Chip electromagnetic compatibility automatic test method and conducted radiation interference test platform

Abstract

The invention provides a chip electromagnetic compatibility automatic test method and a conducted radiation interference test platform. The method comprises the following steps: receiving a test parameter set configured by a user by using a first graphical user interface; the test parameter set comprises configuration parameters for a radiated interference test and / or a conducted interference test of the tested chip; positioning and identifying interaction elements in a second graphical user interface provided by test instrument control software of the operation instrument control end based on an image identification technology; a simulation user operation instruction is generated and executed, and test instrument control software is controlled to automatically complete test parameter setting and start a radiated interference test and / or a conducted interference test; and after the test is completed, obtaining test data output by the test instrument control software, and generating an electromagnetic compatibility test result report for the tested chip. According to the invention, the problems of separation of radiation and conduction test equipment, tedious operation, lack of integrated automatic management and control and the like in an existing chip electromagnetic compatibility test can be effectively solved.

Description

Technical Field

[0001] This application relates to the field of electronic information, and in particular to an automated testing method for electromagnetic compatibility of chips and a test platform for conducted and radiated interference. Background Technology

[0002] Since the inception of Moore's Law, the size of transistors in integrated circuits has entered the nanometer era. High-precision electronic devices have consistently pursued miniaturization and high performance from design to application. With advancements in manufacturing processes, through-silicon via (TSV) 3D integrated chips have become widely used in the electronics and information field due to their advantages such as high-density integration and high performance. However, miniaturization and process complexity pose significant challenges to their electromagnetic compatibility (EMC) testing. Accurate and effective integrated testing of radiated and conducted interference has become a critical issue that the industry urgently needs to address.

[0003] Despite some progress in domestic and international research, there are still bottlenecks in this field that urgently need to be addressed and overcome. In existing TSV chip electromagnetic compatibility testing, radiation and conduction testing equipment are separate, lacking an integrated management platform; testing generally relies on manual operation, with cumbersome parameter configuration and a high risk of human error; traditional automation solutions are mostly based on dedicated software or non-Python languages, resulting in poor compatibility and high difficulty in secondary development; some semi-automatic systems cannot achieve fully unattended operation, requiring testing to be interrupted at night when no one is present, extending the overall cycle; furthermore, existing systems lack an integrated visual interface, have a high operational threshold, and rely on external software for data processing, leading to low efficiency.

[0004] Therefore, developing an automated testing technology for chip electromagnetic compatibility testing, enabling integrated visual control of near-field scanning and conducted testing, and full automation of radiation testing, has become key to solving industry pain points. Summary of the Invention

[0005] In view of this, embodiments of this application provide an automated testing method for electromagnetic compatibility of chips and a conducted and radiated interference testing platform to eliminate or improve one or more defects existing in the prior art.

[0006] The first aspect of this application provides an automated testing method for electromagnetic compatibility (EMC) of a chip, the method comprising: The test parameter set configured by the user is received using a first graphical user interface; wherein the test parameter set includes configuration parameters for radiated interference testing and / or conducted interference testing of the chip under test; Based on image recognition technology, the system locates and identifies interactive elements in the second graphical user interface provided by the test instrument control software running on the instrument control terminal; generates and executes simulated user operation instructions based on the interactive elements and the test parameter set, and controls the test instrument control software to automatically complete the test parameter settings and start the corresponding radiated interference test and / or conducted interference test. After the test is completed, the test data output by the test instrument control software is acquired, and an electromagnetic compatibility test result report for the chip under test is generated based on the test data.

[0007] In some embodiments of this application, receiving a user-configured set of test parameters using a first graphical user interface includes: The test parameter set input by the user is received using the first graphical user interface; wherein the test parameter set is used to define the test task to be executed and includes configuration parameters for at least one of radiated interference test and conducted interference test for the chip under test. The validity of the test parameter set is verified based on a preset parameter rule base; if the verification passes, the test parameter set is stored in the preset parameter base or the current task parameter queue. The test parameter set is loaded from the preset parameter library or the current task parameter queue to start the subsequent automated testing process.

[0008] In some embodiments of this application, the step of locating and identifying interactive elements in the second graphical user interface provided by the test instrument control software running on the instrument control terminal based on image recognition technology includes: Receive scheduling instructions and obtain the active window and coordinate information from the second graphical user interface provided by the test instrument control software; A screenshot is obtained by taking a screenshot of the active window or a specified screen area in the second graphical user interface based on the coordinate information. The template matching algorithm is invoked, and a preset optimization strategy is used to match the pre-stored interactive element templates corresponding to the input and control buttons of the test parameter set with the interface screenshot to identify the interactive elements and determine the position coordinates of the interactive elements in the screen coordinate system; wherein, the optimization strategy includes at least one of the following: cropping the interface screenshot, matching the same interactive element multiple times, and dynamically adjusting the similarity threshold according to the display resolution of the second graphical user interface.

[0009] In some embodiments of this application, the step of generating and executing simulated user operation instructions based on the interactive elements and the test parameter set, and controlling the test instrument control software to automatically complete the test parameter settings and initiate the corresponding radiated interference test and / or conducted interference test, includes: Generate an operation request containing the location coordinates of the interactive element and the parameter values ​​to be input based on the test parameter set; In response to the operation request, simulated user operation instructions are generated and executed; Before or during the execution of the simulated user operation command, the application window of the control software for the test instrument is in the foreground active state. The system monitors the status indicator elements in the second graphical user interface that represent the test running status to determine the test progress, and triggers a predefined exception recovery process when an abnormal status prompt is detected.

[0010] In some embodiments of this application, the simulated user operation instructions include: Commands to control the mouse pointer to move to the position coordinates of the interactive element and simulate a click, and / or commands to control the keyboard to simulate key input, focus switching, or confirmation events to input the parameter value to be input.

[0011] In some embodiments of this application, generating an electromagnetic compatibility test result report for the chip under test based on the test data includes: The test data is subjected to filtering and / or smoothing processing; wherein the smoothing processing includes a Gaussian smoothing algorithm; The field strength distribution data of the radiated interference test and the disturbance current or voltage spectrum data of the conducted interference test are integrated into the same report, and a field strength distribution map corresponding to the field strength distribution data and a spectrum analysis map corresponding to the disturbance current or voltage spectrum data are generated; wherein, the report includes at least one of the field strength distribution map, spectrum analysis map and test setup photos.

[0012] The second aspect of this application provides a conducted and radiated interference test platform, which is communicatively connected to a control subsystem for executing the aforementioned automated chip electromagnetic compatibility test method.

[0013] A third aspect of this application provides an automated testing system for chip electromagnetic compatibility, comprising: The hardware subsystem includes a near-field scanning unit for performing radiated interference tests, a conducted test unit for performing conducted interference tests, and a signal processing unit for performing radiated interference tests and / or conducted interference tests. A control subsystem, which is communicatively connected to the hardware subsystem, is used to execute the automated chip electromagnetic compatibility testing method. The control subsystem includes: Graphical user interface control software for providing the first graphical user interface; An automated control program is used to control the test instrument control software running on the instrument control terminal using image recognition and simulation operation technology, so as to operate the hardware subsystem.

[0014] In some embodiments of this application, the automated control program includes: The process control module is used to schedule test tasks, generate scheduling instructions, generate operation requests based on test parameter sets, monitor test running status, and manage exception recovery processes. The image recognition module is used to respond to the scheduling instruction, obtain the active window and coordinate information of the second graphical user interface and take a screenshot to obtain an interface screenshot, and use a template matching algorithm and optimization strategy to identify the interactive elements in the interface screenshot and determine the position coordinates of the interactive elements in the screen coordinate system. The operation execution module is used to generate and execute simulated user operation instructions in response to the operation request; The window management module is used to manage the activation status of the application windows of the test instrument control software, ensuring that the application windows are active in the foreground.

