Optical sensor and electronic device

Abstract

The invention discloses an optical sensor and electronic equipment, and aims to solve the problem of optical crosstalk caused by direct leakage of light emitted by a light emitter to a light receiver and simplify the manufacturing process of the optical sensor. The optical sensor comprises a substrate, a light emitter, a light receiver, an encapsulation layer and a light absorption coating. The substrate includes a first surface. The light emitter is located on the first surface. The light receiver is located on the first surface and is spaced from the light emitter. The encapsulation layer covers the light emitter, the light receiver and the substrate, and includes a second surface facing away from the substrate. The light absorbing coating is located on at least one of the first surface and the second surface; the orthographic projection of at least part of the light absorption coating on the substrate is located between the light emitter and the light receiver.

Description

Technical Field

[0001] This application relates to the field of technology, and more particularly to an optical sensor and electronic device. Background Technology

[0002] Optical tracking sensors typically consist of a light emitter and a light receiver, which work together to transmit and receive optical information about a target. To suppress crosstalk caused by direct leakage of emitted light to the light receiver, a barrier structure is usually placed between the light emitter and the light receiver. However, the manufacturing of this barrier structure presents complex technological challenges. Summary of the Invention

[0003] This application provides an optical sensor and electronic device to at least partially solve the above-mentioned technical problems.

[0004] To achieve the above objectives, according to a first aspect of this application, an optical sensor is provided, the optical sensor comprising a substrate, a light emitter, a light receiver, an encapsulation layer, and a light-absorbing coating. The substrate includes a first surface. The light emitter is located on the first surface. The light receiver is located on the first surface and spaced apart from the light emitter. The encapsulation layer covers the light emitter, the light receiver, and the substrate, and includes a second surface facing away from the substrate. The light-absorbing coating is located on at least one of the first surface and the second surface; wherein at least a portion of the light-absorbing coating's orthographic projection onto the substrate lies between the light emitter and the light receiver.

[0005] According to a second aspect of this application, an optical sensor is also provided, the optical sensor comprising a substrate, a light emitter, a light receiver, an encapsulation layer, and a light-absorbing layer. The substrate includes a first surface. The light emitter is located on the first surface. The light receiver is located on the first surface and spaced apart from the light emitter. The encapsulation layer covers the light emitter, the light receiver, and the substrate, and includes a second surface facing away from the substrate. The light-absorbing layer is located on the second surface; wherein at least a portion of the light-absorbing layer's orthographic projection onto the substrate lies between the light emitter and the light receiver.

[0006] According to a third aspect of this application, an electronic device is provided, including the optical sensor described in any of the above embodiments.

[0007] In the optical sensor and electronic device of this application embodiment, a light-absorbing coating is located on at least one of a first surface and a second surface; wherein at least a portion of the light-absorbing coating's orthographic projection on the substrate lies between the light emitter and the light receiver. With this design, when large-angle emitted light emitted by the light emitter is reflected by the first and second surfaces within the encapsulation layer between the light emitter and the light receiver, the light-absorbing coating can absorb it, reducing the risk of crosstalk caused by the large-angle emitted light being directly reflected by the encapsulation layer and / or the substrate and then received by the light receiver. Furthermore, the light-absorbing coating can be formed by coating or printing processes, which simplifies the fabrication process of the light-absorbing coating, thereby simplifying the fabrication process of the optical sensor. It also helps to reduce the distance between the light emitter and the light receiver, mitigating the problem of reduced effective light received by the light receiver due to excessive distance between them. Attached Figure Description

[0008] Figure 1 This is a cross-sectional structural diagram of an optical sensor provided in an exemplary embodiment of this application; Figure 2 This is another cross-sectional view of the optical sensor provided in an exemplary embodiment of this application; Figure 3 This is another cross-sectional view of the optical sensor provided in an exemplary embodiment of this application; Figure 4 This is another cross-sectional view of the optical sensor provided in an exemplary embodiment of this application; Figure 5 This is another cross-sectional view of the optical sensor provided in an exemplary embodiment of this application; Figure 6 This is provided in an exemplary embodiment of this application. Figure 5 The diagram shows a planar structure of an optical sensor. Figure 7 This is another cross-sectional view of the optical sensor provided in an exemplary embodiment of this application.

