Electronic component mounting device

Abstract

The invention provides an electronic component mounting device, which can reduce the possibility of transversely rotating an electronic component loaded on a tray and remove a protective sheet covering the tray. An electronic component mounting apparatus includes: a supply unit that holds a plurality of trays on which electronic components and protective sheets covering the electronic components are placed in a stacked state; a stage for receiving the trays one by one from below the supply unit and conveying the trays from the supply unit to a position where the electronic components are picked up; a head that picks up the electronic component placed on the tray at a position where the electronic component is picked up; a crimping part receiving the electronic component from the head and crimping the electronic component to the substrate; and a removing part which is arranged on a path of the carrying table for carrying the tray from the supply part to the position where the electronic component is picked up, and is used for removing the protective sheet from the carried tray.

Description

[0001] This application is a divisional application of the original application, application number 202211258961.3, filed on October 14, 2022, entitled "Electronic Component Mounting Device". Technical Field

[0002] This invention relates to an electronic component mounting device. Background Technology

[0003] In the manufacturing process of display panels that constitute display devices such as liquid crystal displays, there is a process of mounting chip-shaped electronic components, such as integrated circuits (ICs), for driving the display panel onto the glass substrate that constitutes the display panel. This type of mounting is called chip-on-glass (COG) mounting. In addition, in COG mounting, an electronic component mounting device called a COG mounting device is used.

[0004] The electronic component supply section in the COG mounting device is constructed by stacking multiple trays containing electronic components. Specifically, slots are arranged on the upper surface of the trays, and multiple trays containing electronic components are stacked in these slots. Furthermore, protective sheets, such as protective paper, are sometimes present between the stacked trays to protect the electronic components. These protective sheets can obstruct the picking up of electronic components, thus requiring a process of removing the stacked trays layer by layer and manually removing each component. Afterward, the trays are stacked again to serve as the electronic component supply section. During this process of removing the protective sheets, vibrations caused by contact with the trays can cause the electronic components to rotate inside the slots, potentially obstructing picking up, damaging the electronic components, or even causing the trays to tip over, resulting in the loss of electronic components.

[0005] To address this issue, research is underway on mechanically removing protective covers during the pickup of electronic components, rather than manually removing them beforehand. For example, as shown in Patent Document 1, firstly, the protective cover on the top tray is removed using vacuum suction. Next, the electronic components contained in the trays are picked up sequentially. Furthermore, when the top tray becomes empty, the empty tray is picked up and removed. Then, as the stacked trays rise, the protective covers on the next tray are removed, and the electronic components contained in the trays are picked up sequentially. This pickup process continues until all trays are empty.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 9-55598 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] However, on the top layer of stacked pallets, the accumulated tilting or dimensional errors of each pallet can sometimes cause deviations in the height or tilt of its upper surface. In such cases, the height at which electronic components are picked up may be unstable, making it impossible to pick them up, or even if they can be picked up, they may not be held properly and fall during transport, resulting in loss of the electronic components. Furthermore, the collision between the suction nozzles and other removal parts that descend to remove protective sheets and the upper surface of the pallet can cause the electronic components to rotate laterally inside the tray due to the resulting vibrations, potentially hindering pickup.

[0011] The purpose of this invention is to provide an electronic component mounting device that can reliably pick up electronic components placed on a tray and remove the protective sheet covering the tray.

[0012] Technical means to solve the problem

[0013] To achieve the aforementioned objective, the electronic component mounting apparatus of the present invention includes: a supply unit for holding a tray containing multiple electronic components and protective sheets covering the electronic components in a stacked state; a platform for receiving the tray one by one from below the supply unit and conveying the tray from the supply unit to a position for picking up the electronic components; a head for picking up the electronic components placed on the tray at the position for picking up the electronic components; a pressing unit for receiving the electronic components from the head and pressing the electronic components to a substrate; and a removal unit disposed on the path of the platform conveying the tray from the supply unit to the position for picking up the electronic components and removing the protective sheets from the conveyed tray.

[0014] The effects of the invention

[0015] This invention can reliably pick up electronic components placed on a tray and remove the protective sheet covering the tray. Attached Figure Description

[0016] Figure 1 This is a perspective view showing the tray applicable to the implementation method.

[0017] Figure 2 This is a plan view showing the overall structure of the electronic component mounting device according to the implementation method.

[0018] Figure 3 This is an explanatory diagram showing the assembly process of a chip-shaped electronic component in an embodiment.

[0019] Figure 4 This is an explanatory diagram showing the pallet receiving process of the supply department in an embodiment.

[0020] Figure 5This is a side view showing the platform and removal section of the embodiment.

[0021] Figure 6 This is a functional block diagram illustrating the control unit in the implementation method.

[0022] Figure 7 This is a flowchart illustrating the assembly sequence of the chip-shaped electronic components in the implementation method.

[0023] Figure 8 This is an explanatory diagram showing the adsorption sites in the implementation method.

[0024] Figure 9 This is a diagram showing the removed portion of the modified example.

[0025] Figure 10 This is a diagram showing the removed portion of the modified example.

[0026] Figure 11 This is a diagram showing the removed portion of the modified example.

[0027] Figure 12 This is a diagram showing the movement path of the stage in the modified example.

[0028] Figure 13 This is a diagram showing the movement path of the stage in the modified example.

[0029] Figure 14 This is a diagram illustrating the adsorption situation in the modified example.

[0030] Figure 15 This is an explanatory diagram showing a modified example of tray replacement.

[0031] Figure 16 This is an explanatory diagram showing a modified example of tray replacement.

[0032] Figure 17 This is a plan view of the platform representing the modified example.

[0033] Explanation of symbols

[0034] 10, 10a, 10b: Supply Department

[0035] 11: Framework

[0036] 12: Control Department

[0037] 20, 20a, 20b: Platform

[0038] 21: Maintaining Department

[0039] 22: Support column

[0040] 23: Mobile mechanism

[0041] 231, 431: Bracket

[0042] 232, 432: Linear guide

[0043] 233, 433: Slider

[0044] 30, 30a, 30b: Testing Department

[0045] 40, 40a, 40b: Removal section

[0046] 41: Adsorption section

[0047] 42: Arm

[0048] 43: Lifting mechanism

[0049] 44: Adhesive part

[0050] 441: Path Roller

[0051] 442: Crimping tool

[0052] 45: Airflow generation section

[0053] 451: Air nozzle

[0054] 452: Suction Nozzle

[0055] 46: Chuck section

[0056] 461: Chuck Claw

[0057] 462: Elastic Cap

[0058] 50, 50a, 50b: Testing Department

[0059] 60: Transfer Department

[0060] 61: Head

[0061] 61a: Adsorption nozzle

[0062] 70: Installation Department

[0063] 71: Platform

[0064] 72: Crimping part

[0065] 721: Pressure Head

[0066] 722: Support component

[0067] 80: Control Department

[0068] 81: Mechanism Control Department

[0069] 82: Storage Department

[0070] 83: Judgment Department

[0071] 84: Input / Output Control Unit

[0072] 91: Input device

[0073] 92: Output device

[0074] A: Adhesive sheet

[0075] B: Recycling bin

[0076] C: Electronic components

[0077] D:Substrate

[0078] G: slot

[0079] P: Protective film

[0080] S01~S12: Steps

[0081] T, TR, TL: Tray

[0082] X, Y, Z, α, θ: Direction Detailed Implementation

[0083] The embodiments of the present invention (hereinafter referred to as "this embodiment") will be specifically described with reference to the accompanying drawings. Furthermore, the drawings are schematic representations of the components and structural parts and do not accurately represent their dimensions or spacing.

