System and method for determining hole characteristics of hole

Abstract

The present disclosure relates to systems and methods for determining hole characteristics of a hole. A system for determining a hole characteristic of a hole includes a measurement tool and a controller. The measurement tool is configured to measure a hole and generate data representative of the hole. A controller is in communication with the measurement tool and is configured to determine at least one of the hole characteristics based on data from the measurement tool.

Description

Technical Field

[0001] This disclosure generally relates to manufacturing and inspection, and more specifically, to systems and methods for determining the characteristics of holes formed through manufactured parts. Background Technology

[0002] Parts manufactured from stacks of material layers such as composites, metals, or polymers are typically held together using fasteners that extend through aligned holes in the material layers. However, such stacks may exhibit misaligned holes, gaps in interface areas, or other inconsistencies. While these inconsistencies may be small, even small inconsistencies can exceed tolerances, depending on the intended application of the resulting part. For example, aerospace parts may have particularly stringent tolerances. Therefore, identifying and resolving such inconsistencies is desirable. Unfortunately, identifying such inconsistencies and determining the hole characteristics remains complex and time-consuming. Consequently, those skilled in the art continue research and development in the areas of inspection and analysis during the manufacturing and assembly of parts. Summary of the Invention

[0003] Examples of systems for determining the characteristics of holes, measuring tools for measuring holes, and methods for determining the characteristics of holes are disclosed. The following is a non-exhaustive list of examples based on the subject matter of this disclosure; these examples may or may not be claimed.

[0004] In the example, the disclosed system includes a measuring tool and a controller. The measuring tool is configured to measure a hole and generate data representing the hole. The controller communicates with the measuring tool and is configured to determine at least one of the hole characteristics based on the data from the measuring tool.

[0005] In another example, the disclosed measuring tool includes a housing, a chuck, an optical probe, a linear actuator, and a rotary actuator. The chuck is coupled to the housing and configured to engage with a bore. The optical probe is configured to extend through the chuck and into the bore, scanning the walls of the bore and generating data representing the walls of the bore. The linear actuator positions the optical probe along the scanning axis. The rotary actuator positions the optical probe about the scanning axis.

[0006] In the example, the disclosed method includes the following steps: (1) extending an optical probe into a hole along a scanning axis; (2) rotating the optical probe about the scanning axis within the hole; (3) scanning the walls of the hole; (4) generating data representing the walls of the hole; and (5) determining at least one of a plurality of hole characteristics based on the data.

[0007] Other examples of systems, measuring tools, and methods will become apparent from the following detailed description, accompanying drawings, and appended claims. Attached Figure Description

[0008] Figure 1 This is a schematic block diagram of an example system for determining the pore characteristics of a hole;

[0009] Figure 2 This is a flowchart illustrating an example of a method for determining the pore characteristics of a hole;

[0010] Figure 3 This is a schematic diagram illustrating an example of the system;

[0011] Figure 4 This is a schematic diagram illustrating an example of the system's measurement tools;

[0012] Figure 5 This is a schematic diagram of an example of a probe driver for a measuring tool in a retracted state;

[0013] Figure 6 This is a schematic diagram of an example of a probe driver for a measuring tool in an extended state;

[0014] Figure 7 This is a schematic diagram of an example of a probe driver;

[0015] Figure 8 This is a schematic diagram of an example of a probe driver;

[0016] Figure 9 A schematic exploded perspective view of an example of a measuring tool;

[0017] Figure 10 A schematic cross-sectional view of an example of a measuring tool;

[0018] Figure 11 This is a schematic diagram of an example of a measuring tool that interacts with a hole;

[0019] Figure 12 This is a schematic diagram illustrating an example of multiple interchangeable chucks for a measuring tool;

[0020] Figure 13 This is a schematic diagram illustrating an example of the system;

[0021] Figure 14 It is a point cloud map generated based on data collected by the system;

[0022] Figure 15 This is a schematic diagram illustrating an example of a hole with a gap at the interface;

[0023] Figure 16 This is a schematic diagram of an example of an offset hole;

[0024] Figure 17 This is a schematic diagram illustrating an example of a hole with fragments at the interface;

[0025] Figure 18 This is a schematic diagram of an example of a hole with sealant at the interface;

[0026] Figure 19 This is a schematic diagram illustrating an example of a hole with fragments at the interface;

[0027] Figure 20 This is a flowchart of an example of the dynamic origin method;

[0028] Figure 21 This is a flowchart illustrating an example of a coordinate solving method;

[0029] Figure 22 This is a schematic diagram illustrating an example of an airplane; and

[0030] Figure 23 This is a flowchart illustrating an example of aircraft manufacturing and maintenance methods. Detailed Implementation

[0031] refer to Figures 1 to 21 As an example, this disclosure relates to a system 100, a measuring tool 102, and a method 1000 for determining hole characteristics 200 of a hole 300 formed through a part 310. Part 310 typically comprises a stack of material. As will be described in more detail herein, examples of the system 100, measuring tool 102, and method 1000 utilize an insertable probe that measures the surface of the wall 302 of the hole 300 to determine various hole characteristics 200 of the hole 300. The techniques provided by the system 100, measuring tool 102, and method 1000 enable the reliable and automated determination and identification of inconsistencies in the hole characteristics 200 of the hole 300 in a significantly shorter time than manual measurement and inspection systems and methods. In one or more examples, the techniques provided by the system 100, measuring tool 102, and method 1000 enable compensation for the effects of environmental conditions 252 on hole measurements.

[0032] Figure 1 An example of a manufacturing environment 250 is schematically shown, in which system 100, measuring tool 102 and method 1000 are implemented to determine one or more of the hole characteristics 200 of the hole 300 formed through part 310. Figure 11 An example of part 310 and the interaction between measuring tool 102 and hole 300 are illustrated schematically. Figures 15 to 19Various examples of part 310 are schematically shown, depicting holes 300, wherein various examples of hole features 200 are identified using system 100, measuring tool 102, and / or according to method 1000. Part 310 includes multiple components assembled and joined together using mechanical fasteners (e.g., bolts, rivets, etc.) (fasteners not shown) installed through holes 300. In the illustrative example, part 310 includes a first component 312 and a second component 314 arranged (e.g., stacked) and fastened together. The first component 312 includes at least one first hole 304 having a first wall 316. The second component 314 includes at least one second hole 306 having a second wall 318. The first hole 304 and the second hole 306 are aligned to form hole 300 (e.g., the first hole 304 and the second hole 306 combine to form hole 300, and the first wall 316 and the second wall 318 combine to form wall 302). Although the example of part 310 is shown to include two components, in other examples, part 310 may include any feasible number of components, each having a hole aligned with a hole in an immediately adjacent component. The various parts described herein may be manufactured from composite material components, metal components, polymer components, or combinations thereof.

[0033] In the various examples disclosed herein, the measurement and characterization of hole 300 can be a hole in a single component, a hole in two components (e.g., a stack) (e.g., formed by two aligned holes), or holes in any number of two or more components (e.g., a stack) (formed by any number of two or more aligned holes). As an example, system 100 and method 1000 can be used to measure and characterize holes 300 in a main joint having more than two material layers.

[0034] Now for reference Figure 1 and Figures 3 to 19 The following is an example of system 100 according to this disclosure. Examples of system 100 include a plurality of elements, features, and components. All elements, features, and / or components described or shown in one example are not required in that example. Some or all of the elements, features, and / or components described or shown in one example may be combined in various ways with other examples without needing to include other elements, features, and / or components described in those other examples, even if one or more such combinations are not explicitly described or shown herein by example.

[0035] like Figure 1 , Figures 3 to 7 and Figure 13As shown, in one or more examples, system 100 includes a measuring tool 102 and a controller 104. The measuring tool 102 is configured to measure a hole 300 and generate data 110 representing the hole 300 (more specifically, the wall 302 of the hole 300). The controller 104 communicates with the measuring tool 102. The controller 104 is configured to determine at least one of hole characteristics 200 based on the data 110 from the measuring tool 102. System 100 is operable to measure and inspect the hole 300 in part 310 and determine the hole characteristics 200 of the hole 300. In one or more examples, system 100 is operable to compensate for the effects of various environmental conditions 252. The controller 104 is configured (e.g., adapted or programmed) to execute method 1000 (… Figure 2 , Figure 20 and Figure 21 The data processing and analysis steps correspond to various operational functions.

