Ion source polishing equipment with integrated power supply

Abstract

The invention belongs to the technical field of ion beam polishing, and particularly relates to ion source polishing equipment with an integrated power source, the ion source polishing equipment comprises a moving mechanism, an ion beam generating mechanism, a heating mechanism, a cooling plate, a clamping mechanism and the integrated power source, the heating mechanism comprises a plurality of heating plates, and the clamping mechanism clamps a workpiece and is tightly attached to the front end faces of the heating plates; the cooling plate is fixedly connected with the ion beam generating mechanism through a connecting frame and clings to the rear end face of the corresponding heating plate, so that the cooling plate always corresponds to the polishing point; the heating plates can be used for preheating workpieces, and during polishing, the cooling plates are used for cooling polishing points through the corresponding heating plates; the integrated power supply can supply power to the ion beam generating mechanism, the heating mechanism and the cooling plate; the equipment is high in polishing heat dissipation efficiency, temperature control is free of lag, an ionization power source, a differential pressure power source and an acceleration focusing power source which are needed by the ion beam polishing machine are integrated through the integrated power source, and the equipment has the advantages of being good in integration degree and stability, high in intelligence and low in cost.

Description

Technical Field

[0001] This invention relates to the field of ion beam polishing technology, and more specifically to an ion source polishing device with an integrated power supply. Background Technology

[0002] Ion beam polishing is a precision machining technique that uses an ion beam to polish the surface of a workpiece. It is widely used in fields such as optical components and semiconductor chips, where extremely high polishing precision is required. Ion beam polishing removes material by bombarding the workpiece surface with an ion beam generated from the ionization of an inert gas, utilizing a physical sputtering effect, thereby achieving high-precision surface correction of optical components.

[0003] During ion beam polishing, the physical sputtering effect generated by the ion beam bombarding the workpiece surface is accompanied by a significant thermal effect. The ion beam energy is highly concentrated in the localized area irradiated by the beam spot, causing a sharp rise in temperature in that area, while the temperature of the rest of the workpiece remains relatively low. This large temperature gradient generated within the workpiece can induce severe thermal stress. For large, thin materials with a high coefficient of thermal expansion, when the thermal stress exceeds the material's failure limit or the temperature difference is large, it will lead to workpiece cracking. Existing technology (CN109262376B) – an apparatus and method for reducing thermal stress during ion beam polishing of thin sheet materials – involves setting a heating array consisting of numerous independently temperature-controlled heating units on the back of the workpiece, with a fixed water-cooled heat dissipation base on the back. Its core method is: uniformly preheating the entire workpiece before processing; during processing, through computer control, reducing or shutting down the power of the back heating unit corresponding to the predetermined position before the ion beam moves to that position, thus buffering the heat input from the front ion beam by reducing back heating and minimizing the temperature difference.

[0004] The above solution has the following drawbacks: First, its heat dissipation relies on a fixed, large-area water-cooled base, which has low heat dissipation efficiency and insufficient ability to cope with instantaneous high heat loads; Second, by controlling the heating power of the back side to affect the temperature of the front processing point, its effect heavily depends on the accurate heat transfer model and the lead time (1-600 seconds) prediction, and the temperature control strategy is indirect and lagging. Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide an ion source polishing device with integrated power supply that has high heat dissipation efficiency and no temperature control lag.

[0006] The technical solution adopted in this invention is as follows: An ion source polishing device with an integrated power supply includes a moving mechanism and an ion beam generating mechanism. The moving mechanism can be driven to move along the X-axis and Y-axis. It also includes a heating element, a cooling plate, a clamping mechanism, and an integrated power supply. The heating element includes multiple heating plates. The clamping mechanism clamps the workpiece and holds it close to the front end faces of the multiple heating plates. The cooling plate is fixedly connected to the ion beam generating mechanism via a connecting frame and is close to the rear end face of the corresponding heating plate, ensuring that the cooling plate always corresponds to the polishing point. The heating plates can preheat the workpiece, and during polishing, the cooling plate cools the polishing point through the corresponding heating plate. The integrated power supply provides power to the ion beam generating mechanism, the heating element, and the cooling plate.

