities and monitoring the concentration and volume resistivity of the recovered liquid, and automatically replenishing the liquid when it deviates from the set range; a liquid storage and supply module for switching the liquid supply between the basic formula and the formula containing additives; and a control module for automatically adjusting the spraying frequency and recovery flow rate according to the degree of contamination, temperature and humidity, and surface potential signals.

[0015] Preferably, the spraying module and the recovery module are integrated inside the equipment housing; the nozzle is fixed directly above the part to be cleaned, and the spraying direction is tilted at 30° to 60° relative to the normal direction of the equipment mounting surface; so that the spray mist can cover the corners of electronic components, heat dissipation ducts and terminal blocks and other areas prone to dust accumulation; the control module triggers automatic cleaning on a cycle of 24 to 72 hours, the amount of liquid sprayed at one time is no more than 0.2 mL, and synchronous recovery and drying are completed within 30 seconds after spraying.

[0016] Preferably, the main body of the system is an independent external device; it connects to the air outlet or inspection port of the electronic equipment through a sealed interface to form a closed-loop cleaning path; the nozzle is set at an external position corresponding to the part to be cleaned, located directly in front of or above the area to be cleaned; the spray direction is inclined at 30° to 60° relative to the normal of the equipment surface, used to directionally rinse dust-accumulated areas such as the corners, heat dissipation gaps, and terminal areas of the electronic equipment surface; the recovery module is arranged in the downstream area of ​​the spray path and connected to the filter regeneration module to realize the synchronous recovery of the mixture of droplets and dust; when the system is working, it forms a closed-loop cycle of spraying-rinsing-recovery-regeneration.

[0017] Preferably, the spraying module and the recovery module are configured with a flow rate ratio of / The proportional linkage is ≥1.4; the control module dynamically adjusts based on the negative pressure signal at the recovery end and the surface potential monitoring signal. When the potential drift of the surface being cleaned exceeds 50mV or the recovery negative pressure is lower than 2.5kPa, the spraying is automatically stopped and the module switches to enhanced recovery and gas dry blowing mode; the filter regeneration module is equipped with a microfluidic dripping unit, which drips alkaline buffer solution into the circulation loop at a rate of 0.05~0.2mL / s to maintain the cleaning agent in the weakly alkaline range of equivalent pH 7.5~8.5, and achieves real-time stable control of the cleaning agent components through dual detection of refractive index and resistivity.

[0018] A method for cleaning by electrostatic atomization, characterized by using the cleaning agent described in any one of claims 1 to 4 and implementing it in the system described in any one of claims 6 to 9, includes the following steps: Step 1: Selecting a corresponding cleaning agent from the basic formula or the formula containing additives A, B, and C according to the type of contamination and cleaning requirements of the electronic equipment; Step 2: Atomizing the cleaning agent into droplets with a particle size D50 of 1 to 5 μm by a spraying module, and intermittently spraying according to the batch parameters of claim 5, with the nozzle positioned directly above or in front of the area to be cleaned, and the spraying direction inclined at 30° to 60° relative to the normal of the equipment surface to cover dust-accumulated areas such as the corners and heat dissipation ducts of electronic components; Step 3: ... 3. Simultaneously activate the recovery module, maintaining a negative pressure of 2.5–6.0 kPa, to allow dust-laden droplets to be recovered with the airflow to the filter regeneration module; Step 4. The filter regeneration module sequentially performs microfiltration and concentration / resistivity detection. When the detected value deviates from the preset range, the microfluidic dripping unit automatically activates to replenish alkaline buffer solution to maintain the cleaning agent's equivalent pH of 7.5–8.5; Step 5. Monitor the equipment surface potential in real time throughout the cleaning process. When the potential drift exceeds 50 mV, automatically stop spraying and switch to dry-blowing recovery mode until the detected value returns to stability; Step 6. After the spraying, recovery, and regeneration cycle is completed, the residual liquid volume on the equipment surface is less than 0.1 μL / cm², and the volume resistivity remains no less than [value missing]. Ω·cm, thus achieving safe atomized cleaning without liquid film residue under charged conditions.

[0019] Compared with existing technologies, the advantages of this invention are as follows: This invention combines a high-insulation atomized cleaning agent with directional spraying, negative pressure recovery, and filtration regeneration structures to periodically atomize and rinse the surface of electronic and electrical components while the equipment is powered on. This allows the droplets to cover terminals, heat dissipation structures, and internal corner areas, and they are simultaneously recovered after spraying without forming a liquid film residue. The cleaning agent, through its coating, peeling, and carrying effects on contaminants, removes dust, oxide particles, and oily residues along with the droplets. At the same time, the filtration and regeneration modules maintain the stability of the cleaning fluid's physicochemical properties, preventing performance degradation during repeated use. During operation, the system can automatically adjust the spraying and drying parameters based on potential, temperature, and humidity, ensuring that the cleaning process is independent of the equipment's normal operation and does not affect its electrical performance or continuous operation. This achieves safe, efficient, and repeatable online maintenance without the need for shutdown or manual disassembly, solving the problems of existing technologies such as the need to shut down the equipment for cleaning high-precision electronic and electrical equipment, numerous cleaning blind spots, difficulty in recovering residual liquid, easy redeposition of contaminants, and insufficient safety during cleaning under energized conditions. Detailed Implementation

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] This invention provides a technical solution: an atomizing rinsing cleaning agent for high-precision electronic and electrical equipment, comprising, by weight: 20-40 parts perfluorotripentylamine; 30-60 parts of one or a combination of Novec™ 7300 and Novec™ 7500; 1-5 parts of a fluoroether auxiliary solvent (selected from HFE-347mcc or HFE-449sl); 2-5 parts of a bio-based fluorosurfactant; 3-5 parts of a metal-organic framework stabilizer (Hf-MOF and / or Zr-MOF); 0.1-0.3 parts of an alkaline buffer system (lithium carbonate or its anhydrous salt); optionally, 0.5-1.0 parts of a volatility control agent and 0.2-0.5 parts of a rapid drying accelerator; and 0.5-2.0 parts of a detergency agent. The cleaning agent can be atomized to form droplets with a particle size D50 of 1-5 μm and a volume resistivity not lower than [missing value]. Ω·cm, suitable for batch spraying and recovery cycles under energized conditions.

[0022] The present invention relates to a high-precision electronic and electrical equipment atomized flushing-type live-line cleaning system and its cleaning agent. The system utilizes a composite of multiple high-insulation, low-surface-energy components to construct a safe atomization system, enabling automated decontamination, cleaning, and recycling under live conditions. The cleaning agent employs a synergistic formulation of a fluorinated solvent system and a metal-organic framework stabilizer. Through molecular-level adsorption and dispersion, a stable system with high resistivity and controllable evaporation rate is formed. After atomization through the nozzle, the cleaning agent forms fine droplets with a particle size D50 of 1–5 μm, which can generate a layered impact on the surface of electronic devices, peeling away accumulated dust, oil, and oxide particles layer by layer. The decontamination aids in the system further improve the coating and carrying capacity of the atomized droplets, enabling particles to be dispersed, adsorbed, and carried away from the equipment surface in a short time, thereby achieving non-contact flushing cleaning of the equipment during operation.

[0023] The cleaning agent contains three types of decontamination aids used synergistically. The first type is an encapsulation and removal enhancement agent, which forms a molecular-layer elastic interface upon contact between the droplets and contaminants, encapsulating the contaminant particles and carrying them away with the droplets, achieving rapid removal of highly adherent contaminants. The second type is an anti-redeposition agent, whose components form a low-adhesion-energy protective layer on the cleaned surface after cleaning, preventing the re-adhesion of airborne dust and oil mist, maintaining long-term cleanliness of the device surface. The third type is an oxide dust capture agent, possessing a porous adsorption structure or weak complexing ability, capable of capturing polar particles such as copper oxide and aluminum oxide, and carrying them away through droplet suspension, preventing oxide dust accumulation at high-voltage areas and causing dielectric breakdown. These three types of aids work synergistically during the atomization impact process, enabling the cleaning, dispersion, and protection functions to be continuously completed in a single cycle.

[0024] The system employs a batch-intermittent atomization process. The nozzle atomizes the cleaning agent into fine droplets, then pulses through the droplets at intervals of 0.2–0.5 seconds, switching to a negative pressure airflow with a 0.3–0.6 second interval. This method effectively prevents continuous liquid film formation while ensuring the impact energy and uniform coverage of the sprayed droplets, enabling comprehensive cleaning of complex structural areas through the gas-liquid mixture. The intermittent droplet spray combined with airflow disturbance significantly enhances the micro-dust removal rate, making it suitable for non-contact rinsing of precision components in confined spaces.

[0025] The main system comprises a spraying module, a recovery module, a filtration and regeneration module, a liquid storage and supply module, and a control module. The spraying module is equipped with a multi-stage atomizing nozzle array, which can switch between single-point pulse spray, linear scanning, or area coverage modes depending on the equipment size. The recovery module is coaxially arranged downstream of the nozzles, using a negative pressure flow field to achieve rapid suction and return of dust-laden droplets. The filtration and regeneration module features multi-stage filtration units and dual monitoring channels for concentration and resistivity. When the cleaning fluid performance deviates from a set threshold, it automatically performs replenishment, dilution, or regeneration operations to ensure long-term stability of the cleaning fluid's electrical properties. The liquid storage module can be configured with different formulation branches, allowing the equipment to select different additive combinations based on the type of contaminant. The control module uses sensors to monitor temperature, humidity, and surface potential changes in real time, automatically adjusting the spraying frequency, air pressure, and recovery flow rate to achieve a fully closed-loop operation of spraying-recovery-regeneration.

[0026] For the built-in cleaning structure, the nozzles are positioned above key cleaning locations inside the equipment housing, with the spray direction tilted at 30°–60° relative to the housing normal to cover circuit board terminal areas, heat dissipation gaps, and the housing's internal and external corners. This layout ensures that droplets impact contaminants with the shortest path, reducing cleaning fluid retention, and immediately switches to recovery mode after spraying, achieving a single automated maintenance process. This solution is particularly suitable for high-voltage testing equipment, communication modules, and precision cabinet-type enclosed systems.

[0027] For external cleaning structures, the nozzles and recovery module are integrated into a movable cleaning device, connecting to the equipment's air outlet or maintenance port via a sealed interface to form an independent circulation channel. The external nozzles are positioned directly above or in front of the area to be cleaned, with a spray angle of 30°–60° to the normal to the equipment surface. The recovery module uses negative pressure to draw in droplets and impurity particles, achieving rapid external rinsing and recovery. The filtration module purifies the recovered liquid in real time and monitors the volume resistivity to maintain it at 1×10¹. 4 With a strength of Ω·cm or higher, this ensures safe and reliable operation during repeated use. This solution is suitable for equipment cleaning operations during on-site maintenance or centralized repairs, enabling surface dust removal and internal cooling channel cleaning without disassembling the machine.

[0028] The system's spraying and recovery are achieved through flow-linked control. When the ratio of recovery flow rate to spray flow rate, Q_rec / Q_spray, is ≥1.4, it ensures complete recovery of the sprayed droplets and prevents diffusion. The control module monitors negative pressure and potential in real time. When the recovery pressure is insufficient or the potential fluctuates abnormally, it automatically stops spraying and switches to dry blowing mode to prevent local droplet accumulation. The filter regeneration module is equipped with a microfluidic replenishment device, which maintains the pH of the circulating liquid in the range of 7.5–8.5 through low-speed dripping, ensuring a stable chemical equilibrium for the system over a long period. The system uses dual channels of refractive index detection and resistivity monitoring to ensure a constant liquid ratio, achieving long-term, high-efficiency operation under continuous circulation conditions.

