Wafer chip probe test data processing method and system and medium
By screening and statistically analyzing wafer chip probe test data, the problem of not being able to intuitively detect chip quality in existing technologies has been solved, enabling intuitive data display and improved production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
- Filing Date
- 2025-12-19
- Publication Date
- 2026-05-12
AI Technical Summary
In existing technologies, wafer chip probe test data cannot intuitively detect whether the chip is in good condition, resulting in low efficiency, high difficulty, and easy errors.
By receiving chip probe test data, the system performs data filtering and processing, extracts valid test data, makes judgments based on preset parameter conditions, writes the data into a new table, performs statistical analysis and display, and uses the specific format of the ATE equipment for automated filtering, reducing the amount of data and improving processing efficiency.
It enables intuitive data display, reduces error rates, improves production efficiency, and simplifies the chip status judgment process.
Smart Images
Figure CN122019281A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of integrated circuit data inspection technology, and in particular to a method, system, and medium for processing wafer chip probe test data. Background Technology
[0002] In the integrated circuit manufacturing and R&D process, eight-inch or twelve-inch wafers are commonly used. After photolithography, each wafer exhibits multiple exposure fields, each containing one or more chips. Before the chips are packaged and delivered, ATE (Atomatic Test Equipment) is used to perform chip probe tests on the chips on the uncutterd wafers.
[0003] During chip probe testing, the ATE equipment and probe station work together to test the chips on the wafer using probe cards. Each time the probe card establishes an electrical connection, it completes one probe touch, which means one test is completed.
[0004] In a probe-based test, the ATE (Automatic Test Equipment) uses probes on a probe card to contact the various leads of the bare chip on the wafer, establishing electrical connections. The ATE then automatically applies stimuli to the chip under test and receives the responses from the bare chip, thus obtaining the raw electrical characteristic data of the chip during operation. This data is not intuitive to the human eye and cannot directly indicate the quality of the chip under test. In the early stages of chip development, the quality of the chip is generally determined by manually inspecting the probe test data. However, this method is inefficient, difficult, and prone to errors. Summary of the Invention
[0005] The purpose of this invention is to provide a method, system, and medium for processing wafer chip probe test data, in order to solve the problem of not being able to directly detect whether a chip is good or not.
[0006] To achieve the above objectives, the present invention provides the following technical solution: In a first aspect, the present invention provides a method for processing wafer chip probe test data, comprising: Receive raw test data obtained by receiving chip probes to test chips on the wafer; The original test data is filtered to extract valid test data. The parameter judgment results are obtained according to the preset parameter conditions and written into a new table. Perform statistical analysis on the newly created table to obtain and display the statistical results table.
[0007] This invention provides a method for processing wafer chip probe test data, comprising: receiving raw test data obtained by chip probes testing chips on a wafer. The chip probe testing of chips on a wafer is referred to as chip probe testing, an automated chip testing method that uses ATE (Atomatic Test Equipment) to perform performance testing on chips on an uncut wafer. The raw test data obtained from chip probe testing is the raw electrical characteristic data of the chip under test during operation. Sometimes, the chip needs to be tested multiple times, which makes the amount of raw test data very large and the data redundancy very high.
[0008] Therefore, this invention employs the aforementioned steps to filter data and reduce the amount of data required for subsequent statistical analysis. This invention performs data filtering on the original test data to extract valid test data. This eliminates a large amount of redundant data, significantly reducing the data volume compared to existing technologies. This invention also performs statistical analysis on the newly created table, obtaining and displaying the statistical results. This presents the data intuitively in the table, making it easier for technicians to understand the status of chips on uncut wafers compared to existing technologies, thus helping to reduce error rates and improve production efficiency.
[0009] Preferably, the original test data is subjected to data filtering processing to extract valid test data, parameter judgment results are obtained according to preset parameter conditions, and the parameter judgment results are written into a newly created table, further including: According to the preset data filtering conditions, the valid test data is extracted from the original test data and written to a temporary file; The temporary file is read into memory, and the validity of the test data is determined according to the preset parameter conditions to obtain the parameter determination result. Write the result of the parameter judgment into a new table.
