PCBA board built-in structure and method
By combining the design of limiting components and heat dissipation components, the problems of cumbersome fixing operations and low heat dissipation efficiency in the internal structure of PCBA boards are solved, achieving convenient installation, stable fixing and efficient heat dissipation, and extending service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NINGBO HUALIAN ELECTRONIC SCI & TECH CO LTD
- Filing Date
- 2026-04-03
- Publication Date
- 2026-05-15
AI Technical Summary
Existing PCBA board internal structures have many limitations in terms of fixing and heat dissipation. Fixing is cumbersome and can easily damage the casing, resulting in low heat dissipation efficiency and affecting service life.
The circuit board is securely fixed by a combination of limiting components, adjusting components and heat dissipation components. The design of heat dissipation plate and air inlet pipe improves heat dissipation efficiency.
It enables convenient installation and removal of circuit boards, avoids the problem of stripped screws, increases heat dissipation space, improves overall heat dissipation efficiency, and extends service life.
Smart Images

Figure CN122054497A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of PCBA board technology, and in particular to a PCBA board internal assembly structure and method. Background Technology
[0002] As a core component of modern electronic devices, the PCBA board carries the electrical connections and signal transmission functions of various electronic components. Its performance stability and reliability directly determine the overall quality and lifespan of electronic products. In many fields such as consumer electronics, communication equipment, industrial control, and automotive electronics, PCBAs typically need to be installed inside specific enclosures or chassis to obtain physical protection and meet requirements such as electromagnetic shielding and environmental isolation. This installation process not only needs to ensure the precise positioning and firm fixation of the circuit board itself in three-dimensional space to prevent it from shifting or falling off during transportation, use, or impact and vibration, but also needs to fully consider its thermal management requirements during operation.
[0003] In terms of internal mounting and fixing of PCBA boards, the common practice is to use screws to directly lock them to the inner wall of the equipment housing or a pre-set frame. However, this approach has gradually revealed some limitations in practical applications. First, for scenarios that require frequent debugging, replacement, or maintenance of circuit boards, the repeated tightening and loosening of screws during circuit board repair is cumbersome and time-consuming. Furthermore, improper operation or repeated assembly and disassembly can easily cause the screw holes to strip, affecting the fixing effect and even damaging the housing threads. Second, the back of the circuit board is often tightly fitted to the inner wall of the housing or has a small gap, which hinders air convection and is not conducive to heat dissipation of the circuit board, especially the high-heat area at its bottom. Heat is easily accumulated, forming localized high-temperature points, which affects the overall heat dissipation efficiency of the circuit board.
[0004] Therefore, it is necessary to provide a PCBA board internal structure and method to solve the above-mentioned technical problems. Summary of the Invention
[0005] The purpose of this invention is to provide a PCBA board internal structure and method to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, the present invention provides the following solution to the above technical problems: a PCBA board internal structure includes an outer shell, a circuit board disposed inside the outer shell, two symmetrically distributed brackets fixed on the inner side wall of the outer shell, a second support plate fixed on the side of the brackets, a limiting component for clamping the circuit board disposed on each of the two brackets, an adjusting component for adjusting the position of the limiting component disposed at the bottom of the brackets, a supporting component disposed on one side of the brackets, and a heat dissipation component disposed at the bottom of the circuit board.
[0007] As a further embodiment of the present invention, the limiting component includes a connecting rod that slides through the side wall of the bracket, a pressure block is fixed to the end of the connecting rod, and an end plate is fixed to the end of the connecting rod away from the pressure block.
[0008] As a further embodiment of the present invention, the pressure block has an inclined surface at one end near the center of the outer shell, and the inside of the pressure block has multiple sliding grooves, in which a pressure column is slidably connected, and the bottom end of the pressure column has an arc-shaped end.
[0009] As a further embodiment of the present invention, a spring is provided inside the slide groove, and the two ends of the spring are respectively fixed to the side of the slide groove end and the pressure column.
