Chip packaging machine and packaging method of Internet of Things multi-network miniature split card

Abstract

The invention relates to the technical field of integrated circuit manufacturing, in particular to a chip packaging machine and a packaging method of an internet of things multi-network miniature split card, which comprises a base, a guide rail fixed on the base, a sliding seat capable of linearly moving above the guide rail, a guide sliding block fixed at the bottom of the sliding seat and movably clamped with the guide rail, and a mounting seat fixed on the sliding seat, a turntable for bearing a chip is rotationally mounted on the mounting seat, and a plurality of stations are circumferentially distributed on the turntable at equal angles; a driving block is slidably arranged on the sliding seat, a limiting assembly for limiting the driving block to move is arranged on the sliding seat, the mounting seat and the driving block are fixedly connected through a spring, and a lead screw which sequentially penetrates through the sliding seat, the mounting seat and the driving block and forms a thread pair with the driving block is rotatably arranged on the guide rail; the problems of poor curing uniformity, low efficiency and the like caused by traditional fixed drying can be effectively solved, and the packaging requirements of high-precision and high-reliability microelectronic devices such as multi-network miniature split cards of the Internet of Things are met.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, specifically to a chip packaging machine and a packaging method for a multi-network micro clone card for the Internet of Things. Background Technology

[0002] Chip packaging is a crucial follow-up process in integrated circuit manufacturing. The quality of the packaging directly determines the chip's physical stability, electrical performance, heat dissipation efficiency, and the reliability of the final product. For IoT multi-network micro-SIM cards, which integrate chip modules of multiple communication standards, the structure is complex and highly integrated, with extremely high requirements for the size and performance consistency of the package. This poses a severe challenge to packaging technology and equipment. In existing chip packaging processes, molding is one of the core steps. Molded epoxy molding compound is injected into and encapsulates the chip using a mold to form a protective shell. After molding, the molded body needs to be heated and cured to ensure full cross-linking and achieve the designed strength. Traditional packaging equipment typically uses fixed drying or curing devices. The drying equipment is stationary, and the molded chip substrate is conveyed to a fixed drying area for static heating. However, this traditional fixed drying method has significant drawbacks when used for packaging high-performance chips such as IoT multi-network micro-SIM cards. Because the heat source is located in a fixed position, for complex multi-chip modules, the distance and angle between each part and the heat source are different, resulting in uneven heating. Parts close to the heat source may be over-cured, while parts far from the heat source or located in the shaded area of ​​the structure may not be completely cured. This uneven curing will lead to uneven stress distribution within the package, reduce the mechanical strength and service life of the product, and even cause premature chip failure.

[0003] Therefore, there is an urgent need in this field for a new type of chip packaging machine and packaging method that can effectively solve the problems of poor curing uniformity and low efficiency caused by traditional fixed drying, so as to meet the packaging needs of high-precision and high-reliability microelectronic devices such as IoT multi-network micro clone cards. To this end, we provide a chip packaging machine and a packaging method for IoT multi-network micro clone cards to solve the above-mentioned problems. Summary of the Invention

[0004] The purpose of this invention is to provide a chip packaging machine and a packaging method for IoT multi-network micro clone cards, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A chip packaging machine includes a base, a guide rail fixed on the base, a linearly movable slide above the guide rail, a guide slider fixed at the bottom of the slide and movably engaging with the guide rail, a mounting base fixed on the slide, and a turntable for carrying chips rotatably mounted on the mounting base, with multiple workstations distributed circumferentially at equal angles on the turntable. A driving block is slidably disposed on the slide block, and a limiting component is provided to restrict the movement of the driving block. A spring is fixedly connected between the mounting base and the driving block. A lead screw is rotatably disposed on the guide rail, which passes through the slide block, the mounting base, and the driving block in sequence and forms a threaded pair with the driving block. The base is equipped with a molding device and a drying device. When the slide moves to one end of the guide rail, it triggers the molding device to start molding the packaged chip on the turntable. The other end of the guide rail is fixed with a stop block to restrict the movement of the slide. When the slide moves to the other end of the guide rail, it triggers the drying device to start drying the packaged chip on the turntable. At this time, when the drive block continues to move through the lead screw, the linkage structure between the turntable and the drive block will drive the turntable to rotate intermittently, so that the chip is heated evenly.

[0006] As described above, in a chip packaging machine, the limiting component includes a limiting plate fixed on a mounting base and a limiting groove fixed on a driving block, wherein the limiting plate is movably engaged inside the limiting groove.

