Wearable ring device

Abstract

Methods, systems, and devices for wearable ring devices are described. A wearable ring device may include an annular housing and a printed circuit board (PCB) at least partially in contact with an inner shell of the annular housing. A light emitting component and a light receiving component may be disposed on the first surface of the PCB and may extend through one or more apertures in the inner housing such that the light emitting component and the light receiving component are substantially flush with the inner annular surface of the inner housing. An optical lens may cover the light emitting component and the light receiving component located within the aperture. In some cases, an optical lens may be molded over the light emitting component and the light receiving component prior to inserting the printed circuit board into the annular housing. In other cases, after the printed circuit board is inserted into the annular housing, an optical lens may be molded over the light emitting component and the light receiving component (and one or more apertures).

Description

[0001] Cross-referencing This patent application claims priority to U.S. Patent Application No. 18 / 797,352, filed August 7, 2024, entitled "Wearable Ring Device," by JÄRVELÄ et al.; and to U.S. Provisional Patent Application No. 63 / 578,094, filed August 22, 2023, also entitled "Wearable Ring Device," by JÄRVELÄ et al. Both priorities have been assigned to the assignee of this application, and the entire contents of both are incorporated herein by reference. Technical Field

[0002] The following content relates to wearable devices and data processing, including the form factor of a wearable ring device. Background Technology

[0003] Some wearable devices can be configured to collect user data, including temperature and heart rate data. In some cases, the overall structure of a wearable device may affect the accuracy of the data measurements it performs. Furthermore, wearable devices may need to be worn all day and therefore may be subject to continuous wear and tear. Therefore, there is a need to improve the durability of wearable devices while enabling their efficient and cost-effective manufacturing. Attached Figure Description

[0004] Figure 1 An example of a system for supporting the form factor of a wearable ring device is shown according to various aspects of this disclosure.

[0005] Figure 2 An example of a system for supporting the form factor of a wearable ring device is shown according to various aspects of this disclosure.

[0006] Figure 3 An example of the external dimensions of a wearable ring device according to various aspects of this disclosure is shown.

[0007] Figure 4 An example of a lens molding process for supporting the form factor of a wearable ring device is shown according to various aspects of this disclosure.

[0008] Figure 5 An example of a lens molding process for supporting the form factor of a wearable ring device, according to various aspects of this disclosure, is shown.

[0009] Figures 6 to 8A flowchart illustrating a method for manufacturing a wearable ring device according to various aspects of this disclosure is shown. Detailed Implementation

[0010] Some wearable devices can be configured to collect data related to a user's movement and other activities. For example, some wearable devices can be configured to continuously collect physiological data related to the user, including temperature data, heart rate data, etc. Therefore, some wearable devices can be configured to house one or more sensors configured to collect physiological data from the user.

[0011] In some cases, wearable devices can collect user-related physiological data through skin contact at the optical interface between the wearable device's sensors and the user's skin. In this scenario, the wearable device's structure may affect its ability to efficiently and accurately collect physiological data. Furthermore, wearable devices may need to be worn all day and therefore subject to continuous wear and tear. However, space constraints make it difficult to manufacture wearable rings with sufficiently small form factors suitable for everyday wear. Therefore, it is necessary to improve the durability of wearable devices while maintaining their aesthetic appeal within a smaller form factor.

[0012] Therefore, aspects of this disclosure relate to methods for manufacturing wearable ring devices. Specifically, aspects of this disclosure relate to processes for manufacturing wearable device structures to reduce the width, thickness, and overall size of the wearable ring device. In particular, aspects of this disclosure allow sensors of the wearable device to be moved closer to the user's tissue. By moving the sensors closer to the user's tissue, the thickness of the wearable device can be reduced, and the quality of physiological measurements performed by the sensors can be improved.

[0013] In some cases, wearable ring devices may include an annular housing comprising an inner shell and an outer shell. A printed circuit board (PCB) for housing the device's sensors may be encapsulated within the annular housing located between the inner and outer shells. In some cases, light emitting and receiving components may be disposed on a first surface of the PCB and may extend through one or more openings in the inner shell, such that the light emitting and receiving components are substantially flush with the inner annular surface of the inner shell. By moving the light emitting and receiving components upward into the openings in the inner shell, the PCB can be brought closer to the inner shell, thereby reducing the thickness of the wearable ring device. Furthermore, other electronic components not disposed within the openings (e.g., an accelerometer) may be disposed on a second surface of the PCB opposite the first surface, further enabling the PCB to be positioned to fit snugly against the inner shell.

[0014] In some cases, the optical lens can cover the light emitting and receiving components located within one or more openings in the inner housing. In some cases, the optical lens can be molded over the light emitting and receiving components before the PCB is inserted into the annular housing. In other cases, the optical lens can be molded over the light emitting and receiving components (and the openings) after the PCB is inserted into the annular housing. Furthermore, the molding process of the optical lens can be performed separately from the molding process used to fill the cavity within the annular housing and secure the PCB within that cavity.

[0015] The various aspects of this disclosure are first described in the context of a system supporting the collection of physiological data from a user via a wearable device. Other aspects of this disclosure are described in the context of a lens molding process. The various aspects of this disclosure are further illustrated and described through schematic diagrams of devices, systems, and flowcharts related to wearable ring devices.

[0016] Figure 1 An example of a system 100 for supporting the form factor of a wearable ring device according to various aspects of this disclosure is shown. The system 100 includes multiple electronic devices (e.g., wearable device 104, user device 106) that can be worn and / or operated by one or more users 102. The system 100 also includes a network 108 and one or more servers 110.

[0017] Electronic devices may include any electronic devices known in the art, including wearable device 104 (e.g., a ring wearable device, a watch wearable device, etc.) and user device 106 (e.g., a smartphone, a laptop computer, a tablet computer). Electronic devices associated with a corresponding user 102 may include one or more of the following functions: 1) measuring physiological data; 2) storing the measured data; 3) processing the data; 4) providing output (e.g., via a GUI) to user 102 based on the processed data; and 5) communicating data with each other and / or with other computing devices. Different electronic devices may perform one or more of these functions.

[0018] Example wearable device 104 may include wearable computing devices, such as ring computing devices (hereinafter referred to as "rings") configured to be worn on the finger of user 102, wrist computing devices (e.g., smartwatches, fitness bands, or bracelets) configured to be worn on the wrist of user 102, and / or head-mounted computing devices (e.g., glasses / goggles). Wearable device 104 may also include cords, straps (e.g., flexible or non-flexible cords or straps), hook and loop sensors, etc., that can be positioned in other locations, such as straps around the head (e.g., forehead bands), arms (e.g., forearm straps and / or double headbands), and / or legs (e.g., thigh or calf straps), behind the ears, under the armpits, etc. Wearable device 104 may also be attached to or included in clothing items. For example, wearable device 104 may be included in pockets and / or pouches on clothing. As another example, wearable device 104 may be clipped and / or pinned to clothing, or may otherwise be held near user 102. Exemplary clothing items may include, but are not limited to, hats, shirts, gloves, trousers, socks, outerwear (e.g., jackets), and underwear. In some implementations, wearable device 104 may be included in other types of equipment, such as training / sports equipment used during physical activity. For example, wearable device 104 may be attached to or included in a bicycle, skis, tennis racket, golf club, and / or training weights.

[0019] Many aspects of this disclosure can be described in the context of the ring wearable device 104. Therefore, unless otherwise indicated herein, the terms "ring 104," "wearable device 104," and similar terms may be used interchangeably. However, the use of the term "ring 104" should not be considered limiting, as it is contemplated herein that various aspects of this disclosure can be implemented using other wearable devices (e.g., watch wearable devices, necklace wearable devices, bracelet wearable devices, earring wearable devices, ankle wearable devices, etc.).

[0020] In some aspects, user equipment 106 may include handheld mobile computing devices, such as smartphones and tablet computing devices. User equipment 106 may also include personal computers, such as laptop and desktop computing devices. Other example user equipment 106 may include server computing devices capable of communicating with other electronic devices, such as via the Internet. In some implementations, the computing device may include medical devices, such as external wearable computing devices (e.g., Holter monitors). Medical devices may also include implantable medical devices, such as pacemakers and defibrillators. Other example user equipment 106 may include home computing devices, such as Internet of Things (IoT) devices (e.g., IoT devices), smart TVs, smart speakers, smart displays (e.g., video call displays), hubs (e.g., wireless communication hubs), security systems, smart appliances (e.g., thermostats and refrigerators), and fitness equipment.

[0021] Some electronic devices (e.g., wearable device 104, user device 106) can measure physiological parameters of the corresponding user 102, such as photoplethysmography waveforms, continuous skin temperature, pulse waveforms, respiratory rate, heart rate, heart rate variability (HRV), body motion monitoring, skin conductance response, pulse oxygen saturation, oxygen saturation (SpO2), blood glucose levels (e.g., glucose indicators), and / or other physiological parameters. Some electronic devices that measure physiological parameters may also perform some / all of the calculations described herein. Some electronic devices may not measure physiological parameters but may perform some / all of the calculations described herein. For example, a ring (e.g., wearable device 104), a mobile device application, or a server computing device may process physiological data received from other devices.

[0022] In some implementations, user 102 may operate or be associated with multiple electronic devices, some of which can measure physiological parameters, and some of which can process the measured physiological parameters. In some implementations, user 102 may have a loop for measuring physiological parameters (e.g., wearable device 104). User 102 may also have or be associated with user device 106 (e.g., a mobile device, a smartphone), wherein wearable device 104 and user device 106 are communicatively coupled to each other. In some cases, user device 106 may receive data from wearable device 104 and perform some / all of the calculations described herein. In some implementations, user device 106 may also measure physiological parameters described herein, such as motion / activity parameters.

[0023] For example, such as Figure 1As shown, a first user 102-a (user 1) can operate, or be associated with, a wearable device 104-a (e.g., ring 104-a) and a user device 106-a that can operate as described herein. In this example, the user device 106-a associated with user 102-a can process / store physiological parameters measured by ring 104-a. In contrast, a second user 102-b (user 2) can be associated with ring 104-b, a watch-wearable device 104-c (e.g., watch 104-c), and user device 106-b, wherein the user device 106-b associated with user 102-b can process / store physiological parameters measured by ring 104-b and / or watch 104-c. Furthermore, an nth user 102-n (user N) can be associated with an arrangement of electronic devices (e.g., ring 104-n, user device 106-n) described herein. In some respects, wearable devices 104 (e.g., ring 104, watch 104) and other electronic devices can be communicatively coupled to user equipment 106 of the corresponding user 102 via Bluetooth, Wi-Fi and other wireless protocols.

[0024] In some implementations, the ring 104 of system 100 (e.g., wearable device 104) can be configured to collect physiological data from the corresponding user 102 based on arterial blood flow within the user's finger. Specifically, the ring 104 may utilize one or more light-emitting components, such as LEDs (e.g., red LEDs, green LEDs), that emit light on the palmar side of the user's finger to collect physiological data based on arterial blood flow within the user's finger. Generally, the terms light-emitting component, light-emitting element, and similar terms may include, but are not limited to, LEDs, micro LEDs, mini LEDs, laser diodes (LDs) (e.g., vertical-cavity surface-emitting lasers (VCSELs), etc.).