[0084] [structure]

[0085] (Electronic components and trays)

[0086] In this embodiment, electronic component C is a chip-shaped electronic component such as a driver IC. Electronic component C is housed in... Figure 1 The tray T shown is used to house electronic components C. Specifically, electronic components C are housed in slots G provided on the upper surface of the tray T with their electrodes facing upwards. For example, 20 slots G are provided, with 10 slots in 2 columns, capable of accommodating 20 electronic components C. Additionally, a protective sheet P covering the electronic components C is placed on the upper surface of the tray T (see reference). Figure 4 The protective sheet P is, for example, paper or film, and preferably has properties that make it difficult to carry electricity. Multiple protective sheets P are stacked on the tray T while electronic components C are contained in the slot G and the tray T is holding them in the supply section 10 of the electronic component mounting device.

[0087] Furthermore, the object to which electronic component C is mounted is a component that is electrically connected to the electrodes of electronic component C. In this embodiment, the object to which it is mounted is the display panel, i.e., the substrate D, which constitutes the display device. That is, it is a component that includes display functions and electrodes.

[0088] (Electronic component mounting device)

[0089] Reference Figures 2 to 6The structure of the electronic component mounting device according to this embodiment will be described. For example... Figure 2 and Figure 3 As shown, the electronic component mounting apparatus includes a supply unit 10, a stage 20, a detection unit 30, a removal unit 40, a detection unit 50, a transfer unit 60, a mounting unit 70, and a control unit 80. The electronic component mounting apparatus of this embodiment is a COG mounting apparatus for mounting chip-shaped electronic components, i.e., electronic components C.

[0090] The supply unit 10 supplies a tray T containing electronic components C. The stage 20 transfers the tray T from the supply unit 10 to the transfer unit 60. The transfer unit 60 receives the electronic components C from the tray T transferred by the stage 20 and transfers it to the mounting unit 70. The mounting unit 70 presses the electronic components C onto the substrate D, which is to be mounted.

[0091] The detection units 30 and 50 detect whether a protective sheet P is placed on the tray T placed on the stage 20. The removal unit 40 removes the protective sheet P from the tray T placed on the stage 20.

[0092] exist Figure 2 In this embodiment, the direction in which the pressing portions 72 of the transfer section 60 and the mounting section 70 are arranged is defined as the Y direction. In a plane parallel to the disk surface of the stage 20, the direction orthogonal to the Y direction is defined as the X direction, and the direction orthogonal to both the X and Y directions is defined as the Z direction. The Z direction is the direction that runs through the paper in the figure. In this embodiment, the electronic component mounting device is arranged such that the Z direction is the vertical direction, thereby making the XY plane a horizontal plane. In this case, the Z direction is the height direction, and the side facing the mounting surface is referred to as the lower side, and the opposite side is referred to as the upper side. That is, the lower side refers to the direction of gravity. In addition, the rotation direction parallel to the XY plane is defined as the θ direction, and the rotation direction parallel to the ZX plane is defined as the α direction. Furthermore, these directions are expressions used to describe the positional relationship of the various structures of the electronic component mounting device, and do not limit the positional relationship or direction when the components are mounted on the mounting surface.

[0093] (Supply Department)

[0094] like Figure 4 As shown, the supply unit 10 supplies trays T containing electronic components C. The trays T are held in the supply unit 10 in a stacked state as described above. The portion of each tray T containing the electronic components C is covered by a protective sheet P. Furthermore, in Figure 4For ease of explanation, only the protective sheet P covering the bottommost tray T is shown in the diagram. The supply unit 10 has a frame 11 and a handle 12. The frame 11 is a pair of parallel elongated members. The spacing between the pair of frames 11 is approximately the width of the tray T, but the tray T can pass through vertically. The handle 12 is provided on the opposing sides of the frame 11 and is configured to move forward and backward in a direction approaching / away from the side of the tray T via a drive mechanism (not shown). Thus, as Figure 4 As shown in (A), the gripping part 12 grips the bottom layer of the stacked trays T. Additionally, as... Figure 4 As shown in (B), the lower surface of the tray T held by the holding part 12 is the opposite side to the side where the electronic component C is stored, and becomes the position where the stage 20 receives the tray T.

[0095] like Figure 2 As shown, in this embodiment, a pair of supply units 10 are arranged along the X-axis when viewed from above. Specifically, one supply unit 10a and the other supply unit 10b are arranged in a position symmetrical with respect to the transfer unit 60 when viewed from above. Hereinafter, without distinguishing between supply units 10a and supply units 10b, they will be referred to simply as supply units 10.

[0096] (Platform)

[0097] like Figure 4 , Figure 5 (A) and Figure 5 As shown in (B), the platform 20 is positioned below the supply unit 10 and the transfer unit 60 (described later). It receives the trays T one by one from the bottom layer of the stacked trays T held by the supply unit 10 and transports them to the position where the transfer unit 60 picks up the electronic components C from the trays T. The platform 20 has a holding part 21 and a support part 22.

[0098] The holding portion 21 is a generally cuboid shape with its upper surface outer edge extending above the outer edge of the tray T. Although not shown, an adsorption hole connected to a pneumatic circuit is formed on the upper surface of the holding portion 21, holding the tray T by negative pressure adsorption. Furthermore, from the viewpoint of preventing static electricity, sometimes an uneven shape is provided on the bottom surface of the tray T. In this case, since there is a possibility that sufficient adsorption force cannot be obtained in the uneven portion, it is preferable to avoid the uneven portion and form the adsorption hole at a position corresponding to the flat surface. For example, an adsorption hole is provided at a position corresponding to the edge of the bottom surface of the tray T to ensure stable adsorption. The support portion 22 is a generally cuboid-shaped member that supports the bottom of the holding portion 21.

[0099] A moving mechanism 23 is provided on the stage 20. The moving mechanism 23 is composed of a bracket 231, a linear guide 232, and a slider 233, which allows the holding part 21 to move along the XY plane. Figure 5As shown in (A), the support 231 is an L-shaped strip member extending along the moving direction of the platform 20 in the XY plane, supporting the linear guide 232. Figure 5 As shown in (B), the linear guide 232 is a generally cuboid-shaped guide member extending along the moving direction of the platform 20 in the XY plane, supporting the slider 233 so that it can slide. The slider 233 is driven, for example, by a drive source and ball screw (not shown), and is configured to move along the linear guide 232. The slider 233 is located at the lower end of the support portion 22, allowing the holding portion 21 to move in the XY direction. Furthermore, the moving mechanism 23 includes a lifting mechanism (not shown), by which the holding portion 21 is moved in the Z direction. Thus, the moving mechanism 23 moves the platform 20 in the XYZ direction. Through the moving mechanism 23, the platform 20 is configured to move between the supply portion 10 and the transfer portion 60. In addition, the platform 20 can also be temporarily stopped along the path.