[0015] A fourth aspect of this application provides an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the automated electromagnetic compatibility testing method for chips described in the first aspect.

[0016] The fifth aspect of this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the automated chip electromagnetic compatibility testing method described in the first aspect above.

[0017] The sixth aspect of this application provides a computer program product comprising a computer program that, when executed by a processor, implements the automated chip electromagnetic compatibility testing method described in the first aspect above.

[0018] This application provides an automated electromagnetic compatibility (EMC) testing method for chips. The method includes: receiving a user-configured set of test parameters using a first graphical user interface; wherein the test parameter set includes configuration parameters for radiated interference testing and / or conducted interference testing of the chip under test; locating and identifying interactive elements in a second graphical user interface provided by test instrument control software running on the instrument control terminal based on image recognition technology; generating and executing simulated user operation instructions based on the interactive elements and the test parameter set, controlling the test instrument control software to automatically complete the test parameter settings and start the corresponding radiated interference test and / or conducted interference test; and after the test is completed, acquiring test data output by the test instrument control software, and generating an EMC test result report for the chip under test based on the test data. By designing an electromagnetic compatibility (EMC) testing method that integrates a Python GUI visual control interface, automated programs, and radiated / conducted electromagnetic (TCM) hardware, this method can comprehensively evaluate the EMC characteristics of chips by simultaneously conducting sub-millimeter-level radiated electromagnetic tests (1GHz-6GHz) and standardized conducted electromagnetic tests (0.15GHz-1GHz). The built-in Gaussian smoothing algorithm enhances data accuracy to meet industry testing requirements. By applying automated programs to the EMC testing method, continuous 24-hour unattended radiated electromagnetic tests are achieved, reducing manual operation and monitoring costs and avoiding human error. Integrating radiated and conducted electromagnetic tests with auxiliary anti-interference equipment enables unified management of both types of tests, improving the system's compatibility, flexibility, and ease of use, and adapting to the testing needs of new TSV chips. Furthermore, the rich Python third-party libraries allow for seamless integration with Matlab and Excel, reducing the difficulty of secondary development. The conducted electromagnetic test includes reserved automation extension interfaces for future feature upgrades.

[0019] Additional advantages, objectives, and features of this application will be set forth in part in the description which follows, and will in part become apparent to those skilled in the art upon review of the following description, or may be learned by practice of the application. The objectives and other advantages of this application can be realized and obtained by means of the structures specifically pointed out in the specification and drawings.

[0020] Those skilled in the art will understand that the purposes and advantages that can be achieved with this application are not limited to those specifically described above, and that the above and other purposes that this application can achieve will be more clearly understood from the following detailed description. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, do not constitute a limitation thereof. The components in the drawings are not drawn to scale but are merely for illustrating the principles of this application. For ease of illustration and description of certain parts of this application, corresponding portions in the drawings may be enlarged, i.e., may appear larger relative to other components in an exemplary device actually manufactured according to this application. In the drawings: Figure 1 This is a flowchart illustrating an automated electromagnetic compatibility testing method for chips according to one embodiment of this application.

[0022] Figure 2 This is a schematic diagram of the radiated interference test hardware function as exemplified in this application.

[0023] Figure 3 This is a schematic diagram of the structure of conducted interference testing hardware as an example in this application.

[0024] Figure 4 This is a schematic diagram of the architecture of an automated control program as exemplified in this application.

[0025] Figure 5 This is a schematic diagram of the structure of the radiation interference platform in an application example of this application.

[0026] Figure 6 This is a schematic diagram of the structure of a conduction test unit in one embodiment of this application.

[0027] Figure 7 This is a flowchart illustrating the core code of key steps in an application example of this application.

[0028] Figure 8 This is a schematic diagram of the TSV chip in an application example of this application.

[0029] Figure 9 This is a schematic diagram of the test results after Gaussian filtering in an application example of this application.

[0030] Figure 10 This is a schematic diagram of the test results 0.7mm above the chip in an application example of this application.

[0031] Figure 11 This is a schematic diagram of the test results 1.2mm above the chip in an application example of this application.

[0032] Figure 12 This is a schematic diagram of the test results 1.7mm above the chip in an application example of this application. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the embodiments and accompanying drawings. Here, the illustrative embodiments and their descriptions are used to explain this application, but are not intended to limit it.

[0034] It should also be noted that, in order to avoid obscuring this application with unnecessary details, only the structures and / or processing steps closely related to the solution according to this application are shown in the accompanying drawings, while other details that are not closely related to this application are omitted.

[0035] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, element, step, or component, but does not exclude the presence or addition of one or more other features, elements, steps, or components.

[0036] It should also be noted that, unless otherwise specified, the term "connection" in this article can refer not only to a direct connection, but also to an indirect connection involving an intermediary.

[0037] In the following description, embodiments of the present application will be illustrated with reference to the accompanying drawings. In the drawings, the same reference numerals represent the same or similar parts, or the same or similar steps.

[0038] Currently, the industry commonly uses near-field scanning (NFS) testing methods to analyze radiated interference (EMI) issues in TSV chips, combined with the 1Ω / 150Ω direct coupling method specified in the IEC 61967-4 standard for conducted emission measurements. These two methods together constitute the core solution for TSV chip electromagnetic compatibility testing. NFS can obtain the spatial distribution characteristics of the electromagnetic field on the chip surface, while conducted emission testing comprehensively assesses the chip's EMI level by measuring the interference current at the ground pin and the interference voltage at the output port. However, in traditional testing processes, radiated and conducted emissions testing often rely on independent equipment and manual operation, resulting in low efficiency, large errors, poor continuity, and low integration. Therefore, combining automation technology to achieve coordinated control and efficient execution of these two types of tests has become a research hotspot in the industry.

[0039] China has made rapid progress in TSV technology and electromagnetic testing, forming a complete research system from structural innovation to testing method exploration. In TSV structural design, some research teams have achieved breakthroughs in heterogeneous TSV integration and packaging processes, providing support for high-reliability chip integration. Regarding electromagnetic testing technology, domestic universities have conducted in-depth research on performance optimization of near-field scanning equipment and the design of impedance matching networks for conducted testing, promoting the standardization of testing. The release of the GB / T 42968.2-2024 standard has unified the relevant measurement methods for electromagnetic radiation immunity of integrated circuits, while conducted testing can follow the IEC 61967-4 standard. In the field of automated testing, some research has attempted to apply the Application Programming Interface (Python API) to electromagnetic simulation, such as using the Python for Ansys Electronics Desktop Toolkit (PyAEDT) library to automate parameter scanning in Ansys Simulation Software (Ansys). However, in the physical testing of TSV chips for electromagnetic compatibility, there is still a lack of integrated automated solutions for radiation and conduction based on the Python Graphical User Interface (Python GUI). Most systems use separate radiation and conduction testing equipment, relying on dedicated software or non-open-source languages ​​for development, which makes secondary development difficult and hard to adapt to flexible testing needs. Existing near-field scanning platforms and conduction testing equipment are mostly semi-automatic, requiring manual intervention in parameter configuration, scan initiation, and data saving, making it impossible to achieve fully unattended operation.

[0040] Foreign countries started earlier in TSV technology and electromagnetic testing, forming a pattern of coordinated development of technology and industry. In terms of TSV applications, some companies have scaled up TSV technology for chip integration and storage products, significantly improving product performance. Regarding electromagnetic testing equipment, other companies have launched modular near-field scanning systems and conduction testing kits (such as the LANGER P603-1 / P750 RF conduction measurement kit), supporting high-frequency testing and automated data acquisition. These kits, combined with Standard Commands for Programmable Instruments (SCPI), enable programmable control and linkage. However, the core software is mostly based on the Laboratory Virtual Instrument Engineering Workbench (LabVIEW) or C++, resulting in high customization costs, complex operation, and poor coordination between radiation and conduction testing modules. In the open-source tool field, the Electromagnetic Python (EMagPy) library software implements Python GUI processing of electromagnetic induction data, but it is mainly geared towards environmental monitoring scenarios and is not optimized for the microscale radiation characteristics and conducted interference testing requirements of TSV chips, failing to meet the integrated needs of sub-millimeter-level scanning and automated conduction testing. Overall, foreign testing systems have advantages in accuracy and stability, but they also have problems such as high barriers to secondary development, tight coupling between software and hardware, low degree of integration of radiation / conduction, and high cost, making it difficult to meet the flexible testing needs of small and medium-sized enterprises and research institutions.

