Supporting piece, preparation method thereof and electronic equipment

Abstract

The invention provides a supporting piece, a preparation method thereof and electronic equipment, and relates to the technical field of electronic equipment, the electronic equipment comprises the supporting piece and a display screen, a main supporting structure in the supporting piece comprises a main insulating medium and long-chain carbon fibers, and the long-chain carbon fibers are arranged in the main insulating medium in a lap joint mode in multiple directions; a first structure in the supporting piece is located on the side, away from the display screen, of the main supporting structure and comprises a first insulating medium and a first current leading-out layer, the first insulating medium makes contact with the main supporting structure and comprises a first resin matrix and first reinforcing fibers, and the first reinforcing fibers are distributed in the first resin matrix; the first current lead-out layer and the long-chain carbon fiber are separately arranged at an interval, the first current lead-out layer is partially embedded into the first insulating medium along the first direction, and the first current lead-out layer is grounded. Therefore, the overall thickness of the supporting piece is small, the conducting current can be led to the outer surface of the first current lead-out layer, and deterioration of the electromagnetic wave performance is reduced.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a support component and its preparation method, as well as an electronic device. Background Technology

[0002] With the development of technology, electronic devices are being researched and applied more and more widely in people's work and life. Among them, electronic devices equipped with displays can perform display, touch and other functions. At present, the size of displays is increasing day by day, which requires the use of support components, such as back plates, to support the display and reduce the risk of deformation, bending, warping, breakage, display abnormalities, touch failure and other problems.

[0003] In recent years, electronic devices have become increasingly thinner and smaller. To balance support strength with a slimmer profile, lightweight and high-strength carbon fiber backplates are often used as support components. Furthermore, electronic devices incorporate a variety of antennas to meet communication requirements. When these antennas operate, they radiate electromagnetic waves into space. However, due to discontinuous conductivity and dielectric losses, carbon fiber backplates can easily disturb the electromagnetic environment around the antenna, leading to deterioration in antenna radiation efficiency and consequently, reduced performance of the electronic device. Summary of the Invention

[0004] This application provides a support member and its manufacturing method, as well as an electronic device. The support member is partially embedded in a first insulating medium on the side away from the display screen by setting a first current lead-out layer along a first direction. While ensuring good support performance, the overall thickness of the support member can be relatively thin. At the same time, the conduction current generated by electromagnetic waves in the support member will be led to the outer surface of the first current lead-out layer, which can reduce the deterioration of electromagnetic wave performance.

[0005] To achieve the above objectives, this application adopts the following technical solution: In a first aspect, a support member for an electronic device is provided, the electronic device further including a display screen, the support member being attached to the backlight side of the display screen, the support member including: a main support structure and a first structure, the main support structure including a main insulating medium and long-chain carbon fibers, the long-chain carbon fibers being overlapped and arranged in the main insulating medium in multiple directions; the first structure being located on the side of the main support structure away from the display screen, the first structure including a first insulating medium and a first current lead-out layer, the first insulating medium being in contact with the main support structure, the first insulating medium including a first resin matrix and a first reinforcing fiber, the first reinforcing fiber being distributed in the first resin matrix, the first current lead-out layer being separate from and spaced apart from the long-chain carbon fibers, the first current lead-out layer being partially embedded in the first insulating medium along a first direction, the first current lead-out layer being grounded; wherein, the first direction is a direction parallel to the thickness direction of the support member.

[0006] This application provides a support member in which a first current-leading layer is partially embedded in a first insulating medium along a first direction, making the entire support member thinner in the first direction compared to existing carbon fiber backing plates made entirely of carbon fiber. Simultaneously, the first current-leading layer can divert the conductive current induced by electromagnetic waves in the support member from its surface, preventing the conductive current from entering the support member's interior, especially from penetrating the carbon fiber. This reduces electromagnetic wave performance degradation, shortens the conductive path, and optimizes electrostatic discharge and grounding return performance. Furthermore, the long-chain carbon fibers in the main support structure, combined with the first reinforcing fiber in the first structure and the resin matrix, ensure that the support member has sufficient elastic modulus and rigidity.

[0007] In one possible implementation of the first aspect, the first structure further includes a second current lead-out layer located on at least a portion of the outer surface surrounding the first insulating medium.

[0008] In this implementation, the second current extraction layer can also extract the conduction current generated by the electromagnetic wave in the support to its surface.

[0009] In one possible implementation of the first aspect, the support member further includes a second structure located between the main support structure and the display screen. The second structure includes a second insulating medium and a third current lead-out layer. The second insulating medium includes a second resin matrix and a second reinforcing fiber, and the second reinforcing fiber is distributed in the second resin matrix. The second insulating medium is in contact with the main support structure, the third current lead-out layer is separate from and spaced apart from the long-chain carbon fiber, the third current lead-out layer is partially embedded in the second insulating medium along the first direction, the third current lead-out layer covers the entire second insulating medium, and / or, the third current lead-out layer is in contact with the main support structure, the third current lead-out layer is completely embedded in the second insulating medium along the first direction, and the third current lead-out layer covers the entire main support structure.

[0010] In this implementation, the third current extraction layer can also extract the conduction current generated by the electromagnetic wave in the support to it.

[0011] In one possible implementation of the first aspect, the second structure further includes a fourth current lead-out layer located on at least a portion of the outer surface surrounding the second insulating medium.

[0012] In this implementation, the fourth current extraction layer can also extract the conduction current generated by the electromagnetic wave in the support to its surface.

[0013] In one possible implementation of the first aspect, the first structure further includes a fifth current lead-out layer, which is embedded in the first insulating medium along a first direction. The fifth current lead-out layer is in contact with the main support structure, and the fifth current lead-out layer is separate from and spaced apart from the first current lead-out layer.

[0014] In this implementation, the fifth current extraction layer can also extract the conduction current generated by the electromagnetic wave in the support to it.

[0015] In one possible implementation of the first aspect, there are multiple main support structures, and the support also includes a third structure. The third structure includes a third insulating medium and a sixth current lead-out layer. The third insulating medium is located between any adjacent main support structures and is in contact with the main support structures. The third insulating medium includes a third resin matrix and a third reinforcing fiber, and the third reinforcing fiber is distributed in the third resin matrix. The sixth current lead-out layer is completely embedded in the third insulating medium along the first direction. The sixth current lead-out layer is separate from and spaced apart from the main support structures.

[0016] In this implementation, the sixth current extraction layer can also extract the conduction current generated by the electromagnetic wave in the support to it.

[0017] In one possible implementation of the first aspect, the third structure further includes a seventh current lead-out layer, which is embedded in the third insulating medium along the first direction. The seventh current lead-out layer is in contact with the main support structure, and the seventh current lead-out layer is separate from and spaced apart from the sixth current lead-out layer.

[0018] In this implementation, the seventh current extraction layer can also extract the conduction current generated by the electromagnetic wave in the support to its surface.

[0019] In one possible implementation of the first aspect, the third structure further includes an eighth current lead-out layer located on at least a portion of the outer surface surrounding the third insulating medium.

[0020] In this implementation, the eighth current extraction layer can also extract the conduction current generated by the electromagnetic wave in the support to its surface.

[0021] In one possible implementation of the first aspect, the number of main support structures is even.

[0022] In this implementation, the symmetrical structure prevents the support from unidirectional warping and uneven internal stress loading, resulting in a low risk of delamination failure. At the same time, the support as a whole works together to bear the load, improving the overall bending stiffness and torsional stiffness, significantly optimizing the structural strength, and also providing lightweight, high strength, and deformation resistance.

[0023] In one possible implementation of the first aspect, the support further includes a connecting layer located on at least a portion of the outer surface of the main support structure, the connecting layer being made of a conductive material.

[0024] In this implementation, the connecting layer can be connected to at least one of the first to eighth current lead-out layers to achieve electrical connection of multiple current lead-out layers, and can also lead the conduction current generated by electromagnetic waves in the support to the surface.

[0025] In one possible implementation of the first aspect, the support further includes a protective layer located on the side of the first structure away from the main support structure. The protective layer has a groove that exposes a portion of the first current lead-out layer, and the exposed first current lead-out layer is grounded.

[0026] In this implementation, the protective layer can prevent the first current lead-out layer from being corroded by external moisture, oxygen, etc., and is also drop-proof, so as to ensure the structural and performance stability of the support component.

[0027] In one possible implementation of the first aspect, the support further includes a fourth insulating medium located between the main support structure or the third current lead-out layer and the display screen. The fourth insulating medium includes a fourth resin matrix and a fourth reinforcing fiber, with the fourth reinforcing fiber distributed in the fourth resin matrix.

[0028] In this implementation, the symmetrical structure can minimize unidirectional warping and uneven internal stress during the hot pressing process, resulting in a low risk of delamination failure. At the same time, the support components work together to bear the load, improving the overall bending and torsional stiffness, significantly optimizing the structural strength, and also providing lightweight, high strength, and deformation resistance.

[0029] In one possible implementation of the first aspect, the resistivity of the first current lead-out layer, the resistivity of the second current lead-out layer, the resistivity of the third current lead-out layer, the resistivity of the fourth current lead-out layer, the resistivity of the fifth current lead-out layer, the resistivity of the sixth current lead-out layer, the resistivity of the seventh current lead-out layer, and the resistivity of the eighth current lead-out layer are all less than or equal to 10. -3 Ω•m.

[0030] In this implementation, while the supporting components achieve structural rigidity and thinness, the radiator is guaranteed to have requirements such as low loss, high efficiency, wide bandwidth, low interference, and low heat generation, and the communication signal quality is excellent.

[0031] In one possible implementation of the first aspect, the materials of the first current lead-out layer, the second current lead-out layer, the third current lead-out layer, the fourth current lead-out layer, the fifth current lead-out layer, the sixth current lead-out layer, the seventh current lead-out layer, and the eighth current lead-out layer all include any one of metal and conductive paste.

[0032] In this implementation, these materials are simple to obtain, have good performance, are easy to prepare, and all have good current guiding effect.

[0033] In one possible implementation of the first aspect, the electronic device further includes a mid-frame surrounding the support and the display screen, and a first current lead-out layer connected to the mid-frame.

[0034] In this implementation, the support component is grounded after being connected to the middle frame, which can form a stable ground return path, optimize the radiation emission performance of electronic devices using the support component, and quickly discharge static electricity, high-frequency interference signals and surge pulses, thereby achieving protection functions such as electrostatic discharge, electromagnetic shielding and electromagnetic interference resistance.

[0035] In one possible implementation of the first aspect, the electronic device further includes a radiating element that surrounds the support and the display screen, with a gap between the radiating element and the support and the display screen.

[0036] In this implementation, the first current extraction layer can divert the conduction current induced in the support by the electromagnetic waves emitted by the radiating component during operation from its surface, so that the conduction current hardly enters the interior of the support, especially not into the carbon fiber. Since the first current extraction layer does not participate in electromagnetic wave loss, it can reduce the performance degradation of the radiating component, shorten the conductive path, optimize the electrostatic discharge and grounding return performance, and enhance the electrostatic discharge protection and electromagnetic compatibility of electronic equipment.

[0037] In one possible implementation of the first aspect, the first resin matrix, the second resin matrix, the third resin matrix, and the fourth resin matrix all include at least one of epoxy resin, styrene-acrylic resin, and bismaleimide resin.

[0038] In this implementation, the resins are adhesive before curing, which allows for good adhesion without the need for additional adhesive, and the adhesion is good after curing with a low risk of falling off.

[0039] In one possible implementation of the first aspect, the first insulating medium, the second insulating medium, the third insulating medium, and the fourth insulating medium are all the same.

[0040] This implementation method is simple to prepare and saves costs.

[0041] In a second aspect, a method for manufacturing a support member for an electronic device is provided, the electronic device further including a display screen, the support member being attached to the backlight side of the display screen, the method for manufacturing the support member comprising: Obtain a semi-cured first structure and a semi-cured main support structure, and then stack the semi-cured first structure and the semi-cured main support structure along the first direction; A hot-pressing process is used to hot-press and cure the semi-cured first structure and the semi-cured main support structure to form a support component. The support component includes a main support structure and a first structure. The main support structure includes a main insulating medium and long-chain carbon fibers. The long-chain carbon fibers are overlapped and arranged in the main insulating medium in multiple directions. The first structure is located on the side of the main support structure away from the display screen. The first structure includes a first insulating medium and a first current lead-out layer. The first insulating medium is in contact with the main support structure. The first insulating medium includes a first resin matrix and a first reinforcing fiber. The first reinforcing fiber is distributed in the first resin matrix. The first current lead-out layer is separate from and spaced apart from the long-chain carbon fibers. The first current lead-out layer is partially embedded in the first insulating medium along a first direction. The first current lead-out layer is grounded. The first direction is parallel to the thickness direction of the support component.

[0042] This application provides a method for preparing a support component, which is simple to implement and beneficial for industrial production and application.

[0043] In one possible implementation of the second aspect, the semi-cured first structure includes a semi-cured first insulating medium, a first current-leading layer, and a second current-leading layer, and obtaining the semi-cured first structure includes: Obtain a pre-cured first insulating medium; wherein the size of the pre-cured first insulating medium is larger than the size of the semi-cured first insulating medium; A first current lead-out layer is partially embedded in a pre-cured first insulating medium along a first direction, and a first through hole is opened along the first direction in the portion of the pre-cured first insulating medium that is larger than the semi-cured first insulating medium. A second current lead-out layer is set in the first through hole, and then the portion of the pre-cured first insulating medium that is larger than the semi-cured first insulating medium except for the second current lead-out layer is removed to form a semi-cured first structure.

[0044] In this implementation method, the first via is simple and easy to implement, which is beneficial for industrial production and application.

[0045] In one possible implementation of the second aspect, the support further includes a connecting layer, and obtaining the semi-cured main support structure includes: Obtain a pre-cured main support structure; wherein the size of the pre-cured main support structure is larger than the size of the semi-cured main support structure; A second through hole is opened along the first direction in the part of the pre-cured main support structure that is larger than the semi-cured main support structure, and a connecting layer is set in the second through hole. Then, the part of the pre-cured main support structure that is larger than the semi-cured main support structure except for the connecting layer is removed to form a semi-cured main support structure.

[0046] In this implementation method, the second via is simple and easy to implement, which is beneficial for industrial production and application.

[0047] Thirdly, an electronic device is provided, comprising a support member as described in the first aspect or any possible implementation thereof, or a support member prepared by a method for preparing a support member as described in the second aspect or any possible implementation thereof.