[0100] In this embodiment, a pair of platform 20s are provided corresponding to a pair of supply units 10. Hereinafter, the platform 20 corresponding to one of the supply units 10a will be referred to as platform 20a, and the platform 20 corresponding to the other supply unit 10b will be referred to as platform 20b. Without distinguishing between the two, they will be simply referred to as platform 20.

[0101] (Detection and Removal Department)

[0102] like Figure 2 and Figure 3 As shown, the detection unit 30, detection unit 50, and removal unit 40 are arranged on the path of the stage 20 from the supply unit 10 to the position where the electronic component C is picked up by the transfer unit 60, and are located above the stage 20. Furthermore, the detection unit 30 is sometimes referred to as the wafer detection unit, and the detection unit 50 as the removal detection unit.

[0103] A detection unit 30 is installed along the path of the stage 20 from the supply unit 10 to the removal unit 40, and detects the protective sheet P placed on the tray T on the stage 20. The detection unit 30 is, for example, a color sensor. Furthermore, this embodiment will be described as a reflective sensor where the light-emitting and light-receiving parts are integrated. Since the protective sheet P is primarily white, the detection unit 30 illuminates light from above the stage 20 and detects the protective sheet P placed on the tray T based on whether the reflected light is white or not.

[0104] The removal unit 40 is disposed on the path of the stage 20 from the detection unit 30 to the position where the electronic component C is picked up by the transfer unit 60, and removes the protective sheet P from the tray T placed on the stage 20. The removal unit 40 has an adsorption unit 41 for adsorbing and holding the protective sheet P, an arm 42 for supporting the adsorption unit 41, and a lifting mechanism 43 for supporting the arm 42 and moving the adsorption unit 41 in the Z direction.

[0105] The adsorption unit 41 is connected to a pneumatic circuit (not shown), and the protective sheet P is adsorbed and held by the negative pressure generated by the pneumatic circuit. Figure 5 As shown in (A), arm 42 is an L-shaped support member, supporting the adsorption part 41 at one end. Additionally, a lifting mechanism 43 is provided at the other end of arm 42. The lifting mechanism 43 comprises a bracket 431, a linear guide 432, and a slider 433. Figure 5 As shown in (A), the bracket 431 is an L-shaped component in cross-section that extends along the moving direction of the platform 20 in the XY plane and supports the linear guide 432. Furthermore, the bracket 431 is supported by the bracket 231. Figure 5 As shown in (B), the linear guide 432 is a generally cuboid-shaped guide member extending along the Z direction, supporting the slider 433 so that it can slide. The slider 433 is driven, for example, by a drive source and ball screw (not shown), and is configured to move along the linear guide 432. Furthermore, the slider 433 supports the arm 42. Thus, the lifting mechanism 43 moves the suction portion 41 supported by the arm 42 along the Z direction via the arm 42.

[0106] When the protective sheet P is detected by the detection unit 30, the adsorption unit 41 approaches the stage 20, which is temporarily stopped below, via the lifting mechanism 43, and adsorbs and holds the protective sheet P from the tray T placed on the stage 20. The adsorption unit 41 returns to the position where it began to descend, thereby removing the protective sheet P from the tray T. When the protective sheet P is removed, the stage 20 moves away from below the adsorption unit 41 and moves the tray T below the transfer unit 60 to the position where the electronic component C is picked up. Furthermore, if the protective sheet P is not detected by the detection unit 30, the adsorption unit 41 does not descend or generate negative pressure, and the tray T is transferred to the transfer unit 60.

[0107] A collection box B is provided directly below the adsorption section 41. The negative pressure on the adsorption section 41 is released after the stage 20 passes underneath. As a result, the protective sheet P falls due to gravity and is collected into the collection box B. Alternatively, a guide plate can be provided at the opening of the collection box B to guide the falling of the protective sheet P and ensure its reliable collection.

[0108] The detection unit 50 is positioned along the path of the stage 20 from the removal unit 40 to the position where the electronic component C is picked up by the transfer unit 60, and detects whether the protective sheet P has been removed from the tray T placed on the stage 20. The detection unit 50 is, for example, a color sensor. Furthermore, this embodiment will be described as a reflective sensor where the light-emitting and light-receiving parts are integrated. Since the protective sheet P is primarily a near-white color, the detection unit 50 illuminates light from above the stage 20 and detects whether the protective sheet P has been removed from the tray T based on whether the reflected light is white or not.

[0109] If the detection unit 50 detects the protective plate P, for example, a warning sound may be emitted by a speaker (not shown) to call the operator. Alternatively, a recovery process may be performed. The recovery process involves returning the stage 20 to the removal unit 40, whereby the removal unit 40 removes the protective plate P. Furthermore, in the event of calling the operator, the transport of the tray T may be temporarily stopped.

[0110] The detection unit 30, detection unit 50, and removal unit 40 are provided in pairs corresponding to the supply unit 10 and the stage 20. Hereinafter, the detection unit 30, detection unit 50, and removal unit 40 corresponding to one of the supply units 10a and the stage 20a will be referred to as detection unit 30a, detection unit 50a, and removal unit 40a, and the detection unit 30 and removal unit 40 corresponding to the other supply unit 10b and the stage 20b will be referred to as detection unit 30b, detection unit 50b, and removal unit 40b. Without distinguishing between the two, they will be simply referred to as detection unit 30, detection unit 50, and removal unit 40.

[0111] (Transfer Department)

[0112] like Figure 2 and Figure 3 As shown, the transfer unit 60 is a device that picks up electronic components C from the tray T placed on the stage 20 and transfers them to the mounting unit 70. The transfer unit 60 is an elongated member configured to rotate in the θ direction on a plane parallel to the XY plane by a drive source such as a motor. That is, one end of the transfer unit 60 is fixed to the rotation axis of a drive source (not shown), and it rotates intermittently in the θ direction in units of 180°. More specifically, it rotates intermittently in a counterclockwise or clockwise direction, stopping at the 12 o'clock position and the 6 o'clock position.

[0113] At the other end of the transfer section 60, a head 61, serving as a rotating head, is provided. The head 61 is configured to rotate in the α direction about the long side of the transfer section 60. An adsorption nozzle 61a extending along the radius of the rotation circle is provided on the head 61. The adsorption nozzle 61a is connected to a pneumatic circuit (not shown) and adsorbs and holds the electronic component C by the negative pressure generated by the pneumatic circuit. The orientation of the tip of the adsorption nozzle 61a is changed 180° by the head 61. That is, the transfer section 60 is configured as a reverse transfer device that reverses the direction of the electronic component C picked up by adsorption and holding and transfers it.

[0114] When the adsorption nozzle 61a picks up electronic components C from the tray T held on the stage 20, it adsorbs and holds the electronic components C one by one from above. That is, the orientation of the adsorption nozzle 61a is not reversed, but the electronic components C are adsorbed and held from above. At this time, the electrode portion of the electronic component C faces upward. On the other hand, when the adsorbed and held electronic components C are transferred to the crimping part 72 (described later), the adsorption nozzle 61a transfers the electronic components C from below the crimping part 72. That is, the orientation of the adsorption nozzle 61a is reversed, and the electronic components C are transferred from below. At this time, the electrode portion of the electronic component C faces downward.