[0029] The live-line atomization cleaning method includes the following steps: First, select a basic cleaning agent or a formula with different cleaning aids added according to the type of equipment contamination; second, the spray module atomizes the liquid into 1-5 μm droplets, which are then sprayed onto the target surface in batches at a set frequency; subsequently, the recovery module is activated to create negative pressure suction, guiding the dust-laden droplets into the filter regeneration module for separation and regeneration; during the cleaning process, the system continuously monitors changes in liquid concentration, resistivity, and surface potential, and automatically adjusts the spray and recovery rates when abnormalities are detected; finally, the residual micro-mist is removed through a dry-blowing stage, ensuring that the residual liquid on the equipment surface is less than 0.1 μL / cm², thus ensuring that the equipment is safe, residue-free, and free from static electricity accumulation while operating under live conditions.

[0030] The main formulation of the atomized rinsing-type electrostatic cleaner of this invention consists primarily of perfluorotripentylamine, Novec™ 7300 / 7500, fluoroether auxiliary solvents, bio-based fluorosurfactants, metal-organic framework stabilizers, and an alkaline buffer system. Volatility control agents and rapid drying accelerators may be added if necessary to improve process performance. The components form a multi-layered synergistic system, ensuring both high resistivity and detergency while maintaining safety.

[0031] Perfluorotripentylamine serves as the core solvent, boasting a purity of 99.999%. It provides extremely low surface tension and high chemical inertness within the system, enabling it to penetrate deep into the micropores and crevices of equipment and exhibiting excellent solubility for both polar and non-polar contaminants. Novec™ 7300 or 7500 is an electronic-grade fluorinated liquid with a moderate evaporation rate and good gas-liquid conversion performance. It can form a miscible phase with perfluorotripentylamine, adjusting the overall viscosity and atomization stability of the system to ensure that the spray droplet size distribution is concentrated between 1 and 5 μm.

[0032] Fluoroether auxiliary solvents (such as HFE-347mcc or HFE-449sl) are generally used in formulations at a dosage of 1 to 5 parts. Their main function is to improve the solubility of high-viscosity components and optimize the droplet morphology after atomization. Due to the high flexibility of the C–O bonds in fluoroether molecules, they can effectively reduce solution viscosity and increase the evaporation rate. At the same time, they form a surface tension gradient during the droplet evaporation stage, promoting spontaneous droplet contraction and reducing residual liquid.

[0033] The bio-based fluorosurfactant is used in an amount of 2–5 parts, preferably a fatty acid ester fluorinated polyether extracted by supercritical fluid extraction. Its molecules have strongly polar groups at both ends, allowing them to rapidly align at the gas-liquid interface, giving the droplets ultra-fast wetting and redispersibility. This component can instantly reduce the surface tension of the liquid to 15–18 mN / m, enabling the cleaning agent to form an ultra-thin, continuous liquid film on the surface of electrical equipment, thereby improving the decontamination rate while ensuring that electrical insulation is not compromised.

[0034] The preferred metal-organic framework stabilizer is Hf-MOF or Zr-MOF, at a concentration of 3–5 parts in the system. This stabilizer's porous framework structure (specific surface area ≥1800 m² / g) can adsorb free radicals and trace amounts of moisture, preventing solvent oxidative decomposition, and capture reactive ions through Lewis acid centers, thus extending the system's lifetime. In a highly dispersed state, this stabilizer forms a molecular-level network with the fluorinated solvent, preventing stratification, uneven volatilization, and ensuring long-term storage stability.

[0035] The alkaline buffer system uses 0.1 to 0.3 parts of lithium carbonate or its anhydrous salt. Under ultrapure conditions, it neutralizes acidic byproducts by releasing OH⁻ ions, maintaining a stable pH range of 7.5–8.5 and preventing corrosion of equipment materials and aging of cleaning agents.

[0036] Under certain operating conditions, 0.5 to 1.0 parts of a volatilization control agent can be added to prolong the droplet suspension time and improve the coverage of the cleaning agent inside complex structures; at the same time, 0.2 to 0.5 parts of a rapid drying accelerator can be added to shorten the residual liquid evaporation cycle, so that the overall drying time is controlled within 60 seconds, achieving the "dry in, dry out" electrostatic cleaning effect.

[0037] Under different application scenarios, the above main formulation can form the following typical combination forms: (1) Standard type: 45 parts of perfluorotripentylamine, 28 parts of Novec™ 7500, 10 parts of bio-based fluorinated surfactant, 4.5 parts of Hf-MOF, and 0.3 parts of lithium carbonate, suitable for cleaning control cabinets and power modules; (2) High-efficiency type: 48 parts of perfluorotripentylamine, 30 parts of Novec™ 7300, 5 parts of fluoroether additive, 3 parts of surfactant, and 5 parts of Hf-MOF, suitable for cleaning quantum computing and precision instrument parts; (3) Fast-drying type: 40 parts of perfluorotripentylamine, 55 parts of Novec™ 7500, 3 parts of fluoroether additive, and 0.5 parts of fast drying accelerator, suitable for online cleaning and continuous production line maintenance.

[0038] Specifically, detergency agents include a class of polymeric dispersants used to enhance the ability of atomized particles to coat and carry away contaminants; when droplets collide with contaminant particles, the dispersant can form an instantaneous elastic interface, realizing the coating, peeling and simultaneous recovery of particles, and improving the desorption and carrying efficiency of dirt particles.

[0039] The detergency agent described in this invention enhances the coating, peeling, and carrying capacity of atomized cleaning particles when impacting the surface of electrical equipment. Its core function is to improve the interfacial behavior between droplets and contaminant particles, making it easier for contaminants to be adsorbed by droplets and carried away with the gas-liquid recirculation. The detergency agent mainly uses a polymeric dispersant with low surface energy, weak polarity, and good solvent compatibility. By forming a transient viscoelastic layer on the droplet surface, it regulates the dynamics of droplet impact, rebound, and spreading, thereby achieving efficient coating and transfer of contaminants.

[0040] In terms of component selection, this detergency agent preferably uses fluorinated polymeric dispersants or fluorosiloxane-modified dispersants. The fluorinated polymeric dispersant can be a polyether copolymer with end groups or side chains containing fluoroolefin groups, ether groups, or carboxyl ester groups, and its molecular weight is generally controlled between 3×10³ and 1×10³. 4 Within a certain range, it ensures sufficient fluidity and molecular orientation response in solvent systems. Fluorosiloxane-modified dispersants use the Si–O main chain as a flexible framework, introducing –CF3 or –C2F5 groups at the molecular ends or side chains, giving the material both extremely low surface tension and controllable molecular viscosity. It can rapidly accumulate at the gas-liquid interface during atomization impact, forming a protective film with viscoelastic response characteristics.

[0041] The working principle of this type of dispersant is as follows: When atomized particles impact the surface of an electrical device with a moderate Weber number, the dispersant molecules rapidly orient themselves at the droplet interface, with their low-polarity backbone facing the gas phase side and their polar end groups facing the solid phase interface, forming a transient viscoelastic film layer 5–50 nm thick. This film reduces the adhesion work of the droplets in the initial stage of impact, allowing the droplets to cover contaminant particles in a "flexible wrapping" manner, rather than spreading on the surface to form a continuous liquid film. Subsequently, with changes in impact inertia and interfacial tension, the film layer peels the particles from the substrate surface and keeps them suspended during the rebound phase, ultimately carrying the particles away as a whole under the action of the recovering negative pressure airflow. Because the film disappears with solvent evaporation after a few milliseconds, it does not leave a film layer on the device surface and does not introduce conductive impurities.

[0042] In practice, the amount of detergent additive added is 0.5–2.0 parts by mass, preferably 1.0–1.5 parts by mass. This ratio can maintain the system's volume resistivity ≥1×10¹. 4Under the premise of Ω·cm, the droplets exhibit a significant viscoelastic response during impact without generating foam. The additive addition method is typically as follows: the polymeric dispersant is first pre-dissolved in a mixed solvent of Novec™ 7500 and HFE-347 mcc (volume ratio 9:1), and magnetically stirred at room temperature for 20–40 minutes to form a clear solution. This solution is then slowly added to the main system at 5–15°C, stirred for 30–60 minutes, and filtered through a 0.1 μm filter to obtain a homogeneous finished product. To prevent micro-agglomeration, the order of addition of the dispersant and MOF stabilizer should be "MOF dispersion first, then dispersant addition" to ensure that the system maintains high transparency and compatibility during multiple cycles.

[0043] In applications, this additive significantly improves the ability of droplets to encapsulate and remove contaminant particles. Experiments show that after adding the detergent additive, the rebound coefficient of droplets on the surface of metal terminals and heat sink gaps increases by approximately 25%, and the mass of residual contaminants per unit area decreases by approximately 30% after spray cleaning. Furthermore, under spray conditions with a particle size D50 of 3 μm, the particle removal rate of the recovered filter membrane can reach over 85%, the atomization process remains stable, and there is no escape of large droplets. The additive does not degrade after recycling and can be reused more than 10 times after filter regeneration without affecting cleaning performance.

[0044] Examples of preferred chemical structures of auxiliaries are as follows:

[0045] • Polyfluoroether-polyether copolymer dispersant: with polyperfluorohexyloxyethylene as the main chain and polyoxyethylene segments containing ether bonds inserted into the blocks;

[0046] Fluorosiloxane-modified dispersants: The main chain has a Si–O–Si structure, and the side chains have CF3 and ethoxy groups at the ends;

[0047] • Low-fluorinated polyurea system: formed by the reaction of difluoroisocyanate with fluorinated amine oligomers, forming a reversible hydrogen bond network.

[0048] These types of dispersants all maintain high stability in fluorinated solvent systems and do not affect the insulation class required for electronic equipment.

[0049] In summary, the cleaning aid significantly improves the coating and peeling efficiency of contaminant particles by forming a transient low surface energy viscoelastic film on the droplet surface, enabling the cleaning agent of this invention to stably and efficiently complete the entire process of atomization rinsing and contaminant recovery even in an charged environment.

[0050] Specifically, cleaning aids include a class of surface modifiers that have anti-redeposition properties; surface modifiers are used to enhance the suspension stability of particles in droplets and form a low-adhesion-energy hydrophobic protective film on the cleaned surface after cleaning, preventing the redeposition of dust and oily impurities.

[0051] The core design principle of the anti-redeposition additive of this invention lies in the synergistic effect of surface energy regulation and interfacial adsorption kinetics, enabling the cleaned surface to form a low-adhesion-energy, transient hydrophobic protective film after cleaning, thereby preventing the re-adsorption of micro-dust, oily residues, or redeposited carbides and oxides. Its mechanism is based on molecular-level interfacial reconstruction: when droplets carrying contaminants are recovered after impact, some additive molecules remain on the surface due to van der Waals interactions between their intramolecular fluoride-loving segments and the substrate, forming a self-assembled hydrophobic layer only 1–3 nm thick. This layer exhibits self-limiting properties under the combined action of an electric field and thermal gradient, forming a densely packed, non-polar oriented structure on the surface, reducing the surface free energy to 10–14 mN / m, thus significantly inhibiting secondary adhesion of contaminants.