[0048] This application provides a support component, its manufacturing method, and an electronic device. By embedding a first current-leading layer partially into a first insulating medium along a first direction, the thickness of the entire support component in the first direction can be reduced, thereby enabling lightweight and ultra-thin stacking designs for electronic devices using this support component. Simultaneously, the first current-leading layer can divert the conduction current induced by electromagnetic waves in the support component from its surface, preventing the conduction current from entering the interior of the support component, especially the carbon fiber. This reduces electromagnetic wave performance degradation, shortens the conductive path, optimizes electrostatic discharge and grounding return performance, and enhances the electrostatic discharge protection and electromagnetic compatibility of the electronic device. Furthermore, the long-chain carbon fiber in the main support structure, combined with the first reinforcing fiber in the first structure and the resin matrix, ensures that the support component has sufficient elastic modulus and rigidity, thereby suppressing display screen wrinkles and warping, ensuring excellent overall performance of electronic devices using this support component, and improving the yield of both the support component and the electronic device. Attached Figure Description

[0049] Figure 1 A schematic diagram of a carbon fiber backing plate provided for related technologies; Figure 2 A schematic diagram of another carbon fiber backsheet provided for related technologies; Figure 3 This is a schematic diagram of the structure of a dual-folding screen mobile phone provided in an embodiment of this application; Figure 4 This is a schematic diagram of another dual-folding screen mobile phone provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of another dual-folding screen mobile phone provided in an embodiment of this application; Figure 6 for Figure 5 A schematic diagram of the structure of the back panel of the display screen, the polyimide substrate, and the first antenna; Figure 7 This is a schematic diagram of the structure of a first type of electronic device provided in an embodiment of this application; Figure 8 This is a schematic diagram of the structure of a second electronic device provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a third electronic device provided in an embodiment of this application; Figure 10 This is a schematic diagram of the structure of the fourth electronic device provided in the embodiments of this application; Figure 11 This is a schematic diagram of the structure of the fifth electronic device provided in the embodiments of this application; Figure 12 This is a schematic diagram of the structure of the sixth electronic device provided in the embodiments of this application; Figure 13 This is a schematic diagram of the structure of the seventh electronic device provided in the embodiments of this application; Figure 14 This is a schematic diagram of the structure of the eighth electronic device provided in the embodiments of this application; Figure 15 This is a schematic diagram of the structure of the ninth electronic device provided in the embodiments of this application; Figure 16 This is a schematic diagram of the structure of the tenth electronic device provided in the embodiments of this application; Figure 17 A schematic diagram of the structure of the eleventh electronic device provided in the embodiments of this application; Figure 18 This is a schematic diagram of the structure of the twelfth type of electronic device provided in the embodiments of this application; Figure 19 This is a schematic diagram of the structure of the thirteenth electronic device provided in the embodiments of this application; Figure 20 This is a schematic diagram of the structure of the fourteenth electronic device provided in the embodiments of this application; Figure 21 This is a schematic diagram of the structure of the fifteenth type of electronic device provided in the embodiments of this application; Figure 22 This is a schematic diagram of the structure of the sixteenth type of electronic device provided in the embodiments of this application; Figure 23 This is a schematic diagram of the structure of the seventeenth type of electronic device provided in the embodiments of this application; Figure 24 This is a schematic diagram of the structure of the eighteenth type of electronic device provided in the embodiments of this application; Figure 25 This is a schematic diagram of the structure of the nineteenth type of electronic device provided in the embodiments of this application; Figure 26 This is a schematic diagram of the structure of the twentieth electronic device provided in the embodiments of this application; Figure 27 This is a schematic diagram of the structure of the twenty-first electronic device provided in the embodiments of this application; Figure 28 This is a schematic diagram of the structure of the twenty-second type of electronic device provided in the embodiments of this application; Figure 29 This is a schematic diagram of the structure of the twenty-third type of electronic device provided in the embodiments of this application; Figure 30This is a schematic diagram of the structure of the twenty-fourth electronic device provided in the embodiments of this application; Figure 31 This is a schematic diagram of the structure of the twenty-fifth type of electronic device provided in the embodiments of this application; Figure 32 This is a schematic diagram of the structure of the twenty-sixth type of electronic device provided in the embodiments of this application; Figure 33 This is a schematic diagram of the structure of the twenty-seventh type of electronic device provided in the embodiments of this application; Figure 34 This is a schematic diagram of the structure of the twenty-eighth type of electronic device provided in the embodiments of this application; Figure 35 This is a schematic diagram of the structure of the twenty-ninth electronic device provided in the embodiments of this application; Figure 36 This is a schematic diagram of the structure of the thirtieth electronic device provided in the embodiments of this application; Figure 37 This is a schematic diagram of the structure of the thirty-first electronic device provided in the embodiments of this application; Figure 38 A process flow diagram for the fabrication of a support component provided in this application embodiment; Figure 39 A schematic diagram of the structure of a first current lead-out layer and a first insulating medium provided in an embodiment of this application; Figure 40 This is a schematic diagram of another structure of the first current lead-out layer and the first insulating medium provided in an embodiment of this application; Figure 41 This is a process flow diagram of a second current lead-out layer embedded in a first insulating medium, provided for an embodiment of this application. Detailed Implementation

[0050] The technical solutions in the embodiments of this application will be clearly and thoroughly described below with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B; the word "and / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can be represented as: A existing alone, A and B existing simultaneously, and B existing alone.

[0051] Hereinafter, the terms “first,” “second,” “third,” “fourth,” “fifth,” “sixth,” “seventh,” “eighth,” etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined with “first,” “second,” “third,” “fourth,” “fifth,” “sixth,” “seventh,” and “eighth,” etc., may explicitly or implicitly include one or more of that feature.

[0052] In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more, and "at least one" means one or more.

[0053] First, some terms used in the embodiments of this application will be explained to enable those skilled in the art to better understand them.

[0054] Computer numerical control (CNC) refers to the technology of controlling machine tool movement through computer programs to achieve automated cutting, engraving, and machining.

[0055] Skin depth refers to the depth to which an electromagnetic wave penetrates a good conductor when the electromagnetic field strength (amplitude of electric or magnetic field) decays from the surface to 1 / e of the surface value.

[0056] The elastic modulus is a mechanical property of solid materials. It refers to the ratio of the stress on a material to the corresponding strain. It is used to measure the stiffness of a material when tensile, compressive, bending, torsional, or shear forces are applied.

[0057] Laser direct structuring (LDS) technology can be used to chemically plate copper onto plastic housings after laser activation of the areas, forming antennas. It is suitable for manufacturing three-dimensional (3D) antenna structures.

[0058] Laser modified ceramic (LMC) technology can be used to change the surface structure of ceramic substrates with lasers to achieve the metallization of antenna circuits, and is suitable for high-frequency and high-power devices.

[0059] Laser ablation patterning (LAP) uses a laser to remove the metal layer on the surface of a material to form an antenna pattern.

[0060] Additive manufacturing process (AMP) can be used to manufacture antennas or waveguides with complex geometries, making it suitable for rapid prototyping or customized designs.

[0061] Electroless plating (EPP) is a key step in antenna metallization. It deposits a metal layer on the surface of a substrate through a chemical reaction without an applied current.

[0062] Etching technology systems (ETS) can remove excess metal through chemical or plasma etching to form fine antenna circuitry.

[0063] Embedded trace substrate (ETS) technology is a manufacturing technique that embeds the current lead-out layer directly into the insulating medium.

[0064] The embedded pattern process (EPP) is a process in which the current lead-out layer pattern is pre-embedded in the inner layer of a multilayer insulating medium, and the fully embedded structure is achieved through lamination.

[0065] Coreless substrate technology is a technique that removes the core from traditional substrates and forms an ultra-thin packaging substrate by stacking microvia wiring layers one by one. This fundamentally achieves thinning, weight reduction, and improved electrical performance.

[0066] The above is a brief introduction to some of the terms involved in the embodiments of this application, which will not be repeated below.

[0067] Before providing a detailed explanation of the supporting components provided in the embodiments of this application, the application scenarios involved in the embodiments of this application will be introduced first.

[0068] With the development of technology, electronic devices have become indispensable tools in people's work and life. Today, electronic devices are increasingly diverse in type and function. For example, foldable designs can reduce the overall size and improve portability when folded, while providing a larger display area when unfolded, balancing ergonomics with a large-screen visual experience. As a result, foldable phones, foldable tablets, and other foldable electronic devices have emerged and are receiving increasing research and application.

[0069] Foldable electronic devices typically include multiple relatively foldable bodies and folding structures connecting the bodies, enabling the display screen in the foldable electronic device to switch between a folded state and an unfolded state. The following section uses a foldable mobile phone as an example, with a support component serving as the back panel of the display screen in the foldable mobile phone, to specifically explain the support component in related technologies.

[0070] Currently, displays are becoming increasingly functional and larger in size, significantly improving their information capacity and operating space. However, for foldable displays, there is a conflict between their increased size and structural support requirements. Specifically, the larger the foldable display area, the weaker its own rigidity, necessitating reliance on other structures, such as a back panel, to provide sufficient strength and support. This ensures the flatness and reliability of the foldable display during use, minimizing deformation and collapse. Therefore, the back panel is typically located below the foldable display and above the mid-frame. This allows the back panel to support the foldable display, motherboard, battery, camera components, etc., without affecting the normal display, while also contributing to the overall aesthetics and appearance of the device.

[0071] As electronic devices become increasingly thinner and smaller, carbon fiber back panels are often used as display screen back panels in order to balance structural strength and thinness. Figure 1 and Figure 2 A carbon fiber backplate 01 from the related technology is shown respectively. For example... Figure 1 and Figure 2 As shown, the carbon fiber backing plate 01 comprises seven sublayers: a four-layer first sublayer 011 and a three-layer second sublayer 012. Each sublayer includes long-chain carbon fibers and resin. The diameter of each long-chain carbon fiber is approximately 8μm to 10μm. Figure 1 The total thickness of the provided carbon fiber backing plate 01 is approximately 56μm to 70μm. Therefore, the more sublayers there are, the thicker the total thickness.

[0072] It should be noted that, Figure 1 and Figure 2 The only difference between the first sublayer 011 and the second sublayer 012 is the direction of extension of the long-chain carbon fibers. For example, in the first sublayer 011, the long-chain carbon fibers extend at 0°, while in the second sublayer 012, they extend at 90°. Furthermore, Figure 2 and Figure 1 The difference also lies in: Figure 2 A resin layer 013 is also provided, located between the first sub-layer 011 and the second sub-layer 012, mainly serving an adhesive function. The thickness of the resin layer 013 formed after the single-layer resin has cured is less than or equal to 10 μm. This resin layer is then added... Figure 1 The total thickness of the carbon fiber backing plate 01 can be obtained. Figure 2 The total thickness of the carbon fiber backing plate 01.

[0073] Therefore, the carbon fiber backplate 01, which plays a better supporting role in the relevant technology, has a relatively thick total thickness.

[0074] Furthermore, the carbon fiber backplate 01 is typically integrated with the foldable display, and is generally positioned on the side of the foldable display closer to the mid-frame. In this case, the edge area of ​​the carbon fiber backplate 01 offers minimal signal radiation obstruction, making it an optimal location for signal radiation. Therefore, antenna components, such as cellular, Wi-Fi, and millimeter-wave antennas, are usually placed near the edge area of ​​the carbon fiber backplate 01 to ensure signal transmission and reception efficiency and reduce the impact of hand-held obstruction, thus better meeting communication requirements. However, when the antenna components operate and radiate signals, due to the high resistivity and anisotropy of carbon fiber, the electromagnetic waves radiated by the antenna components induce a conduction current in the carbon fiber backplate 01. Since carbon fiber has low conductivity and a large skin depth, this conduction current penetrates deep into the carbon fiber backplate 01, increasing losses and severely affecting the radiation efficiency of the antenna components. This, in turn, affects the communication quality and signal stability of the foldable phone.

[0075] Currently, a coating layer 111 of a certain thickness is typically added to the outside of the carbon fiber backplane 01, and the thickness of the coating layer 111 is set to be greater than the skin depth of the operating frequency band. This allows the conducted current to be guided to the coating layer 111 for transmission, thereby reducing the loss of the antenna components and maintaining the performance of the carbon fiber backplane 01. Traditional coating methods include, but are not limited to, physical vapor deposition (PVD) on the outer surface of the carbon fiber backplane 01 and coating with copper foil containing thermosetting adhesive. Among them, PVD can achieve a nickel (Ni)-silver (Ag)-Ni coating, and the total thickness of the Ni-Ag-Ni stack is generally about 0.5 μm; while the thickness of the thermosetting adhesive and the copper foil is usually about 15 μm, that is, the total thickness of the copper foil containing thermosetting adhesive is at least about 30 μm. In other words, the overall thickness of the coating 111 on the outer surface of the carbon fiber backplate 01 is generally quite thick. When used together with the already thick carbon fiber backplate 01, the overall thickness of the two is even greater, requiring a larger and more significant amount of space within the electronic device. For example, it occupies some space that could have been used for the battery, leading to a need to reduce the battery size, otherwise it might not fit. However, smaller batteries typically don't have very large capacities. To minimize the impact on battery capacity and enable long battery life for foldable phones, most existing coatings 111 are designed to deliberately avoid the battery area. This requires thinning the structure formed by the carbon fiber backplate 01 and the coating 111, for example, by reducing the thickness of the carbon fiber backplate 01. However, this introduces new problems. Based on traditional processes, it's practically impossible to place antenna components on the edges of a thin carbon fiber backplate 01. Conversely, if antenna components are forcibly placed, it might be impossible to form the coating 111 on the outer surface of the carbon fiber backplate 01. All of these factors are detrimental to the performance of foldable phones.

[0076] Table 1 shows the over-the-air (OTA) performance of the carbon fiber backing plate 01 with different coatings 111 on different surfaces in the related technology. It should be noted that the OTA performance includes the power, efficiency, gain, etc. of the OTA radiation.

[0077] Table 1

[0078] In Table 1, B3 is an abbreviation for Band 3 of 4G LTE, and B1 is an abbreviation for Band 1 of 4G LTE. Uplink (UL) represents the transmission frequency band from the foldable phone to the base station. The uplink frequency of B3 is 1.71GHz~1.78GHz, and the uplink frequency of B1 is 1.92GHz~1.98GHz. Decibels (dB) are logarithmic relative units, representing the relative loss of components such as antennas.

[0079] Based on the simulation data in Table 1, the OTA performance of foldable phones at mid-frequency and high-frequency bands, evaluated with a coating thickness of 5μm (sufficiently thick to provide continuous shielding and electromagnetic wave reflection) and a carbon fiber backplate thickness of 150μm, is as follows: double-sided and side-mounted full coatings, single-sided and side-mounted full coatings, double-sided full coatings, and single-sided full coating. At even higher frequencies, the OTA performance of foldable phones deteriorates more severely. Furthermore, for example, with a single-sided full coating, using a carbon fiber backplate 01 still results in an approximately 0.3dB decrease in antenna efficiency compared to using a titanium alloy backplate.

[0080] In summary, the carbon fiber backplate 01 of the relevant technology cannot balance thickness and electromagnetic shielding effect, resulting in poor performance of foldable phones that use it.

[0081] Based on the above, this application provides a support member that, compared with the carbon fiber backplate in related technologies, retains some carbon fiber to provide good support strength while using an insulating medium composed of reinforcing fibers to replace part of the carbon fiber in the carbon fiber backplate. A first current-leading layer, which does not contact the carbon fiber, is provided at least on the side of the carbon fiber away from the display screen. The first current-leading layer and the insulating medium together provide good support. Simultaneously, because the proportion of carbon fiber is small and the conductivity of the reinforcing fibers is low, the support member can approach the skin depth of the corresponding frequency. Thus, the conduction current generated by electromagnetic waves passing through the support member will mostly pass through the surface of the first current-leading layer and will not enter the interior of the support member, let alone penetrate deep into the carbon fiber. This significantly reduces electromagnetic wave loss, minimizes the impact on radiation efficiency, and maintains the communication quality and signal stability of the foldable phone.

[0082] More importantly, the first current lead-out layer is at least partially embedded in the insulating medium, so that the thickness of the part of the support component other than the first current lead-out layer is almost the same as the thickness of the carbon fiber back plate. This reduces the overall thickness of the support component, allowing it to avoid obstructing the battery and other components inside the foldable phone without affecting their design. Furthermore, the grounding of the first current lead-out layer reduces electromagnetic interference and improves the electromagnetic compatibility of the foldable phone. In addition, the support component does not affect the light emission and display of the foldable phone, resulting in excellent overall performance.

[0083] This application does not limit the specific type of electronic device. In some embodiments, the electronic device in this application can be an electronic device with foldable functionality. This electronic device may include mobile phones, tablets, laptops, wearable devices (e.g., smart bracelets, smartwatches, headphones, etc.), laptops, ultra-mobile personal computers (UMPCs), handheld computers, cellular phones, personal digital assistants (PDAs), augmented reality (AR) / virtual reality (VR) devices, and other Internet of Things (IoT) devices, in-vehicle electronic devices, and may also be drones, robots, televisions, large screens, printers, projectors, etc.

[0084] To facilitate understanding, we will again use a foldable mobile phone as an example to specifically describe the parts of the electronic device that are related to the embodiments of this application. Figures 3 to 6 The accompanying drawings below only schematically show some components of the foldable phone; the actual shape, size, position, and structure of these components are not subject to change. Figures 3 to 6 And the limitations of the figures below.

[0085] The display screen of a foldable phone can be used to display images, videos, etc. The display screen can be a flexible display screen or a rigid display screen, such as, but not limited to, liquid crystal display (LCD), organic light emitting diode (OLED) display screen, mini light emitting diode (Mini LED) display screen, and micro light emitting diode (MicroLED) display screen.

[0086] Figures 3 to 6 The structure of a dual-folding screen phone 100 is shown. Here, the dual-folding screen phone 100 refers to a phone that can be folded once. Of course, the foldable phones in this application embodiment are not limited to dual-folding screen phones; triple-folding screen phones, etc., are also applicable, and will not be described in detail here.

[0087] like Figures 3 to 6 As shown, the dual-folding screen phone 100 includes a first dual-folding display screen 101, a second dual-folding display screen 102, and a rigid display screen 104. The first dual-folding display screen 101 and the second dual-folding display screen 102 are located on both sides of a hinge 103 and share the hinge 103. Therefore, when the dual-folding screen phone 100 is in the folded state, the first dual-folding display screen 101 and the second dual-folding display screen 102 are interlocked, i.e., they face each other; while when the dual-folding screen phone 100 is in the unfolded state, the first dual-folding display screen 101 and the second dual-folding display screen 102 are on the same plane. It should be noted that, in different implementations, the first dual-folding display screen 101 and the second dual-folding display screen 102 can be considered a logical division, actually implemented through a single foldable display screen; alternatively, the first dual-folding display screen 101 and the second dual-folding display screen 102 can be two independent non-folding displays.

