Bonding device information configuration method and device and bonding device

Abstract

The invention discloses a bonding device information configuration method and device and a bonding device, and relates to the technical field of semiconductor preparation. The bonding device information configuration method comprises the following steps: acquiring a first chip distribution diagram of a top wafer and a second chip distribution diagram of a bottom wafer; the bonding device works, the core particles in the top wafer are taken out and bonded to the corresponding positions in the bottom wafer, and according to the working state of the bonding device, the first chip distribution diagram is updated to serve as a real-time distribution diagram, and the second chip distribution diagram is updated to serve as an updated distribution diagram; when the bonding device is abnormal, acquiring a second physical graph of the bottom wafer; according to the second physical diagram, the real-time distribution diagram when the bonding device is abnormal and the updated distribution diagram, determining the state of the current core particle when the bonding device is abnormal; and updating the real-time distribution diagram of the top wafer according to the state of the current core particle during abnormality. According to the information configuration method of the bonding device, the chip distribution diagram of the wafer can be automatically repaired, so that the materials are consistent, and the bonding device continues to work.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, and more specifically, to a method and apparatus for configuring bonding device information, and a bonding device. Background Technology

[0002] With the continuous evolution of integrated circuit manufacturing technology, the traditional planar transistor miniaturization path has approached its physical limits. To overcome the bottleneck of two-dimensional planar integration, three-dimensional integrated circuit technology has emerged. Its core idea is to achieve high-density, low-latency, and low-power system-level integration by stacking multiple chips or wafers vertically and utilizing interconnection methods such as through-silicon vias (TSVs) and hybrid bonding. Currently, the mainstream three-dimensional integration architecture mainly includes wafers... Wafer-to-Wafer (W2W), Chip Chip-to-Wafer (C2W) and chip There are three forms of chip-to-chip (C2C) integration. Among them, C2W technology has become the mainstream solution in the current advanced packaging field due to its advantages of high flexibility and high yield. This technology allows known good chips (top dies) that have been electrically tested and confirmed to be fully functional to be precisely bonded to designated locations on the target wafer (bottom wafer), thereby building a high-performance chip system, significantly improving overall yield and reducing manufacturing costs.

[0003] In the C2W process, chip bonding machines may stop due to mechanical failures, software anomalies, or process parameter drift. Before restarting, the chip status must be confirmed. Currently, this confirmation mainly relies on manual intervention. Operators must verify the current chip-wafer bonding status through visual inspection, manual recording, or low-precision image comparison to ensure that subsequent bonding operations can continue from the point of interruption. Since a single wafer in modern C2W processes typically contains thousands or even tens of thousands of tiny chips, manual verification is not only time-consuming and inefficient, but also prone to errors due to visual fatigue or oversights in recording, which can lead to the scrapping of the entire wafer or product reliability risks. Summary of the Invention

[0004] The purpose of this application is to provide a method and apparatus for configuring bonding device information, and a bonding device that can automatically repair the chip distribution pattern of a wafer, ensuring consistency between the data and the equipment, allowing the bonding device to continue operating, and improving the automation rate of the production line.

[0005] The embodiments of this application are implemented as follows: A first aspect of this application provides a method for configuring bonding device information, comprising: acquiring a first chip distribution map of a top wafer and a second chip distribution map of a bottom wafer; the bonding device operating to extract chips from the top wafer and bond them to corresponding positions on the bottom wafer; updating the first chip distribution map of the top wafer as a real-time distribution map based on the operating state of the bonding device; updating the second chip distribution map of the bottom wafer as an updated distribution map; when the bonding device malfunctions, acquiring a second physical image of the bottom wafer; determining the current state of the chip at the time of the malfunction based on the second physical image, the real-time distribution map when the bonding device malfunctions, and the updated distribution map, as a first state; and updating the real-time distribution map of the top wafer based on the current state of the chip at the time of the malfunction.

[0006] As one possible implementation, the determination of the current chip state at the time of the malfunction based on the second physical image, the real-time distribution map when the bonding device malfunctions, and the updated distribution map further includes: when the bonding device malfunctions, acquiring a first physical image of the top wafer; determining the current chip state at the time of the malfunction based on the first physical image and the real-time distribution map when the bonding device malfunctions, as the second state; determining whether the first state and the second state are the same, and if they are the same, determining it as the current chip state.