[0052] Anti-redeposition additives are preferably a combination system of fluorosilane-terminated oligomers and sulfobetaine-based amphoteric fluorosurfactants. The former has a flexible Si–O–Si backbone and CF3 end groups, which can quickly orient and align on charged surfaces to form a stable hydrophobic layer; the latter contains both positively charged quaternary ammonium groups and negatively charged sulfonic acid groups in its molecule, which can generate electrostatic neutralization and dispersion bilayer repulsive forces between the droplet interface and the contaminant surface, preventing particle aggregation and redeposition during the droplet evaporation stage.

[0053] Its working process can be described in three stages:

[0054] 1. Droplet impact stage: Amphoteric surfactant molecules migrate to the gas-liquid interface at sub-millisecond speeds, reducing surface tension and improving droplet wettability, enabling droplets to penetrate deep into the surface of microgrooves or micropores.

[0055] 2. Stripping and suspension stage: The electric double layer repulsion effect between molecules stabilizes the pollutants in the droplets, preventing particles from agglomerating; fluorosilane end-group molecules begin to adsorb directionally on the substrate surface.

[0056] 3. Evaporation and Curing Stage: As the fluorinated solvent rapidly evaporates, fluorosilane molecules form weak bonds with surface oxygen functional groups via van der Waals forces, constituting a non-polar oriented layer. This layer maintains a contact angle above 110° and can completely evaporate within 60 seconds, leaving no visible film residue.

[0057] The typical ratio of the two components in the additive is: 0.08–0.18 parts by mass of amphoteric fluorosurfactant and 0.05–0.12 parts by mass of fluorosilane-terminated oligomer. Too low a ratio will result in insufficient surface wetting and an incomplete protective film; too high a ratio may reduce the volume resistivity of the system or cause foaming. A ratio of 0.12:0.08 provides the best anti-redeposition performance. To ensure uniform intermolecular dispersion, pre-dissolve the additive in a fluoroether solvent (HFE-449sl or HFE-347mcc) at 10–20°C, then slowly add it to the main system at a dropping rate of 0.1 mL / s, and continue stirring for 30–50 minutes.

[0058] In practice, the atomized cleaning agent with this type of anti-redeposition additive exhibited excellent anti-recontamination performance in tests on charged metal plates and optical lens surfaces: after cleaning and exposure to standard dust for 12 hours, the increase in surface particles was less than 5%, far lower than the 27% without the added component; electrical performance tests showed that the system's volume resistivity remained at 1.1 × 10¹. 4 Above Ω·cm, no conductivity decay was observed.

[0059] Preferred anti-redeposition agents include the following specific types:

[0060] • Fluorosilane-terminated polydimethylsiloxane (F-PDMS) oligomers, whose terminal CF3 groups can be directionally adsorbed to form a liquephobic layer;

[0061] • Sulfobetaine-type amphoteric fluorinated surfactants, with the general formula R_f–CH2–CH2–N⁺(CH3)2–CH2–CH2–SO3⁻, where R_f is a C6–C8 fluoroalkyl chain;

[0062] Fluorinated polyether–alkylamide copolymer system, which combines wetting regulation and antistatic properties;

[0063] Fluorinated acrylate-siloxane block copolymers exhibit reversible thermal responsiveness during film formation and can automatically desorb.

[0064] These anti-redeposition agents work synergistically with the main solvent and dispersant in this system to not only prevent particle redeposition but also reduce interfacial charge accumulation, avoiding the risk of secondary adsorption and partial discharge under charged conditions, thereby ensuring that the cleaned surface maintains a clean and stable state for a long time under high insulation requirements.

[0065] Specifically, cleaning aids include a class of microporous materials with the functions of adsorbing and complexing oxidizing dust; these materials can remove oxidizing particles and polar particles through physical adsorption and weak chemical complexation, while maintaining the high insulation properties and atomization stability of the cleaning agent.

[0066] The oxidizing dust adsorption and complexing agent of this invention is used to remove oxidizing dust, metal ion residues, and non-polar carbonized particles generated on the surface of electrical equipment or inside the heat dissipation cavity due to high-temperature operation, metal friction, or air oxidation. Its core technology lies in utilizing a dual mechanism of porous adsorption and weak chemical complexation. By introducing metal-organic framework materials (MOFs) and their composites with specific coordination centers and pore size distributions into the cleaning agent system, droplets can simultaneously achieve physical capture and ion complexation upon impacting the contaminated surface, thereby improving the dust removal rate and maintaining system stability.

[0067] Preferred adsorption complexation systems include composite systems of **Hf-MOF (hafnium-based metal-organic framework) and Zr-MOF (zirconium-based metal-organic framework)**, used in a mass ratio of 1:1 to 1:2. Hf-MOF has a lattice pore size of approximately 0.8–1.2 nm and a high Lewis acid site density, enabling coordination adsorption with hydroxyl groups, iron oxide layers, or metal cations on the dust surface. Zr-MOF has a larger pore size (1.5–2.0 nm), which is beneficial for containing larger carbonized particles or fluorinated organic debris. The synergistic effect of these two structures forms a stable nanoscale dispersion in the solvent phase, exhibiting a strong ability to capture oxide particles.

[0068] The working principle of this additive is as follows: During the cleaning process, the droplets contain uniformly dispersed MOF nanoparticles. When these droplets come into contact with tiny dust particles on the surface of electrical equipment, the metal centers (Hf) inside the MOF channels... 4 ⁺、Zr 4 (⁺) Through Lewis acid-base interaction, reversible complex bonds are formed between the particles and oxygen atoms on the dust surface. Simultaneously, after being carried into the gas-liquid flow by droplets, the dust particles are stably encapsulated by the pore size sieving effect of the MOF framework. This process achieves synergistic removal in three stages: dissolution, adsorption, and capture, without altering the system's insulation properties.

[0069] To further improve system stability and prevent particle agglomeration, this invention introduces a fluorinated polyether modifier as a dispersion protective layer into the MOF additive system. It contains fluorinophilic segments and carboxylic acid ends, which can form a stable fluorinated coating layer on the MOF surface, making it difficult for nanoparticles to agglomerate and precipitate in highly volatile solvents, thereby ensuring long-term cyclic use.

[0070] During preparation, the MOF additive was dispersed using the following process: Hf-MOF and Zr-MOF powders were first mixed in a specific ratio, then 5–10 times their volume of Novec™ 7500 was added for pre-wetting. Next, 0.5–1.0 parts of a fluorinated polyether modifier were added, and the mixture was dispersed under ultrasonic conditions at 35–50 kHz for 20–40 minutes to control the particle size D50 within the range of 100–200 nm. The resulting mixed solution was then mixed with the main system and stirred for 30 minutes to obtain a stable adsorption-complexing cleaning agent.

[0071] Testing showed that this system could reduce the surface particle concentration from 2.5 mg / cm² to below 0.3 mg / cm² in a simulated motor winding oxide dust environment, with an iron oxide residue rate of less than 5%. Even after 10 cycles of cleaning, the MOF dispersion system remained transparent and stable. Electrical performance tests showed that the system's volume resistivity remained stable at 1.0 × 10¹⁸. 4 The value of Ω·cm or higher indicates that it is fully suitable for cleaning operations in energized environments.

[0072] Preferred oxidizing dust adsorption and complexing agents include:

[0073] • Hf-MOF (UiO-66(Hf) derived structure): pore size 0.8–1.2 nm, specific surface area about 1800 m² / g, mainly adsorbs iron oxide and aluminum oxide particles;

[0074] • Zr-MOF (UiO-67(Zr) type): pore size 1.5–2.0 nm, specific surface area about 2000 m² / g, used to capture larger particle size carbides and resin debris;

[0075] Fluorinated polyether surface modifier (PFPE-COOH type): forms a stable coating layer to prevent MOF from agglomerating in solvent;

[0076] • Optional ligand auxiliaries (nitrogen-containing pyridine or imidazole ligands): enhance the complexation reaction rate in strongly oxidizing environments.

[0077] The introduction of these additives enables the cleaning agent to stably adsorb and remove contaminants when faced with high-temperature oxidation, electrostatic dust, and particulate impurities, without affecting the insulation performance, and allowing for multiple cycles of use. Long-term testing has shown that the system retains over 95% of its transparency, indicating excellent chemical and structural stability under dynamic spraying and recovery conditions.

[0078] A method for applying an atomized rinsing cleaning agent to high-precision electronic and electrical equipment, wherein the atomized spraying is carried out in a batch pulse mode: the single spraying time is 0.2-0.5s, the interval time is 0.3-0.6s, the spray distance is 25-45mm, the mist opening angle is 15°-45°, and the residual liquid on the surface is less than 0.1μL / cm² within 20-30s after spraying, so as to achieve electrostatic rinsing without liquid film residue.

[0079] The atomizing spray structure and spraying process described in this invention are used to transform cleaning agents into highly insulating micro-droplets under energized conditions, achieving directional rinsing and particle removal of the surfaces and internal gaps of electrical equipment. Its core lies in a multi-stage spray system combining low-pressure atomization, directional spraying, and pulse control, enabling the cleaning agent to complete gas-liquid mixing and uniform dispersion in a very short time. The droplet size is stable and the trajectory is controllable, thus balancing cleaning efficiency and electrical safety.

[0080] The atomizing spray structure includes a nozzle body, an atomizing chamber, a liquid inlet, an airflow drive chamber, and a guide outlet. The nozzle body is made of polytetrafluoroethylene (PTFE) or PFA insulating material, and its interior features a coaxial atomizing channel structure: the cleaning agent is sprayed out from the central liquid channel, and compressed air or inert gas (preferably nitrogen) enters the atomizing chamber from the annular outer channel. At the outlet, a high-speed shear field is formed by tangential airflow, achieving instantaneous liquid atomization. This structure has a 45° guide cone at the outlet, with an adjustable spray angle of 30° to 60° to adapt to different equipment surface morphologies.

[0081] The droplet size is controlled synergistically by the gas-liquid flow ratio and the atomizing orifice diameter. When the gas-liquid ratio (Q_g / Q_l) is in the range of 1.5 to 2.5, the droplet size D50 can be stabilized at 1 to 5 μm. Too low a gas-liquid ratio will result in excessively large droplets and obvious flow marks, while too high a ratio may introduce the risk of static charge accumulation. To ensure spray uniformity, the atomizing orifice diameter is preferably 0.2 to 0.5 mm, and a micro-turbulence deflector is added at the outlet to disperse streamlines and reduce liquid jet inertia.

[0082] The nozzle should be positioned approximately 50mm away from the area to be cleaned, and angled along the contour of the equipment surface. The spray direction should be aimed at the "corner" structures on the equipment surface, i.e., areas where contamination is concentrated, such as dust, wire roots, connector gaps, and the bottom of heat sinks. An angle adjustment device can achieve ±15° spray angle compensation, allowing the droplets to fully cover the target area, forming a semi-enclosed micro-airflow circulation zone to increase the probability of impact-induced removal of contaminant particles.

[0083] Regarding the spraying method, this invention employs a batch pulse atomization mode. Each spray lasts 0.3–0.5 seconds, with a 1.5–2 second interval between cycles to avoid liquid accumulation and potential drift, while also providing airflow margin for the recovery system. The atomization pressure is controlled within the range of 0.05–0.1 MPa, effectively suppressing the risk of high-voltage discharge. The atomization device can be configured with multiple nozzle arrays according to the equipment size, and the spraying sequence is triggered sequentially by the control module according to a set program, achieving multi-point synchronous cleaning.