[0088] Specifically, the dual-folding screen phone 100 can have three display states, such as... Figure 3 The unfolded state shown in Figure (a) Figure 3 The figure in middle (b) shows a semi-folded state between the two. Figure 3 The folding state is shown in Figure (c). In the unfolded state, the folding angle of the dual-folding screen phone 100 is 180°, corresponding to an angle of 180° between the first dual-folding display screen 101 and the second dual-folding display screen 102. In the folded state, the first dual-folding display screen 101 and the second dual-folding display screen 102 face each other, and the rigid display screen 104 is located on the outside of the dual-folding screen phone 100; at this time, the folding angle is 0°. Therefore, when the folding angle is between 0° and 180°, the dual-folding screen phone 100 is in a semi-folded state. It can be understood that... Figure 3 Only the state of the dual-folding screen phone 100 with a folding angle between 0° and 180° is shown. However, in some other implementations, the dual-folding screen phone 100 can also support folding greater than 180°. In this case, the first dual-folding display screen 101 and the second dual-folding display screen 102 can also serve as the appearance of the dual-folding screen phone 100 to provide users with display information and operations. The specific implementation shall prevail.

[0089] For example Figures 4 to 6 As shown, the dual-folding screen phone 100 may also include Figure 4 and Figure 5 The components include: a first motherboard 1011, a second motherboard 1021, a first battery 1012, a second battery 1022, a display screen backplate 105, a first antenna 1061, a second antenna 1062, a mid-frame 107, a battery compartment backplate 108, a board-to-board (BTB) connector 109, and... Figure 6 The polyimide (PI) substrate 110 is used. Of course, other arbitrary structures can also be included, which will not be listed here.

[0090] As an example, for Figures 4 to 6 The structure shown is explained as follows: the middle frame 107 serves as the outer contour, and the first battery 1012 and the second battery 1022 are placed in the plastic structure ( Figures 4 to 6 A battery compartment backplate 108 is provided in the cutout (not shown) between the first double-fold display screen 101 and the middle frame 107, and between the second double-fold display screen 102 and the middle frame 107. The battery compartment backplate 108 is attached to the middle frame 107, and the first battery 1012 is placed below the battery compartment backplate 108. At this time, the part of the middle frame 107 above the first battery 1012 has a stepped transition, which makes the thickness of the middle frame 107 in the area of ​​the first battery 1012 different from the thickness in other areas. In order to increase the capacity of the first battery 1012, the thickness of the battery compartment backplate 108 is usually thinned, and in order to ensure strength, the battery compartment backplate 108 near the first double-fold display screen 101 is also locally thickened. In addition, the display screen backplate 105 is located below the first double-fold display screen 101 and is in direct contact with the battery compartment backplate 108. Because it is separated from the first battery 1012 by the battery compartment backplate 108, the display screen backplate 105 and the first battery 1012 will not be in direct contact.

[0091] It should be noted that, in order to make the display screen feel better to the touch, sometimes a one-thru glass (OTG) is added under the polyimide substrate 110. The one-thru glass can enhance the strength of the polyimide substrate 110 and will not affect the display of the first double-folding display screen 101.

[0092] Furthermore, the second battery 1022 can be designed in the same or similar way as the first battery 1012, which will not be elaborated here.

[0093] In addition, the dual-folding screen mobile phone 100 of this application embodiment may also include structures such as a microphone and a speaker, depending on the actual application.

[0094] Based on the above, Figures 3 to 6 The back panel of the central display screen 105 will Figure 1 and Figure 2In the carbon fiber backplate 01, some of the carbon fiber is replaced with reinforcing fibers, and a first current guiding layer, far from the display screen, is embedded in an insulating medium composed of reinforcing fibers and resin. Because the first current guiding layer is partially embedded in the insulating medium rather than entirely on its surface, the overall thickness of the support component (excluding the first current guiding layer) is reduced to almost the same as the carbon fiber backplate thickness. This benefits the dual-folding screen phone 100 by achieving a thinner and lighter design while having minimal impact on battery and other design aspects. Meanwhile... Figures 3 to 6 The display screen back panel 105 retains the following: Figure 1 and Figure 2 The carbon fiber in the carbon fiber backplate 01 provides excellent support for the display screen. Furthermore, the first current extraction layer is located on the side of the carbon fiber furthest from the display screen and does not contact the carbon fiber. This design allows the conduction current generated by radiated electromagnetic waves to flow from its surface to ground without entering the support structure, reducing electromagnetic wave loss and significantly improving radiation efficiency. In addition, the support structure does not affect the light emission and display of the screen. All these factors combined result in the dual-folding screen phone 100 boasting high performance and low cost, making it suitable for large-scale industrial production and application.

[0095] The following is for reference. Figures 7 to 37 The support 1 and the electronic device 200 using it, as provided in the embodiments of this application, will be described in detail.

[0096] This application provides an electronic device 200, such as... Figures 7 to 37 As shown, the electronic device 200 may include: a support member 1 and a display screen 2, with the support member 1 attached to the backlight side of the display screen 2.

[0097] refer to Figures 7 to 37 The support member 1 may include a main support structure 11 and a first structure 12. The main support structure 11 includes a main insulating medium 112 and long-chain carbon fibers 113. The long-chain carbon fibers 113 are overlapped and arranged in the main insulating medium 112 in multiple directions. The first structure 12 is located on the side of the main support structure 11 away from the display screen 2. The first structure 12 is stacked and combined with the main support structure 11. The first structure 12 includes a first insulating medium 121 and a first current lead-out layer 131. The first insulating medium 121 is in direct contact with the main support structure 11. The first insulating medium 121 includes a first resin matrix 1211 and a first reinforcing fiber 1212. The first reinforcing fiber 1212 is distributed in the first resin matrix 1211. The first current lead-out layer 131 is separate from and spaced apart from the long-chain carbon fibers 113. The first current lead-out layer 131 is partially embedded in the first insulating medium 121 in a first direction. The first current lead-out layer 131 is grounded.

[0098] It should be noted that the first direction is Figures 7 to 37The oz direction is the direction parallel to the thickness direction of support member 1.

[0099] In applications, the support 1 can be used as a back panel (such as a display screen back panel), decorative structure, etc. of electronic device 200. The shape and size of the support 1 can be determined according to actual needs.

[0100] Specifically, when the display screen 2 is an LCD, the electronic device 200 is an LCD; when the display screen 2 is an OLED, the electronic device 200 is an OLED electronic device; when the display screen 2 is a Mini LED, the electronic device 200 is a Mini LED electronic device; and when the display screen 2 is a Micro LED, the electronic device 200 is a Micro LED electronic device. The specific type and structure of the electronic device 200 can be determined according to actual needs, and are not specifically limited here.

[0101] The display screen 2 can emit light. The side of the display screen 2 that emits light is the light-emitting side, and the side opposite to the light-emitting side is the backlight side. For example, the support member 1 can be attached to the backlight side of the display screen 2 by means of bonding, welding or hot melting.

[0102] Significantly, the support member 1 is chosen to be bonded to the backlight side of the display screen 2. For example, the support member 1 can be firmly and conveniently bonded to the backlight side of the display screen 2 using an additional adhesive layer. This adhesive layer may include optically clear adhesive (OCA), etc. It should be noted that the optically clear adhesive is often integrated with the display screen 2, and then the support member 1 in this embodiment is bonded to the optically clear adhesive, thus bonding the support member 1 to the backlight side of the display screen 2 using the optically clear adhesive. Figures 7 to 37 Optical transparent adhesive is not shown, but in practice, it may be located between the display screen and the main support structure in the support component, or it may be located between the display screen and the insulating medium in the support component, depending on the actual application.

[0103] In applications, the support component 1 needs to possess sufficient strength and rigidity to minimize deformation, wobbling, or failure during use, thus ensuring reliable support for the display screen 2 and other components. Due to the high elastic modulus (approximately 80 GPa), high rigidity, strong resistance to deformation, and small deformation under the same stress of carbon fiber and the insulating medium, the structural stability and dimensional accuracy of the support component 1 are ensured. Therefore, in this embodiment, long-chain carbon fibers 113 are stacked along a first direction and staggered and distributed in multiple spatial directions within the main insulating medium 112 to form the main support structure 11. This main support structure 11 provides continuous and stable support for the display screen 2 and other components, thereby improving the reliability and service life of the entire support component 1.

[0104] In one or more embodiments, the main insulating medium 112 may be only a main resin matrix, or the main insulating medium 112 may include a main resin matrix and main reinforcing fibers, with the main reinforcing fibers distributed in the main resin matrix; no specific limitation is made here. Significantly, selecting a main insulating medium 112 composed of main reinforcing fibers distributed in the main resin matrix allows the main reinforcing fibers, together with the long-chain carbon fibers 113, to improve the elastic modulus and strength of the main insulating medium 112.

[0105] The main resin matrix can be epoxy resin, styrene-acrylic resin, bismaleimide resin, etc., specifically one or more combinations of epoxy resin (EP), benzocyclobutene resin (BCB), and bismaleimide resin (BMI). These resins have low coefficients of thermal expansion, high rigidity, and high elastic modulus. In particular, they have adhesive properties in their semi-cured state before curing. This allows for bonding of structures such as the main support structure 11 and the first structure 12 without the need for additional adhesive layers, thereby achieving the layering and bonding of the two.

[0106] The epoxy resins mentioned above may include bisphenol A diglycidyl ether epoxy resin (DGEBA) and tetrafunctional epoxy resin (TGEP) to provide good adhesion and insulation.

[0107] The main reinforcing fibers can include one or more combinations of glass fibers (such as alkali-free glass fibers (E glass fibers) and high-strength glass fibers (S glass fibers)), poly-p-phenylene benzobisoxazole (PBO) fibers, polyimide (PI) fibers, ceramic fibers, chopped carbon fibers, boron nitride fibers, silicon carbide fibers, alumina fibers, boron fibers, zirconium oxide fibers, aramid fibers, electronic-grade reinforcing fiber cloth, reinforcing fiber filaments, and reinforcing fiber yarns. When the main reinforcing fiber is electronic-grade reinforcing fiber cloth, its specific model can be 1010, 1017, or 1027, etc. The main reinforcing fibers provide the main support structure 11 with good mechanical strength and dimensional stability, ensuring the supporting performance of the support member 1.

[0108] It should be noted that glass fibers can be further divided into long-chain glass fibers and chopped glass fibers. Long-chain glass fibers and chopped glass fibers can be distinguished according to the thickness of the main resin matrix along the first direction. Specifically, when a single layer of glass fibers is arranged only in one specific direction in the main resin matrix, it is a long-chain glass fiber. This long-chain glass fiber cannot extend in any direction in the main resin matrix. On the other hand, when a single layer of glass fibers can be arranged in any direction in the main resin matrix, it is a chopped glass fiber. This chopped glass fiber is dispersed in the main resin matrix in multiple directions.

[0109] When a single layer of glass fiber contains both long-chain glass fibers and short-cut glass fibers, the glass fibers are distributed throughout the main resin matrix and are impregnated and wrapped by the main resin matrix. At this time, the long-chain glass fibers form a continuous, interconnected mesh skeleton with long-range directional / interwoven spreading and wetting distribution, while the short-cut glass fibers are diffusely filled in the gap areas of the long-chain glass fiber skeleton, exhibiting random overlap and fragmented discrete distribution. Some short-cut glass fiber defect phases are enriched in the fiber-resin interface and skeleton pores.

[0110] Based on the above, long-chain carbon fibers 113 are also incorporated into the pure main resin matrix or a mixture of the main resin matrix and the main reinforcing fibers. It should be understood that long-chain carbon fibers 113 refer to carbon fibers made from continuous carbon fiber filaments, retaining the continuous structure or cut into long segments (without disrupting the continuous overlap), capable of forming long-range connectivity and chain-like overlaps. Unlike chopped carbon fibers, they possess advantages such as high modulus, high strength, anisotropy, fatigue resistance, and impact resistance. The long-chain carbon fibers 113 here can include T700 grade carbon fibers, T800 grade carbon fibers, etc.

[0111] It should be understood that the long-chain carbon fibers 113 overlapping and arranging in multiple directions within the main insulating medium 112 means that all the long-chain carbon fibers 113 can be stacked in one or more layers along the first direction, so that all the long-chain carbon fibers 113 are staggered and arranged in multiple spatial directions within the main insulating medium 112. For example, the long-chain carbon fibers 113 can be a single layer, and the long-chain carbon fibers 113 in this layer are staggered and distributed in multiple directions (second direction, third direction, etc.). In this case, the extension direction of the long-chain carbon fibers 113 can be any direction such as 0°, 45°, or 90°. Significantly, for ease of fabrication, the extension direction of the long-chain carbon fibers 113 is chosen to be 0° or 90°. It should be noted that if the 0° direction is the meridian direction, then the 90° direction is the parallel direction.

[0112] Of course, the long-chain carbon fiber 113 can be multi-layered. In the multi-layered structure, the extension direction (second direction, third direction, etc.) of the long-chain carbon fiber 113 in each layer is the same, and the extension direction of the long-chain carbon fiber 113 in at least two layers is different. Alternatively, the extension direction of the long-chain carbon fiber 113 in each layer is different, and the extension direction of the long-chain carbon fiber 113 in at least two layers is different. Or, the extension direction of the long-chain carbon fiber 113 in each layer is different, and the extension direction of the long-chain carbon fiber 113 in at least two layers is the same. No specific limitation is made here.

[0113] exist Figures 7 to 37 In the first direction, three layers of long-chain carbon fibers 113 are also staggered and overlapped in two spatial directions within the main insulating medium 112. Specifically, the first carbon fiber 1131, the second carbon fiber 1132, and the third carbon fiber 1133 are sequentially stacked along the first direction. These three layers of long-chain carbon fibers 113 have a high elastic modulus, and their shared use with the main insulating medium 112 containing the main reinforcing fibers strengthens the support of the main support structure 11. As an example, the extension direction of the first carbon fiber 1131 can be set to 0° (second direction), the extension direction of the second carbon fiber 1132 to 90° (third direction), and the extension direction of the third carbon fiber 1133 to 0°; as another example, the extension direction of the first carbon fiber 1131 can be set to 90°, the extension direction of the second carbon fiber 1132 to 0°, and the extension direction of the third carbon fiber 1133 to 90°. It should be noted that the second direction is... Figures 7 to 37 The ox direction is the direction perpendicular to the thickness direction of support member 1, and the third direction is... Figures 7 to 37 The oy direction is the direction perpendicular to the thickness direction of support member 1. In other words, the ox direction and the oy direction are perpendicular to the oz direction, and the ox direction is also perpendicular to the oy direction.

[0114] Therefore, the long-chain carbon fiber 113 with high elastic modulus is fully impregnated in the main insulating medium 112, so that the main insulating medium 112 covers the long-chain carbon fiber 113. After curing and cooling, the main support structure 11 is formed. The main support structure 11 exhibits characteristics such as high elastic modulus and high rigidity, which can play a good supporting role for structures such as the display screen 2. At the same time, the higher the elastic modulus, the higher the material stiffness and the stronger the resistance to elastic deformation. Therefore, under the premise of ensuring that the support component 1 is comparable to the existing carbon fiber back plate structure, increasing the elastic modulus of the support component 1 can effectively reduce the deformation of the support component 1 and improve the wrinkles, warping and other defects of the display screen 2.

[0115] It should be noted that silicone can also be used to replace the main insulating medium 112 and long-chain carbon fiber 113 as the main support structure 11, depending on the actual application.

[0116] In application, Figure 1 and Figure 2 The carbon fiber backing plate 01 is made of all carbon fiber. However, the carbon fiber backing plate 01, which is formed from continuous carbon fiber, is a brittle and anisotropic composite material. When the carbon fiber backing plate 01 is relatively thick, drilling it can easily cut off the continuous carbon fiber body. At the same time, the abrupt change in the hole structure will cause significant stress concentration, which will lead to processing defects such as edge chipping around the hole, interlayer peeling, and directional cracking. These problems will not only cause the overall mechanical strength of the carbon fiber backing plate 01 to decrease sharply, but also cause the processing dimensional accuracy and finished product yield to be out of control, making it unable to meet the needs of mass industrial production of electronic equipment 200.