[0010] In the field of chip testing, the raw test data obtained from probe testing has a specific format, that is, data in a specific format defined by the ATE equipment. Utilizing this characteristic of raw test data having a specific format, the specific format defined by the ATE equipment can be used as a preset condition for data filtering, automating the filtering of raw test data and greatly improving processing efficiency.
[0011] Preferably, the step of extracting the valid test data from the original test data according to the preset data filtering conditions and writing the valid test data into a temporary file further includes: Find all exposure fields in the original test data; For each exposure field, a temporary file is created based on the exposure field number; According to the preset data filtering conditions, valid test data for each test point in each exposure field is extracted from the original test data. The valid test data includes at least the exposure field number, test point number, test item, and test value. The valid test data is written into the corresponding temporary file according to the exposure field number.
[0012] This invention creates temporary files corresponding to the exposure field numbers and stores the valid test data filtered from the massive amount of original test data in the temporary files, reducing the data size of the files and improving the speed of reading the temporary files into memory, thereby increasing the speed of the entire data processing flow.
[0013] Preferably, according to the data filtering preset conditions, the effective test data for each test point in each exposure field is extracted from the original test data. The effective test data includes at least the exposure field number, test point number, test item, and test value, and further includes: Read the raw test data line by line; When the original test data in the current row meets the preset data filtering conditions, this row of data is determined as a valid row of test data; Iterate through each test point in each exposure field to obtain all valid test data.
[0014] The present invention reads data line by line according to preset data filtering conditions and traverses each test point in each exposure field to obtain valid test data, which has the advantages of fast and comprehensive data filtering.
[0015] Preferably, the step of reading the temporary file into memory, determining whether the valid test data meets the preset parameter conditions, and obtaining the parameter determination result further includes: Read all temporary files into memory; Extract all valid test data from the temporary file; Determine whether the valid test data meets the preset parameter conditions, where the preset parameter conditions are the acceptable data range for each test item: When the test value of each test item corresponding to the test point in the valid test data meets the preset parameter conditions, the parameter judgment result of the test point is qualified.
[0016] This invention sets the preset conditions of parameters as the acceptable range of test items. This invention can modify the acceptable range of test items according to specific needs to adjust the standard for whether the chip is qualified or not, and has the advantage of flexible data processing method.
[0017] Preferably, the step of performing statistical analysis on the newly created table, obtaining statistical results, and displaying them further includes: Get the directory path and read the newly created tables one by one; Write the exposure field number, the test point number, the test item and the corresponding parameter judgment result into the statistical results table.
[0018] This invention can read multiple newly created tables at once, greatly improving the speed of data processing.
[0019] Preferably, the step of performing statistical analysis on the newly created table, obtaining statistical results, and displaying them further includes: The steps are to perform yield statistics and write the yield into the statistical results table.
[0020] This invention can also perform statistical analysis on yield, making the results of data processing more intuitive.
[0021] Preferably, the step of performing statistical analysis on the newly created table, obtaining statistical results, and displaying them further includes: The parameter judgment results in the statistical results table are displayed separately according to different categories.
[0022] The present invention distinguishes and displays information according to different categories, which can be done by different fonts or different colors. This invention clearly displays the parameter judgment results for each exposure field, each test point, and each test item in a statistical results table, allowing for differentiation of the judgment results for different parameters. This approach offers the advantages of comprehensiveness and clarity.
[0023] Secondly, the present invention also provides a wafer chip probe test data processing system, comprising: The ATE automatic detection module is used to receive raw test data obtained by chip probes testing the chips on the wafer; The data processing module is used to perform data filtering on the raw test data, extract valid test data, obtain parameter judgment results according to preset parameter conditions, and write the parameter judgment results into a newly created table. The results statistics module is used to perform statistical analysis on the newly created table, obtain a statistical results table, and display it.
[0024] Thirdly, the present invention also provides a computer-readable storage medium storing instructions that, when executed, implement the above-mentioned method for processing wafer chip probe test data.
[0025] Compared with the prior art, the beneficial effects of the system of the second aspect and the readable storage medium of the third aspect provided by the present invention are the same as the beneficial effects of the wafer chip probe test data processing method described above, and will not be repeated here. Attached Figure Description
[0026] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a flowchart illustrating the method for processing wafer chip probe test data in an embodiment of the present invention.