[0007] As one possible implementation, determining the current state of the chip during an anomaly based on the second physical image, the real-time distribution map when the bonding device malfunctions, and the updated distribution map includes: comparing the second physical image, the updated distribution map when the bonding device malfunctions, and the real-time distribution map; if the positions of the bonded chips in the second physical image and the updated distribution map are the same, and also the positions of the missing chips in the real-time distribution map, then the current chip has been bonded; if the positions of the bonded chips in the second physical image and the updated distribution map are the same, but different from the positions of the missing chips in the real-time distribution map; or if the positions of the bonded chips in the second physical image and the updated distribution map are different, then the current chip has not been bonded.

[0008] As one possible implementation, before updating the real-time distribution map of the top wafer based on the current chip state during an anomaly, the method for configuring bonding device information further includes: converting the second physical image into a second pixel image, where each pixel in the second pixel image corresponds to a chip position in the physical image.

[0009] As one possible implementation, updating the real-time distribution map of the top wafer based on the current state of the chip during an anomaly includes: when the chip has completed bonding, the real-time distribution map during the bonding device anomaly is the updated real-time distribution map; when the chip has not completed bonding, the distribution map corresponding to the chip that has not completed bonding is removed from the updated distribution map as the updated real-time distribution map.

[0010] As one possible implementation, when the chip is not fully bonded, the updated real-time distribution map, which is obtained by removing the distribution map corresponding to the chip that is not fully bonded, also includes: placing the chip that is not fully bonded back into the corresponding position on the top wafer and updating the real-time distribution map.

[0011] As one possible implementation, the first chip distribution pattern of the top wafer includes good grades and bad grades, and the bonding device automatically skips the bad grades when it is working.

[0012] A second aspect of this application provides a configuration apparatus for bonding device information, including a distribution map acquisition module, a physical image acquisition module, a comparison module, and an update module. The distribution map acquisition module is used to update a first chip distribution map of the top wafer and a second chip distribution map of the bottom wafer according to the working state of the bonding device when the bonding device is working, serving as a real-time distribution map and an updated distribution map, respectively. The physical image acquisition module is used to acquire a first physical image of the top wafer and a second physical image of the bottom wafer when the bonding device malfunctions. The comparison module is used to determine the current chip state at the time of the malfunction based on the second physical image, the real-time distribution map at the time of the malfunction, and the updated distribution map. The update module is used to update the real-time distribution map of the top wafer according to the current chip state at the time of the malfunction.

[0013] A third aspect of this application provides a bonding apparatus, including a machine base and a first loading position and a second loading position disposed on the machine base. The first loading position and the second loading position are used to place a top wafer and a bottom wafer, respectively. The machine base is also provided with a transfer component and a configuration device for the above-mentioned bonding apparatus information. The transfer component is used to pick up the die on the top wafer and place it on the bottom wafer. The configuration device for the bonding apparatus information is used to update the real-time distribution map of the top wafer when the bonding apparatus malfunctions.

[0014] As one possible implementation, the bonding apparatus further includes a first camera and a second camera. The first camera is connected to the physical image acquisition module of the bonding apparatus information configuration device. The first camera is disposed on the transfer assembly or the first loading position to acquire a physical image of the top wafer. The second camera is disposed on the transfer assembly to acquire a physical image of the bottom wafer after bonding is completed.

[0015] As one possible implementation, the transfer assembly includes a pick-up head for picking up wafers; or, a chuck is provided at the first loading position for fixing the top wafer, and a camera is mounted on the chuck at a preset distance from it.

[0016] The beneficial effects of the embodiments of this application include: The method for configuring bonding device information provided in this application includes: acquiring a first chip distribution map of the top wafer and a second chip distribution map of the bottom wafer; the bonding device operates, removing chips from the top wafer and bonding them to corresponding positions on the bottom wafer; updating the first chip distribution map of the top wafer as a real-time distribution map based on the operating status of the bonding device, and updating the second chip distribution map of the bottom wafer as an updated distribution map; when the bonding device malfunctions, acquiring a second physical image of the bottom wafer; determining the current state of the chip at the time of the malfunction based on the second physical image, the real-time distribution map when the bonding device malfunctions, and the updated distribution map, as a first state; and updating the real-time distribution map of the top wafer based on the current state of the chip at the time of the malfunction. This method for configuring bonding device information automatically acquires physical images and corrects the real-time distribution map based on the physical images, allowing production to resume without manual intervention and significantly improving the automation rate of the production line. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A flowchart illustrating a method for configuring bonding device information provided in an embodiment of this application; Figure 2 A first chip distribution diagram of a top wafer provided in an embodiment of this application; Figure 3 A real-time distribution diagram of the top wafer provided in an embodiment of this application; Figure 4 A second chip distribution diagram of a bottom wafer is provided for an embodiment of this application; Figure 5 A real-time distribution diagram of the bottom wafer provided in an embodiment of this application; Figure 6 A second pixel image of a top wafer is provided for an embodiment of this application.

