Substrates with improved scratch resistant coatings

By employing an alternating split structure of DLC layer and dielectric layer on a transparent substrate, the problems of insufficient scratch resistance and durability of DLC coating are solved, achieving higher transparency and longer service life.

CN122055337APending Publication Date: 2026-05-15SAINT-GOBAIN SAFETY GLASS CO FRANCE
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Patent Information

Application Number
CN202480066445.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-10-19
Filing Date
2024-10-07
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Existing DLC ​​coatings on transparent substrates suffer from insufficient scratch resistance, susceptibility to environmental degradation, limited transparency, and limited lifespan, especially evident in automotive glass.

Method used

The DLC layer is divided into at least two split layers and separated by a dielectric layer to form an alternating multilayer structure. Specifically, the layer sequence is substrate-first split DLC layer-dielectric layer-second split DLC layer. The dielectric layer can be made of materials such as Si3N4, and the total thickness of the DLC layer does not exceed 20nm.

Benefits of technology

It improves the scratch resistance and durability of the coating, reduces crack formation and propagation, enhances resistance to environmental impacts, extends service life, and meets transparency requirements.

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Abstract

The invention relates to a coated substrate comprising a substrate (1) having a scratch-resistant coating (2), in which: the scratch-resistant coating (2) comprises a diamond-like carbon (DLC) layer forming a maximum overall DLC layer thickness of 20 nm, and this overall DLC layer thickness is split into at least two split DLC layers, which are separated by at least one dielectric layer, in which, starting from the substrate (1), the dielectric layer is separated from the substrate (1) by at least one dielectric layer. Forming the following sequence of layers:-a first split DLC layer (4)-a second dielectric layer (5)-a second split DLC layer (7); wherein the first split DLC layer (4) is arranged in close proximity to the substrate (1), or a first dielectric layer (3) having a layer thickness of 1 nm to 120 nm is formed in close proximity to the substrate (1) and in close proximity to the first split DLC layer (4). The invention also relates to a method for producing such a coated substrate and to the use thereof.
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