Optical gas sensor and optical detector

Abstract

The optical gas sensor comprises a light detector and a circuit board, the light detector comprises a light detection part, an integrated circuit chip, a switching part and a packaging part, and the integrated circuit chip is electrically connected with the light detection part; the optical detection part and the integrated circuit chip are electrically connected to the switching part respectively, the switching part is electrically connected with the circuit board, and the optical detection part and the integrated circuit chip are both located in the packaging part, so that the influence of the outside of the optical gas sensor on electric signal processing is reduced; in addition, the light detection part and the integrated circuit chip are electrically connected to the switching part, and the switching part is electrically connected to the circuit board, so that the light detection part and the integrated circuit chip are electrically connected with the circuit board conveniently. The optical detector provided by the invention comprises the optical detection part, the integrated circuit chip, the switching part and the packaging part, and the optical detection part and the integrated circuit chip are both located at the packaging part, so that the influence of the outside of the optical gas sensor on electric signal processing is reduced; and meanwhile, the optical detection part and the integrated circuit chip can be electrically connected with other parts in the sensor comprising the optical detector conveniently.

Description

Technical Field

[0001] This application relates to the field of sensing technology, and more specifically, to an optical gas sensor and a photodetector. Background Technology

[0002] In related technologies, optical gas sensors include a light source, a photodetector, and a circuit board assembly. The photodetector includes a photodetector unit; when light emitted from the light source shines on the photodetector unit, the photodetector unit changes and outputs an electrical signal. The circuit board assembly includes a circuit board and multiple electronic components mounted on the circuit board. The photodetector is electrically connected to the circuit board. The circuit board assembly processes the electrical signal output by the photodetector, such as conditioning, storing, and calculating, thereby enabling the sensor to detect gases.

[0003] In related technologies, the electronic devices used to process electrical signals in optical gas sensors are mounted on a circuit board. The circuit board is located in a cavity that communicates with the outside of the optical gas sensor. The outside of the optical gas sensor can easily affect the processing of electrical signals, and the electrical connections between the components also need to be considered. Summary of the Invention

[0004] This application provides a miniaturized optical gas sensor.

[0005] The optical gas sensor provided in this application includes a photodetector and a circuit board, wherein the photodetector includes:

[0006] The optical detection unit is capable of generating a change in a physical quantity under light irradiation and converting the change in the physical quantity into an electrical signal. The change in the physical quantity can change with the concentration of the gas to be measured.

[0007] An integrated circuit chip, which is electrically connected to the photodetector, is capable of processing the electrical signal;

[0008] The adapter, wherein the photodetector and the integrated circuit chip are electrically connected to the adapter, and the adapter is electrically connected to the circuit board; and

[0009] The packaging section houses both the photodetector and the integrated circuit chip.

[0010] The optical gas sensor provided in this application includes a photodetector, which comprises a photodetector unit and an integrated circuit chip capable of processing electrical signals. The integrated circuit chip is electrically connected to the photodetector unit, and both the photodetector unit and the integrated circuit chip are housed within a package, which helps to reduce the influence of external factors on the electrical signal processing of the optical gas sensor. In addition, in this application, the photodetector also includes an adapter unit, and the photodetector unit and the integrated circuit chip are electrically connected to the adapter unit. The adapter unit is electrically connected to a circuit board, thus facilitating the electrical connection between the photodetector unit and the integrated circuit chip and the circuit board.

[0011] The photodetector provided in this application includes:

[0012] The optical detection unit is capable of generating a change in a physical quantity under light irradiation and converting the change in the physical quantity into an electrical signal. The change in the physical quantity can change with the concentration of the gas to be measured.

[0013] An integrated circuit chip, which is electrically connected to the photodetector, is capable of processing the electrical signal;

[0014] The adapter includes a main body and an electrical adapter, the electrical adapter comprising a conductive material, and includes a first adapter terminal and a second adapter terminal. The photodetector and the integrated circuit chip are physically and electrically connected to the first adapter terminal, respectively.

[0015] The packaging section houses both the photodetector and the integrated circuit chip.

[0016] This application provides a photodetector including a photodetector section and an integrated circuit chip capable of processing electrical signals. The integrated circuit chip is electrically connected to the photodetector section, and both the photodetector section and the integrated circuit chip are located within a package, which helps to reduce the influence of external factors on the electrical signal processing of the photodetector. In addition, in this application, the photodetector also includes a transition section. The photodetector section and the integrated circuit chip are physically and electrically connected to a first transition terminal of the transition section, and a second transition terminal can be electrically connected to other components in a sensor including the photodetector. Thus, the transition section facilitates the electrical connection of the photodetector section and the integrated circuit chip with other components in a sensor including the photodetector. Attached Figure Description

[0017] Figure 1 A three-dimensional schematic diagram of an optical gas sensor provided in one embodiment of this application;

[0018] Figure 2 for Figure 1 A cross-sectional schematic diagram of a first embodiment of the photodetector included in the optical gas sensor shown.

[0019] Figure 3 for Figure 2 A cross-sectional view of the photodetector from another angle;

[0020] Figure 4 for Figure 1 A cross-sectional schematic diagram of a second embodiment of the photodetector included in the optical gas sensor shown;

[0021] Figure 5 for Figure 4 A partial cross-sectional schematic diagram of the photodetector shown;

[0022] Figure 6 for Figure 4 A cross-sectional view of the photodetector from another angle;

[0023] Figure 7 for Figure 1 A cross-sectional schematic diagram of a third embodiment of the photodetector included in the optical gas sensor shown.

[0024] Figure 8 for Figure 7 A partial cross-sectional schematic diagram of the photodetector shown;

[0025] Figure 9 for Figure 7 A cross-sectional view of the photodetector from another angle;

[0026] Figure 10 for Figure 1 The diagram shows the electrical connection between the photodetector, the integrated circuit chip, and the adapter in the photodetector of the optical gas sensor shown.

[0027] Figure 11 for Figure 1 A cross-sectional schematic diagram of a fourth embodiment of the photodetector included in the optical gas sensor shown.

[0028] Figure 12 for Figure 11 A top view of the photodetector shown.

[0029] Figure 13 A schematic diagram showing the relative positions of a light source and a photodetector provided in one embodiment of this application;

[0030] Figure 14 This is a schematic diagram showing that, according to one embodiment of this application, the packaging section and the adapter section together form a shell for accommodating the photodetector section and the integrated circuit chip. Detailed Implementation

[0031] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0032] In related technologies, the optical gas sensor 1000 includes a light source 10, a photodetector 100, and a circuit board assembly. The photodetector 100 includes a photodetector unit 1. When light emitted from the light source illuminates the photodetector unit 1, the photodetector unit 1 generates an electrical signal. The circuit board assembly includes a circuit board 110 and multiple electronic components mounted on the circuit board 110. The photodetector 100 is electrically mounted on the circuit board 110. The circuit board assembly processes the electrical signal generated by the photodetector 100, such as conditioning, storing, and calculating, thereby enabling the sensor to detect gases. The optical gas sensor 1000 in related technologies is relatively large, and there is a need for miniaturization.

[0033] Therefore, this application provides an optical gas sensor 1000, for example... Figure 1 , Figure 2 , Figure 4 and Figure 7 As shown, the optical gas sensor 1000 includes a photodetector 100 and a circuit board 110. The photodetector 100 includes: a photodetector 1, which is capable of generating a physical quantity change under light irradiation and converting the physical quantity change into an electrical signal; the physical quantity change can change with the concentration of the gas to be measured; an integrated circuit chip 3, which is electrically connected to the photodetector 1 and can process the electrical signal; and a package 4, in which the photodetector 1 and the integrated circuit chip 3 are both located, and both are electrically connected to the circuit board 110. The photodetector 1 is at least partially aligned with the filter 2. In other words, a plane perpendicular to the height direction H of the photodetector 100 is defined as the projection plane. Along the height direction H of the photodetector 100, the orthographic projection of the photodetector 1 onto the projection plane at least partially coincides with the orthographic projection of the filter 2 onto the projection plane. Thus, light after wavelength selection by the filter 2 can irradiate the photodetector 1, causing the photodetector 1 to generate an electrical signal.