[0025] In some cases, system 100 can be configured to collect physiological data from a corresponding user 102 based on blood flow diffusing into the skin's microvascular bed, which has capillaries and arterioles. For example, system 100 can collect PPG data based on the measured blood volume diffusing into the microvascular system of capillaries and arterioles. In some embodiments, ring 104 may use a combination of both green and red LEDs to acquire physiological data. Physiological data may include any physiological data known in the art, including but not limited to temperature data, accelerometer data (e.g., movement / exercise data), heart rate data, HRV data, blood oxygen level data, or any combination thereof.

[0026] The use of both green and red LEDs offers several advantages over other solutions, as they have been found to have distinct strengths in acquiring physiological data under different conditions (e.g., bright / dark, active / inactive) and through different parts of the body. For example, green LEDs have been found to exhibit better performance during exercise. Furthermore, wearable devices using multiple LEDs distributed around a ring 104 (e.g., green and red LEDs) have been found to exhibit superior performance compared to those using LEDs positioned close together (such as within a watch). Additionally, blood vessels in the fingers (e.g., arteries, capillaries) are more readily accessible via LEDs than those in the wrist. Specifically, arteries in the wrist are located at the base of the wrist (e.g., the palmar side of the wrist), meaning that capillaries are accessible at the top of the wrist (e.g., the back of the wrist on the palmar side), where wearable watches and similar devices are typically worn. Accordingly, it has been found that using LEDs and other sensors within the ring 104 exhibits superior performance compared to wearable devices worn on the wrist, because the ring 104 has greater access to arteries (compared to capillaries), resulting in stronger signals and more valuable physiological data.

[0027] Electronic devices of system 100 (e.g., user equipment 106, wearable device 104) can be communicatively coupled to one or more servers 110 via wired or wireless communication protocols. For example, such as Figure 1 As shown, electronic devices (e.g., user device 106) can be communicatively coupled to one or more servers 110 via network 108. Network 108 can implement Transmission Control Protocol and Internet Protocol (TCP / IP) such as the Internet, or it can implement other network 108 protocols. The network connection between network 108 and the corresponding electronic device can facilitate data transmission via email, web, text messaging, mail, or any other suitable form of interaction within computer network 108. For example, in some implementations, a ring 104-a associated with a first user 102-a can be communicatively coupled to user device 106-a, wherein user device 106-a is communicatively coupled to server 110 via network 108. In additional or alternative cases, wearable device 104 (e.g., ring 104, watch 104) can be directly communicatively coupled to network 108.

[0028] System 100 can provide on-demand database services between user equipment 106 and one or more servers 110. In some cases, server 110 can receive data from user equipment 106 via network 108, and can store and analyze that data. Similarly, server 110 can provide data to user equipment 106 via network 108. In some cases, server 110 may be located in one or more data centers. Server 110 can be used for data storage, management, and processing. In some implementations, server 110 may provide a web-based interface to user equipment 106 via a web browser.

[0029] In some respects, system 100 can detect the duration of user 102's sleep and categorize the duration of user 102's sleep into one or more sleep stages (e.g., sleep stage classification). For example, as... Figure 1 As shown, user 102-a can be associated with wearable device 104-a (e.g., ring 104-a) and user device 106-a. In this example, ring 104-a can collect physiological data associated with user 102-a, including temperature, heart rate, HRV, respiratory rate, etc. In some aspects, the data collected by ring 104-a can be fed into a machine learning classifier, which is configured to determine the time period during which user 102-a is asleep (or previously asleep). Furthermore, the machine learning classifier can be configured to classify the time period into different sleep stages, including awake sleep, rapid eye movement (REM) sleep, light sleep (non-REM (NREM)), and deep sleep (NREM). In some aspects, the classified sleep stages can be displayed to user 102-a via the GUI of user device 106-a. The sleep stage classification can be used to provide user 102-a with feedback on the user's sleep patterns, such as recommended sleep times, recommended wake-up times, etc. Furthermore, in some implementations, the sleep stage classification technique described in this paper can be used to calculate scores for the corresponding user, such as sleep score, readiness score, etc.

[0030] In some respects, system 100 can leverage features derived from circadian rhythms to further improve physiological data collection, data processing procedures, and other techniques described herein. The term circadian rhythm can refer to the natural internal processes that regulate an individual's sleep-wake cycle, which repeats approximately every 24 hours. In this regard, the techniques described herein can utilize circadian rhythm regulation models to improve physiological data collection, analysis, and data processing. For example, a circadian rhythm regulation model, along with physiological data collected from user 102-a via wearable device 104-a, can be fed into a machine learning classifier. In this example, the circadian rhythm regulation model can be configured to "weight" or regulate physiological data collected throughout the user's natural, approximately 24-hour circadian rhythm. In some implementations, the system can initially start with a "baseline" circadian rhythm regulation model and can modify the baseline model using physiological data collected from each user 102 to generate a customized, personalized circadian rhythm regulation model specific to each respective user 102.

[0031] In some respects, System 100 can utilize other circadian rhythms to further improve the collection, analysis, and processing of physiological data through phases of these other rhythms. For example, if a weekly rhythm is detected within an individual's baseline data, the model can be configured to adjust the "weights" of the data according to the days within that week. Circadian rhythms that may require adjustment of the model in this manner include: 1) ultradian rhythms (faster than the day rhythm, including sleep cycles during sleep and oscillations in physiological variables measured during waking states ranging from less than an hour cycle to several hours cycle; 2) diurnal rhythms; 3) non-endogenous daily rhythms that are applied over diurnal rhythms, such as in a work schedule; 4) weekly rhythms, or other exogenously applied artificial time cycles (e.g., a 12-day rhythm can be used in a hypothetical culture with a "week" of 12 days); 5) multi-day ovarian rhythms in women and spermatogenesis rhythms in men; 6) lunar rhythms (associated with individuals living in low or no artificial light); and 7) seasonal rhythms.

[0032] Biorhythms are not always resting rhythms. For example, many women experience variability in ovarian cycle length between cycles, and even within a single user, it is not expected that superdial rhythms will occur at exactly the same time or cycle over several days. Thus, signal processing techniques sufficient to quantify frequency components while maintaining temporal resolution of these rhythms in physiological data can be used to improve the detection of these rhythms, assign phases of each rhythm to each moment measured, and thereby modify regulatory models and comparisons of time intervals. Biorhythm regulatory models and parameters can be added, in linear or nonlinear combinations as appropriate, to more accurately capture the dynamic physiological baseline of an individual or group of individuals.

[0033] Those skilled in the art will understand that one or more aspects of this disclosure can be implemented in system 100 to additionally or alternatively address problems beyond those described herein. Furthermore, various aspects of this disclosure can provide technical improvements to “conventional” systems or processes as described herein. However, the specification and drawings only include exemplary technical improvements derived from implementing aspects of this disclosure and therefore do not represent all technical improvements provided within the scope of the claims.

[0034] In some aspects, such as Figure 1 The wearable ring device 104 shown and described herein can be manufactured according to the manufacturing processes described herein to reduce the width, thickness, and overall size of the wearable ring device 104. For example, the wearable ring device 104 in system 100 may include an annular housing comprising an inner shell and an outer shell. A PCB for housing device sensors may be encapsulated within the annular housing located between the inner shell and the outer shell. In some cases, light emitting and light receiving components may be disposed on a first surface of the PCB and may extend through one or more openings in the inner shell such that the light emitting and light receiving components are substantially flush with the inner annular surface of the inner shell. By moving the light emitting and light receiving components upward into the openings in the inner shell, the PCB can be brought closer to the inner shell, thereby reducing the thickness of the wearable ring device 104.

[0035] Figure 2 An example of a system 200 supporting the form factor of a wearable ring device according to various aspects of this disclosure is shown. System 200 may implement or be implemented by system 100. Specifically, system 200 shows examples of a ring 104 (e.g., wearable device 104), a user device 106, and a server 110, as referenced. Figure 1 As described.

[0036] In some aspects, the ring 104 can be configured to be worn on a user's finger and, when worn on the user's finger, can determine one or more user physiological parameters. Examples of measurements and determinations may include, but are not limited to, user skin temperature, pulse waveform, respiratory rate, heart rate, HRV, blood oxygen level (SpO2), blood glucose level (e.g., glucose index), etc.

[0037] System 200 further includes user equipment 106 (e.g., a smartphone) that communicates with ring 104. For example, ring 104 may communicate wirelessly and / or wiredly with user equipment 106. In some implementations, ring 104 may send measured and processed data (e.g., temperature data, photoplethysmography (PPG) data, motion / accelerometer data, ring input data, etc.) to user equipment 106. User equipment 106 may also send data to ring 104, such as ring 104 firmware / configuration updates. User equipment 106 may process data. In some implementations, user equipment 106 may transmit data to server 110 for processing and / or storage.

[0038] Ring 104 may include a housing 205, which may include an inner housing 205-a and an outer housing 205-b. In some aspects, the housing 205 of ring 104 may store or otherwise include various components of the ring, including but not limited to device electronics, power sources (e.g., battery 210, and / or capacitors), one or more substrates (e.g., printable circuit boards) interconnecting the device electronics and / or power sources, etc. Device electronics may include device modules (e.g., hardware / software), such as: processing module 230-a, memory 215, communication module 220-a, power module 225, etc. Device electronics may also include one or more sensors. Example sensors may include one or more temperature sensors 240, PPG sensor assemblies (e.g., PPG system 235), and one or more motion sensors 245.

[0039] These sensors may include association modules (not shown) configured to communicate with corresponding components / modules of ring 104 and generate signals associated with the corresponding sensors. In some aspects, each of the components / modules of ring 104 may be communicatively coupled to each other via a wired or wireless connection. Furthermore, ring 104 may include additional and / or alternative sensors or other components configured to collect physiological data from the user, including light sensors (e.g., LEDs), pulse oximeters, etc.

[0040] Reference Figure 2 The ring 104 shown and described is provided for illustrative purposes only. Therefore, the ring 104 may include, for example... Figure 2Additional or alternative components, such as those shown, can be manufactured. Other rings 104 can be manufactured to provide the functionality described herein. For example, rings 104 with fewer components (e.g., sensors) can be manufactured. In a particular example, a ring 104 can be manufactured having a single temperature sensor 240 (or other sensor), a power supply, and device electronics configured to read the single temperature sensor 240 (or other sensor). In another particular example, the temperature sensor 240 (or other sensor) can be attached to a user's finger (e.g., using adhesive, wrapping, clamp, spring-loaded clamp, etc.). In this case, the sensor can be wired to another computing device, such as a wrist-worn computing device that reads the temperature sensor 240 (or other sensor). In other examples, rings 104 can be manufactured to include additional sensors and processing capabilities.

[0041] Housing 205 may include one or more housing 205 assemblies. Housing 205 may include an outer housing 205-b assembly (e.g., a housing) and an inner housing 205-a assembly (e.g., a molded part). Housing 205 may be included in... Figure 2 Additional components not explicitly shown (e.g., additional layers). For example, in some implementations, ring 104 may include one or more insulating layers that electrically insulate device electronics and other conductive materials (e.g., electrical traces) from housing 205-b (e.g., metal housing 205-b). Housing 205 may provide structural support for device electronics, battery 210, one or more substrates, and other components. For example, housing 205 may protect device electronics, battery 210, and one or more substrates from mechanical forces such as pressure and shock. Housing 205 may also protect device electronics, battery 210, and one or more substrates from water and / or other chemicals.

[0042] The housing 205-b can be made of one or more materials. In some implementations, the housing 205-b may include a metal, such as titanium, which provides strength and abrasion resistance at a relatively light weight. The housing 205-b may also be made of other materials, such as polymers. In some implementations, the housing 205-b can be both protective and decorative.

