Millimeter wave multichannel transceiver assembly based on heterogeneous integration

Abstract

The invention discloses a millimeter wave multichannel transmit-receive assembly based on heterogeneous integration, which comprises a main body with two layers of back-to-back cavity structures, and radio frequency circuits are assembled in cavities on the A surface and the B surface. One side of the main body is provided with a low-frequency socket and radio-frequency connectors, and the other side is provided with radio-frequency connectors connected with an antenna in array distribution. The radio frequency circuit comprises a driving stage bidirectional amplifier, a power divider, a multi-channel amplitude-phase multifunctional chip based on the heterogeneous integration technology and a final stage bidirectional amplifier which are connected in sequence to form a transceiving link. The multi-channel amplitude-phase multifunctional chip integrates functions of attenuation phase shift, driving amplification and power supply modulation; the low-frequency socket pin adopts double-sided gold wire bonding, and a multi-core insulator is arranged in the main body to realize vertical interconnection. Through heterogeneous integration and double-layer cavity design, the integration level is improved, the size is reduced, the cost is reduced, and the requirements for miniaturization and high performance are met.

Description

Technical Field

[0001] This invention relates to the field of microwave and millimeter-wave technology, and more specifically to a millimeter-wave multi-channel transceiver component based on heterogeneous integration. Background Technology

[0002] With the rapid development of communication technology, active phased array antennas are continuously evolving towards miniaturization, high integration, and low cost. Among them, the transceiver module is the core component of the active phased array antenna, which determines the size, weight, performance, and other specifications of the antenna array.

[0003] Currently, transceiver circuit device processes are mainly divided into two categories: silicon-based semiconductor processes represented by CMOS, and III-V compound semiconductor processes represented by GaAs and GaN. CMOS processes have advantages such as high integration density, low power consumption, and low cost, but they are difficult to meet the requirements of millimeter-wave phased array radar in terms of output power, noise, and dynamic range, making them more suitable for analog-to-digital circuits. In contrast, GaAs and GaN processes exhibit superior high-frequency performance, making them particularly suitable for millimeter-wave applications, but they also suffer from low integration density, high cost, and poor process consistency. Each process has its own advantages and disadvantages, and using a single process is insufficient to meet the development needs of miniaturization, multifunctionality, and low cost of transceiver components. Therefore, how to combine the advantages of different processes to design a highly integrated, low-cost transceiver component is a pressing technical problem that needs to be solved. Summary of the Invention

[0004] The purpose of this invention is to provide a millimeter-wave multi-channel transceiver component based on heterogeneous integration, which aims to solve the problem that transceiver components in the prior art are difficult to achieve miniaturization, high performance and low cost at the same time.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A millimeter-wave multi-channel transceiver component based on heterogeneous integration, comprising: The main body is a two-layer back-to-back cavity structure, including an A-side cavity structure and a B-side cavity structure, both of which are equipped with radio frequency circuits. A low-frequency socket and an RF connector are provided on one side of the main body. The low-frequency socket is configured to provide power and control signals, and the RF connector is configured to input or output RF signals. Multiple RF connectors are arranged in an array on the other side of the main body and are configured to connect antennas. The radio frequency circuit includes a driver-stage bidirectional amplifier, a power divider, a multi-channel amplitude-phase multi-function chip, and a final-stage bidirectional amplifier; the multi-channel amplitude-phase multi-function chip is based on heterogeneous integration technology and integrates attenuation phase shift, drive amplification, and power modulation functions for multiple transceiver channels. The driver-stage bidirectional amplifier, power divider, multi-channel amplitude-phase multi-function chip, and final-stage bidirectional amplifier are connected in sequence to form a transceiver link.

[0006] Furthermore, the multi-channel amplitude-phase multi-function chip is configured such that, in the transmitting state, the signal after being split by the power divider is phase-shifted and attenuated before being transmitted to the final stage bidirectional amplifier; and in the receiving state, the signal from the final stage bidirectional amplifier is phase-shifted and attenuated before being transmitted to the power divider for reconnection.