[0010] As a further embodiment of the present invention, the adjustment assembly includes a rotating seat fixed on the inner side wall of the housing. Two rotating seats are provided and the two rotating seats are symmetrically distributed. A double-threaded rod is rotatably connected to both rotating seats. Two connecting rods are threadedly connected to the double-threaded rod. The end of the connecting rod away from the nut sleeve is fixed to the end plate.
[0011] As a further embodiment of the present invention, a screw head block is fixed to one end of the double-screw rod, and a rubber sleeve is fitted onto the surface of the screw head block.
[0012] As a further embodiment of the present invention, the support assembly includes an outer sleeve and a support block fixed to the inner side wall of the outer casing. A sliding plate is slidably connected inside the outer sleeve. A side plate is fixed to one end of the sliding plate. A first support plate is fixed to the side of the side plate. A locking bolt is threadedly connected to the side of the outer sleeve.
[0013] As a further embodiment of the present invention, the heat dissipation assembly includes a heat dissipation plate disposed at the bottom of the circuit board, the heat dissipation plate having an inner cavity inside, and a blower hole communicating with the inner cavity being disposed on the top surface of the heat dissipation plate, the blower hole being provided in a plurality of such blower holes being equidistantly distributed, and an air inlet pipe communicating with the inner cavity being connected to the heat dissipation plate.
[0014] As a further embodiment of the present invention, the heat sink is provided with a groove, and the double-threaded rod passes through the groove.
[0015] An installation method using a PCBA board internal structure includes the following steps:
[0016] S1. When installing the circuit board inside the housing, lay the circuit board flat and place it on the top surface of the second support plate of the bracket. The second support plates on the two brackets support both ends of the circuit board.
[0017] S2. By rotating the double-threaded rod, the two nut sleeves move synchronously in opposite directions. The nut sleeves move through the connecting rod and the connecting rod, which in turn moves the pressure block to adjust its position, thus allowing the pressure block to press and limit the circuit board.
[0018] S3. The spring pushes the pressure column to extend from the slide groove, thereby pressing and locking the circuit board through multiple pressure columns, effectively improving the installation stability of the circuit board. At the same time, the retractable pressure column can be used to press and limit the circuit board of different thicknesses.
[0019] S4. The circuit board is fully supported by the second support plate, the first support plate and the support block, so that the circuit board is suspended inside the shell, which effectively increases the gap between the circuit board and the inner wall of the shell, so that the heat on the circuit board can be dissipated more comprehensively.
[0020] Compared with the prior art, the beneficial effects of the present invention are:
[0021] 1. By using the adjustment component to drive two sets of limiting components to symmetrically press and lock the two ends of the circuit board, the circuit board can be clamped inside the housing. The limiting components can be used to press and limit circuit boards of different thicknesses, effectively expanding the overall applicability. By using the adjustment component to release the pressing and limiting components on the circuit board, the circuit board can be easily removed, effectively improving the efficiency of circuit board installation and removal. This makes it easier to install and remove the circuit board inside the housing, facilitating subsequent maintenance, improving maintenance efficiency, saving installation and removal workload, and avoiding the problem of stripped screws caused by repeated installation and removal.
[0022] 2. By supporting the circuit board with the second support plate, the support components and the two sets of limiting components, the circuit board is suspended inside the shell, thereby avoiding the side of the circuit board from touching the inner wall of the shell. This effectively increases the gap between the circuit board and the inner wall of the shell, allowing the heat on the circuit board to be dissipated more comprehensively, effectively improving the overall heat dissipation efficiency of the circuit board and extending its overall service life.
[0023] 3. By blowing cool air evenly and finely to the bottom of the circuit board through the heat dissipation component, the heat dissipation efficiency and uniformity of the circuit board are effectively improved. The bottom air blowing can directly act on the high-heat area on the back of the circuit board, accelerate heat convection and diffusion, and avoid the phenomenon of excessive temperature caused by heat accumulation in a local area. Attached Figure Description
[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0025] Figure 1 The overall three-dimensional structure of the present invention Figure 1 ;
[0026] Figure 2 This is a top view of the overall structure of the present invention;
[0027] Figure 3 The overall three-dimensional structure of the present invention Figure 2 ;
[0028] Figure 4 for Figure 3 Enlarged view of the structure at point A in the middle;
[0029] Figure 5 This is a partial structural diagram of the adjustment component of the present invention;
[0030] Figure 6 This is a partial structural diagram of the support component of the present invention;
[0031] Figure 7 This is a partial structural diagram of the adjustment component of the present invention;
[0032] Figure 8 This is a partial structural diagram of the limiting component of the present invention;
[0033] Figure 9 This is a schematic diagram of the internal structure of the pressing block of the present invention;
[0034] Figure 10 This is a schematic diagram of the heat dissipation component structure of the present invention.