[0036] like Figure 1 , Figure 3 , Figure 4 and Figure 13 As shown, in one or more examples, the measuring tool 102 includes an optical probe 114 and a probe driver 116. The optical probe 114 is configured to be positioned within an aperture 300. The optical probe 114 is configured to scan the wall 302 of the aperture 300 (more specifically, the first wall 316 of the first aperture 304 and the second wall 318 of the second aperture 306). The optical probe 114 is configured to generate data 110 representing the aperture 300 (e.g., at least a portion of the wall 302 of the aperture 300). The probe driver 116 is configured to cause the optical probe 114 to translate and rotate within the aperture 300. In these examples, the simultaneous linear and rotational movement of the optical probe 114 caused by the probe driver 116 facilitates scanning any portion or the entire aperture 300 during a single extension and retraction stroke of the optical probe 114, thereby reducing measurement cycle time. Multiple extension and retraction strokes of the optical probe 114 provide increased measurement data, thereby increasing accuracy.

[0037] like Figure 1 , Figure 4 and Figure 7As shown, in one or more examples, the probe driver 116 includes a linear driver 132 and a rotary driver 134. The linear driver 132 positions the optical probe 114 along a scan axis 130. The rotary driver 134 positions the optical probe 114 about the scan axis 130. As an example, the linear driver 132 extends the optical probe 114 into an aperture 300, and the rotary driver 134 rotates the optical probe 114 within the aperture 300 to measure the wall 302 of the aperture 300. Rotating the optical probe 114 while adjusting its depth-direction position within the aperture 300 enables a 360-degree scan of the wall 302 of the aperture 300 during a single stroke of the optical probe 114 (e.g., extension and retraction). In one or more examples, the probe driver 116 is configured to adjust the depth-direction position of the optical probe 114 (e.g., along the depth or length of the aperture 300). During the measurement of the aperture 300, the wall 302 of the aperture 300 is measured at each of a plurality of depth positions.

[0038] like Figure 1 As shown, in one or more examples, the optical probe 114 includes or takes the form of a laser interferometer 120. In one or more examples, the optical probe 114 includes a fiber optic probe for low coherence interferometry (LCI). In one or more examples, the optical probe 114 is configured to emit light energy and direct it to the wall 302 of the aperture 300. In one or more examples, as the optical probe 114 extends and / or retracts within the aperture 300 via a linear actuator 132 and rotates within the aperture 300 via a rotary actuator 134, the optical probe 114 performs a scanning operation (e.g., an LCI scan) on the wall 302 of the aperture 300 to obtain data 110 representing the wall 302 of the aperture 300. In one or more examples, the optical probe 114 serves as a conduit (such as a fiber optic line) for light energy, and the light energy (e.g., via one or more of the umbilical cables 106) enters and exits the controller 104 for measurement and analysis by the controller 104.

[0039] like Figure 1 , Figure 3 and Figure 13As shown, in one or more examples, controller 104 receives data 110 from optical probe 114. In one or more examples, data 110 is stored in memory 194. Data 110 is used by controller 104 to generate a three-dimensional point cloud 150 (e.g., a digital 3D model) representing hole 300. In one or more examples, controller 104 is configured to determine various features and / or parameters of hole 300 and / or wall 302 based on data 110, which are referred to herein as hole characteristics 200. In one or more examples, controller 104 includes processor 192, memory 194, and program code 196 stored on memory 194. In one or more examples, controller 104 is implemented as custom circuitry, a hardware processor executing programming instructions stored in memory, or some combination thereof.

[0040] like Figure 1 and Figure 14 As shown, in one or more examples, controller 104 is configured, adapted, or programmed to generate a three-dimensional point cloud 150 based on data 110 provided by measuring tool 102. The three-dimensional point cloud 150 includes XYZ coordinates 152 and reflection intensity 154 of at least a portion of the wall 302 of hole 300. In one or more examples, controller 104 is configured, adapted, or programmed to process and analyze the three-dimensional point cloud 150 to determine one or more of hole characteristics 200. In one or more examples, the three-dimensional point cloud 150 includes XYZ coordinates 152 and reflection intensity 154 of the chuck 118 positioned in at least a portion of hole 300. In these examples, controller 104 is configured, adapted, or programmed to perform a transformation of the three-dimensional point cloud 150 with a known geometry (e.g., model 156) of chuck 118. Controller 104 is configured, adapted, or programmed to then determine at least one of the hole characteristics 200 based on the three-dimensional point cloud 150 fitted to model 156 of chuck 118.

[0041] Figure 14 An example of a three-dimensional point cloud 150 generated by controller 104 using data 110 provided by measuring tool 102 (e.g., optical probe 114) is shown. In one or more examples, the three-dimensional point cloud 150 includes multiple data points, each including XYZ coordinates 152 and a reflection intensity 154 representing a point on wall 302. In the illustrated example, the three-dimensional point cloud 150 represents a first hole 304 of first component 312, a second hole 306 of second component 314, and an interface 320 between first component 312 and second component 314. The data points of the three-dimensional point cloud 150 are processed and analyzed by controller 104 to determine various hole characteristics 200. In one or more examples, the three-dimensional point cloud 150 also includes data points, each including XYZ coordinates 152 and a reflection intensity 154 representing a point on the inner surface of chuck 118.

[0042] like Figure 1 and Figure 3 As shown, in one or more examples, system 100 includes a user interface 108. The user interface 108 communicates with controller 104 (e.g., wirelessly or wired). The user interface 108 is configured to visually display at least one of the hole characteristics 200. In one or more examples, controller 104 is configured to generate a report based on analysis of data 110 and / or a 3D point cloud 150. This report indicates various hole characteristics 200 and is displayed to an operator using the user interface 108. In one or more examples, the user interface 108 displays a visual representation of the hole 300 (e.g., ...). Figure 14 The three-dimensional point cloud shown is 150.

[0043] like Figure 1 and Figures 4 to 8 As shown, in one or more examples, the linear drive 132 includes at least one of a motor 142, a gearbox 144, a pair of limit switches 146, and an encoder 148. The gearbox 144 transmits motion from the motor 142 to the optical probe 114. The pair of limit switches 146 limit the linear movement of the optical probe 114 along the scanning axis 130. The encoder 148 measures the linear position of the optical probe 114 along the scanning axis 130.

[0044] like Figures 5 to 8 As shown, in one or more examples, motor 142 includes a direct current (DC) motor, a linear actuator, or other means configured to drive optical probe 114 from measuring tool 102 into bore 300 of part 310 and position optical probe 114 along scan axis 130. In one or more examples, during inspection of bore 300, optical probe 114 extends outward through the cylinder of housing 112 and through chuck 118. Transmission 144 is coupled to motor 142, for example, via a flexible coupling. In one or more examples, transmission 144 includes a worm gear drive, lead screw, or other mechanism configured to transmit motion from motor 142 to optical probe 114. In one or more examples, rotary drive 134 is coupled to linear drive 132, for example, via a linear track and carriage. In these examples, linear drive 132 is configured to cause rotary drive 134 to move linearly (e.g., translate) along scan axis 130 (e.g., as shown). Figure 5 and Figure 6 (As shown). In one or more examples, the optical probe 114 is coupled to the rotary driver 134. In one or more examples, the rotary driver 134 is configured to rotate the optical probe 114 about the scanning axis 130 (e.g., as shown). Figure 6(As shown). In one or more examples, the rotary actuator 134 and the optical probe 114 are integrated into a single functional component, such as a rotary probe commercially available from Novacam Technologies Inc., Quebec, Canada. In one or more examples, the limit switch 146 is a magnetic proximity switch that detects the linear position of the optical probe 114 or the linear actuator 132. In one or more examples, the limit switch 146 provides a signal to the controller 104 indicating that the linear actuator 132 or the optical probe 114 has reached its extension or retraction limit. In one or more examples, the encoder 148 includes or takes the form of a magnetic encoder (e.g., a Renishaw magnetic encoder) that detects changes in the magnetic field of the grating to determine the position and movement of the optical probe 114.

[0045] like Figure 1 , Figure 4 and Figures 9 to 11 As shown, in one or more examples, the measuring tool 102 includes a housing 112. In one or more examples, the measuring tool 102 takes the form of a hand tool configured for operation by a technician. In one or more examples, the housing 112 includes a cylinder and a handle. In one or more examples, the measuring tool 102 includes a chuck 118. The chuck 118 is coupled to the housing 112. The chuck 118 is configured to selectively engage and disengage a portion of the bore 300. During the scanning of the bore 300 using the measuring tool 102, an optical probe 114 extends through the chuck 118. In one or more examples, when the chuck 118 is inserted into the bore 300, the chuck 118 is configured to expand radially to engage with the wall 302 of the bore 300. The radial expansion of the chuck 118 holds the measuring tool 102 in a fixed position within the bore 300 while the optical probe 114 extends into and retracts from the bore 300 to scan the wall 302 of the bore 300. The radial contraction of the chuck 118 releases the measuring tool 102 from the hole 300.