[0034] The optical gas sensor 1000 provided in this application includes a photodetector 100, which includes an integrated circuit chip 3. The integrated circuit chip 3 can process the electrical signals of the photodetector 1. The integrated circuit chip 3 helps to reduce the size of the circuit board 110, thereby enabling the miniaturization of the optical gas sensor 1000. Both the photodetector and the integrated circuit chip are located in the packaging section, which helps to reduce the influence of external factors on the electrical signal processing of the optical gas sensor.

[0035] The integrated circuit chip, such as an application-specific integrated circuit (ASIC) chip, is used. In some embodiments, the integrated circuit chip 3 includes at least a portion of an integrated circuit capable of conditioning the electrical signal generated by the photodetector 1. Compared to the circuit board 110 of the gas sensor in the related art, the integrated circuit chip 3 reduces the size of at least the portion used for processing the electrical signal (from a portion of the circuit board 110 that originally integrated the conditioning function to the size of the conditioning chip), thereby facilitating the reduction of the size of the circuit board 110 in the related art.

[0036] In some embodiments, the optical gas sensor 1000 includes a conditioning module electrically connected to the photodetector 1. The conditioning module is used to condition electrical signals. The conditioning module includes a first conditioning section and a second conditioning section, at least one of which is integrated into an integrated circuit chip. That is, the module in the optical gas sensor 1000 used to condition the electrical signal output from the photodetector can be partially or entirely integrated into the integrated circuit chip 3 and mounted in the package 4 as part of the photodetector 100. Correspondingly, the processing of the electrical signal by the integrated circuit chip 3 can be the entire conditioning process or a portion of the conditioning process, such as simulating or amplifying the signal.

[0037] In some embodiments, the optical gas sensor 1000 includes a light source for emitting light, at least a portion of which is capable of parameter changes under the influence of the gas to be measured, and the light is capable of illuminating the photodetector 1, for example... Figure 13 As shown, the optical gas sensor 1000 has a cavity A communicating with the outside world, and a circuit board 110 for cavity A. The circuit board 110 is equipped with a power supply unit, a microcontroller unit (MCU), and other components. In some embodiments, the optical gas sensor 1000 includes a cable electrically connected to the circuit board 110.

[0038] In some embodiments, the optical gas sensor 1000 is an infrared gas sensor. The light mentioned above is infrared light, and the light detection unit 1 is an infrared light detection unit 1, which can generate an electrical signal under infrared light irradiation. Correspondingly, the light source mentioned above is an infrared light source.

[0039] In some embodiments, the photodetector 1 is a thermopile, and the physical quantity is potential difference. That is, when the photodetector 1 is exposed to light, it generates a change in temperature difference or potential difference, and this change can be converted into an electrical signal output. For example, the photodetector 1 is an infrared thermopile chip.

[0040] In some embodiments, the optical gas sensor 1000 of this application can be used to detect refrigerant or coolant leaks. The electrical signal generated by the photodetector 1 described above under light irradiation changes with the concentration of a specific gas (e.g., refrigerant gas). Specifically, when a refrigerant leaks, the refrigerant affects infrared light of a specific wavelength, for example, by changing its light intensity. This infrared light of a specific wavelength irradiates the photodetector 1, causing a change in the electrical signal it generates. This change in the electrical signal indicates a refrigerant leak.

[0041] In some embodiments, the packaging section 4 includes a connecting section 5, with the photodetector 1 and the integrated circuit chip 3 electrically connected to the connecting section 5, and the connecting section 5 electrically connected to the circuit board 110. Further, both the photodetector 1 and the integrated circuit chip 3 are fixedly connected to the packaging section 4. Along the height direction of the photodetector 1000, the photodetector 1 and the integrated circuit chip 3 are located on the same side of the connecting section 5, and the photodetector 1 and the circuit board 110 are located on opposite sides of the connecting section 5. Specifically, for example, both the photodetector 1 and the integrated circuit chip 3 are fixedly connected to the connecting section 5.

[0042] In some embodiments, the packaging part 4 has a cavity 400, the photodetector part 1 and the integrated circuit chip 3 are both located in the cavity 400, and the connecting part 5 is part of the wall of the cavity 400. In some embodiments, the cavity 400 is a closed cavity.

[0043] In some embodiments, along the height direction H of the photodetector 100, the photodetector 1 and the integrated circuit chip 3 are located on the same side of the connecting portion 5; the connecting portion 5 includes a first connecting portion 51 and a second connecting portion 52, the photodetector 1 being electrically connected to the first connecting portion 51, and the integrated circuit chip 3 being electrically connected to the second connecting portion 52; along the direction D perpendicular to the height direction of the photodetector 100, the first connecting portion 51 is located on one side of the second connecting portion 52. Correspondingly, along the direction perpendicular to the height direction of the photodetector 100, the photodetector 1 is at least partially located on one side of the integrated circuit chip 3. Further, along the direction perpendicular to the height direction of the photodetector 100, the photodetector 1 and the integrated circuit chip 3 are arranged side by side. In some embodiments, the connecting portion 5 is a single piece.

[0044] In some embodiments, the optical gas sensor 1000 includes a filter section 2, and a light detection section 1 is at least partially aligned with the filter section 2. The filter section 2 is capable of selecting the wavelength range of light irradiating the light detection section 1.

[0045] In some implementations, for example Figures 2-9As shown, the light detection unit 1 includes a first light detection unit 11 and a second light detection unit 12, both of which are electrically connected to the integrated circuit chip 3. The filter unit 2 includes a first filter unit 21 and a second filter unit 22. The first filter unit 21 is used to select light within a first wavelength range, and the second filter unit 22 is used to select light within a second wavelength range. The first and second wavelength ranges do not overlap. The first light detection unit 11 is at least partially aligned with the first filter unit 21, and the second light detection unit 12 is at least partially aligned with the second filter unit 22. Along a direction perpendicular to the height of the photodetector 100, the first light detection unit 11 is located on one side of the second light detection unit 12. The first light detection unit 11 is used to detect light waves affected by the target gas, and the second light detection unit 12 is used to detect light waves unaffected by the target gas. The second light detection unit 12 is used to compensate for the electrical signal of the first light detection unit 11, reducing the influence of environmental factors such as ambient temperature and humidity, thereby improving detection accuracy. Correspondingly, along the height direction of the photodetector 100, the first filter section 21 is located on one side of the second filter section 22.

[0046] In some embodiments, the integrated circuit chip 3 is at least partially located between the first photodetector 11 and the second photodetector 12 in a direction perpendicular to the height of the photodetector 100. This facilitates the electrical connection between the first photodetector 11 and the second photodetector 12 and the integrated circuit chip 3.

[0047] Regarding the arrangement of the filter section 2 and the encapsulation section 4, in some embodiments, the filter section 2 is a portion of the wall of the cavity 400, and the filter section 2 is fixedly connected to the encapsulation section 4; or, the photodetector 100 includes a light-transmitting section 6, which is a portion of the wall of the cavity 400 and fixedly connected to the encapsulation section 4. At least a portion of the photodetector 1 and at least a portion of the filter section 2 are aligned with the light-transmitting section 6. The filter section 2 is located in the cavity 400, along the height direction of the photodetector 100, with the photodetector 100 and the light-transmitting section 6 located on opposite sides of the filter section 2. The filter section 2 has the function of selecting light waves, and the light-transmitting section 6 allows light to pass through, mainly serving as part of the encapsulation section 4 to protect the internal structure. The filter section 2 is, for example, a light filter, and the light-transmitting section 6 is, for example, a light-transmitting sheet.