[0035] The attached diagram lists the components represented by each number as follows:
[0036] 1. Limiting assembly; 101. Pressure block; 102. Inclined surface; 103. Connecting rod; 104. End plate; 105. Slide groove; 106. Pressure column; 107. Arc end; 108. Spring; 2. Adjustment assembly; 201. Connecting rod; 202. Nut sleeve; 203. Double-threaded rod; 204. Rotating seat; 205. Rotating head block; 3. Support assembly; 301. Side plate; 302. First support plate; 303. Slide plate; 304. Outer sleeve; 305. Locking bolt; 306. Support block; 4. Heat dissipation assembly; 401. Heat dissipation plate; 402. Inner cavity; 403. Air inlet pipe; 405. Air outlet; 406. Groove; 5. Outer shell; 6. Circuit board; 7. Bracket; 8. Second support plate. Detailed Implementation
[0037] The present invention will be further described below with reference to embodiments.
[0038] Please see Figure 1-10This invention provides a PCBA board internal assembly structure, including a housing 5. A circuit board 6 is disposed inside the housing 5. Two symmetrically distributed brackets 7 are fixed to the inner side wall of the housing 5. A second support plate 8 is fixed to the side of each bracket 7. Each bracket 7 is provided with a limiting component 1 for clamping the circuit board 6. An adjusting component 2 for adjusting the position of the limiting component 1 is provided at the bottom of each bracket 7. A support component 3 is provided on one side of each bracket 7. A heat dissipation component 4 is provided at the bottom of the circuit board 6. When installing the circuit board 6 inside the housing 5, the circuit board 6 is laid flat and placed on the top surface of the second support plate 8 of the bracket 7. The second support plates 8 on the two brackets 7 support both ends of the circuit board 6, and the support component 3 supports the other two ends. The adjusting component 2 drives the two sets of limiting components 1 to symmetrically press and lock the ends of the circuit board 6, thereby achieving the clamping of the circuit board 6 inside the housing 5. Furthermore, the limiting components 1 are applicable to pressing and limiting circuit boards 6 of different thicknesses, effectively expanding the overall adaptability. Application Scope: When it is necessary to remove the circuit board 6, the adjustment component 2 releases the pressure limit of the limiting component 1 on the circuit board 6, allowing the circuit board 6 to be easily removed. This effectively improves the installation and removal efficiency of the circuit board 6, making the installation and removal of the circuit board 6 inside the housing 5 more convenient, facilitating subsequent maintenance, improving maintenance efficiency, eliminating the need for repeated installation and removal of multiple screws, saving installation and removal workload, and avoiding the problem of stripped screws caused by repeated installation and removal. Through the support of the second support plate 8, the support component 3, and the two sets of limiting components 1, the circuit board 6 is suspended inside the housing 5, thus preventing the side of the circuit board 6 from touching the inner wall of the housing 5, effectively increasing the gap between the circuit board 6 and the inner wall of the housing 5, allowing the heat on the circuit board 6 to be dissipated more comprehensively, effectively improving the overall heat dissipation efficiency of the circuit board 6, and extending the overall service life. The adjustment component 2 can be used to easily adjust the distance between the two sets of limiting components 1, thereby adapting to the installation of circuit boards 6 of different sizes, effectively improving the overall applicability and practicality.