[0041] A conventional, separate electromagnetic compatibility (EMC) testing device comprises an independent near-field scanning platform and a conducted testing kit (such as an RF conducted measurement kit and an EMI receiver). The near-field scanning platform uses a mechanical positioning system to drive the probe to scan the chip surface, and acquires electromagnetic signals through a spectrum analyzer. Conducted testing can be based on the IEC 61967-4 standard, using a 1Ω / 150Ω direct coupling method, and measures interference signals through an RF current / voltage probe, impedance matching network, and EMI receiver. Both types of equipment require manual parameter configuration and manual start-up of the test process. Manual monitoring is required during the test, and data must be manually exported and processed after scanning. Its near-field scanning accuracy is millimeter-level, and the conducted testing frequency covers 0.15GHz-1GHz. It lacks an integrated automated control module and only supports manual operation via the device's built-in simple control panel or dedicated software.

[0042] However, this technical solution, due to its separate equipment and fully manual operation mode, results in a cumbersome and inefficient testing process. Independent configuration of radiation and conduction test parameters easily leads to inconsistencies. Different operators' habits can introduce individual errors, affecting the consistency of test results. The millimeter-level scanning accuracy cannot precisely capture the microscale electromagnetic characteristics of TSV chips, failing to meet the requirements of high-precision radiation testing. The lack of integrated automated control functions based on a Python GUI prevents unattended operation throughout the testing process, necessitating testing interruptions at night and extending the overall testing cycle. Furthermore, the equipment's anti-interference design is insufficient, making it susceptible to interference from external electromagnetic environments, and its poor scalability makes it difficult to adapt to the high-frequency testing requirements of new TSV chips. Data processing requires manual screening of abnormal data and report compilation, further increasing labor and time costs.

[0043] Another existing semi-automatic radiation / conduction combined testing system supports some parameter presets, but still requires manual initiation of scanning, switching of test tasks, and data saving. This system transmits data between the near-field scanning module and the conduction testing module via a wired connection. The near-field scanning frequency covers 1GHz-6GHz, and the conduction testing can comply with the IEC 61967-4 standard. The automation control is developed based on C++ and does not adopt a Python GUI architecture. The user interface is complex, secondary development is difficult, and it only supports limited parameter presets and single-task automated execution. Multi-task continuous testing and the coordinated management of the two types of tests still require manual intervention for switching.

[0044] However, this technical solution suffers from high data transmission latency due to its separate hardware architecture, affecting the real-time performance of tests. It lacks an integrated automated control program based on a Python GUI, preventing fully unattended testing and requiring manual intervention in key stages (such as starting scans and saving data), thus not completely eliminating reliance on manual operation. The C++-based development architecture results in poor compatibility, making seamless integration with mainstream data analysis tools (such as Matlab and Excel) difficult, and the high barrier to secondary development hinders rapid adaptation to the personalized testing needs of new TSV chips. The user interface is complex, requiring extensive training for researchers to master its operation, resulting in poor usability. Data processing lacks built-in automated smoothing algorithms, necessitating manual post-processing to filter out abnormal data, leading to low efficiency. Furthermore, the poor coordination between radiation and conduction tests, with parameter configuration and data management operating independently, increases operational complexity.

[0045] Therefore, to address the problems of separate radiation and conduction testing equipment, cumbersome operation, and lack of integrated automated control in existing chip electromagnetic compatibility (EMC) testing, this application provides an automated chip EMC testing method, a conducted and radiated interference testing platform, an automated chip EMC testing system, an electronic device, a computer-readable storage medium, and a computer program product. These components enable integrated automated control of radiation and conduction testing, improve the compatibility, flexibility, and ease of use of EMC testing methods, reduce manual operation costs and secondary development barriers, and adapt to the testing needs of new TSV chips.

[0046] The following examples will provide a detailed description.

[0047] Based on this, embodiments of this application provide an automated chip electromagnetic compatibility (EMC) testing method that can be executed by an automated chip EMC testing device. See [link to relevant documentation]. Figure 1 The method specifically includes the following: Step 100: Receive a set of test parameters configured by the user using a first graphical user interface; wherein the set of test parameters includes configuration parameters for radiated interference testing and / or conducted interference testing of the chip under test.

[0048] Specifically, the first graphical user interface is provided by the graphical user interface control software (i.e., software in the computer) in the control subsystem. It acquires the test parameter set input by the user, configures the virtual environment, and calibrates the hardware parameters. The initialization of the hardware and software environment configuration prepares for subsequent electromagnetic compatibility automated testing.

[0049] Step 200: Based on image recognition technology, locate and identify the interactive elements in the second graphical user interface provided by the test instrument control software running on the instrument control terminal; generate and execute simulated user operation instructions according to the interactive elements and the test parameter set, and control the test instrument control software to automatically complete the test parameter settings and start the corresponding radiated interference test and / or conducted interference test.

[0050] It should also be noted that the device at the instrument control end does not send instructions directly to the hardware subsystem, but instead drives the test instrument control software to control the hardware subsystem by simulating manual operation.

[0051] Understandably, firstly, the automated control program of the control subsystem automatically identifies and locates the interactive elements of the second graphical user interface of the test instrument control software (i.e., the software in the computer), such as buttons, icons, and text boxes. The specific method for obtaining the interactive elements will be described in detail in subsequent embodiments. Then, it generates and executes simulated user operation instructions (such as mouse operations, keyboard operations, text input and parameter setting operations, etc.). The specific implementation method will be described in detail in subsequent embodiments. Finally, it controls the test instrument control software to start radiated interference testing and / or conducted interference testing.

[0052] Step 300: After the test is completed, acquire the test data output by the test instrument control software, and generate an electromagnetic compatibility test result report for the chip under test based on the test data.

[0053] It should be noted that the test data is generated and saved by the test instrument control software. Subsequent processing requires reading the electromagnetic compatibility test result report from the test instrument control software. The specific implementation method for generating the electromagnetic compatibility test result report will be described in detail in the following embodiments.

[0054] As described above, the automated electromagnetic compatibility (EMC) testing method for chips provided in this application integrates a Python GUI visual control interface, an automated program, and radiation-conduction integrated hardware. This method comprehensively evaluates the EMC characteristics of chips by encompassing both sub-millimeter-level radiation testing (1GHz-6GHz) and standardized conducted testing (0.15GHz-1GHz). Furthermore, it incorporates a built-in Gaussian smoothing algorithm to improve data accuracy and meet industry testing requirements. By applying the automated program to the EMC testing method, continuous 24-hour unattended radiation testing is achieved, reducing manual operation and monitoring costs and avoiding human error. Integrating radiation and conduction hardware with auxiliary anti-interference equipment enables integrated management of both types of tests, improving the compatibility, flexibility, and ease of use of the testing system, and adapting to the testing needs of new TSV chips. Simultaneously, the rich Python third-party libraries allow for seamless integration with Matlab and Excel, reducing the difficulty of secondary development. The conducted testing provides a reserved automated expansion interface for future functional upgrades.

[0055] To further achieve integrated automated control of radiation and conducted testing, and to improve the compatibility, flexibility, and ease of use of electromagnetic compatibility testing methods, in an automated electromagnetic compatibility testing method for chips provided in this application embodiment, step 100, which involves receiving a user-configured set of test parameters using a first graphical user interface, specifically includes the following: Step 110: Receive a set of test parameters input by the user using the first graphical user interface; wherein the set of test parameters is used to define the test task to be executed and includes configuration parameters for at least one of radiated interference test and conducted interference test for the chip under test.