[0043] The inner housing 205-a can be configured to engage with a user's finger. The inner housing 205-a can be formed of a polymer (e.g., a medical-grade polymer) or other materials. In some implementations, the inner housing 205-a can be transparent. For example, the inner housing 205-a can be transparent to light emitted by a PPG light-emitting diode (LED). In some implementations, the inner housing 205-a assembly can be molded onto the outer housing 205-b. For example, the inner housing 205-a can include a polymer molded (e.g., injection molded) to fit into the metal casing of the outer housing 205-b.

[0044] Ring 104 may include one or more substrates (not shown). Device electronics and battery 210 may be included on one or more substrates. For example, device electronics and battery 210 may be mounted on one or more substrates. Example substrates may include one or more printed circuit boards (PCBs), such as flexible PCBs (e.g., polyimide). In some implementations, electronics / battery 210 may include surface-mount devices (e.g., surface mount technology (SMT) devices) on a flexible PCB. In some implementations, one or more substrates (e.g., one or more flexible PCBs) may include electrical traces providing electrical communication between device electronics. The electrical traces may also connect battery 210 to device electronics.

[0045] Device electronics, battery 210, and substrate can be arranged in various ways within ring 104. In some implementations, a substrate including the device electronics may be mounted along the bottom (e.g., lower half) of ring 104, such that sensors (e.g., PPG system 235, temperature sensor 240, motion sensor 245, and other sensors) engage with the underside of a user's finger. In these implementations, battery 210 may be included along the top portion of ring 104 (e.g., on another substrate).

[0046] The various components / modules of ring 104 may include functions (e.g., circuits and other components) within ring 104. A module may include any discrete and / or integrated electronic circuit components that implement analog and / or digital circuits capable of producing the functions attributed to the modules herein. For example, a module may include analog circuitry (e.g., amplifier circuitry, filter circuitry, analog-to-digital converter circuitry, and / or other signal conditioning circuitry). A module may also include digital circuitry (e.g., combinational or sequential logic circuitry, memory circuitry, etc.).

[0047] The memory 215 (memory module) of ring 104 may include any volatile, non-volatile, magnetic, or electrical dielectric, such as random access memory (RAM), read-only memory (ROM), non-volatile RAM (NVRAM), electrically erasable programmable ROM (EEPROM), flash memory, or any other memory device. Memory 215 may store any data described herein. For example, memory 215 may be configured to store data collected by the corresponding sensors and PPG system 235 (e.g., motion data, temperature data, PPG data). Furthermore, memory 215 may include instructions that, when executed by one or more processing circuits, cause the module to perform various functions belonging to the modules herein. The device electronics of ring 104 described herein are merely example device electronics. Therefore, the type of electronic components used to implement the device electronics may vary based on design considerations.

[0048] The functionality of the modules belonging to ring 104 described herein can be embodied in one or more processors, hardware, firmware, software, or any combination thereof. Describing different features as modules is intended to highlight different functional aspects and does not necessarily imply that these modules must be implemented by separate hardware / software components. Rather, the functionality associated with one or more modules can be performed by separate hardware / software components or integrated within common hardware / software components.

[0049] The processing module 230-a of ring 104 may include one or more processors (e.g., processing units), microcontrollers, digital signal processors, system-on-a-chip (SoC), and / or other processing devices. The processing module 230-a communicates with modules contained within ring 104. For example, the processing module 230-a may send / receive data to / from modules and other components (such as sensors) of ring 104. As described herein, modules may be implemented from various circuit components. Therefore, modules may also be referred to as circuits (e.g., communication circuits and power supply circuits).

[0050] Processing module 230-a can communicate with memory 215. Memory 215 may include computer-readable instructions that, when executed by processing module 230-a, cause processing module 230-a to perform various functions belonging to processing module 230-a herein. In some implementations, processing module 230-a (e.g., a microcontroller) may include additional features associated with other modules, such as communication functions provided by communication module 220-a (e.g., an integrated Bluetooth Low Energy transceiver) and / or additional onboard memory 215.

[0051] Communication module 220-a may include circuitry providing wireless and / or wired communication with user equipment 106 (e.g., communication module 220-b of user equipment 106). In some implementations, communication modules 220-a and 220-b may include wireless communication circuitry, such as Bluetooth circuitry and / or Wi-Fi circuitry. In some implementations, communication modules 220-a and 220-b may include wired communication circuitry, such as Universal Serial Bus (USB) communication circuitry. Using communication module 220-a, ring 104 and user equipment 106 may be configured to communicate with each other. Ring processing module 230-a may be configured to transmit / receive data to / from user equipment 106 via communication module 220-a. Example data may include, but is not limited to, motion data, temperature data, pulse waveform, heart rate data, HRV data, PPG data, and status updates (e.g., charging status, battery charge level, and / or ring 104 configuration settings). The ring's processing module 230-a can also be configured to receive updates (e.g., software / firmware updates) and data from the user equipment 106.

[0052] Ring 104 may include a battery 210 (e.g., a rechargeable battery 210). Example battery 210 may include a lithium-ion or lithium-polymer type battery 210, but various battery options are possible. Battery 210 can be wirelessly charged. In some implementations, ring 104 may include a power source other than battery 210, such as a capacitor. The power source (e.g., battery 210 or capacitor) may have a curved geometry that matches the curves of ring 104. In some aspects, the charger or other power source may include additional sensors that can be used to collect data in addition to or supplement the data collected by ring 104 itself. Furthermore, the charger or other power source of ring 104 may act as user equipment 106, in which case the charger or other power source of ring 104 may be configured to receive data from ring 104, store and / or process data received from ring 104, and communicate data between ring 104 and server 110.

[0053] In some aspects, ring 104 includes a power module 225 that controls the charging of battery 210. For example, power module 225 may engage with an external wireless charger that charges battery 210 when engaged with ring 104. The charger may include a reference structure that mates with a reference structure of ring 104 to create a specified orientation of ring 104 during charging. Power module 225 may also regulate the voltage of device electronics, regulate the power output to device electronics, and monitor the state of charge of battery 210. In some implementations, battery 210 may include a protection circuit module (PCM) that protects battery 210 from high-current discharge, overvoltage during charging, and undervoltage during discharging. Power module 225 may also include electrostatic discharge (ESD) protection.

[0054] One or more temperature sensors 240 may be electrically coupled to processing module 230-a. Temperature sensors 240 may be configured to generate temperature signals (e.g., temperature data) indicating the temperature read or sensed by the temperature sensors 240. Processing module 230-a may determine the temperature at the location of the user at the temperature sensor 240. For example, in ring 104, the temperature data generated by the temperature sensor 240 may indicate the user's temperature at the user's finger (e.g., skin temperature). In some implementations, the temperature sensor 240 may contact the user's skin. In other implementations, a portion of housing 205 (e.g., inner housing 205-a) may form a barrier (e.g., a thin thermally conductive barrier) between the temperature sensor 240 and the user's skin. In some implementations, the portion of ring 104 configured to contact the user's finger may have a thermally conductive portion and a thermally insulating portion. The thermally conductive portion conducts heat from the user's finger to the temperature sensor 240. The thermally insulating portion insulates portions of ring 104 (e.g., temperature sensor 240) from ambient temperature.

[0055] In some implementations, temperature sensor 240 can generate a digital signal (e.g., temperature data), which processing module 230-a can use to determine the temperature. As another example, if temperature sensor 240 includes a passive sensor, processing module 230-a (or temperature sensor 240 module) can measure the current / voltage generated by temperature sensor 240 and determine the temperature based on the measured current / voltage. Example temperature sensor 240 may include a thermistor (such as a negative temperature coefficient (NTC) thermistor) or other types of sensors, including resistors, transistors, diodes, and / or other electrical / electronic components.

[0056] Processing module 230-a can sample the user's temperature over time. For example, processing module 230-a can sample the user's temperature based on a sampling rate. An example sampling rate might include one sample per second, but processing module 230-a can be configured to sample the temperature signal at other sampling rates, higher or lower than one sample per second. In some implementations, processing module 230-a can continuously sample the user's temperature throughout the day and night. Sampling at a sufficient rate (e.g., one sample per second) throughout the day can provide sufficient temperature data for the analysis described herein.

[0057] Processing module 230-a can store the sampled temperature data in memory 215. In some implementations, processing module 230-a can process the sampled temperature data. For example, processing module 230-a can determine the average temperature value over a time period. In one example, processing module 230-a can determine the average temperature value for a minute by summing all temperature values ​​collected per minute and dividing by the number of samples (e.g., quantity) in that minute. In a specific example of sampling temperature at one sample per second, the average temperature could be the sum of all sampled temperatures for one minute divided by sixty seconds. Memory 215 can store the average temperature value over time. In some implementations, memory 215 can store the average temperature (e.g., one per minute) instead of the sampled temperatures to save memory 215.

[0058] The sampling rate, which can be stored in memory 215, can be configurable. In some implementations, the sampling rate can be the same throughout the day and night. In other implementations, the sampling rate can vary throughout the day / night. In some implementations, ring 104 can filter / reject temperature readings, such as large spikes in temperature that do not indicate physiological changes (e.g., temperature spikes from a hot shower). In some implementations, ring 104 can filter / reject temperature readings that may be unreliable due to other factors, such as excessive movement during exercise (e.g., as indicated by motion sensor 245).

[0059] Ring 104 (e.g., a communication module) can transmit sampled temperature data and / or average temperature data to user equipment 106 for storage and / or further processing. User equipment 106 can transmit sampled temperature data and / or average temperature data to server 110 for storage and / or further processing.

[0060] Although ring 104 is shown as including a single temperature sensor 240, ring 104 may include multiple temperature sensors 240 in one or more locations, such as arranged along the inner housing 205-a near the user's finger. In some implementations, the temperature sensor 240 may be a standalone temperature sensor 240. Additionally or alternatively, one or more temperature sensors 240 may be included with other components (e.g., packaged together with other components), such as with an accelerometer and / or a processor.

[0061] Processing module 230-a can acquire and process data from multiple temperature sensors 240 in a manner similar to that described with respect to a single temperature sensor 240. For example, processing module 230 can sample, average, and store temperature data from each of the multiple temperature sensors 240 separately. In other examples, processing module 230-a can sample the sensors at different rates and average / store different values ​​for different sensors. In some implementations, processing module 230-a can be configured to determine a single temperature based on the average of two or more temperatures determined by two or more temperature sensors 240 at different locations on the finger.

[0062] Temperature sensors 240 on ring 104 can acquire the distal temperature at a user's finger (e.g., any finger). For example, one or more temperature sensors 240 on ring 104 can acquire the user's temperature from the underside of the finger or different locations on the finger. In some implementations, ring 104 can continuously acquire distal temperatures (e.g., at a sampling rate). While distal temperatures measured by ring 104 at a finger are described herein, other devices can measure temperatures at the same / different locations. In some cases, the distal temperature measured at a user's finger may differ from the temperature measured at the user's wrist or other external body locations. Furthermore, the distal temperature measured at a user's finger (e.g., "shell" temperature) may differ from the user's core temperature. Thus, ring 104 can provide a useful temperature signal that may not have been acquired at other internal / external locations of the body. In some cases, continuous temperature measurements at the finger can capture temperature fluctuations (e.g., small or large fluctuations) that may not be apparent in the core temperature. For example, continuous temperature measurements at the fingertips can capture temperature fluctuations minute by minute or hour by hour, providing additional insights that other temperature measurements in other parts of the body may not offer.