[0007] As described above, in a chip packaging machine, a drive motor is fixed on the guide rail, and the output end of the drive motor is connected to a lead screw via a coupling to drive the lead screw to rotate.

[0008] As described above, in a chip packaging machine, the molding device includes a molding motor fixed on a base. The output end of the molding motor is connected to a rotating shaft rotatably mounted on the base via a coupling. A connecting frame is fixed at the bottom of the rotating shaft, and an injection head is fixed at the bottom of the connecting frame. A molding material tank is fixed on the base, and a material delivery pipe communicating with the injection head is connected to the bottom of the molding material tank.

[0009] As described above, in a chip packaging machine, a trigger switch is fixed on the guide rail, and an electrically controlled valve is installed on the feed tube. The trigger switch is connected to the drive motor, the molding motor, and the electrically controlled valve via electrical signals. When the slide moves to one end of the guide rail and presses against the trigger switch, the trigger switch is activated, and the following instructions are executed simultaneously: a) Turn off the drive motor and start the encapsulated motor to drive the shaft to rotate intermittently; b) Open the electronically controlled valve to intermittently supply molding compound from the molding compound tank to the injection head.

[0010] As described above, in a chip packaging machine, the drying device includes a drying fan fixed on a base, an air outlet shroud fixed at the air outlet of the drying fan, and a fan impeller shaft rotatably mounted on the base and connected to the fan impeller. A driven shaft is rotatably mounted on a guide rail, passing through a slide, a mounting base, and a drive block in sequence. The driven shaft is engaged with a lead screw via a gear mechanism, and the rotation of the lead screw drives the driven shaft to rotate synchronously. A sleeve is rotatably mounted on the slide and movably sleeved on the driven shaft. The sleeve is engaged with the driven shaft via a keyway structure. A drive triangular gear ring is fixed to the outer circumference of the sleeve. An mounting shaft is rotatably mounted on the guide rail, and a driven triangular gear is fixed on the mounting shaft to mesh with the drive triangular gear ring. The mounting shaft is engaged with the fan impeller shaft via a pulley mechanism, and the rotation of the mounting shaft drives the fan impeller shaft to rotate synchronously.

[0011] As described above, in a chip packaging machine, the gear mechanism includes a driving gear fixed on a lead screw and a driven gear fixed on a driven shaft, wherein the driving gear meshes with the driven gear. The keyway structure includes a key fixed on the driven shaft and a keyway formed in the inner wall of the sleeve, wherein the key is movably engaged inside the keyway. The pulley mechanism includes a driving toothed pulley fixed on the impeller shaft of the wind turbine and a driven toothed pulley fixed on the mounting shaft. The driving toothed pulley and the driven toothed pulley are driven by a toothed transmission belt.

[0012] As described above, in a chip packaging machine, the linkage structure includes a guide sleeve and a rotating rod rotatably mounted on a mounting base and sleeved on a lead screw. The turntable is fixed on the rotating rod. The guide sleeve and the rotating rod are engaged by a second gear mechanism. When the guide sleeve rotates, it drives the rotating rod to rotate synchronously. A movable sleeve sleeved on the lead screw is fixed on the drive block. The movable sleeve is movably inserted into the guide sleeve. The movable sleeve and the guide sleeve are engaged by a rolling groove structure. When the movable sleeve moves inside the guide sleeve, it drives the guide sleeve to rotate intermittently.

[0013] In the chip packaging machine described above, the second gear mechanism includes a passive bevel gear fixed on a rotating rod and an active bevel gear fixed on a guide sleeve, wherein the passive bevel gear meshes with the active bevel gear; The groove structure includes a ball that is movably embedded and engaged in the inner wall of the guide sleeve and a composite groove formed on the outer wall of the movable sleeve. The ball is movably engaged in the interior of the composite groove and can roll along the track of the composite groove. The composite groove is a composite groove composed of continuously alternating straight groove segments and spiral groove segments.