[0039] Further as Figure 5 , Figure 6 and Figure 7 As shown, it is worth noting that the limiting component 1 includes a connecting rod 103 that slides through the side wall of the bracket 7. A pressure block 101 is fixed to the end of the connecting rod 103, and an end plate 104 is fixed to the end of the connecting rod 103 away from the pressure block 101. In actual operation, the circuit board 6 is laid flat and placed on the top surface of the second support plate 8 of the bracket 7. The pressure block 101 moves to one end of the circuit board 6, and the two pressure blocks 101 symmetrically press and lock the two ends of the circuit board 6, thereby realizing the mounting of the circuit board 6 inside the outer shell 5. This eliminates the need for repeated installation and removal of multiple screws, saves the workload of installation and removal, and avoids the problem of stripped screws caused by repeated installation and removal.
[0040] Further as Figure 8 and Figure 9 As shown, it is worth noting that the pressure block 101 has a sloping surface 102 at one end near the center of the outer shell 5. The pressure block 101 has multiple sliding grooves 105 inside, and a pressure post 106 is slidably connected in the sliding groove 105. The bottom end of the pressure post 106 has an arc-shaped end 107. A spring 108 is installed in the sliding groove 105, and the two ends of the spring 108 are fixed to the side of the sliding groove 105 and the pressure post 106, respectively. In actual operation, the spring 108 pushes the pressure post 106 to extend out of the sliding groove 105, thereby pressing and locking the circuit board 6 through multiple pressure posts 106, effectively improving the installation stability of the circuit board 6. At the same time, the retractable pressure post 106 can be used to press and limit the circuit board 6 of different thicknesses, effectively expanding the overall applicability.
[0041] Further as Figure 3 , Figure 5 and Figure 6 As shown, it is worth noting that the adjustment assembly 2 includes a rotating seat 204 fixed to the inner wall of the outer casing 5. There are two rotating seats 204, which are symmetrically distributed. A double-threaded rod 203 is rotatably connected to both rotating seats 204. Two connecting rods 201 are threadedly connected to the double-threaded rod 203. The end of the connecting rod 201 away from the nut sleeve 202 is fixed to the end plate 104. In actual operation, by rotating the double-threaded rod 203, the two nut sleeves 202 are driven to move synchronously in opposite directions. Thus, the nut sleeves 202 drive the connecting rod 103 to move through the connecting rod 201. The connecting rod 103 drives the pressure block 101 to move and adjust, so that the pressure block 101 presses and limits or releases the limit on the circuit board 6, making it convenient to install or remove the circuit board 6.
[0042] Further as Figure 1 , Figure 2 and Figure 4 As shown, it is worth noting that the support assembly 3 includes an outer sleeve 304 and a support block 306 fixed to the inner wall of the outer casing 5. A sliding plate 303 is slidably connected inside the outer sleeve 304. A side plate 301 is fixed to one end of the sliding plate 303. A first support plate 302 is fixed to the side of the side plate 301. A locking bolt 305 is threadedly connected to the side of the outer sleeve 304. In actual operation, by loosening and tightening the locking bolt 305, the sliding plate 303 can be moved and adjusted, thereby adjusting the position of the side plate 301, so that the first support plate 302 can limit the circuit boards 6 of different specifications and sizes.
[0043] This solution has the following working process: When installing the circuit board 6 inside the outer casing 5, the circuit board 6 is laid flat and placed on the top surface of the second support plate 8 of the bracket 7. The second support plates 8 on the two brackets 7 support both ends of the circuit board 6. By rotating the double-threaded rod 203, the two nut sleeves 202 are driven to move synchronously in opposite directions. The nut sleeves 202 drive the connecting rod 103 to move through the connecting rod 201. The connecting rod 103 drives the pressure block 101 to move and adjust, so that the pressure block 101 presses and limits the circuit board 6. With the support of the second support plate 8, the circuit board 6 is suspended inside the outer casing 5, thereby avoiding the side of the circuit board 6 from touching the inner wall of the outer casing 5, effectively increasing the gap between the circuit board 6 and the inner wall of the outer casing 5, so that the heat on the circuit board 6 can be dissipated more comprehensively.