[0027] Figure 2 This is a flowchart illustrating the process of determining the parameter judgment result and writing it into a newly created table in an embodiment of the present invention.
[0028] Figure 3 This is a schematic diagram illustrating the process of determining valid test data and writing it to a temporary file in an embodiment of the present invention.
[0029] Figure 4 This is a schematic diagram of the process for determining valid test data in an embodiment of the present invention.
[0030] Figure 5 This is a flowchart illustrating the process of determining the parameter judgment result in an embodiment of the present invention.
[0031] Figure 6 This is a schematic diagram illustrating the process of determining and displaying a statistical analysis table in an embodiment of the present invention.
[0032] Figure 7 A flowchart illustrating the creation and display of a statistical analysis table according to an embodiment of the present invention.
[0033] Figure 8 This is a structural diagram of a wafer chip probe test data processing system according to an embodiment of the present invention.
[0034] 401-ATE Automatic Detection Module, 402-Data Processing Module, 403-Result Statistics Module. Detailed Implementation
[0035] To facilitate a clear description of the technical solutions in the embodiments of the present invention, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the present invention should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.
[0036] In this invention, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.
[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0038] Before introducing the embodiments of the present invention, the relevant terms involved in the embodiments of the present invention are first defined as follows: ATE (Automatic Test Equipment).
[0039] Method Implementation Examples Figure 1 This is a flowchart illustrating a method for processing wafer chip probe test data according to an embodiment of the present invention. Figure 1 As shown, the method includes the following steps: Step 1: Receive the raw test data obtained by the chip probes testing the chips on the wafer.
[0040] Step 2: Perform data filtering on the original test data, extract valid test data, obtain parameter judgment results according to the preset parameter conditions, and write the parameter judgment results into a new table.
[0041] Step 3: Perform statistical analysis on the newly created table to obtain and display the statistical results table.
[0042] As a specific implementation method, step 1 can be implemented as follows: In the chip manufacturing process, after photolithography on the wafer, each wafer exhibits multiple exposure fields, and each exposure field contains at least one chip. Before dicing the photolithographically lithographic wafer, the chips within all exposure fields on the entire wafer must undergo quality inspection. In the chip manufacturing field, ATE (Automatic Test Equipment) is typically used to perform chip probe testing on the chips on the wafer.
[0043] During chip probe testing, the ATE (Automatic Test Equipment) and probe station work together, using probe cards to test the chips on the wafer. Each time the probe card establishes an electrical connection, it completes one probe reach, thus completing one test. In one probe reach, the ATE test equipment, through the probes on the probe card, contacts the various leads of the chip under test on the wafer, forming an electrical connection. Subsequently, the ATE automatically applies stimuli to the chip under test and receives the responses returned by the chip, thereby obtaining the chip's basic identification data and its core electrical characteristics data during operation. The chip's basic identification data is used to associate the chip with its core electrical characteristics data; this chip's basic identification data and core electrical characteristics data constitute the raw test data.
[0044] Optionally, the raw test data may also include one of the following: process and reliability-related data, or auxiliary data for the test process.
[0045] The basic chip identification data must include at least one of the following: wafer information, chip location, and product information. Specifically, wafer information must include at least one of the following: wafer ID, batch number, lithography number, and wafer size / specification; chip location must include at least one of the following: chip coordinates (X / Y axis), scribe groove position, and chip serial number; and product information must include at least one of the following: chip model, version number, and design specification number.
[0046] The core electrical characteristic data must include at least one of the following: DC parameters, AC parameters, and functional parameters. DC parameters must include at least one of the following: voltage, quiescent current, dynamic current, threshold voltage, on-resistance, and leakage current. AC parameters must include at least one of the following: timing delay, transmission rate, signal rise / fall time, and clock frequency. Functional parameters must include at least one of the following: logical function correctness and interface compatibility.
[0047] Process and reliability-related data should include at least one of the following: process deviation, limiting characteristics, and preliminary reliability. Testing process auxiliary data should include at least one of the following: testing environment, test results, and anomaly records. Process and reliability-related data, as well as testing process auxiliary data, can be used to trace problems and optimize processes and testing procedures.