[0014] A packaging method for an IoT multi-network micro SIM card using the aforementioned chip packaging machine includes the following steps: S1, precisely loads the IoT multi-network micro clone card chip substrate that has been completed with surface mount and wire bonding into multiple stations on the turntable; S2, start the drive motor, drive the lead screw to rotate, and drive the slide and turntable to move along the guide rail to the molding station; when the slide moves to one end of the guide rail and triggers the molding device, the injection head of the molding device rotates intermittently, and the molding material in the molding material tank is intermittently transported to the injection head through the material conveying pipe for quantitative extrusion, and the molding material is injected into the mold cavity of the chip substrate at multiple stations on the turntable in sequence to complete the molding of the molding body; S3, after the molding is completed, the slide continues to move under the drive of the screw, leaving the molding station and moving towards the drying and curing station until it is blocked and positioned by the stop block; S4. After the slide reaches the drying and curing station, the drying device is triggered to start, generating hot air to heat and cure the encapsulated chip. At the same time, the lead screw continues to rotate, driving the turntable to rotate intermittently through the linkage structure, so that the encapsulated bodies on multiple stations can be heated evenly under the drying device, promoting the full and uniform curing of the encapsulating material. S5, after the curing process is completed, the drive motor reverses and drives the slide back to the initial position, taking out the encapsulated IoT multi-network miniature clone card.

[0015] Compared with the prior art, the beneficial effects of the present invention are: (1) The present invention uses a linkage structure consisting of a drive block, guide sleeve, movable sleeve and passive bevel gear, active bevel gear, etc. to drive the turntable to rotate intermittently during the drying stage. This allows the encapsulated chips in each station on the turntable to receive hot air from the exhaust hood evenly from multiple angles, which completely solves the problem of uneven heating caused by the static heat source in traditional fixed drying. This mechanism ensures that the curing rate of each part of the encapsulated body is consistent, effectively eliminates internal stress, and greatly improves the reliability and service life of complex chip packaging such as IoT multi-network micro clone cards. (2) The present invention drives the lead screw to rotate by a single drive motor, which can drive the slide and the chip it carries to pass through the molding and drying curing stations in sequence. In the whole process, the slide automatically starts and stops by touching the trigger switch and the stop block and triggers the corresponding device, realizing the fully automatic connection from molding and transfer to drying curing, reducing the waiting time and human intervention between processes, and significantly improving the packaging efficiency. (3) The present invention adopts a set of efficient power transmission system. While driving the slide to move linearly, the drive motor also drives the driven shaft to rotate through the gear mechanism. Then, the drive triangular gear ring, driven triangular gear and pulley mechanism drive the fan impeller shaft to rotate, so that the drying fan generates drying hot air. At the same time, the linkage structure can also drive the turntable to rotate intermittently. This "one machine for multiple uses" design makes the equipment structure compact, the transmission chain efficient, and reduces manufacturing costs and energy consumption. Attached Figure Description

[0016] Figure 1 This is a first-person view of the overall structure of a chip packaging machine.

[0017] Figure 2 This is a schematic diagram of the overall structure of a chip packaging machine from a second perspective.

[0018] Figure 3 This is a schematic diagram of the encapsulation device of a chip packaging machine.

[0019] Figure 4 for Figure 1 A schematic diagram of the decomposed part of the structure.

[0020] Figure 5 for Figure 4 A schematic diagram of the truncated part of the structure.

[0021] Figure 6 for Figure 4 A schematic diagram of the truncated part of the structure.

[0022] Figure 7 for Figure 6 A schematic diagram of the main structure.

[0023] Figure 8 for Figure 6 A schematic diagram of the decomposed part of the structure.

[0024] Figure 9 This is a schematic diagram of the grooving structure of a chip packaging machine.

[0025] Figure 10 for Figure 6 A partial structural diagram.

[0026] Figure 11 This is a schematic diagram of the keyway structure of a chip packaging machine.

[0027] Figure 12 for Figure 11 Enlarged structural diagram at point A in the middle.