[0117] Furthermore, carbon fiber has a high melting point (i.e., softening point), making it difficult to melt and soften even after heating. Therefore, in this embodiment, a first reinforcing fiber 1212 is used to replace part of the carbon fiber in the carbon fiber backing plate 01 in the related art. Taking glass fiber as an example, the first reinforcing fiber 1212 has a low melting point and can melt and soften after heating at a certain temperature. It is convenient to drill holes in the melted and softened first insulating medium 121 without affecting the structure and performance, and it is also convenient to embed the first current lead-out layer 131 into the hole. It should be noted that although the overall elastic modulus of the glass fiber and insulating medium (approximately 5 GPa) is lower than that of the long-chain carbon fiber 113 and the overall elastic modulus of the insulating medium, the first current lead-out layer 131 is partially embedded in the first insulating medium 121. The combined effect of the first current lead-out layer 131 and the glass fiber can make the overall elastic modulus of the first structure 12 higher and the stiffness stronger. As a result, the elastic modulus and strength of the support member 1 formed together with the main support structure 11 are not much different from those of the carbon fiber back plate 01 (with a coating on its surface). At the same time, since the first current lead-out layer 131 is not completely disposed on the outer surface of the first insulating medium 121, the total thickness of the support member 1 along the first direction can be reduced compared to the total thickness of the carbon fiber back plate 01 and the coating along the first direction, thereby achieving the thinning of the support member 1.

[0118] It should be understood that the stacking and mutual combination of the first structure 12 and the main support structure 11 means that, in the first direction, the main support structure 11 and the first structure 12 are stacked sequentially from near to far along the backlight side of the display screen 2; at the same time, since the semi-cured first structure and the semi-cured main support structure are stacked and then hot-pressed during the manufacturing process, the two are combined with each other.

[0119] In one or more embodiments, the first resin matrix 1211 may be configured with reference to the main resin matrix, which will not be described in detail here. Thus, by using the first resin matrix 1211, which has a low coefficient of thermal expansion, high rigidity, high elastic modulus, and especially adhesive properties in the semi-cured state before curing, the first structure 12 and the main support structure 11 can be bonded together without the need for an additional adhesive layer, thereby achieving the stacking and mutual bonding of the first structure 12 and the main support structure 11.

[0120] In one or more embodiments, the first reinforcing fiber 1212 may also be configured with reference to the main reinforcing fiber, which will not be described in detail here.

[0121] Furthermore, the first resin matrix 1211 can be the same as the main resin matrix, and / or the first reinforcing fiber 1212 can be the same as the main reinforcing fiber. This facilitates preparation and saves costs and processes. It should be noted that within the same resin system, the functional groups inherent in the resin molecular backbone can cross-link to achieve adhesion, thus eliminating the need for additional adhesive layers. To put it simply, imagine the resin as a box of building blocks with built-in Velcro. Each block has Velcro (inherent functional groups) sewn onto its edges. Given appropriate temperature, catalyst, or light, the blocks will automatically bond together to form a strong network without the need for additional glue. Based on this principle, since the first resin matrix 1211 and the main resin matrix are from the same resin system, no additional adhesive is needed; the first resin matrix 1211 and the main resin matrix can react with each other to form a cross-linked network. Therefore, the structural strength of the support member 1 after hot pressing in this embodiment depends on the bonding effect of the main resin matrix and long-chain carbon fiber 113 with the first resin matrix 1211 and the first reinforcing fiber 1212. When the materials of the first resin matrix 1211 and the main resin matrix are resins of the same system, the first resin matrix 1211 and the main resin matrix can be cross-linked with each other without the need for additional adhesive layer coating. This reduces the process of applying glue to cure. At the same time, since no additional adhesive layer is applied, the size of the support member 1 in the thickness direction is avoided, which is conducive to the overall thinning of electronic devices.

[0122] Optionally, the aforementioned homologous resins include, but are not limited to, epoxy resins, styrene-acrylic resins, and bismaleimide resins. For example, if both the first resin matrix 1211 and the main resin matrix are epoxy resins, then the first resin matrix 1211 can specifically be a bisphenol A type epoxy resin, while the main resin matrix can specifically be a tetrafunctional epoxy resin.

[0123] In one or more embodiments, the first current lead-out layer 131 may be entirely located on the side of the first insulating medium 121 away from the display screen 2, or the first current lead-out layer 131 may be partially (not entirely located) on the side of the first insulating medium 121 away from the display screen 2, depending on the actual application.

[0124] It should be understood that the first current lead-out layer 131 being partially embedded in the first insulating medium 121 along the first direction means that a portion of the surface of the first current lead-out layer 131 needs to be exposed for grounding. In specific implementation, the support member 1 can be connected to the grounding terminal, which can be the middle frame 3, etc. Grounding the support member 1 can form a stable ground return path, optimize the overall radiation emission performance of the device, and quickly discharge static electricity, high-frequency interference signals, and surge pulses, thereby achieving protection functions such as electrostatic discharge (ESD), electromagnetic shielding, and electromagnetic interference immunity.

[0125] The resistivity of the first current extraction layer 131 is less than or equal to 10. -3 Ω•m, for example, the resistivity of the first current extraction layer 131 can be 10 Ω•m. -4 Ω•m, 10 -5 Ω•m, 10 -6 Ω•m, 10 -7 Ω•m or 10 -8 Ω•m, etc. Therefore, while the support component 1 can achieve structural rigidity and thinness, it ensures that the radiator 4 has the requirements of low loss, high efficiency, wide bandwidth, low interference, low heat generation, and good communication signal quality.

[0126] The material of the first current extraction layer 131 can be metal, conductive paste, etc. The metal can be copper (Cu), nickel (Ni), gold (Au), etc. Metals can draw away the conductive current induced by electromagnetic waves in the support 1 from their surface, which is simple to implement and low in cost. In addition, metals can also achieve good heat dissipation. The conductive paste is mainly composed of epoxy, acrylic, and other resins, plus oil-based or water-based solvents, and then mixed with conductive powders such as silver (Ag) powder (forming conductive silver paste), copper powder (forming conductive copper paste), carbon black, and silver-coated copper. After curing, it does not have elasticity.

[0127] The thickness of the first insulating medium 121 along the first direction can be set to 25μm~35μm, and the thickness of the single-layer first current extraction layer 131 along the first direction can be 2μm~5μm. The sum of their thicknesses is 27μm~40μm, which is much thinner than the all-carbon fiber backing in related technologies. Therefore, the thickness of the first current extraction layer 131 meets the skin depth requirements at a specific frequency, enabling it to effectively guide the direction of the conduction current induced by electromagnetic waves in the support member 1.

[0128] Furthermore, since the thickness of the pure carbon fiber backing plate in related technologies can be reduced from about 150 μm to the thickness of the main support structure 11 in this embodiment of the application, the relative performance degradation can also be improved.

[0129] The support component provided in this application embodiment has a first current-leading layer partially embedded in a first insulating medium along a first direction. This reduces the thickness of the entire support component in the first direction compared to existing carbon fiber backplates made entirely of carbon fiber, enabling lightweight and ultra-thin stacking designs for electronic devices using this support component. Simultaneously, the reduced thickness of the main carbon fiber chain along the first direction, combined with the first current-leading layer, allows the conduction current induced by electromagnetic waves in the support component to be diverted away from its surface, preventing the conduction current from entering the support component's interior, especially penetrating the carbon fiber. Since the first current-leading layer does not participate in electromagnetic wave loss, it reduces electromagnetic wave performance degradation, shortens the conductive path, optimizes electrostatic discharge and grounding return performance, and enhances the electrostatic discharge protection and electromagnetic compatibility of electronic devices. Furthermore, the long-chain carbon fiber in the main support structure, together with the first reinforcing fiber and resin matrix in the first structure, ensures that the support component has sufficient elastic modulus and rigidity. This suppresses display wrinkles and warping, ensures the performance of electronic devices using the support component, improves the yield of both the support component and the electronic device, and guarantees aesthetic appearance, which is beneficial for large-scale industrial production and application.

[0130] For example Figures 7 to 37 As shown, the electronic device 200 provided in this application embodiment may further include a middle frame 3, which surrounds the support member 1 and the display screen 2, and the first current lead-out layer 131 is connected to the middle frame 3.

[0131] In applications, the middle frame 3 is generally not in direct contact with the first current lead-out layer 131, and the middle frame 3 serves as a grounding terminal.

[0132] Since the first current lead-out layer 131 is located close to the middle frame 3, it is significant that a portion (not the entire layer) of the first current lead-out layer 131 can be located on the side of the first insulating medium 121 away from the display screen 2, which can save more space for structures such as batteries.

[0133] Therefore, the non-display surface (backlight side) of the display screen 2 does not directly contact the middle frame 3, but is indirectly attached to the display screen 2 through the support member 1 (which is used as the back plate of the display screen at this time). The support member 1 can provide global support for the display screen 2 and play a role in buffering and stress dispersion, reducing the local stress concentration caused by the direct contact of the display screen 2 with the middle frame 3. It is especially suitable for fragile electronic devices such as OLED flexible screens and foldable displays.

[0134] The support component provided in this application embodiment is connected to the middle frame to achieve grounding, which can form a stable grounding return path and optimize the radiation performance of electronic devices using the support component. In addition, it can quickly discharge static electricity and achieve protection such as electrostatic discharge, electromagnetic shielding and electromagnetic interference resistance.

[0135] For example Figures 7 to 37 As shown, the electronic device 200 provided in this application embodiment may further include a radiating element 4, which is disposed around the outer periphery of the support 1 and the display screen 2, and there are gaps between the radiating element 4 and the support 1 and the display screen 2 respectively.

[0136] In application, the radiating component 4 does not contact the supporting component 1, the display screen 2, or the middle frame 3.

[0137] Radiating element 4 may include an antenna, for example, radiating element 4 is... Figure 5 The first antenna is 1061, the second antenna is 1062, etc.

[0138] It should be noted that, in Figure 4 and Figure 5 In the dual-folding screen phone 100, when the first dual-folding screen 101 is used as the main screen, the first antenna 1061 and the second antenna 1062 can be set at any position on the other side of the first dual-folding screen 101 except for the hinge 103, and / or, can be set at any position on the other side of the second dual-folding screen 102 except for the hinge 103. No specific limitation is made here.

[0139] The support member provided in this application embodiment has a first current lead-out layer that can draw away the conduction current induced in the support member by the electromagnetic waves emitted when the radiating element is working from its outer surface. In this way, the conduction current will hardly enter the interior of the support member, especially will not penetrate into the carbon fiber. Since the first current lead-out layer does not participate in electromagnetic wave loss, it can reduce the performance degradation of the radiating element, shorten the conductive path, optimize the electrostatic discharge and grounding return performance, and enhance the electrostatic discharge protection and electromagnetic compatibility of electronic devices using the support member.

[0140] Alternatively, as one possible approach, such as Figures 11 to 18 , Figures 20 to 21 As shown, the electronic device 200 provided in this application embodiment may include: a support member 1, a display screen 2, a middle frame 3, and a radiating member 4. The support member 1 is attached to the backlight side of the display screen 2, the middle frame 3 surrounds the support member 1 and the display screen 2, and the radiating member 4 is arranged around the outer periphery of the support member 1, the display screen 2, and the middle frame 3. There are gaps between the radiating member 4 and the support member 1, the display screen 2, and the middle frame 3.

[0141] The support member 1 may include a main support structure 11 and a first structure 12. The main support structure 11 includes a main insulating medium 112 and long-chain carbon fibers 113. The long-chain carbon fibers 113 are stacked in a first direction, that is, arranged in an alternating manner along multiple spatial directions within the main insulating medium 112. The first structure 12 is located on the side of the main support structure 11 away from the display screen 2. The first structure 12 is stacked and combined with the main support structure 11. The first structure 12 includes a first insulating medium 121, a first current lead-out layer 131, and a second current lead-out layer 132. The first insulating medium 121 is in direct contact with the main support structure 11. The first insulating medium 121 includes a first resin matrix 1211 and a first reinforcing fiber 1212. The first reinforcing fiber 1212 is distributed in the first resin matrix 1211. The first current lead-out layer 131 is separate from and spaced apart from the long-chain carbon fiber 113. The first current lead-out layer 131 is partially embedded in the first insulating medium 121 along the first direction. The first current lead-out layer 131 is grounded. The second current lead-out layer 132 is located on at least a portion of the outer surface of the first insulating medium 121.

[0142] It should be noted that the support member 1, display screen 2, middle frame 3, radiator 4 and first current lead-out layer 131 in this application embodiment can all refer to the above embodiment, and will not be repeated here.

[0143] It should be understood that the second current lead-out layer 132 located on at least a portion of the outer surface surrounding the first insulating medium 121 means that the second current lead-out layer 132 is located on a portion of the outer surface surrounding the first insulating medium 121, or that the second current lead-out layer 132 is located on the entire outer surface surrounding the first insulating medium 121, depending on the actual application.

[0144] Significantly, by selecting the second current lead-out layer 132 to be located on all the outer surfaces (all the sides) around the first insulating medium 121, the support member 1 can guide as much of the conduction current induced in the main support structure 11 by the electromagnetic waves radiated by the radiator 4 during operation to the outer surfaces of the first current lead-out layer 131 and the second current lead-out layer 132 as possible.

[0145] The second current extraction layer 132 can be configured with reference to the first current extraction layer 131, and will not be described in detail here. When the material of the second current extraction layer 132 is metal, when the radiator 4 is working and radiating signals, the electromagnetic waves generated by the radiator 4 induce a conduction current in the main support structure 11. The conduction current can be guided at least to the outer surface of the first current extraction layer 131 and the second current extraction layer 132, and then flow to the middle frame 3. At this time, the metal can also dissipate heat well.

[0146] Furthermore, the second current lead-out layer 132 can be selected to have at least one of the same material, resistivity, or fabrication process as the first current lead-out layer 131, in order to simplify the process and save costs.

[0147] It should be noted that the second current lead-out layer 132 and the first current lead-out layer 131 can be electrically connected, or they can be not electrically connected; no specific limitation is made here.

[0148] Therefore, at least through the first current extraction layer 131 and the second current extraction layer 132, the conduction current generated in the support member 1 by the electromagnetic waves radiated when the radiator 4 is working is extracted to the outer surface and then flows to the middle frame 3. In this way, the support member 1 has little impact on the radiation efficiency of the radiator 4 and significantly reduces the loss of the radiator 4, resulting in lower cost. Overall, this makes the communication quality of the electronic device 200 good and the signal stable. In addition, the second current extraction layer 132 is not located in the first direction and has virtually no impact on the thickness of the support member 1.

[0149] Alternatively, as one possible approach, such as Figures 19 to 21 As shown, the electronic device 200 provided in this application embodiment may include: a support member 1, a display screen 2, a middle frame 3, and a radiating member 4. The support member 1 is attached to the backlight side of the display screen 2, the middle frame 3 surrounds the support member 1 and the display screen 2, and the radiating member 4 is arranged around the outer periphery of the support member 1, the display screen 2, and the middle frame 3. There are gaps between the radiating member 4 and the support member 1, the display screen 2, and the middle frame 3.

[0150] The support component 1 may include a main support structure 11 and a first structure 12. The main support structure 11 includes a main insulating medium 112 and long-chain carbon fibers 113, which are arranged in an alternating manner along multiple spatial directions within the main insulating medium 112. The first structure 12 is located on the side of the main support structure 11 away from the display screen 2. The first structure 12 is stacked and combined with the main support structure 11. The first structure 12 includes a first insulating medium 121, a first current lead-out layer 131, and a fifth current lead-out layer 135. The first insulating medium 121 is in direct contact with the main support structure 11. 1 includes a first resin matrix 1211 and a first reinforcing fiber 1212. The first reinforcing fiber 1212 is distributed in the first resin matrix 1211. A first current lead-out layer 131 is separate from and spaced apart from long-chain carbon fiber 113. The first current lead-out layer 131 is partially embedded in the first insulating medium 121 along a first direction. The first current lead-out layer 131 is grounded. A fifth current lead-out layer 135 is wholly or partially embedded in the first insulating medium 121 along the first direction. The fifth current lead-out layer 135 is in contact with the main support structure 11. The fifth current lead-out layer 135 is separate from and spaced apart from the first current lead-out layer 131.

[0151] It should be noted that the support member 1, display screen 2, middle frame 3, radiator 4 and first current lead-out layer 131 in this application embodiment can all refer to the above embodiment, and will not be repeated here.

[0152] Optionally, embodiments of this application may also include a second current lead-out layer, which is located on at least a portion of the outer surface of the first insulating medium. For details, please refer to the above embodiments, which are not specifically limited here.

[0153] The fifth current lead-out layer 135 can be in full contact with the main support structure 11, or the fifth current lead-out layer 135 can be in partial (non-full) contact with the main support structure 11.