[0019] Icons: 110 - Top wafer; 111 - Chip; 120 - Bottom wafer. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.

[0021] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] In the C2W process, the chip bonding machine is responsible for picking up the Top Die from the feed carrier and precisely aligning and bonding it to a preset position on the Bottom Wafer. However, in actual production, the equipment may stop due to mechanical failures, software malfunctions, or process parameter drift. When the equipment is repaired and ready to be restarted, two key pieces of information must be accurately obtained: first, the number and specific positions of the remaining available Top Dies at the feed end; and second, the number of dies already bonded on the Bottom Wafer, their coordinate distribution, and any unbonded areas. Only with this information can subsequent bonding operations continue from the correct breakpoint, avoiding serious defects such as duplicate bonding, missed bonding, or misaligned bonding.

[0024] This application provides a method for configuring bonding device information, used to automatically update the real-time distribution map when the bonding device malfunctions, in order to solve the problem of inconsistency between the real-time distribution map of the wafer and the actual physical state caused by equipment malfunction during the bonding process. Figure 1 As shown, it includes: S100: As Figure 2 and Figure 4 As shown, a first chip distribution pattern of the top wafer 110 and a second chip distribution pattern of the bottom wafer 120 are obtained; Before bonding begins, an offline program is used to obtain the initial position layout of all dies 111 to be bonded on the top wafer 110 as the first chip distribution map. An offline program is then used to obtain the initial position layout of all dies to be bonded on the bottom wafer 120 as the second chip distribution map. This serves as the baseline data for subsequent bonding operations and state comparison.

[0025] Specifically, multiple chips are distributed on the top wafer 110, and the first chip distribution map includes the pixel positions corresponding to each chip. The bottom wafer 120 is the same.

[0026] When the bonding device is used for C2W bonding, the parameter information of the core 111 in the top wafer 110 is also acquired. Specifically, the parameter information of the core 111 includes position information and quality information, such as... Figure 2 As shown, different colors are used to distinguish the quality information of core 111. More specifically, the quality information includes good products and defective products. Figure 2 Medium blue and yellow indicate that the core at this position is a good product of two different grades, while red indicates that core 111 at this position is a defective product.

[0027] S200: such as Figure 3 and Figure 5 As shown, the bonding device operates, taking out the chip 111 in the top wafer 110 and bonding it to the corresponding position in the bottom wafer 120. The first chip distribution map of the top wafer 110 is updated according to the working status of the bonding device as a real-time distribution map, and the second chip distribution map of the bottom wafer 120 is updated as an updated distribution map. The bonding device performs the chip picking and bonding operations according to a preset program, and dynamically updates the chip distribution map of the top wafer 110 after each successful bonding as a real-time distribution map. The real-time distribution map reflects the theoretically remaining chip positions on the top wafer 110.

[0028] During the bonding process, the bonding device not only tracks which dies 111 on the top wafer 110 have been removed, but also simultaneously maintains which positions on the bottom wafer 120 have been successfully bonded. After each bonding operation is completed, if the control system of the bonding device confirms that the bonding is complete, it marks the corresponding position as bonded in the second chip distribution map. This map is called the updated distribution map, which reflects the system's theoretical understanding of the current bonding state of the bottom wafer 120.

[0029] S300: When the bonding device malfunctions, obtain a second physical image of the bottom wafer 120; When the bonding device malfunctions, the second camera is immediately triggered to take a picture of the bottom wafer 120 to obtain a second physical image. The second physical image is an image of the actual state of the bottom wafer 120, which is used to truly reflect the actual existence of the bonding chips on the bottom wafer 120.

[0030] Specifically, bonding device malfunctions can include nozzle blockage, pick-up failure, chip drop, etc.

[0031] S400: Determine the current state of core 111 during the abnormality based on the second physical diagram, the real-time distribution diagram when the bonding device is abnormal, and the updated distribution diagram, and use it as the first state; The second physical image of the bottom wafer, the real-time distribution map of the top wafer at the time of the anomaly, and the updated distribution map of the bottom wafer are subjected to image recognition and logical comparison. The second physical image reflects the actual state of the bottom wafer 120, the real-time distribution map reflects the theoretical state of the top wafer 110, and the updated distribution map reflects the theoretical state of the bottom wafer 120. By comparing the actual state with the theoretical state, the current state of the chip 111 at the time of the anomaly is determined: whether it has been removed but failed to bond, has been removed and successfully bonded, or has not been removed.