[0028] In the diagram: 1. Base; 2. Slide; 3. Guide rail; 4. Guide slider; 5. Mounting base; 6. Turntable; 7. Station; 8. Drive block; 9. Spring; 10. Limiting plate; 11. Limiting groove; 12. Lead screw; 13. Drive motor; 14. Trigger switch; 15. Molding motor; 16. Rotating shaft; 17. Connecting frame; 18. Injection head; 19. Molding material tank; 20. Material conveying pipe; 21. Guide sleeve; 22. Rotating rod; 23. Driven bevel gear; 24. 25. Driven bevel gear; 26. Movable sleeve; 27. Ball bearing; 28. Composite groove; 29. ​​Sleeve; 30. Driven triangular gear ring; 31. Driven shaft; 32. Key; 33. Driven gear; 34. Driven gear; 35. Drying fan; 36. Fan impeller shaft; 37. Mounting shaft; 38. Driven triangular gear; 39. Driven toothed pulley; 40. Driven toothed pulley; 41. Toothed transmission belt; 42. Stop block; 43. Air outlet hood. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0030] Please see Figures 1-12 As an embodiment of the present invention, a chip packaging machine includes a base 1, a guide rail 3 fixed on the base 1, a linearly movable slide 2 arranged above the guide rail 3, a guide slider 4 fixed at the bottom of the slide 2 and movably engaged with the guide rail 3, a mounting base 5 fixed on the slide 2, a turntable 6 for carrying chips rotatably mounted on the mounting base 5, and multiple workstations 7 distributed circumferentially at equal angles on the turntable 6. A drive block 8 is slidably mounted on the slide block 2, and a limiting component is provided to restrict the movement of the drive block 8. A spring 9 is fixedly connected between the mounting base 5 and the drive block 8. A lead screw 12 is rotatably mounted on the guide rail 3, which passes through the slide block 2, the mounting base 5, and the drive block 8 in sequence and forms a threaded pair with the drive block 8. The base 1 is equipped with a molding device and a drying device. When the slide 2 moves to one end of the guide rail 3, it triggers the molding device to start molding the packaged chip on the turntable 6. The other end of the guide rail 3 is fixed with a stop block 42 to restrict the movement of the slide 2. When the slide 2 moves to the other end of the guide rail 3, it triggers the drying device to start drying the packaged chip on the turntable 6. At this time, when the drive block 8 continues to move through the lead screw 12, the linkage structure between the turntable 6 and the drive block 8 will drive the turntable 6 to rotate intermittently, so that the chip is heated evenly.

[0031] In this embodiment, during use, in the initial state of the equipment, the slide 2 is located at the starting position on the guide rail 3. The operator places the chip to be packaged in one of the multiple workstations 7 on the turntable 6, starts the drive source, and drives the lead screw 12 to rotate. Since the lead screw 12 and the drive block 8 form a threaded pair, and the drive block 8 is connected to the mounting base 5 through the spring 9, and the mounting base 5 is fixed to the slide 2, the slide 2 is movably engaged with the guide rail 3 through the guide slider 4 at its bottom. Therefore, the rotational motion of the lead screw 12 is converted into the precise linear motion of the slide 2 carrying the turntable 6 along the guide rail 3. When the slide 2 moves to one end of the guide rail 3, the molding device is triggered to start, and the molding device begins to work, performing molding operations on the chip on the turntable 6 located below it. After the molding process is completed, the slide 2 moves to the other end of the guide rail 3 under the reverse drive of the lead screw 12 until it contacts the stop block 42 fixed at that end. After stopping, the slide 2 triggers the start of the drying device to dry and cure the encapsulated chips on the turntable 6. During this drying stage, the slide 2 is blocked by the stop block 42 and cannot continue to move forward, but the lead screw 12 continues to rotate. The continuous rotation of the lead screw 12 forces the drive block 8, which is threaded to it, to slide in a straight line on the slide 2. The straight movement of the drive block 8 is ultimately converted into the intermittent rotation of the turntable 6 through the linkage structure set between the turntable 6 and the drive block 8. The intermittent rotation of the turntable 6 allows the chips in all stations 7 on it to periodically change their angle relative to the heat source, thereby ensuring that each part of each chip is heated evenly, effectively improving the curing quality and consistency of the encapsulated body. After the curing process is completed, the drive lead screw 12 reverses, which can drive the slide 2 back to the initial position for unloading and preparing for the next work cycle.

[0032] As a further embodiment of the present invention, the limiting component includes a limiting plate 10 fixed on the mounting base 5 and a limiting groove 11 fixed on the driving block 8, wherein the limiting plate 10 is movably engaged inside the limiting groove 11.

[0033] In this embodiment, the limiting component limits the sliding stroke of the drive block 8 on the slide block 2 by the cooperation of the limiting plate 10 fixed to the mounting base 5 and the limiting groove 11 fixed to the drive block 8, thus preventing it from deviating from the normal working range.

[0034] As a further embodiment of the present invention, a drive motor 13 is fixed on the guide rail 3, and the output end of the drive motor 13 is connected to the lead screw 12 through a coupling to drive the lead screw 12 to rotate.

[0035] In this embodiment, the drive motor 13 is electrically connected to an external power source via a wire. The drive motor 13 is fixed to the guide rail 3 and directly connected to the lead screw 12 via a coupling, providing a stable and reliable power source for the equipment.