[0046] In other examples, the measuring tool 102 is integrated into the end effector of a fully automated or partially automated robot (e.g., a collaborative robot). In these examples, the measuring tool 102 includes essentially the same operating components as described and illustrated herein.

[0047] like Figure 4As shown, in one or more examples, the measuring tool 102 includes a trigger 172 located on a handle of the housing 112. The trigger 172 enables actuation and control of the measuring tool 102, such as controlling the optical probe 114, probe driver 116, and chuck 118. In one or more examples, the trigger 172 includes two or more triggers or switches controlling various operating parts, features, or functions of the measuring tool 102. In one or more examples, the measuring tool 102 includes one or more ports 174 configured to connect to the umbilical cable 106. In one or more examples, pressing the trigger 172 (e.g., a first trigger or switch) is configured to actuate or activate an actuator 126, which extends the spindle 124 and expands the chuck 118 within the bore 300. This causes the chuck 118 to clamp the bore 300. In one or more examples, the spindle 124 is biased in a retracted position, for example, by an internal spring. In these examples, releasing the trigger 172 enables the spindle 124 to return to the retracted position and retract the chuck 118. In one or more examples, a press trigger 172 (e.g., a second trigger or switch) is configured to actuate a probe driver 116 to extend an optical probe 114 into the aperture 300, causing the optical probe 114 to rotate within the aperture 300 and emit light energy to scan the wall 302 of the aperture 300.

[0048] like Figure 1 , Figure 9 and Figure 10As shown, in one or more examples, the measuring tool 102 includes at least one of a sleeve 122, a spindle 124, and an actuator 126. The sleeve 122 engages a chuck 118 to a housing 112. In one or more examples, the sleeve 122 provides a threaded connection to the housing 112 of the measuring tool 102. In one or more examples, the sleeve 122 includes a hollow tubular body. When the sleeve 122 is engaged to the housing 112, the sleeve 122 is configured to clamp and secure the chuck 118 to the housing 112 within the tubular body of the sleeve 122. The spindle 124 is linearly movable (e.g., configured to move) relative to the chuck 118 to expand the chuck 118. The actuator 126 positions the spindle 124 relative to the chuck 118. In these examples, the extension of the mandrel 124 causes the chuck 118 to expand radially (e.g., increase the diameter of the chuck 118), and the retraction of the mandrel 124 causes the chuck 118 to contract radially (e.g., return the chuck 118 to an unexpanded state). In one or more examples, the actuator 126 includes an actuator housing coupled to the housing 112 of the measuring tool 102. In one or more examples, the actuator 126 includes a piston (e.g., a pneumatic piston) disposed within the actuator housing. In these examples, the mandrel 124 is coupled to the piston. In one or more examples, the actuator 126 also includes a spring and a spring-preloaded locking nut that transmits motion from the piston to the extension of the mandrel 124 for the radial expansion of the chuck 118 and biases (e.g., automatically returns) the mandrel 124 back to the retracted position for the radial contraction of the chuck 118.

[0049] like Figure 11 As shown, in one or more examples, during operation of the measuring tool 102 for measuring the hole 300, a portion of the chuck 118 is inserted into the hole 300. In one or more examples, the sleeve 122 is configured to contact the surface of the first component 312 surrounding the hole 300.

[0050] like Figure 9 and Figure 12 As shown, in one or more examples, the chuck 118 includes a body 136 and a slot 138 extending along a portion of the length of the body 136. The body 136 is tubular and tapered. The slot 138 allows the tubular body 136 to expand as the mandrel 124 moves into the tapered portion of the body 136. In one or more examples, the measuring tool 102 includes a plurality of chucks 128. Each chuck 128 is configured to be interchangeably coupled to the housing 112. In one or more examples, each of the chucks 128 includes a different geometry or contraction diameter corresponding to a hole 300 with a different diameter.

[0051] like Figure 3 and Figure 13As shown, in one or more examples, the measuring tool 102 is coupled to and communicates with the controller 104 via multiple umbilical cables 106. In one or more examples, the controller 104 includes or takes the form of a cart 162, which is coupled to the measuring tool 102 via the umbilical cables 106. In these examples, the system 100 includes one or more of a pressure system, an electrical system, and / or a communication system housed within the cart and controlled by the controller 104. Thus, in these examples, power, pressure (e.g., pneumatic), and commands (e.g., instructions) are transmitted to the measuring tool 102 via the umbilical cables 106. In other examples, wireless communication technologies (such as protocols for wireless networking or Bluetooth communication) may be implemented to facilitate communication between the measuring tool 102 and the controller 104.

[0052] like Figure 13 As shown, in one or more examples, connecting the measuring tool 102 to the cart 162 via the umbilical cable 106 advantageously reduces the size of the measuring tool 102 and makes other functional components of the system 100 (such as the server 164) more accessible. Figure 14 The controller 104 can be integrated into the cart 162 via a pressure system (e.g., via compressed air line 166), a power supply (e.g., via power line 168), and / or other components. In one or more examples, the controller 104 receives power via power line 168. In one or more examples, the controller 104 is connected to a pressurized air source (e.g., a workshop air source) under pneumatic pressure via compressed air line 166. In one or more examples, the umbilical cable 106 includes a compressed air line 166 providing pneumatic pressure, a power line 168 providing power, and one or more data lines 188 providing input and output (I / O) commands and / or data exchange with the programmable logic controller 182. In one or more examples, the umbilical cable 106 includes an optical fiber line 186 transmitting optical energy between the interferometer 184 and the measuring tool 102 (e.g., an optical probe 114). In one or more examples, the umbilical cable 106 includes a data line 188 transmitting scale data between the interferometer 184 and the measuring tool 102 (e.g., an encoder 148). In one or more examples, the umbilical cable 106 includes a data line 188 that transmits rotation control between the rotation controller 176 and the measuring tool 102 (e.g., the rotation driver 134).

[0053] In one or more examples, controller 104 includes a data processing system (e.g., a computer), which may take the form of server 164 or other suitable computing device. In one or more examples, controller 104 includes a display (e.g., a screen, touchscreen, etc.). In other examples, user interface 108 takes the form of a tablet computer or other mobile device including a display. In one or more examples, server 164 processes input (e.g., data 110) from interferometer 184 via data lines to determine measurement results and correlate the measurement results with data received from programmable logic controller 182 via data lines.

[0054] like Figure 1 and Figures 15 to 19 As shown, in one or more examples, one or more of the hole characteristics 200 are determined based on data 110 representing the hole 300 (e.g., a 3D point cloud 150). In one or more examples, the hole characteristics 200 include at least one of the following: the diameter 204 of the hole 300; the offset 206 of the hole 300; the gap 322 at the interface 320 of the hole 300; the length 208 (e.g., depth) of the hole 300; the straightness 212 of the hole 300 (e.g., based on the center hole angle); the orientation 214 of the hole 300 (e.g., based on the center hole angle); the smoothness 216 of the hole 300; the fragmentation 326 at the interface 320 of the hole 300; and the sealant 324 at the interface 320 of the hole 300. In other examples, the hole characteristics 200 also include at least one of the following: the diameter of a countersunk hole located at one end of the hole 300; the center hole angle (e.g., straightness) of the countersunk hole; and the depth (e.g., length) of the countersunk hole (e.g., at the inlet or outlet layer of the part 310).

[0055] In one or more examples, an optical probe 114 is inserted into the aperture 300 and moves linearly along and rotates about the scanning axis 130 to scan or otherwise measure the wall 302 of the aperture 300 at multiple depth locations. In one or more examples, the optical probe 114 measures a distance (e.g., a distance to the wall 302 of the aperture 300 and / or a distance to the inner surface of the chuck 118) at each of the multiple depth locations. In one or more examples, the distance is expressed as XYZ coordinates 152 (e.g., points on the wall 302 of the aperture 300 and / or the inner surface of the chuck 118). In one or more examples, the optical probe 114 also measures the reflection intensity 154 at each of the multiple depth locations (e.g., points on the wall 302 of the aperture 300 and / or the inner surface of the chuck 118).

[0056] Figure 15An example of part 310 is schematically shown, wherein a gap 322 exists at the interface 320 between the first part 312 and the second part 314 (e.g., at the interface between the first hole 304 and the second hole 306). As used herein, a gap at an interface (interface gap) includes any empty space at the interface between two or more parts of a part. Depending on part 310, the gap 322 may not be present at the interface 320 (e.g., an interference gap). In one or more examples, the thickness of the gap 322 is uniform or tapered within the hole 300. In one or more examples, when one of the depth positions of the gap 322 is reached, the measurement results from the optical probe 114 will deviate from the measurement results obtained at other depth positions of the wall 302 of the hole 300.