[0084] Experiments show that the average particle size of the droplet swarm formed under the above conditions is about 3 μm, with 90% distributed in the range of 1–5 μm. The droplet velocity is about 8–12 m / s, which can generate sufficient kinetic energy to impact and remove particles without damaging electrical insulation. Observation with a high-frame camera shows that the droplets complete the entire process of impact, expansion, and evaporation within 10 ms after spraying, with a droplet coverage rate of over 95%. The residual liquid after washing completely evaporates within 60 s.

[0085] In addition, to prevent static electricity buildup and droplet deviation, a potential equalization layer made of highly insulating fluororesin composite ceramic is installed inside the nozzle and on the surface of the atomization chamber, which can disperse the local electric field intensity within a safe threshold. The entire spray module and control system are electrically isolated by a shielding layer to ensure electrical safety during the cleaning process.

[0086] In practical applications, this atomizing spray structure can be used in both fixed cleaning systems and as a portable module with an external recycling device. Taking a substation control unit as an example, when the nozzle is positioned 50mm above the device at a spray angle of 45°, the dust removal efficiency reaches over 92%. For ventilation openings or cable connector areas, the nozzle can be modified to a fine, concentrated stream to increase local impact force and thus improve the decontamination capability.

[0087] The atomization spraying process of this invention not only ensures the efficient distribution and rapid evaporation of the cleaning agent under charged conditions, but also achieves a balance between spray safety and effectiveness through precise gas-liquid control, forming a complete cleaning process of "point spraying - directional rinsing - rapid evaporation - no residue".

[0088] A high-precision electronic and electrical equipment atomized flushing type live-line cleaning system, characterized in that: the system uses the cleaning agent according to any one of claims 1 to 4 as the cleaning medium, and includes: a spraying module for atomizing the cleaning agent into droplets with a particle size D50 of 1 to 5 μm and spraying them in batches according to the parameters of claim 5; a recovery module, coaxially arranged with the spraying module and forming a negative pressure backflow field, so that the ratio of the recovered amount to the sprayed amount is not less than 0.95; a filter regeneration module for separating particulate impurities and monitoring the concentration and volume resistivity of the recovered liquid, and automatically replenishing the liquid when it deviates from the set range; a liquid storage and supply module for switching the liquid supply between the basic formula and the formula containing additives; and a control module for automatically adjusting the spraying frequency and recovery flow rate according to the degree of contamination, temperature and humidity, and surface potential signals.

[0089] The atomized rinsing system of this invention comprises five main parts: a liquid storage unit, an atomized spraying unit, a recovery and filtration regeneration unit, a gas-liquid separation unit, and a control and monitoring module, forming a closed-loop circulation system. Through low-pressure airflow drive, segmented filtration, and automatic concentration compensation, the system maintains stable performance of the cleaning agent during multiple rounds of spraying and recovery, avoiding the waste and environmental risks associated with traditional disposable cleaning agents.

[0090] I. System Overall Structure The liquid storage unit is used to store the prepared atomized cleaning agent. Its tank adopts a double-layer insulated stainless steel structure, with the inner wall treated with a fluorinated polymer protective coating to resist long-term immersion corrosion by fluorinated solvents and MOF additives. A liquid level sensor and temperature monitoring module are installed at the bottom of the tank to detect changes in solution volume and viscosity. A nitrogen protective layer is installed at the top to prevent water vapor from entering the system.

[0091] The liquid storage unit is connected to the spraying unit via a delivery pipe. The pipe contains a solenoid valve and a flow meter to control the dosage of each spray. The spraying unit is connected to the atomizing nozzle described in claim 5 and can achieve pulsed spraying through a control program. After atomization, the cleaning agent forms a gas-liquid mixture in the target area, flushing away contaminant particles and carrying them into the recovery hood below.

[0092] II. Recycling and Filtration Regeneration Unit The recycling system employs a negative pressure suction method and consists of a recycling hood, liquid collection pipeline, gas-liquid separator, and filtration module. The negative pressure is provided by a miniature vortex pump. The mixed airflow after suction first enters the gas-liquid separator, where the liquid and gas are separated using the principles of vortex flow and gravity separation. The gas is discharged through a drying filter element, while the liquid flows into the filtration module.

[0093] The filtration module features a three-layer structure: the first layer is a polytetrafluoroethylene microporous membrane (0.2μm pore size) for trapping particulate impurities; the second layer is an activated carbon / silica gel composite layer for adsorbing organic residues; and the third layer is a regenerated Hf-MOF and Zr-MOF layer for capturing dissolved metal ions and trace oxides. The filtered cleaning agent returns to the storage unit via a conduit. The entire circuit operates at ambient temperature and pressure, requiring no high-pressure pump and exhibiting extremely low system energy consumption.

[0094] III. Automatic Concentration Monitoring and Compensation To prevent compositional deviations in the cleaning agent after multiple cycles, this system incorporates an online concentration detection module. This module uses an infrared refractive index sensor to detect the relative ratio of perfluorotripentylamine to Novec™ 7500, determining whether the solvent concentration is below a set threshold by comparing it to a standard refractive index (1.258±0.002). When solvent dilution or a decrease in active components is detected, the control system automatically opens the solenoid valve of the replenishment tank, injecting a high-concentration mother liquor proportionally to restore the system to the standard ratio. The compensation process is coordinated by a microcontroller unit (MCU) to ensure loop self-balancing.

[0095] IV. System Operation Flow During operation, the system first activates the negative pressure recovery module via the control unit. Subsequently, the spray module pulses, atomizing the cleaning agent and spraying it to cover the target area. The gas-liquid mixture flows over the equipment surface and enters the recovery hood. Particles, along with droplets, enter the circulation pipeline and are trapped in the filtration module. The filtered liquid returns to the storage tank. The detection module monitors the concentration and temperature in real time; if parameter deviations are detected, it automatically replenishes and stirs the liquid evenly. The entire cleaning cycle can run continuously for 30–60 minutes, achieving unattended automatic maintenance.

[0096] V. Security and Control Strategy System: The system incorporates multiple security mechanisms.

[0097] 1. Electrical isolation control: Optically isolated signal transmission is used between the injection and recovery units to prevent high-potential backflow;

[0098] 2. Temperature and resistivity monitoring: Real-time detection of the volume resistivity of the cleaning agent; if it is lower than 1×10¹... 4 The spraying will automatically stop at Ω·cm.

[0099] 3. Automatic discharge protection: When an abnormal increase in liquid level or excessive particle concentration is detected, the system automatically switches to discharge mode to ensure solution quality.

[0100] During long-term operation, the system can automatically adjust the spray frequency according to the degree of surface contamination and air humidity, achieving integrated periodic rinsing and maintenance cleaning. Experiments show that the cleaning agent reuse rate of this circulating system is over 95%, and the residual liquid discharge in a single cleaning process is less than 2%, greatly improving the cleaning economy and environmental adaptability.

[0101] Specifically, the spraying module and the recovery module are integrated inside the equipment housing; the nozzle is fixed directly above the area to be cleaned, and the spraying direction is tilted at 30° to 60° relative to the normal direction of the equipment mounting surface; so that the spray mist can cover the corners of electronic components, heat dissipation ducts, terminal blocks and other areas prone to dust accumulation; the control module triggers automatic cleaning on a cycle of 24 to 72 hours, with a single spray volume not exceeding 0.2 mL, and synchronous recovery and drying are completed within 30 seconds after spraying.

[0102] The built-in cleaning system of this invention integrates the cleaning spray and recovery module directly inside the housing of the equipment being cleaned. This allows for automatic cleaning and protective maintenance of electrified surfaces during equipment operation, forming a closed-loop function of "self-cleaning—self-drying—self-detection." This system is particularly suitable for dynamic surface cleaning and dust removal of high-precision electrical equipment (such as power control units, communication modules, and sensor modules) that operate continuously for extended periods and cannot be frequently shut down for maintenance.

[0103] The built-in system consists of a cleaning spray pipeline, micro-atomizing nozzles, an internal collection channel, a micro-recovery unit, a filter element assembly, and insulation and detection circuitry. The entire system is embedded within the cavity structure of the equipment housing, maintaining electrical isolation from the internal wiring and heat dissipation modules. The nozzles are positioned above the areas inside the equipment requiring cleaning, typically in gaps between components, at the base of connectors, or in the corners of structures. The spray direction is angled along the equipment surface, aimed at these corners, to ensure that the atomized particles effectively cover all areas of accumulated dust.

[0104] The cleaning agent is supplied from a micro-storage tank located at the bottom or side of the equipment and delivered into the spray pipeline via a miniature electromagnetic pump. The atomizing nozzle is made of ceramic electrically insulating material with an orifice diameter of 0.25–0.4 mm and an internal flow-dividing needle structure to control the spray cone angle and flow stability. To prevent voltage interference to electrical components caused by atomized spraying, the nozzle is covered with an insulating layer and is electrically isolated from the equipment casing. The spraying cycle is automatically triggered by the main control system during operating intervals, with each cleaning session lasting no more than 3 seconds.

[0105] The droplets formed after spraying are immediately drawn into micro-recovery channels located below or on the side walls upon impact with the surface. These channels are distributed in a grid pattern and have a hydrophilic coating on the inner wall to improve the residual liquid return rate. The recovered liquid is purified through a micro-filter (0.1μm pore size) and an MOF adsorption layer before flowing back into the storage tank, achieving internal circulation. The system has built-in temperature and humidity sensors to monitor the internal environment after cleaning. When the humidity returns to the set value (relative humidity <25%), the recovery fan automatically stops and the system is resealed.

[0106] To prevent cleaning agent residue and insulation degradation, the built-in system is structurally designed with an airflow-guided drying channel. Utilizing the equipment's own cooling airflow or an independent micro-fan, it creates a directional purging effect, ensuring that residual liquid on the surface completely evaporates within 30-60 seconds. Simultaneously, the system's insulation detection module monitors the resistivity of key nodes in real time. If an abnormally high surface conductivity is detected, the drying time can be extended or the main circuit operation can be paused to ensure electrical safety.

[0107] During use, the control module triggers cleaning at regular intervals based on the equipment's operating status. For example, if continuous operation exceeds 48 hours or an increase in internal dust concentration is detected (identified by the optical detection module), the system automatically enters maintenance mode and performs a short-term electrified atomized flush. After flushing, the system recovers all residual liquid into the storage tank and completes regeneration and concentration calibration through internal circulation.

[0108] Compared to external cleaning systems, the built-in system offers the advantage of automatic maintenance without disassembly, making it particularly suitable for environments such as sealed electrical control equipment, vehicle-mounted control modules, and internal control cabinets of wind turbines. Test results show that the built-in system can remove more than 90% of the surface dust in each cleaning cycle, and the change rate of insulation resistance before and after cleaning is less than 2%, fully meeting the safety requirements under energized working conditions.

[0109] Specifically, the main body of the system is an independent external device; it connects to the air outlet or maintenance port of electronic equipment through a sealed interface to form a closed-loop cleaning path; the nozzles are set at the external position corresponding to the part to be cleaned, located directly in front of or above the area to be cleaned; the spray direction is inclined at 30° to 60° relative to the normal of the equipment surface, used to directionally rinse the dust-accumulated parts such as the inside and outside corners, heat dissipation gaps and terminal areas of the electronic equipment surface; the recovery module is arranged in the downstream area of ​​the spray path and connected to the filter regeneration module to realize the synchronous recovery of the mixture of droplets and dust; when the system is working, it forms a closed-loop cycle of spraying-rinsing-recovery-regeneration.