[0036] As a further embodiment of the present invention, the sealing device includes a sealing motor 15 fixed on a base 1. The output end of the sealing motor 15 is connected to a rotating shaft 16 rotatably mounted on the base 1 via a coupling. A connecting frame 17 is fixed at the bottom of the rotating shaft 16. An injection head 18 is fixed at the bottom of the connecting frame 17. A sealing material tank 19 is fixed on the base 1. A material conveying pipe 20 communicating with the injection head 18 is connected to the bottom of the sealing material tank 19.

[0037] In this embodiment, the molding motor 15 is electrically connected to an external power source via a wire. The molding motor 15 drives the rotating shaft 16 and the injection head 18 to rotate. The molding material is transported from the molding material tank 19 to the injection head 18 via the material conveying pipe 20, thus completing the sequential molding operation of chips at multiple stations 7.

[0038] As a further embodiment of the present invention, a trigger switch 14 is fixed on the guide rail 3, and an electric control valve is installed on the feed pipe 20. The trigger switch 14 is connected to the drive motor 13, the sealing motor 15, and the electric control valve via an electrical signal. When the slide 2 moves to one end of the guide rail 3 and presses the trigger switch 14, the trigger switch 14 will be triggered to open, and the following instructions will be executed simultaneously: a) Turn off drive motor 13 and start plastic seal motor 15 to drive shaft 16 to rotate intermittently; b) Open the electronically controlled valve to intermittently supply molding compound from the molding compound tank 19 to the injection head 18.

[0039] In this embodiment, the electric control valve and the trigger switch 14 are electrically connected to an external power supply via wires. A timer is also installed on the electric control valve. The timer is connected to the electric control valve via an electrical signal. The trigger switch 14 enables automatic switching of the workstation. After the slide 2 arrives at the molding station, it will contact the trigger switch 14 to trigger the switch. The trigger signal controls the drive motor 13 to pause, start the molding motor 15, and open the electric control valve. The electric control valve, in conjunction with the timer, intermittently opens and closes the feed pipe 20, so that the molding material tank 19 intermittently feeds material to the injection head 18, thereby realizing the automatic execution of the molding process.

[0040] As a further embodiment of the present invention, the drying device includes a drying fan 35 fixed on the base 1, an air outlet hood 43 fixed at the air outlet of the drying fan 35, and a fan impeller shaft 36 rotatably mounted on the base 1 and connected to the fan impeller. A driven shaft 30 is rotatably mounted on the guide rail 3, passing through the slide 2, the mounting base 5, and the drive block 8 in sequence. The driven shaft 30 is engaged with the lead screw 12 through a gear mechanism. When the lead screw 12 rotates, it drives the driven shaft 30 to rotate synchronously. A sleeve 28 is rotatably mounted on the slide 2 and movably sleeved on the driven shaft 30. The sleeve 28 and the driven shaft 30 are connected by a keyway structure. A drive triangular gear ring 29 is fixed on the outer periphery of the sleeve 28. An installation shaft 37 is rotatably mounted on the guide rail 3. A driven triangular gear 38 that meshes with the drive triangular gear ring 29 is fixed on the installation shaft 37. The installation shaft 37 and the fan impeller shaft 36 are connected by a pulley mechanism. When the installation shaft 37 rotates, it will drive the fan impeller shaft 36 to rotate synchronously.

[0041] In this embodiment, the power source of the drying device is the lead screw 12, which transmits power to the driven shaft 30 through the driving gear 33 and the driven gear 34 to drive the driven shaft 30 to rotate. The sleeve 28 and the driven shaft 30 are connected by a keyway structure. When the driven shaft 30 rotates, it will drive the sleeve 28 to rotate, thereby driving the drive triangular gear ring 29 to rotate. When the slide 2 moves to the other end of the guide rail 3, the drive triangular gear ring 29 will mesh with the driven triangular gear 38 on the mounting shaft 37 to drive the driven triangular gear 38 to rotate, which in turn drives the mounting shaft 37 to rotate. When the mounting shaft 37 rotates, it will use the pulley mechanism to finally drive the fan impeller shaft 36 to rotate. The rotation of the fan impeller shaft 36 will drive the impeller on the drying fan 35 to rotate, realizing the automatic supply of drying airflow from the drying fan 35. The drying airflow blown out by the drying fan 35 is blown to the chip on the workstation 7 below through the air outlet hood 43. It should be noted that, in order to ensure that the drive triangular gear ring 29 and the driven triangular gear 38 can mesh smoothly, the tooth edges of both gears are treated with bevel transition. This design allows the drive triangular gear ring 29 to smoothly guide and automatically correct the tooth position of the driven triangular gear 38 at the beginning of meshing, achieving smooth meshing without impact.