[0009] Explanation of reference numerals in the attached figures: 100. Optical sensors; 1. Substrate; 11. First surface; 2. Light emitter; 21. Top surface of the first device; 3. Optical receiver; 31. Top surface of the second device; 4. Encapsulation layer; 41. Second surface; 5. Light-absorbing layer; 50. Light-absorbing coating; 51. First light-absorbing coating; 511. First side surface; 512. Second side surface; 513. Fifth side surface; 52. Second light-absorbing coating; 521. Third side surface; 522. Fourth side surface; 523. Sixth side surface; 61. First anti-reflective structure; 611. First groove; 62. Second anti-reflective structure; 621. Second roughened surface; L represents emitted light; L' represents the target light signal. M, the object to be detected. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0011] Please see Figures 1 to 7 This application provides an optical sensor 100, which can be applied to various fields such as face recognition, driver monitoring, vital sign monitoring, and gesture recognition. The optical sensor 100 includes a substrate 1, a light emitter 2, and a light receiver 3.

[0012] The substrate 1 includes a first surface 11. A light emitter 2 and a light receiver 3 are located on the first surface 11. The substrate 1 may include a printed circuit board.

[0013] The light emitter 2 is used to emit light L at a target wavelength. The emitted light L at the target wavelength can be, but is not limited to, at least one of visible light and infrared light. In one example, the emitted light L at the target wavelength includes near-infrared light. The light emitter 2 can include at least one of a light-emitting diode and a laser diode. The number of light emitters 2 can be one or more.

[0014] The optical receiver 3 is used to acquire the target optical signal L'. In some embodiments, the target optical signal L' may include a reflected optical signal, which can be obtained by the reflection of the emitted light L at the target wavelength by the object M to be detected. In this case, the optical emitter 2 and the optical receiver 3 work together to detect the features of the object M. In some embodiments, the target optical signal L' may include other signals different from the emitted light L at the target wavelength, such as ambient light signals. The optical receiver 3 may include a photosensitive chip, which may be equipped with photodiodes. The number of photodiodes in the photosensitive chip may be one or more. The number of optical receivers 3 may also be one or more.

[0015] In some embodiments, please refer to Figure 1The distance d1 between the light emitter 2 and the light receiver 3 can be 0.5 mm to 2 mm to ensure a suitable distance between them, thus mitigating the problem of light crosstalk caused by excessively close proximity and addressing the issue of excessively large distances between them leading to an overly large overall size of the optical sensor 100. Optionally, the distance between the light emitter 2 and the light receiver 3 can be 0.8 mm to 1.5 mm.

[0016] In some embodiments, the optical sensor 100 further includes an encapsulation layer 4, which covers the light emitter 2, the light receiver 3, and the substrate 1 to encapsulate and protect the light emitter 2 and the light receiver 3. The encapsulation layer 4 is transparent to ensure that the light signal of the target wavelength emitted by the light emitter 2 can pass through the encapsulation layer 4 and be emitted, and also to ensure that the target light signal can pass through the encapsulation layer 4 and be received by the light receiver 3. The encapsulation layer 4 may include at least one of silicone, epoxy resin, glass, and thermoplastic materials. The thickness of the encapsulation layer 4 may be 0.2 mm to 3 mm. The encapsulation layer 4 includes a second surface 41 facing away from the substrate 1.

[0017] In some embodiments, please refer to Figures 1 to 5 The optical sensor 100 also includes a light-absorbing layer 5, which is located on at least one of the first surface 11 and the second surface 41. At least a portion of the orthographic projection of the light-absorbing layer 5 onto the substrate 1 lies between adjacent light emitters 2 and light receivers 3. With this design, when large-angle emitted light L emitted by the light emitter 2 is reflected by the first surface 11 and the second surface 41 within the encapsulation layer 4 between the light emitter 2 and the light receiver 3, the light-absorbing layer 5 can absorb it, reducing the risk of crosstalk caused by the large-angle emitted light L being directly reflected by the encapsulation layer 4 and the substrate 1 and then received by the light receiver 3.