[0007] Furthermore, the pins of the low-frequency socket adopt a double-sided gold wire bonding connection method. One side of the pin is bonded and interconnected with the printed circuit board in the cavity on side A, and the other side is bonded and interconnected with the printed circuit board in the cavity on side B.

[0008] Furthermore, the inner shell of the main body is provided with a multi-core insulator, and some electrical signals in the A-side cavity and the B-side cavity are vertically interconnected and transmitted through the multi-core insulator.

[0009] Furthermore, the pins interconnected with the printed circuit board inside the cavity on side A are configured to provide power and control signals for the circuit on side A and some power and control signals for the circuit on side B; the pins interconnected with the printed circuit board inside the cavity on side B are configured to provide power and control signals for the circuit on side B and some power and control signals for the circuit on side A.

[0010] Furthermore, the printed circuit board designs within the A-side cavity and the B-side cavity are identical; during assembly, the signal transmission path of the circuit is changed by adjusting the position of the bonding point between the chip and the printed circuit board to achieve the corresponding electrical characteristics.

[0011] Furthermore, a partition wall is provided between the radio frequency signal lines on the printed circuit board, and an inner cover plate is provided on the partition wall.

[0012] Furthermore, the inner cover plate is fixed to the housing by screws; an outer cover plate is also provided on the inner cover plate, and the outer cover plate is laser-sealed to the housing.

[0013] Furthermore, the radio frequency circuits inside both the A-side cavity and the B-side cavity are 8-channel transceiver circuit structures, and 16 radio frequency connectors are provided on the other side of the main body, arranged in a 2×8 array.

[0014] Furthermore, the radio frequency connector is an SSMP connector; two radio frequency connectors are provided on one side of the main body, corresponding to the radio frequency circuits inside the A-side cavity and the B-side cavity, respectively.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention employs a multi-channel amplitude-phase multi-functional chip based on heterogeneous integration technology, combining silicon-based processes with compound semiconductor processes to integrate attenuation phase shifting, drive amplification, and power modulation functions for multiple transceiver channels. This design significantly improves system integration, reduces overall circuit size, achieves miniaturization, and lowers component costs while ensuring the electrical performance of the components. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below.

[0017] Figure 1 This is a 3D structural appearance diagram of a millimeter-wave multi-channel transceiver component.

[0018] Figure 2 This is a schematic diagram of the connector arrangement at the front end of a millimeter-wave multichannel transceiver assembly.

[0019] Figure 3 This is a schematic diagram of the connector arrangement at the rear end of a millimeter-wave multichannel transceiver assembly.

[0020] Figure 4 This is a schematic diagram of the internal structure of the cavity on sides A and B.

[0021] Figure 5 This is a schematic diagram illustrating the adjustment of the bonding points between the chip and the printed circuit board.

[0022] Explanation of reference numerals in the attached figures: 1. Partition wall; 2. Outer cover plate; 3. Low frequency socket; 4. Transmit excitation input SSMP connector; 5. Transmit output SSMP connector; 6. Driver stage bidirectional amplifier; 7. Power divider; 8. Multi-channel amplitude and phase multi-function chip; 9. Final stage bidirectional amplifier; 10. Printed circuit board; 11. Multi-core insulator. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0024] like Figures 1 to 5 As shown, the present invention provides a millimeter-wave multi-channel transceiver component based on heterogeneous integration. To make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0025] It should be noted that in the following embodiments, the independent claims for the apparatus are not segmented and numbered, only the independent claims for the method are segmented and numbered. For the apparatus claims, the original text will be directly reproduced and explained.