[0042] As a further embodiment of the present invention, the gear mechanism includes a driving gear 33 fixed on the lead screw 12 and a driven gear 34 fixed on the driven shaft 30, wherein the driving gear 33 meshes with the driven gear 34. The keyway structure includes a key 31 fixed on the driven shaft 30 and a keyway 32 opened on the inner wall of the sleeve 28. The key 31 is movably engaged inside the keyway 32. The pulley mechanism includes a driving toothed pulley 39 fixed on the impeller shaft 36 of the fan and a driven toothed pulley 40 fixed on the mounting shaft 37. The driving toothed pulley 39 and the driven toothed pulley 40 are driven by a toothed transmission belt 41.

[0043] In this embodiment, when the lead screw 12 rotates, it drives the drive gear 33 to rotate. The drive gear 33 meshes with the driven gear 34 to drive the driven shaft 30 to rotate. When the driven shaft 30 rotates, the key 31 and the keyway 32 cooperate to drive the sleeve 28 to rotate while allowing the sleeve 28 to slide along its axial direction. When the mounting shaft 37 rotates, the toothed belt 41 between the drive toothed pulley 39 and the driven toothed pulley 40 drives the fan impeller shaft 36 to rotate.

[0044] As a further embodiment of the present invention, the linkage structure includes a guide sleeve 21 and a rotating rod 22 rotatably mounted on the mounting base 5 and sleeved on the lead screw 12. The turntable 6 is fixed on the rotating rod 22. The guide sleeve 21 and the rotating rod 22 are connected by a second gear mechanism. When the guide sleeve 21 rotates, it will drive the rotating rod 22 to rotate synchronously. A movable sleeve 25 is fixed on the drive block 8 and sleeved on the lead screw 12. The movable sleeve 25 is movably inserted into the guide sleeve 21. The movable sleeve 25 and the guide sleeve 21 are connected by a groove structure. When the movable sleeve 25 moves inside the guide sleeve 21, it will drive the guide sleeve 21 to rotate intermittently.

[0045] In this embodiment, the core of the linkage structure is to convert the linear motion of the drive block 8 into the rotational motion of the turntable 6. After the slide block 2 moves to the other end of the guide rail 3 and is stopped by the stop block 42, the drive block 8 will continue to move because it is threadedly connected to the lead screw 12. The movable sleeve 25 moves linearly with the drive block 8, and drives the guide sleeve 21 to rotate intermittently through the grooving structure. Then, the second gear mechanism drives the rotating rod 22 and the turntable 6 to rotate intermittently.

[0046] As a further embodiment of the present invention, the second gear mechanism includes a passive bevel gear 23 fixed on the rotating rod 22 and an active bevel gear 24 fixed on the guide sleeve 21, wherein the passive bevel gear 23 meshes with the active bevel gear 24. The groove structure includes a ball 26 that is movably embedded and engaged in the inner wall of the guide sleeve 21 and a composite groove 27 that is opened in the outer wall of the movable sleeve 25. The ball 26 is movably engaged in the interior of the composite groove 27 and can roll along the track where the composite groove 27 is located. The composite groove 27 is a composite groove composed of continuously alternating straight groove segments and spiral groove segments.

[0047] In this embodiment, when the movable sleeve 25 is inserted into the guide sleeve 21 and moves, the ball 26 rolls in the composite groove 27. When it moves to the straight groove section, the guide sleeve 21 does not rotate; when it moves to the spiral groove section, it pushes the guide sleeve 21 to rotate a certain angle. When the guide sleeve 21 rotates, the passive bevel gear 23 meshes with the active bevel gear 24 to drive the rotating rod 22 to rotate, thereby realizing the intermittent rotation of the turntable 6. The period and angle of the intermittent motion are determined by the alternating design of the groove shape of the composite groove 27.