[0044] Further as Figure 3 and Figure 10 As shown, it is worth noting that the heat dissipation component 4 includes a heat dissipation plate 401 disposed at the bottom of the circuit board 6. The heat dissipation plate 401 has an inner cavity 402 inside. The top surface of the heat dissipation plate 401 has air blowing holes 405 that communicate with the inner cavity 402. Multiple air blowing holes 405 are provided and are equidistantly distributed. An air inlet pipe 403 connected to the heat dissipation plate 401 and communicating with the inner cavity 402 is connected to it. Cold air is delivered to the inner cavity 402 through the air inlet pipe 403 and blown out evenly and finely to the bottom of the circuit board 6 through multiple grooves 406, which effectively improves the heat dissipation efficiency and uniformity of the circuit board 6. The bottom air blowing can directly act on the high-heat area on the back of the circuit board 6, accelerate heat convection and diffusion, and avoid the phenomenon of excessive temperature caused by heat accumulation in a local area.
[0045] Further as Figure 10 As shown, it is worth noting that a groove 406 is provided inside the heat sink 401, and a double-threaded rod 203 passes through the groove 406.
[0046] Further as Figure 6 As shown, it is worth noting that a screw head block 205 is fixed on one end of the double-threaded rod 203, and a rubber sleeve is fitted on the surface of the screw head block 205; in actual operation, the double-threaded rod 203 can be easily rotated and adjusted by the screw head block 205, which facilitates operation.
[0047] An installation method using a PCBA board internal structure includes the following steps:
[0048] S1. When installing the circuit board 6 inside the housing 5, the circuit board 6 is laid flat and placed on the top surface of the second support plate 8 of the bracket 7, and the two ends of the circuit board 6 are supported by the second support plates 8 on the two brackets 7.
[0049] S2. By rotating the double-threaded rod 203, the two nut sleeves 202 are driven to move synchronously in opposite directions. Thus, the nut sleeves 202 drive the connecting rod 103 to move through the connecting rod 201. The connecting rod 103 drives the pressure block 101 to move and adjust, so that the pressure block 101 presses and limits the circuit board 6.
[0050] S3. The spring 108 pushes the pressure column 106 to extend out of the slide groove 105, thereby pressing and locking the circuit board 6 through multiple pressure columns 106, effectively improving the installation stability of the circuit board 6. At the same time, the retractable pressure column 106 can be used to press and limit the circuit board 6 of different thicknesses.
[0051] S4. The circuit board 6 is fully supported by the second support plate 8, the first support plate 302 and the support block 306, so that the circuit board 6 is suspended inside the outer shell 5, which effectively increases the gap between the circuit board 6 and the inner wall of the outer shell 5, so that the heat on the circuit board 6 can be dissipated more comprehensively.
[0052] In summary: By using the adjusting component 2 to drive the two sets of limiting components 1 to symmetrically press and lock the two ends of the circuit board 6, the circuit board 6 is secured inside the housing 5. The limiting components 1 are applicable to circuit boards 6 of different thicknesses, effectively expanding the overall applicability. When the circuit board 6 needs to be removed, the adjusting component 2 releases the pressing and locking of the limiting components 1, allowing for easy removal. This significantly improves the efficiency of installation and removal, making the assembly and disassembly of the circuit board 6 inside the housing 5 more convenient, facilitating subsequent maintenance, improving maintenance efficiency, eliminating the need for repeated screw installation and removal, saving workload, and avoiding the stripping of screws caused by repeated screw installation and removal. The second support plate 8, the supporting component 3, and the two sets of limiting components 1 support the circuit board 6, allowing it to be suspended inside the housing 5. This prevents the sides of the circuit board 6 from contacting the inner wall of the housing 5, effectively increasing the gap between the circuit board 6 and the inner wall of the housing 5, allowing for more comprehensive heat dissipation.
Claims
1. A PCBA board internal structure, comprising a shell (5), characterized in that, The inside of the outer shell (5) is provided with a circuit board (6). Two symmetrically distributed brackets (7) are fixed on the inner side wall of the outer shell (5). A second support plate (8) is fixed on the side of the bracket (7). Each of the two brackets (7) is provided with a limiting component (1) for clamping the circuit board (6). The bottom of the bracket (7) is provided with a shifting component (2) for adjusting the position of the limiting component (1). A support component (3) is provided on one side of the bracket (7). A heat dissipation component (4) is provided on the bottom of the circuit board (6).