[0063] Ring 104 may include a PPG system 235. The PPG system 235 may include one or more light emitters that emit light. The PPG system 235 may also include one or more light receivers that receive light emitted by the one or more light emitters. The light receivers may generate a signal indicating the amount of light received by the light receivers (hereinafter referred to as a "PPG" signal). The light emitters may illuminate an area of ​​the user's finger. The PPG signal generated by the PPG system 235 may indicate blood perfusion in the illuminated area. For example, the PPG signal may indicate changes in blood volume in the illuminated area caused by the user's pulse pressure. Processing module 230-a may sample the PPG signal and determine the user's pulse waveform based on the PPG signal. Processing module 230-a may determine various physiological parameters, such as the user's respiratory rate, heart rate, HRV, oxygen saturation, and other circulatory parameters, based on the user's pulse waveform.

[0064] In some implementations, the PPG system 235 can be configured as a reflective PPG system 235, wherein one or more light receivers receive transmitted light reflected from an area of ​​the user's finger. In some implementations, the PPG system 235 can be configured as a transmissive PPG system 235, wherein one or more light emitters and one or more light receivers are arranged opposite each other such that light is directly transmitted through a portion of the user's finger to one or more light receivers.

[0065] The number (e.g., quantity) and ratio of transmitters and receivers included in the PPG system 235 can vary. Example light transmitters may include light-emitting diodes (LEDs). Light transmitters may emit light in the infrared spectrum and / or other spectra. Example light receivers may include, but are not limited to, photosensors, phototransistors, and photodiodes. Light receivers can be configured to generate PPG signals in response to wavelengths received from the light transmitter. The positions of the transmitters and receivers can be varied. Furthermore, a single device may include a reflective and / or transmissive PPG system 235.

[0066] In some implementations, Figure 2 The PPG system 235 shown may include a reflective PPG system 235. In these implementations, the PPG system 235 may include a centrally located optical receiver (e.g., at the bottom of ring 104) and two optical emitters located on each side of the optical receiver. In this implementation, the PPG system 235 (e.g., the optical receiver) may generate a PPG signal based on light received from one or both of these optical emitters. In other implementations, further placements, combinations, and / or configurations of one or more optical emitters and / or optical receivers are considered.

[0067] Processing module 230-a can control one or both of the optical emitters to emit light while sampling the PPG signal generated by the optical receiver. In some implementations, processing module 230-a can cause the optical emitter with a stronger received signal to emit light while sampling the PPG signal generated by the optical receiver. For example, when the PPG signal is sampled at a sampling rate (e.g., 250 Hz), the selected optical emitter can emit light continuously.

[0068] Sampling the PPG signal generated by the PPG system 235 can produce a pulse waveform, which may be referred to as "PPG". The pulse waveform can indicate the blood pressure pair (vs) time over multiple cardiac cycles. The pulse waveform may include peak values ​​indicating cardiac cycles. Furthermore, the pulse waveform may include respiratory-induced changes that can be used to determine respiratory rate. In some implementations, the processing module 230-a may store the pulse waveform in memory 215. The processing module 230-a may process the pulse waveform when it is generated and / or when it is retrieved from memory 215 to determine the user physiological parameters described herein.

[0069] Processing module 230-a can determine a user's heart rate based on a pulse waveform. For example, processing module 230-a can determine the heart rate (e.g., in heartbeats per minute) based on the time between peaks in the pulse waveform. The time between peaks may be referred to as the inter-beat interval (IBI). Processing module 230-a can store the determined heart rate value and IBI value in memory 215.

[0070] Processing module 230-a can determine the HRV over time. For example, processing module 230-a can determine the HRV based on changes in the IBI. Processing module 230-a can store the HRV value over time in memory 215. Furthermore, processing module 230-a can determine the user's respiratory rate over time. For example, processing module 230-a can determine the respiratory rate based on the user's IBI value over a time period using frequency modulation, amplitude modulation, or baseline modulation. The respiratory rate can be calculated as breaths per minute or as another respiratory rate (e.g., breaths every 30 seconds). Processing module 230-a can store the user's respiratory rate value over time in memory 215.

[0071] Ring 104 may include one or more motion sensors 245, such as one or more accelerometers (e.g., 6-D accelerometers) and / or one or more gyroscopes. Motion sensors 245 may generate motion signals indicating the motion of the sensors. For example, ring 104 may include one or more accelerometers that generate acceleration signals indicating the acceleration of the accelerometers. As another example, ring 104 may include one or more gyroscope sensors that generate gyroscope signals indicating angular motion (e.g., angular velocity) and / or orientation changes. Motion sensors 245 may be included in one or more sensor packages. An example accelerometer / gyroscope sensor is the Bosch BM1160 inertial microelectromechanical system (MEMS) sensor, which can measure angular rate and acceleration on three vertical axes.

[0072] Processing module 230-a can sample the motion signal at a sampling rate (e.g., 50 Hz) and determine the motion of ring 104 based on the sampled motion signal. For example, processing module 230-a can sample an acceleration signal to determine the acceleration of ring 104. As another example, processing module 230-a can sample a gyroscope signal to determine angular motion. In some implementations, processing module 230-a can store motion data in memory 215. The motion data may include sampled motion data and motion data calculated based on the sampled motion signal (e.g., acceleration and angle values).

[0073] Ring 104 can store various types of data described herein. For example, ring 104 can store temperature data, such as raw sampled temperature data and calculated temperature data (e.g., average temperature). As another example, ring 104 can store PPG signal data, such as pulse waveforms and data calculated based on pulse waveforms (e.g., heart rate values, IBI values, HRV values, and respiratory rate values). Ring 104 can also store motion data, such as sampled motion data indicating linear and angular motion.

[0074] Ring 104 or other computing devices can calculate and store additional values ​​based on the sampled / computed physiological data. For example, processing module 230 can calculate and store various metrics such as sleep metrics (e.g., sleep score), activity metrics, and readiness metrics. In some implementations, the additional value / metric may be referred to as a "derived value." Ring 104 or other computing / wearable devices can calculate various values / metrics related to movement. Example derived values ​​of movement data may include, but are not limited to, movement count values, regularity values, intensity values, metabolic equivalence (MET) of task values, and orientation values. Movement counts, regularity values, intensity values, and MET can indicate the amount of user movement over time (e.g., speed / acceleration). Orientation values ​​can indicate how ring 104 is oriented on the user's fingers and whether ring 104 is worn on the left or right hand.

[0075] In some implementations, motion counts and regularity values ​​can be determined by counting the number (e.g., quantity) of acceleration peaks over one or more time periods (e.g., one or more time periods of 30 seconds to 1 minute). Intensity values ​​can indicate the number of motions and the associated intensity of the motions (e.g., acceleration value). Intensity values ​​can be categorized as low, medium, and high, depending on the associated threshold acceleration value. MET can be determined based on the intensity of motions during a time period (e.g., 30 seconds), the regularity / irregularity of the motions, and the number of motions associated with different intensities.

[0076] In some implementations, processing module 230-a can compress the data stored in memory 215. For example, processing module 230-a can delete sampled data after performing calculations based on the sampled data. As another example, processing module 230-a can average data over a longer time period to reduce the number of stored values. In a particular example, if the user's average temperature over one minute is stored in memory 215, processing module 230-a can calculate the average temperature over a five-minute time period for storage and then erase the one-minute average temperature data. Processing module 230-a can compress data based on various factors, such as the total amount of memory 215 used / available and / or the time elapsed since the last time loop 104 transmitted the data to user equipment 106.

[0077] While a user's physiological parameters can be measured by sensors included on ring 104, other devices can also measure these parameters. For example, while a user's temperature can be measured by temperature sensor 240 included in ring 104, other devices can also measure it. In some examples, other wearable devices (e.g., wrist devices) may include sensors for measuring a user's physiological parameters. Furthermore, medical devices such as external medical devices (e.g., wearable medical devices) and / or implantable medical devices can measure a user's physiological parameters. The techniques described herein can be implemented using one or more sensors on any type of computing device.

[0078] Physiological measurements can be acquired continuously throughout the day and / or night. In some implementations, physiological measurements can be acquired during various parts of the day and / or night. In some implementations, physiological measurements can be acquired in response to determining that the user is in a specific state (e.g., active state, resting state, and / or sleeping state). For example, ring 104 can perform physiological measurements during rest / sleep states to obtain cleaner physiological signals. In one example, ring 104 or other devices / systems can detect when the user is resting and / or sleeping and acquire physiological parameters (e.g., temperature) of the detected state. When the user is in other states, the devices / systems can use rest / sleep physiological data and / or other data to implement the techniques of this disclosure.

[0079] In some implementations, as described previously herein, ring 104 may be configured to collect, store, and / or process data, and may transfer any data described herein to user device 106 for storage and / or processing. In some aspects, user device 106 includes wearable application 250, operating system (OS), web browser application (e.g., web browser 280), one or more additional applications, and GUI 275. User device 106 may further include other modules and components, including sensors, audio devices, haptic feedback devices, etc. Wearable application 250 may include examples of applications (e.g., “apps”) that can be installed on user device 106. Wearable application 250 may be configured to acquire data from ring 104, store the acquired data, and process the acquired data as described herein. For example, wearable application 250 may include user interface (UI) module 255, acquisition module 260, processing module 230-b, communication module 220-b, and storage module (e.g., database 265) configured to store application data.

[0080] The various data processing operations described herein can be performed by ring 104, user equipment 106, server 110, or any combination thereof. For example, in some cases, data collected by ring 104 may be preprocessed and transmitted to user equipment 106. In this example, user equipment 106 may perform some data processing operations on the received data, transmit the data to server 110 for data processing, or both. For example, in some cases, user equipment 106 may perform processing operations that rely on relatively low processing power and / or operations that rely on relatively low latency, while user equipment 106 may transmit data to server 110 for processing operations that rely on relatively high processing power and / or operations that allow for relatively high latency.

[0081] In some aspects, the ring 104, user device 106, and server 110 of system 200 can be configured to assess a user's sleep patterns. Specifically, the corresponding components of system 200 can be used to collect data from the user via ring 104 and generate one or more scores (e.g., sleep score, readiness score) for the user based on the collected data. For example, as previously noted herein, the ring 104 of system 200 can be worn by the user to collect data from the user, including temperature, heart rate, HRV, etc. The data collected by ring 104 can be used to determine when the user fell asleep to assess the user's sleep for a given "sleep day." In some aspects, a score can be calculated for each corresponding sleep day, such that a first sleep day is associated with a first set of scores, and a second sleep day is associated with a second set of scores. The score for each corresponding sleep day can be calculated based on data collected by ring 104 during the corresponding sleep day. The scores can include, but are not limited to, sleep scores, readiness scores, etc.

[0082] In some cases, a "sleep day" can be aligned with a traditional calendar day, allowing a given sleep day to extend from midnight to midnight on the corresponding calendar day. In other cases, a sleep day can be offset relative to a calendar day. For example, a sleep day can extend from 6:00 PM (6:00 PM) on a calendar day to 6:00 PM (6:00 PM) on a subsequent calendar day. In this example, 6:00 PM can serve as a "deadline," where data collected from the user before 6:00 PM is counted for the current sleep day, and data collected from the user after 6:00 PM is counted for subsequent sleep days. Because most individuals sleep the most at night, offsetting the sleep day relative to the calendar day allows System 200 to assess the user's sleep patterns in a manner consistent with their sleep schedule. In some cases, users may be able to selectively adjust (e.g., via a GUI) the timing of their sleep day relative to the calendar day, aligning the sleep day with the duration of the corresponding user's typical sleep.