[0048] As a specific implementation method, step 2, which involves filtering the original test data, extracting valid test data, obtaining parameter judgment results based on preset parameter conditions, and writing the parameter judgment results into a newly created table, may further include, for example: Figure 2 The steps shown are as follows: Step 21: Extract the valid test data from the original test data according to the preset data filtering conditions, and write the valid test data into a temporary file.
[0049] Step 22: Read the temporary file into memory, and determine whether the valid test data meets the preset parameter conditions according to the preset parameter conditions to obtain the parameter judgment result.
[0050] Step 23: Write the parameter judgment results into a new table.
[0051] Specifically, step 21 can be adopted as follows: Figure 3 Implemented as shown: Step 211: Locate all exposure fields in the original test data.
[0052] Step 212: Create a temporary file for each exposure field according to its exposure field number.
[0053] Step 213: According to the preset data filtering conditions, extract the valid test data of each test point in each exposure field from the original test data. The valid test data includes at least the exposure field number, test point number, test item, and test value.
[0054] Step 214: Write the valid test data into the corresponding temporary file according to the exposure field number.
[0055] Each wafer has multiple exposure fields. After the chip probes traverse all the exposure fields on the wafer once or multiple times, a large amount of raw test data is obtained. This raw test data contains a lot of useless information and has a large amount of data redundancy. Therefore, it is necessary to filter the raw test data according to preset data filtering conditions to obtain valid test data.
[0056] Specifically, to extract valid test data from each test point within each exposure field of the raw test data, the exposure field must first be located. Then, within that exposure field, valid test data must be filtered out according to preset data filtering conditions. The raw test data for a wafer is typically a single file, containing all the exposure fields for that wafer. The raw test data is generally in .log format.
[0057] The raw test data obtained from chip probe testing has a specific format, that is, data in a specific format defined by the ATE equipment. For example: A line that begins with "====" followed by "one or more spaces" followed by a number, where the number is the exposure field number; A line that begins with "[PLAN]" marks the start of a test item; The first line after each "[PLAN" that begins with a space followed by "P / F" is the table header; The following format represents the data rows for test items, containing the test point number, test item, and test value: Lines containing "space" + "1P" + "space" + "|" + "space" + "BL_" + "test value"; Lines containing "space" + "1F" + "space" + "|" + "space" + "BL_" + "test value"; Lines containing "space" + "1P" + "space" + "|" + "space" + "BLB_" + "test value"; Lines containing "space" + "1F" + "space" + "|" + "space" + "BLB_" + "test value"; Lines containing "space" + "1P" + "space" + "|" + "space" + "SN" + "test value"; Lines containing "space" + "1F" + "space" + "|" + "space" + "SN" + "test value"; Lines containing "space" + "1P" + "space" + "|" + "space" + "SN" + "test value"; Lines containing "space" + "1F" + "space" + "|" + "space" + "SN" + "test value"; Lines containing "space" + "1P" + "space" + "|" + "space" + "WL" + "test value"; Lines containing "space" + "1F" + "space" + "|" + "space" + "WL" + "test value"; Lines containing "space" + "1P" + "space" + "|" + "space" + "SN" + "test value"; Lines containing "space" + "1F" + "space" + "|" + "space" + "SN" + "test value"; Lines containing "space" + "1P" + "space" + "|" + "space" + "BL" + "test value"; Lines containing "space" + "1F" + "space" + "|" + "space" + "BL" + "test value".
[0058] Leveraging the specific format of raw test data, the format defined by the ATE equipment can be used as a preset data filtering condition to automatically filter the raw test data, significantly improving processing efficiency. The preset data filtering conditions are set according to specific user needs and include conditions for detecting multiple different data types to filter out valid test data of different data types.
[0059] For example, the preset conditions for data filtering can be: (1) The condition used to filter exposure field numbers is to filter rows containing "====" followed by "one or more spaces" followed by "numbers", where "numbers" are the exposure field numbers. For example, the following data: ==== 1 ============= The "1" in the data represents the exposure field number.