[0018] In some embodiments, the light-absorbing layer 5 may include a light-absorbing coating 50, which is typically formed by coating or printing processes. This simplifies the manufacturing process of the light-absorbing coating 50, thereby simplifying the manufacturing process of the optical sensor 100. It also helps to reduce the distance between the light emitter 2 and the light receiver 3, thus improving the problem that excessive distance between the light emitter 2 and the light receiver 3 leads to a reduction in the effective light received by the light receiver 3.

[0019] In one related technology, a groove is typically cut in the encapsulation layer between the light transmitter and the light receiver, and then the groove is filled with a black material to form a light-blocking structure to improve the crosstalk problem. To reduce the risk of damage to the light transmitter and receiver during the groove-cutting process, the distance between them is usually increased; however, this increased distance increases the risk of reduced effective light received by the light receiver. In another related technology, a barrier structure is set around both the light transmitter and the light receiver, with the light exit port only located above them, to improve the crosstalk problem within the encapsulation layer. However, setting a barrier structure around both the light transmitter and the light receiver is complex, and the barrier structure occupies a large space, resulting in a larger optical sensor.

[0020] However, in this application, due to the mature coating and printing processes of the light-absorbing coating 50, the formation process of the light-absorbing coating 50 is simpler and more flexible, and the distance between the light emitter 2 and the light receiver 3 does not need to be too large. Therefore, the design of the light-absorbing coating 50 in this application can improve the crosstalk problem between the light emitter 2 and the light receiver 3, simplify the manufacturing process of the light-absorbing coating 50 to simplify the manufacturing process of the optical sensor 100, and also help to reduce the distance between the light emitter 2 and the light receiver 3, improve the problem that the effective light received by the light receiver 3 is reduced due to the excessive distance between the light emitter 2 and the light receiver 3, and help to reduce the size of the optical sensor 100.

[0021] In some embodiments, please refer to Figure 1 and Figure 2 The light-absorbing coating 50 may include a first light-absorbing coating 51, which is located on the first surface 11 and between the light emitter 2 and the light receiver 3. Thus, when the emitted light L is reflected from the emitter via the second surface 41 onto the first surface 11 between the light emitter 2 and the light receiver 3, the first light-absorbing coating 51 can absorb the emitted light L reflected onto the first surface 11, reducing the risk of crosstalk caused by the emitted light L being reflected again by the first surface 11 and then received by the light receiver 3.

[0022] In some embodiments, please refer to Figure 1 and Figure 2 The first light-absorbing coating 51 can directly contact the first surface 11. This allows the first light-absorbing coating 51 to be directly formed on the first surface 11 of the substrate 1, simplifying the fabrication process. Specifically, the first light-absorbing coating 51 can be formed after the light emitter 2 and light receiver 3 are mounted on the substrate 1; alternatively, the light emitter 2 and light receiver 3 can be mounted on the substrate 1 after the first light-absorbing coating 51 is formed. Therefore, the process sequence for forming the first light-absorbing coating 51 on the first substrate 1 can be more flexible.

[0023] In some embodiments, please refer to Figure 1 and Figure 2 The light emitter 2 includes a first device top surface 21 facing away from the substrate 1. The light receiver 3 includes a second device top surface 31 facing away from the substrate 1. The distances from the first device top surface 21 to the substrate 1 and from the second device top surface 31 to the substrate 1 are both greater than the thickness of the first light-absorbing coating 51. Thus, the first light-absorbing coating 51 does not protrude from the light emitter 2 and the light receiver 3, reducing the risk of the first light-absorbing coating 51 overflowing into the areas where the light emitter 2 and the light receiver 3 are located due to excessive thickness, and also reducing the manufacturing difficulty of the first light-absorbing coating 51.

[0024] In some implementations, please refer to Figure 2 The optical sensor 100 also includes a first anti-reflection structure 61. At least one first anti-reflection structure 61 is located on the first light-absorbing coating 51, reducing the reflectivity of the first light-absorbing coating 51 to the emitted light L reflected from the encapsulation layer 4 toward the first surface 11. The first light-absorbing coating 51 absorbs more of the emitted light L reflected from the first surface 11 between the light emitter 2 and the light receiver 3. There can be multiple first anti-reflection structures 61, and the multiple first anti-reflection structures 61 can be arranged at intervals.