[0154] It should be understood that the fifth current lead-out layer 135 and the first current lead-out layer 131 are separate and spaced apart, meaning that the fifth current lead-out layer 135 and the first current lead-out layer 131 do not contact each other in any direction.

[0155] Optionally, by setting the fifth current lead-out layer 135 to be fully embedded in the first insulating medium 121, the fifth current lead-out layer 135 can be protected from external environmental erosion, impact, scratches, etc., and the film imprint on the display screen 2 after hot pressing can be reduced, and the appearance of the support member 1 is also better.

[0156] The fifth current lead-out layer 135 can be configured with reference to the first current lead-out layer 131, and will not be described in detail here. When the material of the fifth current lead-out layer 135 is metal, when the radiator 4 is working and radiating signals, the electromagnetic waves generated by the radiator 4 induce a conduction current in the main support structure 11. The conduction current can be guided to at least the outer surface of the first current lead-out layer 131 and the fifth current lead-out layer 135, and then flow to the middle frame 3. At this time, the metal can also dissipate heat well.

[0157] Furthermore, the fifth current lead-out layer 135 may be selected to have the same material, resistivity, preparation process, etc. as the first current lead-out layer 131, and / or the same material, resistivity, preparation process, etc. as the second current lead-out layer, in order to simplify the process and save costs.

[0158] It should be noted that the fifth current lead-out layer 135 can be electrically connected to the first current lead-out layer 131, and / or the second current lead-out layer, or they can be not electrically connected; no specific limitation is made here.

[0159] Therefore, at least the first current extraction layer 131 and the fifth current extraction layer 135 together extract the conduction current generated in the support member 1 by the electromagnetic waves radiated when the radiator 4 is working to the outer surface, and then flow to the middle frame 3. In this way, the support member 1 has little impact on the radiation efficiency of the radiator 4 and significantly reduces the loss of the radiator 4. The cost is low, and overall, the electronic device 200 has good communication quality and stable signal.

[0160] Alternatively, as one possible approach, such as Figures 22 to 30 As shown, the electronic device 200 provided in this application embodiment may include: a support member 1, a display screen 2, a middle frame 3, and a radiating member 4. The support member 1 is attached to the backlight side of the display screen 2, the middle frame 3 surrounds the support member 1 and the display screen 2, and the radiating member 4 is arranged around the outer periphery of the support member 1, the display screen 2, and the middle frame 3. There are gaps between the radiating member 4 and the support member 1, the display screen 2, and the middle frame 3.

[0161] The support component 1 may include a main support structure 11, a first structure 12, and a second structure 16. The main support structure 11 includes a main insulating medium 112 and long-chain carbon fibers 113, which are arranged in an alternating manner along multiple spatial directions within the main insulating medium 112. The first structure 12 is located on the side of the main support structure 11 away from the display screen 2. The first structure 12 is stacked and combined with the main support structure 11. The first structure 12 includes a first insulating medium 121 and a first current lead-out layer 131. The first insulating medium 121 is in direct contact with the main support structure 11. The first insulating medium 121 includes a first resin matrix 1211 and a second current lead-out layer 131. A first reinforcing fiber 1212 is distributed in a first resin matrix 1211. A first current lead-out layer 131 and a long-chain carbon fiber 113 are separated and spaced apart. The first current lead-out layer 131 is partially embedded in a first insulating medium 121 along a first direction and is grounded. A second structure 16 is located between the main support structure 11 and the display screen 2. The second structure 16 includes a second insulating medium 161 and a third current lead-out layer 133. The second insulating medium 161 includes a second resin matrix 1611 and a second reinforcing fiber 1612. The second reinforcing fiber 1612 is distributed in the second resin matrix 1611.

[0162] Based on the above, as one scenario: Figure 22 , Figure 24 , Figures 26 to 27 , Figures 29 to 30 As shown, the second insulating medium 161 is in contact with the main support structure 11, the third current lead-out layer 133 is separate from and spaced apart from the long chain carbon fiber 113, the third current lead-out layer 133 is partially embedded in the second insulating medium 161 along the first direction, and the third current lead-out layer 133 covers the entire second insulating medium 161.

[0163] It should be understood that the third current lead-out layer 133 covering the entire second insulating medium 161 means that the third current lead-out layer 133 can be located entirely between the main support structure 11 and the display screen 2.

[0164] As another case: such as Figure 23 , Figure 25 , Figure 26 , Figures 28 to 30 As shown, the third current lead-out layer 133 is in contact with the main support structure 11. The third current lead-out layer 133 is fully or partially embedded in the second insulating medium 161 along the first direction. The third current lead-out layer 133 covers the entire main support structure 11.

[0165] It should be understood that the third current lead-out layer 133 covering the entire main support structure 11 means that the third current lead-out layer 133 can be located entirely between the main support structure 11 and the display screen 2.

[0166] It should be noted that after comparing the antenna performance of single-sided full coating and double-sided full coating in Table 1, it was found that the third current lead-out layer 133, which is closer to the display screen 2, cannot be set locally or with a step difference. Therefore, it needs to be set as a whole layer, which can reduce problems such as film imprint on the display screen 2 after hot pressing and also ensure the appearance effect.

[0167] Furthermore, the support member 1, display screen 2, middle frame 3, radiator 4 and first current lead-out layer 131 in this application embodiment can all refer to the above embodiment, and will not be repeated here.

[0168] Optionally, embodiments of this application may further include a second current lead-out layer and / or a fifth current lead-out layer, wherein the second current lead-out layer is located on at least a portion of the outer surface of the first insulating medium, and the fifth current lead-out layer is wholly or partially embedded in the first insulating medium along the first direction and is in contact with the main support structure.

[0169] The third current extraction layer 133 can be configured with reference to the first current extraction layer 131, and will not be described in detail here. When the material of the third current extraction layer 133 is metal, when the radiator 4 is working and radiating signals, the electromagnetic waves generated by the radiator 4 induce a conduction current in the main support structure 11. The conduction current can be guided to at least the outer surfaces of the first current extraction layer 131 and the third current extraction layer 133, and then flow to the middle frame 3. At this time, the metal can also dissipate heat well.

[0170] Furthermore, the third current lead-out layer 133 may be selected to be the same as at least one of the materials, resistivity, and preparation process of the first current lead-out layer 131, and / or the same as at least one of the materials, resistivity, and preparation process of the second current lead-out layer, and / or the same as at least one of the materials, resistivity, and preparation process of the fifth current lead-out layer, in order to simplify the process and save costs.

[0171] It should be noted that the third current lead-out layer 133 can be electrically connected to the first current lead-out layer 131, and / or the second current lead-out layer, and / or the fifth current lead-out layer, or they can be not electrically connected; no specific limitation is made here.

[0172] Furthermore, the second resin matrix 1611 can be configured with reference to the first resin matrix 1211, and the second reinforcing fiber 1612 can be configured with reference to the first reinforcing fiber 1212, which will not be elaborated here. Obviously, selecting the same second resin matrix 1611 as the first resin matrix 1211, and / or the same second reinforcing fiber 1612 as the first reinforcing fiber 1212, simplifies the process and saves costs.

[0173] Therefore, the main support structure 11 is covered by the first current lead-out layer 131 and the third current lead-out layer 133 together, and the electromagnetic waves radiated by the radiator 4 during operation are led out to the outer surface of the support member 1 and then flow to the middle frame 3. In this way, the support member 1 has little impact on the radiation efficiency of the radiator 4, which can significantly reduce the loss of the radiator 4 and reduce the cost. Overall, this results in good communication quality and stable signal of the electronic device 200. In addition, the third current lead-out layer 133 is partially or completely embedded in the second insulating medium 161 along the first direction, which will not make the thickness of the support member 1 along the first direction too thick. Furthermore, since the third current lead-out layer 133 is closer to the display screen 2 than the first current lead-out layer 131, it can better improve the wrinkles, warping and other problems of the display screen 2.

[0174] Alternatively, as one possible approach, such as Figures 24 to 30 As shown, the electronic device 200 provided in this application embodiment may include: a support member 1, a display screen 2, a middle frame 3, and a radiating member 4. The support member 1 is attached to the backlight side of the display screen 2, the middle frame 3 surrounds the support member 1 and the display screen 2, and the radiating member 4 is arranged around the outer periphery of the support member 1, the display screen 2, and the middle frame 3. There are gaps between the radiating member 4 and the support member 1, the display screen 2, and the middle frame 3.

[0175] The support component 1 may include a main support structure 11, a first structure 12, and a second structure 16. The main support structure 11 includes a main insulating medium 112 and long-chain carbon fibers 113, which are arranged in an alternating manner along multiple spatial directions within the main insulating medium 112. The first structure 12 is located on the side of the main support structure 11 away from the display screen 2. The first structure 12 is stacked and combined with the main support structure 11. The first structure 12 includes a first insulating medium 121 and a first current lead-out layer 131. The first insulating medium 121 is in direct contact with the main support structure 11 and encapsulates... The first structure includes a first resin matrix 1211 and a first reinforcing fiber 1212, the first reinforcing fiber 1212 being distributed in the first resin matrix 1211, a first current lead-out layer 131 being separate from and spaced apart from long-chain carbon fibers 113, the first current lead-out layer 131 being partially embedded in the first insulating medium 121 along a first direction, and the first current lead-out layer 131 being grounded; the second structure 16 is located between the main support structure 11 and the display screen 2, the second structure 16 including a second insulating medium 161 and a fourth current lead-out layer 134, the fourth current lead-out layer 134 being located on at least a portion of the outer surface surrounding the second insulating medium 161.

[0176] It should be noted that the support member 1, display screen 2, middle frame 3, radiator 4 and first current lead-out layer 131 in this application embodiment can all refer to the above embodiment, and will not be repeated here.

[0177] Optionally, embodiments of this application may further include a second current lead-out layer, and / or a fifth current lead-out layer, and / or a third current lead-out layer, wherein the second current lead-out layer is located on at least a portion of the outer surface of the periphery of the first insulating medium; the fifth current lead-out layer is wholly or partially embedded in the first insulating medium along the first direction and is in contact with the main support structure; the third current lead-out layer 133 is separate from and spaced apart from the long-chain carbon fiber 113, the third current lead-out layer 133 is partially embedded in the second insulating medium 161 along the first direction, and the third current lead-out layer 133 covers the entire second insulating medium 161, or the third current lead-out layer 133 is in contact with the main support structure 11, the third current lead-out layer 133 is wholly embedded in the second insulating medium 161 along the first direction, and the third current lead-out layer 133 covers the entire main support structure 11.

[0178] It should be understood that the fourth current lead-out layer 134 located on at least a portion of the outer surface surrounding the second insulating medium 161 means either the fourth current lead-out layer 134 located on a portion of the outer surface surrounding the second insulating medium 161, or the fourth current lead-out layer 134 located on the entire outer surface surrounding the second insulating medium 161, depending on the actual application.

[0179] Significantly, the fourth current lead-out layer 134 is located on the entire outer surface (all sides) of the second insulating medium 161, so that the support member 1 can guide as much of the conduction current induced in the main support structure 11 by the electromagnetic waves radiated by the radiator 4 when it is working to the outer surface of the first current lead-out layer 131 and the outer surface of the fourth current lead-out layer 134 as possible.

[0180] The fourth current extraction layer 134 can be configured with reference to the first current extraction layer 131, and will not be described in detail here. When the material of the fourth current extraction layer 134 is metal, when the radiator 4 is working and radiating signals, the electromagnetic waves generated by the radiator 4 induce a conduction current in the main support structure 11. The conduction current can be guided to at least the outer surface of the first current extraction layer 131 and the outer surface of the fourth current extraction layer 134, and then flow to the middle frame 3. At this time, the metal can also dissipate heat well.

[0181] Furthermore, the fourth current lead-out layer 134 may be selected to be the same as at least one of the materials, resistivity, and preparation process of the first current lead-out layer 131, and / or at least one of the materials, resistivity, and preparation process of the second current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the third current lead-out layer, in order to simplify the process and save costs.

[0182] It should be noted that the fourth current lead-out layer 134 can be electrically connected to the first current lead-out layer 131, and / or the second current lead-out layer, and / or the third current lead-out layer, and / or the fifth current lead-out layer, or they can be not electrically connected; no specific limitation is made here.

[0183] Therefore, at least the first current extraction layer 131 and the fourth current extraction layer 134 together extract the conduction current generated in the support member 1 by the electromagnetic waves radiated when the radiator 4 is working to the outer surface, and then flow to the middle frame 3. In this way, the support member 1 has little impact on the radiation efficiency of the radiator 4 and significantly reduces the loss of the radiator 4, resulting in lower cost. Overall, this makes the communication quality of the electronic device 200 good and the signal stable. In addition, since the fourth current extraction layer 134 is not located in the first direction, it has virtually no impact on the thickness of the support member 1.

[0184] Alternatively, as one possible approach, such as Figures 31 to 37 As shown, the electronic device 200 provided in this application embodiment may include: a support member 1, a display screen 2, a middle frame 3, and a radiating member 4. The support member 1 is attached to the backlight side of the display screen 2, the middle frame 3 surrounds the support member 1 and the display screen 2, and the radiating member 4 is arranged around the outer periphery of the support member 1, the display screen 2, and the middle frame 3. There are gaps between the radiating member 4 and the support member 1, the display screen 2, and the middle frame 3.

[0185] The support component 1 may include a main support structure 11, a first structure 12, and a third structure 17. There are multiple main support structures 11, each including a main insulating medium 112 and long-chain carbon fibers 113. The long-chain carbon fibers 113 are arranged in a staggered manner along multiple spatial directions within the main insulating medium 112. The first structure 12 is located on the side of the main support structure 11 away from the display screen 2. The first structure 12 is stacked and combined with the main support structure 11. The first structure 12 includes a first insulating medium 121 and a first current lead-out layer 131. The first insulating medium 121 is in direct contact with the main support structure 11. The first insulating medium 121 includes a first resin matrix 1211 and first reinforcing fibers 1212. The first reinforcing fibers 1212 are distributed within the first resin matrix 1211. The first current lead-out layer 131 and the long-chain carbon fibers... The first current lead-out layer 131 is partially embedded in the first insulating medium 121 along the first direction and is grounded. The third structure 17 includes a third insulating medium 171 and a sixth current lead-out layer 136. The third insulating medium 171 is located between any adjacent main support structures 11 and is in contact with the main support structure 11. The third insulating medium 171 includes a third resin matrix 1711 and a third reinforcing fiber 1712. The third reinforcing fiber 1712 is distributed in the third resin matrix 1711. The sixth current lead-out layer 136 is completely embedded in the third insulating medium 171. The sixth current lead-out layer 136 and any one of the long-chain carbon fibers 113 are separated by the third insulating medium 171. The sixth current lead-out layer 136 and any one of the main support structures 11 are separated by and spaced apart.

[0186] It should be noted that the support member 1, display screen 2, middle frame 3, radiator 4 and first current lead-out layer 131 in this application embodiment can all refer to the above embodiment, and will not be repeated here.

[0187] Optionally, embodiments of this application may further include a second current lead-out layer and / or a fifth current lead-out layer, wherein the second current lead-out layer is located on at least a portion of the outer surface of the first insulating medium; the fifth current lead-out layer is wholly or partially embedded in the first insulating medium along the first direction and is in contact with the main support structure.

[0188] The sixth current lead-out layer 136 can be fully embedded in the third insulating medium 171, or the sixth current lead-out layer 136 can be partially (not fully embedded) in the third insulating medium 171, without specific limitations.

[0189] The aforementioned sixth current lead-out layer 136 can be configured with reference to the first current lead-out layer 131, and will not be described in detail here. When the material of the sixth current lead-out layer 136 is metal, when the radiator 4 is working and radiating signals, the electromagnetic waves generated by the radiator 4 induce a conduction current in the main support structure 11. The conduction current can be guided at least to the outer surface of the first current lead-out layer 131 and the sixth current lead-out layer 136, and then flow to the middle frame 3. At this time, the metal can also dissipate heat well.

[0190] Furthermore, the sixth current lead-out layer 136 may be selected to be the same as at least one of the materials, resistivity, and preparation process of the first current lead-out layer 131, and / or at least one of the materials, resistivity, and preparation process of the second current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the third current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the fourth current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the fifth current lead-out layer, in order to simplify the process and save costs.

[0191] It should be noted that the sixth current lead-out layer 136 can be electrically connected to the first current lead-out layer 131, and / or the second current lead-out layer, and / or the fifth current lead-out layer, or they can be not electrically connected; no specific limitation is made here.