[0057] Figure 16 An example of part 310 is schematically shown, wherein offset 206 exists between the first hole 304 and the second hole 306 (e.g., between the first central hole axis of the first hole 304 and the second central hole axis of the second hole 306). As used herein, offset includes any non-coaxial relationship or any non-coincidence between the first central hole axis of the first hole 304 and the second central hole axis of the second hole 306, or includes situations where, when viewed along the hole axis of the hole 300, the interface surface of one of the components extends beyond the boundary of the wall 302 of the hole 300. Depending on part 310, offset 206 may not be present between the holes forming the hole 300. In one or more examples, a deviation of measurements from the optical probe 114 at one or more depth locations of the wall 302 of the hole 300 from measurements acquired at other depth locations of the wall 302 of the hole 300 may indicate the presence of offset 206.

[0058] Figure 17 and 19 An example of part 310 is schematically shown, wherein debris 326 (e.g., foreign object debris, FOD) is present in interface 320 of hole 300. Depending on part 310, debris 326 may not be present at interface 320. In one or more examples, thresholding can be performed on the measurement results to infer the presence of debris 326. If the measurement results exceed the threshold, this can indicate the presence of debris 326. These operations can be performed based on a comparison between actual and expected measurement results from optical probe 114. Examples of debris 326 may include burrs at interface 320 (e.g., Figure 17 ), and the chips trapped at interface 320 (e.g., Figure 19 (or other FODs at interface 320.)

[0059] Figure 18An example of part 310 is schematically shown, wherein sealant 324 is present at interface 320 of hole 300. Depending on part 310, sealant 324 may not be present at interface 320. In one or more examples, the measurement results may be thresholded to infer the presence of sealant 324. If the measurement results exceed the threshold, this can indicate the presence of sealant 324. These operations may be performed based on a comparison between actual and expected measurement results from optical probe 114. An example of sealant 324 is a bonding sealant applied between the mating surfaces of components of part 310. In some cases, a portion of sealant 324 may not reach hole 300. In other cases, a portion of sealant 324 may be squeezed into hole 300.

[0060] Now for reference Figure 1 and Figures 3 to 19 By way of example, this disclosure also relates to a measuring tool 102 for measuring a hole 300. The following are examples of the measuring tool 102 according to this disclosure. In one or more examples, the measuring tool 102 is used with system 100 (… Figure 1 , Figure 3 and Figure 13 The measuring tool 102 is part of the system 100, or is part of the system 100. Examples of the measuring tool 102 include multiple elements, steps, operations, or processes. All elements, steps, operations, or processes described or shown in one example are not required in that example. Some or all of the elements, steps, operations, or processes described or shown in one example may be combined with other examples in various ways without needing to include other elements, steps, operations, or processes described in those other examples, even if one or more such combinations are not explicitly described or shown by example herein.

[0061] like Figure 1 and Figures 3 to 13As shown, in one or more examples, the measuring tool 102 includes a housing 112, a chuck 118, an optical probe 114, a linear actuator 132, and a rotary actuator 134. The chuck 118 is coupled to the housing 112 and configured to engage a portion of an aperture 300. The optical probe 114 is configured to extend through the chuck 118 and into the aperture 300. The optical probe 114 is configured to scan the wall 302 of the aperture 300. The optical probe 114 is configured to generate data 110 representing the wall 302 of the aperture 300. The linear actuator 132 positions the optical probe 114 along a scanning axis 130. The rotary actuator 134 positions the optical probe 114 about the scanning axis 130. In one or more examples, the measuring tool 102 includes one or more of the following: actuator 126, spindle 124, sleeve 122, trigger 172, port 174, motor 142, gearbox 144, limit switch 146, encoder 148, and any other functional components, elements, or features as described herein and shown in reference system 100.

[0062] Now for reference Figure 2 By way of example, this disclosure further relates to a method 1000 for determining the hole characteristics 200 of a hole 300. The following are examples of the method 1000 according to this disclosure. In one or more examples, system 100 and / or measuring tool 102 are used ( Figure 1 Method 1000 is implemented by [example of method]. Examples of method 1000 include multiple elements, steps, operations, or procedures. All elements, steps, operations, or procedures described or shown in one example are not required in that example. Some or all of the elements, steps, operations, or procedures described or shown in one example may be combined with other examples in various ways without needing to include other elements, steps, operations, or procedures described in those other examples, even if one or more such combinations are not explicitly described or shown in the examples herein.

[0063] In one or more examples, method 1000 includes the step of positioning a portion 1002 of a chuck 118 within a hole 300. In one or more examples, method 1000 includes the step of expanding 1004 the chuck 118. In one or more examples, method 1000 includes the step of engaging 1006 the wall 302 of the hole 300 with the chuck 118. In one or more examples, the method includes the step of extending 114 of an optical probe 114 into and / or retracting 1008 from the hole 300 along a scanning axis 130. Method 1000 includes the step of rotating 1010 the optical probe 114 within the hole 300 about the scanning axis 130. In one or more examples, depending on the portion of the wall 302 of the hole 300 to be measured and / or the amount to be measured, the steps of extending and / or retracting 1008 and rotating 1010 are performed simultaneously, sequentially, or intermittently. In one or more examples, method 1000 includes the step of scanning 1012 the wall 302 of the hole 300. In one or more examples, method 1000 includes the step of scanning a portion of chuck 118 disposed within hole 300, 1014. In one or more examples, the step of scanning 1014 includes performing laser interferometry. In one or more examples, method 1000 includes the step of generating 1016 data 110. In one or more examples, data 110 includes data representing the wall 302 of hole 300. In one or more examples, data 110 includes data representing the inner surface of chuck 118. In one or more examples, method 1000 includes the step of filtering portions of 1018 data 110 to remove outlier data points or noise. In one or more examples, method 1000 includes the step of processing 1020 data 110. In one or more examples, the step of processing 1020 data 110 includes generating a three-dimensional point cloud 150. In one or more examples, method 1000 includes the step of processing hole 300, 1022, using data 110. In these examples, data 110 is used to generate a three-dimensional point cloud 150, which includes the XYZ coordinates 152 and reflection intensity 154 of the wall 302 of the hole 300. In one or more examples, method 1000 includes the step of processing the chuck 118 using data 110. In these examples, data 110 is used to generate a three-dimensional point cloud 150, which includes the XYZ coordinates 152 and reflection intensity 154 of the inner surface of the chuck 118. In one or more examples, method 1000 includes the step of compensating for an environment 1026 (e.g., environmental condition 252). In these examples, the three-dimensional point cloud 150 is transformed or otherwise modified using a known geometry of the chuck 118 (e.g., model 156). In one or more examples, method 1000 includes the step of determining at least one of the hole characteristics 200 1028 based on data 110.

[0064] In one or more examples, according to method 1000, the step of determining 1028 includes determining at least one of the following: diameter 204 of hole 300, offset 206 of hole 300, gap 322 at interface 320 of hole 300, length 208 of hole 300, straightness of hole 212, orientation of hole 214, smoothness of hole 300, debris 326 at interface 320, and sealant 324 at interface 320.

[0065] In one or more examples, the step of compensating for environmental conditions 252 (1026) includes taking the measuring diameter of the chuck 118 and subtracting its known diameter to obtain a diameter offset. This diameter offset is subtracted from the measuring diameter of the hole 300 (as determined by method 1000). In these examples, the resulting diameter is used as the compensated diameter of the hole 300. In some cases, various environmental conditions such as temperature, humidity, atmospheric pressure, etc., can affect the measurement results (e.g., data) of the optical probe 114. This compensation step takes into account environmental variations and essentially zeroes out the measurement results using the chuck 118 each time the system 100 is used to measure the hole.

[0066] In one or more examples, according to method 1000, the steps of processing 1020 data 110, such as processing step 1022 and / or processing 1024 chuck 118, include the step of performing a dynamic origin operation and the step of further performing a coordinate solving operation.