[0025] In some embodiments, please refer to Figure 2 The first anti-reflective structure 61 can be integrated with the first light-absorbing coating 51, that is, the first anti-reflective structure 61 is formed by utilizing the first light-absorbing coating 51, thereby eliminating the need for an additional film layer to form the first anti-reflective structure 61. The first anti-reflective structure 61 may include at least one of a first groove 611 and a first protrusion, or the first anti-reflective structure 61 may include a first roughened surface.

[0026] In some embodiments, please refer to Figure 2 The first groove 611 can be recessed into the substrate 1 from the surface of the first light-absorbing coating 51 facing away from the substrate 1. The first roughened surface can be formed by treating a portion or the entire surface of the first light-absorbing coating 51 facing away from the substrate 1.

[0027] In some embodiments, the first light-absorbing coating 51 may include a black ink layer, such that the first light-absorbing coating 51 has light-absorbing properties, and it may be formed by coating or printing processes.

[0028] In some embodiments, the thickness of the first light-absorbing coating 51 can be 20 micrometers to 80 micrometers to ensure the light absorption performance of the first light-absorbing coating 51, reduce the manufacturing difficulty of the first light-absorbing coating 51, and reduce the risk of overflow problems during the manufacturing process of the first light-absorbing coating 51. Optionally, the thickness of the first light-absorbing coating 51 can be 30 micrometers to 50 micrometers.

[0029] In some embodiments, please refer to Figure 3 and Figure 4 The light-absorbing coating 50 may also include a second light-absorbing coating 52, which is located on the second surface 41. At least a portion of the second light-absorbing coating 52 is projected onto the substrate 1 between the light emitter 2 and the light receiver 3. Thus, when the emitted light L emitted by the emitter is emitted onto the second surface 41 between the light emitter 2 and the light receiver 3, the second light-absorbing coating 52 can absorb the emitted light L emitted onto the second surface 41, reducing the risk of crosstalk caused by the emitted light L being reflected again by the second surface 41 and received by the light receiver 3.

[0030] In some embodiments, please refer to Figure 3 and Figure 4 The orthographic projection of the second light-absorbing coating 52 on the substrate 1 is located between the light emitter 2 and the light receiver 3, and the orthographic projection of the second light-absorbing coating 52 on the substrate 1 is spaced apart from the light emitter 2 and the light receiver 3. In this way, the risk of the second light-absorbing coating 52 blocking the light-emitting surface of the light emitter 2 and the light-incident surface of the light receiver 3 is reduced, ensuring that more emitted light L emitted by the light emitter 2 can be emitted outside the encapsulation layer 4, and that more target light signals L' are not absorbed by the second light-absorbing coating 52 and are received by the light receiver 3.

[0031] In some embodiments, please refer to Figure 4 The optical sensor 100 further includes a second anti-reflection structure 62, at least one of which is located between the substrate 1 and the second light-absorbing coating 52 and is in contact with the second light-absorbing coating 52. The second anti-reflection structure 62 can reduce the reflectivity of the emitted light L on the surface of the second light-absorbing coating 52, so that more emitted light L emitted towards the second surface 41 between the light emitter 2 and the light receiver 3 can be absorbed by the second light-absorbing coating 52.

[0032] In some embodiments, the second anti-reflective structure 62 is located on at least one of the encapsulation layer 4 and the second light-absorbing coating 52. Thus, the second anti-reflective structure 62 can be formed using at least one of the encapsulation layer 4 and the second light-absorbing coating 52, eliminating the need for an additional film layer and simplifying the manufacturing process of the optical sensor 100.

[0033] In some embodiments, please refer to Figure 4 The second anti-reflection structure 62 may include a second roughened surface 621, which can be formed by roughening the entire second surface 41, in which case the second anti-reflection structure 62 can be located on the entire second surface 41; or the second surface 41 of the encapsulation layer 4 between the light emitter 2 and the light receiver 3 can be locally processed to form the second roughened surface 621.

[0034] In some embodiments, the second anti-reflective structure 62 may also include at least one of a protrusion and a groove.

[0035] In some embodiments, the second light-absorbing coating 52 may include a black ink layer, thereby giving the second light-absorbing coating 52 light-absorbing properties, and may be formed by coating or printing processes.