[0110] This invention can also set the entire cleaning system as an external docking cleaning system, which is suitable for electrical equipment or long-term encapsulated operating units (such as power control cabinets, communication base stations, photovoltaic inverters, electronic testing terminals, etc.) that cannot reserve space for internal cleaning modules. The system achieves atomized rinsing and cleaning maintenance of charged surfaces through temporary external docking, and has the technical characteristics of strong portability, wide applicability, and no structural modification requirements for existing equipment.

[0111] The external system comprises five parts: a main unit, a liquid supply unit, a gas-liquid mixing and spraying unit, a recovery and filtration unit, and a sealed guide hood. The main unit integrates a cleaning agent tank, an air pump, a control module, and a concentration detection device. Its bottom connects to the liquid supply unit via a hose assembly. The liquid supply unit uses a replaceable storage tank filled with atomized cleaning agent concentrate, and its outer wall features quick-connect snap-fit ​​connectors for easy on-site replacement.

[0112] Before the cleaning operation, the guide hood is fixed to the outer edge of the air inlet, air outlet, or inspection port of the equipment being cleaned via magnetic attraction or a spiral locking structure, forming a locally sealed space. The hood is made of transparent polycarbonate material, with a guide curved surface on the inner surface to ensure that the atomized jet is evenly distributed along the airflow direction. A pressure-resistant sealing ring is provided on the outer edge of the hood to maintain stable airtightness within 0.1 MPa. An adjustable nozzle array is installed at the top of the hood, with the nozzle structure consistent with claim 5, and its spray direction is aimed at the heat sink, filter, and electrical connector area of ​​the equipment casing at an angle of 15° to 45°.

[0113] During operation, the main unit activates the air pump, delivering the cleaning agent from the storage tank into the nozzle array for atomized spraying. The sprayed droplets evenly cover the target surface within the enclosure, relying on airflow guidance to achieve directional impact and dirt removal. The spray cycle is 0.5–1.0 seconds, with a 2–3 second interval, and cleaning is completed in 3–5 minutes. The contaminated droplets are then drawn in by the airflow through the lower recovery inlet and enter the gas-liquid separation and filtration system inside the main unit.

[0114] The recovery module, similar to the built-in system, includes a hydrocyclone separator, a PTFE filter membrane, a MOF composite adsorption layer, and an activated carbon layer. It thoroughly removes impurities from the cleaned liquid before returning it to the storage tank for recycling. The main unit has a built-in concentration detection and temperature sensing module that automatically assesses the effective concentration of the cleaning agent after recovery and replenishes with a high-concentration concentrate if necessary.

[0115] To ensure insulation safety during live cleaning, all docking components of the external system (including the housing, nozzles, piping, and outer casing) are made of highly insulating materials with a volume resistivity of not less than 1×10¹. 4 Ω·cm. The power supply section uses an isolated power module, and a potential equalization ring is installed between the nozzle and the cover to prevent local static electricity accumulation from causing discharge.

[0116] This external system can be operated by hand or in a fixed position. For applications requiring targeted spraying, a telescopic arm structure can be used to allow the nozzle array to extend into the equipment for cleaning. For larger equipment, such as wind turbine nacelle control cabinets, a dual-nozzle structure can be used to achieve bidirectional counter-current spraying, improving particle stripping efficiency.

[0117] In terms of performance, the external docking system can remove surface dust and oil without disassembling the equipment. Test data shows that when the spray pressure is 0.08 MPa, the droplet size is 3 μm, and the cleaning time is 3 minutes, the residual dust on the surface is less than 4%, and the insulation resistance retention rate after cleaning is greater than 98%. At the same time, because the droplets evaporate rapidly inside the enclosure, there is almost no liquid spillage during the entire process.

[0118] Compared to built-in cleaning systems, this external solution enables temporary connection via a portable interface, allowing for rapid maintenance during equipment operation or short-term downtime. It is suitable for periodic maintenance and multi-point inspections. Its advantages include no need to modify the original equipment structure, easy installation, adequate safety isolation, and compatibility with multiple devices, significantly improving the operation and maintenance efficiency and environmental adaptability of high-precision electronic and electrical equipment.

[0119] Specifically, the spraying module and the recovery module are configured with a flow rate ratio of / The proportional linkage is ≥1.4; the control module dynamically adjusts based on the negative pressure signal at the recovery end and the surface potential monitoring signal. When the potential drift of the surface being cleaned exceeds 50mV or the recovery negative pressure is lower than 2.5kPa, the spraying is automatically stopped and the module switches to enhanced recovery and gas dry blowing mode; the filter regeneration module is equipped with a microfluidic dripping unit, which drips alkaline buffer solution into the circulation loop at a rate of 0.05~0.2mL / s to maintain the cleaning agent in the weakly alkaline range of equivalent pH 7.5~8.5, and achieves real-time stable control of the cleaning agent components through dual detection of refractive index and resistivity.

[0120] The control system module of this invention is used for multi-parameter dynamic coordination of atomization spraying, recovery negative pressure, concentration, and potential status to achieve real-time safety control and adaptive feedback adjustment in an electrified cleaning environment. This module collects signals such as potential, flow rate, temperature, humidity, and pH value, combined with the flow ratio between the atomization spraying unit and the recovery unit. / The dynamic linkage logic of ≥1.4 enables quantitative atomization of cleaning agents, timely recovery, and self-balancing operation of the system.

[0121] The control module mainly consists of a main control chip (MCU), a high-precision potential sampling unit, a flow detection circuit, a temperature and humidity sensing module, and a concentration refractive index detection unit. The main control chip is interconnected with the injection module and the recovery module via a CAN bus or a 485 communication interface to perform closed-loop control of injection time, pressure, recovery negative pressure, and drying time.

[0122] During operation, the control module monitors the potential changes of the surface being cleaned and the pressure fluctuations at the recovery end in real time.

[0123] • When the surface potential drift is detected to exceed 50mV or the recovery negative pressure is below 2.5kPa, the system automatically stops injection and switches to gas dry blowing mode to prevent liquid accumulation from causing transient conductivity risk;

[0124] • If the detection signal returns to the safe range (drift less than 20mV, negative pressure higher than 3kPa), the system restarts the spray cycle to ensure the stability of continuous cleaning.

[0125] To maintain long-term stable operation of the system, the control module is equipped with a micro-flow replenishment device for the filtration unit. This device adds a small amount of diluent to the circulation loop at a rate of 0.05–0.2 mL / s to balance solvent evaporation loss and ion concentration fluctuations. This process is monitored by a closed-loop conductivity detection circuit, which automatically replenishes the solution when the system's volume resistivity approaches the lower threshold limit to prevent a decrease in the insulating properties of the cleaning agent.

[0126] The system maintains the cleaning agent's pH value within the slightly alkaline range of 7.5–8.5 during operation to prevent acidification or metal ion precipitation caused by prolonged use. pH detection is achieved via an electrode microprobe, and the results are fed back to the main control module in real time for adjusting the microdroplet replenishment ratio.

[0127] Furthermore, the control system dynamically assesses the composition of the cleaning agent through a dual-channel monitoring mechanism combining refractive index detection and resistivity detection. The refractive index unit monitors the relative concentration changes of the main solvent and additives in the cleaning agent. When the refractive index deviates from the standard value (1.258±0.002), the control unit automatically activates the solenoid valve of the replenishment tank for concentration correction. The resistivity detection unit continuously monitors the insulation performance of the system and is linked to the spray start / stop logic to ensure the safety of the live operation process.

[0128] The master control algorithm adopts a hierarchical feedback strategy:

[0129] 1. The first layer is the injection-recovery flow ratio balance control, which is achieved through real-time sampling. and Perform proportional correction;

[0130] 2. The second layer is a dynamic potential protection control to prevent surface charge accumulation caused by cleaning droplets;

[0131] 3. The third layer is for solution composition self-calibration and temperature and humidity compensation control to ensure long-term system stability;

[0132] 4. The fourth layer is a self-learning adjustment module, which automatically optimizes the spray rhythm based on the equipment's historical cleaning cycles.

[0133] Tests showed that this control system maintained potential fluctuations of less than ±30mV and droplet size stability of over 95% during dynamic cleaning, and its insulation performance remained at 1×10¹ after 10 cycles. 4 Above Ω·cm. The entire control logic realizes closed-loop control of multi-parameter collaborative monitoring, self-balancing feedback, abnormal linkage protection, and automatic concentration calibration, so that the system always maintains the optimal balance between cleaning effect and electrical safety during continuous operation.

[0134] A method for cleaning by electrostatic atomization, characterized in that it uses the cleaning agent of any one of claims 1 to 4 and is implemented in any one of claims 6 to 9, comprising the following steps: Step 1: Selecting the appropriate cleaning agent from the basic formula or the formula containing additives A, B, and C according to the type of contamination and cleaning requirements of the electronic equipment;

[0135] The specific procedure involves adding the prepared atomized cleaning agent to the storage unit, checking the liquid level, pH value, and volume resistivity of the storage tank, and ensuring that the system is within the standard range (pH 7.5–8.5, volume resistivity ≥1×10¹). 4 Ω·cm). After the control module starts, it first establishes a self-test procedure for the gas-liquid circuit:

[0136] • Detect the static flow ratio of the injection and recovery modules / Is it ≥1.4?

[0137] • Calibrate the refractive concentration detection unit and potential monitoring module;

[0138] • The system automatically purges nitrogen to remove moisture from the storage tank and pipelines, preventing the risk of electrical conductivity from subsequent spraying.

[0139] During this stage, historical data is read simultaneously, and the initial spray parameters (spray pressure, pulse frequency, drying time) are adaptively corrected according to the ambient temperature and humidity, and the equipment is confirmed to be within the safe power range for cleaning. Step 2: The spraying module atomizes the cleaning agent into droplets with a particle size D50 of 1 to 5 μm, and sprays them intermittently according to the batch parameters of claim 5. The nozzle position is set directly above or in front of the outer side of the part to be cleaned, and the spraying direction is tilted at 30° to 60° relative to the normal of the equipment surface to cover dust accumulation areas such as the inside and outside corners of electronic components and heat dissipation air ducts.

[0140] The specific procedure is as follows: the spraying module is started according to the set program, the cleaning agent is atomized into fine droplets with a particle size of 1 to 5 μm through the nozzle, and sprayed at an angle of 30° to 60° towards the area to be cleaned. The spraying cycle is 0.3 to 0.5 seconds, with an interval of 1.5 to 2.0 seconds, and the total duration of a single spraying cycle is 1 to 3 minutes.

[0141] During this process, the control module monitors the potential drift value and local humidity changes on the surface of the spray zone in real time. If the potential drift exceeds 50mV or the humidity is higher than 60%, the system automatically pauses spraying and initiates negative pressure recovery and dry blowing procedures until the data returns to a safe range before resuming spraying. This dynamic switching is responded to in real time by the main control unit based on a sampling frequency of 0.1s.

[0142] During the spraying process, the impact shear force generated by the gas-liquid mixture and the dispersion and adsorption effects of the additives inside the cleaning agent work together to achieve the removal and suspension of pollutants. When the droplets diffuse on the surface, Hf-MOF / Zr-MOF particles capture oxidized dust, while amphoteric surfactants and fluorosilane oligomers form a transient hydrophobic film at the interface to prevent particle re-adhesion; Step 3: Simultaneously start the recovery module and maintain a negative pressure of 2.5-6.0 kPa to allow the dust-laden droplets to be recovered with the airflow to the filter regeneration module;

[0143] The specific procedure is as follows: the flushed gas-liquid mixture is drawn into the recovery port at the bottom or side of the equipment and enters the negative pressure recovery system. The recovery system uses the principles of cyclone and gravity separation to separate the gas and liquid. The gas is discharged after drying and filtration, while the liquid enters a three-layer filtration module.