[0007] Working principle: Ion beam processing takes place in a vacuum chamber, where heat dissipation through gas is difficult. The heating plate can preheat the workpiece, giving it a certain temperature before processing. During polishing, the polishing point generates a lot of heat. Preheating reduces the temperature difference between the workpiece and its surroundings, preventing workpiece breakage. By installing a cooling plate on the ion beam generating mechanism, it can move with the mechanism and always be positioned behind the corresponding heating plate at the polishing point. Utilizing the good thermal conductivity of the heating plate itself, localized heat dissipation is achieved on the workpiece through the corresponding heating plate.

[0008] Compared with the prior art, the beneficial effects of the present invention are as follows: First, the smaller cooling plate acts directly on the back of the heat source (polishing point), establishing the most efficient heat conduction path through the corresponding heating plate. It can instantly and efficiently remove the instantaneous concentrated heat generated by ion beam bombardment, greatly improving the ability to cope with instantaneous high heat loads and effectively preventing local overheating.

[0009] Second, the cooling action is synchronized with the ion beam processing position, eliminating the need for complex heat transfer model prediction and lead control, thus achieving direct control of the polishing point temperature.

[0010] In a preferred embodiment of the present invention, each heating plate includes a heat-conducting shell, a heating resistor is provided inside the heat-conducting shell, and a plurality of heat-resistant plates are fixedly connected to the outer wall of the heat-conducting shell. The heat-conducting shell is fixedly connected to the adjacent heat-conducting shell through the corresponding heat-resistant plates. The heat-conducting shell side plate is provided with multiple telescopic heat-conducting plates. When the heat is generated, the corresponding telescopic heat-conducting plates of two adjacent heat-conducting shells come into contact with each other. During polishing, the polishing point moves inward on the corresponding telescopic heat-conducting plate of the heat-conducting shell.

[0011] Beneficial effects: With the above setup, multiple heating plates are connected together to form a whole using heat-insulating plates, but their heat transfer is independent. However, by setting up telescopic heat-conducting plates, multiple heating plates are connected to each other and heat together when heating, resulting in more uniform heat distribution. During polishing, the telescopic heat-conducting plates of the heat-conducting shell corresponding to the polishing point retract inward, so that the corresponding heating plate is in an independent heat transfer state, allowing the cooling plate to cool the polishing point in a targeted manner.

[0012] In a preferred embodiment of the present invention, a sliding groove is provided on the rear end face of the heat-conducting shell, and a sliding frame is slidably installed in the sliding groove along the Z-axis. The telescopic heat-conducting plate is installed in the sliding groove by a first spring. The contact surface between the sliding frame and the telescopic heat-conducting plate is an inclined surface. When the sliding frame is pressed inward by the cooling plate, the telescopic heat-conducting plate moves inward.

[0013] Beneficial effects: When the cooling plate moves with the ion beam generating mechanism, it will squeeze the corresponding sliding frame, thereby disconnecting the heat transfer between the corresponding heating plate and the other heating plates, making it an independent heat transfer unit; the telescopic heat conduction plate's telescopic movement is controlled by the cooling plate's mechanical mechanism, which is simple in structure, reliable in operation, and has a low failure rate; the disconnection of the telescopic heat conduction plate is completely synchronized with the cooling plate's positioning and the ion beam processing, disconnecting during processing and reconnecting upon removal, further optimizing the thermal field.

[0014] In a preferred embodiment of the present invention, the cooling plate is provided with a refrigerant channel, which is serpentine in shape.

[0015] Beneficial effects: The serpentine flow channel extends the flow path and residence time of the refrigerant within the cooling plate, increases the heat exchange area, and can more effectively remove heat.