2. The PCBA board internal structure according to claim 1, characterized in that, The limiting component (1) includes a connecting rod (103) that slides through the side wall of the bracket (7), with a pressure block (101) fixed at the end of the connecting rod (103) and an end plate (104) fixed at the end of the connecting rod (103) away from the pressure block (101).
3. The PCBA board internal structure according to claim 2, characterized in that, The pressure block (101) has an inclined surface (102) at one end near the center of the outer shell (5). The pressure block (101) has multiple sliding grooves (105) inside. A pressure column (106) is slidably connected in the sliding groove (105). The bottom end of the pressure column (106) has an arc end (107).
4. The PCBA board internal structure according to claim 3, characterized in that, A spring (108) is provided inside the slide groove (105), and the two ends of the spring (108) are fixed to the side of the slide groove (105) and the pressure column (106) respectively.
5. The PCBA board internal structure according to claim 3, characterized in that, The adjustment assembly (2) includes a rotating seat (204) fixed on the inner wall of the outer shell (5). There are two rotating seats (204) and the two rotating seats (204) are symmetrically distributed. A double-threaded rod (203) is rotatably connected to both rotating seats (204). Two connecting rods (201) are threadedly connected to the double-threaded rod (203). The end of the connecting rod (201) away from the nut sleeve (202) is fixed to the end plate (104).
6. The PCBA board internal structure according to claim 5, characterized in that, A screw head block (205) is fixed to one end of the double-helix threaded rod (203), and a rubber sleeve is fitted onto the surface of the screw head block (205).
7. The PCBA board internal structure according to claim 6, characterized in that, The support assembly (3) includes an outer sleeve (304) and a support block (306) fixed to the inner wall of the outer shell (5). A sliding plate (303) is slidably connected inside the outer sleeve (304). A side plate (301) is fixed to one end of the sliding plate (303). A first support plate (302) is fixed to the side of the side plate (301). A locking bolt (305) is threadedly connected to the side of the outer sleeve (304).
8. The PCBA board internal structure according to claim 7, characterized in that, The heat dissipation assembly (4) includes a heat dissipation plate (401) disposed at the bottom of the circuit board (6). The heat dissipation plate (401) has an inner cavity (402) inside. The top surface of the heat dissipation plate (401) has a blow hole (405) communicating with the inner cavity (402). There are multiple blow holes (405) and the multiple blow holes (405) are equidistantly distributed. An air inlet pipe (403) communicating with the inner cavity (402) is connected to the heat dissipation plate (401).
9. The PCBA board internal structure according to claim 5, characterized in that, The heat sink (401) has a groove (406) inside, and the double-threaded rod (203) passes through the groove (406).
10. An installation method using the PCBA board internal structure of claim 8, characterized in that, Includes the following steps: S1. When installing the circuit board (6) inside the outer casing (5), the circuit board (6) is laid flat and placed on the top surface of the second support plate (8) of the bracket (7). The two ends of the circuit board (6) are supported by the second support plate (8) on the two brackets (7). S2. By rotating the double-threaded rod (203), the two nut sleeves (202) are driven to move synchronously in opposite directions. Thus, the nut sleeves (202) drive the connecting rod (103) to move through the connecting rod (201). The connecting rod (103) drives the pressure block (101) to move and adjust, so that the pressure block (101) presses and limits the circuit board (6). S3. The spring (108) pushes the pressure column (106) to extend out of the slide groove (105), thereby pressing and locking the circuit board (6) through multiple pressure columns (106), effectively improving the installation stability of the circuit board (6). At the same time, the retractable pressure column (106) can be used to press and limit the circuit board (6) of different thicknesses. S4. The circuit board (6) is fully supported by the second support plate (8), the first support plate (302) and the support block (306), so that the circuit board (6) is suspended inside the shell (5), effectively increasing the gap between the circuit board (6) and the inner wall of the shell (5), so that the heat on the circuit board (6) can be dissipated more comprehensively.