[0060] (2) The criteria used to filter the starting point of the test item are: filter rows containing "[PLAN" plus "a string of characters" plus "coordinates", where PLAN is the start of a test item, the string of characters is the name of the test item, and the coordinates are the test point number. For example, the following data: [PLAN:D127_IREAD_IBLB](6,8) The PLAN in the data is the start of the test item named D127_IREAD_IBLB, and the coordinates (6,8) are the coordinates of the test point. (3) Conditions used to filter test values, Filter rows containing "space" + "1P" + "space" + "|" + "space" + "BL_" + "test value", where the value is the test value of the previous test item detected. Filter rows containing "space" + "1F" + "space" + "|" + "space" + "BL_" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1P" + "space" + "|" + "space" + "BLB_" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1F" + "space" + "|" + "space" + "BLB_" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1P" + "space" + "|" + "space" + "SN" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1F" + "space" + "|" + "space" + "SN" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1P" + "space" + "|" + "space" + "SN" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1F" + "space" + "|" + "space" + "SN" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1P" + "space" + "|" + "space" + "WL" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1F" + "space" + "|" + "space" + "WL" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1P" + "space" + "|" + "space" + "SN" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1F" + "space" + "|" + "space" + "SN" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1P" + "space" + "|" + "space" + "BL" + "test value", where the test value is the test value of the previous test item detected. Filter rows containing "space" + "1F" + "space" + "|" + "space" + "BL" + "test value", where the test value is the test value of the previous test item.
[0061] The criteria used to filter test values are illustrated in the following example: The test value here is 131.5889 uA. The data filtering method involved in this invention adopts a row-by-row data filtering method. Therefore, the test value here is the test value corresponding to the previous test item detected.
[0062] This invention can process raw test data from one wafer at a time, or from multiple wafers simultaneously. Upon receiving one or more files containing raw test data input from a command line, it begins reading data line by line. When a current line meets preset data filtering conditions, corresponding processing is performed. When reading raw test data, according to the conditions for detecting exposure fields in the preset data filtering conditions, if the raw test data in the current line contains an exposure field number, the exposure field number is taken as valid test data, and a temporary file is created for each exposure field based on the exposure field number. The process continues to read raw test data line by line, and according to the conditions for detecting test point numbers, test items, and test values in the preset data filtering conditions, the test point numbers, test items, and test values are extracted from the raw test data and written as valid test data into the corresponding temporary file for the exposure field. The test item includes at least one of the following: chip basic identification data, core electrical characteristic data, process and reliability related data, and test process auxiliary data. Valid test data includes at least one of the following: exposure field number, test point number, test item, and test value. When the valid test data is a numerical value, the value may be positive or negative. In this case, the absolute value must be taken.
[0063] Specifically, step 213 can be adopted Figure 4 The method shown is implemented as follows: Figure 4 The method shown is as follows: Step 2131: Read the original test data line by line.
[0064] Step 2132: When the original test data in the current row meets the preset data filtering conditions, this row of data is determined as a row of valid test data.
[0065] Step 2133: Traverse each test point in each of the exposure fields to obtain all the valid test data. The valid test data includes at least the exposure field number, test point number, test item, and test value.
[0066] Specifically, step 22 can be adopted Figure 5 Implemented as shown: Step 221: Read all the temporary files into memory.
[0067] Step 222: Extract all the valid test data from the temporary file.
[0068] Step 223: Determine whether the valid test data meets the preset parameter conditions, where the preset parameter conditions are the acceptable range for each test item. After reading the temporary file into memory, according to the preset parameter conditions, determine whether the test value of each test item in the valid test data of one test point in the exposure field meets the preset parameter conditions, and obtain the parameter judgment result. The preset parameter conditions are corresponding parameter ranges set according to different data categories, and there is at least one preset parameter condition. When determining whether the test value of each test item in the valid test data meets the preset parameter conditions, the test value of each test item in the valid test data is compared with the set parameter range according to the data category. When the value of a certain data item in the valid test data falls within the parameter range of the corresponding data category, the parameter judgment result is that the preset parameter condition is met. When the value of a certain data item in the valid test data does not fall within the parameter range of the corresponding data category, the parameter judgment result is that the preset parameter condition is not met.
[0069] When the test value of each test item corresponding to the test point in the valid test data meets the preset parameter conditions, the parameter judgment result of the test point is qualified.