[0016] In a preferred embodiment of the present invention, the cooling plate is provided with a single liquid inlet and two liquid outlets. The liquid inlet corresponds to the polishing point and is located at the center of the cooling plate, and the two liquid outlets are distributed on both sides of the liquid inlet.

[0017] Beneficial effects: The coolant enters from the central area directly opposite the polishing point and flows out symmetrically to both sides, forming the strongest and most direct cooling in the core high-heat area corresponding to the polishing point, and spreading the cooling effect evenly in all directions, effectively creating a cooling area with a smooth temperature gradient centered on the polishing point.

[0018] In a preferred embodiment of the present invention, the refrigerant in the outlet at the front end of the polishing point heats the workpiece, and the refrigerant in the outlet at the rear end of the polishing point cools the workpiece.

[0019] Beneficial effects: The refrigerant flowing in from the inlet is at its lowest temperature, initially cooling the workpiece area at the polishing point. As it passes through the serpentine refrigerant channel, it absorbs a significant amount of heat, reaching the outlets on both sides. At this point, the refrigerant temperature exceeds the preheating temperature generated by the heating plate. Therefore, the workpiece at the outlet position at the front of the polishing point can be reheated, reducing the temperature difference between it and the polishing point. At the outlet position at the rear of the polishing point, although already polished and cooled, its residual temperature remains high, exceeding the temperature at the outlet itself. Therefore, the refrigerant at the rear outlet can continue to cool this area, further reducing the temperature difference.

[0020] In a preferred embodiment of the present invention, the clamping mechanism includes an elastic pressure bar and a clearance portion. The elastic pressure bar presses the workpiece onto the heating plate from the front end. When the ion beam generating mechanism needs to process the clamping point, the clearance portion causes the corresponding elastic pressure bar to disengage.

[0021] Beneficial effect: When the ion beam needs to process a position blocked by the elastic pressure bar, the clearance part can automatically disengage the pressure bar at that point, making room for the ion beam to process. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of an ion source polishing device with integrated power supply according to a first embodiment of the present invention; Figure 2 This is a partial enlarged view of the heating plate in Embodiment 1 of the ion source polishing device with integrated power supply of the present invention; Figure 3 This is a schematic diagram of the back structure of the heating plate in Embodiment 1 of the ion source polishing device with integrated power supply of the present invention; Figure 4 This is a cross-sectional view of the heating plate in Embodiment 1 of the ion source polishing device with integrated power supply of the present invention; Figure 5 This is a schematic diagram of the flow channel of the cooling plate in Embodiment 1 of the ion source polishing device with integrated power supply of the present invention; Figure 6 This is a schematic diagram of the cooling plate and clamping mechanism in Embodiment 2 of the ion source polishing device with integrated power supply of the present invention; Figure 7 This is a partially enlarged view of the clamping mechanism in Embodiment 1 of the ion source polishing device with integrated power supply of the present invention.

[0023] The reference numerals in the attached drawings include: heating plate 1, heat-conducting shell 11, heat-insulating plate 12, telescopic heat-conducting plate 13, sliding frame 14, first spring 15, heating resistor 16, cooling plate 2, refrigerant channel 21, liquid inlet 22, liquid outlet 23, clamping mechanism 3, elastic pressure rod 31, first rod body 32, second cylinder body 33, U-shaped frame 34, second spring 35, stop block 36, adjusting nut 37, mounting ring 38, workpiece 4, ion beam generating mechanism 5, connecting frame 6. Detailed Implementation

[0024] Typical embodiments embodying the features and advantages of the present invention will be specifically described in the following description. It should be understood that the present invention can have various variations in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations herein are for illustrative purposes only and not intended to limit the present invention.