[0026] A millimeter-wave multi-channel transceiver component based on heterogeneous integration, comprising: The system includes a main body, which is a two-layer back-to-back cavity structure, including an A-side cavity structure and a B-side cavity structure. Both the A-side cavity structure and the B-side cavity structure are equipped with radio frequency circuits. Specifically, the main body adopts a two-layer back-to-back cavity structure design, with radio frequency circuits installed inside both the A-side and B-side cavities, forming a double-sided integrated structure. This effectively utilizes space and volume, significantly improving component integration and achieving miniaturization.

[0027] A low-frequency socket 3 and an RF connector are provided on one side of the main body. The low-frequency socket 3 is configured to provide power and control signals, and the RF connector is configured to input or output RF signals. Multiple RF connectors are arranged in an array on the other side of the main body and are configured to connect antennas. The low-frequency socket 3 is responsible for transmitting power and control signals, while the RF connectors are used for signal input and output. The RF connectors arranged in an array on the other side connect to the antenna. This enables convenient connection between the component and external devices and antenna arrays, optimizing the interface layout.

[0028] In one embodiment of this application, the radio frequency connector is an SSMP connector; two radio frequency connectors are provided on one side of the main body, corresponding to the radio frequency circuits inside the A-side cavity and the B-side cavity, respectively.

[0029] Specifically, the RF connectors are of the SSMP type, with two RF connectors on one side of the main body corresponding to the circuitry inside side A and side B, respectively. This adapts to the connection requirements of the millimeter-wave band and ensures high stability of RF signal transmission.

[0030] In one embodiment of this application, the radio frequency circuits inside both the A-side cavity and the B-side cavity are 8-channel transceiver circuit structures, and 16 radio frequency connectors are provided on the other side of the main body, arranged in a 2×8 array.

[0031] Specifically, each of the A-side and B-side cavities is designed with 8-channel transceiver circuits, and 16 RF connectors are arranged in a 2×8 array on the other side of the main body. This enables high-density multi-channel signal transmission and reception, meeting the large-scale integration requirements of phased array antennas.

[0032] In one embodiment of this application, the pins of the low-frequency socket 3 are connected by double-sided gold wire bonding. One side of the pin is bonded to the printed circuit board 10 in the cavity on side A, and the other side is bonded to the printed circuit board 10 in the cavity on side B.

[0033] Specifically, the low-frequency socket's three pins employ double-sided gold wire bonding, with one side connecting to the A-side printed circuit board 10 and the other side connecting to the B-side printed circuit board 10. This achieves signal interconnection between the two-sided circuits through a single-sided socket, simplifying the interface structure and improving connection reliability.

[0034] In one embodiment of this application, a multi-core insulator 11 is provided on the inner shell of the main body, and some electrical signals in the A-side cavity and the B-side cavity are vertically interconnected and transmitted through the multi-core insulator 11.

[0035] Specifically, the housing is equipped with a multi-core insulator 11, through which some electrical signals within the cavities on side A and side B are vertically interconnected and transmitted. This solves the signal interconnection problem between the two cavities, ensuring both isolation and conductivity of signal transmission.

[0036] In one embodiment of this application, the pins interconnected with the printed circuit board 10 inside the A-side cavity are configured to provide power and control signals for the A-side circuit and some power and control signals for the B-side circuit; the pins interconnected with the printed circuit board 10 inside the B-side cavity are configured to provide power and control signals for the B-side circuit and some power and control signals for the A-side circuit.

[0037] Specifically, in addition to providing signals for its own side, the pins on side A also transmit some signals from side B, and the same applies to the pins on side B, forming a cross-power supply and control system. This achieves redundant backup and flexible allocation of power and control signals, improving the system's fault tolerance.