[0036] In some embodiments, the thickness of the second light-absorbing coating 52 can be 20 micrometers to 80 micrometers to ensure the light absorption performance of the second light-absorbing coating 52, reduce the manufacturing difficulty of the second light-absorbing coating 52, and reduce the risk of overflow problems during the manufacturing process of the second light-absorbing coating 52. Optionally, the thickness of the second light-absorbing coating 52 can be 30 micrometers to 50 micrometers.

[0037] In some embodiments, please refer to Figures 5 to 7 The light-absorbing coating 50 includes both a first light-absorbing coating 51 and a second light-absorbing coating 52. The first light-absorbing coating 51 is located on the first surface 11, and at least a portion of the first light-absorbing coating 51 is located between the light emitter 2 and the light receiver 3. The second light-absorbing coating 52 is located on the second surface 41, and at least a portion of the orthographic projection of the second light-absorbing coating 52 onto the substrate 1 is located between the light emitter 2 and the light receiver 3.

[0038] It should be noted that when the light-absorbing coating 50 includes both the first light-absorbing coating 51 and the second light-absorbing coating 52, the first light-absorbing coating 51 can be formed on the first surface 11 first, then an encapsulation layer 4 covering the light emitter 2, the light receiver 3, the first surface 11 and the first light-absorbing coating 51 can be formed, and finally the second light-absorbing coating 52 can be formed on the encapsulation layer 4 using a coating process.

[0039] In some embodiments, the orthographic projection of the second light-absorbing coating 52 on the substrate 1 overlaps with the orthographic projection of the first light-absorbing coating 51 on the substrate 1. This allows the emitted light L from the light emitter 2 to be absorbed multiple times by the first light-absorbing coating 51 and the second light-absorbing coating 52 when reflected within the encapsulation layer 4, thus better improving the crosstalk problem between the light emitter 2 and the light receiver 3. It also helps to reduce the space occupied by the second light-absorbing coating 52 and the first light-absorbing coating 51 as a whole between the light emitter 2 and the light receiver 3, thereby reducing the distance between the light emitter 2 and the light receiver 3.

[0040] In some embodiments, the second light-absorbing coating 52 is spaced apart from the first light-absorbing coating 51, and the second light-absorbing coating 52 and the first light-absorbing coating 51 are separated by an encapsulation layer 4.

[0041] In some embodiments, please refer to Figure 5 and Figure 6The first light-absorbing coating 51 includes a first side surface 511 and a second side surface 512 disposed opposite to each other. The first side surface 511 and the second side surface 512 are located between the light emitter 2 and the light receiver 3. The first side surface 511 is located on the side of the first light-absorbing coating 51 closer to the light emitter 2, and the second side surface 512 is located on the side of the first light-absorbing coating 51 closer to the light receiver 3. The second light-absorbing coating 52 includes a third side surface 521 and a fourth side surface 522 disposed opposite to each other. The third side surface 521 is located on the side of the second light-absorbing coating 52 closer to the light emitter 2, and the fourth side surface 522 is located on the side of the second light-absorbing coating 52 closer to the light receiver 3. The orthographic projection of the third side surface 521 on the substrate 1 is located on the side of the first side surface 511 on the substrate 1 closer to the light receiver 3, and / or, the orthographic projection of the fourth side surface 522 on the substrate 1 is located on the side of the second side surface 512 on the substrate 1 closer to the light emitter 2. In this way, at least one of the third side 521 and the fourth side 522 of the second light-absorbing coating 52 is recessed relative to the corresponding side of the first light-absorbing coating 51, reducing the risk that the second light-absorbing coating 52 may block the light emitted by the light emitter 2 and the target light signal that the light receiver 3 needs to receive due to process deviation.

[0042] In one example, the orthographic projection of the third side 521 on the substrate 1 is located on the side of the orthographic projection of the first side 511 on the substrate 1 that is closer to the light receiver 3, and the orthographic projection of the fourth side 522 on the substrate 1 is located on the side of the orthographic projection of the second side 512 on the substrate 1 that is closer to the light emitter 2. At this time, the orthographic projection of the second light-absorbing coating 52 on the substrate 1 can be located within the orthographic projection of the first light-absorbing coating 51 on the substrate 1.

[0043] In some embodiments, the first light-absorbing coating 51 further includes a fifth side surface 513, which is connected between the first side surface 511 and the second side surface 512. The second light-absorbing coating 52 may further include a sixth side surface 523, which is connected between the third side surface 521 and the fourth side surface 522. The fifth side surface 513 and the sixth side surface 523 are coplanar with the side surfaces of the encapsulation layer 4.