[0025] In the description of this application, the terms "first", "second", etc. are used only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the structure referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0026] Example 1 See Figure 1 As shown, this embodiment discloses an ion source polishing device with an integrated power supply, including a moving mechanism, a heating mechanism, a cooling plate 2, a clamping mechanism 3, an ion beam generating mechanism 5, and an integrated power supply.

[0027] The moving mechanism can be a combination of two sets of motors and lead screws, or a combination of two types of gears and racks. This part is existing technology and will not be described in detail here. The ion beam generating mechanism 5 and the cooling plate are connected by a connecting frame 6. The moving mechanism drives the ion beam generating mechanism 5 and the cooling plate 2 to move along the X-axis and Y-axis.

[0028] The integrated power supply includes the ionization power supply, differential pressure power supply, and accelerating focusing power supply required by the ion polishing equipment. This integrated power supply is compatible with communication interfaces such as RS485 and RS232, and can feed back the operating status of each part to the host computer. The host computer can monitor in real time, and can transmit signals to the host computer for real-time data updates via fiber optic transmission. The ionization power supply is a device that converts electrical energy into a specific form of energy to ionize working gas (such as argon) in a vacuum chamber to generate and maintain plasma.

[0029] Among them, see Figures 2 to 4As shown, the heating mechanism consists of multiple independent heating plates 1 arranged in a row; each heating plate 1 includes a heat-conducting shell 11, which has a heating resistor 16 embedded inside to generate heat. Multiple heat-insulating plates 12 are fixedly connected to the outer wall of the heat-conducting shell 11. These heat-insulating plates 12 not only provide heat insulation but also mechanically connect adjacent heat-conducting shells 11 together to form an integrated support structure. Multiple telescopic heat-conducting plates 13 are provided on the side plates of the heat-conducting shell 11. In the heating state, the corresponding telescopic heat-conducting plates 13 of two adjacent heat-conducting shells 11 contact each other. During polishing, the polishing point corresponds to the telescopic heat-conducting plate 13 of the heat-conducting shell 11 moving inward. A sliding groove is provided on the rear end face of the heat-conducting shell 11. A sliding frame 14 is slidably installed along the Z-axis in the sliding groove. The telescopic heat-conducting plate 13 is installed in the sliding groove by a first spring 15. The contact surface between the sliding frame 14 and the telescopic heat-conducting plate 13 is inclined. When the sliding frame 14 is pressed inward by the cooling plate 2, the telescopic heat-conducting plate 13 moves inward. In the non-processing or preheating state, these telescopic heat-conducting plates 13 extend outward under the action of springs, so that the telescopic heat-conducting plates 13 of adjacent heating plates 1 come into contact with each other, thereby establishing a thermal connection between the heating plates 1, so that heat can be transferred between them, and achieving large-area and uniform preheating of the workpiece 4.

[0030] The clamping mechanism 3 is used to fix the workpiece 4. It includes multiple elastic pressure rods 31, which can be made of rubber and have chamfered or rounded edges to facilitate movement from the outside of the workpiece 4 to the front face of the workpiece 4 (in other embodiments, springs can also be provided along the axial direction of the elastic pressure rods 31 to achieve elastic clamping). These elastic pressure rods 31 apply pressure from the front of the workpiece 4, pressing the workpiece 4 tightly against the front face of all heating plates 1 to ensure good thermal contact. When the ion beam needs to process a position blocked by a certain elastic pressure rod 31, the clearance part in the device will be activated, causing the elastic pressure rod 31 at that position to automatically disengage from the surface of the workpiece 4, making room for ion beam processing, thereby achieving full-area processing of the surface of the workpiece 4. In this embodiment, an electric push rod can be used to drive the elastic pressure rod 31 to move laterally to achieve clearance.