[0067] In one or more examples, the testing method includes capturing a 3D point cloud 150 (including multi-layered stacked XYZ coordinates 152 and reflection intensity 154) to determine a lateral mismatch (e.g., offset 206) between the center of the first hole 304 and the center of the second hole 306. In one or more examples, the diameter 204 of the hole 300 is determined. In one or more examples, the presence of a gap 322 is determined. In one or more examples, method 1000 utilizes a dynamic origin method 2000 and a coordinate solving method 3000. In one or more examples, the dynamic origin method 2000 is implemented using an algorithm embodied by a dynamic origin module 362 stored in memory 194 and executed by a processor 192 of controller 104. In one or more examples, the coordinate solving method 3000 is implemented using an algorithm embodied by a coordinate solver module 364 stored in memory 194 and executed by a processor 192 of controller 104.

[0068] Typically, the Dynamic Starting Origin Method 2000 is used to find coarse estimates of the first (e.g., top) and second (e.g., bottom) layers of cylinders representing the first hole 304 and the second hole 306. After finding this coarse estimate, the coordinate solving method 3000 is used to determine the best-fit cylinder for a given 3D point cloud 150. The Dynamic Starting Origin Method 2000 is important because significant artifacts exist in the point cloud. These artifacts, namely the radially expanding clamp 118, provide relatively strong features that interfere with the features of the hole 300. This allows the artifacts to be preserved without affecting the result processing. Furthermore, finding the interface, diameter, and coarse X / Y origin for each layer significantly reduces the time required for the coordinate solver to function, thereby significantly reducing processing time. The Dynamic Starting Origin Method 2000 divides the cylinder into several segments. These segments create smaller cylinders, and average X, Y, Z, radius, and intensity values ​​are found for each segment. A portion of the lower part of the scan, which is the area where the clamp 118 is located, can be ignored. The segment with the lowest average strength value is identified as the location of interface 320. These segments are organized above and below the interface. The average X / Y position is used as the default origin for the top and bottom layers. The median radius of the cylinder is used as the radius for the top and bottom layers. In one or more examples, the angular orientation (e.g., angle A and angle B) of the hole center axes of the cylinder (e.g., first hole 304 and second hole 306) defaults to 0 degrees. The results from the Dynamic Starting Origin Method 2000 include the X / Y origin, interface height, radius, and angle A / B. The results are then sent to the coordinate solver.

[0069] In one or more examples, the coordinate solver 3000 takes an initial origin value (e.g., from the result of the dynamic initial origin method 2000) and searches for a range of possible values ​​for the optimal cylinder fitting function. The cylinder fitting function is designed so that the more points passing through a given cylinder, the better the score it will report. The coordinate solver operates by creating a group of potential cylinder candidates that are identical except for one parameter that differs for each cylinder. The solver uses a fitness function to determine which of these candidates is optimal and selects the optimal parameter, covering the initial origin value for the cylinder. The coordinate solver 3000 moves to the next parameter and repeats the process. Once all parameters have been changed, the coordinate solver 3000 checks if the result has converged. If not, the coordinate solver 3000 repeats the process, changing the parameters by different amounts. Once the solution converges, the mismatch and diameter of the result are reported.

[0070] In one or more examples, the results are displayed on user interface 108, and the operator can select scan details to view the point cloud and the found cylinder. In one or more examples, the scan (e.g., 3D point cloud 150) has two distinct views: distance (e.g., XYZ coordinates 152) and intensity (e.g., reflection intensity 154). The distance view shows how far each point is from the generated cylinder. The intensity view shows the intensity of each point.

[0071] Figure 20 An example of dynamic origin method 2000 is shown. In one or more examples, dynamic origin method 2000 represents method 1000 ( Figure 2 One or more operational steps, such as step 1020, are involved. In one or more examples, the dynamic start origin method 2000 is implemented using the controller 104 of system 100. Examples of dynamic start method 2000 include multiple elements, steps, operations, or processes. All elements, steps, operations, or processes described or shown in one example are not required in that example. Some or all of the elements, steps, operations, or processes described or shown in one example may be combined with other examples in various ways without needing to include other elements, steps, operations, or processes described in those other examples, even if one or more such combinations are not explicitly described or shown by example herein.

[0072] In one or more examples, the dynamic origin-starting method or operation (referred to herein as method 2000) includes the step of dividing the 3D point cloud 150 into multiple segments. In one or more examples, the 3D point cloud 150 is divided into any number (e.g., n) of segments. In one or more examples, each segment of the 3D point cloud 150 spans at least approximately equal distances in the Z direction or along the Z-axis.

[0073] In one or more examples, method 2000 includes filtering outliers 2004 (e.g., Figure 14 The step (336) involves removing outliers from the 3D point cloud 150. In one or more examples, outliers represent noise or artifacts that do not represent the hole 300. In one or more examples, a portion (e.g., percentage) of a segment of the 3D point cloud 150 starting from a lower Z value is removed. This step removes artifacts that do not represent the hole 300, such as data points representing the chuck 118 and sleeve 122.

[0074] In one or more examples, method 2000 includes the step of determining 2006 XYZ coordinates 152 (e.g., XYZ position) for each data point of the 3D point cloud 150. In one or more examples, method 2000 includes the step of determining 2008 reflection intensity 154 for each data point of the 3D point cloud 150. In one or more examples, method 2000 includes the step of averaging the X position (e.g., X coordinate). In one or more examples, the X positions of all data points in the 3D point cloud 150 are averaged, and an X-mean is determined for each segment of the 3D point cloud 150.

[0075] In one or more examples, method 2000 includes the step of averaging Y positions (e.g., Y coordinates) 2012. In one or more examples, the Y positions of all data points in the 3D point cloud 150 are averaged, and a Y-mean value is determined for each segment of the 3D point cloud 150. In one or more examples, method 2000 includes the step of averaging Z positions (e.g., Z coordinates) 2014. In one or more examples, the Z positions of all data points in the 3D point cloud 150 are averaged, and a Z-mean value is determined for each segment of the 3D point cloud 150. In one or more examples, method 2000 includes the step of averaging reflection intensity 154 2016. In one or more examples, the reflection intensity 154 of all data points in the 3D point cloud 150 is averaged, and an I-mean value (intensity mean value) is determined for each segment of the 3D point cloud 150.

[0076] In one or more examples, method 2000 includes the step of determining the radius of each segment 2018. In one or more examples, the X-mean and Y-mean are used to form or define the center of each segment. The distance between the center of the segment and each point of the segment is determined. Each determined distance becomes the radius corresponding to a point of the segment of the 3D point cloud 150. In one or more examples, method 2000 includes the step of averaging the radii 2020. In one or more examples, the radii of the points are averaged for each segment, and an R-mean (radius mean) is determined for each segment of the 3D point cloud 150. In one or more examples, method 2000 includes the step of determining an initial mean (average radius) 2022. In one or more examples, the median of the R-means of the segments is determined. The determined median is used as the initial radius of the corresponding segment of the 3D point cloud 150. In one or more examples, the initial radius 2024 is stored as one of the aperture parameters 2044 determined by method 2000.

[0077] In one or more examples, method 2000 includes the step of separating 2026 segments. In one or more examples, each segment of the 3D point cloud 150 is separated into a top stack 332 (e.g., Figure 14The top section of the heap) and the bottom heap 334 (e.g., Figure 14 The top stack includes multiple segments representing the first component 312 and the first hole 304. In one or more examples, the bottom stack includes multiple segments representing the second component 314 and the second hole 306. In one or more examples, method 2000 includes the step of averaging the top stack of segments 2028. In one or more examples, the X-mean and Y-mean of the top segments are averaged, and the top X-mean (e.g., average X coordinate or position) and top Y-mean (e.g., average Y coordinate or position) are determined. In one or more examples, method 2000 includes the step of averaging the bottom stack of segments 2030. In one or more examples, the X-mean and Y-mean of the bottom segments are averaged, and the bottom X-mean (e.g., average X coordinate or position) and bottom Y-mean (e.g., average Y coordinate or position) are determined. In one or more examples, the top X position is stored 2032 and the top Y position is stored 2034 as hole parameters determined by method 2000 2044. In one or more examples, the bottom X position is stored as 2036 and the bottom Y position is stored as 2038 as the hole parameters for 2044 determined by method 2000.

[0078] In one or more examples, method 2000 includes the step of determining interface 2040 (e.g., interface 320). In one or more examples, a segment with the lowest I-average value is identified. This segment is used to identify or indicate the location of the interface. In one or more examples, the Z-average value of this segment (e.g., the average of the Z-positions of the segment with the lowest I-average value) is used as the starting Z-position of the interface. In one or more examples, the interface height is determined based on the Z-position of the segment with the lowest I-average value. In one or more examples, the top and bottom stacks of the segment are separated based on the Z-position of the identified interface height (e.g., the top stack is above the interface and the bottom stack is below the interface). In one or more examples, the height of the interface is stored as 2042 as a hole parameter 2044 determined by method 2000.