[0056] Step 120: Verify the validity of the test parameter set based on the preset parameter rule base; if the verification is successful, store the test parameter set in the preset parameter base or the current task parameter queue.

[0057] Step 130: Load the test parameter set from the preset parameter library or the current task parameter queue to start the subsequent automated testing process.

[0058] It should also be noted that the user inputs a set of test parameters and performs validity verification. If the parameter fails to meet the requirements, an alarm message will be issued.

[0059] To further achieve integrated automated control of radiation and conduction testing, and to improve the compatibility, flexibility, and ease of use of electromagnetic compatibility testing methods, in an automated chip electromagnetic compatibility testing method provided in this application embodiment, step 200, which involves locating and identifying interactive elements in the second graphical user interface provided by the test instrument control software running on the instrument control terminal based on image recognition technology, specifically includes the following: Step 210: Receive scheduling instructions and obtain the active window and coordinate information in the second graphical user interface provided by the test instrument control software.

[0060] Step 220: Take a screenshot of the active window or a specified screen area in the second graphical user interface based on the coordinate information to obtain an interface screenshot.

[0061] Step 230: Invoke the template matching algorithm and use a preset optimization strategy to match the pre-stored interactive element templates corresponding to the input and control buttons of the test parameter set with the interface screenshot to identify the interactive elements and determine the position coordinates of the interactive elements in the screen coordinate system; wherein, the optimization strategy includes at least one of the following: cropping the interface screenshot, matching the same interactive element multiple times, and dynamically adjusting the similarity threshold according to the display resolution of the second graphical user interface.

[0062] Specifically, the automated testing process begins with the image recognition module and window management module working together in the automated control program. The image recognition module can use a template matching algorithm based on the Open Source Computer Vision Library (OpenCV) to automatically identify interactive elements (such as buttons, icons, text boxes, etc.) in the second graphical user interface to achieve precise positioning of interface elements. The specific contents of the window management module are shown in Table 1, which can realize functions such as window recognition and activation, screenshot capture, icon positioning and clicking, and automatic input and saving of test parameters.

[0063] Table 1 Functions of the Window Management Module It should be noted that, to improve recognition efficiency and accuracy, the image recognition module employs the following optimization strategies: Region cropping: Before matching, a specified region in the screenshot is searched to narrow the search range, reduce computational load, and improve matching speed. Repeat recognition mechanism: Each target element undergoes a maximum of 3 matching attempts to reduce the risk of false recognition. Similarity threshold control: Matching results are based on similarity evaluation, with a default threshold of 0.9. This threshold can be dynamically adjusted according to different interface elements or resolutions to balance recognition accuracy and robustness.

[0064] To further achieve integrated automated control of radiated and conducted tests, and to improve the compatibility, flexibility, and ease of use of electromagnetic compatibility testing methods, an automated electromagnetic compatibility testing method for chips is provided in this application embodiment. In step 200, the step of generating and executing simulated user operation instructions based on the interactive elements and the test parameter set, and controlling the test instrument control software to automatically complete the test parameter settings and initiate the corresponding radiated interference test and / or conducted interference test, specifically includes the following: Step 240: Generate an operation request containing the position coordinates of the interactive element and the parameter values ​​to be input based on the test parameter set.

[0065] Step 250: Respond to the operation request to generate and execute simulated user operation instructions.

[0066] Step 260: Before or during the execution of the simulated user operation command, the application window of the control software for the test instrument is in the foreground active state.

[0067] Step 270: Monitor the status indicator elements in the second graphical user interface that represent the test running status to determine the test progress, and trigger the predefined exception recovery process when an abnormal status prompt is detected.

[0068] Specifically, the process control module in the automated control program schedules and coordinates with the operation execution module and window management module to process the interactive element information obtained by the image recognition module and window management module into actual operation requests (i.e., simulated user operation instructions) to achieve automatic control.

[0069] The process control module is responsible for organizing and scheduling the execution of each sub-module, realizing the automated operation, status monitoring, and exception handling of test tasks. Its main functions include: main loop management, which uses the `running_program` function to implement a loop execution mechanism, automatically and sequentially calling the window management module, image recognition module, and operation execution module to complete the test process, supporting manual termination to ensure users can safely exit the automated program at any time; test status judgment, which uses the `is_test_over` function to identify running icons on the interface to determine in real time whether the test task has been completed, ensuring that subsequent operations are executed only at appropriate times; and exception detection and automatic recovery, which uses the `check_abnormal_cases` function to monitor interface error messages or abnormal states and attempt automatic recovery, improving the stability and robustness of system operation.

[0070] To further achieve integrated automated control of radiation and conduction testing, and to improve the compatibility, flexibility, and ease of use of electromagnetic compatibility testing methods, in an automated electromagnetic compatibility testing method for chips provided in this application embodiment, the simulated user operation command in step 200 specifically includes the following: Commands to control the mouse pointer to move to the position coordinates of the interactive element and simulate a click, and / or commands to control the keyboard to simulate key input, focus switching, or confirmation events to input the parameter value to be input.

[0071] Specifically, simulated user operation commands include: mouse operations, which can be achieved by encapsulating mouse operations and executing click operations based on screen coordinates or icon center positions, enabling control of buttons, menus, and other interface elements; keyboard operations, which can use the keyboard library to simulate keyboard events, including tab switching, Enter confirmation, and shortcut key combinations, to automate form filling, interface navigation, and operation flow control; and text input and parameter setting operations, which can use the pyautogui.typewrite() function to automatically fill in test parameters and support dynamic timestamp generation, which can be used for scenarios such as experiment names and file naming.

[0072] To further achieve integrated automated management of radiation and conducted tests, and to improve the compatibility, flexibility, and ease of use of electromagnetic compatibility (EMC) testing methods, in an embodiment of this application, a chip EMC automated testing method is provided. In step 300, the generation of an EMC test result report for the chip under test based on the test data specifically includes the following content: Step 310: Perform filtering and / or smoothing processing on the test data; wherein the smoothing processing includes a Gaussian smoothing algorithm.

[0073] Step 320: Integrate the field strength distribution data of the radiated interference test and the disturbance current or voltage spectrum data of the conducted interference test into the same report, and generate a field strength distribution map corresponding to the field strength distribution data and a spectrum analysis map corresponding to the disturbance current or voltage spectrum data; wherein, the report includes at least one of the field strength distribution map, spectrum analysis map and test setup photos.

[0074] Specifically, after each task is completed, the data is automatically processed using a Gaussian smoothing algorithm, the files are named in the format of date-radiation task-number, and the test data and field strength distribution map of radiated interference test, the spectrum analysis map of conducted interference test data, and test setup photos are stored, generating a PDF report.

[0075] This application also provides a conducted and radiated interference testing platform, which is communicatively connected to a control subsystem. The control subsystem is used to execute the aforementioned automated chip electromagnetic compatibility testing method.

[0076] This application also provides an automated testing system for chip electromagnetic compatibility, which specifically includes the following: The hardware subsystem includes a near-field scanning unit for performing radiated interference tests, a conducted test unit for performing conducted interference tests, and a signal processing unit for performing radiated interference tests and / or conducted interference tests. A control subsystem, which is communicatively connected to the hardware subsystem, is used to execute the automated chip electromagnetic compatibility testing method. The control subsystem includes: Graphical user interface control software for providing the first graphical user interface; An automated control program is used to control the test instrument control software running on the instrument control terminal using image recognition and simulation operation technology, so as to operate the hardware subsystem.

[0077] It should be noted that the hardware subsystem adopts an integrated radiation and conduction architecture, with the core including a near-field scanning unit, a conduction testing unit, a signal processing module, and auxiliary equipment. The modules work together to achieve high-precision and standardized testing, providing stable hardware support for Python automation programs.