[0032] S500: Update the real-time distribution map of the top wafer 110 based on the current state of the core 111 in the event of an anomaly.

[0033] The real-time chip distribution map of the top wafer 110 is corrected to correspond with the second physical map, i.e., to be consistent with physical reality. The corrected real-time distribution map can serve as a reliable basis for subsequent bonding tasks, allowing the bonding device to continue operating automatically without manual intervention.

[0034] The bonding device information configuration method of this application embodiment automatically acquires the physical image of the bottom wafer in an abnormal state and corrects the real-time distribution image of the top wafer, enabling production to resume without manual intervention and significantly improving the automation rate of the production line. Furthermore, the bonding device information configuration method of this application embodiment ensures that the real-time distribution image is always consistent with the physical state, effectively avoiding process defects such as mis-bonding, missed bonding, and over-bonding, thereby improving bonding yield.

[0035] In summary, the embodiments of this application, by introducing a physical image comparison mechanism triggered in case of anomalies, realize dynamic self-correction of wafer chip distribution information during the bonding process, and solve the problem of downtime or bonding errors caused by information distortion in traditional bonding systems under abnormal conditions.

[0036] As one feasible approach, determining the current state of core 111 at the time of the malfunction based on the second physical diagram, the real-time distribution diagram of the bonding device during the malfunction, and the updated distribution diagram further includes: S430: When the bonding device malfunctions, obtain the first physical image of the top wafer 110; After the anomaly occurred, in addition to imaging the bottom wafer 120, the top wafer 110 was simultaneously imaged to obtain an image of its actual physical state, i.e., the first physical image. The first physical image is used to verify whether there is indeed a chip 111 at the target location.

[0037] S440: Determine the current state of core 111 during the abnormality based on the first physical diagram and the real-time distribution diagram when the bonding device is abnormal, and use it as the second state; The same process as for the bottom wafer 120 is applied. The first physical image is compared with the real-time distribution image of the top wafer 110. If they match, it is determined that the current chip 111 has been removed. If they do not match, it is considered that the real-time distribution image has been removed but the physical object still exists. It is determined that the chip has not been removed and the state of the chip 111 at this time is defined as the second state.

[0038] S450: Determine whether the first state and the second state are the same. If they are the same, then determine it as the current state of core 111. The first state is derived by comparing the physical image and updated distribution map of the bottom wafer 120 with the real-time distribution map of the top wafer 110, and is used to reflect whether the current chip 111 has been removed for bonding; the second state is derived by comparing the physical image and its real-time distribution map of the top wafer 110, and is used to reflect whether the current chip 111 has been successfully removed; only when the first state and the second state are consistent, i.e. both are completed, or both are not completed, will the common conclusion be adopted as the final state of the current chip 111.

[0039] This application embodiment introduces a dual verification mechanism for the top wafer 110, using bidirectional consistency verification to more reliably determine the true state of the current chip 111 when an anomaly occurs, thereby improving the accuracy of the chip 111 state.

[0040] Understandably, when the first state and the second state are different, other matters should be handled accordingly. Specifically, if the second state is "taken away" and the first state is "not attached", it can be determined that the piece has fallen off or been lost during transportation; if the second state is "not taken away" and the first state is "attached", it may be due to coordinate disorder.

[0041] Optionally, the state of the current core 111 at the time of the malfunction is determined based on the second physical image, the real-time distribution map when the bonding device malfunctions, and the updated distribution map, including: S410: Compare the second physical image, the updated distribution map when the bonding device malfunctions, and the real-time distribution map; The second physical image is a real physical image obtained by taking a picture of the bottom wafer 120 after the bonding device malfunctions, reflecting the actual location of the bonding chips on the bottom wafer 120. The updated distribution map is a theoretical chip distribution map of the bottom wafer 120 that is dynamically updated by the bonding device based on the bonding actions that have been performed, representing the location information of the bonding chip positions that the bonding device believes exist on the bottom wafer 120. The real-time distribution map is a theoretical chip distribution map of the top wafer 110 that is dynamically updated by the bonding device based on the bonding actions that have been performed, comparing the physical reality with the bonding device's perception to provide a basis for state determination.

[0042] S421: If the positions of the bonded core particles in the second physical map and the updated distribution map are the same, and the positions of the missing core particles in the real-time distribution map are the same, then the current core particle 111 has been bonded. The second physical image matches the bonded positions in the updated distribution image, indicating that the bottom state record is accurate. Simultaneously, these positions correspond precisely to the missing core positions in the real-time distribution image, indicating that the top record is also accurate. Since the logical loop of these three is consistent, it is determined that the current core 111 has completed bonding.