[0044] In some embodiments, please refer to Figure 7 The first light-absorbing coating 51 can be located in other areas of the first surface 11 besides the light emitter 2 and the light receiver 3, reducing the risk that the emitted light L will be reflected by the first surface 11 and then received by the light receiver 3, while also simplifying the manufacturing process of the first light-absorbing coating 51.

[0045] Based on the same inventive concept, this application provides an electronic device. The electronic device can be applied to at least one of mobile smart terminals, in-vehicle displays, and smartwatches. The electronic device may include the optical sensor 100 of any of the embodiments described above.

[0046] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0047] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0048] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0049] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. An optical sensor, characterized in that, include: The substrate includes a first surface; A light emitter is located on the first surface; A light receiver is located on the first surface and spaced apart from the light emitter; An encapsulation layer covers the light emitter, the light receiver, and the substrate, and includes a second surface facing away from the substrate; as well as A light-absorbing coating is located on at least one of the first surface and the second surface; wherein at least a portion of the light-absorbing coating has its orthographic projection on the substrate located between the light emitter and the light receiver.

2. The optical sensor according to claim 1, characterized in that, The light-absorbing coating includes a first light-absorbing coating and a second light-absorbing coating; The first light-absorbing coating is located on the first surface, and at least a portion of the first light-absorbing coating is located between the light emitter and the light receiver; The second light-absorbing coating is located on the second surface, and at least a portion of the orthographic projection of the second light-absorbing coating on the substrate lies between the light emitter and the light receiver.

3. The optical sensor according to claim 2, characterized in that, The orthographic projection of the second light-absorbing coating on the substrate overlaps with the orthographic projection of the first light-absorbing coating on the substrate.

4. The optical sensor according to claim 2, characterized in that, The light emitter includes a first device top surface facing away from the substrate, and the light receiver includes a second device top surface facing away from the substrate. The distance from the first device top surface to the substrate and the distance from the second device top surface to the substrate are both greater than the thickness of the first light-absorbing coating.

5. The optical sensor according to claim 2, characterized in that, The optical sensor further includes a first anti-reflective structure, at least one of which is located on the first light-absorbing coating.

6. The optical sensor according to claim 2, characterized in that, The optical sensor further includes a second anti-reflective structure, at least one of which is located between the substrate and the second light-absorbing coating and is in contact with the second light-absorbing coating.

7. The optical sensor according to claim 6, characterized in that, The second anti-reflective structure is located in at least one of the encapsulation layer and the second light-absorbing coating.

8. The optical sensor according to claim 2, characterized in that, The first light-absorbing coating includes a first side and a second side disposed opposite to each other, the first side being located on the side of the first light-absorbing coating closer to the light emitter, and the second side being located on the side of the first light-absorbing coating closer to the light receiver; The second light-absorbing coating includes a third side and a fourth side disposed opposite to each other, the third side being located on the side of the second light-absorbing coating closer to the light emitter, and the fourth side being located on the side of the second light-absorbing coating closer to the light receiver; Wherein, the orthographic projection of the third side on the substrate is located on the side of the orthographic projection of the first side on the substrate that is closer to the light receiver, and / or, the orthographic projection of the fourth side on the substrate is located on the side of the orthographic projection of the second side on the substrate that is closer to the light emitter.

9. The optical sensor according to claim 2, characterized in that, Both the first light-absorbing coating and the second light-absorbing coating include a black ink layer; and / or, The distance between the light transmitter and the light receiver is 0.5 mm to 2 mm.

10. An optical sensor, characterized in that, include: The substrate includes a first surface; A light emitter is located on the first surface; A light receiver is located on the first surface and spaced apart from the light emitter; An encapsulation layer covers the light emitter, the light receiver, and the substrate, and includes a second surface facing away from the substrate; as well as A light-absorbing layer is located on the second surface; wherein at least a portion of the light-absorbing layer has its orthographic projection on the substrate located between the light emitter and the light receiver.

11. An electronic device, characterized in that, Includes the optical sensor according to any one of claims 1 to 9, or the optical sensor according to claim 10.

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