[0048] Specifically, the encapsulation part 4 has an opening 40 that penetrates the wall of the encapsulation part 4, and the encapsulation part 4 has an opening 43 that includes the inner wall corresponding to the opening 40.

[0049] When the filter section 2 is part of the wall of the cavity 400, for example Figures 4-6As shown, the opening 40 is covered by the filter section 2, and the filter section 2 is fixedly connected to the opening 43. Along the height direction of the photodetector 100, the filter section 2 is close to the photodetector 1 relative to the opening 43, or the filter section 2 is at least partially located in the opening 40. A plane perpendicular to the height direction of the photodetector 100 is defined as the projection plane. Along the height direction of the photodetector 100, the inner contour of the orthographic projection of the opening 43 onto the projection plane coincides with the outer contour of the orthographic projection of the filter section 2 onto the projection plane, or the inner contour of the orthographic projection of the opening 43 onto the projection plane is located within the outer contour of the orthographic projection of the filter section 2 onto the projection plane. Furthermore, the filter section 2 is sealed to the encapsulation section 4, thereby making the cavity 400 a closed cavity.

[0050] When the light-transmitting part 6 is part of the wall of the cavity 400, and the light-filtering part 2 is located in the cavity 400, for example... Figures 7-10 As shown, the opening 40 is covered by the light-transmitting portion 6, and the light-transmitting portion 6 is fixedly connected to the opening 43. A plane perpendicular to the height direction of the photodetector 100 is defined as the projection plane. Along the height direction of the photodetector 100, the inner contour of the orthographic projection of the opening 43 onto the projection plane coincides with the outer contour of the orthographic projection of the light-transmitting portion 6 onto the projection plane, or the inner contour of the orthographic projection of the opening 43 onto the projection plane is located within the outer contour of the orthographic projection of the light-transmitting portion 6 onto the projection plane. Furthermore, the light-transmitting portion 6 is sealed to the encapsulation portion 4.

[0051] In some embodiments, along the height direction of the photodetector 100, the opening 40 and the connecting portion 5 are located on opposite sides of the cavity 400, or the opening 40 is disposed on the connecting portion 5. This reduces the interference of the connecting portion 5 with the incident light.

[0052] In some embodiments, the opening 40 includes a first opening 401 and a second opening 402, which are respectively covered by a first light-filtering part 21 and a second light-filtering part 22; or, the light-transmitting part 6 includes a first light-transmitting part 61 and a second light-transmitting part 62, with the first light-transmitting part 61 aligned with the first light-detecting part 11 and the first light-filtering part 21, and the second light-transmitting part 62 aligned with the second light-detecting part 12 and the second light-filtering part 22, and the first opening 401 and the second opening 402 are respectively covered by the first light-transmitting part 61 and the second light-transmitting part 62.

[0053] For the encapsulation part 4, in some embodiments, for example Figure 2 , Figure 4 or Figure 7As shown, the encapsulation part 4 includes a first housing part 41 and a second housing part 42. The first housing part 41 has a receiving groove 410, which at least partially forms a cavity 400. The receiving groove 410 has a slot 411. The first housing part 41 includes a slot portion 412, which includes a slot wall 413 corresponding to the slot 411. Along the height direction of the photodetector 100, the slot portion 412 and the second housing part 42 are located on the same side of the encapsulation part 4, and the second housing part 42 is connected to the slot portion 412. A plane perpendicular to the height direction of the photodetector 100 is defined as the projection plane. Along the height direction of the photodetector 100, the inner contour of the orthographic projection of the slot portion 412 onto the projection plane is located within the outer contour of the orthographic projection of the second housing part 42 onto the projection plane. Specifically, for example... Figure 2 , Figure 4 and Figure 7 As shown, the first housing portion 41 includes an end wall 415 and a peripheral wall 416. Along the height direction of the photodetector 100, the peripheral wall 416 extends outward from the end wall 415. Both the end wall 415 and the peripheral wall 416 are located around the receiving groove 410. The peripheral wall 416 includes a slot 412, and the end wall 415 and the slot 412 are located on opposite sides of the receiving groove 410. The second housing portion 42 is fixedly and sealingly connected to the end of the peripheral wall 416. One of the first housing portion 41 and the second housing portion 42 includes a connecting portion 5. Further, the second housing portion 42 is a plate-shaped member, and the second housing portion 42 is fixedly connected to the slot 412. Even further, the second housing portion 42 is sealingly connected to the first housing portion 41.

[0054] In some embodiments, the opening 40 is provided in the first housing portion 41 or the second housing portion 42. For example Figure 2 , Figure 4 and Figure 7 As shown, the first housing portion 41 includes a body portion 414, which has a receiving groove 410 and a slot portion 412. An opening 40 is disposed on the body portion 414. For example, along the height direction of the photodetector 100, the opening 40 and the slot portion 412 are located on opposite sides of the body portion 414. Of course, in other embodiments, the opening 40 may also be disposed on the second housing portion 42.

[0055] Specifically, the relative positions of the opening 40 and the connecting portion 5 are as follows: First, the opening 40 is disposed in the first housing portion 41, and the first housing portion 41 includes the connecting portion 5; Second, the opening 40 is disposed in the second housing portion 42, and the second housing portion 42 includes the connecting portion 5; Third, the opening 40 is disposed in the first housing portion 41, and the second housing portion 42 includes the connecting portion 5; and Fourth, the opening 40 is disposed in the second housing portion 42, and the first housing portion 41 includes the connecting portion 5.

[0056] In some embodiments, one of the first housing portion 41 and the second housing portion 42 has an opening 40, and the other of the first housing portion 41 and the second housing portion 42 includes a connecting portion 5; or, the connecting portion 5 has an opening 40.

[0057] In some implementations, for example Figures 4-9 As shown, the connecting portion 5 includes a base portion 53 and a conductive portion 54, with the conductive portion 54 penetrating through the base portion 53. A first conductive end portion 541 is electrically connected to the photodetector portion 1 or the integrated circuit chip 3, and a second conductive end portion 542 is electrically connected to the circuit board 110. Specifically, in the first embodiment, the base portion 53 is an insulating component, including a first surface 531 and a second surface 532. Along the height direction of the photodetector 100, the first surface 531 and the second surface 532 are located on opposite sides of the base portion 53, with the first surface 531 closer to the cavity 400 than the second surface 532. The conductive portion 54 includes a first conductive end portion 541 and a second conductive end portion 542, with the first conductive end portion 541 disposed on the first surface 531 and the second conductive end portion 542 disposed on the second surface 532. For example, the photodetector 100 is a sealed core, the connecting part 5 is a plastic encapsulation jacket for the core, the substrate part 53 is a plastic encapsulating adhesive, such as epoxy resin, and the conductive part 54 is embedded in the substrate part 53 for electrically connecting the photodetector 1 and the integrated circuit chip 3 to the outside world. Figure 2 , Figure 4 and Figure 7 As shown. Alternatively, the connecting portion 5 can be a ceramic substrate or a printed circuit board. Further, the second conductive end 542 is fixedly connected to the circuit board 110. In the second embodiment, the base portion 53 is a metal component, and the conductive portion 54 is at least partially a wire. One end of the wire is electrically connected to at least one of the photodetector 1 and the integrated circuit chip 3, and the other end of the wire is electrically connected to the circuit board 110. The wire is insulated from the base portion 53. For example, the photodetector 100 is a chip assembly packaged in a housing (e.g., a TO package), meaning that the photodetector 1 and the integrated circuit chip are disposed within the housing.