[0070] When all test values of each test item in the valid test data of a test point meet the preset parameter conditions, it indicates that all functions at that test point can be implemented, and the valid test data at that test point is qualified data, meaning the parameter judgment result for that test point is qualified. When at least one of the multiple data items in the valid test data of a test point does not meet the preset parameter conditions, it indicates that at least some functions at that test point cannot be implemented, and the valid test data at that test point is unqualified data, meaning the parameter judgment result for that test point is unqualified. The parameter judgment result is the total result of whether the valid test data of each test point within the entire exposure field on the wafer is qualified. The parameter judgment result is one of two types: qualified and unqualified.
[0071] As a specific implementation method, such as Figure 6 As shown, step 3, which involves performing statistical analysis on the newly created table to obtain and display the statistical results, further includes: Step 31: Obtain the directory path and read the newly created tables one by one. Specify the path to the target folder in the command line when calling the program, and read all newly created tables in the specified directory.
[0072] Step 32: Write the exposure field number, test point number, test item, and corresponding parameter judgment result into the statistical result table. After reading all the newly created tables, use the hash algorithm to correspond the exposure field number, test point number, test item, and parameter judgment result, and write them into the statistical result table. The statistical result table is used to display the pass / fail situation of multiple test points in multiple exposure fields on the wafer.
[0073] In step 3, the step of performing statistical analysis on the newly created table to obtain statistical results and display them further includes: Step 33: Display the parameter judgment results in the statistical result table according to different categories. Specifically, if the parameter judgment result in the statistical result table is pass / fail, then display the pass / fail results in different colors or fonts to facilitate intuitive finding of the required results and improve work efficiency.
[0074] After step 3, the step of performing statistical analysis on the newly created table to obtain a statistical result table and display it further includes: The step of performing yield statistics and writing the yield into the statistical result table.
[0075] The yield refers to the ratio of qualified chips that can work properly among the chips produced from the wafer to the total number of chips produced on the wafer. The yield can be simply calculated by the formula: The yield is the core indicator to measure the chip manufacturing efficiency and quality. In addition, the yield can also reflect the levels of production process maturity, equipment accuracy, material quality, etc. Statistically analyzing the yield can visually observe the chip situation of this wafer, which has the advantage of intuitiveness.
[0076] Further, after step 4, the step of performing yield statistics and writing the yield into the statistical result table further includes: Step 5: The step of setting a filtering function for the statistical result table. In the present invention, setting a filtering function for the statistical result table makes it more convenient to find a certain result.
[0077] The following is a specific embodiment of the method part of the present invention: This embodiment adopts the method of the present invention to provide a specific implementation process, which includes the process of processing the original test data to obtain a newly created table containing parameter judgment results, and the process of Figure 7 performing statistical analysis on the newly created table to obtain statistical results and display them as shown.
[0078] The process of processing raw test data to obtain a new table containing parameter judgment results is as follows: Raw test data obtained from chip probes testing chips on a wafer is received. Input files are read from a specified file list to obtain the raw test data. Data is read from the raw test data in the input files. When a preset parameter condition related to an exposure field number is encountered, a temporary file corresponding to that exposure field number is created. Other raw test data under that exposure field are read line by line. When data matching the preset data filtering conditions is read, this data is considered valid test data and stored in the temporary file corresponding to that exposure field number. All temporary files corresponding to all exposure fields are read into memory at once. Then, the test values of each test point in the valid test data are judged according to the preset parameter conditions to determine whether they meet the pass / fail criteria. In this embodiment, preset parameter condition A means that the test value corresponding to the test item is between 5 and 100, and the test item is considered qualified. Preset parameter condition B means that the test value corresponding to the test item is between 5 and 100, and the test item is considered qualified. Preset parameter condition C means that the test value corresponding to the test item is greater than 0.7, and the test item is considered qualified. The parameter preset condition D means that the test value corresponding to the test item is less than 0.2, at which point the test item is considered qualified. If all four parameter preset conditions (A, B, C, and D) are met, the parameter judgment result for that test point is qualified; if not all four preset conditions (A, B, C, and D) are met, the parameter judgment result for that test point is unqualified. The parameter judgment results for each test point in the exposure field are then written into a newly created table.