[0115] (Installation Department)

[0116] like Figure 2 and Figure 3 As shown, the mounting portion 70 is a device that heats and presses the electrodes of the electronic component C onto the electrodes of the substrate D via an anisotropic conductive film (ACF). The ACF is a sheet-like component in which many small conductive particles are incorporated into a resin substrate. Furthermore, in this embodiment, the ACF is pre-attached to the substrate D side.

[0117] The mounting section 70 includes a platform 71 and a pressing section 72. The platform 71 is a horizontal plate-shaped body that holds the substrate D. Although not shown, an adsorption hole connected to a pneumatic circuit is formed on the upper surface of the platform 71, and the substrate D is held by adsorption through negative pressure. The platform 71 is configured to be movable in the XY and θ directions by a drive mechanism (not shown).

[0118] like Figure 3As shown, the pressing part 72 includes a pressing head 721 and a support member 722. The pressing head 721 holds the electronic component C by means of a holding part (not shown). Furthermore, the pressing head 721 is configured to move along the XYZ and θ directions via a drive mechanism (not shown). Thus, the pressing head 721 holds the electronic component C by means of a holding part (not shown), moves the held electronic component C, and aligns the electronic component C with the substrate D supported by the platform 71. Then, with the electronic component C overlapping the substrate D, the pressing head 721 heats and presses the electronic component C by means of a heating part (not shown) and a pressing part (not shown). Thus, the electronic component C is heated and pressed onto the substrate D. The support member 722 is a member that supports the substrate D when the electronic component C is heated and pressed by the pressing head 721 via an ACF.

[0119] The crimping section 72 is a device for performing temporary crimping before final crimping. After temporary crimping using the crimping section 72, although not shown, formal crimping is performed using the formal crimping section located in the downstream process.

[0120] (Control Department)

[0121] The control unit 80 may include, for example, dedicated electronic circuitry or a computer operating according to a predetermined program. Figure 6 As shown, the control unit 80 includes a mechanism control unit 81, a storage unit 82, a determination unit 83, and an input / output control unit 84. The mechanism control unit 81 controls the operation of the supply unit 10, the stage 20, the detection unit 30, the removal unit 40, the detection unit 50, the transfer unit 60, and the mounting unit 70. The storage unit 82 stores the programs, data, and other information required for control in this embodiment to implement these operations. The determination unit 83 determines whether the protective sheet P is present based on the detection results of the detection units 30 and 50. The input / output control unit 84 is an interface for controlling the conversion or input / output of signals between the controlled units and the various units.

[0122] Furthermore, an input device 91 and an output device 92 are connected to the control unit 80. The input device 91 is an input component such as a switch, touch panel, keyboard, and mouse for the operator to operate the electronic component mounting device via the control unit 80. The output device 92 is an output component such as a display device that displays information used to confirm the status of the electronic component mounting device in a way that the operator can see.

[0123] [effect]

[0124] In addition to reference Figures 1 to 6 In addition, refer to Figure 7 Flowchart and Figure 8 The explanatory diagram illustrates the function of the electronic component mounting device described above.

[0125] like Figure 4 As shown in (A), the platform 20 is moved below the supply unit 10 by the moving mechanism 23 (step S01). Figure 4 As shown in (B), in the supply section 10, the holding section 21 of the stage 20 holds the bottom surface of the lowest tray T. Then, the holding section 21 of the stage 20 receives the trays T one by one in the following sequence (step S02).

[0126] like Figure 4 As shown in (C), the supply unit 10 releases the grip performed by the gripping unit 12. Then, as... Figure 4 As shown in (D), the stage 20 lowers by the amount of one tray T. Figure 4 As shown in (E), the tray T, which is one level higher than the bottom layer, is held by the holding part 12. Figure 4 As shown in (F), the stage 20 descends, and the tray T is transferred to the holding part 21.

[0127] The stage 20 receiving the tray T moves to below the detection unit 30 (step S03). The stage 20 may temporarily stop below the detection unit 30, or it may move to below the removal unit 40 without stopping. During the movement to below the removal unit 40, it only needs to pass below the detection unit 30. When the stage 20 passes below the detection unit 30, the detection unit 30 illuminates the tray T placed on the stage 20 to detect whether a protective sheet P is placed there (step S04). Specifically, the determination unit 83 receiving the detection result from the detection unit 30 determines whether a protective sheet P is present. If the protective sheet P is placed on the tray T (YES in step S04), proceed to step S06. If the protective sheet P is not placed on the tray T (NO in step S04), proceed to step S09. Furthermore, in the case where the protective sheet P is not placed on the tray T, the following situations can be considered: the protective sheet P may fall off the tray T due to vibration or other reasons before the platform 20 passes under the detection unit 30; the protective sheet P may be attached to the bottom surface of the upper tray T in the supply unit 10; or the protective sheet P may accidentally fall off during the process of placing the stacked trays T. In addition, if the operator needs to confirm whether the protective sheet P is placed on the tray T, the structure of the detection unit 30 and the determination unit 83 can be omitted.

[0128] The stage 20 below the detection unit 30 moves to below the removal unit 40 (step S05). In this embodiment, the stage 20 temporarily stops below the removal unit 40. The adsorption section 41 of the removal unit 40 descends via the lifting mechanism 43 to approach the protective sheet P and stops at a predetermined height at which the protective sheet P can be adsorbed by negative pressure. This height is, for example, 0.5 mm above the upper surface of the tray T placed on the stage 20. At this height, the adsorption section 41 adsorbs and holds the protective sheet P by generating negative pressure. The adsorption section 41 returns to the height at which it began to descend, thereby removing the protective sheet P from the tray T (step S06).

[0129] On the tray T, the position of the protective sheet P, which is held in place by adsorption, is preferably opposite to the slot G containing the electronic component C. More preferably, as shown below... Figure 8 As shown in (A), it is preferable to position it opposite to the central portion of the slot G that houses the electronic component C.

[0130] The suction airflow acting on the protective sheet P on the tray T also acts on the tray T through the protective sheet P. That is, the suction force also acts on the tray T. As a result, the tray T is held in place. However, if the suction part 41 performs suction above the groove G, the groove G becomes an air passage, causing a leak for the tray T. Therefore, the suction force acts on the protective sheet P, but not on the tray T, and thus the tray T is not held in place. In this way, as long as a leak occurs for the tray T and the tray T is not held in place, the position can be facing any groove G on the tray T, or any part of the groove G.

[0131] However, sometimes a slotless section G is set in tray T. Figure 8 The image shows a tray T without a central groove G. In this case, leakage to the tray T is reduced in the area where the suction part 41 acts on the groove G, thus the suction force also acts on the tray T, increasing the likelihood of suction on the tray T. For example, as... Figure 8 As shown in (B), if an attempt is made to use the suction part 41 to draw in the ungrooved portion G in the center of the tray T, the air only flows from one end of the groove G, and the area acting on the groove G is small, so the groove G is difficult to become an air passage. In this case, since there is not enough air flowing from the groove G over the protective sheet P to the suction part 41, there is little leakage, and it is possible to pass over the protective sheet P and adsorb and hold the tray T.

[0132] In contrast, such as Figure 8 As shown in (A), when the central portion of the suction tank G is drawn using the suction section 41, air flows from both ends of the tank G over the protective sheet P to the suction section 41. Therefore, there is more leakage, and the possibility of the air passing over the protective sheet P and being adsorbed and held by the tray T is small. That is, the possibility of the protective sheet P being adsorbed and held together with the tray T is small.