[0038] The radio frequency circuit includes a driver-stage bidirectional amplifier 6, a power divider 7, a multi-channel amplitude-phase multi-function chip 8, and a final-stage bidirectional amplifier 9; the multi-channel amplitude-phase multi-function chip 8 is based on heterogeneous integration technology and integrates attenuation phase shift, drive amplification, and power modulation functions for multiple transceiver channels. The radio frequency circuit consists of a driver-stage bidirectional amplifier 6, a power divider 7, a multi-channel amplitude and phase multi-function chip 8, and a final-stage bidirectional amplifier 9, arranged sequentially. The core chip employs heterogeneous integration technology. This significantly reduces the circuit area, improves channel consistency, and achieves a high degree of multi-functional integration.

[0039] In one embodiment of this application, the printed circuit board 10 in the A-side cavity and the B-side cavity has the same circuit design; during assembly, the position of the bonding point between the chip and the printed circuit board 10 is adjusted to change the circuit signal transmission path to achieve the corresponding electrical characteristics.

[0040] Specifically, the A-side and B-side printed circuit boards 10 adopt a consistent design. During assembly, the signal path is changed by adjusting the bonding point position to match the electrical characteristics. This reduces the design and manufacturing cost of the printed circuit boards, simplifies the production process, and improves assembly flexibility.

[0041] In one embodiment of this application, the multi-channel amplitude-phase multi-function chip 8 is configured to: in the transmitting state, transmit the signal after being split by the power divider 7 to the final stage bidirectional amplifier 9 after phase shifting and attenuation processing; and in the receiving state, transmit the signal from the final stage bidirectional amplifier 9 to the power divider 7 after phase shifting and attenuation processing.

[0042] Specifically, during transmission, chip 8 performs phase shifting and attenuation on the split signals before outputting them, and during reception, it performs phase shifting and attenuation on the amplified signals before combining them, thereby achieving precise amplitude and phase control in the transmit / receive duplex mode and ensuring the accuracy of beamforming.

[0043] The driver-stage bidirectional amplifier 6, power divider 7, multi-channel amplitude-phase multi-function chip 8, and final-stage bidirectional amplifier 9 are connected in sequence to form a transceiver link.

[0044] Specifically, the devices are cascaded sequentially to form a complete transceiver link, in which signals are transmitted in order. This constructs a stable and efficient signal transmission channel, meeting the performance requirements of millimeter-wave communication systems.

[0045] In one embodiment of this application, a partition wall 1 is provided between the radio frequency signal lines on the printed circuit board 10, and an inner cover plate is provided on the partition wall 1.

[0046] Specifically, a partition wall 1 is provided between the radio frequency signal lines of the printed circuit board 10, and an inner cover plate is installed on the partition wall 1.

[0047] This effectively suppresses signal crosstalk between adjacent channels and significantly improves the isolation between channels.

[0048] In one embodiment of this application, the inner cover plate is connected and fixed to the housing by screws; an outer cover plate 2 is also provided on the inner cover plate, and the outer cover plate 2 is laser-sealed to the housing.

[0049] Specifically, the inner cover plate is fixed with screws, while the outer cover plate 2 is connected to the housing using laser sealing welding. This achieves hermetic sealing of the components, enhances environmental adaptability, and ensures the long-term reliability of the internal components.

[0050] For example, this application is based on a heterogeneous integrated millimeter-wave multichannel transceiver assembly. The main body is a two-layer back-to-back cavity structure, namely an A-side cavity structure and a B-side cavity structure. The RF circuits are assembled inside the cavity, and each cavity has a partition wall 1 and a cover plate 2. There is a low-frequency socket 3 on one side of the main body, and there is a transmit excitation input SSMP connector 4 on each side of the socket; there are 16 transmit output SSMP connectors 5 on the other side, distributed in a 2×8 array.

[0051] Specifically, the low-frequency socket 3 serves as the common control signal and power supply port for the internal circuits of both the A and B sides of the cavity. The two transmit excitation input SSMP connectors 4 on one side of the socket are the transmit excitation input / receive signal output ports for the internal RF circuits of the A and B sides of the cavity, respectively. Both the A and B sides of the cavity's internal RF circuits are 8-channel transceiver circuits, totaling 16 channels. The 2×8 array of transmit output SSMP connectors 5 on the other side of the main body are the transmit signal output / receive signal input ports for the internal circuits of the cavity, connecting to the external antenna.