[0058] The optical detection unit 1 and the integrated circuit chip 3 are electrically connected, for example, through a conductive part 9, so that the integrated circuit chip 3 can condition the electrical signal generated by the optical detection unit 1. In some embodiments, the conductive part 9 is a wire located in the cavity 400. For example... Figure 2As shown, along the height direction of the photodetector, the wire is located away from the connecting part 5 relative to the photodetector 1, and the wire is positioned between the photodetector 1 and the integrated circuit chip 3. The wire includes a first wire and a second wire. Both the first photodetector 11 and the integrated circuit chip 3 are electrically connected to the first wire, and both the second photodetector 12 and the integrated circuit chip 3 are electrically connected to the second wire. In other embodiments, the conductive part 9 is disposed on the connecting part 5, or on the circuit board 110, or on the adapter part 7 described below, which can further simplify the process and improve the integration of the photodetector.

[0059] In other embodiments, the conductive portion 9 is a wire, electrically connected to the photodetector 1 or the integrated circuit chip 3, and electrically connected to the adapter portion 72. At least a portion of the conductive portion 9 has a gap with the adapter portion 72. Specifically, the conductive portion 9 includes a first conductive portion 91 and a second conductive portion 92. The first conductive portion 91 is electrically connected to the photodetector 1 and the adapter portion 7, and the second conductive portion 92 is electrically connected to the integrated circuit chip 3 and the adapter portion 7.

[0060] This application also provides a photodetector 100, which includes: a photodetector 1, which is capable of generating a physical quantity change under light irradiation and converting the physical quantity change into an electrical signal, the physical quantity change being able to change with the concentration of the gas to be measured; a filter 2, which is at least partially aligned with the photodetector 1; an integrated circuit chip 3, which is electrically connected to the photodetector 1 and is capable of processing the electrical signal; and a package 4, which is connected to the photodetector 2, and both the photodetector 1 and the integrated circuit chip 3 are located within the package 4.

[0061] The photodetector 100 has any one or more of the features described above, which will not be repeated here.

[0062] This application provides a photodetector 100 including a photodetector unit 1 and an integrated circuit chip 3 capable of conditioning electrical signals. The integrated circuit chip 3 is electrically connected to the photodetector unit 1. The integrated circuit chip helps to reduce the size of the circuit board 110 in the sensor including the photodetector 100, thereby enabling miniaturization of the sensor including the photodetector 100. Both the photodetector unit 1 and the integrated circuit chip 3 are located in the packaging unit 4, which helps to reduce the influence of external factors on the electrical signal processing of the photodetector 100.

[0063] Another aspect of this application provides an optical gas sensor 1000, which can further improve the connection reliability between the light detection unit 1 and the integrated circuit chip 3 and the connection unit 5 based on the miniaturized optical gas sensor 1000.

[0064] The optical gas sensor 1000 provided in the second aspect of this application, for example... Figures 4-9 As shown, the device includes a photodetector 100 and a circuit board 110. The photodetector 100 includes: a photodetector 1, which is capable of generating a physical quantity change under light irradiation and converting the physical quantity change into an electrical signal, and the physical quantity change can change with the concentration of the gas to be measured; an integrated circuit chip 3, which is electrically connected to the photodetector 1 and is capable of processing the electrical signal; a converter 7, which is electrically connected to the photodetector 1 and the integrated circuit chip 3, and the converter 7 is electrically connected to the circuit board 110; and a package 4, in which the photodetector 1 and the integrated circuit chip 3 are both housed.

[0065] The optical gas sensor 1000 provided in this application includes a photodetector 100, which includes a photodetector unit 1, an integrated circuit chip 3 capable of processing electrical signals, and a converter unit 7. The integrated circuit chip 3 is electrically connected to the photodetector unit 1, and both the photodetector unit 1 and the integrated circuit chip 3 are connected to the converter unit 7. The converter unit 7 is electrically connected to a circuit board 110. The integrated circuit chip 3 helps to reduce the size of the circuit board 110, thereby enabling the miniaturization of the optical gas sensor 1000. Both the photodetector unit 1 and the integrated circuit chip 3 are located within the package 4, which helps to reduce the influence of external factors on the electrical signal processing of the optical gas sensor 1000.

[0066] Furthermore, in the optical gas sensor 1000 provided in the second aspect of this application, the light detection unit 1 and the integrated circuit chip 3 are electrically connected to the adapter 7, and the adapter 7 is electrically connected to the circuit board 110, which facilitates the connection between the light detection unit 1 and the integrated circuit chip 3 and the circuit board 110.

[0067] In the second aspect of this application, the specific descriptions of the light detection unit 1, the conditioning module, and the integrated circuit chip 3 can be found in the relevant content of the first aspect of the previous application, and will not be repeated here.

[0068] When the photodetector 100 is a sealed core, in order to transmit the electrical signals output by the photodetector 1 and the integrated circuit chip 3 to other components, the photodetector 1 and the integrated circuit chip 3 need to be electrically connected to other components. However, the alignment accuracy of the electrical connection points of the components (e.g., circuit boards) electrically connected to the photodetector 1 in the optical gas sensor 1000 is 5 to 10 times the size of the electrical connection points of the photodetector 1, and the alignment accuracy of the components (e.g., circuit boards) electrically connected to the integrated circuit chip 3 in the optical gas sensor 1000 is also 5 to 10 times the size of the electrical connection points of the integrated circuit chip 3. For example, the alignment accuracy of the electrical connection points of other components electrically connected to the photodetector 1 or the integrated circuit chip 3 is 100 μm, and the dimensions (e.g., length and width) of the electrical connection points of the photodetector 1 in the direction perpendicular to the height of the photodetector are 20 μm, and the dimensions (e.g., length and width) of the electrical connection points of the integrated circuit chip 3 are 21 μm. Without the adapter 7, the electrical connections between the light detection unit 1 and the integrated circuit chip 3 are difficult to align with the electrical connections of other components, making it difficult to achieve reliable electrical connections between the light detection unit 1 and other components, and between the integrated circuit chip 3 and other components. Alternatively, achieving connections between the light detection unit 1 and the integrated circuit chip 3 and other components (e.g., circuit boards) requires more precise alignment and more expensive process equipment. This application, through the adapter 7, makes the electrical connections between the light detection unit 1 and the circuit board 110, and between the integrated circuit chip 3 and the circuit board 110, easier to achieve in terms of process, more reliable, and lower cost. Furthermore, by using the adapter 7 to achieve electrical connections between the light detection unit 1 and other components, this application can reduce the influence of other components on the light detection unit 1. For example, the circuit board 110, which is electrically connected to the light detection unit 1, has some electronic components that are prone to generating heat. If the light detection unit 1 is directly connected to the circuit board 110, the heat generated by these electronic components can easily be conducted to the light detection unit 1, affecting it. Moreover, due to the different coefficients of thermal expansion between the light detection unit 1 and the circuit board 110, stress can easily be generated between them, leading to connection failure. This application uses the adapter 7 for transfer, which can effectively reduce the heat of the circuit board and the impact of the stress mentioned above on the photodetector 1.

[0069] In some embodiments, the adapter 7 includes a first adapter end 721 and a second adapter end 722. The first adapter end 721 is physically and electrically connected to the photodetector 1 or the integrated circuit chip 3, and the second adapter end 722 is electrically connected to the circuit board 110. Along the height direction of the photodetector, the first adapter end 721 and the second adapter end 722 are located on opposite sides of the adapter 7. A plane perpendicular to the height direction of the photodetector 100 is defined as the projection plane. Along the height direction of the photodetector 100, the area of ​​the orthographic projection of the first adapter end 721 onto the projection plane is smaller than the area of ​​the orthographic projection of the second adapter end 722 onto the projection plane. Specifically, the area of ​​the first adapter 721 projected onto the projection surface is S1', the area of ​​the second adapter 722 projected onto the projection surface is S2', the first adapter 721 adapts to the alignment accuracy of the electrical connection point of the light detection unit 1 or the conditioning chip, and the second adapter 722 adapts to the alignment accuracy of the connection unit 5, S2' / S1'≥10.