[0192] Furthermore, the third resin matrix 1711 can be configured with reference to either the first resin matrix 1211 or the second resin matrix 1611, and the third reinforcing fiber 1712 can be configured with reference to either the first reinforcing fiber 1212 or the second reinforcing fiber 1612; these details will not be elaborated further here. Significantly, selecting the same third resin matrix 1711 as either the first resin matrix 1211 or the second resin matrix 1611, and / or having the same third reinforcing fiber 1712 as either the first reinforcing fiber 1212 or the second reinforcing fiber 1612, simplifies the process and saves costs.

[0193] Therefore, at least the first current extraction layer 131 and the sixth current extraction layer 136 together extract the conduction current generated in the support member 1 by the electromagnetic waves radiated when the radiator 4 is working to its surface, and then flow to the middle frame 3. In this way, the support member 1 has little impact on the radiation efficiency of the radiator 4 and significantly reduces the loss of the radiator 4, resulting in lower cost. Overall, this makes the communication quality of the electronic device 200 good and the signal stable. In addition, since the sixth current extraction layer 136 is completely embedded in the third insulating medium 171, it has virtually no impact on the thickness of the support member 1.

[0194] Alternatively, as one possible approach, such as Figures 31 to 37As shown, the electronic device 200 provided in this application embodiment may include: a support member 1, a display screen 2, a middle frame 3, and a radiating member 4. The support member 1 is attached to the backlight side of the display screen 2, the middle frame 3 surrounds the support member 1 and the display screen 2, and the radiating member 4 is arranged around the outer periphery of the support member 1, the display screen 2, and the middle frame 3. There are gaps between the radiating member 4 and the support member 1, the display screen 2, and the middle frame 3.

[0195] The support component 1 may include a main support structure 11, a first structure 12, and a third structure 17. There are multiple main support structures 11, each including a main insulating medium 112 and long-chain carbon fibers 113. The long-chain carbon fibers 113 are arranged in a staggered manner along multiple spatial directions within the main insulating medium 112. The first structure 12 is located on the side of the main support structure 11 away from the display screen 2. The first structure 12 is stacked and combined with the main support structure 11. The first structure 12 includes a first insulating medium 121 and a first current extraction layer 131. The first insulating medium 121 is in direct contact with the main support structure 11. The first insulating medium 121 includes a first resin matrix 1211 and first reinforcing fibers 1212. The first reinforcing fibers 1212 are distributed within the first resin matrix 1211. The first current extraction layer 131 and the long-chain carbon fibers 113 are arranged in a staggered manner along multiple spatial directions within the main insulating medium 112. Carbon fibers 113 are discretely and spaced apart. The first current lead-out layer 131 is partially embedded in the first insulating medium 121 along the first direction and is grounded. The third structure 17 includes a third insulating medium 171 and a seventh current lead-out layer 137. The third insulating medium 171 is located between any adjacent main support structures 11 and is in contact with the main support structure 11. The third insulating medium 171 includes a third resin matrix 1711 and a third reinforcing fiber 1712. The third reinforcing fiber 1712 is distributed in the third resin matrix 1711. The seventh current lead-out layer 137 is partially or completely embedded in the third insulating medium 171 along the first direction and is in contact with any one of the main support structures 11. The seventh current lead-out layer 137 and the sixth current lead-out layer 136 are discretely and spaced apart.

[0196] It should be noted that the support member 1, display screen 2, middle frame 3, radiator 4 and first current lead-out layer 131 in this application embodiment can all refer to the above embodiment, and will not be repeated here.

[0197] Optionally, by setting the seventh current lead-out layer 137 to be completely embedded in the third insulating medium 171, the seventh current lead-out layer 137 can be protected from external environmental erosion, impact, scratches, etc., and the film imprint on the display screen 2 after hot pressing can be reduced, and the appearance of the support member 1 is also better.

[0198] Optionally, embodiments of this application may further include a second current lead-out layer, and / or a fifth current lead-out layer, and / or a sixth current lead-out layer, wherein the second current lead-out layer is located on at least a portion of the outer surface of the periphery of the first insulating medium; the fifth current lead-out layer is wholly or partially embedded in the first insulating medium along the first direction and is in contact with the main support structure; the sixth current lead-out layer is wholly embedded in the third insulating medium, and the sixth current lead-out layer is separated from any one of the long-chain carbon fibers by the third insulating medium, and the sixth current lead-out layer is separate from and spaced apart from any one of the main support structures.

[0199] The aforementioned seventh current lead-out layer 137 can be configured with reference to the first current lead-out layer 131, and will not be described in detail here. When the material of the seventh current lead-out layer 137 is metal, when the radiator 4 is working and radiating signals, the electromagnetic waves generated by the radiator 4 induce a conduction current in the main support structure 11. The conduction current can be guided at least to the outer surface of the first current lead-out layer 131 and the seventh current lead-out layer 137, and then flow to the middle frame 3. At this time, the metal can also dissipate heat well.

[0200] Furthermore, the seventh current lead-out layer 137 may be selected to be the same as at least one of the materials, resistivity, and preparation process of the first current lead-out layer 131, and / or at least one of the materials, resistivity, and preparation process of the second current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the third current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the fourth current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the fifth current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the sixth current lead-out layer, in order to simplify the process and save costs.

[0201] It should be noted that the seventh current lead-out layer 137 can be electrically connected to the first current lead-out layer 131, and / or the second current lead-out layer, and / or the fifth current lead-out layer, and / or the sixth current lead-out layer, or they can be not electrically connected; no specific limitation is made here.

[0202] Therefore, at least the first current extraction layer 131 and the seventh current extraction layer 137 together extract the conduction current generated in the support member 1 by the electromagnetic waves radiated when the radiator 4 is working to its surface, and then flow to the middle frame 3. In this way, the support member 1 has little impact on the radiation efficiency of the radiator 4 and significantly reduces the loss of the radiator 4, resulting in lower cost. Overall, this makes the communication quality of the electronic device 200 good and the signal stable. In addition, since the seventh current extraction layer 137 is partially or completely embedded in the third insulating medium 171 along the first direction, it has virtually no significant impact on the thickness of the support member 1.

[0203] Alternatively, as one possible approach, such as Figures 31 to 37 As shown, the electronic device 200 provided in this application embodiment may include: a support member 1, a display screen 2, a middle frame 3, and a radiating member 4. The support member 1 is attached to the backlight side of the display screen 2, the middle frame 3 surrounds the support member 1 and the display screen 2, and the radiating member 4 is arranged around the outer periphery of the support member 1, the display screen 2, and the middle frame 3. There are gaps between the radiating member 4 and the support member 1, the display screen 2, and the middle frame 3.

[0204] The support component 1 may include a main support structure 11, a first structure 12, and a third structure 17. There are multiple main support structures 11, each including a main insulating medium 112 and long-chain carbon fibers 113. The long-chain carbon fibers 113 are arranged in a staggered manner along multiple spatial directions within the main insulating medium 112. The first structure 12 is located on the side of the main support structure 11 away from the display screen 2. The first structure 12 is stacked and combined with the main support structure 11. The first structure 12 includes a first insulating medium 121 and a first current extraction layer 131. The first insulating medium 121 is in direct contact with the main support structure 11. The first insulating medium 121 includes a first resin matrix 1211 and a first reinforcing fiber 1212. The first current-leading layer 131 and the long-chain carbon fiber 113 are separated and spaced apart in the first resin matrix 1211. The first current-leading layer 131 is partially embedded in the first insulating medium 121 along the first direction and is grounded. The third structure 17 includes a third insulating medium 171 and an eighth current-leading layer 138. The third insulating medium 171 is located between any adjacent main support structures 11 and is in contact with the main support structure 11. The third insulating medium 171 includes a third resin matrix 1711 and a third reinforcing fiber 1712. The third reinforcing fiber 1712 is distributed in the third resin matrix 1711. The eighth current-leading layer 138 is located on at least a portion of the outer surface of the third insulating medium 171.

[0205] It should be noted that the support member 1, display screen 2, middle frame 3, radiator 4 and first current lead-out layer 131 in this application embodiment can all refer to the above embodiment, and will not be repeated here.

[0206] Optionally, embodiments of this application may further include a second current lead-out layer, and / or a fifth current lead-out layer, and / or a sixth current lead-out layer, and / or a seventh current lead-out layer, wherein the second current lead-out layer is located on at least a portion of the outer surface of the periphery of the first insulating medium; the fifth current lead-out layer is wholly or partially embedded in the first insulating medium along the first direction and is in contact with the main support structure; the sixth current lead-out layer is wholly embedded in the third insulating medium, and the sixth current lead-out layer has a third insulating medium between it and any one of the long-chain carbon fibers, and the sixth current lead-out layer is separate from and spaced apart from any one of the main support structures; the seventh current lead-out layer is partially or entirely embedded in the third insulating medium along the first direction, and the seventh current lead-out layer is in contact with any one of the main support structures, and the seventh current lead-out layer is separate from and spaced apart from the sixth current lead-out layer.

[0207] It should be noted that the third insulating medium 171 refers to the insulating medium between any two adjacent long-chain carbon fibers 113.

[0208] It should be understood that the eighth current lead-out layer 138 located on at least a portion of the outer surface surrounding the third insulating medium 171 means either the portion of the eighth current lead-out layer 138 located on the outer surface surrounding the third insulating medium 171, or the entire outer surface surrounding the eighth current lead-out layer 138, depending on the actual application.

[0209] Significantly, by selecting the eighth current lead-out layer 138 to be located on all the outer surfaces (all sides) around the third insulating medium 171, the support member 1 can guide as much of the conduction current induced in the main support structure 11 by the electromagnetic waves radiated by the radiator 4 during operation to at least the outer surfaces of the first current lead-out layer 131 and the eighth current lead-out layer 138.

[0210] The eighth current lead-out layer 138 can be configured with reference to the first current lead-out layer 131, and will not be described in detail here. When the material of the eighth current lead-out layer 138 is metal, when the radiator 4 is working and radiating signals, the electromagnetic waves generated by the radiator 4 induce a conduction current in the main support structure 11. The conduction current can be guided to at least the outer surface of the first current lead-out layer 131 and the outer surface of the eighth current lead-out layer 138, and then flow to the middle frame 3. At this time, the metal can also dissipate heat well.

[0211] Furthermore, the eighth current lead-out layer 138 may be selected to be the same as at least one of the materials, resistivity, and preparation process of the first current lead-out layer 131, and / or at least one of the materials, resistivity, and preparation process of the second current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the third current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the fourth current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the fifth current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the sixth current lead-out layer, and / or at least one of the materials, resistivity, and preparation process of the seventh current lead-out layer, in order to simplify the process and save costs.

[0212] It should be noted that the eighth current lead-out layer 138 can be electrically connected to the first current lead-out layer 131, and / or the second current lead-out layer, and / or the fifth current lead-out layer, and / or the sixth current lead-out layer, and / or the seventh current lead-out layer, or they can be not electrically connected; no specific limitation is made here.

[0213] Therefore, at least the first current lead-out layer 131 and the eighth current lead-out layer 138 together lead out the conduction current generated in the support member 1 by the electromagnetic waves radiated when the radiator 4 is working to the outer surface, and then flow to the middle frame 3. In this way, the support member 1 has little impact on the radiation efficiency of the radiator 4 and significantly reduces the loss of the radiator 4, resulting in lower cost. Overall, this makes the communication quality of the electronic device 200 good and the signal stable. In addition, since the eighth current lead-out layer 138 is not located in the first direction, it has virtually no impact on the thickness of the support member 1.

[0214] Based on the above, for example... Figures 31 to 37 As shown, the number of main support structures 11 in support member 1 is even.

[0215] Taking a main support structure 11 consisting of two parts as an example, the thickness direction of the support member 1 can be understood as follows: Figures 7 to 37 In the oz direction, the two main support structures 11 are arranged symmetrically with respect to the geometric center line of the support member 1, and the thickness of the two main support structures 11 is equal. It should be noted that the long-chain carbon fibers 113 on the two symmetrical main support structures 11 may be different.

[0216] Optionally, the number of main support structures 11 is multiple, and the multiple main support structures 11 are arranged in a symmetrical stacked manner in the thickness direction of the support member 1.

[0217] For ease of understanding, such as Figures 31 to 37 As shown, taking two main support structures 11 as an example, the thickness direction of support member 1 can be understood as... Figures 31 to 37In the oz direction, the two main support structures 11 are arranged symmetrically with respect to the geometric center line of the support member 1 as the axis of symmetry.

[0218] Therefore, the long-chain carbon fiber 113, the first insulating medium 121, and the third insulating medium 171 can be arranged symmetrically in mirror image along the thickness direction (lamination stacking direction) of the support 1. In this way, each structure can offset unidirectional warping and internal stress eccentricity during the heating, heat preservation, and cooling processes of hot pressing, so that the compressive stress and shear stress distribution of the entire support 1 is balanced and the interfacial bonding stress is consistent, which greatly reduces the risk of delamination failure. At the same time, there is no local stress concentration and no interlayer loosening, which enables the support 1 to bear the load as a whole, improve the overall bending stiffness and torsional stiffness, significantly optimize the structural strength, and also have the properties of being thin, high-strength, and deformation-resistant, making it suitable for supporting the display screen 2.

[0219] Based on the above, alternatively, as one possible approach, such as Figures 15 to 18 , Figure 21 , Figures 28 to 30 , Figures 35 to 37 As shown, the support provided in this application embodiment may further include: a connecting layer 139, the connecting layer 139 being located on at least a portion of the outer surface of the main support structure 11, and the material of the connecting layer 139 including a conductive material.

[0220] In the application, the connection layer 139 can be connected to at least one of the first current lead-out layer 131, the second current lead-out layer, the third current lead-out layer, the fourth current lead-out layer, the fifth current lead-out layer, the sixth current lead-out layer, the seventh current lead-out layer, or the eighth current lead-out layer.

[0221] It should be understood that at least part of the outer surface of the connecting layer 139 on the periphery of the main support structure 11 means either part of the outer surface of the connecting layer 139 on the periphery of the main support structure 11, or all of the outer surface of the connecting layer 139 on the periphery of the main support structure 11, without any specific limitation here.

[0222] Significantly, by selecting the connecting layer 139 to be located on all the outer surfaces (all sides) around the main support structure 11, the support member 1 can guide as much of the conduction current induced in the main support structure 11 by the electromagnetic waves radiated by the radiator 4 during operation to at least the outer surfaces of the first current lead-out layer 131 and the connecting layer 139.

[0223] The aforementioned conductive material can be a metal or a conductive paste, etc. Of course, the connecting layer 139 can also be the same as at least one of the materials, resistivity, and manufacturing processes of any of the first current lead-out layer 131, the second current lead-out layer, the third current lead-out layer, the fourth current lead-out layer, the fifth current lead-out layer, the sixth current lead-out layer, or the seventh current lead-out layer, in order to simplify the process and save costs.

[0224] It is worth noting that any support member 1 in the embodiments of this application may be provided with a connection layer 139, and is not limited to Figures 15 to 18 , Figure 21 , Figures 28 to 30 , Figures 35 to 37 The structure.

[0225] The support member provided in this application embodiment has a connecting layer on at least a portion of the outer surface around the main support structure. The connecting layer can be connected to at least one of the first, second, third, fourth, fifth, sixth, seventh, or eighth current lead-out layers to achieve electrical connection of multiple current lead-out layers from the first to the eighth current lead-out layers. It can also lead the conduction current generated in the support member by the electromagnetic waves radiated when the radiator is working to the outer surface and then flow to the middle frame. In this way, the support member has little impact on the radiation efficiency of the radiator and significantly reduces the loss of the radiator. The cost is low, and overall, the communication quality of the electronic device is good and the signal is stable. In addition, since the connecting layer is not located in the first direction, it has virtually no impact on the thickness of the support member.

[0226] Alternatively, as one possible approach, such as Figures 9 to 10 , Figures 13 to 14 , Figures 17 to 37 As shown, the support provided in this application embodiment may further include: a protective layer 15, the protective layer 15 being located on the side of the first structure 12 away from the main support structure 11, a groove k being provided in the protective layer 15, the groove k exposing part of the first current lead-out layer 131, and the exposed first current lead-out layer 131 being grounded.

[0227] In application, the size and shape of the groove k are not specifically limited, as long as the first current lead-out layer 131 is partially exposed.

[0228] It is worth noting that any support member 1 in the embodiments of this application may be provided with a protective layer 15, and is not limited to Figures 9 to 10 , Figures 13 to 14 , Figures 17 to 37 The structure.

[0229] The support component provided in this application embodiment can prevent the first current lead-out layer from being corroded, bumped, or scratched by moisture and oxygen in the external environment through the protective layer, thereby protecting the first current lead-out layer and ensuring the structural and performance stability of the support component. In addition, it can also avoid the risk of display screen film imprints after hot pressing, thus ensuring the appearance quality.