[0048] The working principle of this invention is as follows: The equipment drives the lead screw 12 to rotate via the drive motor 13, realizing the automatic reciprocating movement of the slide 2 between the molding station and the drying station. When the slide 2 moves to the molding station, it triggers the molding device. Through the intermittent rotation of the injection head 18 and the intermittent quantitative supply of molding material, the chip is molded. When the slide 2 moves to the drying station and is blocked by the stop block 42, the drying device is automatically started. At this time, the lead screw 12 continues to rotate, driving the drive block 8 to slide relative to the slide 2. Its linear motion is converted into the intermittent rotational motion of the turntable 6 through the linkage structure composed of the composite groove 27, etc. At the same time, the fan impeller shaft 36 is driven to rotate through the gear and pulley mechanism, so that the drying fan 35 generates hot air to dry the intermittently rotating chip on the turntable 6, realizing the curing of the chip under the condition of uniform heating from multiple angles, effectively improving the packaging quality and efficiency.

[0049] The above embodiments are exemplary and not restrictive. Therefore, any technical solutions that can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention are included within the scope of the present invention.

Claims

1. A chip packaging machine, comprising a base (1), characterized in that, A guide rail (3) is fixed on the base (1). A slide (2) that can move linearly is provided above the guide rail (3). A guide slider (4) that is movably engaged with the guide rail (3) is fixed at the bottom of the slide (2). A mounting base (5) is fixed on the slide (2). A turntable (6) for carrying the chip is rotatably mounted on the mounting base (5). Multiple workstations (7) are distributed circumferentially at equal angles on the turntable (6). A drive block (8) is slidably disposed on the slide (2), and a limiting component is provided to restrict the movement of the drive block (8). A spring (9) is fixedly connected between the mounting base (5) and the drive block (8). A lead screw (12) is rotatably disposed on the guide rail (3) and passes through the slide (2), mounting base (5), and drive block (8) in sequence, and forms a threaded pair with the drive block (8). The base (1) is provided with a molding device and a drying device. When the slide (2) moves to one end of the guide rail (3), the molding device is triggered to start molding the packaged chip on the turntable (6). The other end of the guide rail (3) is fixed with a stop block (42) to restrict the movement of the slide (2). When the slide (2) moves to the other end of the guide rail (3), the drying device is triggered to start drying the packaged chip on the turntable (6). At this time, when the drive block (8) continues to move through the screw (12), the linkage structure between the turntable (6) and the drive block (8) will drive the turntable (6) to rotate intermittently, so that the chip is heated evenly.

2. The chip packaging machine according to claim 1, characterized in that, The limiting component includes a limiting plate (10) fixed on the mounting base (5) and a limiting groove (11) fixed on the drive block (8), wherein the limiting plate (10) is movably engaged inside the limiting groove (11).

3. A chip packaging machine according to claim 1, characterized in that, A drive motor (13) is fixed on the guide rail (3). The output end of the drive motor (13) is connected to the lead screw (12) through a coupling to drive the lead screw (12) to rotate.

4. A chip packaging machine according to claim 3, characterized in that, The sealing device includes a sealing motor (15) fixed on a base (1). The output end of the sealing motor (15) is connected to a rotating shaft (16) rotatably mounted on the base (1) via a coupling. A connecting frame (17) is fixed at the bottom of the rotating shaft (16). An injection head (18) is fixed at the bottom of the connecting frame (17). A sealing material tank (19) is fixed on the base (1). A material conveying pipe (20) communicating with the injection head (18) is connected to the bottom of the sealing material tank (19).

5. A chip packaging machine according to claim 4, characterized in that, A trigger switch (14) is fixed on the guide rail (3), and an electric control valve is installed on the feed pipe (20). The trigger switch (14) is connected to the drive motor (13), the sealing motor (15), and the electric control valve via electrical signals. When the slide (2) moves to one end of the guide rail (3) and presses the trigger switch (14), the trigger switch (14) will be triggered to open, and the following instructions will be executed at the same time: a) Turn off the drive motor (13) and start the encapsulated motor (15) to drive the rotating shaft (16) to rotate intermittently; b) Open the electronically controlled valve to intermittently feed molding material from the molding can (19) to the injection head (18).