[0031] See Figure 5 As shown, the cooling plate 2 is rigidly fixed to the ion beam generating mechanism via a connecting frame, thus allowing it to move synchronously with the ion beam generating mechanism. The cooling plate 2 has serpentine refrigerant channels 21 machined inside for the flow of cooling liquid (refrigerant refrigeration is a mature existing technology and will not be described in detail here). The cooling plate 2 has a liquid inlet 22 located at its center and two symmetrically distributed liquid outlets 23 on either side of the liquid inlet 22. The cooling plate 2 is arranged behind the array of heating plates 1, and during processing, it remains directly opposite the ion beam polishing point, closely adhering to the rear end face of the corresponding heating plate 1.

[0032] In this embodiment, the heating resistor 16 can adjust its power or heating time according to the material of the workpiece 4, thereby adjusting the preheating temperature; the existing refrigerant refrigeration can also adjust the refrigeration temperature according to the material of the workpiece 4.

[0033] During operation, the heating plate 1 is powered to preheat the workpiece 4, which is in close contact with the front end face, thereby increasing the base temperature of the workpiece 4 and reducing the initial temperature difference in subsequent processing. When the ion beam generating mechanism begins to polish a specific point (polishing point), the moving mechanism drives the workpiece 4, moving that point below the ion beam. At the same time, the cooling plate 2, fixed on the ion beam generating mechanism, also moves accordingly and precisely abuts against the rear end face of the heating plate 1 corresponding to the polishing point.

[0034] Just as the cooling plate 2 comes into contact with the target heating plate 1, the pressure from the cooling plate 2 acts on a sliding frame 14 within the sliding groove on the rear end face of the target heating plate 1, pushing it inward (since the sliding frame 14 is rectangular, the cooling plate 2 can correspond to multiple adjacent sliding frames 14). Because the contact surface between the sliding frame 14 and the telescopic heat-conducting plate 13 is inclined, the inward movement of the sliding frame 14 compresses all the telescopic heat-conducting plates 13, causing them to retract inward against the spring force. This severs the direct thermal connection between the target heating plate 1 and the surrounding adjacent heating plates 1, making it an independent thermal unit.

[0035] Subsequently, the integrated power supply powers the circulation system within the cooling plate 2, and refrigerant is pumped in from the central inlet 22. The lowest-temperature refrigerant first flows through the central area directly opposite the polishing point, efficiently absorbing and carrying away the large amount of concentrated heat generated by the ion beam bombardment through the high thermal conductivity of the heating plate 1. After absorbing heat, the refrigerant flows to both sides along the serpentine channel, gradually increasing in temperature. When the refrigerant flows out from the outlet 23 on the front side (the area to be processed) of the polishing point's travel direction, its temperature is already higher than the preheating temperature of the workpiece 4. Therefore, it can provide moderate supplementary heating to the area of ​​the workpiece 4 in front, further smoothing the temperature gradient between this area and the high-temperature polishing point. While the refrigerant flowing out from the outlet 23 on the rear side (the processed area) of the polishing point has also increased in temperature, it may still be lower than the processed area due to residual heat from processing. This allows for gentle subsequent cooling of this area, promoting the uniformity of the overall temperature field.

[0036] Example 2 See Figure 6 and Figure 7As shown, the clearance part includes a first rod 32, a second cylinder 33, and a U-shaped frame 34. The first rod 32 is fixedly installed on the frame, and the second cylinder 33 is slidably installed on the first rod 32 along the X-axis. A second spring 35 is fixedly connected between one end of the first rod 32 and one end of the second cylinder 33. The middle part of the U-shaped frame 34 is connected to the other end of the second cylinder 33, so that the two ends of the U-shaped frame 34 are located on both sides of the heating plate. An elastic pressure rod 31 is fixed to one end of the U-shaped frame 34, and a stop block 36 is fixed to the other end of the U-shaped frame 34. The stop block 36 has chamfers on its upper and lower sides.