[0083] In some implementations, a user's total score for each corresponding day (e.g., sleep score, readiness score) can be determined / calculated based on one or more "contributors," "factors," or "contribution factors." For example, a user's total sleep score can be calculated based on a set of contributors, including: total sleep, efficiency, restfulness, REM sleep, deep sleep, wait time, timing, or any combination thereof. The sleep score can include any number of contributors. A "total sleep" contributor can refer to the sum of all sleep periods on a sleep day. A "efficiency" contributor can reflect the percentage of time spent asleep compared to the time spent waking up while sleeping, and can be calculated using the average efficiency of the long sleep periods (e.g., the main sleep period) of the sleep day, weighted by the duration of each sleep period. A "restfulness" contributor can indicate how restful a user's sleep is, and can be calculated using the average of all sleep periods of the sleep day, weighted by the duration of each period. Tranquility contributors can be based on “wake-up count” (e.g., the sum of all wake-ups detected during different sleep periods when the user wakes up), excessive movement, and “get-out count” (e.g., the sum of all get-outs detected during different sleep periods when the user gets out of bed).

[0084] A “REM sleep” contributor can refer to the sum of REM sleep durations across all sleep segments on a sleep day that includes REM sleep. Similarly, a “deep sleep” contributor can refer to the sum of deep sleep durations across all sleep segments on a sleep day that includes deep sleep. A “waiting time” contributor can represent how long it takes a user to fall asleep (e.g., average, median, longest) and can be calculated using the average of long sleep segments between sleep days, weighted by the duration of each segment and the number of such segments (e.g., combining one or more given sleep stages can be its own contributor or can be weighted by other contributors). Finally, a “timed” contributor can refer to the relative timed sleep segments within a sleep day and / or calendar day and can be calculated using the average of all sleep segments on a sleep day weighted by the duration of each segment.

[0085] As another example, a user's overall readiness score can be calculated based on a set of contributors, including: sleep, sleep balance, heart rate, HRV balance, recovery index, temperature, activity, activity balance, or any combination thereof. The readiness score can include any number of contributors. A "sleep" contributor can refer to the combined sleep score of all sleep periods within a sleep day. A "sleep balance" contributor can refer to the cumulative duration of all sleep periods within a sleep day. Specifically, sleep balance can indicate to a user whether the sleep a user has taken over a certain period (e.g., the past two weeks) is in line with the user's needs. Typically, adults need 7-9 hours of sleep per night to maintain health, alertness, and optimal mental and physical performance. However, occasional nights with poor sleep are common, so sleep balance contributors consider long-term sleep patterns to determine whether each user's sleep needs are being met. A "resting heart rate" contributor can indicate the lowest heart rate from the longest sleep period (e.g., the main sleep period) and / or the lowest heart rate from a nap following the main sleep period.

[0086] Continuing to reference the "contributors" (e.g., factors, contributing factors) of the readiness score, the "HRV balance" contributor can indicate the highest average HRV from the main sleep period and naps that occur after the main sleep period. The HRV balance contributor helps users track their recovery status by comparing their HRV trend over a first time period (e.g., two weeks) with the average HRV over a second, longer time period (e.g., three months). The "recovery index" contributor can be calculated based on the longest sleep period. The recovery index measures how long it takes for a user's resting heart rate to stabilize during the night. A very good sign of recovery is that the user's resting heart rate stabilizes during the first half of the night (at least six hours before the user wakes up), leaving time for the body to recover the next day. If the user's highest temperature during a nap is at least 0.5°C higher than the highest temperature during the longest sleep period, the "body temperature" contributor can be calculated based on the longest sleep period (e.g., the main sleep period) or based on naps that occur after the longest sleep period. In some aspects, the ring can measure the user's body temperature while the user is asleep, and the system 200 can display the user's average temperature relative to the user's baseline temperature. If a user's body temperature is outside their normal range (e.g., clearly above or below 0.0), the body temperature contributor can be highlighted (e.g., put into "attention" status) or otherwise generate an alert for the user.

[0087] In some respects, Figure 2The wearable ring device 104 shown and described herein can be manufactured according to the manufacturing processes described herein to reduce the width, thickness, and overall size of the wearable ring device 104. For example, the wearable ring device 104 in system 200 may include an annular housing comprising an inner shell and an outer shell. A PCB for housing device sensors may be encapsulated within the annular housing located between the inner shell and the outer shell. In some cases, light emitting and light receiving components may be disposed on a first surface of the PCB and may extend through one or more openings in the inner shell such that the light emitting and light receiving components are substantially flush with the inner annular surface of the inner shell. By moving the light emitting and light receiving components upward into the openings in the inner shell, the PCB can be brought closer to the inner shell, thereby reducing the thickness of the wearable ring device 104.

[0088] Figure 3 Examples of the external dimensions of a wearable ring device 300 according to various aspects of this disclosure are shown. Aspects of the wearable ring device 300 may be implemented by or in combination with aspects of system 100, system 200, or both. For example, Figure 3 The wearable ring device 300 shown may include reference Figure 1 and Figure 2 An example of the wearable ring device 104 shown and described.

[0089] exist Figure 3 The wearable ring device 300 is shown in three different views 305. The first view 305-a shows a perspective view of the wearable ring device 300. The second view 305-b depicts a cross-sectional view of the wearable ring device 300 without filler material (e.g., before the molding process of injecting filler material into the ring). Finally, the third view 305-c depicts a cross-sectional view of the wearable ring device 300 with filler material (e.g., after the molding process of injecting filler material into the ring).

[0090] like Figure 3 As shown, the wearable ring device 300 may include an annular housing 310, which includes an inner shell 315 and an outer shell 320, which may be examples of an inner shell 205-a and an outer shell 205-b, respectively. The inner shell 315 may define an inner annular surface (e.g., an inner circumferential surface) of the wearable ring device 300, and the outer shell 320 may define an outer annular surface of the wearable ring device 300. The inner shell 315 and the outer shell 320 may be made of the same or different materials, such as metallic materials (e.g., titanium), plastic materials, epoxy materials, or any combination thereof.

[0091] In some cases, the PCB 330 may be disposed within the cavity of the annular housing 310 located between the inner housing 315 and the outer housing 320. As shown in views 305-a and 305-c, a filler material may be injected into the annular housing to at least partially fill the cavity and secure the PCB 330 to the inner housing 315, the outer housing 320, or both. In this case, the filler material 325 may secure the outer housing 320 to the inner housing 315. Alternatively, the annular housing 310 may also include a side cover (e.g., annular fitting) inserted into a groove between the inner housing 315 and the outer housing 320, wherein the side cover (e.g., annular fitting) binds the inner housing 315 and the outer housing 320 together.

[0092] PCB 330 may include multiple electronic components. For example, PCB 330 may include one or more light emitting components (e.g., light-emitting diodes (LEDs) 335) and light receiving components (e.g., photodetectors (PDs) 340), which are disposed on a first surface of PCB 330. PCB 330 may also include one or more additional electronic components (e.g., accelerometers), which are disposed on a second surface of PCB 330 opposite to the first surface.

[0093] In some aspects, as shown in first view 305-a, the inner surface of the inner housing 315 may include one or more openings configured to receive LEDs 335 and PDs 340 of the PCB 330. In some cases, LEDs 335 and PDs 340 may extend into the openings such that the top surfaces of LEDs 335 and / or PDs 340 are substantially flush with the inner annular surface of the inner housing 315. By moving LEDs 335 and PDs 340 upward into the openings (rather than recessed into the openings), aspects of this disclosure allow the PCB 330 to move closer to (e.g., contact) the inner housing 315, thereby reducing the thickness and size of the wearable ring device 300. Furthermore, moving all other electronic components (except those intended to contact user tissue, such as LEDs 335, PDs 340, temperature sensors, etc.) to the back of the PCB 330 allows the PCB 330 to move closer to the inner housing 315, thereby reducing the thickness of the wearable ring device 300.

[0094] As shown in first view 305-a, the inner annular surface of the inner housing 315 may include a curved region (e.g., a region adjacent to the curved battery 350) and one or more planar regions. In some cases, one or more openings (and corresponding LEDs 335 and PDs 340) may be located within or adjacent to one or more planar regions. Similarly, the PCB 330 may include curved portions corresponding to the curved regions of the inner surface (e.g., located within the curved regions of the inner surface) and one or more planar portions corresponding to the curved regions of the inner surface (e.g., located within the curved regions of the inner surface). In this case, LEDs 335 and PDs 340 may be located on the planar portions of the PCB 330 such that LEDs 335 and PDs 340 are aligned with openings located within the planar regions of the inner annular surface of the inner housing 315. In some cases, the planar regions of the inner housing 315 may allow the PCB 330 to be positioned to fit against or be close to the inner housing 315. In other words, including a planar region in the inner housing 315 allows the PCB 330 to be positioned close to the inner housing 315, particularly around the LED 335 and PD 340. Therefore, including the planar region facilitates further movement of the LED 335 and PD 340 into the openings, thereby allowing the PCB 330 to move closer to the inner housing 315 and reducing the thickness of the wearable ring device 300. In other cases, the LED 335 and PD 340 may also be additionally or alternatively positioned on / within a curved area of ​​the PCB 330 / inner housing 315.

[0095] In some cases, PCB 330 may include an adhesive that helps couple PCB 330 to the inner housing 315. Thus, at least a portion of PCB 330 may be in contact with the inner housing 315. In some cases, PCB 330 may include a light-shielding layer disposed between LED 335 and PD 340, which helps prevent stray light from emanating from LED 335 and PD 340 within the cavity of the annular housing 310.

[0096] In some aspects, the wearable ring device 300 may include one or more optical lenses 345 for covering the LED 335 and / or PD 340. For example, as shown in first view 305-a, the optical lenses 345 may be disposed in one or more openings of the inner housing 315 (e.g., substantially filling one or more openings of the inner housing 315). In some cases, the optical lenses 345 may include convex lenses extending from the inner annular surface of the inner housing 315. The optical lenses 345 may be formed by surface mount technology (SMT) processes or other molding processes.

[0097] In some cases, the optical lens 345 can be formed over the LED 335 and PD 340 using a separate molding process different from the molding process used for injecting / molding the filler material 325. In this regard, the optical lens 345 can be made of a different material than the filler material 325. For example, the optical lens can be made of a (basically) transparent material, allowing light to pass through one or more openings, while the filler material 325 can include an opaque material. Figure 3 As shown, the optical lens 345 can be formed to include one or more facets. In some cases, each optical lens 345 can be formed or molded independently of each other. Therefore, the shape of each optical lens 345 can be the same as or different from each other. For example, the shape of each optical lens 345 can be customized based on whether the optical lens 345 is above the LED 335 or the PD 340, based on the position of the optical lens 345 in the inner shell 315, based on the size or shape of the corresponding opening, or any combination of the above factors. In this respect, the optical lens 345 can be customized to achieve specific optical and / or measurement characteristics of the wearable ring device 300. For example, the optical lens 345 can be manufactured separately for each LED 335 and / or PD 340 to help focus the light emitted by the LED 335 in a specific direction (e.g., to illuminate a specific PD 340 or a specific physiological structure) and to help receive light from a specific direction at the PD 340 (e.g., to minimize stray light).