6. A chip packaging machine according to claim 1, characterized in that, The drying device includes a drying fan (35) fixed on a base (1), and an air outlet cover (43) fixed at the air outlet of the drying fan (35). The drying fan (35) includes a fan impeller shaft (36) rotatably mounted on the base (1) and connected to the fan impeller. A driven shaft (30) is rotatably mounted on the guide rail (3) and sequentially passes through the slide (2), mounting base (5), and drive block (8). The driven shaft (30) is engaged with the lead screw (12) through a gear mechanism. When the lead screw (12) rotates, it drives the driven shaft (30) to rotate synchronously. 2) A sleeve (28) is rotatably mounted on the driven shaft (30). The sleeve (28) and the driven shaft (30) are connected by a keyway structure. A drive triangular gear ring (29) is fixed on the outer periphery of the sleeve (28). An installation shaft (37) is rotatably mounted on the guide rail (3). A driven triangular gear (38) that meshes with the drive triangular gear ring (29) is fixed on the installation shaft (37). The installation shaft (37) and the fan impeller shaft (36) are connected by a pulley mechanism. When the installation shaft (37) rotates, it will drive the fan impeller shaft (36) to rotate synchronously.

7. A chip packaging machine according to claim 6, characterized in that, The gear mechanism includes a driving gear (33) fixed on a lead screw (12) and a driven gear (34) fixed on a driven shaft (30), wherein the driving gear (33) meshes with the driven gear (34); The keyway structure includes a key (31) fixed on the driven shaft (30) and a keyway (32) formed on the inner wall of the sleeve (28), wherein the key (31) is movably engaged inside the keyway (32); The pulley mechanism includes a driving toothed pulley (39) fixed on the impeller shaft (36) of the wind turbine and a driven toothed pulley (40) fixed on the mounting shaft (37). The driving toothed pulley (39) and the driven toothed pulley (40) are driven by a toothed transmission belt (41).

8. A chip packaging machine according to claim 1, characterized in that, The linkage structure includes a guide sleeve (21) rotatably mounted on the mounting base (5) and a rotating rod (22) sleeved on the lead screw (12). The turntable (6) is fixed on the rotating rod (22). The guide sleeve (21) and the rotating rod (22) are connected by a second gear mechanism. When the guide sleeve (21) rotates, it will drive the rotating rod (22) to rotate synchronously. A movable sleeve (25) sleeved on the lead screw (12) is fixed on the drive block (8). The movable sleeve (25) is movably inserted into the guide sleeve (21). The movable sleeve (25) and the guide sleeve (21) are connected by a grooving structure. When the movable sleeve (25) moves inside the guide sleeve (21), it will drive the guide sleeve (21) to rotate intermittently.

9. A chip packaging machine according to claim 8, characterized in that, The second gear mechanism includes a passive bevel gear (23) fixed on the rotating rod (22) and an active bevel gear (24) fixed on the guide sleeve (21), wherein the passive bevel gear (23) meshes with the active bevel gear (24); The groove structure includes a ball (26) that is movably embedded and engaged in the inner wall of the guide sleeve (21) and a composite groove (27) opened on the outer wall of the movable sleeve (25). The ball (26) is movably engaged in the interior of the composite groove (27) and can roll along the track of the composite groove (27). The composite groove (27) is a composite groove composed of a continuous alternating connection of straight groove segments and spiral groove segments.

10. A packaging method for an IoT multi-network micro SIM card using a chip packaging machine as described in any one of claims 1-9, characterized in that, Includes the following steps, S1, the IoT multi-network micro clone card chip substrate that has been completed by surface mounting and wire bonding is precisely mounted in multiple stations (7) on the turntable (6); S2, start the drive motor (13), drive the lead screw (12) to rotate, and drive the slide (2) and turntable (6) to move along the guide rail (3) to the molding station; when the slide (2) moves to one end of the guide rail (3) and triggers the molding device, the injection head (18) of the molding device rotates intermittently, and the molding material in the molding material tank (19) is intermittently transported to the injection head (18) through the material conveying pipe (20) for quantitative extrusion, and the molding material is injected into the mold cavity of the multiple stations (7) on the turntable (6) to wrap the chip substrate, thus completing the molding of the molding body; S3, after the plastic sealing is completed, the slide (2) continues to move under the drive of the screw (12), leaving the plastic sealing station and moving towards the drying and curing station until it is blocked and positioned by the stop block (42); S4, after the slide (2) arrives at the drying and curing station, the drying device is triggered to start, generating hot air to heat and cure the encapsulated chip; at the same time, the screw (12) continues to rotate, driving the turntable (6) to rotate intermittently through the linkage structure, so that the encapsulated bodies on multiple stations (7) can be heated evenly under the drying device, promoting the full and uniform curing of the encapsulated material. S5. After the curing process is completed, the drive motor (13) reverses and drives the slide (2) back to the initial position to remove the encapsulated IoT multi-network miniature clone card.

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