[0079] like Figure 7 As shown, after obtaining the parameter judgment results corresponding to each test point, the method involved in this invention begins the steps of statistical analysis of the newly created table, obtaining a statistical result table, and displaying it. According to the specified directory, filenames are read one by one. If the format "probe card + number + row" is detected, the matching content is extracted as the Hash Key; if the format "exposure site number + qualified / unqualified" is detected, the matching content is extracted as the Hash Value; the Value is the Hash Key. The Hash Key and Hash Value are mapped and written into the newly created statistical result table. The table format and cell size are then designed for the statistical result table, and the table header and other fixed content are written into the statistical result table. Each Key in the Hash is read one by one. Based on the Key value, the probe card number is written into the table, and based on the Key value, the test point row number is written into the table. The address is written based on the probe card number + test point row number. For the Value array corresponding to the Hash Key, each element is traversed, and the qualified / unqualified status of each exposure site is written into the corresponding cell in the table. After performing yield statistics, set the format and add filtering functions to the statistical results table.
[0080] Device Examples A wafer chip probe test data processing system, such as Figure 8 As shown, it includes: The ATE automatic detection module 401 is used to receive raw test data obtained by chip probes testing the chips on the wafer.
[0081] The data processing module 402 is used to perform data filtering processing on the original test data, extract valid test data, obtain parameter judgment results according to preset parameter conditions, and write the parameter judgment results into a newly created table.
[0082] The results statistics module 403 is used to perform statistical analysis on the newly created table, obtain a statistical results table, and display it.
[0083] As a specific implementation method, the ATE automatic inspection module 401 can be implemented in the following way. In the chip manufacturing process, after photolithography on the wafer, each wafer exhibits multiple exposure fields, and each exposure field contains one or more chips. Before dicing the photolithographically lithographic wafer, the chips in all exposure fields on the entire wafer must be quality inspected. In the chip manufacturing field, ATE is typically used to perform chip probe testing on the chips on the wafer.
[0084] During chip probe testing, the ATE (Automatic Test Equipment) and probe station work together, using probe cards to test the chips on the wafer. Each time the probe card establishes an electrical connection, it completes one probe reach, thus completing one test. In one probe reach, the ATE test equipment, through the probes on the probe card, contacts the various leads of the bare chip on the wafer, forming an electrical connection. Subsequently, the ATE automatically applies stimulation to the chip under test and receives the response returned by the bare chip, thereby obtaining the chip's basic identification data and its core electrical characteristics data during operation. The chip's basic identification data is used to associate the chip with its core electrical characteristics data; this chip's basic identification data and core electrical characteristics data constitute the raw test data.
[0085] Optionally, the raw test data may also include one of the following: process and reliability-related data, or auxiliary data for the test process.
[0086] The basic chip identification data must include at least one of the following: wafer information, chip location, and product information. Specifically, wafer information must include at least one of the following: wafer ID, batch number, lithography number, and wafer size / specification; chip location must include at least one of the following: chip coordinates (X / Y axis), scribe groove position, and chip serial number; and product information must include at least one of the following: chip model, version number, and design specification number.
[0087] The core electrical characteristic data must include at least one of the following: DC parameters, AC parameters, and functional parameters. DC parameters must include at least one of the following: voltage, quiescent current, dynamic current, threshold voltage, on-resistance, and leakage current. AC parameters must include at least one of the following: timing delay, transmission rate, signal rise / fall time, and clock frequency. Functional parameters must include at least one of the following: logical function correctness and interface compatibility.
[0088] Process and reliability-related data should include at least one of the following: process deviation, limiting characteristics, and preliminary reliability. Testing process auxiliary data should include at least one of the following: testing environment, test results, and anomaly records. Process and reliability-related data, as well as testing process auxiliary data, can be used to trace problems and optimize processes and testing procedures.
[0089] In practice, this invention also relates to a computer-readable storage medium storing instructions that, when executed, implement a method for processing wafer chip probe test data.
[0090] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer programs or instructions. When the computer program or instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present invention are performed entirely or partially. The computer can be a general-purpose computer, a special-purpose computer, a computer network, a terminal, a user equipment, or other programmable device. The computer program or instructions can be stored in a computer-readable storage medium or transferred from one computer-readable storage medium to another. For example, the computer program or instructions can be transferred from one website, computer, server, or data center to another website, computer, server, or data center via wired or wireless means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium, such as a floppy disk, hard disk, or magnetic tape; it can also be an optical medium, such as a digital video disc (DVD); or it can be a semiconductor medium, such as a solid-state drive (SSD).