[0230] Alternatively, as one possible approach, such as Figure 8 , Figure 10 , Figure 12 , Figure 14 , Figure 16 , Figures 18 to 21 , Figures 32 to 37 As shown, the support provided in this application embodiment may further include: a fourth insulating medium 14, which is located between the main support structure 11 or the third current lead-out layer 133 and the display screen 2. The fourth insulating medium 14 includes a fourth resin matrix 141 and a fourth reinforcing fiber 142, with the fourth reinforcing fiber 142 distributed in the fourth resin matrix 141.

[0231] In application, the fourth resin matrix 141 can be any one of the first resin matrix 1211, the second resin matrix 1611, or the third resin matrix 1711, and the fourth reinforcing fiber 142 can be any one of the first reinforcing fiber 1212, the second reinforcing fiber 1612, or the third reinforcing fiber 1712, which will not be elaborated here. Significantly, selecting the fourth resin matrix 141 to be the same as any one of the first resin matrix 1211, the second resin matrix 1611, and the third resin matrix 1711, and / or, the fourth reinforcing fiber 142 to be the same as any one of the first reinforcing fiber 1212, the second reinforcing fiber 1612, and the third reinforcing fiber 1712, simplifies the process and saves costs.

[0232] It is worth noting that any support member 1 in the embodiments of this application may be provided with a fourth insulating medium 14, and is not limited to Figure 8 , Figure 10 , Figure 12 , Figure 14 , Figure 16 , Figures 18 to 21 , Figures 32 to 37 The structure.

[0233] The support component provided in this application embodiment has a fourth insulating medium between the main support structure or the third current lead-out layer and the display screen. Due to the near-symmetrical structure during the manufacturing process, unidirectional warping and internal stress eccentricity can be offset during the heating, heat preservation, and cooling processes of hot pressing. The compressive and shear stress distribution of the entire support component is balanced, and the interfacial bonding stress is consistent, which greatly reduces the risk of delamination failure. At the same time, there is no local stress concentration and no loosening between layers, which enables the support component to work together to bear the load, improve the overall bending stiffness and torsional stiffness, significantly optimize the structural strength, and have the properties of being lightweight, high-strength, and deformation-resistant.

[0234] See again Figures 7 to 37 The following provides a detailed description of various support components 1 with different structures and electronic devices 200 using support components 1.

[0235] like Figure 7As shown, the electronic device 200 provided in this application embodiment includes a support member 1, a display screen 2, a middle frame 3, and a radiating member 4. The support member 1 is attached to the backlight side of the display screen 2, the middle frame 3 surrounds the support member 1 and the display screen 2, and the radiating member 4 is arranged around the outer periphery of the support member 1, the display screen 2, and the middle frame 3. The radiating member 4 does not contact the support member 1, the display screen 2, or the middle frame 3. The support member 1 includes a main support structure 11 and a first structure 12. The main support structure 11 includes a main insulating medium 112, a first carbon fiber 1131, a second carbon fiber 1132, and a third carbon fiber 1133. The first carbon fiber 1131 extends in the main insulating medium 112 along the 0° direction, the second carbon fiber 1132 extends in the main insulating medium 112 along the 90° direction, and the third carbon fiber 1133 extends in the main insulating medium 112 along the 90° direction. 1133 extends along the 0° direction in the main insulating medium 112; the first structure 12 is located on the side of the main support structure 11 away from the display screen 2, the first structure 12 is stacked and combined with the main support structure 11, the first structure 12 includes the first insulating medium 121 and the first current lead-out layer 131, the first insulating medium 121 is in direct contact with the main support structure 11, the first insulating medium 121 includes the first resin matrix 1211 and the first reinforcing fiber 1212, the first reinforcing fiber 1212 is distributed in the first resin matrix 1211, the first current lead-out layer 131 and the third carbon fiber 1133 are separate and spaced apart, the first current lead-out layer 131 is partially embedded in the first insulating medium 121 along the first direction and grounded, the first current lead-out layer 131 is partially disposed.

[0236] Figure 8 and Figure 7 The only difference is: Figure 8 A fourth insulating medium 14 is also provided, which is located between the first carbon fiber 1131 and the display screen 2.

[0237] Figure 9 and Figure 7 The only difference is: Figure 9 A protective layer 15 is also provided, which is located between the first current lead-out layer and the middle frame 3. A groove k is provided in the protective layer 15, which exposes part of the first current lead-out layer 131. The exposed first current lead-out layer 131 is connected to the middle frame 3.

[0238] Figure 10 and Figure 7 The only difference is: Figure 10 The device also includes a fourth insulating medium 14 and a protective layer 15. The fourth insulating medium 14 is located between the first carbon fiber 1131 and the display screen 2. The protective layer 15 is located between the first current lead-out layer and the middle frame 3. A groove k is provided in the protective layer 15, which exposes part of the first current lead-out layer 131. The exposed first current lead-out layer 131 is connected to the middle frame 3.

[0239] Figure 11 and Figure 7 The only difference is: Figure 11 The medium also includes a second current lead-out layer 132, which is located along the second direction on all sides of the first insulating medium 121.

[0240] Figure 12 and Figure 11 The only difference is: Figure 12 A fourth insulating medium 14 is also provided, which is located between the first carbon fiber 1131 and the display screen 2.

[0241] Figure 13 and Figure 11 The only difference is: Figure 13 A protective layer 15 is also provided, which is located between the first current lead-out layer and the middle frame 3. A groove k is provided in the protective layer 15, which exposes part of the first current lead-out layer 131. The exposed first current lead-out layer 131 is connected to the middle frame 3.

[0242] Figure 14 and Figure 11 The only difference is: Figure 14 The device also includes a fourth insulating medium 14 and a protective layer 15. The fourth insulating medium 14 is located between the first carbon fiber 1131 and the display screen 2. The protective layer 15 is located between the first current lead-out layer and the middle frame 3. A groove k is provided in the protective layer 15, which exposes part of the first current lead-out layer 131. The exposed first current lead-out layer 131 is connected to the middle frame 3.

[0243] Figure 15 and Figure 11 The only difference is: Figure 15 A connecting layer 139 is also provided, which is located on all sides of the main support structure 11.

[0244] Figure 16 and Figure 15 The only difference is: Figure 16 A fourth insulating medium 14 is also provided, which is located between the first carbon fiber 1131 and the connecting layer 139 and the display screen 2.

[0245] Figure 17 and Figure 15 The only difference is: Figure 17 A protective layer 15 is also provided, which is located between the first current lead-out layer and the middle frame 3. A groove k is provided in the protective layer 15, which exposes part of the first current lead-out layer 131. The exposed first current lead-out layer 131 is connected to the middle frame 3.

[0246] Figure 18and Figure 15 The only difference is: Figure 18 The device also includes a fourth insulating medium 14 and a protective layer 15. The fourth insulating medium 14 is located between the first carbon fiber 1131 and the connecting layer 139 and the display screen 2. The protective layer 15 is located between the first current lead-out layer and the middle frame 3. A groove k is provided in the protective layer 15, which exposes part of the first current lead-out layer 131. The exposed first current lead-out layer 131 is connected to the middle frame 3.

[0247] Figure 19 and Figure 10 The only difference is: Figure 19 The medium also includes a third current lead-out layer 133, which is fully embedded in the first insulating medium 121 along the first direction. The third current lead-out layer 133 is separate from and spaced apart from the first current lead-out layer 131, and the third current lead-out layer 133 is partially provided.

[0248] Figure 20 and Figure 19 The only difference is: Figure 20 The medium also includes a second current lead-out layer 132, which is located along the second direction on all sides of the first insulating medium 121. The first current lead-out layer 131 and the third current lead-out layer 133 are both integrally arranged, and the first current lead-out layer 131, the second current lead-out layer 132, and the third current lead-out layer 133 are all connected.

[0249] Figure 21 and Figure 20 The only difference is: Figure 21 A connecting layer 139 is also provided, which is located on all sides of the main support structure 11. The first current lead-out layer 131, the second current lead-out layer 132, the third current lead-out layer 133, and the connecting layer 139 are all connected.

[0250] Figure 22 and Figure 9 The only difference is: Figure 22 A second structure 16 is also provided, which is located between the main support structure 11 and the display screen 2. The second structure 16 includes a second insulating medium 161 and a third current lead-out layer 133. The second insulating medium 161 includes a second resin matrix 1611 and a second reinforcing fiber 1612. The second reinforcing fiber 1612 is distributed in the second resin matrix 1611. The second insulating medium 161 is in contact with the main support structure 11. The third current lead-out layer 133 is separate from and spaced apart from the long chain carbon fiber 113. The third current lead-out layer 133 is partially embedded in the second insulating medium 161 along the first direction and covers the entire second insulating medium 161.

[0251] Figure 23 and Figure 22 The only difference is: Figure 23 The third current lead-out layer 133 is in contact with the main support structure 11. The third current lead-out layer 133 is completely embedded in the second insulating medium 161 along the first direction. The third current lead-out layer 133 covers the entire main support structure 11. The second insulating medium 161 is in contact with the display screen 2.

[0252] Figure 24 and Figure 22 The only difference is: Figure 24 A fourth current lead-out layer 134 is also provided, which is located on all sides of the second insulating medium 161. The third current lead-out layer 133 is provided as a whole layer and is connected to the fourth current lead-out layer 134.

[0253] Figure 25 and Figure 23 The only difference is: Figure 25 A fourth current lead-out layer 134 is also provided, which is located on all sides of the second insulating medium 161. The third current lead-out layer 133 is provided as a whole layer and is connected to the fourth current lead-out layer 134.

[0254] Figure 26 and Figure 25 The only difference is: Figure 25 Two third current lead-out layers 133 are provided, and both third current lead-out layers 133 are arranged as a whole. One third current lead-out layer 133 is separate from and spaced apart from the long chain carbon fiber 113 and is partially embedded in the second insulating medium 161 along the first direction. The other third current lead-out layer 133 is in contact with the main support structure 11 and is completely embedded in the second insulating medium 161 along the first direction. The second insulating medium 161 is between the two third current lead-out layers 133. The two third current lead-out layers 133 are connected to the fourth current lead-out layer 134.

[0255] Figure 27 and Figure 24 The only difference is: Figure 27 It also includes a connection layer 139, a third current lead-out layer 133, a fourth current lead-out layer 134, and the connection layer 139.

[0256] Figure 28 and Figure 25 The only difference is: Figure 28 It also includes a connection layer 139, a third current lead-out layer 133, a fourth current lead-out layer 134, and the connection layer 139.

[0257] Figure 29 and Figure 26 The only difference is: Figure 29The system also includes a connection layer 139, which is connected to two third current lead-out layers 133, a fourth current lead-out layer 134, and the connection layer 139.

[0258] Figure 30 and Figure 29 The only difference is: Figure 29 The medium also includes a second current lead-out layer 132, which is located on the entire side of the first insulating medium 121. The second current lead-out layer 132, two third current lead-out layers 133, a fourth current lead-out layer 134, and a connecting layer 139 are connected together.

[0259] Figure 31 and Figure 9 The only difference is: Figure 31 There are two main support structures 11 in the middle. Figure 31 The system also includes a third structure 17, which comprises a third insulating medium 171 and a sixth current lead-out layer 136. The third insulating medium 171 is located between any adjacent main support structures 11 and is in contact with the main support structures 11. The third insulating medium 171 comprises a third resin matrix 1711 and a third reinforcing fiber 1712. The third reinforcing fiber 1712 is distributed in the third resin matrix 1711. The sixth current lead-out layer 136 is completely embedded in the third insulating medium 171. The sixth current lead-out layer 136 is separate from any one of the main support structures 11 and is spaced apart. The sixth current lead-out layer 136 is partially disposed.

[0260] Figure 32 and Figure 31 The only difference is: Figure 32 A fourth insulating medium 14 is also provided, which is located between a first carbon fiber 1131 and the display screen 2.

[0261] Figure 33 and Figure 32 The only difference is: Figure 33 The medium also includes a seventh current lead-out layer 137, which is partially embedded in the third insulating medium 171 along the first direction. The seventh current lead-out layer 137 is located between the third carbon fiber 1133 and the sixth current lead-out layer 136 on the side near the display screen 2. The seventh current lead-out layer 137 and the sixth current lead-out layer 136 are separate and spaced apart. The seventh current lead-out layer 137 is partially provided.

[0262] Figure 34 and Figure 33 The only difference is: Figure 34 An eighth current lead-out layer 138 is also provided, which is located on all sides of the third insulating medium 171. The seventh current lead-out layer 137 is provided as a whole layer and is connected to the eighth current lead-out layer 138.

[0263] Figure 35 and Figure 34 The only difference is: Figure 35 A connecting layer 139 is also provided. The connecting layer 139 is located on all sides of a main support structure 11 near the display screen 2. The seventh current lead-out layer 137, the eighth current lead-out layer 138 and the connecting layer 139 are connected.

[0264] Figure 36 and Figure 34 The only difference is: Figure 36 A connecting layer 139 is also provided. The connecting layer 139 is located on all sides of a main support structure 11 on the side away from the display screen 2. The seventh current lead-out layer 137, the eighth current lead-out layer 138 and the connecting layer 139 are connected.

[0265] Figure 37 and Figure 36 The only difference is: Figure 37 There are two connection layers 139. One connection layer 139 is located on all sides of a main support structure 11 on the side away from the display screen 2, and the other connection layer 139 is located on all sides of a main support structure 11 on the side close to the display screen 2. The seventh current lead-out layer 137, the eighth current lead-out layer 138, and the two connection layers 139 are connected.

[0266] The following is for reference. Figures 38 to 41 The preparation method of the support member 1 provided in the embodiments of this application will be described in detail. It should be noted that all structures in the embodiments of this application can be referred to the above embodiments, and will not be repeated here.

[0267] like Figure 38 As shown, the method for preparing the support member 1 provided in this application embodiment may include the following steps: S1, such as Figure 38 As shown in Figures (a)-(c), a semi-cured main support structure 11' and a semi-cured first structure 12' are obtained, and then the semi-cured main support structure 11' and the semi-cured first structure 12' are stacked along the first direction.

[0268] S2, such as Figure 38 As shown in Figures (c)-(d), a hot pressing process is used to press and solidify the semi-cured main support structure 11' and the semi-cured first structure 12' to form the support component 1.

[0269] In applications, the semi-cured state refers to an intermediate state formed by thermosetting resins, such as epoxy resins, styrene-acrylic resins, and bismaleimide resins, after partial cross-linking. It can be solid or flexible at room temperature, losing its fluidity. When heated to 80℃~200℃, its viscosity drops sharply, and it can melt and flow again. Continuing to raise the temperature and pressurize will complete the final cross-linking and enter the irreversible fully cured state.

[0270] The hot pressing here can be vacuum hot pressing, 3D hot pressing, etc. High-temperature curing allows the resin matrix to harden rapidly, resulting in good adhesion and a low risk of detachment after curing.

[0271] In other words, the semi-cured main support structure 11' and the semi-cured first structure 12' refer to the intermediate state in which the main resin matrix and the first resin matrix 1211 are not fully cross-linked and cured. After heating and pressing, the main resin matrix and the first resin matrix 1211 can be fully cured, thereby realizing the layering and bonding (specifically, adhesion) of the main support structure 11 and the first structure 12 together.

[0272] Optionally, the steps for obtaining the semi-cured main support structure 11' can be as follows: first, the original long-chain carbon fiber filaments are unfurled or woven, then pre-impregnated with the main resin matrix, cut, and finally stacked to form the semi-cured main support structure 11'. In the preparation of conventional support components, the semi-cured structure is directly hot-pressed after being stacked. However, in this embodiment, the semi-cured main support structure 11' is first briefly stored, and then hot-pressed with the semi-cured first structure 12' in a subsequent process.

[0273] Optionally, the steps for obtaining the semi-cured first structure 12' can be as follows: first, obtain a pre-cured first insulating medium 121'', and then form a first current lead-out layer 131 in the pre-cured first insulating medium 121'' to obtain the semi-cured first structure 12'. Specifically, the first current lead-out layer 131 can be formed in the pre-cured first insulating medium 121'' through steps such as lamination, exposure, development, etching, and stripping, partially embedded therein along the first direction. Alternatively, the first current lead-out layer 131 can be designed using laser engraving, cavity embedding technology, etc., to achieve the required shape, thickness, and position, and then the thickness of the first current lead-out layer 131 can be increased or decreased through any of the following methods: chemical plating, electroplating, etching, etc., to meet the requirements of different radiators (such as antennas) for line impedance. For example, the function of a high-frequency antenna generally requires the thickness of the first current lead-out layer 131 to be greater than or equal to 2μm. Furthermore, in the preparation of conventional support components, the pre-cured first insulating medium 121'' is cured first and then the first current lead-out layer 131 is prepared, while in the embodiments of this application, the first current lead-out layer 131 is prepared directly in the pre-cured first insulating medium 121''.