[0144] 1. The PTFE microporous membrane (0.2μm) traps solid impurities;

[0145] 2. Activated carbon / silica gel layer adsorbs organic residues and trace solvent gases;

[0146] 3. The MOF regeneration layer removes metal oxides and ionic impurities through coordination adsorption.

[0147] The filtered liquid is assessed for concentration by a refractive index detection unit and returned to the storage tank for recycling. If the detected concentration deviates from the standard value of 1.258±0.002, the system automatically injects a high-concentration solvent from the mother liquor tank for correction; if the pH value is below 7.5, the micro-flow replenishment device replenishes the buffer solution at a rate of 0.05~0.2mL / s to restore the system to a weakly alkaline state; Step 4: The filtration regeneration module sequentially performs microfiltration and concentration and resistivity detection. When the detected value deviates from the preset range, the microfluidic dripping unit is automatically activated to replenish the alkaline buffer solution to maintain the equivalent pH of the cleaning agent at 7.5~8.5;

[0148] The specific procedure is as follows: After spraying and recovery are completed, the control system initiates a directional drying program, using the equipment's built-in cooling airflow or an external micro-fan to create a directional airflow, allowing the residual liquid to completely evaporate within 30-60 seconds. During the drying process, the control module continuously monitors the surface potential drift. When the drift is less than 10mV and the relative humidity is below 25%, the cleaning is considered complete. If the potential or humidity recovers slowly, the system extends the drying time or automatically increases the airflow rate.

[0149] In addition, at this stage, the control system uses both resistivity and capacitance detection signals to determine whether the surface insulation performance has recovered to the standard (1×10¹). 4 Step 5: Monitor the surface potential of the equipment in real time throughout the cleaning process. When the potential drift exceeds 50mV, automatically stop spraying and switch to dry blowing recovery mode until the detection value returns to stability.

[0150] The specific procedure is as follows: When the system concentration drops by more than 5% or the transparency of the recovered liquid decreases to a set threshold, the system automatically enters regeneration mode. The control module starts the circulation pump, causing the liquid in the storage tank to circulate continuously through the MOF composite filter layer for 10-15 minutes to remove residual particles. If the system detects that the MOF adsorption layer is saturated (judged by changes in conductivity and flow resistance), it automatically prompts for maintenance and filter replacement. The regenerated cleaning agent returns to standard parameters and can be used in the next cleaning cycle. Step 6: After the spraying, recovery, and regeneration cycles are completed, the residual liquid volume on the equipment surface is less than 0.1 μL / cm², and the volume resistivity remains at no less than [value missing]. Ω·cm, thus achieving safe atomized cleaning without liquid film residue under charged conditions.

[0151] Specifically, the main control module records and uploads data from the entire cleaning process (potential drift, concentration, humidity, spraying duration, temperature changes, etc.) to the control terminal in real time. The system can automatically analyze cleaning cycles and contamination accumulation patterns based on historical data, optimizing subsequent spraying frequency and duration to achieve predictive maintenance.

[0152] Using the above method, this invention enables safe and efficient live cleaning and protection of high-precision electronic and electrical equipment without power interruption. The system utilizes dynamic potential monitoring, concentration self-balancing, and a closed-loop recovery mechanism to achieve long-term recycling of the cleaning agent, maintaining high insulation while ensuring the impact force and coating performance of the atomized rinsing, thus achieving a balance between cleaning and protection.

[0153] Experiments have shown that this method improves cleaning efficiency by about 70% compared to traditional manual power-off cleaning, reduces agent consumption per cycle by 60%, and the equipment insulation performance shows no significant degradation after 100 hours of continuous operation.

[0154] Example 1:

[0155] The cleaning agent was formulated according to the following mass ratios: 35 parts perfluorotripentylamine, 45 parts Novec™ 7500, 3 parts fluoroether auxiliary solvent, 3 parts bio-based fluorosurfactant, 4 parts Hf-MOF stabilizer, 0.2 parts lithium carbonate buffer system, and 1.2 parts detergency agent. The detergency agent is a complex system of polymeric dispersant and amphoteric surfactant, which enhances the coating and carrying capacity of droplets for contaminant particles. The cleaning agent was magnetically stirred and then allowed to stand to degas before being injected into the system's storage tank. The spray system used a 0.3mm orifice ceramic insulated nozzle with a 45° spray angle, a 32mm spray distance, a spray pressure of 0.06MPa, and a gas-liquid ratio of 1.8. Atomization was achieved using a 0.4-second pulse spray followed by a 0.4-second intermittent cycle for six rounds. The recovery system had a negative pressure of 4.0kPa, a flow ratio Q_rec / Q_spray of 1.6, and a drying time of 60 seconds. The control module monitors the potential drift in real time. When the drift exceeds 50mV, it automatically stops the injection and enters the dry blowing process.

[0156] The contaminated sample was set as a terminal block of a printed circuit board in operation, with a terminal spacing of 2 mm. The contamination source was a mixture of ISO Fine Dust A2 standard dust and a light lubricating oil film. The dust application rate was approximately 10 g / m², and the oil film thickness was approximately 0.5 μm. 30 seconds after spraying, the residual liquid volume on the surface was less than 0.08 μL / cm², the residual mass on the surface decreased by 91% compared to before cleaning, the particle removal rate was 88%, the potential drift range was within ±25 mV, and the volume resistivity remained at 1 × 10¹. 4 Above Ω·cm, no corrosion marks were found on the terminal surface after cleaning, and the insulation performance was unaffected. In repeated tests, the transparency of the recovered liquid remained good, with no obvious sedimentation or turbidity.

[0157] To compare and verify the effect of the cleaning aid on the coating and carrying capacity, the same solvent system was used without the cleaning aid, while other conditions remained consistent. After cleaning, the residual mass of the terminal area decreased by only 63%, the particle removal rate was significantly reduced, surface droplets merged to form local liquid films, the drying time was extended to 110 seconds, and the residual liquid volume was approximately 0.16 μL / cm². Microscopic observation revealed that some dust formed strip-shaped deposition bands along the airflow direction, and slight redeposition occurred in local areas. The comparative results show that the coating and carrying capacity of the system without the cleaning aid is significantly insufficient, and particles are difficult to be completely carried away by the droplets. After cleaning, dust remains locally on the terminal surface. In contrast, the system containing the cleaning aid can achieve complete particle dispersion, suspension, and removal in a short time, while maintaining high insulation and rapid drying performance.

[0158] To further demonstrate the differences in cleaning efficiency and electrical safety performance, key performance indicators were selected for comparative testing, and the results are shown in Table 1.

[0159] Test Project Contains detergent additive system No detergent additive system Performance Difference Explanation Surface residual mass (mg / cm²) 0.045 0.122 The residue level in the system containing additives decreased by approximately 63% after cleaning. Pollutant removal rate (%) 91 63 Increased by approximately 28%, particles were completely encapsulated and carried away by the mist droplets. Surface residual liquid volume (μL / cm²) 0.08 0.16 Systems containing additives dry faster and prevent the formation of liquid films. Drying time (s) 60 110 The evaporation rate of the system containing additives is increased by approximately 45%. Potential drift range (mV) ±25 ±70 Electrical stability significantly improved Volume resistivity (Ω·cm) <![CDATA[≥1.0×10¹ 4 ]]> <![CDATA[≥1.0×10¹ 4 ]]> Maintain high insulation performance Residual particle form Scattered, without reunion Strip-like aggregation, local redeposition Additives improve particle dispersion stability Surface corrosion signs none slight oxidation spots Significantly improved formula gentleness

[0160] As shown in Table 1, the cleaning agent of the present invention, after introducing the detergency agent, can significantly improve the ability of droplets to encapsulate and remove pollutants, achieving efficient cleaning and rapid drying under charged conditions, and ensuring electrical insulation stability.

[0161] Example 2:

[0162] The cleaning agent was formulated according to the following parts by weight: 30 parts perfluorotripentylamine, 50 parts Novec™ 7300, 3 parts fluoroether auxiliary solvent, 2.5 parts bio-based fluorosurfactant, 4 parts Zr-MOF stabilizer, 0.2 parts lithium carbonate buffer system, and 1 part anti-redeposition detergency agent. The anti-redeposition detergency agent is a compound of amphoteric fluorosurfactant and fluorosiloxane end-group oligomers. This system is used to reduce particle re-adsorption after cleaning, resulting in a uniform hydrophobic protective layer on the cleaned metal or insulating surface.

[0163] The cleaning agent, after being thoroughly mixed, is injected into the storage tank. The nozzle uses a 0.25mm orifice ceramic insulated nozzle with a 30° spray angle, a 40mm spray distance, and a pulse spray time of 0.3 seconds followed by a 0.5-second interval, for a total of 8 continuous sprays. The gas-liquid ratio is controlled at 2.0, and the spray pressure is 0.05MPa. The recovery system has a negative pressure of 3.8kPa, and the flow ratio Q_rec / Q_spray is 1.5. The automatic drying time after cleaning is 45 seconds. The control module monitors the potential and humidity of the spray area in real time. When the potential drift exceeds 40mV or the humidity is higher than 60%, spraying is paused and the system enters a drying mode.

[0164] The sample was a heat sink array structure under energized operation, made of anodized aluminum, with a fin spacing of 5 mm. The contaminants were a uniformly applied composite layer of fine dust and silicone oil mist, with a dust load of approximately 12 g / m² and a silicone oil film thickness of 0.8 μm. After spray cleaning, the samples were evaluated using surface weighing, particle counting, and microscopic observation.

[0165] After cleaning, the residual mass on the heat sink surface decreased by 89%, the particle removal rate was 91%, and no visible residual liquid was observed within 60 seconds of spraying, indicating complete drying. A dust exposure test was conducted again after 12 hours, showing a surface particle growth rate of less than 5%, while the untreated sample showed a particle growth rate of 27%, indicating that the anti-redeposition layer effectively delayed secondary adhesion. Contact angle measurements showed that the contact angle of the cleaned heat sink surface was 110°±3°, significantly higher than that of the untreated sample (72°±5°), indicating a stable hydrophobic layer formation on the surface.

[0166] To further verify the role of the Zr-MOF stabilizer in the system, the same conditions were used, but the Zr-MOF component was removed, while the remaining components and parameters remained the same. After cleaning, the residual oxidized dust rate was 18%, the particle redeposition area ratio increased to 15%, the dust growth rate after 12 hours rose to 22%, and trace water marks appeared on the surface. The comparison shows that the system without MOF exhibited decreased adsorption capacity for oxidized particles after multiple cycles, significantly reduced liquid transparency, increased filter pressure differential, and insufficient system stability.

[0167] The test results are shown in Table 2.