[0133] When the protective sheet P is removed from the tray T, the stage 20 moves toward the transfer section 60. After the stage 20 moves beneath it, the adsorption section 41 releases the negative pressure and separates the adsorbed and held protective sheet P. The protective sheet P falls due to gravity and is collected in the collection box B (see reference) located directly below the adsorption section 41. Figure 5 (B)

[0134] The stage 20 moves from below the removal unit 40 to below the detection unit 50 (step S07). The stage 20 may temporarily stop below the detection unit 50, or it may move without stopping to below the suction nozzle 61a of the transfer unit 60. During the movement to below the suction nozzle 61a of the transfer unit 60, it only needs to pass below the detection unit 50. When the stage 20 passes below the detection unit 50, the detection unit 50 irradiates the tray T placed on the stage 20 with light to detect whether the protective sheet P has been removed (step S08). Specifically, the determination unit 83, which receives the detection result from the detection unit 50, determines whether the protective sheet P is present or not. If the protective sheet P is removed from the tray T (YES in step S08), proceed to step S09. If the protective sheet P remains on the tray T (NO in step S08), return to step S06. Specifically, the recovery process is performed, the stage 20 returns to below the removal unit 40, and the protective sheet P is removed. Furthermore, when the operator confirms whether the protective sheet P has been removed from the tray T, the structure of the detection unit 50 and the determination unit 83 can be omitted.

[0135] The stage 20, passing below the detection unit 50, moves to the area below the suction nozzle 61a of the transfer unit 60. That is, the stage 20 moves such that the electronic component C placed on the tray T is positioned below the suction nozzle 61a of the transfer unit 60, which is located at the 12 o'clock position. More specifically, each electronic component C housed in the slot G of the tray T is sequentially positioned facing the suction nozzle 61a of the transfer unit 60. This positioning is performed by scanning the tray T with a scanning unit (not shown). Furthermore, when an electronic component C on the tray T is positioned, pickup by the suction nozzle 61a begins. Thus, the electronic component C is transferred to the transfer unit 60 (step S09).

[0136] The transfer unit 60 rotates 180° in the XY plane, moving the electronic component C to the crimping part 72 of the mounting unit 70. Midway through this movement, the head 61 rotates in the α direction and reverses to hold the electronic component C from below. The adsorption performed by the adsorption nozzle 61a of the transfer unit 60 is released, and adsorption is performed by the pressure head 721 of the crimping part 72, thereby transferring the electronic component C to the pressure head 721 (step S10). Then, by the descent of the pressure head 721, the electrode portion of the electronic component C is heated and pressed onto the electrode of the substrate D via ACF (step S11). Afterwards, the adsorption performed by the pressure head 721 is released, and the substrate D with the electronic component C temporarily crimped is transferred to the formal crimping part for formal crimping. Steps S09 to S11 are repeated until all electronic components C are removed from a tray T (step S12 NO).

[0137] Furthermore, when all electronic components C have been removed from a tray T (YES in step S12), the platform 20 carrying the empty tray T moves to a storage section (not shown) for the empty tray T and transfers the tray T to the storage section. Then, the platform 20 returns to the supply section 10, where, as described above, the platform 20 receives the tray T containing the electronic components C from the supply section 10, performing the transfer of the electronic components C. Furthermore, the storage section for the empty tray T can, for example, be arranged in an adjacent position to the supply section 10 with the same structure. By configuring it in this way, the reverse order of the supply section 10 can be achieved, i.e., in... Figure 4 Stack the empty tray T in the order of (F), (E), (D), (C), (B), (A) and store it.

[0138] The supply of this type of tray T is initially carried out through one of the supply units 10a and the stage 20a. Then, when the tray T containing the electronic component C is used up, the supply unit 10a is switched to another supply unit 10b and the stage 20b to continue supplying the tray T. During this period, the tray T in the supply unit 10a is replaced, and when the tray T in the other supply unit 10b is used up, the supply of the tray T is switched back to the supply unit 10a and the stage 20a. Thus, installation can continue without stopping the electronic component mounting device.

[0139] [Effect]

[0140] (1) The electronic component mounting apparatus of this embodiment includes: a supply unit 10, which holds a tray T containing electronic components C and a protective sheet P covering the electronic components C in a stacked state; a platform 20, which receives the tray T one by one from below the supply unit 10 and transports the tray T from the supply unit 10 to the position for picking up the electronic components C; a head 61, which picks up the electronic components C placed on the tray T at the position for picking up the electronic components C; a pressing unit 72, which receives the electronic components C from the head 61 and presses the electronic components C onto the substrate D; and a removal unit 40, which is provided on the path of the platform 20 transporting the tray T from the supply unit 10 to the position for picking up the electronic components C and removes the protective sheet P from the transported tray T.

[0141] Therefore, the protective sheet P can be mechanically removed from the tray T, thus reducing the likelihood of damage to the electronic component C placed on the tray T, the tray being flipped, or the electronic component C rotating sideways on the tray T compared to manual removal. Furthermore, since the tray T is transported one piece at a time, the deviation in the height of the upper surface is less compared to stacking multiple trays T. Additionally, there is less tilting of the upper surface. Therefore, the possibility of the removal unit 40 accidentally colliding with the tray T during the removal of the protective sheet P, and the electronic component C rotating sideways on the tray T due to the impact, can be reduced.

[0142] (2) In this embodiment, the removal section 40 uses negative pressure to adsorb and hold the protective sheet P in the adsorption section 41. Therefore, when the removal section 40 removes the protective sheet P from the tray T, there is no possibility of transmitting an impact to the tray T via the protective sheet P, thus reducing the possibility of the electronic component C rotating horizontally on the tray T.

[0143] (3) In this embodiment, the tray T is provided with a groove G for accommodating electronic components C. The adsorption part 41 is positioned opposite to the groove G and adsorbs and holds the protective sheet P from the tray T. As a result, the groove G becomes an air passage, so the possibility of the adsorption part 41 adsorbing and holding the tray T together is small.

[0144] (4) The electronic component mounting apparatus of this embodiment also includes a recycling bin B for recycling the protective sheet P of this embodiment, and the recycling bin B is located directly below the adsorption unit 41. Thus, the adsorption unit 41 can recycle the adsorbed and held protective sheet P to the recycling bin B simply by releasing the negative pressure.

[0145] (5) The electronic component mounting apparatus of this embodiment also includes a detection unit 30, which is disposed between the supply unit 10 and the removal unit 40 in the path of this embodiment and detects the protective sheet P. As a result, there is no negative pressure generated on the upper surface of the tray T when the protective sheet P is not mounted, thus eliminating the possibility of accidentally adsorbing and holding the electronic component C.

[0146] (6) The electronic component mounting apparatus of this embodiment also includes a detection unit 50, which is disposed between the removal unit 40 and the transfer unit 60 along the path of this embodiment and detects the protective sheet P. Therefore, even if the protective sheet P remains on the tray T without being removed, the transfer unit 60 can be prevented from being moved to the transfer unit 60 in that state. Furthermore, if the detection unit 50 detects the protective sheet P, the protective sheet P can be reliably removed from the tray T by calling the operator or resuming the process. Therefore, the electronic component C can be reliably picked up from the transfer unit 60.