[0043] S422: If the positions of the bonded core particles in the second physical map and the updated distribution map are the same, but different from the positions of the missing core particles in the real-time distribution map; or if the positions of the bonded core particles in the second physical map and the updated distribution map are different, then the current core particle 111 has not been bonded.

[0044] In the first scenario, the bottom wafer 120 physical object, i.e., the second physical object image and the updated distribution. Figure 1 If the bonding record is correct but does not match the missing position of the top wafer, it indicates that the top record is incorrect, such as being mistakenly marked as already taken. In the second case, the bottom wafer 120 physical object, i.e., the second physical object image, is inconsistent with the updated distribution map. For example, if the updated distribution map is marked but the physical object does not have core 111, it indicates that the bonding was unsuccessful or the record was incorrect. In both cases, it is determined that the current core 111 has not been bonded.

[0045] This solution completely eliminates ambiguity in judgments through three-way position alignment verification, ensuring a unique and reliable conclusion. It achieves high-precision, unambiguous determination of the 111 core state.

[0046] As an implementable approach, the method for configuring bonding device information before updating the real-time distribution map of the top wafer 110 based on the current state of the die 111 in the event of an anomaly also includes: S401: As Figure 6 As shown, the second physical image is converted into a second pixel image, where each pixel in the second pixel image corresponds to a core particle position in the physical image.

[0047] After the bonding device malfunctions, the system acquires a second physical image of the bottom wafer 120. This second physical image is a high-resolution optical image containing the actual physical layout of all chips 111 on the bottom wafer 120. The updated distribution map and the real-time distribution map typically record position information in the form of structured data or logical coordinates. To facilitate efficient and accurate comparison between the second physical image and the real-time and updated distribution maps, the physical image needs to undergo structured preprocessing to form a second pixel image. Specifically, the second pixel image is a binary or labeled image. Each pixel corresponds to a chip position on the wafer, and the pixel value encodes the state of that position. For example, 1 can represent the presence of chip 111 at that chip position, and 0 can represent that the chip position is empty, indicating that chip 111 has been successfully removed.

[0048] Specifically, the conversion process may include: 1) image denoising and enhancement; 2) grid alignment and coordinate mapping based on a preset wafer layout template; 3) determining whether each chip position has a complete chip 111 through image segmentation or classification models; 4) outputting a first pixel image that corresponds one-to-one with the arrangement of wafer chip 111.

[0049] It is understood that the above representation and conversion process of the second pixel image is only one embodiment. Those skilled in the art can choose different representation methods and conversion methods according to the actual situation, as long as the core position can be identified.

[0050] By converting the second physical image into a second pixel image with the same dimension and coordinates, the second pixel image can directly perform pixel-by-pixel logical operations with the real-time distribution map and the updated distribution map, which greatly improves the comparison speed and accuracy.

[0051] In addition, before determining the current state of the core 111 during the abnormality based on the first physical image and the real-time distribution map of the bonding device, it is also necessary to convert the first physical image into the first pixel image, which will not be elaborated here.

[0052] Optionally, updating the real-time distribution map of the top wafer 110 based on the current state of the die 111 during an anomaly includes: S510: When core 111 completes bonding, the real-time distribution map when the bonding device malfunctions is the updated real-time distribution map. When the comparison determines that the current core 111 has successfully completed bonding, i.e., the second physical image and the real-time distribution Figure 1 If the chip bit is empty, it means that the bonding device record is accurate and the abnormality occurred after bonding. In this case, the real-time distribution map at the moment of the abnormality of the bonding device is correct and can be directly used as the updated distribution map.

[0053] S520: When core 111 is not fully bonded, the updated real-time distribution map is the distribution map corresponding to the unbonded core 111 removed from the updated distribution map.

[0054] If it is determined that the core 111 has not been effectively bonded, such as falling after being picked up, not being released, or being picked up without being released, it indicates that the state recorded by the bonding device is inconsistent with the physical reality. At this time, the original real-time distribution map cannot be trusted, and the actual state of the core 111 reflected in the second physical map should be the sole basis. In this case, chip positions marked as bonded in the updated distribution map but not bonded in the second physical map are misidentified. The "attached" marks of those misidentified bonded cores 111 in the real-time distribution map are removed, and a new real-time distribution map that is completely synchronized with the physical structure is generated. The updated real-time distribution map will guide the bonding device to retry picking up the missed cores 111 after recovery, ensuring that no cores are missed or incorrectly attached.