[0078] Understandably, both the graphical user interface (GUI) control software and the automated control program are hosted on the computer. The GUI control software, developed using Python, can utilize the PyQt5 framework to construct the GUI interface. It features integrated management and control of radiation / conduction testing, parameter configuration, real-time monitoring, data processing, and export functions. The operation is simple and easy to use, and it supports seamless integration with automated programs. The software adopts a modular GUI layout, comprising five main modules: test mode selection, parameter configuration, real-time monitoring, device status, and data export. The operation flow is as follows: device connection detection, test mode selection (radiation / conduction), GUI parameter configuration, test start, real-time data monitoring, automatic data processing, and data export and storage. The entire process is visualized, requiring no manual coding.

[0079] In one example, the functional block diagram of the hardware system for radiated interference testing is as follows: Figure 2 As shown, the radiated interference testing hardware system includes a signal generation module (DC power supply and vector network analyzer), a radiated field testing module (TEM chamber, i.e., transverse electromagnetic wave chamber), a near-field scanning module (near-field scanning plane), a signal acquisition module (spectrum analyzer and EMI receiver), and a signal analysis module (computer). The conducted interference testing hardware layout is as follows. Figure 3 As shown, the power supply output is connected in parallel with multiple decoupling capacitors (the other end of each decoupling capacitor is connected to the ground terminal GND of the power supply line), and the power supply is directly connected to the chip's power supply terminal. The decoupling capacitors are connected in parallel with the chip's power supply circuit, and their function is to suppress noise interference on the power line, ensuring that the test signal only reflects the chip's own conducted interference. The chip in the figure is an integrated circuit (IC), and the TSV 3D integrated chip under test is the source of conducted interference. The power supply provides the DC power supply with the operating voltage of the chip under test. The RF current probe is a dedicated probe used to collect conducted interference current in the chip's grounding circuit. The impedance matching network is a circuit network that achieves 150Ω impedance matching, adapting to the 50Ω input impedance of the test instrument. The test instrument is a device that receives and analyzes conducted interference signals.

[0080] As described above, the automated electromagnetic compatibility (EMC) testing method system for chips provided in this application, by designing an EMC testing method that integrates a Python GUI visual control interface, an automated program, and radiation-conduction integrated hardware, can comprehensively evaluate the EMC characteristics of chips by simultaneously conducting submillimeter-level radiation tests (1GHz-6GHz) and standardized conducted tests (0.15GHz-1GHz). This achieves integrated management of both types of tests, improves the compatibility, flexibility, and ease of use of the testing system, reduces manual operation costs and the threshold for secondary development, and adapts to the testing needs of new TSV chips. To further achieve integrated automated control of radiation and conducted testing, and to improve the compatibility, flexibility, and ease of use of electromagnetic compatibility testing methods, the automated control program in the chip electromagnetic compatibility automated testing system provided in this application embodiment specifically includes the following: The process control module is used to schedule test tasks, generate scheduling instructions, generate operation requests based on test parameter sets, monitor test running status, and manage exception recovery processes. The image recognition module is used to respond to the scheduling instruction, obtain the active window and coordinate information of the second graphical user interface and take a screenshot to obtain an interface screenshot, and use a template matching algorithm and optimization strategy to identify the interactive elements in the interface screenshot and determine the position coordinates of the interactive elements in the screen coordinate system. The operation execution module is used to generate and execute simulated user operation instructions in response to the operation request; The window management module is used to manage the activation status of the application windows of the test instrument control software, ensuring that the application windows are active in the foreground.

[0081] Understandably, the automated control program is developed based on the Python language, combined with OpenCV image recognition, pyautogui GUI automation and other technologies, to achieve unattended operation of the entire near-field scanning (radiation) process. The program reserves an automated extension interface for conduction testing, and the program and GUI control software share parameter configurations, supporting the automatic execution of batch radiation test tasks.

[0082] In one example, the overall architecture of the automated control program is as follows: Figure 4 As shown.

[0083] To further illustrate the embodiments of the above-described automated chip electromagnetic compatibility (EMC) testing method and system, this application also provides a specific application example of the automated chip EMC testing method. Specifically, it includes the following: The method proposed in this application deeply integrates electromagnetic compatibility (i.e., radiation and conduction) testing technology, Python GUI development technology, automation control technology, and hardware integration technology. It leverages the advantages of precise radiation testing in near-field scanning and the quantitative measurement capability of disturbance in conduction testing. Combined with the high compatibility of the Python language and rich third-party library resources, it designs an integrated automated testing solution for radiation and conduction. Through a visual interface, it enables unified configuration of parameters and collaborative management of equipment for both types of tests. Radiation testing achieves fully unattended automation, while conduction testing reserves an automation extension interface. While ensuring testing accuracy, it significantly improves testing efficiency and reduces the operational threshold.

[0084] This application addresses the shortcomings of existing TSV chip electromagnetic compatibility testing equipment, such as low integration of radiation and conduction testing, insufficient scanning accuracy, low automation, complex operation, and poor compatibility. It also addresses the problems of traditional automation solutions lacking a Python GUI visual interface, high difficulty in secondary development, and inability to achieve unattended operation of the entire near-field scanning process. The application provides an automated testing technology for a TSV 3D integrated chip electromagnetic compatibility testing platform based on a Python GUI. Through Python GUI visual control interface design, automated program development, integrated radiation and conduction hardware, and anti-interference optimization, it achieves sub-millimeter-level high-precision near-field scanning, full-band coverage of radiation testing from 1GHz to 6GHz, standardized measurement of conduction testing (0.15GHz-1GHz), and continuous 24-hour unattended radiation testing. Simultaneously, it achieves integrated management and control of both types of testing, improving the compatibility, flexibility, and ease of use of the testing system, reducing manual operation costs and the threshold for secondary development, and adapting to the testing needs of new TSV chips. The specific technical solution is as follows: I. Hardware System Design The hardware system adopts an integrated radiation-conduction architecture, with its core including a near-field scanning platform (radiation testing core), a conduction testing module, a signal processing module, and auxiliary equipment. These modules work together to achieve high-precision, standardized testing, providing stable hardware support for Python automation programs. The radiation interference platform, for example... Figure 5 As shown. The vector network signal generator / signal source provides a signal to the DUT (TSV chip), the DC power supply powers the TSV chip, the TSV chip is placed on the IC scanner, the IC scanner is controlled by a computer, the IC scanner is connected to the spectrum analyzer and the magnetic field / electric field probe, and the magnetic field / electric field probe performs signal processing on the spectrum analyzer.

[0085] The near-field scanning platform (core of radiation testing) can adopt a four-axis positioning system (X, Y, Z axes and rotary axis), with scanning accuracy down to sub-millimeter level, positioning accuracy of 20μm, and scanning range covering 400mm×600mm×120mm. It supports ±180° rotation scanning. It can be equipped with a high-resolution magnetic field probe, capable of measuring magnetic field components in the X, Y, and Z directions. The probe is fixed by an SH01 probe bracket and has anti-collision protection. It can be equipped with a T-slot worktable to accommodate TSV chips and printed circuit boards (PCBs) of different sizes. It supports universal fixtures and ground plane installation to ensure test stability. The scanning speed can reach 20mm / s (X-axis), 25mm / s (Y-axis), 10mm / s (Z-axis), and 90° / s (rotary axis), balancing testing efficiency and accuracy.