[0037] In this embodiment, the sidewall of the cooling plate 2 is curved. Whenever the cooling plate 2 moves to the clamping area, the cooling plate 2 abuts against the stop block 36, which pushes the stop block 36, U-shaped frame 34, second cylinder 33, and elastic pressure rod 31, and compresses the second spring 35, thereby detaching from the workpiece 4. Other elastic pressure rods 31 are used to ensure the clamping of the workpiece 4. When the cooling plate 2 leaves the corresponding clamping point, the second spring 35 resets the elastic pressure rod 31, realizing the automatic reset of the clamping mechanism 3.

[0038] The first rod 32 is threaded, and an adjusting nut 37 is screwed onto the first rod 32. The adjusting nut 37 has a rotating groove, and an installation ring 38 is installed in the rotating groove. The two ends of the second spring 35 are fixedly connected to the installation ring 38 and the second cylinder 33, respectively. With this setting, the distance between the second cylinder 33 and the first rod 32 can be adjusted, thereby adjusting the pressing point of the elastic pressure rod 31, which is suitable for workpieces 4 of different sizes within a certain range.

[0039] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. An ion source polishing device with an integrated power supply, comprising a moving mechanism and an ion beam generating mechanism, wherein the moving mechanism is drivable to move along the X-axis and Y-axis, characterized in that: It also includes a heating mechanism, a cooling plate, a clamping mechanism, and an integrated power supply. The heating mechanism includes multiple heating plates. The clamping mechanism clamps the workpiece and keeps it close to the front end face of the multiple heating plates. The cooling plate is fixedly connected to the ion beam generating mechanism through a connecting frame and is close to the rear end face of the corresponding heating plate, so that the cooling plate always corresponds to the polishing point. The heating plate can preheat the workpiece, and during polishing, the cooling plate cools the polishing point through the corresponding heating plate; The integrated power supply can power the ion beam generating mechanism, the heating mechanism, and the cooling plate.

2. The ion source polishing device with integrated power supply according to claim 1, characterized in that: Each of the heating plates includes a heat-conducting shell, a heating resistor is provided inside the heat-conducting shell, and multiple heat-insulating plates are fixedly connected to the outer wall of the heat-conducting shell. The heat-conducting shell is fixedly connected to the adjacent heat-conducting shell through the corresponding heat-insulating plates. The heat-conducting shell side plate is provided with multiple telescopic heat-conducting plates. When the heat is generated, the corresponding telescopic heat-conducting plates of two adjacent heat-conducting shells come into contact with each other. During polishing, the polishing point moves inward on the corresponding telescopic heat-conducting plate of the heat-conducting shell.

3. The ion source polishing device with integrated power supply according to claim 2, characterized in that: The rear end face of the heat-conducting shell is provided with a sliding groove, and a sliding frame is slidably installed in the sliding groove along the Z-axis. The telescopic heat-conducting plate is installed in the sliding groove by a first spring. The contact surface between the sliding frame and the telescopic heat-conducting plate is an inclined surface. When the sliding frame is pressed inward by the cooling plate, the telescopic heat-conducting plate moves inward.

4. The ion source polishing device with integrated power supply according to claim 1, characterized in that: The cooling plate has a refrigerant channel, which is serpentine.

5. The ion source polishing device with integrated power supply according to claim 4, characterized in that: The cooling plate has a single liquid inlet and two liquid outlets. The liquid inlet corresponds to the polishing point and is located in the center of the cooling plate, while the two liquid outlets are distributed on both sides of the liquid inlet.

6. The ion source polishing apparatus with integrated power supply according to claim 5, characterized in that: The refrigerant in the outlet at the front of the polishing point heats the workpiece, while the refrigerant in the outlet at the rear of the polishing point cools the workpiece.

7. The ion source polishing device with integrated power supply according to claim 1, characterized in that: The clamping mechanism includes an elastic pressure bar and a clearance part. The elastic pressure bar presses the workpiece onto the heating plate from the front end. When the ion beam generating mechanism needs to process the clamping point, the clearance part causes the corresponding elastic pressure bar to disengage.

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