[0098] In some aspects, the optical lens 345 may be formed above the LED 335 and PD 340 before or after the PCB 330 is inserted into the inner housing 315. For example, according to a first embodiment, the optical lens 345 may be molded onto the PCB 330, and then the PCB 330 is inserted into the inner housing 315 such that the molded / formed optical lens 345 is inserted into (and substantially fills) one or more openings in the inner housing 315. The first embodiment for forming the optical lens 345 will be described in detail below. Figures 4 to 7 Further illustration and description are provided below.

[0099] In contrast, according to the second embodiment, the PCB 330 can be coupled to the inner housing 315, such that the LED 335 and PD 340 are inserted into one or more openings in the inner housing 315. Subsequently, a molding process can be used to form / mold the optical lens 345 onto the openings and the LED 335 / PD 340. In this example, the molding process can effectively fill the openings (and cover the LED 335 and PD 340) with the material used to form the optical lens 345. The second embodiment for forming the optical lens 345 will... Figure 5 and Figure 8 Further illustration and description are provided below.

[0100] Figure 4 An example of a lens molding process 400 for supporting the form factor of a wearable ring device according to various aspects of this disclosure is shown. Aspects of the lens molding process 400 can be implemented in or by various aspects of system 100, system 200, wearable ring device 300, or any combination thereof. In particular, Figure 4 The lens molding process 400 shown illustrates an example of a first embodiment of forming an optical lens 345 on a PCB 330.

[0101] like Figure 4 As shown and as previously described, the PCB 330 of the wearable ring device 300 may include one or more LEDs 335 and one or more PDs 340, which are coupled to a first surface of the PCB 330. The PCB 330 may also include one or more additional electronic components 410 coupled to a second surface of the PCB 330 opposite to the first surface. As described herein, coupling the LEDs 335 and PDs 340 (and / or other components intended to be in close contact with the user's tissue, such as a temperature sensor) can be achieved by positioning the LEDs 335 and PDs 340 within openings in the inner housing 315, bringing the PCB 330 close to the inner housing 315 of the wearable ring device 300. That is, the LEDs 335 and PDs 340 can be positioned within openings, thereby bringing the first surface of the PCB 330 into contact with the inner housing 315. In contrast, other electronic components 410 that are not intended to be in close contact with the user's tissue, such as accelerometers, gyroscopes, etc., can be placed on the second surface of the PCB 330.

[0102] In some cases, one or more cavities 415 (e.g., frames) can be formed around the LED 335 and PD 340 on the first surface of the PCB 330. For example, Figure 4 The first view 405-a shows an independent cavity 415 formed around each corresponding LED 335 and PD 340, while the second view 405-b shows a single cavity 415 formed integrally around the LED 335 and PD 340. The cavity 415 (e.g., a frame) can effectively form a "well-like structure" in which an optical lens 345 can be formed. In some cases, the cavity 415 (frame) can be made of a flexible material, such as soft foam or shock-absorbing material, to mitigate tolerances during the molding process of the optical lens 345.

[0103] In other cases, the optical lens 345 can be formed directly on the surface of the PCB 330 without the use of the cavity 415. In other words, in some cases, the optical lens 345 can be formed on the PCB 330 without any physical cavity 415 or frame. In this case, the filling area of ​​the optical lens 345 (e.g., the shape / area of ​​the optical lens 345) can be controlled in other ways, such as by using materials exhibiting different surface energies on the surface of the PCB 330, texturing (e.g., laser processing), printing, etc.

[0104] like Figure 4 As shown, optical lenses 345 can be formed above LEDs 335 and PDs 340. For example, one or more molds can be placed above a cavity 415, wherein material for the optical lenses 345 is injected into the molds, substantially filling the cavity 415, and forming the optical lenses 345 above the LEDs 335 / PDs 340. In some cases, each optical lens 345 can be formed or molded independently of each other. Optical lenses 345 can be formed together or individually (e.g., through one or more independent molding processes). In other words, the molds, molding processes, and / or materials used to form each optical lens 345 can be different from each phase optical lens 345, or can be different from each phase optical lens 345. For example, optical lenses 345 can be formed with different properties, different numbers of facets, etc. As previously mentioned, by forming the optical lens 345 separately and / or using different molds or materials, the optical characteristics of the LED 335, PD 340, and / or wearable ring device 300 can be customized and tailored, which may help improve the acquisition of physiological data.

[0105] In some cases, the optical lens 345 can be pre-cured by light. When each optical lens 345 is molded individually, each optical lens 345 can be pre-cured by light before molding the next optical lens 345. In some aspects, after all the optical lenses 345 have been formed (and pre-cured), the wearable ring device 300 can be placed in an oven for final heat curing.

[0106] According to the first embodiment for forming the optical lens 345, after the optical lens 345 is formed on the PCB 330 (as shown in the first embodiment), the optical lens 345 is formed on the PCB 330. Figure 4As shown, the PCB 330 can be coupled to the inner housing 315 of the wearable ring device 300, such that the LED 335 and PD 340 (and the optical lens 345) are inserted into one or more openings in the inner housing 315. The PCB 330 may include one or more alignment features 420 for engaging with alignment features in the inner housing 315 to ensure proper orientation of the PCB 330 within the inner housing 315. Specifically, the PCB 330 may be coupled to the inner housing 315 such that the top surfaces of the LED 335 and / or PD 340 are substantially flush with (or even extend beyond) the inner annular surface of the inner housing 315. Therefore, the optical lens 345 may extend beyond the inner surface of the inner housing 315. Furthermore, the optical lens 345 may be formed to substantially fill the entire space of the opening. In some cases, the surfaces of the PCB 330 and / or the cavity 415 may include an adhesive material for bonding with the inner housing 315, thereby forming a waterproof seal around the opening. In some cases, the inner housing 315 may include one or more recesses surrounding the opening, these recesses being configured to receive the cavity 415, thereby allowing the LED 335 / PD 340 to be inserted into the opening and allowing the PCB 330 to contact the inner housing 315 around the opening / lens 345 (e.g. Figure 5 (As further shown in the diagram). In other or alternative embodiments, the cavity 415 may be removed after the optical lens 345 is formed and before the PCB 330 is attached to the inner housing 315.

[0107] According to the first embodiment, after the PCB 330 with optical lens 345 is inserted into the inner housing 315, a second molding or injection process can be performed to fill the cavity of the annular housing 310 with filler material 325. The filler material 325 can be configured to at least partially fill the cavity and secure the PCB 330 to the inner housing 315, the outer housing 320, or both. Alternatively, the PCB 330 can be secured to the inner housing 315, the outer housing 320, or both by using a mechanical locking structure, side cover, etc., thereby securing it inside the annulus without using the second molding process. For example, the PCB 330 can be slid into a groove or other mechanical structure in the inner housing 315 to secure the PCB 330 within the inner housing 315.

[0108] Figure 5An example of a lens molding process 500 for supporting the form factor of a wearable ring device according to various aspects of this disclosure is shown. Aspects of lens molding processes 500-a and 500-b may be implemented by aspects of system 100, system 200, wearable ring device 300, lens molding process 400, or any combination thereof, or by aspects of system 100, system 200, wearable ring device 300, lens molding process 400, or any combination thereof.

[0109] Specifically, the first lens molding process 500-a illustrates an example of a first embodiment of forming an optical lens 345 onto a PCB 330, as shown below. Figure 4 As shown and described above, according to the first embodiment, an optical lens 345 can be formed on the PCB 330 via one or more cavities 415 before the PCB 330 is coupled to the inner housing 315. In this case, the optical lens 345 can substantially fill one or more openings in the inner housing 315, and the surfaces of the cavity 415 and / or the PCB 330 can include adhesive material or other substances to form a waterproof seal with the inner housing 315 around the openings. In some cases, as shown in the first lens molding process 500-a, the inner housing 315 can include one or more recesses surrounding the openings, these recesses being configured to receive the cavity 415, thereby allowing the LED 335 / PD 340 to be inserted into the openings and allowing the PCB 330 to contact the inner housing 315 around the openings / lens 345 (e.g., Figure 5 (As further shown). In other or alternative embodiments, the cavity 415 may be removed after the optical lens 345 is formed and before the PCB 330 is attached to the inner housing 315.

[0110] In contrast, the second lens molding process 500-b illustrates an example of forming an optical lens 345 on the PCB 330 according to the second embodiment. Specifically, compared to the first lens molding process 500-a (in which the optical lens 345 is molded on the PCB 330 before the PCB 330 is inserted into the inner housing 315), the second lens molding process 500-b can be performed after the PCB 330 is inserted into the inner housing 315 to form the optical lens 345.

[0111] For example, see Figure 5In the second lens molding process 500-b shown, the PCB 330 may include one or more LEDs 335 and PDs 340 disposed on a first surface of the PCB 330. The PCB may also include other electronic components 410 disposed on a second surface of the PCB 330. According to the first embodiment, the PCB 330 can be inserted into the inner housing 315 such that the surfaces of the LEDs 335 / PDs 340 are substantially flush with or extend beyond the inner surface of the inner housing 315. Subsequently, an optical lens 345 can be formed over the opening and the LEDs 335 / PDs 340. For example, a mold can be placed over the opening of the inner housing 315, and material can be injected into the mold such that the material substantially fills the opening and covers the LEDs 335, thereby forming the optical lens 345. In this case, the forming of the optical lens 345 effectively forms a waterproof seal around the opening.

[0112] In some embodiments, the first molding process for forming the optical lens 345 can be performed before inserting the PCB 330 into the wearable ring device. That is, a mold can be placed above the inner housing 315, and the first molding process can be performed to form the optical lens 345, wherein the lens is formed to include cavities / recesses configured to accommodate LEDs 335, PDs 340, or other electronic components that will be placed within openings in the inner housing 315. In this case, after forming the optical lens 345, the PCB 330 can be coupled to the inner housing 315 such that the LEDs 335 and PDs 340 are inserted into the openings in the inner housing 315 and the cavities / recesses formed in the optical lens 345.

[0113] As previously mentioned, the optical lens 345 can be pre-cured using light. In the case of individual molding of each optical lens 345, each optical lens 345 can be pre-cured using light before molding the next optical lens 345. In some aspects, after all the optical lenses 345 have been formed (and pre-cured), the wearable ring device 300 can be placed in an oven for final heat curing.

[0114] According to the second embodiment, after the optical lens 345 is formed on the opening of the inner shell 315, a second molding or injection process can be performed to fill the cavity of the annular shell 310 with a filler material 325. The filler material 325 can be configured to at least partially fill the cavity and fix the PCB 330 to the inner shell 315, the outer shell 320, or both.

[0115] Figure 6A method 600 for manufacturing a wearable ring device according to various aspects of this disclosure is shown. In particular, method 600 illustrates an example of a first embodiment of forming an optical lens 345 on a PCB 330, as shown and described. Various operations of method 600 can be implemented by a wearable device or components thereof, as described below. For example, various operations of method 600 can be performed by a wearable device, such as... Figures 1 to 5 As shown. In some examples, the wearable device can execute a set of instructions to control the functional elements of the wearable device, thereby performing the function. Alternatively, the wearable device can also perform aspects of the function via dedicated hardware.

[0116] In block 605, the method may include coupling one or more light emitting components and one or more light receiving components to a first surface of a PCB. Operation of block 605 may be performed according to the examples disclosed herein.

[0117] In 610, the method may include coupling one or more additional electronic components to a second surface of the PCB opposite to the first surface. Operation of block 610 may be performed according to the examples disclosed herein.

[0118] In block 615, the method may include performing a first molding process to mold a plurality of optical lenses over one or more light emitting components and one or more light receiving components. Operation of block 615 may be performed according to the examples disclosed herein.