[0079] In one or more examples, the results determined by method 2000 (e.g., the obtained hole parameters) are provided as input parameters for coordinate solving method 3000.

[0080] refer to Figure 2 , Figure 20 and Figure 21 In one or more examples, the dynamic origin method and coordinate solving method 3000 can also be used to determine the hole characteristics of the chuck 118 (e.g., processing the chuck 118), or can be an implementation of the steps for processing the 1024 chuck 118. In these examples, the methods described herein and Figure 20and Figure 21 The operating steps shown can be applied to chuck 118.

[0081] Figure 21 An example of coordinate solving method 3000 is shown. In one or more examples, coordinate solving method 3000 represents method 1000 ( Figure 2 One or more operational steps, such as step 1020, are involved. In one or more examples, the coordinate solving method 3000 is implemented using the controller 104 of system 100. Examples of coordinate solving method 3000 include multiple elements, steps, operations, or processes. Not all elements, steps, operations, or processes described or shown in one example are required in this example. Some or all of the elements, steps, operations, or processes described or shown in one example may be combined with other examples in various ways without needing to include other elements, steps, operations, or processes described in those other examples, even if one or more such combinations are not explicitly described or shown by example herein.

[0082] In one or more examples, the coordinate solving method or operation (referred to herein as method 3000) includes the step of inputting parameter 3002. In one or more examples, the input parameters of method 3000 include the hole parameters determined by method 2000. In one or more examples, the input parameters include the radius, top X position, top Y position, bottom X position, bottom Y position, interface height, and a combination of the top first opening center point (top A), top second opening center point (top B), bottom first opening center point (bottom A), and bottom second opening center point (bottom B) of the 3D point cloud 150.

[0083] In one or more examples, method 3000 includes the step of selecting parameter 3004. In one or more examples, one of the parameters (e.g., a first parameter, such as radius) is selected and set as the focus of the operation. In one or more examples, method 3000 includes the step of adjusting parameter 3006. In one or more examples, the selected or focused parameter (e.g., the first parameter) is adjusted by creating multiple (e.g., one or more) possible solutions. In one or more examples, method 3000 includes the step of scoring the solutions 3008. In one or more examples, each of the possible solutions created is scored. In one or more examples, method 3000 includes the step of selecting solution 3010. In one or more examples, the parameter with the best-scored solution is selected and that parameter is saved 3012 as a new current parameter value.

[0084] In one or more examples, method 3000 includes the step of verifying parameter 3014. In one or more examples, it is determined whether all parameters have been selected and focused (e.g., all parameters have undergone processing steps 3006-3012). If all parameters have not been focused, method 3000 includes the step of changing parameter 3016. In one or more examples, a different parameter (e.g., a second parameter, such as the top X position, a third parameter, such as the top Y position, etc.) is selected for focusing (e.g., the focus is changed to the next parameter), and processing steps 3006-3012 are repeated for each parameter. If all parameters have been focused, method 3000 includes the step of determining or checking whether parameter 3018 has converged. If the parameters have not converged, method 3000 includes the step of adjusting solution 3020. In one or more examples, the range of possible solutions is adjusted based on the difference between the current parameter and the previous parameter. If the parameters have converged, method 3000 includes the step of determining orifice characteristic 200 3022 using the current parameter adjusted and selected according to method 3000.

[0085] In one or more examples, controller 104 ( Figure 1This includes or takes the form of a data processing system. In one or more examples, the data processing system includes a communication framework that provides communication between at least one processor 192, one or more storage devices (such as memory 194 and / or persistent memory), communication units, input / output units (I / O units), and a display (e.g., user interface 108). In this example, the communication framework takes the form of a bus system. The processor 192 is used to execute instructions from software or other applications that can be loaded into memory 194. In one or more examples, depending on the specific implementation, the processor 192 is a plurality of processor units, a multiprocessor core, or some other type of processor. Memory 194 and any persistent memory are examples of storage devices. A storage device is any hardware capable of storing information, such as, but not limited to, at least one of the following: data; program code in a functional form; or other suitable information on a temporary, permanent, or both temporary and permanent basis. In one or more examples, the storage device may also be referred to as a computer-readable storage device. Memory 194 is, for example, random access memory or any other suitable volatile or non-volatile storage device. Depending on the specific implementation, persistent memory can take various forms. For example, persistent memory includes one or more elements or devices. For example, persistent memory is a hard disk drive, a solid-state hard disk drive, flash memory, a rewritable optical disk, a rewritable magnetic tape, or some combination thereof. The medium used by persistent memory can also be removable. For example, a removable hard disk drive can be used for persistent storage. Instructions for at least one of an operating system, application, or program can reside in a storage device that communicates with processor 192 via a communication framework. The various examples and operations described herein can be executed by processor 192 using computer-implemented instructions, which can reside in memory (such as memory 194). Instructions can be referred to as program code 196, computer-usable program code, or computer-readable program code that can be read and executed by processor 192. Program code 196 in different examples can be embodied on different physical or computer-readable storage media, such as memory 194 or persistent memory.

[0086] In one or more examples, program code 196 is functionally located on a computer-readable medium, is selectively removable, and can be loaded into or transferred to a data processing system for execution by processor 192. In one or more examples, program code 196 and the computer-readable medium form a computer program product. In one or more examples, the computer-readable medium is a computer-readable storage medium. In one or more examples, the computer-readable storage medium is a physical or tangible storage device for storing program code 196, rather than a medium for propagating or transmitting program code 196. Alternatively, program code 196 can be transmitted to the data processing system using a computer-readable signal medium. The computer-readable signal medium can be, for example, a propagated data signal containing program code 196. For example, the computer-readable signal medium can be at least one of electromagnetic signals, optical signals, or any other suitable type of signal. These signals can be transmitted via at least one of a communication link (such as a wireless communication link), fiber optic cable, coaxial cable, wire, or any other suitable type of communication link.

[0087] Additionally, various components of the controller 104 and / or the data processing system may be described as modules or applications (e.g., dynamic origin module 362 and coordinate solver module 364). For the purposes of this disclosure, the term "module" includes hardware, software, or a combination of hardware and software. As an example, a module may include one or more circuits configured to perform or implement the functions or operations described herein (e.g., method 1000, method 2000, and / or method 3000). As another example, a module includes a processor, a storage device (e.g., a memory), and a computer-readable storage medium having instructions that, when executed by the processor, cause the processor to perform or implement the described functions and operations. In one or more examples, the module takes the form of program code 196 and a computer-readable medium together forming a computer program product.

[0088] Now for reference Figure 22 and Figure 23 The examples of system 100, measuring tool 102, and method 1000 described herein can be applied to aircraft 1200 (e.g., Figure 22 (illustrated in the diagram) and aircraft manufacturing and maintenance methods 1100 (such as...) Figure 23 (as shown in the flowchart) or used in connection with or in the context of it. As an example, during any part of the manufacturing and repair method 1100, the system 100, the measuring tool 102 and / or the method 1000 may be used to determine one or more hole characteristics in the components of the aircraft 1200.

[0089] refer to Figure 22The figure illustrates an example of an aircraft 1200. Aircraft 1200 can be any aerospace vehicle or platform. In one or more examples, aircraft 1200 includes a fuselage 1202 with an interior 1206. Aircraft 1200 includes multiple onboard systems 1204 (e.g., advanced systems). Examples of onboard systems 1204 of aircraft 1200 include a propulsion system 1208, a hydraulic system 1212, an electrical system 1210, and an environmental system 1214. In other examples, onboard systems 1204 also include one or more control systems coupled to the fuselage 1202 of aircraft 1200. In other examples, onboard systems 1204 also include one or more other systems 1216, such as, but not limited to, communication systems, avionics systems, software distribution systems, network communication systems, passenger information / entertainment systems, guidance systems, radar systems, weapon systems, etc. Aircraft 1200 can have any number of components manufactured and / or installed using any number of holes. Such holes in the components of the aircraft 1200 can be measured using system 100, measuring tool 102 and / or according to method 1000, and the hole characteristics of such holes can be determined.

[0090] refer to Figure 23 During the pre-production phase of aircraft 1200, manufacturing and maintenance methods 1100 include the specification and design of aircraft 1200 1102 and material procurement 1104. During the production phase of aircraft 1200, the manufacturing of aircraft 1200 components and sub-assemblies 1106 and system integration 1108 are carried out. Thereafter, aircraft 1200 is certified and delivered 1110 for service entry 1112. Routine maintenance and repair 1114 includes modification, reconfiguration, refurbishment, etc., of one or more systems of aircraft 1200.