[0274] It should be noted that there is no specific limitation on the order of preparing the semi-cured main support structure 11' and the semi-cured first structure 12'. The semi-cured main support structure 11' can be prepared first, followed by the semi-cured first structure 12', or the semi-cured first structure 12' can be prepared first, followed by the semi-cured main support structure 11', or the semi-cured first structure 12' and the semi-cured main support structure 11' can be prepared simultaneously.

[0275] Furthermore, the number of semi-cured main support structure 11' and semi-cured first structure 12' is not limited to one. Regardless of the number of each, they can be temporarily stored in a semi-cured state and then stacked and heat-pressed as needed in subsequent processes.

[0276] Optionally, a first current lead-out layer 131 may be provided in the pre-cured first insulating medium 121''. This can also be achieved using laser direct forming technology, laser modified ceramic technology, laser ablation patterning, additive manufacturing process, chemical plating process, etching technology system, etc.

[0277] Optionally, in the step of embedding the first current lead-out layer 131 inside the first insulating medium 121, the embedded circuit board technology can be used to replace the traditional surface electroplating or etching process. Specifically, grooves are made in the pre-cured first insulating medium 121'' by laser ablation or precision milling, and then filled with conductive materials, such as copper paste or electroplated copper. Alternatively, the embedded patterning process can be used to pre-embed the pattern of the first current lead-out layer in the multilayer pre-cured first insulating medium 121'', and then the fully embedded structure is achieved by lamination.

[0278] Alternatively, the first structure 12 can be fabricated using a coreless substrate process. The core of this process is to use a detachable core as a temporary support, which is then peeled off after multilayer lamination to form a coreless structure. Specific steps may include lamination, circuit fabrication, core removal, and post-processing.

[0279] Therefore, we can obtain the following respectively: Figure 39 and Figure 40 The first structure 12 is shown. (As shown...) Figure 39 As shown, the first current lead-out layer 131 is partially embedded in the first insulating medium 121, and the surface of the first current lead-out layer 131 away from the display screen along the first direction is flush with the surface of the first insulating medium 121 away from the display screen along the first direction.

[0280] like Figure 40As shown, the first current lead-out layer 131 is completely embedded in the first insulating medium 121. The surface of the first current lead-out layer 131 away from the display screen along the first direction is lower than the surface of the first insulating medium 121 away from the display screen along the first direction. The difference between the two is the depth difference d, which is generally less than or equal to 5μm.

[0281] Figure 39 and Figure 40 The structure is called a buried circuit. The buried circuit can effectively reduce the thickness of the support member 1 and increase the elastic modulus of the support member 1. Specifically, the elastic modulus of the support member 1 with the first current lead-out layer 131 can increase by about 30%.

[0282] It should be noted that the third, fifth, sixth, and seventh current extraction layers can all be fabricated with reference to the first current extraction layer, and will not be elaborated here.

[0283] The method for preparing the support member provided in this application embodiment is simple and easy to implement, forming a support member that is thin along the first direction, has a high elastic modulus, high stiffness, strong resistance to deformation, low probability of wrinkles and deformation, sufficient flatness, and can conduct the conductive current generated by electromagnetic waves to the outer surface of the first current lead-out layer. When such a support member is used to support a display screen, it is opaque and will not affect the light output and display of the display screen. It can also avoid the risk of display screen film imprints after hot pressing, ensuring the appearance quality. In addition, it is well adapted to existing processes, which facilitates large-scale mass production and is also economical.

[0284] Alternatively, as one possible approach, such as Figure 41 As shown, the semi-cured first structure provided in this application embodiment includes a semi-cured first insulating medium, a first current lead-out layer, and a second current lead-out layer. Therefore, the steps for obtaining the semi-cured first structure may include: S111, such as Figure 41 As shown in Figures (a)-(b), the pre-cured first insulating medium 121'' is obtained.

[0285] The size of the pre-cured first insulating medium 121'' is larger than the size of the semi-cured first insulating medium 121'.

[0286] S112, such as Figure 41 As shown in Figures (a)-(b), the first current extraction layer ( Figure 41 (not shown in Figures (a)-(b)) is partially embedded in the pre-cured first insulating medium 121'' along the first direction, and a first through hole is formed along the first direction in the portion D of the pre-cured first insulating medium 121'' that is larger than the semi-cured first insulating medium 121'. Figure 41(Figures (a)-(b) are not shown), a second current lead-out layer 132 is provided in the first via, and then the part of part D except for the second current lead-out layer 132 is removed to form a semi-cured first structure 12'.

[0287] In applications, the first via can be formed by drilling (such as laser etching drilling, mechanical drilling, etc.), computer digital control, 3D plugging (such as 3D vacuum plugging), etc.

[0288] It should be noted that the fourth and eighth current extraction layers can be fabricated with reference to the second current extraction layer, and will not be elaborated here.

[0289] Therefore, a semi-cured first structure can be prepared by a simple and easy-to-implement method, and the semi-cured first structure has good performance.

[0290] Optionally, as an implementation method, the support member provided in the embodiments of this application further includes a connecting layer, then the steps of obtaining the semi-cured main support structure may include: S121. Obtain the pre-cured main support structure.

[0291] The size of the pre-cured main support structure is larger than that of the semi-cured main support structure.

[0292] S122. A second through hole is opened along the first direction in the part of the pre-cured main support structure that is larger than the semi-cured main support structure, and a connecting layer is set in the second through hole. Then, the part of the pre-cured main support structure that is larger than the semi-cured main support structure except for the connecting layer is removed to form a semi-cured main support structure.

[0293] In applications, the second via can be formed using methods such as drilling (e.g., laser etching drilling, mechanical drilling), computer-controlled digital drilling, or 3D plugging (e.g., 3D vacuum plugging). Significantly, 3D plugging is the preferred method for processing the second via.

[0294] It should be noted that when the outer surface of the insulating medium is smooth, vias can be formed in any way; however, when the outer surface of the insulating medium is uneven, it is best to use 3D plugging to form vias. Furthermore, when preparing the non-smooth surface, it is necessary to first avoid the non-smooth areas, such as curved areas, in the molten state, and form a second via in a planar area closer to the curved area. Then, clean the impurities inside the second via, and fill the second via (blind via or through via) with non-solid material. At this point, the non-solid material can automatically flow into and fill the second via. It should be noted that a blind via is a hole that does not penetrate the insulating medium along the first direction, while a through via is a hole that penetrates the insulating medium along the first direction. This prevents short circuits caused by residual air bubbles or impurities in the second via and improves the mechanical strength of the inner wall of the second via.

[0295] The second via can be filled with any of the following: metal, conductive paste, conductive resin, etc., and these can all be filled using methods such as vacuum pressure injection. When filling the second via with conductive paste or conductive resin, vacuum pressure injection is less likely to generate air bubbles, and the filling rate within the second via is high. Specifically, it can be done in 10... -3 Under vacuum conditions, conductive paste and conductive resin are injected to completely eliminate air bubbles in the second vias, reducing the bubble rate from 5% to less than 0.5% and increasing the filling rate from 80% to 99.97%. Furthermore, injecting conductive paste and conductive resin into the channels under high pressure ensures that micron-sized pores (e.g., 0.1mm diameter, while conventional filling methods only achieve 0.15mm diameter) are completely filled. In addition, the interlayer alignment accuracy can reach ±8μm, a significant improvement over the traditional ±25μm.

[0296] Furthermore, if conductive resin is injected into the second via, a resin of the same system as the first resin matrix, second resin matrix, third resin matrix, and fourth resin matrix can be selected. This will generate adhesion after curing, reducing the possibility of the resin falling off due to insufficient adhesion after curing.

[0297] Therefore, a semi-cured main support structure can be prepared by a simple and easy-to-implement method, and the semi-cured main support structure has good performance.

[0298] It should be understood that the above description is merely to help those skilled in the art better understand the embodiments of this application, and is not intended to limit the scope of the embodiments of this application. Those skilled in the art can obviously make various equivalent modifications or variations based on the examples given above, or combinations of any two or more of the above embodiments. Such modifications, variations, or combinations also fall within the scope of the embodiments of this application.

[0299] It should also be understood that the above description of the embodiments of this application focuses on highlighting the differences between the various embodiments. Any similarities or differences not mentioned can be referred to each other. For the sake of brevity, they will not be repeated here.

[0300] It should also be understood that the methods, situations, categories, and classifications of embodiments in this application are for the convenience of description only and should not constitute a special limitation. Various methods, categories, situations, and features in embodiments can be combined without contradiction.

[0301] It should also be understood that, in the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0302] Finally, it should be noted that the above descriptions are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A support member, characterized in that, Applied to an electronic device, the electronic device further including a display screen, the support member being attached to the backlight side of the display screen, the support member comprising: The main support structure includes a main insulating medium and long-chain carbon fibers, wherein the long-chain carbon fibers are overlapped and arranged in the main insulating medium in multiple directions; A first structure is located on the side of the main support structure away from the display screen. The first structure includes a first insulating medium and a first current lead-out layer. The first insulating medium is in contact with the main support structure. The first insulating medium includes a first resin matrix and a first reinforcing fiber. The first reinforcing fiber is distributed in the first resin matrix. The first current lead-out layer is separate from and spaced apart from the long-chain carbon fiber. The first current lead-out layer is partially embedded in the first insulating medium along a first direction. The first current lead-out layer is grounded. Wherein, the first direction is a direction parallel to the thickness direction of the support member.

2. The support member according to claim 1, characterized in that, The first structure further includes a second current lead-out layer, which is located on at least a portion of the outer surface of the first insulating medium.

3. The support member according to claim 1, characterized in that, The support also includes a second structure located between the main support structure and the display screen. The second structure includes a second insulating medium and a third current lead-out layer. The second insulating medium includes a second resin matrix and a second reinforcing fiber, with the second reinforcing fiber distributed in the second resin matrix. The second insulating medium is in contact with the main support structure. The third current-leading layer is separate from and spaced apart from the long-chain carbon fibers. The third current-leading layer is partially embedded in the second insulating medium along the first direction, and the third current-leading layer covers the entire second insulating medium. And / or, The third current lead-out layer is in contact with the main support structure, and the third current lead-out layer is completely embedded in the second insulating medium along the first direction, and the third current lead-out layer covers the entire main support structure.

4. The support member according to claim 3, characterized in that, The second structure further includes a fourth current lead-out layer located on at least a portion of the outer surface of the second insulating medium.

5. The support member according to claim 1, characterized in that, The first structure further includes a fifth current lead-out layer, which is embedded in the first insulating medium along the first direction. The fifth current lead-out layer is in contact with the main support structure, and the fifth current lead-out layer is separate from and spaced apart from the first current lead-out layer.

6. The support member according to claim 1, characterized in that, The number of main support structures is multiple; The support also includes a third structure, which includes a third insulating medium and a sixth current lead-out layer. The third insulating medium is located between any adjacent main support structures and is in contact with the main support structures. The third insulating medium includes a third resin matrix and a third reinforcing fiber, and the third reinforcing fiber is distributed in the third resin matrix. The sixth current lead-out layer is completely embedded in the third insulating medium along the first direction, and the sixth current lead-out layer is separate from the main support structure and is spaced apart.

7. The support member according to claim 6, characterized in that, The third structure further includes a seventh current lead-out layer, which is embedded in the third insulating medium along the first direction. The seventh current lead-out layer is in contact with the main support structure, and the seventh current lead-out layer is separate from and spaced apart from the sixth current lead-out layer.

8. The support member according to claim 6, characterized in that, The third structure further includes an eighth current lead-out layer, which is located on at least a portion of the outer surface of the third insulating medium.

9. The support member according to claim 6, characterized in that, The number of main support structures is even.

10. The support member according to any one of claims 1 to 9, characterized in that, The support also includes a connecting layer located on at least a portion of the outer surface of the main support structure, and the connecting layer is made of a conductive material.

11. The support member according to any one of claims 1 to 9, characterized in that, The support also includes a protective layer located on the side of the first structure away from the main support structure. The protective layer has a groove that exposes part of the first current lead-out layer, and the exposed first current lead-out layer is grounded.

12. The support member according to any one of claims 1 to 9, characterized in that, The support also includes a fourth insulating medium, which is located between the main support structure or the third current lead-out layer and the display screen. The fourth insulating medium includes a fourth resin matrix and a fourth reinforcing fiber, with the fourth reinforcing fiber distributed in the fourth resin matrix.

13. The support member according to any one of claims 1 to 9, characterized in that, The resistivity of the first current lead-out layer, the resistivity of the second current lead-out layer, the resistivity of the third current lead-out layer, the resistivity of the fourth current lead-out layer, the resistivity of the fifth current lead-out layer, the resistivity of the sixth current lead-out layer, the resistivity of the seventh current lead-out layer, and the resistivity of the eighth current lead-out layer are all less than or equal to 10. -3 Ω•m.

14. The support member according to any one of claims 1 to 9, characterized in that, The materials of the first current lead-out layer, the second current lead-out layer, the third current lead-out layer, the fourth current lead-out layer, the fifth current lead-out layer, the sixth current lead-out layer, the seventh current lead-out layer, and the eighth current lead-out layer include any one of metal and conductive paste.

15. The support member according to any one of claims 1 to 9, characterized in that, The electronic device also includes a mid-frame that surrounds the support and the display screen, and the first current lead-out layer is connected to the mid-frame.

16. The support member according to any one of claims 1 to 9, characterized in that, The electronic device further includes a radiating element, which is disposed around the outer periphery of the support and the display screen, and there is a gap between the radiating element and the support and the display screen.

17. The support member according to any one of claims 1 to 9, characterized in that, The first resin matrix, the second resin matrix, the third resin matrix, and the fourth resin matrix each include at least one of epoxy resin, styrene-acrylic resin, and bismaleimide resin.

18. The support member according to any one of claims 1 to 9, characterized in that, The first insulating medium, the second insulating medium, the third insulating medium, and the fourth insulating medium are all the same.

19. A method for preparing a support member, characterized in that, The support member is used in an electronic device, which further includes a display screen. The support member is attached to the backlight side of the display screen, and the method for manufacturing the support member includes: Obtain a semi-cured first structure and a semi-cured main support structure, and then stack the semi-cured first structure and the semi-cured main support structure along a first direction; The support component is formed by hot-pressing and curing the semi-cured first structure and the semi-cured main support structure using a hot-pressing process. The support component includes a main support structure and a first structure. The main support structure includes a main insulating medium and long-chain carbon fibers, which are overlapped and arranged in the main insulating medium along multiple directions. The first structure is located on the side of the main support structure away from the display screen. The first structure includes a first insulating medium and a first current-leading layer. The first insulating medium is in contact with the main support structure. The first insulating medium includes a first resin matrix and a first reinforcing fiber, which is distributed in the first resin matrix. The first current-leading layer is separate from and spaced apart from the long-chain carbon fibers. The first current-leading layer is partially embedded in the first insulating medium along a first direction and is grounded. The first direction is parallel to the thickness direction of the support component.

20. The method for preparing the support member according to claim 19, characterized in that, The semi-cured first structure includes a semi-cured first insulating medium, a first current lead-out layer, and a second current lead-out layer. Obtaining the semi-cured first structure includes: Obtain a pre-cured first insulating medium; wherein the size of the pre-cured first insulating medium is larger than the size of the semi-cured first insulating medium; The first current lead-out layer is partially embedded in the pre-cured first insulating medium along the first direction, and a first through hole is formed along the first direction in the portion of the pre-cured first insulating medium that is larger than the semi-cured first insulating medium. The second current lead-out layer is disposed in the first through hole, and then the portion of the pre-cured first insulating medium that is larger than the semi-cured first insulating medium, excluding the second current lead-out layer, is removed to form the semi-cured first structure.

21. The method for preparing the support member according to claim 19, characterized in that, The support component further includes a connecting layer, and the process of obtaining the semi-cured main support structure includes: Obtain a pre-cured main support structure; wherein the size of the pre-cured main support structure is larger than the size of the semi-cured main support structure; A second through hole is formed along the first direction in the portion of the pre-cured main support structure that is larger than the semi-cured main support structure, and a connecting layer is provided in the second through hole. Then, the portion of the pre-cured main support structure that is larger than the semi-cured main support structure, excluding the connecting layer, is removed to form the semi-cured main support structure.

22. An electronic device, characterized in that, This includes the support member as described in any one of claims 1 to 18, or the support member prepared by the method described in any one of claims 19 to 21.

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