[0052] In an embodiment of the present invention, a multi-channel amplitude-phase multi-function chip 8 based on heterogeneous integration technology is used internally. This chip integrates attenuation, phase shifting, drive amplification, and power modulation functions for multiple transmit and receive channels, improving system integration and reducing component costs. When this scheme is adopted, the RF signal flow is as follows: When the A-side circuit operates in transmit mode, the RF excitation enters from the transmit excitation input SSMP connector 4, is transmitted through the microstrip circuit, first passes through the driver-stage bidirectional amplifier 6, and after signal amplification, is split into two signals by the power divider 7. These signals are then input to a multi-channel amplitude-phase multi-function chip 8, each split into four outputs and transmitted to the final-stage bidirectional amplifier 9. After final-stage amplification, the signal is finally output to the antenna through the transmit output SSMP connector 5. When the A-side circuit operates in receive mode, the transmit output SSMP connector 5 serves as the receive input port. The signal passes sequentially through the final-stage bidirectional amplifier 9, the multi-channel amplitude-phase multi-function chip 8, the power divider 7 (combined), and the driver-stage bidirectional amplifier 6 before being received.

[0053] Furthermore, to facilitate the processing of low-frequency signals, the power supply and control methods of the components have been optimized and improved. One option is as follows: the pins of the low-frequency socket 3 adopt a double-sided gold wire bonding connection. One pin is bonded to the printed circuit board 10 inside the A-side cavity, and the other pin is bonded to the printed circuit board 10 inside the B-side cavity. The pins connected to the printed circuit board 10 inside the A-side cavity provide power and control signals to the A-side circuit, as well as some power and control signals to the B-side circuit. Similarly, the pins connected to the printed circuit board 10 inside the B-side cavity provide power and control signals to the B-side circuit, as well as some power and control signals to the A-side circuit. Additionally, a multi-core insulator 11 is provided on the internal housing of the component. Some electrical signals from the A and B sides are vertically interconnected and transmitted between the A and B side circuits through the multi-core insulator 11, thereby providing power and control signals to the circuits on the other side. This solution utilizes a double-sided bonding interconnection method, allowing the low-frequency connectors on both the A and B sides of the circuitry to be reused, thus reducing the number of connectors required for the product. By transmitting some low-frequency signals through interconnection between the A and B side circuits, the number of pins required for external low-frequency connectors is reduced, enabling the use of smaller connectors. This solution further reduces the overall size of the component.

[0054] Furthermore, because the low-frequency socket 3 and the multi-core insulator 11 provide different signals to the circuits within the A and B side cavities, the circuit designs of the printed circuit boards 10 on sides A and B typically differ and cannot be guaranteed to be completely identical, which increases the production cost of the component. To facilitate printed circuit board processing and component assembly and testing, the design of the printed circuit board is optimized and improved. One option is listed here: [Refer to...] Figure 5 The circuit designs of the A and B sides of the printed circuit board are kept consistent. During product assembly, the positions of the bonding points between the chip and the printed circuit board are adjusted, allowing the same printed circuit board to achieve different electrical characteristics. This solution ensures the circuit consistency of the A and B sides of the printed circuit board, reduces the types of printed circuit board processing, and lowers manufacturing costs.

[0055] Furthermore, considering that radio frequency signals require certain isolation measures to avoid interference, the isolation method is optimized, and one option is listed: a partition wall 1 is installed between the radio frequency signal lines on the printed circuit board, and an inner cover plate is placed on the partition wall, which is connected and fixed to the housing with screws for easy disassembly and debugging. There is also an outer cover plate 2 on the inner cover plate, which is laser-sealed to the housing.