[0086] The conducted test unit is based on the IEC 61967-4 standard and can be configured with an RF conducted measurement kit (P603-1 / P750 set), an EMI receiver (ESW44 model, calibrated), an impedance matching network, and RF current / voltage probes. It supports both 1Ω direct coupling (measuring total interference current at the ground pin) and 150Ω direct coupling (measuring output port interference voltage). The 1Ω test achieves impedance matching and current acquisition through a 1Ω resistor in series, while the 150Ω test uses a dedicated impedance matching network to adapt to a 50Ω test system. The specific structure of the conducted test unit is as follows: Figure 6 As shown, DUT stands for Device Under Test; the conducted test unit includes an auxiliary power supply, excitation equipment, and a ground plane. The probe bracket is fixed to the ground plane to ensure that the test setup meets the standard requirements.

[0087] The signal processing unit includes a vector network analyzer (frequency range 300kHz-8GHz, 4 ports), a spectrum analyzer (frequency range 10kHz-7GHz, 4 ports), and a DC power supply (3 ports). The vector network analyzer generates various vector signals required for testing, providing specific excitation to the chip. The spectrum analyzer and EMI receiver respectively receive electromagnetic signals for radiated and conducted tests, realizing spectrum characteristic measurement and interference signal analysis. The DC power supply provides stable power to the circuit board under test and the test module, ensuring normal chip operation and generating electromagnetic radiation / conducted interference. Signal transmission between modules is achieved through a standard SMA (SubMiniature version A) RF connector and coaxial cable. It is equipped with a preamplifier and a BiasTee biaser to improve weak signal detection capability and power supply stability.

[0088] The hardware system also includes auxiliary equipment, specifically a computer (CPU ≥ 4 cores, memory ≥ 8GB DDR4, hard disk ≥ 500GB, 1 gigabit network port), a video camera, an emergency stop switch, a safety shield, and an integrated circuit test shielded room (calibrated). The computer is used to run Python GUI control software and automation programs, and to store test data and scan results. The camera supports visual monitoring of the test process and photographic archiving of the test setup. The emergency stop switch and the safety shield ensure safe operation of the equipment. The test shielded room provides an interference-free testing environment to ensure the accuracy of test data.

[0089] II. Working Principle 1) Working principle of radiation testing The near-field scanning platform, based on the IEC 61967-3 standard, uses a precision mechanical positioning system to control a magnetic field probe, scanning point-by-point along a preset path above the chip surface to collect local electromagnetic field intensity distribution data. The core components of the near-field scanning platform are as follows: Magnetic field probe: Essentially a miniature induction coil structure. According to Faraday's law of electromagnetic induction, a changing magnetic field passing through the coil generates an induced electromotive force. The induced voltage V in the coil satisfies the relationship between the magnetic field strength H and the induced voltage V, V = ωμNAH (ω is the angular frequency, μ is the permeability of the medium, N is the number of turns of the coil, and A is the effective area of ​​the coil). Measurements are made using both horizontal and vertical probes. , , Three-dimensional magnetic field components; Amplifier: Increases the amplitude of the microvolt / millivolt level signal sensed by the probe, improves the signal-to-noise ratio, and obtains a stable DC power supply through the Bias Tee biaser; Bias Tee biaser: Enables the separation of DC power supply and RF signal superposition, ensuring that power supply and signal transmission do not interfere with each other; Data processing: The software normalizes, interpolates, and filters the collected data, and draws 2D / 3D field strength distribution maps to realize radiation source location and characteristic analysis.

[0090] 2) Working principle of conduction test Conducted interference testing can be based on the IEC 61967-4 standard and can achieve quantitative measurement of interference through two types of methods: 1Ω direct coupling method: A 1Ω resistor is connected in series in the chip ground pin loop to achieve impedance matching between the test equipment and the ground pin, and to indirectly obtain the ground loop RF current through the voltage across the resistor, reflecting the magnitude of the chip's electromagnetic interference; 150Ω direct coupling method: A 150Ω impedance matching network (representing the statistical average value of the common-mode impedance of the harness) is used. The output port interference voltage is measured by an RF voltage probe and then adapted to a 50Ω test system via the impedance matching network. Signal acquisition: The EMI receiver receives the interference signal collected by the resistor / probe and can perform spectrum analysis and data recording according to standard limit requirements.

[0091] III. Python Automation Control Design Key steps and core code, such as Figure 7 As shown. The core functions are as follows: Integrated management and control: Supports mode switching between radiation and conduction testing, unified parameter configuration, centralized monitoring of equipment status, and enables coordinated scheduling of the two types of testing; Radiation testing functions: Visual settings for scanning parameters, scanning range, and movement strategies; supports real-time display of multiple measurement points, generation of 2D / 3D field strength distribution maps, Gaussian smoothing data processing, and export of data in multiple formats; scanning parameters include frequency range, step size, resolution bandwidth (RBW), and video bandwidth (VBW), etc. Conducted testing function: Supports 1Ω / 150Ω test method selection, test limit configuration (Level1 / Level2 / Level3), probe and impedance matching network parameter settings, and real-time display of interference current / voltage data collected by EMI receiver; Equipment Management: Integrates connection detection, status monitoring, calibration triggering, and fault alarm functions for radiation / conduction testing equipment, and displays hardware operating parameters in real time; Data management: Supports categorized storage of radiation / conduction test data, automated report generation (including test setup photos, parameter configurations, and data charts), and optimization of test data errors.

[0092] IV. Python Automation Program Development 1) Core Technology Stack Image recognition: Based on the OpenCV template matching algorithm, the test software interface elements are automatically identified and located by comparing screenshots with pre-stored templates.

[0093] GUI control: Based on the pyautogui library, mouse clicks and keyboard operations are simulated, and Win32 API is used to activate and control the position of windows, thereby completing operations such as parameter configuration.

[0094] Process control: Python scripts are used to implement logical scheduling and state management, and loguru is used for logging to facilitate debugging.

[0095] Environment Dependencies: Miniconda3 manages independent virtual environments, performs version control and isolation of third-party dependency libraries, and ensures stable operation of the system on different computers. The specific environment is as follows: Programming language / environment management: Python 3.8 and Miniconda3 can be used; Python third-party libraries that can be used include pywin32 306, pyautogui 0.9.54, OpenCV 4.8.1, pillow 10.1.0, loguru 0.7.2, PyQt5 5.15.9, numpy 1.24.3, pandas 2.0.3, matplotlib 3.7.2, scipy 1.10.1, scikit-image 0.21.0, and scikit-learn 1.2.23. Dedicated software: ChipScan-Scanner software can be used.

[0096] The dependencies of this project are managed uniformly using the environment.yml file. This file records the Python version and the names and version numbers of all required third-party libraries. By executing the commands "conda env create -fenvironment.yml" and "conda activate gui", a virtual environment named gui is automatically created and activated, and the environment initialization is completed. The key system dependencies are shown in Table 2.

[0097] Table 2 System Dependencies and Key Libraries 2) Automated processes Initialization: Start the GUI control software and automation program, detect the connection status of the radiation / conduction test equipment, and initialize the parameter configuration library.

[0098] Mode selection: The default mode is radiation test mode, but you can manually switch to conduction test mode from the GUI interface (manually perform standardized measurements).

[0099] Automated Radiation Testing: ① Parameter Loading: Loads preset radiation test parameters (e.g., scan range 40mm×40mm×8mm, step size 0.1mm, frequency 1GHz-6GHz, VBW 500Hz and RBW 200Hz, scan time 100ms); ② Task Startup: Automatically activates the scanning module. Clicking "Start Scan" controls the near-field scanning platform to scan along the preset path and collect magnetic field signals; ③ Real-time Monitoring: Monitors the scanning progress, stores test data in real time, and displays the field strength distribution synchronously in the GUI; ④ Data Processing: After scanning, automatically executes the Gaussian smoothing algorithm to remove abnormal errors; ⑤ Data Saving: Names data and field strength distribution maps in the format "Test Date-Time-Radiation" and generates a PDF report.

[0100] Multi-task switching: Repeated radiation testing process enables 24-hour unattended continuous testing.

[0101] Standardization of conduction testing: Manually start the conduction test, configure the 1Ω / 150Ω test parameters through the GUI interface, perform the measurement according to the standard procedure, and the data is automatically stored in the same report.