[0091] Although the invention has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed invention. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.
[0092] Although the invention has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made therein without departing from the spirit and scope of the invention. Accordingly, this specification and drawings are merely exemplary descriptions of the invention as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. Clearly, those skilled in the art can make various alterations and modifications to the invention without departing from its spirit and scope. Thus, if such modifications and modifications of the invention fall within the scope of the claims and their equivalents, the invention is also intended to include such modifications and modifications.
Claims
1. A method for processing wafer chip probe test data, characterized in that, include: Receive raw test data obtained by the chip probes testing the chips on the wafer; The original test data is filtered to extract valid test data. The parameter judgment results are obtained according to the preset parameter conditions and written into a new table. Perform statistical analysis on the newly created table to obtain and display the statistical results table.
2. The method for processing wafer chip probe test data according to claim 1, characterized in that, The step of performing data filtering processing on the original test data, extracting valid test data, obtaining parameter judgment results based on preset parameter conditions, and writing the parameter judgment results into a newly created table further includes: According to the preset data filtering conditions, the valid test data is extracted from the original test data and written to a temporary file; The temporary file is read into memory, and the validity of the test data is determined according to the preset parameter conditions to obtain the parameter determination result. Write the result of the parameter judgment into a new table.
3. The method for processing wafer chip probe test data according to claim 2, characterized in that, The step of extracting the valid test data from the original test data according to the preset data filtering conditions and writing the valid test data into a temporary file further includes: Find all exposure fields in the original test data; For each exposure field, a temporary file is created corresponding to its exposure field number; According to the preset data filtering conditions, valid test data for each test point in each exposure field is extracted from the original test data. The valid test data includes at least the exposure field number, test point number, test item, and test value. The valid test data is written into the corresponding temporary file according to the exposure field number.
4. The method for processing wafer chip probe test data according to claim 3, characterized in that, The step of extracting valid test data for each test point in each exposure field from the original test data according to the preset data filtering conditions further includes: Read the raw test data line by line; When the original test data in the current row meets the preset data filtering conditions, this row of data is determined as a valid row of test data; Iterate through each test point in each exposure field to obtain all valid test data.
5. The method for processing wafer chip probe test data according to claim 3, characterized in that, The step of reading the temporary file into memory and determining whether the valid test data meets the preset parameter conditions to obtain the parameter determination result further includes: Read all the temporary files into memory; Extract all valid test data from the temporary file; Determine whether the valid test data meets the preset parameter conditions, wherein the preset parameter conditions are the acceptable data range for each test item: When the test value of each test item corresponding to the test point in the valid test data meets the preset parameter conditions, the parameter judgment result of the test point is qualified.
6. The method for processing wafer chip probe test data according to claim 3, characterized in that, The step of performing statistical analysis on the newly created table, obtaining statistical results, and displaying them further includes: Obtain the directory path and read the newly created tables one by one; The exposure field number, the test point number, the test item, and the corresponding parameter judgment results are written into the statistical results table.
7. The method for processing wafer chip probe test data according to claim 6, characterized in that, The step of performing statistical analysis on the newly created table, obtaining statistical results, and displaying them also includes: Perform yield statistics and record the yield in the statistical results table.
8. The method for processing wafer chip probe test data according to claim 6, characterized in that, The step of performing statistical analysis on the newly created table, obtaining statistical results, and displaying them further includes: The parameter judgment results in the statistical results table are displayed separately according to different categories.
9. A system for processing wafer chip probe test data, characterized in that, include: The ATE automatic detection module is used to receive raw test data obtained by chip probes testing the chips on the wafer; The data processing module is used to perform data filtering on the raw test data, extract valid test data, obtain parameter judgment results according to preset parameter conditions, and write the parameter judgment results into a newly created table. The results statistics module is used to perform statistical analysis on the newly created table, obtain a statistical results table, and display it.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores instructions that, when executed, implement a method for processing wafer chip probe test data as described in any one of claims 1-8.