[0055] It is understood that, in the embodiments of this application, while updating the real-time distribution map, the distribution map is also updated synchronously according to the state of the core particles.

[0056] Optionally, when the core 111 is not fully bonded, the updated real-time distribution map is further updated by removing the distribution map corresponding to the unbonded core 111 from the updated distribution map; The unbonded core 111 is placed back into its corresponding position on the top wafer 110, and the real-time distribution map is updated.

[0057] When it is determined that chip 111 has not been successfully bonded, the system generates a new real-time distribution map based on the second physical image of the bottom wafer 120, which reflects the actual state of chip 111. This map retains all actual chip positions to ensure that subsequent bonding tasks are not missed. If an anomaly occurs and chip 111 has been picked up by the nozzle but has not yet been successfully bonded to the target position (e.g., the equipment alarms and stops during transport), then chip 111 still physically exists on the nozzle or in the temporary storage area. The system controls the bonding device to perform a reverse operation, precisely placing chip 111 back to its original position, i.e., the corresponding chip position on the top wafer 110. The placement operation relies on high-precision visual alignment and motion control to ensure that the orientation and position of chip 111 after placement meet the original arrangement requirements. After chip 111 is successfully placed back, the physical state of the top wafer 110 is restored to the initial state before chip 111 was removed. Therefore, the real-time distribution map should re-mark this position as unbonded / available so that it can be called back in subsequent bonding processes. This update ensures that the data state is fully synchronized with physical reality.

[0058] Active return to its original position protects the integrity of core pellet 111, significantly reduces material loss, maximizes core pellet 111 utilization, and prevents the loss or scrapping of high-value core pellets 111. The entire process from pickup to final reset is fully automated, requiring no manual intervention and minimizing downtime.

[0059] As one feasible approach, the first chip layout of the top wafer 110 includes good and bad grades, and the bad grades are automatically skipped when the bonding device is in operation.

[0060] After die cutting is completed, the surface contamination of the wafer is usually checked, and a wafer grading map is generated. The "Good Die" grade indicates a clean surface with defects within a certain range, and the die is usable. The "Defective Die" grade indicates surface contamination, cracks, or other defects, and is unusable. This grading information is integrated into the first chip distribution map as a quality status label for each die.

[0061] Before or during the bonding task, the bonding device control system reads the quality label in the first chip distribution diagram. When the path planning or pick instruction points to a certain chip position, if the position is marked as defective, the pick action is not performed, and the position is automatically skipped to continue processing the next good position. At the same time, the internal status is updated to ensure the continuity of the process.

[0062] In practical applications, different application environments have different quality requirements for core 111, and core 111 also has different quality levels. To match the quality of core 111 with the application environment, the yield grade can be divided into multiple levels, such as... Figure 2 As shown, both blue and yellow are good grades, and the quality of the blue core 111 is higher than that of the yellow core 111. When the bonding device is used for bonding high-quality core 111, it automatically skips the yellow position. Figure 3 As shown.

[0063] A second aspect of this application provides a configuration device for bonding device information, including a distribution map acquisition module, a physical image acquisition module, a comparison module, and an update module. The distribution map acquisition module is used to update a first chip distribution map of the top wafer 110 and a second chip distribution map of the bottom wafer 120 according to the working state of the bonding device when the bonding device is working, serving as a real-time distribution map and an updated distribution map, respectively. The physical image acquisition module is used to acquire a first physical image of the top wafer 110 and a second physical image of the bottom wafer 120 when the bonding device malfunctions. The comparison module is used to determine the current state of the chip 111 when the malfunction occurs based on the second physical image, the real-time distribution map when the bonding device malfunctions, and the updated distribution map. The update module is used to update the real-time distribution map of the top wafer 110 according to the current state of the chip 111 when the malfunction occurs.

[0064] The distribution map acquisition module dynamically updates the chip distribution maps of the top wafer 110 and the bottom wafer 120 when the bonding device is working normally, forming a real-time distribution map and an updated distribution map that reflect the system's understanding. When the equipment malfunctions, the physical image acquisition module triggers the vision system to acquire the actual image of the bottom wafer 120, i.e., the second physical image. The comparison module accurately determines whether the current chip 111 has been bonded by comparing the second physical image, the real-time distribution map, and the updated distribution map. The update module then corrects the real-time distribution map based on the judgment result to ensure that the data is consistent with the physical state, thereby realizing automatic repair in abnormal states.