[0168] Test Project Zr-MOF system Zr-MOF-free system Explanation of differences Surface residual mass (mg / cm²) 0.052 0.128 Residue was reduced by approximately 59% after cleaning with a MOF-containing system. Pollutant removal rate (%) 91 74 MOF enhances particle capture and cyclic cleaning capabilities. Dust redeposition area (%) 3 15 The anti-adhesion capability of MOF-containing systems is improved by approximately 5 times. Dust growth rate (12h, %) 5 22 The durability of the surface hydrophobic layer is significantly enhanced. Surface contact angle (°) 110±3 72±5 A stable hydrophobic layer forms on the surface Filter element pressure difference change (kPa) +0.3 +1.5 MOF effectively prevents clogging and extends service life. Potential drift range (mV) ±28 ±65 The system's operational stability has been significantly improved. Liquid transparency (% transmittance) after cleaning 96 81 The MOF-containing system has better circulating fluid stability.

[0169] The results show that the system of the present invention, under the synergistic effect of Zr-MOF and anti-redeposition additive, can effectively inhibit the re-adhesion of particles after cleaning, maintain the long-term cleanliness and liquid repellency of the equipment surface, and ensure that the electrical system operates stably and without breakdown under energized conditions.

[0170] Example 3:

[0171] The cleaning agent was formulated according to the following mass ratios: 32 parts perfluorotripentylamine, 48 parts Novec™ 7500, 2.5 parts fluoroether auxiliary solvent, 3 parts bio-based fluorosurfactant, 4.5 parts Hf-MOF and Zr-MOF compound stabilizer, 0.2 parts lithium carbonate buffer system, and 0.8 parts detergency agent, wherein the MOF compound ratio was 1:1. The MOF component exhibits excellent metal ion capture performance, adsorbing oxide particles and metal debris generated during the cleaning process and preventing solution performance degradation during recycling.

[0172] After the cleaning agent is thoroughly mixed, it is injected into the system's storage tank. The atomizing nozzle has an orifice diameter of 0.25 mm, a spray angle of 60°, a spray distance of 25 mm, a spray pressure of 0.06 MPa, a gas-liquid ratio of 1.8, a pulse spray time of 0.5 seconds followed by a 0.5-second interval, and a total of 5 spray cycles. The recovery system maintains a negative pressure of 3.5 kPa, and the Q_rec / Q_spray ratio is 1.6. The detection module monitors potential drift, and spraying is paused when the drift exceeds 50 mV.

[0173] The sample consisted of a copper busbar and nickel-plated contact area. The contamination source was a mixed layer of Fe2O3 and Al2O3 dust (particle size 1–10 μm), with an application rate of approximately 15 g / m². A 10V DC bias was applied to simulate electrical operating conditions. After cleaning, the samples were evaluated using surface weighing, electron microscopy, and resistance change testing.

[0174] After cleaning, the residual mass on the busbar surface decreased to 0.049 mg / cm², the oxidation dust removal rate was 95%, and the average surface roughness decreased from 1.2 μm to 0.8 μm. Electrical contact resistance decreased by 17%, while insulation resistance remained at 1 × 10¹.4 The potential drift was above Ω·cm, within ±30mV, and no flashover or localized conductive paths were observed. After 10 consecutive cycles, the transparency of the recovered solution remained above 95%, with no significant sedimentation.

[0175] To compare and verify the role of the MOF system in oxide adsorption and cycle stability, the same process conditions were used without the addition of MOF components. After cleaning, the residual oxide dust rate was 18%, and fine dust particles were visible on the surface. After three cycles, the cleaning solution became slightly turbid, and the filter pressure differential increased to 1.8 kPa, indicating that particles gradually accumulated in the system. The improvement rate of electrical contact resistance was only 8%, and extremely thin watermarks appeared in some areas. Comparative data are shown in Table 3.

[0176] Test Project Hf / Zr-MOF system MOF-free system Explanation of differences Surface residual mass (mg / cm²) 0.049 0.112 Residue was reduced by 56% after cleaning with a MOF-containing system. Oxidized dust removal rate (%) 95 82 Improved by 13%, for more thorough removal. Change rate of electrical contact resistance (%) -17 -8 The conductive surface is more uniform after cleaning. Filter element pressure difference change (kPa) +0.4 +1.8 MOF delays clogging and improves cycle stability Light transmittance of cleaning solution (%) 95 78 The transparency of MOF-containing systems remains good. Potential drift range (mV) ±30 ±70 The system runs more stably Surface observation results Clean and free of dust Local dust bands are obvious Improved surface cleaning uniformity Insulation resistance (Ω·cm) <![CDATA[≥1.0×10¹ 4 ]]> <![CDATA[≥1.0×10¹ 4 ]]> All maintain high insulation

[0177] The results show that the Hf / Zr-MOF composite stabilizer effectively improves the oxidative impurity capture capacity and cycle stability of the cleaning agent through physical adsorption and chemical complexation of oxide particles. Compared with the MOF-free system, the surface is cleaner after cleaning, the electrical properties are restored more significantly, and the system can maintain a high insulation and low residue state for a long time, making it suitable for live flushing maintenance of high-precision electrical components such as busbars, contacts, and control terminals.

[0178] Example 4:

[0179] An internal atomizing rinsing system is installed within the equipment, with the spraying and recovery components integrated into the equipment housing cavity. This system automatically performs surface cleaning and drying maintenance during equipment operation. The system includes a miniature liquid storage tank, an atomizing nozzle array, a recovery channel, a microfiltration unit, and a potential detection module. The cleaning agent uses the formulation described in Example 1, containing detergency agents and MOF stabilizers, with a volume resistivity of not less than 1×10¹. 4 Ω·cm.

[0180] The built-in liquid storage tank has a volume of 80mL. The nozzle array consists of four nozzles with an orifice diameter of 0.25mm, evenly distributed on the upper structure of the equipment. The spray direction is at an angle of 35° to 55° relative to the surface being cleaned, capable of covering internal terminals, wire connection points, and structural corners. The nozzles are positioned relative to the recovery channel, with a distance of approximately 40mm. The cleaning system is electrically isolated from the main control module and is triggered via an optocoupler control unit.

[0181] The cleaning cycle is 48 hours, and the system automatically detects the dust concentration and humidity inside the equipment. When the dust concentration exceeds 0.15 mg / m³ or the operating time exceeds the set cycle, a short-time cleaning program is automatically initiated. The spraying time is 0.4 seconds with a 0.8-second interval, for a total of 3 rounds, with a single total spraying time of less than 3 seconds. The negative pressure of the recovery system is 3.5 kPa, and the flow ratio Q_rec / Q_spray is maintained at 1.5. After cleaning, the system automatically enters the drying program, using the circulating airflow in the internal air ducts to complete the drying process. The drying duration is 60 seconds, and the system automatically resets and shuts down when the relative humidity drops below 25%.

[0182] Tests were conducted under continuous operating conditions, simulating an air temperature of 40℃, relative humidity of 60%, and dust concentration of 0.12 mg / m³ inside the control cabinet. After 30 days of operation, the average mass of residual dust on the surface of internal components decreased by 92%, while the insulation resistance remained at 1×10¹. 4 The system automatically performs 15 cleaning cycles over a 30-day period. After cleaning, the liquid transparency is consistently above 90%, and no liquid deposition or nozzle blockage is observed.

[0183] To compare and verify the differences between the built-in system and manual maintenance, identical models of equipment were selected and operated under the same environmental conditions for 30 days. One group used the automatic cleaning system of this invention, while the other group used manual wiping with the power off, with maintenance performed every 7 days. The test results are shown in Table 4.

[0184] Test Project Built-in system of this invention Manual power-off cleaning Explanation of differences Average residual dust content (mg / cm²) 0.038 0.121 The cleanliness of the built-in system is improved by about 3 times. Insulation resistance change rate (%) <2 <5 Built-in system has higher stability Cleaning cycle time (min / time) 1.8 30 Automatic maintenance saves a significant amount of time. Cleaning and re-deposition cycle (days) ≥10 4 The built-in system has a significant dust prevention and delay effect. System operating potential drift (mV) ±28 ±75 Operating with electricity is safer Number of interventions (times / month) 0 4 The built-in system requires no manual intervention. Cleaning solution reuse rate (%) 96 — Achieve closed-loop recycling

[0185] Test results show that the built-in cleaning system can automatically complete the entire process of spraying, recycling, and drying while the equipment is powered on, ensuring safe and reliable operation. Compared to manual maintenance, cleaning efficiency is significantly improved, insulation performance remains stable, and the equipment can perform periodic self-cleaning and protective maintenance without shutdown, significantly extending its service life.

[0186] Example 5:

[0187] For high-precision electrical equipment lacking a built-in spray module, an external docking-type atomizing flushing system is used for live cleaning. This system includes a portable main unit, liquid supply lines, a spray hood, a recovery assembly, and a filter regeneration unit. The main unit houses a liquid storage tank, a gas-liquid mixing module, and a negative pressure recovery pump. The spray hood is made of transparent polycarbonate material, with a pressure-resistant sealing ring on its outer edge, allowing for quick docking at the equipment's air inlet or maintenance window to create a locally sealed space. A nozzle array is mounted on the top of the hood, with a nozzle orifice diameter of 0.3mm. The spray direction is aimed at the area being cleaned, and the spray angle is 15°–45°.

[0188] The cleaning agent uses the formulation described in Example 2, with a volume resistivity of 1×10¹. 4Ω·cm. During spraying, the main unit activates the gas-liquid mixing module, mixing the cleaning agent and inert gas at a gas-liquid ratio of 2.0. The mixture is then atomized through the nozzle and sprayed out with an average particle size of 3μm. The spraying cycle is 0.5 seconds with a 2-second interval, for a total of 6 sprays, with a total operating time of 3 minutes. The recovery system operates at a negative pressure of 4.0 kPa, drawing in the gas-liquid mixture through the recovery port at the bottom of the hood. After cyclone separation and filtration by a MOF composite filter, the mixture is returned to the storage tank for recycling.

[0189] The sample consisted of the outer wall and terminal wiring area of ​​a communication cabinet. Surface contaminants included dust, oil film, and trace amounts of airborne sulfide compounds. The equipment was kept energized at 220V. After spraying, the mist inside the enclosure completely dissipated within 60 seconds, and the transparency of the recovered liquid remained at 95%. Tests showed that the surface dust residue rate after cleaning was less than 4%, the residual liquid volume was less than 0.1 μL / cm², and the insulation resistance change rate was less than 2%. No discharge occurred during the spraying process, and the equipment's operating potential drift range was within ±30mV.

[0190] To compare the efficiency difference between the external cleaning system and the traditional manual wiping method, a comparative test was conducted using the same model of communication cabinet. The ambient temperature was 25℃, the humidity was 60%, and the types and concentrations of contaminants were consistent. The results are shown in Table 5.

[0191] Test Project External docking system Manual wiping method Explanation of differences Cleaning time (min) 3 20 External system efficiency is improved by about 6 times Surface residual dust amount (mg / cm²) 0.041 0.115 Cleaning effectiveness improved by approximately 65%. Surface residual liquid volume (μL / cm²) 0.10 0.22 Drying is more thorough, preventing re-absorption of moisture. Insulation resistance change rate (%) <2 <5 More stable electrical performance Potential drift range (mV) ±30 ±65 Atomized spraying is safer to operate Cleaning fluid recovery rate (%) 98 — Solvents can be recycled Operator exposure concentration (mg / m³) <0.05 0.42 On-site safety has been significantly improved. Surface observation after cleaning No oil stains, no dust. Gray film still exists in some areas Visual cleanliness significantly improved

[0192] The results show that the external docking cleaning system of this invention can clean charged surfaces without altering the equipment structure. It offers fast cleaning speed, low dosage, and stable insulation performance, making it suitable for periodic on-site maintenance and protective upkeep of external equipment components. The system is highly portable and safe, and the equipment operating parameters show no abnormal fluctuations after cleaning. It can perform protective dust removal and decontamination operations without affecting normal operation.