[0070] The first adapter end 721 of the adapter 7 is used for electrical connection with the electrical connection part of the photodetector 100 or the conditioning chip. By adjusting the alignment accuracy of the first adapter end 721 to be on the same order of magnitude as the volume of the electrical connection part of the photodetector 1 or the integrated circuit chip 3 (or the area of ​​the electrical connection part of the photodetector 1 or the integrated circuit chip 3 projected onto the projection surface), reliable electrical connection can be achieved between the photodetector 1 and the adapter 7, and between the integrated circuit chip 3 and the adapter 7.

[0071] Specifically, the photodetector 1 includes a first connection terminal 13, the integrated circuit chip 3 includes a second connection terminal 31, and the first adapter terminal 721 includes a first sub-adapter terminal 7211 and a second sub-adapter terminal 7212. The first sub-adapter terminal 7211 is directly and electrically connected to the first connection terminal 13, and the second sub-adapter terminal 7212 is directly and electrically connected to the second connection terminal 31. Along the height direction of the photodetector 100, the area of ​​the orthographic projection of the first connection terminal 13 on the projection surface is S1, the area of ​​the orthographic projection of the second connection terminal 31 on the projection surface is S2, the area of ​​the orthographic projection of the first sub-adapter terminal 7211 on the projection surface is S3, and the area of ​​the orthographic projection of the second sub-adapter terminal 7212 on the projection surface is S4, where 0.25 < S1 / S3 < 1 and 0.25 < S2 / S4 < 1. This facilitates achieving an alignment accuracy of the first adapter terminal 721 that is on the same order of magnitude as the size of the electrical connection portion of the photodetector 1 or the integrated circuit chip 3.

[0072] In some embodiments, the adapter 7 is directly connected to the circuit board 110. By adjusting the alignment accuracy of the second adapter 722 to be on the same order of magnitude as the volume of the electrical connection portion of the circuit board 110 (or the area of ​​the electrical connection portion of the circuit board 110 projected onto the projection plane), a reliable electrical connection between the adapter 7 and the circuit board 110 can be achieved.

[0073] In other embodiments, the adapter 7 is connected to the circuit board 110 via other components. For example, the package 4 includes a connecting portion 5, and the adapter 7 is electrically connected to the connecting portion 5. Alternatively, the adapter 7 is electrically connected to the circuit board 110 via the connecting portion 5. In some embodiments, the area of ​​the second adapter end 722 projected onto the projection plane along the height direction of the photodetector 100 is S5; the connecting portion 5 includes a third connecting end 55, and the area of ​​the third connecting end 55 projected onto the projection plane along the height direction of the photodetector 100 is S6, where S5 / S6 > 10. Specifically, S5 > 1 mm. Thus, with an alignment accuracy of approximately 100 μm for the third connecting end 55 of the connecting portion 5, alignment of the second adapter end 722 with the electrical connection portion of the connecting portion 5 can be achieved, thereby enabling a reliable electrical connection between the adapter 7 and the connecting portion 5. The first conductive end 541 includes the third connecting end 55.

[0074] In some embodiments, the features of the encapsulation part 4, including the features of the connecting part 5, the cavity 400, etc., can be referred to above and will not be repeated here.

[0075] In other embodiments, the packaging section 4 and the adapter section 7 together form a housing for accommodating the photodetector section 1 and the integrated circuit chip 3. Specifically, for example... Figure 14 As shown, the photodetector 100 has a cavity 400, where both the photodetector 1 and the integrated circuit chip 3 are located. At least a portion of the sidewall of the encapsulation portion 4 is a cavity wall corresponding to the cavity 400, and at least a portion of the adapter portion 7 is a cavity wall corresponding to the cavity 400. Alternatively, the adapter portion 7 replaces the previously described second housing portion 42 and together with the previously described first housing portion 41 forms a shell for accommodating the photodetector 1 and the integrated circuit chip 3; or, the adapter portion 7 replaces the previously described end wall 415 of the encapsulation portion, and together with the peripheral wall 416 and the second housing portion 42, forms a shell for accommodating the photodetector 1 and the integrated circuit chip 3.

[0076] Specifically, both the first connection terminal 13 and the second connection terminal 31 are conductive terminals with three-dimensional shapes, such as spherical, flat, or irregular shapes. More specifically, for example, both the first connection terminal 13 and the second connection terminal 31 are solder balls formed by a wafer bumping process. In some embodiments, the third connection terminal 55 is a solder ball. In some embodiments, both the first adapter terminal 721 and the second adapter terminal 722 are solder pads.

[0077] Specifically, for example Figure 5 , Figure 8 and Figure 10As shown, the first optical detection unit 11 includes a first sub-connection terminal 131 and a second sub-connection terminal 132. The adapter unit 7 includes two first sub-adapter terminals 7211 corresponding to the first sub-connection terminal 131 and the second sub-connection terminal 132, respectively. The first sub-connection terminal 131 and the second sub-connection terminal 132 are electrically connected to their respective first sub-adapter terminals 7211. The integrated circuit chip 3 includes a third sub-connection terminal 311 and a fourth sub-connection terminal 312. The adapter unit 7 includes two second sub-adapter terminals 7212 corresponding to the third sub-connection terminal 311 and the fourth sub-connection terminal 312, respectively. The third sub-connection terminal 311 and the fourth sub-connection terminal 312 are electrically connected to their respective second sub-adapter terminals 7212.

[0078] Specifically, for example Figures 4-9 As shown, the adapter 7 includes a first adapter surface 77 and a second adapter surface 78, which are located on opposite sides of the adapter 7 along its thickness direction. The adapter 7 includes a main body 71 and an electrical adapter 72. The main body 71 comprises silicon or glass, and the electrical adapter 72 comprises a conductive material. That is, the adapter 7 is a silicon adapter plate or a glass adapter plate. The electrical adapter 72 penetrates the main body 71, for example, by forming a through-hole in the main body 71 using TGV (Trough Glass Via) or TSV (Trough Silicon Via) technology, and then filling the through-hole with conductive material to form the electrical adapter 72. The electrical adapter 72 includes a first adapter end 721 and a second adapter end 722. Along the thickness direction of the adapter 7, the first adapter end 721 and the second adapter end 722 are located on opposite sides of the adapter 7, and the first adapter surface 77 is closer to the first adapter end 721 than the second adapter surface 78. The thickness direction of the adapter 7 is parallel to the height direction of the photodetector 100.

[0079] In the specific production process, the first photodetector 11, the second photodetector 12 and the integrated circuit chip 3 can be formed into solder balls for signal extraction through wafer bumping process. The three are then soldered to the adapter 7 through reflow process. Finally, the adapter 7 is reflow soldered to the connection part 5 through reflow process.

[0080] In some embodiments, along the height direction of the photodetector 100, the adapter 7 is at least partially located between the circuit board 110 and the photodetector 1, and at least partially located between the circuit board 110 and the integrated circuit chip 3, for example... Figures 4-9As shown. This allows the adapter 7 to electrically connect the photodetector 1 and the integrated circuit chip 3 to the circuit board 110 via an adapter. The adapter 7 is a silicon adapter plate or a glass adapter plate. The adapter 7 includes a first adapter 73 and a second adapter 74. The photodetector 1 is electrically connected to the first adapter 73, and the integrated circuit chip 3 is electrically connected to the second adapter 74. Both the first adapter 73 and the second adapter 74 are electrically connected to the circuit board 110. Alternatively, the photodetector 1 is electrically connected to the circuit board 110 via the first adapter 73, and the integrated circuit chip 3 is electrically connected to the circuit board 110 via the second adapter 74. Along a direction perpendicular to the height of the photodetector 100, the second adapter 74 is located to one side of the first adapter 73.