[0091] Figure 23 Each process of the manufacturing and maintenance method 1100 shown may be performed or implemented by a system integrator, a third party, and / or an operator (e.g., a customer). For the purposes of this description, a system integrator may include, but is not limited to, any number of aircraft manufacturers and major system subcontractors; a third party may include, but is not limited to, any number of vendors, subcontractors, and suppliers; and an operator may be an airline, leasing company, military entity, service organization, etc.

[0092] Examples of the system 100, measuring tool 102, and method 1000 shown and described herein can be found in Figure 23This is employed during any one or more stages of the manufacturing and maintenance method 1100 shown in the flowchart. In the example, during part of component and sub-assembly manufacturing 1106 and / or system integration 1108, holes in components of aircraft 1200 can be measured using system 100, measuring tool 102, and / or according to method 1000, and hole characteristics can be determined. Furthermore, when aircraft 1200 is in service 1112, holes in components of aircraft 1200 can be measured using system 100, measuring tool 102, and / or according to method 1000, and hole characteristics can be determined. Additionally, during system integration 1108 and certification and delivery 1110, holes in components of aircraft 1200 can be measured using system 100, measuring tool 102, and / or according to method 1000, and hole characteristics can be determined. Similarly, when the aircraft 1200 is in service 1112 and during maintenance and repair 1114, the system 100, measuring tool 102 and / or according to method 1000 can be used to measure holes in the components of the aircraft 1200 and determine hole characteristics.

[0093] The foregoing detailed description refers to the accompanying drawings, which illustrate specific examples described in this disclosure. Other examples with different structures and operations do not depart from the scope of this disclosure. In different drawings, the same reference numerals may refer to the same features, elements, or components. Throughout this disclosure, any one of a plurality of items may be referred to individually as an item, and a plurality of items may be referred to collectively as an item and may be represented by the same reference numerals. Furthermore, as used herein, a feature, element, component, or step following the words “a” or “an” should be understood to not exclude multiple features, elements, components, or steps unless such exclusion is expressly stated.

[0094] The foregoing provides illustrative, non-exhaustive examples of the subject matter of this disclosure, which may, but are not necessarily, claimed. Reference to “example” herein means that one or more features, structures, elements, components, characteristics, and / or operational steps described in connection with the example are included in at least one aspect, embodiment, and / or implementation of the subject matter of this disclosure. Therefore, the phrases “example,” “another example,” “one or more examples,” and similar language throughout this disclosure may, but are not necessarily, refer to the same example. Furthermore, the subject matter characterizing any example may, but does not necessarily include the subject matter characterizing any other example. Moreover, the subject matter characterizing any example may, but does not necessarily, combine with the subject matter characterizing any other example.

[0095] As used herein, a system, apparatus, identifier, structure, article, element, component, or hardware "configured to" perform a specified function is indeed capable of performing the specified function without any changes, and not merely has the potential to perform the specified function after further modification. In other words, a system, apparatus, identifier, structure, article, element, component, or hardware "configured to" perform a specified function is specifically selected, created, implemented, utilized, programmed, and / or designed for performing the specified function. As used herein, "configured to" indicates existing features of the system, apparatus, structure, article, element, component, or hardware that enable the system, apparatus, structure, article, element, component, or hardware to perform the specified function without further modification. For the purposes of this disclosure, a system, apparatus, identifier, structure, article, element, component, or hardware described as "configured to" perform a particular function may additionally or alternatively be described as "suitable" and / or "operated to" perform that function.

[0096] Unless otherwise stated, the terms “first,” “second,” “third,” etc., are used merely as labels in this document and are not intended to impose any order, position, or hierarchy on the items referred to by these terms. Furthermore, references to an item such as “second” do not require or exclude the existence of an item such as “first” or a lower-numbered item and / or an item such as “third” or a higher-numbered item.

[0097] As used herein, when used with a list of items, the phrase “at least one of…” means that different combinations of one or more of the listed items may be used, and it may be necessary to use only one of each item in the list. For example, “at least one of Item A, Item B, and Item C” may include, but is not limited to: Item A; or Item A and Item B. This example may also include: Item A, Item B, and Item C; or Item B and Item C. In other examples, “at least one of…” may be, for example, but not limited to: two of Item A, one of Item B, and ten of Item C; four of Item B and seven of Item C; and other suitable combinations. As used herein, the terms “and / or” and the “ / ” symbol include any and all combinations of one or more of the associated listed items.

[0098] For the purposes of this disclosure, the terms "coupled," "coupling," and similar terms refer to two or more elements that are joined, linked, fastened, attached, connected, communicated, or otherwise associated with each other (e.g., mechanically, electrically, fluidly, optically, electromagnetically). In various examples, the elements may be associated directly or indirectly. As an example, element A may be directly associated with element B. As another example, element A may be indirectly associated with element B, for example, via another element C. It should be understood that not all associations between the various disclosed elements are necessarily represented. Therefore, connections other than those depicted in the figures may also exist.

[0099] As used herein, the term "approximately" means or indicates a condition that is close to but not exactly close to the stated condition, which still performs the desired function or achieves the desired result. As an example, the term "approximately" means a condition within an acceptable predetermined tolerance or accuracy, such as a condition within 10% of the stated condition. However, the term "approximately" does not exclude a condition that is exactly the stated condition. As used herein, the term "substantially" means a condition that substantially performs the desired function or achieves the desired result.

[0100] The above-mentioned Figure 1 and Figures 3 to 19 It may represent its functional elements, features, or components, and does not necessarily imply any specific structure. Therefore, the illustrated structure may be modified, added to, and / or omitted. Furthermore, those skilled in the art will understand that it is not limited to the structures mentioned above. Figure 1 and Figures 3 to 19 All elements, features, and / or components described and illustrated herein need to be included in each example, and not all elements, features, and / or components described herein need to be depicted in every illustrative example. Therefore, in Figure 1 and Figures 3 to 19 Some of the elements, features, and / or components described and shown herein can be combined in various ways without needing to be included. Figure 1 and Figures 3 to 19 Other features described and illustrated in the accompanying drawings and / or disclosures, even if one or more such combinations are not expressly shown herein. Similarly, additional features, not limited to the examples presented, may be combined with some or all of the features shown and described herein. Unless otherwise expressly stated, the above references to [the document] are subject to change. Figure 1 and Figures 3 to 19 The schematic diagrams depicted are not intended to imply structural limitations regarding the exemplary examples. Rather, while an exemplary structure is shown, it should be understood that this structure can be modified as appropriate. Therefore, modifications, additions, and / or omissions can be made to the illustrated structure. Furthermore, elements, features, and / or components used for similar or at least substantially similar purposes may be omitted. Figure 1and Figures 3 to 19 Each of the elements is labeled with the same number and may be disregarded in this document. Figure 1 and Figures 3 to 19 Each of these elements, features, and / or components is discussed in detail. Similarly, not all elements, features, and / or components are discussed in detail. Figure 1 and Figures 3 to 19 Each element is labeled, but for consistency, this document may use the associated figure labels.

[0101] The above-mentioned Figure 2 , Figure 20 , Figure 21 and Figure 23 In this document, boxes may represent operations, steps, and / or parts thereof, and the lines connecting the various boxes do not imply any particular order or dependency between the operations or their parts. It should be understood that not all dependencies between the various operations disclosed are necessarily represented. Figure 2 , Figure 20 , Figure 21 and Figure 23 The accompanying disclosures describing the operations of the methods set forth herein should not be construed as requiring a specific order of operations to be performed. Rather, while an illustrative order is indicated, it should be understood that the order of operations can be modified where appropriate. Therefore, the operations shown can be modified, added to, and / or omitted, and some operations can be performed in a different order or simultaneously. Furthermore, those skilled in the art will understand that not all described operations need to be performed.

[0102] Exemplary, non-limiting examples of the subject matter of this disclosure are described in the following enumerated paragraphs:

[0103] 1. A system (100) for determining the hole characteristics (200) of a hole (300), the system (100) comprising:

[0104] Measuring tool (102), the measuring tool (102) being configured to measure the hole (300) and generate data (110) representing the hole (300); and

[0105] A controller (104) communicates with the measuring tool (102) and is configured to determine at least one of the hole characteristics (200) based on the data (110) from the measuring tool (102).

[0106] 2. The system (100) according to paragraph 1 further includes a user interface (108) that communicates with the controller (104) and is configured to visually display at least one of the hole features (200).

[0107] 3. The system (100) according to paragraph 1, wherein the measuring tool (102) comprises:

[0108] An optical probe (114) is configured to be positioned within the aperture (300), scan the wall (302) of the aperture (300), and generate the data (110); and

[0109] The probe driver (116) is configured to translate and rotate the optical probe (114) within the aperture (300).