[0056] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A millimeter-wave multi-channel transceiver component based on heterogeneous integration, characterized in that, include: The main body is a two-layer back-to-back cavity structure, including an A-side cavity structure and a B-side cavity structure, both of which are equipped with radio frequency circuits. A low-frequency socket and an RF connector are provided on one side of the main body. The low-frequency socket is configured to provide power and control signals, and the RF connector is configured to input or output RF signals. Multiple RF connectors are arranged in an array on the other side of the main body and are configured to connect antennas. The radio frequency circuit includes a driver-stage bidirectional amplifier, a power divider, a multi-channel amplitude-phase multi-function chip, and a final-stage bidirectional amplifier; the multi-channel amplitude-phase multi-function chip is based on heterogeneous integration technology and integrates attenuation phase shift, drive amplification, and power modulation functions for multiple transceiver channels. The driver-stage bidirectional amplifier, power divider, multi-channel amplitude-phase multi-function chip, and final-stage bidirectional amplifier are connected in sequence to form a transceiver link.

2. The millimeter-wave multi-channel transceiver component based on heterogeneous integration according to claim 1, characterized in that, The multi-channel amplitude-phase multi-function chip is configured such that, in the transmitting state, the signal after being split by the power divider is phase-shifted and attenuated before being transmitted to the final stage bidirectional amplifier; and in the receiving state, the signal from the final stage bidirectional amplifier is phase-shifted and attenuated before being transmitted to the power divider for reconnection.

3. The millimeter-wave multi-channel transceiver component based on heterogeneous integration according to claim 1, characterized in that, The pins of the low-frequency socket are connected by double-sided gold wire bonding. One side of the pin is bonded to the printed circuit board in the cavity on side A, and the other side is bonded to the printed circuit board in the cavity on side B.

4. The millimeter-wave multi-channel transceiver component based on heterogeneous integration according to claim 3, characterized in that, The main body's internal shell is equipped with multi-core insulators, and some electrical signals in the A-side cavity and B-side cavity are vertically interconnected and transmitted through the multi-core insulators.

5. The millimeter-wave multi-channel transceiver component based on heterogeneous integration according to claim 4, characterized in that, The pins interconnected with the printed circuit board inside the cavity on side A are configured to provide power and control signals for the circuit on side A, as well as some power and control signals for the circuit on side B; the pins interconnected with the printed circuit board inside the cavity on side B are configured to provide power and control signals for the circuit on side B, as well as some power and control signals for the circuit on side A.

6. The millimeter-wave multi-channel transceiver component based on heterogeneous integration according to claim 1, characterized in that, The printed circuit board designs in the A-side cavity and the B-side cavity are identical; during assembly, the signal transmission path of the circuit is changed by adjusting the position of the bonding point between the chip and the printed circuit board to achieve the corresponding electrical characteristics.

7. The millimeter-wave multi-channel transceiver component based on heterogeneous integration according to claim 1, characterized in that, A partition wall is provided between the radio frequency signal lines on the printed circuit board, and an inner cover plate is provided on the partition wall.

8. The millimeter-wave multi-channel transceiver component based on heterogeneous integration according to claim 7, characterized in that, The inner cover plate is fixed to the housing by screws; an outer cover plate is also provided on the inner cover plate, and the outer cover plate is laser-sealed to the housing.

9. The millimeter-wave multi-channel transceiver component based on heterogeneous integration according to claim 1, characterized in that, The radio frequency circuits inside both the A-side cavity and the B-side cavity are 8-channel transceiver circuit structures. On the other side of the main body, there are 16 radio frequency connectors arranged in a 2×8 array.

10. The millimeter-wave multi-channel transceiver component based on heterogeneous integration according to claim 1, characterized in that, The radio frequency connector is an SSMP connector; two radio frequency connectors are provided on one side of the main body, corresponding to the radio frequency circuits inside the A-side cavity and the B-side cavity, respectively.

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