[0147] [Variation Example]

[0148] (1) The removal section 40 of the embodiment includes the adsorption section 41 that removes the protective sheet P by negative pressure, but is not limited thereto. For example, such as Figure 9 As shown, the adhesive section 44 can have a stronger adhesive force than the holding force of the platform 20. The adhesive section 44 includes an adhesive sheet A wound on a supply roll and a take-up roll (not shown). The adhesive sheet A is guided in the direction of movement by a path roller 441 and is fed from the supply roll toward a crimping tool 442. The crimping tool 442 is configured to hold the adhesive sheet A and is capable of rising and falling. By falling, the adhesive sheet A comes into contact with a protective sheet P on a tray T, thereby adhesively holding the protective sheet P on the adhesive sheet A. Subsequently, the adhesive sheet A is removed from the tray T by the rising of the crimping tool 442, thereby removing the protective sheet P. Furthermore, by rotating the take-up roll, the protective sheet P and the adhesive sheet A are taken back together, and a new adhesive sheet A is supplied to the tray T.

[0149] Therefore, compared to the case where the adsorption unit 41 is provided, a pneumatic circuit that generates negative pressure is not required, thus simplifying the structure. Furthermore, when the adsorption unit 41 is moved horizontally to avoid the path of the stage 20, the arrangement of piping and other components relative to the moving adsorption unit 41 requires considerable effort in design and installation, but this situation can be avoided. Additionally, compared to adsorption using negative pressure, a wider area can be held for the protective sheet P, thus ensuring more reliable holding of the protective sheet P and reducing holding errors. Furthermore, the case where a tray or electronic components are not required for holding is also possible.

[0150] Furthermore, by transferring the protective sheet P bonded to adhesive sheet A to another adhesive sheet with stronger adhesion, adhesive sheet A can be reused like a recyclable belt. This eliminates the need for a supply roll and a recycling roll, simplifying the structure. Additionally, instead of a recycling roll, adhesive sheet A and the protective sheet P can be recycled together to a recycling bin B or similar facility located at the destination of adhesive sheet A for disposal. This also eliminates the need for a recycling roll, resulting in a simpler structure.

[0151] (2) The removal section 40 of the embodiment includes the adsorption section 41 that removes the protective sheet P by negative pressure, but is not limited thereto. For example, such as Figure 10 As shown in (A), an airflow generating section 45 can also be used to blow the protective sheet P away from the tray T using airflow. The airflow generating section 45 is, for example, a cylindrical or rectangular blowing nozzle 451, which generates airflow to blow the protective sheet P away towards the recycling bin B and remove the protective sheet P from the tray T. Additionally, as... Figure 10 As shown in (B), the recycling bin B can also function as an airflow generating section 45. That is, a rectangular suction nozzle 452, wider than the protective sheet P, can be provided at the opening of the recycling bin B. In this case, airflow is generated by creating a negative pressure inside the recycling bin B, thereby removing the protective sheet P from the suction nozzle 452. Furthermore, as... Figure 10 As shown in (C), the protective sheet P can also be removed by using both the blowing nozzle 451 and the suction nozzle 452, through the combined blowing and suction. By using both, the protective sheet P can be removed more reliably. Figure 10 (A) to Figure 10 In any of the cases (C), a simpler structure can be formed by using a nozzle that only blows or sucks air.

[0152] (3) The removal section 40 of the embodiment includes the adsorption section 41 that removes the protective sheet P by negative pressure, but is not limited thereto. For example, such as Figure 11 As shown, the chuck section 46 can also be used to remove the protective sheet P from the tray T. The chuck section 46 includes a pair of chuck jaws 461 that approach each other via pneumatic drive, and the protective sheet P is removed using these jaws. The front ends of the chuck jaws 461 are covered with elastic caps 462 made of rubber or the like. The elastic caps 462 mitigate the impact generated when the chuck jaws 461 contact the tray T, and also facilitate the easy removal of the protective sheet P. Thus, the chuck section 46 removes the protective sheet P from the tray T in the same manner as the suction section 41. Because the protective sheet P is mechanically removed, it can be removed more reliably.

[0153] (4) The tray T of the embodiment contains electronic component C in a groove G provided on its upper surface, but is not limited thereto. For example, electronic component C may also be bonded to a thin adhesive layer formed on the upper surface of the tray T. In this case, by making the adhesive force of the adhesive layer smaller than the adsorption force of the adsorption part 41 of the removal part 40 or the adhesive force of the adhesive part, electronic component C can be picked up from the tray T.

[0154] (5) The recycling bin B in the above embodiment is located directly below the removal section 40, but is not limited thereto. For example, an XY moving mechanism can be provided in the removal section 40, and the recycling bin B can be placed at any position as long as it can move in the XY plane. Thus, the location of the recycling bin B can be freely set. Alternatively, it is also possible to have a configuration without the recycling bin B. In this case, the removal section 40 can move in the XY plane while holding the protective sheet P removed from the tray T, and place the protective sheet P on the empty tray T after the electronic component C is picked up. Thus, the protective sheet P and the empty tray T are recycled together to the storage section that stores the empty tray T.

[0155] (6) In the embodiment described above, a detection unit 50 is provided between the removal unit 40 and the transfer unit 60, but the embodiment is not limited thereto. As long as the protective sheet P is removed substantially and reliably in the removal unit 40, the detection unit 50 may be omitted. This simplifies the structure of the electronic component mounting device and enables miniaturization.

[0156] (7) The removal unit 40 in the above embodiment is provided between the detection unit 30 and the transfer unit 60, but is not limited thereto. For example, an XY moving mechanism may be provided in the removal unit 40 to move back and forth between the supply unit 10 and the platform 20. That is, the removal unit 40 may enter between the two after the platform 20 receives the tray T and leaves the supply unit 10 in the Z direction to remove the protective sheet P. In this case, the distance from the supply unit 10 to the transfer unit 60 can be shortened, thus making the overall device smaller. In addition, in this case, the detection unit 30 may also irradiate light toward the tray T placed on the platform 20 before the removal unit 40 enters to detect the protective sheet P placed on the tray T.

[0157] (8) The moving path of the stage 20 in the described embodiment is generally straight from the supply unit 10 through the removal unit 40 to the transfer unit 60, but is not limited thereto. For example, as Figure 12 (A) Figure 12 As shown in (B), the direction can also be changed at approximately a right angle directly below the removal section 40. In other words, the arrangement of the supply section 10, the removal section 40, and the transfer section 60 is not limited to a generally linear shape. Furthermore, in Figure 12 (A) Figure 12 In (B), for ease of explanation, the structures of the detection unit 30 and the detection unit 50 are omitted.

[0158] When the stage 20 changes direction at approximately a right angle, the moving mechanism 23 only needs to be configured as a slider and guide, a conveyor belt, and a conveyor track that allows the stage 20 to move independently, all of which can be arranged in a manner that enables movement in the XY directions. Furthermore, while the stage 20 reciprocates along a single path from the supply unit 10 to the transfer unit 60, it can also rotate around a circular path. By configuring this path, the degree of freedom in path setting increases, allowing for a reduction in the overall size of the device.