[0065] The configuration device for bonding device information constructs a closed-loop control logic of perception, analysis, decision-making, and correction, enabling the bonding device to have self-diagnosis and self-healing capabilities. Compared with the traditional method that relies on manual intervention, this solution significantly improves the system's robustness and automation level, effectively avoiding missed bonding, re-bonding, or waste of core 111 due to information distortion.

[0066] A third aspect of this application provides a bonding apparatus, including a machine base and a first loading position and a second loading position disposed on the machine base. The first loading position and the second loading position are used to place a top wafer 110 and a bottom wafer 120, respectively. The machine base is also provided with a transfer component and a configuration device for the above-mentioned bonding apparatus information. The transfer component is used to pick up the core 111 on the top wafer 110 and place it on the bottom wafer 120. The configuration device for the bonding apparatus information is used to update the real-time distribution map of the top wafer 110 when the bonding apparatus malfunctions.

[0067] Specifically, the bonding apparatus includes a machine base and a first loading station and a second loading station on the machine base, used for placing the top wafer 110 and the bottom wafer 120, respectively. The machine base also includes a transfer assembly for picking up the die 111 from the top wafer 110 and precisely bonding it to a designated position on the bottom wafer 120, achieving high-precision assembly at the die 111 level. This bonding apparatus further integrates a configuration device for the aforementioned bonding apparatus information. This device includes a distribution map acquisition module, a physical image acquisition module, a comparison module, and an update module. When an anomaly occurs in the bonding apparatus, the configuration device for the bonding apparatus information can automatically acquire a physical image of the top wafer 110, compare it with the real-time distribution map recorded by the system, determine the current actual state of the die 111, and dynamically correct the distribution map of the top wafer 110 accordingly, ensuring that subsequent bonding tasks continue to be executed based on accurate material information.

[0068] By integrating the hardware structure with the intelligent information configuration device, this bonding device not only has bonding capabilities, but also realizes data self-correction and process self-recovery functions under abnormal conditions, improving the reliability, automation level and yield assurance capabilities of the equipment in advanced packaging scenarios.

[0069] Optionally, the bonding apparatus further includes a first camera and a second camera. The first camera is connected to the physical image acquisition module of the bonding apparatus information configuration device. The first camera is set on the transfer assembly or the first loading position to acquire a physical image of the top wafer 110. The second camera is set on the transfer assembly to acquire a physical image of the bottom wafer 120 after bonding is completed.

[0070] The first camera is electrically connected to the physical image acquisition module in the configuration device and is installed on the transfer assembly or near the first loading position to ensure clear imaging of the top wafer 110. This camera is used to acquire a first physical image of the top wafer 110 in case of a bonding device malfunction, to determine whether the chip 111 still exists in its original position. The second camera is set on the transfer assembly and, after the chip 111 is bonded, images the bottom wafer 120 to acquire its second physical image. This image is used to verify whether the chip 111 has been successfully and accurately bonded to the target position, supporting subsequent state comparison and closed-loop verification.

[0071] The first camera ensures that the status of the feeding end is perceptible, and the second camera ensures that the result of the receiving end is verifiable. The two cameras work together, enabling the system to not only determine whether the core particle 111 has been taken away, but also to confirm whether the core particle 111 has been correctly bonded, greatly reducing the risk of single-point visual misjudgment.

[0072] As one possible implementation, the transfer assembly includes a pick-up head for picking up the die 111; or, a chuck is provided at the first loading position for fixing the top wafer 110, and a camera is mounted on the chuck at a preset distance from the chuck.

[0073] The pick-up head is the core component of the bonding device for handling the core 111. It typically employs a vacuum nozzle structure, using negative pressure adsorption to achieve non-contact picking and placement of the tiny core 111. The chuck is used to stably hold the top wafer 110 during the bonding process, preventing positioning deviations caused by vibration or movement. Common methods include vacuum adsorption or electrostatic adsorption. The camera is directly integrated into the chuck and maintains a fixed optical distance from the wafer surface, i.e., a preset distance. This design ensures a constant object distance for each image capture, eliminating the need for dynamic focusing and improving image clarity and recognition stability.

[0074] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0075] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A method for configuring bonding device information, characterized in that, include: Obtain the first chip distribution map of the top wafer and the second chip distribution map of the bottom wafer; The bonding device operates, removing the chips from the top wafer and bonding them to the corresponding positions on the bottom wafer. The first chip distribution map of the top wafer is updated according to the operating status of the bonding device as a real-time distribution map, and the second chip distribution map of the bottom wafer is updated as an updated distribution map. When the bonding device malfunctions, obtain a second physical image of the bottom wafer; The state of the current core particle when the malfunction occurs is determined based on the second physical diagram, the real-time distribution diagram of the bonding device when the malfunction occurs, and the updated distribution diagram, and is taken as the first state. The real-time distribution map of the top wafer is updated based on the current state of the chip during an anomaly.