[0081] In some embodiments, the adapter 7 is electrically connected to the circuit board 110 via the connecting portion 5. Specifically, along the height direction of the photodetector 1000, the adapter 7 is at least partially located between the connecting portion 5 and the photodetector 1, and at least partially located between the connecting portion 5 and the integrated circuit chip 3. The photodetector 1 is electrically connected to the first adapter 73, and the integrated circuit chip 3 is electrically connected to the second adapter 74. Both the first adapter 73 and the second adapter 74 are electrically connected to the connecting portion 5. Alternatively, the photodetector 1 is electrically connected to the connecting portion 5 via the first adapter 73, and the integrated circuit chip 3 is electrically connected to the connecting portion 5 via the second adapter 74. Along the height direction of the photodetector 100, the first adapter 73 is at least partially located between the connecting portion 5 and the photodetector 1, specifically between the first connecting portion 51 and the photodetector 1; the second adapter 74 is at least partially located between the connecting portion 5 and the integrated circuit chip 3, specifically between the second connecting portion 52 and the photodetector 1.

[0082] In some embodiments, the light detection unit 1 includes a first light detection unit 11 and a second light detection unit 12, both of which are electrically connected to the integrated circuit chip 3. The first adapter unit 73 includes a first sub-adapter unit 731 and a second sub-adapter unit 732. The first light detection unit 11 and the circuit board 110 are both electrically connected to the first sub-adapter unit 731, and the second light detection unit 12 and the circuit board 110 are both electrically connected to the second sub-adapter unit 732. The first sub-adapter unit 731 and the second sub-adapter unit 732 can be directly connected to the circuit board 110, or connected to the circuit board 110 via a connecting part 5. Along a direction perpendicular to the height of the photodetector 100, the second adapter unit 74 is at least partially located between the first sub-adapter unit 731 and the second sub-adapter unit 732. As mentioned above, the second light detection unit 12 can serve as a reference component to improve the detection accuracy of the first light detection unit 11; related details are provided above and will not be repeated here.

[0083] In some embodiments, the photodetector 100 includes a first adapter 81 and a second adapter 82. Along a direction perpendicular to the height of the photodetector 100, the first adapter 81 is located on one side of the second adapter 82, and there is a gap between the first adapter 81 and the second adapter 82. The first adapter 81 includes a first sub-adapter portion 731, and the second adapter 82 includes a second sub-adapter portion 732. In some embodiments, the first adapter 81 or the second adapter 82 includes a second adapter portion 74; or, the photodetector 100 includes a third adapter 83. Along a direction perpendicular to the height of the photodetector 100, the third adapter 83 is located between the first adapter 81 and the second adapter 82, and there is a gap between both the first adapter 81 and the second adapter 82 and the third adapter 83. The third adapter 83 includes a second adapter portion 74. In some embodiments, the first adapter portion 73 and the second adapter portion 74 of the photodetector 100 are a single piece, for example... Figure 8 and Figure 9 As shown, the first adapter 73 and the second adapter 74 are both disposed on the same adapter 8.

[0084] In some embodiments, the photodetector 100 includes a filter section 2, which is connected to the encapsulation section 4. As described above, light with wavelength selection after passing through the filter section 2 is incident on the photodetector 1, thereby realizing gas detection. In order to reduce the interference of the adapter section 7 on the incident light, that is, in order to reduce the interference of the adapter section 7 on light in the photodetector 100 including the adapter section 7, the adapter section 7 is designed in this application. As described above, the photodetector 100 includes a filter section 2, or the photodetector 100 includes a filter section 2 and a light-transmitting section 6. The relative positional relationship between the filter section 2 and other components of the photodetector 100 can be referred to above, and the relative positional relationship between the light-transmitting section 6 and other components of the photodetector 100 can also be referred to above. The relative positional relationship between the adapter section 7 and the filter section 2 and the light-transmitting section 6 will be described below.

[0085] In one implementation, for example Figures 7-9As shown, the adapter 7 has a light entrance 75 that extends through the thickness direction of the adapter 7. The adapter 7 includes an entrance portion 76, which includes an inner wall corresponding to the light entrance 75. A plane perpendicular to the height direction of the photodetector 100 is defined as the projection plane. Along the height direction of the photodetector 100, at least a portion of the orthographic projection of the photodetector 76 onto the projection plane lies within the inner contour of the orthographic projection of the entrance portion 76 onto the projection plane. At least a portion of the orthographic projection of the filter portion 2 onto the projection plane lies within the inner contour of the orthographic projection of the entrance portion 76 onto the projection plane. At least a portion of the orthographic projection of the photodetector 76 onto the projection plane coincides with the orthographic projection of the filter portion 2 onto the projection plane. That is, at least a portion of the photodetector 75 is aligned with the light entrance 75, and at least a portion of the filter portion 2 is aligned with the light entrance 75. In one embodiment, the filter portion 2 is a portion of the wall of the cavity 400, and the filter portion 2 is fixedly connected to the encapsulation portion 4.

[0086] Specifically, in some embodiments, the adapter 7 has a first light entrance 751 and a second light entrance 752, and the entrance portion 76 includes a first entrance portion 761 and a second entrance portion 762. The first entrance portion 761 includes an inner wall corresponding to the first light entrance 751, and the second entrance portion 762 includes an inner wall corresponding to the second light entrance 752. Along the height direction of the photodetector 100, the first light detection portion 11 and the first filter portion 21 are respectively located on both sides of the first entrance portion 761, and the second light detection portion 12 and the second filter portion 22 are respectively located on both sides of the second entrance portion 762. That is, at least a portion of the first light detection portion 11 and at least a portion of the first filter portion 21 are aligned with the first light entrance 751, and at least a portion of the second light detection portion 12 and at least a portion of the second filter portion 22 are aligned with the second light entrance 752.

[0087] In some embodiments, along the height direction of the photodetector 100, the photodetector 1 and the circuit board 110 are located on both sides of the connecting portion 5. The circuit board 110 has an entrance hole 111 that extends through the thickness direction of the circuit board 110. The filter portion 2 and the light entrance port 75 are both aligned with the entrance hole 111. At least a portion of the circuit board 110 includes a hole portion 112, and the hole portion 112 includes the hole wall of the entrance hole 111. A plane perpendicular to the height direction of the photodetector is defined as a projection plane. Along the height direction of the photodetector, the orthographic projection of the filter portion 2 onto the projection plane is a first projection, the inner contour of the orthographic projection of the entrance portion 76 onto the projection plane is a second projection, and the inner contour of the orthographic projection of the hole portion onto the projection plane is a third projection. The first projection is at least partially located within the second projection and within the third projection.

[0088] In some embodiments, the entrance aperture 111 includes a first entrance aperture 113 and a second entrance aperture 114, the first filter part 21 and the first light entrance port 751 are both aligned with the first entrance aperture 113, and the second filter part 22 and the second light entrance port 752 are both aligned with the second entrance aperture 114.

[0089] In some embodiments, the photodetector 1 includes a filter section 2 and a light-transmitting section 6, both of which are aligned with the entrance aperture. The alignment of the circuit board entrance aperture 111 with other components is based on the requirement that light can pass through the entrance aperture 111 and reach the photodetector 1 through other optical devices; the specific method will not be described in detail here.