[0102] V. Testing of TSV Structure Filter Chips 1) Environment configuration and hardware deployment (1) Python environment configuration: Configure relevant files, import environment files, create a virtual environment and activate the GUI tool to enter the automation program operation interface; (2) Hardware deployment: Radiation testing: Place the near-field scanning platform on a shockproof and anti-static workbench, adjust the level, connect the power supply, Universal Serial Bus (USB) data cable and RF cable, and install the magnetic field probe and bias tee 706. Conducted test: Install the conducted test kit (P603-1 / P750) and EMI receiver (ESW44) in the integrated circuit test shielded room, fix the probe bracket to the ground plane, and connect the impedance matching network, RF cable and auxiliary power supply; (3) System connection: Connect the computer to the scanning platform, spectrum analyzer, EMI receiver and other equipment via USB, and configure the computer IP and spectrum analyzer (IP: 169.254.7.200) to be on the same network segment to ensure normal communication; Software deployment: Install the Python GUI control software and the ChipScan-Scanner auxiliary software. After startup, the device management module will detect all hardware and complete the initial calibration.

[0103] 2) Test Implementation Process Using a TSV structure filter chip as the test object, perform automated radiation testing and standardized conducted testing: (1) Chip mounting: Fix the TSV chip and peripheral circuit PCB board to the UH DUT universal fixture of the near-field scanning platform. For the conduction test section, connect the chip ground pin and output port according to the standard arrangement. The TSV chip is as follows: Figure 8 As shown.

[0104] (2) Environmental preparation: Turn on the test shielding room, adjust the ambient temperature to 23±5℃ and the relative humidity to 20%-80%, and preheat the equipment for 15 minutes.

[0105] (3) Parameter configuration: Radiation test: Start the GUI control software and set the automation task parameters: X / Y / Z axis scanning range 40mm×40mm×8mm, step size 0.1mm, frequency 2GHz-6GHz, RBW=2MHz, VBW=5MHz, and the scanning strategy is volumetric scanning with vertical collision detection.

[0106] Conducted test: Switch to conducted mode, select the 1Ω / 150Ω test method, configure the Level 2 limit, and set the EMI receiver parameters.

[0107] (4) Start the automated program: Run the automated program, read the preset parameters of radiation test, check the hardware connection status, and activate the radiation test mode after confirming that there are no errors.

[0108] (5) Automatic radiation scanning: The program controls the near-field scanning platform to scan along a preset path and collect the magnetic field components at 0.7 mm, 1.2 mm, and 1.7 mm above the chip. The signal and spectrum analyzer synchronously record data, automatically starting the next round of testing.

[0109] (6) Conducted standardized test: The conducted test can be started manually. The 1Ω / 150Ω test can be performed based on the IEC 61967-4 standard procedure. The EMI receiver collects the disturbance current / voltage data and automatically stores it to the system.

[0110] (7) Data processing and storage: Radiation testing: After each task is completed, the Gaussian smoothing algorithm is automatically executed to process the data, and the files are named in the format of "date-radiation task-number" to store the data and field strength distribution map.

[0111] Transmission testing: After the test is completed, the data is automatically linked to the same test report.

[0112] (8) Report generation: The program generates a test report, which includes radiation / conduction test parameters, setup photos, data charts and analysis conclusions.

[0113] (9) Task completion: After all preset radiation tasks are completed, the program logs, closes the device connection, and prompts that the test is complete.

[0114] 3) Test Results Radiation test: Magnetic field components at different heights of the TSV chip were successfully obtained. The data, with a scanning accuracy of 0.1mm, shows a clear field strength distribution and no obvious abnormal fluctuations. After Gaussian filtering, the data is as follows: Figure 9 As shown. Figure 9The magnetic field strength at 0.7mm and 2.7mm above the test chip is shown in the upper and lower halves, respectively, under different smoothing factors. X and Y are the X-axis and Y-axis directions of the plane above the device under test, respectively, and σ is the smoothing factor of Gaussian filtering.

[0115] The processed data effectively eliminates interference factors, making it suitable for electromagnetic compatibility research. The results of automated testing on multiple planes are shown below. Figure 10 , Figure 11 as well as Figure 12 As shown, Figure 10 , Figure 11 as well as Figure 12 These represent the magnetic field strength components at 0.7mm, 1.2mm, and 1.7mm above the test chip, respectively. X and Y represent the X and Y axes of the plane above the device under test, respectively, and σ is the smoothing factor of the Gaussian filter. With pre-set parameters, the test platform automatically performs parameter input and sequential scanning tests, and the test results can be effectively used for subsequent research.

[0116] The automated program enables 24-hour unattended continuous testing, reducing the overall cycle time by more than 30%, and achieving repeatability errors of less than 5% across multiple testing rounds. Conducted tests: The grounding pin disturbance current measured by the 1Ω test method meets the Level 2 limit requirements (maximum 84dBμV in the 0.15GHz-1GHz band), and the output port disturbance voltage measured by the 150Ω test method meets the Level 2 limit requirements (maximum 84dBμV in the 0.15GHz-1GHz band). The test data are stable and reliable. Integrated management and control: Radiation and conduction test data are stored in a unified report, and parameter configuration and equipment status are centrally managed, improving operational efficiency by 50% compared to separate equipment. All data is stored according to rules, and the test report contains complete test information that can be directly used for subsequent research and product evaluation.

[0117] VI. Beneficial Effects High degree of automation in radiation: The entire near-field scanning process is automated based on Python GUI, supporting 24-hour unattended operation and automatic switching of multiple sets of parameters, which greatly reduces the cost of manual operation and monitoring and avoids human error; Comprehensive testing coverage: It takes into account both submillimeter-level radiation testing (1GHz-6GHz) and standardized conducted testing (0.15GHz-1GHz) to fully evaluate the electromagnetic compatibility characteristics of chips and meet industry testing needs; High compatibility and flexibility: Python has a rich library of third-party libraries, can be seamlessly integrated with Matlab and Excel, has low difficulty in secondary development, and has reserved automated extension interfaces for transmission testing, which facilitates future function upgrades; High testing accuracy: Sub-millimeter scanning accuracy (positioning accuracy 20μm), full frequency band coverage, combined with built-in Gaussian smoothing algorithm to improve data accuracy and meet the testing requirements of microscale electromagnetic properties; Easy to operate: The GUI interface is intuitive and easy to understand. Radiation / conduction test modes can be switched with one click. Parameter configuration, progress monitoring and data export can be completed with one click. Relevant personnel can become proficient in operation after 24 hours of training. Strong anti-interference capability: The hardware design takes electromagnetic shielding into account, the test shielding room provides an interference-free environment, and the probe signal is amplified and filtered to ensure stable and reliable test data; High scalability: Modular architecture design facilitates the addition of automated testing algorithms and new testing function modules, supporting testing of new 2.5D / 3D chips.

[0118] Compared to existing technologies both domestically and internationally, this solution achieves a breakthrough in fully automated radiation testing of TSV chips using a Python GUI. Leveraging the flexibility and rich library resources of the Python language, it addresses the pain points of poor compatibility and high difficulty in secondary development inherent in traditional automation solutions. The integrated hardware architecture and control software resolve the issues of cumbersome operation and poor coordination associated with separate devices. Sub-millimeter scanning accuracy and standardized conduction testing meet the demands for high-precision and comprehensive testing. The GUI-based automated process enhances ease of operation and testing efficiency, providing a highly efficient, accurate, and flexible integrated solution for TSV chip electromagnetic compatibility testing.

[0119] The processor can be a central processing unit (CPU). The processor can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or combinations of the above types of chips.

[0120] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs, non-transitory computer-executable programs, and modules, such as the program instructions / modules corresponding to the chip electromagnetic compatibility automated testing method in the embodiments of this application. The processor executes various functional applications and data processing by running the non-transitory software programs, instructions, and modules stored in the memory, thereby implementing the chip electromagnetic compatibility automated testing method in the above method embodiments.