2. The method for configuring bonding device information according to claim 1, characterized in that, Determining the current state of the core chip during an anomaly based on the second physical diagram, the real-time distribution diagram of the bonding device during an anomaly, and the updated distribution diagram further includes: When the bonding device malfunctions, obtain the first physical image of the top wafer; The state of the current core particle during the abnormality is determined based on the first physical image and the real-time distribution diagram of the bonding device during the abnormality, and is taken as the second state; Determine whether the first state and the second state are the same. If they are the same, then determine it as the current state of the core.

3. The method for configuring bonding device information according to claim 1, characterized in that, The step of determining the current state of the core particle during an anomaly based on the second physical image, the real-time distribution map of the bonding device during an anomaly, and the updated distribution map includes: Compare the second physical image, the updated distribution map when the bonding device malfunctions, and the real-time distribution map; If the positions of the bonded core particles in the second physical image and the updated distribution image are the same, and the positions of the missing core particles in the real-time distribution image are also the same, then the current core particle has been bonded. If the positions of the bonded core particles in the second physical image and the updated distribution image are the same, but the positions of the missing core particles in the real-time distribution image are different; or if the positions of the bonded core particles in the second physical image and the updated distribution image are different, then the current core particle has not been bonded.

4. The method for configuring bonding device information according to claim 3, characterized in that, Before updating the real-time distribution map of the top wafer based on the current state of the die in the event of an anomaly, the method further includes: The second physical image is converted into a second pixel image, where each pixel in the second pixel image corresponds to a core particle position in the physical image.

5. The method for configuring bonding device information according to claim 3, characterized in that, The step of updating the real-time distribution map of the top wafer based on the current state of the die during an anomaly includes: When the core is bonded, the real-time distribution map is the updated real-time distribution map when the bonding device malfunctions. When the core particles are not fully bonded, the updated real-time distribution map is taken from the distribution map corresponding to the core particles that are not fully bonded.

6. The method for configuring bonding device information according to claim 5, characterized in that, When the core particles are not fully bonded, the updated real-time distribution map is obtained by removing the distribution map corresponding to the unbonded core particles from the updated distribution map; The unbonded dies are placed back into their corresponding positions on the top wafer, and the real-time distribution map is updated.

7. The method for configuring bonding device information according to claim 1, characterized in that, The first chip distribution diagram of the top wafer includes good grades and bad grades. When the bonding device is working, it automatically skips the bad grades.

8. A device for configuring bonding device information, characterized in that, The system includes a distribution map acquisition module, a physical image acquisition module, a comparison module, and an update module. The distribution map acquisition module updates the first chip distribution map of the top wafer and the second chip distribution map of the bottom wafer according to the working status of the bonding device when the bonding device is working, serving as the real-time distribution map and the updated distribution map, respectively. The physical image acquisition module acquires the first physical image of the top wafer and the second physical image of the bottom wafer when the bonding device malfunctions. The comparison module determines the current chip state at the time of the malfunction based on the second physical image, the real-time distribution map when the bonding device malfunctions, and the updated distribution map. The update module updates the real-time distribution map of the top wafer according to the current chip state at the time of the malfunction.

9. A bonding device, characterized in that, The device includes a machine and a first loading station and a second loading station disposed on the machine. The first loading station and the second loading station are used to place a top wafer and a bottom wafer, respectively. The machine is also provided with a transfer assembly and a bonding device information configuration device as described in claim 8. The transfer assembly is used to pick up the die on the top wafer and place it on the bottom wafer. The bonding device information configuration device is used to update the real-time distribution map of the top wafer when the bonding device malfunctions.

10. The bonding apparatus according to claim 9, characterized in that, It also includes a first camera and a second camera. The first camera is connected to the physical image acquisition module of the bonding device information configuration device. The first camera is set on the transfer component or the first loading position to acquire a physical image of the top wafer. The second camera is set on the transfer component to acquire a physical image of the bottom wafer after bonding is completed.

11. The bonding apparatus according to claim 10, characterized in that, The transfer assembly includes a pick-up head for picking up the die; or, a chuck is provided at the first loading position for fixing the top wafer, and the camera is mounted on the chuck at a preset distance from it.

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