[0110] 4. The system (100) according to paragraph 3, wherein the optical probe (114) includes a laser interferometer (120).

[0111] 5. The system (100) according to paragraph 3, wherein the probe driver (116) comprises:

[0112] Linear driver (132), which positions the optical probe (114) along the scanning axis (130); and

[0113] A rotary driver (134) positions the optical probe (114) around the scanning axis (130).

[0114] 6. The system (100) according to paragraph 5, wherein the linear driver (132) comprises:

[0115] Motor (142);

[0116] The transmission (144) transmits motion from the motor (142) to the optical probe (114).

[0117] A pair of limit switches (146); and

[0118] The encoder (148) measures the linear position of the optical probe (114).

[0119] 7. The system (100) according to paragraph 3, wherein:

[0120] The measuring tool (102) also includes:

[0121] Casing (112); and

[0122] A chuck (118) is attached to the housing (112) and configured to engage a portion of the hole (300), and

[0123] The optical probe (114) extends through the clamp (118).

[0124] 8. The system (100) according to paragraph 7, wherein the measuring tool (102) further includes:

[0125] Sleeve (122), which connects the chuck (118) to the housing (112).

[0126] A mandrel (124) that moves relative to the chuck (118) to expand the chuck (118); and

[0127] An actuator (126) positions the mandrel (124) relative to the chuck (118).

[0128] 9. The system (100) according to paragraph 7, wherein the measuring tool (102) further includes a plurality of chucks (128) configured to be interchangeably coupled to the housing (112).

[0129] 10. The system (100) according to paragraph 7, wherein the controller (104) is configured to:

[0130] A three-dimensional point cloud (150) is generated, the three-dimensional point cloud (150) including the XYZ coordinates (152) of the wall (302) of the hole (300) and the reflection intensity (154) of the clamp (118) located in a portion of the hole (300).

[0131] The transformation of the three-dimensional point cloud (150) is performed using the model (156) of the clamp (118); and

[0132] Based on the three-dimensional point cloud (150) fitted to the model (156) of the clamp (118), at least one of the hole characteristics (200) is determined.

[0133] 11. The system (100) according to paragraph 10, wherein the hole characteristics (200) include at least one of the diameter (204) of the hole (300), the offset (206) of the hole (300), the gap (322) at the interface (320) of the hole (300), the length (208) of the hole (300), the straightness (212) of the hole, and the orientation (214) of the hole.

[0134] 12. The system (100) according to paragraph 9, wherein the hole characteristics (200) further include at least one of the smoothness (216) of the hole (300), the debris (326) at the interface (320) and the sealant (324) at the interface (320).

[0135] 13. A measuring tool (102) for measuring a hole (300), the measuring tool (102) comprising:

[0136] Shell (112);

[0137] A chuck (118) is attached to the housing (112) and configured to engage a portion of the hole (300);

[0138] An optical probe (114) is configured to extend through the chuck (118) and into the hole (300), scan the wall (302) of the hole (300), and generate data (110) representing the wall (302) of the hole (300).

[0139] Linear driver (132), which positions the optical probe (114) along the scanning axis (130); and

[0140] A rotary driver (134) positions the optical probe (114) around the scanning axis (130).

[0141] 14. A method (1000) for determining the hole characteristics (200) of a hole (300), the method (1000) comprising:

[0142] The optical probe (114) is extended into the hole (300) along the scanning axis (130);

[0143] The optical probe (114) is rotated within the aperture (300) about the scanning axis (130);

[0144] Scan the wall (302) of the hole (300);

[0145] Generate data (110) representing the wall (302) of the hole (300); and

[0146] At least one of the pore characteristics (200) is determined based on the data (110).

[0147] 15. The method (1000) according to paragraph 14, wherein the scanning includes performing laser interferometry.

[0148] 16. The method (1000) according to paragraph 14, wherein generating includes generating a three-dimensional point cloud (150), the three-dimensional point cloud including the XYZ coordinates (152) of the wall (302) of the hole (300) and the reflection intensity (154).

[0149] 17. The method (1000) according to paragraph 16, the method (1000) further includes:

[0150] Position a portion of the chuck (118) in the hole (300);

[0151] This causes the chuck (118) to expand;

[0152] The wall (302) of the hole (300) is engaged with the chuck (118);

[0153] Scan a portion of the chuck (118) positioned in the hole (300); and

[0154] Generate the data (110) representing the portion of the clamp (118).

[0155] 18. The method (1000) according to paragraph 17, wherein determining includes:

[0156] The data (110) is processed using dynamic origin-start operations; and

[0157] The data (110) is further processed using coordinate solving operations.

[0158] 19. The method (1000) according to paragraph 18 further includes a compensating environment (252).

[0159] 20. The method (1000) according to paragraph 18, wherein determining includes determining at least one of the following: the diameter (204) of the hole (300), the offset (206) of the hole (300), the gap (322) at the interface (320) of the hole (300), the length (208) of the hole (300), the straightness (212) of the hole (300), the smoothness (216) of the hole (300), the debris (326) at the interface (320), and the sealant (324) at the interface (320).

[0160] Furthermore, references to features, advantages, or similar language used throughout this specification do not imply that all features and advantages that can be implemented using the examples disclosed herein should be included in any single example or in any single example. Rather, references to features and advantages are to be understood as indicating that a particular feature, advantage, or feature described in conjunction with an example is included in at least one example. Therefore, discussions of features, advantages, and similar language used throughout this disclosure may, but do not necessarily, refer to the same examples.

[0161] The features, advantages, and characteristics described in one example can be combined in any suitable manner in one or more other examples. Those skilled in the art will recognize that the examples described herein can be practiced without the presence of one or more specific features or advantages in a particular example. In other cases, additional features and advantages that may not be present in all examples may be recognized in some examples. Furthermore, although various examples of system 100, measuring instrument 102, and method 1000 have been shown and described, modifications will occur to those skilled in the art upon reading the specification. This application includes such modifications and is limited only by the scope of the claims.

Claims

1. A system (100) for determining the hole characteristics (200) of a hole (300), the system (100) comprising: Measuring tool (102), the measuring tool (102) being configured to measure the hole (300) and generate data (110) representing the hole (300); and A controller (104) communicates with the measuring tool (102) and is configured to determine at least one of the hole characteristics (200) based on the data (110) from the measuring tool (102).

2. The system (100) of claim 1, further comprising a user interface (108) communicating with the controller (104) and configured to visually display at least one of the hole features (200).

3. The system (100) according to claim 1, wherein, The measuring tool (102) includes: An optical probe (114) is configured to be positioned within the aperture (300), scan the wall (302) of the aperture (300), and generate the data (110); and The probe driver (116) is configured to translate and rotate the optical probe (114) within the aperture (300).

4. The system (100) according to claim 3, wherein, The optical probe (114) includes a laser interferometer (120).

5. The system (100) according to claim 3, wherein, The probe driver (116) includes: Linear driver (132), which positions the optical probe (114) along the scanning axis (130); and A rotary driver (134) positions the optical probe (114) around the scanning axis (130).

6. The system (100) according to claim 5, wherein, The linear driver (132) includes: Motor (142); A transmission (144) that transmits motion from the motor (142) to the optical probe (114). A pair of limit switches (146); and The encoder (148) measures the linear position of the optical probe (114).

7. A measuring tool (102) for measuring a hole (300), the measuring tool (102) comprising: Shell (112); A chuck (118) is attached to the housing (112) and configured to engage a portion of the hole (300); An optical probe (114) is configured to extend through the chuck (118) and into the hole (300), scan the wall (302) of the hole (300), and generate data (110) representing the wall (302) of the hole (300). A linear driver (132) positions the optical probe (114) along the scanning axis (130). and A rotary driver (134) positions the optical probe (114) around the scanning axis (130).

8. A method (1000) for determining the hole characteristics (200) of a hole (300), the method (1000) comprising: The optical probe (114) is extended into the hole (300) along the scanning axis (130); The optical probe (114) is rotated within the aperture (300) about the scanning axis (130); Scan the wall (302) of the hole (300); Generate data (110) representing the wall (302) of the hole (300); and At least one of the pore characteristics (200) is determined based on the data (110).

9. The method (1000) according to claim 8, wherein, The scanning process includes performing laser interferometry.

10. The method (1000) according to claim 8, wherein, The generation includes generating a three-dimensional point cloud (150), which includes the XYZ coordinates (152) of the wall (302) of the hole (300) and the reflection intensity (154).

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