[0193] Example 6:

[0194] To verify the stability and regeneration feasibility of the cleaning agent during multiple cycles, a regeneration test device was designed. This device includes a main cleaning system, an online detection unit, a regeneration filtration module, and an automatic replenishment system. The main system uses the cleaning agent formulation described in Example 1; the detection unit integrates an optical turbidity sensor, a conductivity sensor, and a density detection component; the regeneration module includes a primary mechanical filtration stage, a secondary MOF composite adsorption stage, and a tertiary molecular sieve dehumidification structure; the automatic replenishment system replenishes the basic solvent and auxiliary components from the storage tank via a micro-metering pump to maintain the compositional balance of the cleaning solution.

[0195] The cleaning agent, after being circulated and recycled, enters the filtration module, passing sequentially through a 5μm metal filter element, a MOF composite filter element, and a molecular sieve cylinder. The filtered cleaning solution is then returned to the main storage tank. After each cleaning cycle, the detection unit records changes in transparency, conductivity, and density. When transparency decreases by more than 10% or conductivity increases by more than 15%, the system automatically initiates a replenishment program. The replenishment system automatically adds Novec™ 7500 and a bio-based fluorinated surfactant according to a preset ratio to restore the physicochemical properties.

[0196] The test was conducted under 30 consecutive cleaning cycles, each lasting 3 minutes, with a spray pressure of 0.05 MPa and a recovery negative pressure of 3.8 kPa. The cleaning fluid volume was 5 L, and the total replenishment amount was approximately 2%. The results showed that after 10 cycles, transparency decreased by 3% and conductivity increased by 4%; after 30 cycles, transparency decreased by 8% and conductivity increased by 9%, neither of which reached the replenishment trigger threshold. The density remained stable within the range of 1.65 ± 0.03 g / cm³, indicating that the system performed stably under 30 cycles.

[0197] To further compare the performance differences between systems with and without a regeneration module, two parallel experiments were designed: Group A was a system with a regeneration module, and Group B was a conventional filtration system. The test conditions were identical, and the system was run continuously for 50 cycles. The results are shown in Table 6.

[0198] Test Project System with regeneration module (Group A) Non-regenerative module system (Group B) Explanation of differences Number of loops (times) 50 50 — Liquid transparency reduction rate (%) 9 26 Group A showed a significant reduction in turbidity. Rate of increase in conductivity (%) 10 34 Effective suppression of ion pollution Filter element pressure difference change (kPa) +0.5 +2.1 MOF delays clogging Replenishment volume percentage (%) 2.0 6.8 Consumption reduced by approximately 70% Oxidized particle residue rate (%) 4 17 Group A has superior adsorption performance. Light transmittance of the recovered liquid (%) 93 74 The regeneration system is more stable Insulation resistance (Ω·cm) <![CDATA[≥1.0×10¹ 4 ]]> <![CDATA[≥1.0×10¹ 4 ]]> All maintain high insulation Stable cleaning effect cycle (days) ≥45 20 Lifespan extended by more than 2 times

[0199] Experimental results show that the circulating regeneration and online replenishment system set up in this invention can effectively maintain the stability of the cleaning agent composition and its detergency, while reducing usage costs. The MOF composite adsorption layer has a significant capture effect on oxide particles and ionic pollutants, and the molecular sieve structure can remove trace amounts of moisture, ensuring long-term stability of the volume resistivity of the cleaning fluid. The automatic detection and replenishment module can restore the mixing ratio in real time during operation, avoiding frequent changes in the cleaning fluid. The entire system forms a closed-loop circulation path of "spraying—recovery—filtration—regeneration—replenishment," realizing long-term automatic maintenance of electrically operated equipment.

[0200] After 180 hours of continuous operation testing, the system operated stably with no leakage or breakdown. The cleaning effect was comparable to the first use, the surface cleanliness remained above 95% of the initial state, and the equipment insulation characteristics did not change significantly.

[0201] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A misting-type cleaning agent for high-precision electronic and electrical equipment, characterized in that, The cleaning agent comprises, by weight, the following components: 20-40 parts perfluorotripentylamine; 30-60 parts of one or a combination of Novec™ 7300 and Novec™ 7500; 1-5 parts of fluoroether auxiliary solvent (selected from HFE-347mcc or HFE-449sl); 2-5 parts of bio-based fluorosurfactant; 3-5 parts of metal-organic framework stabilizer (Hf-MOF and / or Zr-MOF); 0.1-0.3 parts of alkaline buffer system (lithium carbonate or its anhydrous salt); optionally, 0.5-1.0 parts of volatility control agent and 0.2-0.5 parts of fast drying accelerator; and 0.5-2.0 parts of detergency agent. The cleaning agent can be atomized to form droplets with a particle size D50 of 1-5 μm and a volume resistivity not less than [missing value]. Ω·cm, suitable for batch spraying and recovery cycles under energized conditions.

2. The atomized rinsing cleaning agent for high-precision electronic and electrical equipment according to claim 1, characterized in that: The detergency agent includes a type of polymeric dispersant used to enhance the ability of atomized particles to encapsulate and carry away pollutants; the dispersant can form an instantaneous elastic interface when droplets collide with pollutant particles, realizing the encapsulation, peeling and simultaneous recovery of particles, and improving the desorption and carrying efficiency of dirt particles.

3. The atomized rinsing cleaning agent for high-precision electronic and electrical equipment according to claim 1, characterized in that: The cleaning aid includes a type of surface modifier with anti-redeposition function; the surface modifier is used to enhance the suspension stability of particles in droplets and form a low adhesion energy hydrophobic protective film on the cleaned surface after cleaning to prevent the redeposition of dust and oily impurities.

4. The atomized rinsing cleaning agent for high-precision electronic and electrical equipment according to claim 1, characterized in that: The cleaning aid includes a type of microporous material with the function of adsorbing and complexing oxidizing dust; the material can remove oxidizing particles and polar particles through physical adsorption and weak chemical complexation, while maintaining the high insulation properties and atomization stability of the cleaning agent.

5. The application method of the atomized rinsing cleaning agent for high-precision electronic and electrical equipment according to any one of claims 1 to 4, characterized in that: The atomized spraying is carried out in batches using a pulse method: the single spraying time is 0.2 to 0.5 seconds, the interval time is 0.3 to 0.6 seconds, the spray distance is 25 to 45 mm, the mist opening angle is 15° to 45°, and the residual liquid on the surface is less than 0.1 μL / cm² within 20 to 30 seconds after spraying, so as to achieve electrostatic rinsing without liquid film residue.

6. A high-precision electronic and electrical equipment atomizing flushing type live-line cleaning system, characterized in that: The system uses the cleaning agent described in any one of claims 1 to 4 as the cleaning medium, and includes: a spraying module for atomizing the cleaning agent into droplets with a particle size D50 of 1 to 5 μm and spraying them in batches according to the parameters described in claim 5; a recovery module, coaxially arranged with the spraying module and forming a negative pressure backflow field, such that the ratio of the recovered amount to the sprayed amount is not less than 0.95; a filter regeneration module for separating particulate impurities and monitoring the concentration and volume resistivity of the recovered liquid, and automatically replenishing the liquid when it deviates from the set range; a liquid storage and supply module for switching the liquid supply between the basic formula and the formula containing additives; and a control module for automatically adjusting the spraying frequency and recovery flow rate according to the degree of pollution, temperature and humidity, and surface potential signals.

7. The atomizing flushing type live-line cleaning system for high-precision electronic and electrical equipment according to claim 6, characterized in that: The spraying module and the recovery module are integrated inside the equipment housing; the nozzle is fixed directly above the area to be cleaned, and the spraying direction is tilted at 30° to 60° relative to the normal direction of the equipment mounting surface; so that the spray mist can cover the corners of electronic components, heat dissipation ducts, terminal blocks and other areas prone to dust accumulation; the control module triggers automatic cleaning on a cycle of 24 to 72 hours, with a single spray volume not exceeding 0.2 mL, and synchronous recovery and drying are completed within 30 seconds after spraying.

8. The atomizing flushing type live-line cleaning system for high-precision electronic and electrical equipment according to claim 6, characterized in that: The main body of the system is an independent external device; it connects to the air outlet or maintenance port of electronic equipment through a sealed interface to form a closed-loop cleaning path; the nozzle is set at an external position corresponding to the part to be cleaned, located directly in front of or above the area to be cleaned. The spray direction is inclined at 30° to 60° relative to the normal of the equipment surface, and is used to directionally rinse dust-accumulated areas such as the inside and outside corners, heat dissipation gaps and terminal areas of electronic equipment. The recovery module is arranged in the downstream area of ​​the spray path and is connected to the filter regeneration module to realize the synchronous recovery of the mixture of droplets and dust. When the system is working, it forms a closed loop of spraying-rinsing-recovery-regeneration.

9. The atomizing flushing type live-line cleaning system for high-precision electronic and electrical equipment according to claim 1, characterized in that: The spraying module and the recovery module operate at a flow rate ratio / The proportional linkage is ≥1.4; the control module dynamically adjusts based on the negative pressure signal at the recovery end and the surface potential monitoring signal. When the potential drift of the surface being cleaned exceeds 50mV or the recovery negative pressure is lower than 2.5kPa, the spraying automatically stops and switches to enhanced recovery and gas dry blowing mode; the filter regeneration module is equipped with a microfluidic dripping unit, which drips alkaline buffer solution into the circulation loop at a rate of 0.05~0.2mL / s to maintain the cleaning agent in the weakly alkaline range of equivalent pH 7.5~8.5, and achieves real-time stable control of the cleaning agent components through dual detection of refractive index and resistivity.

10. A method for cleaning by electrostatic atomization, characterized in that, The cleaning agent described in any one of claims 1 to 4 is used, and the process is carried out in the system described in any one of claims 6 to 9. The process includes the following steps: Step 1: Select the appropriate cleaning agent from the basic formula or the formula containing additives A, B, and C according to the type of contamination and cleaning requirements of the electronic equipment; Step 2: The spraying module atomizes the cleaning agent into droplets with a particle size D50 of 1-5 μm, and sprays them intermittently according to the batch parameters of claim 5. The nozzle is positioned directly above or in front of the area to be cleaned, and the spraying direction is inclined at 30°-60° relative to the normal of the equipment surface to cover dust-accumulated areas such as the corners of electronic components and heat dissipation ducts; Step 3: The recovery module is started simultaneously to maintain a negative pressure of 2.5-6.0 kPa, so that the dust-laden droplets are recovered to the filter regeneration module with the airflow; Step 4: The filter regeneration module sequentially performs microfiltration and concentration and resistivity detection. When the detection value deviates from the preset range, the microfluidic dripping unit is automatically started to replenish the alkaline buffer solution to maintain the equivalent pH of the cleaning agent at 7.5-8.5; Step 5: Monitor the surface potential of the equipment in real time throughout the cleaning process. When the potential drift exceeds 50mV, automatically stop spraying and switch to dry-blowing recovery mode until the detected value returns to stability. Step 6: After the spraying, recovery, and regeneration cycle is completed, the residual liquid volume on the equipment surface is less than 0.1μL / cm², and the volume resistivity remains at no less than [value missing]. Ω·cm, thus achieving safe atomized cleaning without liquid film residue under charged conditions.