[0090] In another implementation, for example Figures 4-6 As shown, the photodetector 100 includes a filter section 2 and a light-transmitting section 6. The light-transmitting section 6 is a portion of the wall of the cavity 400. At least a portion of the light detection section 1 and at least a portion of the filter section 2 are aligned with the light-transmitting section 6. Along the height direction of the photodetector 100, the light detection section 1 and the light-transmitting section 6 are located on opposite sides of the filter section 2. The adapter section 7 includes the filter section 2. Specifically, a glass adapter plate is used as the adapter section 7. An area is defined on the glass adapter plate, and a film capable of selecting light waves of a specific wavelength is coated in this area, so that the area has a filtering function. The adapter 7 includes a main body 71 and an electrical adapter 72. The main body 71 includes glass, and the electrical adapter 72 includes a conductive material and penetrates through the main body 71. The electrical adapter 72 includes a first adapter end 721 and a second adapter end 722. Along the thickness direction of the adapter 7, the first adapter end 721 and the second adapter end 722 are located on both sides of the adapter 7. The first adapter end 721 is electrically connected to the photodetector 1 or the integrated circuit chip 3, and the second adapter end 722 is electrically connected to the connector 5. The main body 71 includes a filter film (not shown) which is coated on the surface of the glass. The main body 71 also includes a filter part 2, which includes a filter film.

[0091] Furthermore, the filter section 2 is disposed to avoid the electrical adapter section 72 described above.

[0092] In some embodiments, when the photodetector 100 is a sealed core and the substrate of the corresponding connecting part 5 is an insulating component, the adapter 7 is a silicon adapter plate or a glass adapter plate, for example... Figure 2 , Figure 4 and Figure 7 As shown.

[0093] When the photodetector is a chip assembly encapsulated in a housing, and the substrate of the corresponding connection part 5 is an insulating or metal component, the adapter part 7 is a PCB circuit board or a ceramic circuit board. For example Figure 11 and Figure 12As shown, the photodetector 1 and the integrated circuit chip 3 are connected to the adapter 7 (PCB circuit board) via the conductive part 9 (binding wire), and the electrical connection between the two is realized within the PCB circuit board. Then, the adapter 7 is connected to the conductive part 54 included in the connecting part 5. The conductive part 54 is at least partially a wire, such as the four wires shown in the figure, so that the signal of the adapter 7 is led out from the TO package housing. When the photodetector 100 is a chip assembly with a housing package (e.g., TO package), the adapter 7 facilitates the electrical connection between the photodetector 11, the integrated circuit chip 12, and the circuit board 110. Specifically, the adapter 7 can reduce the suspension of the conductive part 9 in the cavity of the package part 4, thereby reducing the influence of the conductive part 9 on the photodetector 1, for example, reducing the interference of the conductive part 9 on the light incident on the photodetector 1.

[0094] In some embodiments, at least one of the first photodetector 11, the second photodetector 12, and the integrated circuit chip 3 is mounted on the adapter 7. A first direction and a second direction are defined, perpendicular to the height direction of the photodetector 100. The first direction is perpendicular to the second direction. Along the first direction, the integrated circuit chip 3 is located between the first photodetector 11 and the second photodetector 12. Along the second direction, the first photodetector 11 and the second photodetector 12 are located on the same side of the integrated circuit chip 3. Specifically, the center line connecting the first photodetector 11, the second photodetector 12, and the integrated circuit chip 3 approximately forms a triangle. This facilitates the connection of the binding wires of the first photodetector 11, the second photodetector 12, and the integrated circuit chip 3 to the adapter 7, reducing interference between multiple binding wires.

[0095] In some embodiments, the integrated circuit chip 3 is mounted on the base portion 53 of the connecting portion 5, or the integrated circuit chip 3 is mounted on the adapter portion 7. Along the height direction of the photodetector 1000, the orthographic projection of the integrated circuit chip 3 onto the aforementioned projection surface is located outside the orthographic projection of the adapter portion 7 onto that projection surface, or at least partially, the orthographic projection of the integrated circuit chip 3 onto the aforementioned projection surface is located within the orthographic projection of the adapter portion 7 onto that projection surface. The first light detection unit 11 and the second light detection unit 12 are mounted on the adapter portion 7.

[0096] A second aspect of this application also provides a photodetector 100, comprising: a photodetector 1, capable of generating a physical quantity change under light irradiation and converting the physical quantity change into an electrical signal, the physical quantity change being adaptable to changes in the concentration of the gas to be measured; an integrated circuit chip 3, electrically connected to the photodetector 1, capable of processing the electrical signal; a converter 7, comprising a main body 71 and an electrical converter 72, the electrical converter 72 comprising a conductive material, and including a first converter terminal 721 and a second converter terminal 722, the photodetector and the integrated circuit chip being physically and electrically connected to the first converter terminal respectively; and a package 4, wherein the photodetector 1 and the integrated circuit chip 3 are both housed within the package 4. Other features of the photodetector 100 are described above and will not be repeated here.

[0097] The photodetector 100 provided in the second aspect of this application, by employing an integrated circuit chip 3, helps to reduce the size of the circuit board 110 of the sensor including the photodetector 100, thereby facilitating the miniaturization of the corresponding sensor. Both the photodetector 1 and the integrated circuit chip 3 are located within the package 4, which helps to reduce the influence of external factors on the electrical signal processing of the photodetector 100. Furthermore, since the photodetector 100 includes a transition section 7, the photodetector 1 and the integrated circuit chip 3 are physically and electrically connected to the first transition terminal 721 of the transition section 7, and the second transition terminal 722 can be electrically connected to other components in the sensor including the photodetector 100. Thus, the transition section 7 facilitates the electrical connection of the photodetector 1 and the integrated circuit chip 3 to other components in the sensor including the photodetector 100, and vice versa. When the photodetector 100 is a packaged chip, the adapter 7 can be set according to the connection accuracy of the photodetector 1, the integrated circuit chip 3 and the circuit board 110 or the connector 5, which is beneficial to improve the connection reliability of the photodetector 1 and the integrated circuit chip 3 and the circuit board 110.

[0098] The features of the photodetector 100, such as the photodetector unit 1, the integrated circuit chip 3, and the packaging unit 4, can be referred to in the previous text and will not be repeated here.

Claims

1. An optical gas sensor, comprising a photodetector (100) and a circuit board (110), characterized in that, The photodetector (100) includes: The light detection unit (1) is capable of generating a change in physical quantity under light irradiation and converting the change in physical quantity into an electrical signal. The change in physical quantity can change with the change in the concentration of the gas to be measured. An integrated circuit chip (3) is electrically connected to the photodetector (1), and the integrated circuit chip (3) is capable of processing the electrical signal; The adapter (7) is electrically connected to the light detection unit (1) and the integrated circuit chip (3), and the adapter (7) is electrically connected to the circuit board (110); and The packaging unit (4) houses both the photodetector unit (1) and the integrated circuit chip (3).

2. The optical gas sensor as described in claim 1, characterized in that, The optical gas sensor includes a conditioning module, which is electrically connected to the photodetector (1). The conditioning module is used to condition the electrical signal. The conditioning module includes a first conditioning section and a second conditioning section, at least one of which is integrated into the integrated circuit chip.

3. The optical gas sensor as described in claim 1 or 2, characterized in that, The optical detection unit (1) is a thermopile, and the physical quantity is the potential difference.

4. The optical gas sensor as described in claim 1 or 2, characterized in that, The adapter (7) includes a main body (71) and an electrical adapter (72). The electrical adapter (72) is made of conductive material and extends through the main body (71). The electrical adapter (72) includes a first adapter end (721) and a second adapter end (722). Along the height direction of the photodetector (100), the first adapter end (721) and the second adapter end (722) are located on opposite sides of the adapter (7). The first adapter end (721) connects to the photodetector (100). The detection unit (1) or the integrated circuit chip (3) is physically and electrically connected, and the second adapter (722) is physically and electrically connected to the connection unit (5); a plane perpendicular to the height direction of the photodetector (100) is defined as the projection plane, and along the height direction of the photodetector (100), the area of ​​the orthographic projection of the first adapter (721) on the projection plane is S1', the area of ​​the orthographic projection of the second adapter (722) on the projection plane is S2', and S2' / S1'≥10.