[0159] In addition, such as Figure 12 As shown in (A), the recycling bin B and the removal unit 40 are arranged adjacent to each other. In the case of the waste protection sheet P, the removal unit 40 can be moved above the recycling bin B. Furthermore, as... Figure 12 As shown in (B), the recycling bin B can also be moved below the removal section 40.

[0160] Furthermore, referring to Figure 13 For Figure 12 The layout shown is illustrated by describing a platform 20 holding two trays T. In this case, the arrangement direction of the two trays T is consistent with the movement direction of the platform 20 from the removal section 40 to the transfer section 60. Therefore, after the removal section 40 removes the protective sheet P from one of the trays T, moving the platform 20 by only one tray T is sufficient to bring the removal section 40 facing the protective sheet P of the other tray T. Furthermore, replacing the tray T in the transfer section 60 is also achieved by moving the platform 20 by one tray.

[0161] (9) such as Figure 14 As shown in (A), the adsorption section 41 of the described embodiment stops descending to a predetermined height, generating a negative pressure, but is not limited thereto. For example, as Figure 14 As shown in (B), the device can also descend toward the tray T while generating negative pressure. That is, negative pressure is generated when the adsorption section 41 of the removal section 40 descends to a predetermined height where the protective sheet P can be adsorbed using negative pressure via a lifting mechanism (not shown). As a result, compared to the case where negative pressure is generated after descending to the predetermined height where the protective sheet P can be adsorbed, the time required to reach the negative pressure where adsorption can be performed is saved, thus shortening the production cycle time.

[0162] Furthermore, in this case, instead of setting a predetermined descent height, control can be implemented to stop the descent once the protective sheet P is detected to be adsorbed. This not only shortens the time until the protective sheet P is removed, but also minimizes the possibility of the adsorption unit 41 colliding with the tray T when adsorbing the protective sheet P, even if there are large dimensional errors or height deviations in the tray T.

[0163] Furthermore, the adsorption state of the adsorption section 41 on the protective sheet P can be determined appropriately, either by generating negative pressure while the adsorption section 41 is descending or by generating negative pressure after the adsorption section 41 has descended to a predetermined height. It can also have a mode that allows selection of these states.

[0164] (10) The adsorption unit 41 of the described embodiment removes the protective sheet P from the tray T of the platform 20, which is temporarily stopped below, but is not limited thereto. The protective sheet P may also be removed from the tray T without temporarily stopping the platform 20. For example, the adsorption unit 41 may be positioned at a height higher than the upper surface of the tray T placed on the platform 20, for example, about 3 mm higher, and a negative pressure may be generated at the moment the platform 20 passes below the adsorption unit 41. Thus, without temporarily stopping the platform 20, the protective sheet P is removed from the tray T as the platform 20 passes below the adsorption unit 41, thereby eliminating the time lag caused by temporarily stopping the platform 20 and increasing the production cycle time.

[0165] (11) The detection unit 30 in the embodiment described above is a color sensor for detecting the color of the protective sheet P, but is not limited thereto. For example, it may also be a sensor that can detect the protective sheet P by detecting the reflectivity of light irradiated onto the protective sheet P.

[0166] (12) The electronic component mounting apparatus of the embodiment is such that a holding part 21 of the stage 20 receives trays T one by one from the supply part 10 and mounts electronic components C. However, it is also possible to receive multiple trays T at a time by a holding part 21 or to hold multiple trays T by providing multiple holding parts 21. That is, switching is performed in the following manner: when all the electronic components C contained in a tray T are mounted and a tray T becomes empty, electronic components C are picked up from another tray T. During the time when electronic components C are not picked up, such as when the substrate D is transported from the mounting part 70 to the formal pressing part, the empty tray T is replaced with the next tray T containing electronic components C. Thus, during the mounting of electronic components C, the electronic components C in the holding part 21 will not be missing, so the electronic components C can be mounted without delay.

[0167] Reference Figure 15 An embodiment where the stage 20 holds multiple trays T will be described. Figure 15 In, with Figure 13Similarly, in the layout shown, the movement path of the platform 20 is arranged to change direction at approximately right angles, and one platform 20 holds two trays T. Furthermore, in this embodiment, two platforms 20 are provided. That is, two platforms 20a and 20b each hold two trays T. Hereinafter, the left tray T will be referred to as tray TL, and the right tray T as tray TR. Additionally, when a diagonal line is applied to the tray T in the figure, it is assumed that a protective sheet P is placed on it; when no diagonal line is applied to the tray T, it is assumed that the protective sheet P is removed.

[0168] First, such as Figure 15 As shown in (A), pallet T is removed from supply unit 10a and held on platform 20a. Platform 20a receives pallet TL and pallet TR sequentially from supply unit 10a. Simultaneously, pallet T is removed from supply unit 10b and held on platform 20b. Platform 20b receives pallet TR and pallet TL sequentially from supply unit 10b. That is, the order in which supply unit 10b receives pallet T is different from that of supply unit 10a.

[0169] Next, as Figure 15 As shown in (B), the stage 20a moves below the removal section 40a to remove the protective sheet P from the tray T. The stage 20a first positions the tray TR below the removal section 40a, and after removing the protective sheet P from the tray TR, as shown... Figure 15 As shown in (C), the tray TL is positioned below the removal section 40a, and the protective sheet P of the tray TL is removed. Similarly, as... Figure 15 As shown in (B), the stage 20b first positions the tray TL below the removal section 40b. After removing the protective sheet P from the tray TL, as... Figure 15 As shown in (C), the tray TR is positioned below the removal section 40b, and the protective sheet P of the tray TR is removed. That is, the order in which the removal section 40b removes the protective sheet P from the tray TR is different from that of the removal section 40a.

[0170] Furthermore, such as Figure 15 As shown in (D), the stage 20a moves below the transfer unit 60, the transfer unit 60 picks up the electronic component C from the tray T, and the mounting unit 70 mounts the electronic component C onto the substrate D. The stage 20a first positions the tray T1 below the transfer unit 60, and after the tray T1 becomes empty due to being picked up by the transfer unit 60, as shown in (D). Figure 15 As shown in (E), the tray TR is positioned below the transfer unit 60. Therefore, even if the tray TL becomes empty, the transfer unit 60 can still pick up the electronic component C from the tray TR, thus ensuring uninterrupted picking of the electronic component C.

[0171] Furthermore, after the tray TL is emptied by being picked up by the transfer unit 60, such as Figure 15As shown in (F), the stage 20a can be moved to the supply section 10a at any time, and the tray TL can be replaced with a new tray. An example of such a time is when the substrate D for mounting electronic component C is replaced. At this time, it is assumed that approximately half of electronic component C remains on the tray TR. While the stage 20a is moving to replace the tray TL with a new tray, the stage 20b moves below the transfer section 60. Specifically, the tray TR of the stage 20b is positioned below the transfer section 60. Thus, the picking and mounting of electronic component C can resume immediately after the substrate D is replaced. During the picking and mounting of electronic component C from the tray TR of the stage 20b, the tray TL of the stage 20a is replaced with a new tray, and the newly replaced tray TL, moved by the stage 20a, is positioned below the removal section 40a, where the protective sheet P is removed.