[0121] The memory may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created by the processor, etc. Furthermore, the memory may include high-speed random access memory and non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory may optionally include memory remotely located relative to the processor, which can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0122] The one or more modules are stored in the memory, and when executed by the processor, the automated chip electromagnetic compatibility testing method in the embodiment is executed.

[0123] In some embodiments of this application, the user equipment may include a processor, a memory, and a transceiver unit. The transceiver unit may include a receiver and a transmitter. The processor, memory, receiver, and transmitter may be connected via a bus system. The memory is used to store computer instructions, and the processor is used to execute the computer instructions stored in the memory to control the transceiver unit to send and receive signals.

[0124] As one implementation method, the functions of the receiver and transmitter in this application can be implemented by transceiver circuits or dedicated transceiver chips, and the processor can be implemented by dedicated processing chips, processing circuits or general-purpose chips.

[0125] As another implementation approach, the server provided in this application embodiment can be implemented using a general-purpose computer. That is, the program code implementing the processor, receiver, and transmitter functions is stored in memory, and the general-purpose processor implements the processor, receiver, and transmitter functions by executing the code in memory.

[0126] This application also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the steps of the aforementioned automated chip electromagnetic compatibility testing method. The computer-readable storage medium can be a tangible storage medium, such as random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, floppy disks, hard disks, removable storage disks, CD-ROMs, or any other form of storage medium known in the art.

[0127] This application also provides a computer program product, specifically including a computer program that, when executed by a processor, implements the steps of the automated chip electromagnetic compatibility testing method mentioned in the foregoing embodiments.

[0128] Those skilled in the art will understand that the exemplary components, systems, and methods described in conjunction with the embodiments disclosed herein can be implemented in hardware, software, or a combination of both. Whether implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application. When implemented in hardware, it can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this application are programs or code segments used to perform the required tasks. The programs or code segments can be stored on a machine-readable medium or transmitted over a transmission medium or communication link via data signals carried on a carrier wave.

[0129] It should be clarified that this application is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of this application is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of this application.

[0130] In this application, features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, and / or combined with or in place of features of other embodiments.

[0131] The above description is merely a preferred embodiment of this application and is not intended to limit this application. For those skilled in the art, various modifications and variations can be made to the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An automated testing method for electromagnetic compatibility of chips, characterized in that, include: The test parameter set configured by the user is received using a first graphical user interface; wherein the test parameter set includes configuration parameters for radiated interference testing and / or conducted interference testing of the chip under test; Based on image recognition technology, the system locates and identifies interactive elements in the second graphical user interface provided by the test instrument control software running on the instrument control terminal; generates and executes simulated user operation instructions based on the interactive elements and the test parameter set, and controls the test instrument control software to automatically complete the test parameter settings and start the corresponding radiated interference test and / or conducted interference test. After the test is completed, the test data output by the test instrument control software is acquired, and an electromagnetic compatibility test result report for the chip under test is generated based on the test data.

2. The automated testing method for chip electromagnetic compatibility according to claim 1, characterized in that, The step of receiving the user-configured test parameter set using the first graphical user interface includes: The test parameter set input by the user is received using the first graphical user interface; wherein the test parameter set is used to define the test task to be executed and includes configuration parameters for at least one of radiated interference test and conducted interference test for the chip under test. The validity of the test parameter set is verified based on a preset parameter rule base; if the verification passes, the test parameter set is stored in the preset parameter base or the current task parameter queue. The test parameter set is loaded from the preset parameter library or the current task parameter queue to start the subsequent automated testing process.

3. The automated testing method for chip electromagnetic compatibility according to claim 1, characterized in that, The method of locating and identifying interactive elements in the second graphical user interface provided by the test instrument control software running on the instrument control terminal based on image recognition technology includes: Receive scheduling instructions and obtain the active window and coordinate information from the second graphical user interface provided by the test instrument control software; A screenshot is obtained by taking a screenshot of the active window or a specified screen area in the second graphical user interface based on the coordinate information. The template matching algorithm is invoked, and a preset optimization strategy is used to match the pre-stored interactive element templates corresponding to the input and control buttons of the test parameter set with the interface screenshot to identify the interactive elements and determine the position coordinates of the interactive elements in the screen coordinate system; wherein, the optimization strategy includes at least one of the following: cropping the interface screenshot, matching the same interactive element multiple times, and dynamically adjusting the similarity threshold according to the display resolution of the second graphical user interface.

4. The automated testing method for chip electromagnetic compatibility according to claim 1, characterized in that, The step of generating and executing simulated user operation instructions based on the interactive elements and the test parameter set, and controlling the test instrument control software to automatically complete the test parameter settings and start the corresponding radiated interference test and / or conducted interference test, includes: Generate an operation request containing the location coordinates of the interactive element and the parameter values ​​to be input based on the test parameter set; In response to the operation request, simulated user operation instructions are generated and executed; Before or during the execution of the simulated user operation command, the application window of the control software for the test instrument is in the foreground active state. The system monitors the status indicator elements in the second graphical user interface that represent the test running status to determine the test progress, and triggers a predefined exception recovery process when an abnormal status prompt is detected.

5. The automated testing method for chip electromagnetic compatibility according to claim 1 or 4, characterized in that, The simulated user operation instructions include: Commands to control the mouse pointer to move to the position coordinates of the interactive element and simulate a click, and / or commands to control the keyboard to simulate key input, focus switching, or confirmation events to input the parameter value to be input.

6. The automated testing method for chip electromagnetic compatibility according to claim 1, characterized in that, The step of generating an electromagnetic compatibility test result report for the chip under test based on the test data includes: The test data is subjected to filtering and / or smoothing processing; wherein the smoothing processing includes a Gaussian smoothing algorithm; The field strength distribution data of the radiated interference test and the disturbance current or voltage spectrum data of the conducted interference test are integrated into the same report, and a field strength distribution map corresponding to the field strength distribution data and a spectrum analysis map corresponding to the disturbance current or voltage spectrum data are generated; wherein, the report includes at least one of the field strength distribution map, spectrum analysis map and test setup photos.

7. A conducted-radiated interference testing platform, characterized in that, A communication connection is established with a control subsystem, which is used to execute the automated electromagnetic compatibility testing method for chips according to any one of claims 1 to 6.

8. An automated testing system for electromagnetic compatibility of chips, characterized in that, include: The hardware subsystem includes a near-field scanning unit for performing radiated interference tests, a conducted test unit for performing conducted interference tests, and a signal processing unit for performing radiated interference tests and / or conducted interference tests. A control subsystem, communicatively connected to the hardware subsystem, is used to execute the automated chip electromagnetic compatibility testing method according to any one of claims 1 to 6; The control subsystem includes: Graphical user interface control software for providing the first graphical user interface; An automated control program is used to control the test instrument control software running on the instrument control terminal using image recognition and simulation operation technology, so as to operate the hardware subsystem.

9. The automated chip electromagnetic compatibility testing system according to claim 8, characterized in that, The automated control program includes: The process control module is used to schedule test tasks, generate scheduling instructions, generate operation requests based on test parameter sets, monitor test running status, and manage exception recovery processes. The image recognition module is used to respond to the scheduling instruction, obtain the active window and coordinate information of the second graphical user interface and take a screenshot to obtain an interface screenshot, and use a template matching algorithm and optimization strategy to identify the interactive elements in the interface screenshot and determine the position coordinates of the interactive elements in the screen coordinate system. The operation execution module is used to generate and execute simulated user operation instructions in response to the operation request; The window management module is used to manage the activation status of the application windows of the test instrument control software, ensuring that the application windows are active in the foreground.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements an automated chip electromagnetic compatibility testing method as described in any one of claims 1 to 6.

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