5. The optical gas sensor as described in claim 4, characterized in that, The optical detection unit (1) includes a first connection terminal (13), the integrated circuit chip (3) includes a second connection terminal (31), the first adapter terminal (721) includes a first sub-adapter terminal (7211) and a second sub-adapter terminal (7212), the first sub-adapter terminal (7211) is directly connected to the first connection terminal (13) and electrically connected, and the second sub-adapter terminal (7212) is directly connected to the second connection terminal (31) and electrically connected; Along the height direction of the photodetector (100), the area of ​​the first connection end (13) projected onto the projection surface is S1, the area of ​​the second connection end (31) projected onto the projection surface is S2, the area of ​​the first sub-transfer end (7211) projected onto the projection surface is S3, and the area of ​​the second sub-transfer end (7212) projected onto the projection surface is S4, 0.25 < S1 / S3 < 1, 0.25 < S2 / S4 < 1.

6. The optical gas sensor as described in claim 1 or 2, characterized in that, The photodetector (100) includes a filter (2), which is connected to the encapsulation part (4); A plane perpendicular to the height direction of the photodetector (100) is defined as the projection plane. Along the height direction of the photodetector (100), the orthographic projection of the photodetector on the projection plane at least partially coincides with the orthographic projection of the filter (2) on the projection plane.

7. The optical gas sensor as described in claim 6, characterized in that, The photodetector (100) includes a light-transmitting part (6) connected to the encapsulation part (4), and a light-filtering part located inside the encapsulation part (4). At least a portion of the light-detecting part (1) and at least a portion of the light-filtering part (2) are aligned with the light-transmitting part (6). Along the height direction of the photodetector (100), the light-detecting part (1) and the light-transmitting part (6) are located on both sides of the light-filtering part (2).

8. The optical gas sensor as described in claim 7, characterized in that, The adapter (7) includes the filter (2); The adapter (7) includes a main body (71) and an electrical adapter (72). The main body (71) includes glass, and the electrical adapter (72) includes a conductive material. The electrical adapter (72) penetrates the main body (71). The electrical adapter (72) includes a first adapter end (721) and a second adapter end (722). Along the thickness direction of the adapter (7), the first adapter end (721) and the second adapter end (722) are located on both sides of the adapter (7). The first adapter end (721) is electrically connected to the photodetector (1) or the integrated circuit chip (3), and the second adapter end (722) is electrically connected to the connecting part (5). The main body (71) includes a filter film, which is applied to the surface of the glass. The main body (71) includes the filter part (2), which includes the filter film.

9. The optical gas sensor as described in claim 1, 2, 5, 7 or 8, characterized in that, The adapter (7) is located inside the encapsulation part (4); The encapsulation part (4) includes a connecting part (5), which is located at least partially between the adapter part (7) and the circuit board (110) along the height direction of the photodetector (100). The connecting part (5) includes a base part (53) and a conductive part (54). The conductive part (54) is disposed through the base part (53). The conductive part (54) includes a first conductive end (541) and a second conductive end (542). The first conductive end (541) is electrically connected to the adapter part (7), and the second conductive end (542) is electrically connected to the circuit board (110).

10. The optical gas sensor as claimed in claim 9, characterized in that, The base part (53) is an insulating part or a metal part.

11. The optical gas sensor as claimed in claim 9, characterized in that, The photodetector (100) has a cavity (400), and the photodetector (1) and the integrated circuit chip (3) are both located in the cavity; The sidewall of the encapsulation part is at least partially the cavity wall corresponding to the cavity, and the adapter (7) is located in the cavity.

12. The optical gas sensor as claimed in claim 1, characterized in that, The adapter is connected to the encapsulation part; The photodetector (100) has a cavity (400), the sidewall of the encapsulation portion is at least partially the cavity wall corresponding to the cavity, and the adapter portion is at least partially the cavity wall corresponding to the cavity.

13. The optical gas sensor as described in claim 1, 2, 5, 7, 8, 10, 11, or 12, characterized in that, The adapter (7) includes a main body (71) and an electrical adapter (72), the electrical adapter (72) being made of a conductive material; The adapter is a silicon adapter or a glass adapter, and the electrical adapter (72) penetrates the main body (71) through a glass through-hole or silicon through-hole process; or, the adapter is a ceramic substrate or a printed circuit board, the photodetector (100) includes a conductive part (9), the conductive part (9) is a wire, the conductive part (9) is electrically connected to the photodetector (1) or the integrated circuit chip (3), the conductive part (9) is electrically connected to the adapter, and the conductive part (9) has at least a gap with the adapter (72).

14. The optical gas sensor as described in claim 1, 2, 5, 7, 8, 10, 11, or 12, characterized in that, The adapter (7) includes a first adapter (73) and a second adapter (74). The light detection unit (1) is electrically connected to the first adapter (73), and the integrated circuit chip (3) is electrically connected to the second adapter (74). Both the first adapter (73) and the second adapter (74) are electrically connected to the circuit board (110). Along the height direction of the photodetector (100), the first adapter (73) is at least partially located between the circuit board (110) and the photodetector (1), and the second adapter (74) is at least partially located between the circuit board (110) and the integrated circuit chip (3); along the direction perpendicular to the height direction of the photodetector (100), the second adapter (74) is located on one side of the first adapter (73).

15. The optical gas sensor as claimed in claim 14, characterized in that, The light detection unit (1) includes a first light detection unit (11) and a second light detection unit (12), both of which are electrically connected to the integrated circuit chip (3). The first adapter (73) includes a first sub-adapter (731) and a second sub-adapter (732). The first light detection unit (11) is physically connected to and electrically connected to the first sub-adapter (731), and the second light detection unit (12) is physically connected to and electrically connected to the second sub-adapter (732). Along a direction perpendicular to the height of the photodetector (100), the second adapter (74) is at least partially located between the first sub-adapter (731) and the second sub-adapter (732).

16. The optical gas sensor as described in claim 1, 2, 5, 7, 8, 10, 11, 12, or 15, characterized in that, The light detection unit (1) includes a first light detection unit (11) and a second light detection unit (12). Both the first light detection unit (11) and the second light detection unit (12) are electrically connected to the integrated circuit chip (3). At least one of the first light detection unit (11), the second light detection unit (12) and the integrated circuit chip (3) is installed in the adapter unit (7). Define a first direction and a second direction perpendicular to the height direction of the photodetector (100), the first direction being perpendicular to the second direction, along the first direction, the integrated circuit chip (3) being located between the first photodetector (11) and the second photodetector (12), and along the second direction, the first photodetector (11) and the second photodetector (12) being located on the same side of the integrated circuit chip (3).

17. A photodetector, characterized in that, The photodetector (100) includes: The light detection unit (1) is capable of generating a change in physical quantity under light irradiation and converting the change in physical quantity into an electrical signal. The change in physical quantity can change with the change in the concentration of the gas to be measured. An integrated circuit chip (3) is electrically connected to the photodetector (1), and the integrated circuit chip (3) is capable of processing the electrical signal; The adapter (7) includes a main body (71) and an electrical adapter (72). The electrical adapter (72) includes a conductive material and a first adapter terminal (721) and a second adapter terminal (722). The photodetector (1) and the integrated circuit chip (3) are physically and electrically connected to the first adapter terminal (721), respectively. The packaging unit (4) houses both the photodetector unit (1) and the integrated circuit chip (3).

18. The photodetector as claimed in claim 17, characterized in that, The adapter is a silicon adapter plate or a glass adapter plate, and the electrical adapter (72) penetrates the main body (71) through a glass through-hole or silicon through-hole process; or, The adapter is a ceramic substrate or a printed circuit board. The photodetector (100) includes a conductive part (9), which is a wire. The conductive part (9) is electrically connected to the photodetector (1) or the integrated circuit chip (3). The conductive part (9) is electrically connected to the adapter. The conductive part (9) has at least a gap with the adapter (72).

Images