[0172] When returning to stage 20b for pickup, when tray TR on stage 20b becomes empty, stage 20b positions tray TL below transfer unit 60 and continuously picks up electronic component C. After tray TR on stage 20b becomes empty, similar to the above description, stage 20b is moved to supply unit 10b at a time corresponding to the replacement time of substrate D, and the empty tray TR is replaced. While stage 20b is moving, stage 20a positions tray TR with approximately half of electronic component C remaining below transfer unit 60 and restarts the pickup and installation of electronic component C.

[0173] Thus, by employing a structure in which the two stages 20a and 20b respectively hold two trays TL and TR, electronic components C can be continuously mounted on the substrate D. Furthermore, there is no possibility of installation being interrupted due to the replacement of tray T. That is, even if one tray T becomes empty, it can be immediately switched to the adjacent tray T. Furthermore, the stage 20 can be switched at the same time as the substrate D is being replaced. Therefore, in the other stage 20, there is no possibility of installation being interrupted due to the time spent replacing tray T or removing the protective sheet P.

[0174] (13) The supply unit 10 and the platform 20 of the embodiment are provided with a pair of supply units 10a and platform 20a and supply units 10b and platform 20b, but only one of them may be provided. Alternatively, a platform 20 may be provided for the pair of supply units 10a and 10b, so that the platform 20 can move between the pair of supply units 10a and 10b, and the two supply units 10 share a platform 20. This simplifies the overall structure of the electronic component mounting device.

[0175] Reference Figure 16 An embodiment where a single platform 20 is shared will be described. Figure 16 In, with Figure 13Similarly, in the layout shown, the movement path of the platform 20 is configured to change direction at approximately right angles, and one platform 20 is configured to hold two trays T. The following is related to... Figure 15 Similarly, the left tray T is referred to as tray TL, and the right tray T is referred to as tray TR. Furthermore, if a diagonal line is drawn over the tray T in the diagram, it is assumed that a protective sheet P is placed on it; if no diagonal line is drawn over the tray T, it is assumed that the protective sheet P is removed.

[0176] First, such as Figure 16 As shown in (A), tray T is removed from supply unit 10a and held on platform 20. Platform 20 sequentially receives tray TL and tray TR from supply unit 10a. Then, as... Figure 16 As shown in (B), the stage 20 moves below the removal section 40a and removes the protective sheet P from the tray T. The stage 20 first positions the tray TR below the removal section 40a, and after removing the protective sheet P from the tray TR, as shown... Figure 16 As shown in (C), the tray TL is positioned below the removal section 40a, and the protective sheet P of the tray TL is removed.

[0177] Furthermore, such as Figure 16 As shown in (D), the stage 20 moves below the transfer unit 60, the transfer unit 60 picks up the electronic component C from the tray T, and the mounting unit 70 mounts the electronic component C onto the substrate D. The stage 20 first positions the tray T1 below the transfer unit 60, and after the tray T1 becomes empty due to being picked up by the transfer unit 60, as shown in (D). Figure 16 As shown in (E), the tray TR is positioned below the transfer unit 60. Therefore, even if the tray TL becomes empty, the transfer unit 60 can still pick up the electronic component C from the tray TR, thus ensuring uninterrupted picking of the electronic component C.

[0178] Furthermore, after the tray TL is emptied by being picked up by the transfer unit 60, such as Figure 16 As shown in (F), the stage 20 can be moved to the supply section 10b at any time to replace the tray TL with a new tray. An example of such a time is when the substrate D for mounting electronic component C is replaced. At this time, it is assumed that approximately half of the electronic component C remains on the tray TR. After replacing the tray TL, the protective sheet P is removed using the removal section 40b, placing the tray TR below the transfer section 60, allowing the picking and mounting of the electronic component C to resume. Subsequently, if the tray TR becomes empty, it is picked up from the tray TL. Furthermore, if the time for replacing the substrate D arrives, the empty tray TR is replaced. In addition, in Figure 16 The number of electronic components C mounted on the substrate D is set to be less than or equal to the number of electronic components C contained in a tray T.

[0179] (14) An ionizer may also be provided to remove static electricity from the lowest tray T held by the supply section 10 in the above embodiment. This prevents the protective sheet P placed on the lowest tray T from sticking to the bottom surface of the upper tray T due to static electricity or the like.

[0180] (15) such as Figure 17 As shown, the platform 20 in this embodiment can be a round, table-shaped platform capable of intermittent rotation. The platform... Figure 17 The tray T is received at the 9 o'clock position, the protective sheet P is removed by the removal unit 40 at the 6 o'clock position, the electronic component C is picked up by the suction nozzle 61a of the transfer unit 60 at the 3 o'clock position, and after all the electronic components C on the tray T are picked up, the tray T is stored in the storage section of the empty tray T at the 12 o'clock position.

[0181] (16) The electronic component mounting apparatus of the embodiment described herein is a COG mounting apparatus for mounting chip-shaped electronic components, but is not limited thereto. For example, it may be an electronic component mounting apparatus for mounting chip-shaped electronic components on a film-like circuit board such as an organic electroluminescence (EL) substrate, or a dual-purpose electronic component mounting apparatus that selectively supplies and mounts both chip-shaped and film-like electronic components, wherein the film-like electronic components are chip-on-film (COF) electronic components on which a driver IC is mounted on a film-like circuit board. In short, any apparatus that supplies and mounts chips from a stacked tray is acceptable, and the substrate may be a wafer such as silicon, or a non-film-like circuit board.

[0182] [Other Implementation Methods]

[0183] The embodiments and variations of the present invention have been described above. However, these embodiments and variations are provided as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments or variations thereof are included in the scope or spirit of the invention and are included in the invention as described in the claims.

Claims

1. An electronic component mounting device, comprising: The supply department holds trays containing electronic components and protective sheets covering the electronic components in a stacked state. The platform receives the trays one by one from below the supply unit and moves the trays from the supply unit to the position where the electronic components are picked up; The head, at the position for picking up the electronic component, picks up the electronic component placed on the tray; The crimping section receives the electronic component from the head and crimps the electronic component to the substrate; A removal unit is provided on the path along which the platform transports the tray from the supply unit to the position where the electronic component is picked up, and removes the protective sheet from the transported tray; as well as A removal detection unit is disposed on the path between the removal unit and the position where the electronic component is picked up, and detects whether the protective sheet on the tray moving in the horizontal direction has been removed.

2. The electronic component mounting device according to claim 1, wherein... The removal section uses negative pressure to adsorb and retain the adsorption section of the protective sheet.

3. The electronic component mounting device according to claim 2, wherein... The adsorption section approaches the protective sheet and stops at a predetermined height to generate negative pressure.

4. The electronic component mounting device according to claim 2, wherein... The adsorption section generates negative pressure while approaching the protective sheet.

5. The electronic component mounting apparatus according to any one of claims 2 to 4, further comprising: The recycling bin is used to recycle the protective sheet. The recycling bin is located directly below the adsorption unit.

6. The electronic component mounting apparatus according to claim 1, wherein... The removal part is an adhesive part that uses an adhesive sheet to adhere and retain the protective sheet.

7. The electronic component mounting device according to claim 1, wherein... The removal section is an airflow generation section that uses airflow to remove the protective sheet.

8. The electronic component mounting apparatus according to claim 1, wherein... The removal section is the chuck section that removes the protective sheet.

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