[0119] In 620, the method may include: inserting a PCB into an annular housing such that a plurality of optical lenses extend through a plurality of openings within an inner annular surface of the inner shell of the annular housing, wherein one or more light emitting components and one or more light receiving components are substantially flush with the inner annular surface. Operation of block 620 may be performed according to the examples disclosed herein.

[0120] In block 625, the method may include performing a second molding process to secure the PCB within the annular housing. The operation of block 625 may be performed according to the examples disclosed herein.

[0121] Figure 7 A method 700 for manufacturing a wearable ring device according to various aspects of this disclosure is shown. In particular, method 700 illustrates an example of a first embodiment of forming an optical lens 345 on a PCB 330, as shown and described. Various operations of method 700 can be implemented by a wearable device or its components, as described herein. For example, various operations of method 700 can be performed by a wearable device, such as… Figures 1 to 6 As shown.

[0122] In 705, the method may include coupling one or more light emitting components and one or more light receiving components to a first surface of a PCB. Operation of block 705 may be performed according to the examples disclosed herein.

[0123] In 710, the method may include coupling one or more additional electronic components to a second surface of the PCB opposite to the first surface. Operation of block 710 may be performed according to the examples disclosed herein.

[0124] In 715, the method may include forming a plurality of cavities around one or more light emitting components and one or more light receiving components on a first surface of the PCB. Operation of block 715 may be performed according to the examples disclosed herein.

[0125] In 720, the method may include performing a first molding process to mold a plurality of optical lenses over one or more light emitting components and one or more light receiving components, wherein the first molding process fills a plurality of cavities to form a plurality of optical lenses within the plurality of cavities. Operation of block 720 may be performed according to the examples disclosed herein.

[0126] In 725, the method may include: inserting a PCB into an annular housing such that a plurality of optical lenses extend through a plurality of openings within an inner annular surface of the inner shell of the annular housing, wherein one or more light emitting components and one or more light receiving components are substantially flush with the inner annular surface. Operation of block 725 may be performed according to the examples disclosed herein.

[0127] In 730, the method may include performing a second molding process to secure the PCB within the annular housing. The operation of block 730 can be performed according to the examples disclosed herein.

[0128] Figure 8 A flowchart of a method 800 for manufacturing a wearable ring device according to various aspects of this disclosure is shown. In particular, method 800 illustrates an example of a second embodiment of forming an optical lens 345 on a PCB 330, as shown and described. Various operations of method 800 can be implemented by a wearable device or its components, as described herein. For example, various operations of method 800 can be performed by a wearable device, such as… Figures 1 to 5 As shown.

[0129] In block 805, the method may include coupling one or more light emitting components and one or more light receiving components to a first surface of a PCB. Operation of block 805 may be performed according to the examples disclosed herein.

[0130] In 810, the method may include coupling one or more additional electronic components to a second surface of the PCB opposite the first surface. Operation of block 810 may be performed according to the examples disclosed herein.

[0131] In block 815, the method may include: inserting a PCB into an annular housing such that one or more light emitting components and one or more light receiving components extend through a plurality of openings within an inner annular surface of the inner shell of the annular housing, and such that one or more light emitting components and one or more light receiving components are substantially flush with the inner annular surface. Operation of block 815 may be performed according to the examples disclosed herein.

[0132] In 820, the method may include performing a first molding process to mold a plurality of optical lenses over a plurality of openings, wherein the first molding process secures one or more light emitting components and one or more light receiving components within the plurality of openings. Operation of block 820 may be performed according to the examples disclosed herein.

[0133] In block 825, the method may include performing a second molding process after the first molding process is completed to secure the PCB within the annular housing. The operation of block 825 can be performed according to the examples disclosed herein.

[0134] It should be noted that the methods described herein are possible implementations; the operations and steps may be rearranged or otherwise modified, and other implementations may exist. Furthermore, aspects of two or more methods can be combined with each other.

[0135] This disclosure describes a method for manufacturing a wearable ring device using an apparatus. The method may include: coupling one or more light-emitting components and one or more light-receiving components to a first surface of a PCB; coupling one or more additional electronic components to a second surface of the PCB opposite to the first surface; performing a first molding process to mold a plurality of optical lenses over the one or more light-emitting components and one or more light-receiving components; inserting the PCB into an annular housing such that the plurality of optical lenses extend through a plurality of openings in an inner annular surface of the annular housing, wherein the one or more light-emitting components and one or more light-receiving components are substantially flush with the inner annular surface; and performing a second molding process to secure the PCB within the annular housing.

[0136] This disclosure describes an apparatus for manufacturing a wearable ring device. The apparatus may include one or more memories for storing processor-executable code, and one or more processors coupled to the one or more memories. The one or more processors may operate individually or collectively to execute code, causing the apparatus to perform the following steps: coupling one or more light-emitting components and one or more light-receiving components to a first surface of a PCB; coupling one or more additional electronic components to a second surface of the PCB opposite to the first surface; performing a first molding process to mold a plurality of optical lenses over the one or more light-emitting components and one or more light-receiving components; inserting the PCB into an annular housing such that the plurality of optical lenses extend through a plurality of openings in an inner annular surface of the inner shell of the annular housing, wherein the one or more light-emitting components and one or more light-receiving components are substantially flush with the inner annular surface; and performing a second molding process to secure the PCB within the annular housing.

[0137] This disclosure also describes another apparatus for manufacturing a wearable ring device. The apparatus may include: means for coupling one or more light-emitting components and one or more light-receiving components to a first surface of a PCB; means for coupling one or more additional electronic components to a second surface of the PCB opposite to the first surface; means for performing a first molding process to mold a plurality of optical lenses over one or more light-emitting components and one or more light-receiving components; means for inserting the PCB into an annular housing such that the plurality of optical lenses extend through a plurality of openings in an inner annular surface of the annular housing, wherein one or more light-emitting components and one or more light-receiving components are substantially flush with the inner annular surface; and means for performing a second molding process to secure the PCB within the annular housing.

[0138] This disclosure describes a non-transitory computer-readable medium storing code for manufacturing a wearable ring device. The code may include instructions executable by a processor to couple one or more light-emitting components and one or more light-receiving components to a first surface of a PCB; to couple one or more additional electronic components to a second surface of the PCB opposite the first surface; to perform a first molding process to mold a plurality of optical lenses over one or more light-emitting components and one or more light-receiving components; to insert the PCB into an annular housing such that the plurality of optical lenses extend through a plurality of openings in an inner annular surface of the annular housing, wherein one or more light-emitting components and one or more light-receiving components are substantially flush with the inner annular surface; and to perform a second molding process to secure the PCB within the annular housing.

[0139] Examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein may further include operations, features, devices, or instructions for forming a plurality of cavities around one or more light emitting components and one or more light receiving components on a first surface of a PCB, wherein a first plastic film process fills the plurality of cavities to form a plurality of optical lenses within the plurality of cavities.

[0140] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, the surfaces of the plurality of cavities include an adhesive that can be configured to secure the plurality of cavities to the inner shell of a wearable ring device, and the adhesive forms a waterproof seal around the plurality of openings.

[0141] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, a first molding process may be performed using a substantially transparent material, while a second molding process may be performed using a second material different from the substantially transparent material.

[0142] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, the inner annular surface of the inner shell includes a curved region and one or more planar regions, and multiple openings may be provided within one or more planar regions.

[0143] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, a PCB may be inserted into an annular housing such that a curved portion of the PCB may be disposed within the wearable ring device and near a curved region of the inner housing, while one or more planar portions of the PCB may be disposed within the wearable ring device and near one or more planar regions of the inner housing, and one or more light emitting components and one or more light receiving components may be disposed on the PCB and within one or more planar portions.

[0144] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, a plurality of optical lenses include convex lenses extending from an inner annular surface.

[0145] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, the first molding process may be performed using a basic transparent material for forming a plurality of optical lenses, and inserting the PCB into the annular housing will cause the plurality of optical lenses to substantially fill the plurality of openings.

[0146] This disclosure describes a method for manufacturing a wearable ring device using an apparatus. The method may include: coupling one or more light-emitting components and one or more light-receiving components to a first surface of a PCB; coupling one or more additional electronic components to a second surface of the PCB opposite to the first surface; inserting the PCB into an annular housing such that one or more light-emitting components and one or more light-receiving components extend through a plurality of openings in an inner annular surface of the annular housing, and such that one or more light-emitting components and one or more light-receiving components are substantially flush with the inner annular surface; performing a first molding process to mold a plurality of optical lenses over the plurality of openings, wherein the first molding process secures one or more light-emitting components and one or more light-receiving components within the plurality of openings; and after the first molding process is completed, performing a second molding process to secure the PCB within the annular housing.

[0147] This disclosure describes an apparatus for manufacturing a wearable ring device. The apparatus may include one or more memories for storing processor-executable code, and one or more processors coupled to the one or more memories. The one or more processors may operate individually or collectively to execute code, causing the apparatus to perform the following steps: coupling one or more light-emitting components and one or more light-receiving components to a first surface of a PCB; coupling one or more additional electronic components to a second surface of the PCB opposite to the first surface; inserting the PCB into an annular housing such that one or more light-emitting components and one or more light-receiving components extend through a plurality of openings in an inner annular surface of the annular housing, and such that one or more light-emitting components and one or more light-receiving components are substantially flush with the inner annular surface; performing a first molding process to mold a plurality of optical lenses over the plurality of openings, wherein the first molding process secures one or more light-emitting components and one or more light-receiving components within the plurality of openings; and, after the first molding process is completed, performing a second molding process to secure the PCB within the annular housing.

[0148] This disclosure also describes an apparatus for manufacturing a wearable ring device. The apparatus may include: means for coupling one or more light-emitting components and one or more light-receiving components to a first surface of a PCB; means for coupling one or more additional electronic components to a second surface of the PCB opposite to the first surface; means for inserting the PCB into an annular housing such that one or more light-emitting components and one or more light-receiving components extend through a plurality of openings in an inner annular surface of the annular housing and such that one or more light-emitting components and one or more light-receiving components are substantially flush with the inner annular surface; means for performing a first molding process to mold a plurality of optical lenses over the plurality of openings, wherein the first molding process secures one or more light-emitting components and one or more light-receiving components within the plurality of openings; and means for performing a second molding process after the first molding process is completed to secure the PCB within the annular housing.

[0149] This disclosure describes a non-transitory computer-readable medium storing code for manufacturing a wearable ring device. The code may include instructions executable by a processor for: coupling one or more light-emitting components and one or more light-receiving components to a first surface of a PCB; coupling one or more additional electronic components to a second surface of the PCB opposite to the first surface; inserting the PCB into an annular housing such that one or more light-emitting components and one or more light-receiving components extend through a plurality of openings in an inner annular surface of the annular housing, and such that one or more light-emitting components and one or more light-receiving components are substantially flush with the inner annular surface; performing a first molding process to mold a plurality of optical lenses over the plurality of openings, wherein the first molding process secures one or more light-emitting components and one or more light-receiving components within the plurality of openings; and performing a second molding process after the first molding process is completed to secure the PCB within the annular housing.

[0150] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, the first surface of the PCB may include an adhesive that can be configured to secure the PCB to the inner shell of the annular housing.

[0151] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, a first molding process may be performed using a substantially transparent material, while a second molding process may be performed using a second material different from the substantially transparent material.

[0152] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, the inner annular surface of the inner shell includes a curved region and one or more planar regions, and multiple openings may be provided within one or more planar regions.

[0153] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, a PCB may be inserted into an annular housing such that a curved portion of the PCB may be disposed within the wearable ring device and near a curved region of the inner housing, while one or more planar portions of the PCB may be disposed within the wearable ring device and near one or more planar regions of the inner housing, and one or more light emitting components and one or more light receiving components may be disposed on the PCB and within one or more planar portions.

[0154] In some examples of the methods, apparatus, and non-transitory computer-readable media disclosed herein, a plurality of optical lenses include convex lenses extending from an inner annular surface.

[0155] This disclosure describes an apparatus for a wearable ring device. The apparatus may include an annular housing comprising an inner shell and an outer shell, wherein the inner shell includes a plurality of openings and defines an inner annular surface of the wearable ring device; and wherein the outer shell defines an outer annular surface of the wearable ring device, and a PCB is disposed within the annular housing; wherein at least a portion of a first surface of the PCB contacts the inner shell, and a plurality of electronic components are disposed on the PCB, the plurality of electronic components including: one or more light emitting components and one or more light receiving components disposed on the first surface of the PCB and extending through the plurality of openings of the inner annular surface, wherein the one or more light emitting components and one or more light receiving components are substantially flush with the inner annular surface; one or more additional elements disposed on a second surface of the PCB opposite to the first surface; and a plurality of optical lenses covering the one or more light emitting components and one or more light receiving components disposed within the plurality of openings.

[0156] In some examples of the device, the inner annular surface of the inner shell includes a curved region and one or more planar regions, wherein multiple openings may be provided within one or more planar regions.

[0157] In some examples of the device, the PCB includes a curved portion of a curved region located within the wearable ring device and near the inner shell, and one or more planar portions of one or more planar regions located within the wearable ring device and near the inner shell, wherein one or more light emitting components and one or more light receiving components may be disposed on the PCB and within one or more planar portions.

[0158] In some examples of this device, multiple optical lenses include convex lenses extending from the inner annular surface.

[0159] In some examples of this device, multiple optical lenses comprise a basic transparent material used to fill multiple openings.

[0160] In some examples of the device, the portion of the first surface includes an adhesive material that can be configured to couple the portion of the first surface of the PCB to the inner housing.

[0161] In some examples of the device, the PCB also includes a light-shielding layer disposed on a first surface of the PCB and located between one or more light-emitting components and one or more light-receiving components.

[0162] The description herein, illustrated with reference to the accompanying drawings, describes exemplary configurations and does not represent all examples that can be implemented or that are within the scope of the claims. The term "exemplary" as used herein means "serving as an example, instance, or illustration," and not "preferred" or "superior to other examples." Detailed descriptions include specific details for the purpose of providing an understanding of the described techniques. However, these techniques can be practiced without these specific details. In some instances, well-known structures and devices are shown in block diagram form to avoid obscuring the concepts of the described examples.

[0163] In the accompanying drawings, similar components or features may have the same reference numerals. Furthermore, various components of the same type can be distinguished by a reference numeral marked with a dash and a second numeral to differentiate them. If only the first reference numeral is used in the specification, the description applies to any of the similar components having the same first reference numeral, without regard to the second reference numeral.

[0164] The information and signals described herein can be represented using any of a variety of different techniques and means. For example, data, instructions, commands, information, signals, bits, symbols, and chips referred to in the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or light particles, or any combination thereof.

[0165] The various illustrative boxes and modules described in connection with this disclosure may be implemented or performed using a general-purpose processor, DSP, ASIC, FPGA or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. The general-purpose processor may be a microprocessor, but alternatively, it may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors incorporating a DSP core, or any other such configuration).

[0166] The functions described herein can be implemented in hardware, software executed by a processor, firmware, or any combination thereof. If implemented in software executed by a processor, the functions can be stored on or transmitted via a computer-readable medium as one or more instructions or code. Other examples and implementations are within the scope of this disclosure and the appended claims. For example, due to the nature of software, the functions described above can be implemented using software executed by a processor, hardware, firmware, hardwired, or any combination thereof. Features implementing the functions can also be physically located in various locations, including being distributed such that different parts of the functions are implemented in different physical locations. Furthermore, as used herein, including in the claims, the word "or" as used in a list of items (e.g., a list of items beginning with phrases such as "at least one of" or "one or more") indicates an inclusive list, such that, for example, a list of at least one of A, B, or C means A or B or C, or AB or AC or BC, or ABC (i.e., A and B and C). Moreover, as used herein, the phrase "based on" should not be construed as referring to a set of closing conditions. For example, without departing from the scope of this disclosure, an exemplary step described as "based on condition A" may be based on both condition A and condition B. In other words, as used herein, the phrase "based on" should be interpreted in the same way as the phrase "at least partially based on".

[0167] Computer-readable media includes both non-transitory computer storage media and communication media, including any media that facilitates the transfer of a computer program from one place to another. Non-transitory storage media can be any available medium accessible by a general-purpose or special-purpose computer. By way of example, and not limitation, non-transitory computer-readable media may include RAM, ROM, electrically erasable programmable ROM (EEPROM), disc-on-CD ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other means of carrying or storing desired program code in the form of instructions or data structures and accessible by a general-purpose or special-purpose computer, or a general-purpose or special-purpose processor. Furthermore, any connection is appropriately referred to as computer-readable media. For example, if software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of media. As used in this article, disks and optical discs include CDs, laser discs, optical discs, digital versatile discs (DVDs), floppy disks, and Blu-ray discs, where disks typically reproduce data magnetically, while optical discs use lasers to reproduce data optically. Combinations of these are also included within the scope of computer-readable media.

[0168] The description herein is provided to enable those skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the scope of this disclosure. Therefore, this disclosure is not limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wearable ring device, comprising: An annular housing comprising an inner shell and an outer shell, wherein the inner shell includes a plurality of openings and defines an inner annular surface of the wearable ring device, and wherein the outer shell defines an outer annular surface of the wearable ring device; A printed circuit board disposed within the annular housing, wherein at least a portion of a first surface of the printed circuit board is in contact with the inner housing; Multiple electronic components are disposed on the printed circuit board, and the multiple electronic components include: One or more light emitting components and one or more light receiving components are disposed on the first surface of the printed circuit board and extend through the plurality of openings on the inner annular surface, wherein the one or more light emitting components and the one or more light receiving components are substantially flush with the inner annular surface; and One or more additional components are disposed on a second surface of the printed circuit board opposite the first surface; and Multiple optical lenses cover one or more light emitting components and one or more light receiving components disposed within multiple openings.

2. The wearable ring device according to claim 1, wherein, The inner annular surface of the inner shell includes: A curved region and one or more planar regions, wherein the plurality of openings are disposed within the one or more planar regions.

3. The wearable ring device according to claim 2, wherein, The printed circuit board includes: A curved portion, the curved portion being located within the wearable ring device and near the curved region of the inner shell; and One or more planar portions, said one or more planar portions being located within the wearable ring device and close to said one or more planar regions of the inner shell, wherein said one or more light emitting components and said one or more light receiving components are disposed on the printed circuit board and within said one or more planar portions.

4. The wearable ring device according to claim 1, wherein, The plurality of optical lenses includes a convex lens extending from the inner annular surface.

5. The wearable ring device according to claim 1, wherein, The plurality of optical lenses comprise a basic transparent material that fills the plurality of openings.

6. The wearable ring device according to claim 1, wherein, The portion of the first surface includes an adhesive material configured to couple the portion of the first surface of the printed circuit board to the inner housing.

7. The wearable ring device according to claim 1, wherein, The printed circuit board also includes: A light-shielding layer is disposed on the first surface of the printed circuit board and located between the one or more light emitting components and the one or more light receiving components.

8. A method for manufacturing a wearable ring device, comprising: One or more light emitting components and one or more light receiving components are coupled to a first surface of a printed circuit board; One or more additional electronic components are coupled to a second surface of the printed circuit board opposite the first surface; Perform a first molding process to mold a plurality of optical lenses over the one or more light emitting components and the one or more light receiving components; The printed circuit board is inserted into the annular housing such that the plurality of optical lenses extend through a plurality of openings in the inner annular surface of the inner shell of the annular housing, wherein the one or more light emitting components and the one or more light receiving components are substantially flush with the inner annular surface; as well as A second molding process is performed to fix the printed circuit board inside the annular housing.

9. The method according to claim 8, further comprising: A plurality of cavities are formed around the one or more light emitting components and the one or more light receiving components on the first surface of the printed circuit board, wherein the first molding process fills the plurality of cavities to form the plurality of optical lenses within the plurality of cavities.

10. The method according to claim 9, wherein, The surfaces of the plurality of cavities include an adhesive configured to secure the plurality of cavities to the inner shell of the wearable ring device, wherein the adhesive forms a waterproof seal around the plurality of openings.

11. The method according to claim 8, wherein, The first molding process is performed using a substantially transparent material, and the second molding process is performed using a second material that is different from the substantially transparent material.

12. The method according to claim 8, wherein, The inner annular surface of the inner shell includes a curved region and one or more planar regions, wherein the plurality of openings are disposed within the one or more planar regions.

13. The method according to claim 12, wherein, The printed circuit board is inserted into the annular housing such that a curved portion of the printed circuit board is disposed within the wearable ring device and near the curved area of ​​the inner housing, and one or more planar portions of the printed circuit board are disposed within the wearable ring device and near the one or more planar areas of the inner housing, wherein the one or more light emitting components and the one or more light receiving components are disposed on the printed circuit board and within the one or more planar portions.

14. The method according to claim 8, wherein, The plurality of optical lenses includes a convex lens extending from the inner annular surface.

15. The method according to claim 8, wherein, The first molding process is performed using a basic transparent material that forms the plurality of optical lenses, wherein the printed circuit board is inserted into the annular housing such that the plurality of optical lenses substantially fill the plurality of openings.

16. A method for manufacturing a wearable ring device, comprising: One or more light emitting components and one or more light receiving components are coupled to a first surface of a printed circuit board; One or more additional electronic components are coupled to a second surface of the printed circuit board opposite the first surface; The printed circuit board is inserted into the annular housing such that the one or more light emitting components and the one or more light receiving components extend through a plurality of openings in the inner annular surface of the inner shell of the annular housing, and such that the one or more light emitting components and the one or more light receiving components are substantially flush with the inner annular surface; A first molding process is performed to mold a plurality of optical lenses above the plurality of openings, wherein the first molding process fixes one or more light emitting components and one or more light receiving components within the plurality of openings; as well as After the first molding process is completed, a second molding process is performed to fix the printed circuit board inside the annular housing.

17. The method according to claim 16, wherein, The first surface of the printed circuit board includes an adhesive configured to secure the printed circuit board to the inner shell of the annular housing.

18. The method according to claim 16, wherein, The first molding process is performed using a substantially transparent material, and the second molding process is performed using a second material that is different from the substantially transparent material.

19. The method of claim 16, wherein, The inner annular surface of the inner shell includes a curved region and one or more planar regions, wherein the plurality of openings are disposed within the one or more planar regions.

20. The method according to claim 19, wherein, The printed circuit board is inserted into the annular housing such that a curved portion of the printed circuit board is disposed within the wearable ring device and near the curved area of ​​the inner housing, and one or more planar portions of the printed circuit board are disposed within the wearable ring device and near the one or more planar areas of the inner housing, wherein the one or more light emitting components and the one or more light receiving components are disposed on the printed circuit board and within the one or more planar portions.

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