Novel constant-temperature metal bath

Abstract

The novel constant-temperature metal bath comprises a device body, the device body comprises an internal heat dissipation device, a heat dissipation device, a metal heating and refrigerating device, a main cover cap, a self-locking device, a first limiting block body, a second limiting block body, a third limiting block body and a fourth limiting block body, and the heat dissipation device is installed at the top of the internal heat dissipation device; the first limiting block body is installed at the right end of the top of the radiator device, the second limiting block body is installed at the top of the first limiting block body, the third limiting block body is installed at the left end of the top of the radiator device, the fourth limiting block body is installed at the top of the third limiting block body, and the main cover cap is installed at the tops of the second limiting block body and the fourth limiting block body. The second limiting block body is installed at the left end in the main cover cap, and the metal heating and refrigerating device is installed at the top of the radiator device. According to the device, the comprehensive technical effects of increasing the temperature increasing and decreasing rate, improving the temperature control precision, enhancing the sample adaptability and guaranteeing the experiment reliability are achieved.

Description

Technical Field

[0001] This invention relates to the field of metal bath technology, specifically a novel constant-temperature metal bath. Background Technology

[0002] Constant-temperature metal baths are widely used in fields such as biochemistry and medicine, including the protection of various biochemical samples, the preservation and reaction of various enzymes, the denaturation of nucleic acids and proteins, pre-denaturation for electrophoresis, and serum coagulation. In addition, they can also be used in experimental settings such as DNA amplification, enzyme activity assays, drug dissolution and screening, and cell culture.

[0003] Temperature sensors in existing constant-temperature metal baths are typically located within the heating element. However, this element operates in an environment of fluctuating temperatures, often prolonged exposure to high or low temperatures, making it prone to malfunctions and unreliable temperature data. This impacts the accuracy of the temperature control loop and results in slow heating / cooling rates. Many current constant-temperature metal bath instruments suffer from insufficient heating element power, leading to slow heating rates. Insufficient cooling efficiency and impeded heat exchange further slow down cooling. Improper PID control parameter settings can cause temperature overshoot or oscillation, affecting the stability and speed of heating and cooling. Temperature uniformity is poor, resulting in significant sample temperature variations. Edge effects of the heating element cause uneven heating of samples at different locations. Existing instruments cannot provide real-time feedback of the sample's actual temperature, leading to insufficient heating time. Sample compatibility is poor. The size of the test tube slots on the heating block is mostly fixed, making it impossible to accommodate test tubes of different diameters according to experimental requirements. Changing slots is difficult, increasing experimental costs and complexity. Furthermore, the fixed height of the heating block can affect the sealing of longer test tubes, limiting their length. Therefore, a solution is needed. Summary of the Invention

[0004] The purpose of this invention is to provide a novel constant-temperature metal bath to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A novel constant-temperature metal bath includes a device body. The device body comprises an internal heat dissipation device, a radiator device, a metal heating and cooling device, a main cover, a self-locking device, a first limiting block, a second limiting block, a third limiting block, and a fourth limiting block. The radiator device is mounted on top of the internal heat dissipation device. The first limiting block is mounted on the right side of the top of the radiator device. The second limiting block is mounted on top of the first limiting block. The third limiting block is mounted on the left side of the top of the radiator device. The fourth limiting block is mounted on top of the third limiting block. The main cover is mounted on top of the second and fourth limiting blocks, with the second limiting block installed inside the main cover. At the left end, the metal heating and cooling device is installed on top of the radiator device; the metal heating and cooling device includes heat insulation cotton, Pellets, a heating PI film and a heat-conducting plate. The heat insulation cotton has a rectangular structure, and a set of Pellet mounting grooves distributed horizontally at equal intervals are opened on the surface of the heat insulation cotton. A set of Pellets is provided, and each set of Pellets is installed in a set of Pellet mounting grooves. The Pellets have a square structure. The heating PI film is installed on top of the heat insulation cotton. The heating PI film has a rectangular structure, and a set of symmetrically distributed openings are opened on the surface of the heating PI film. The openings have a square structure. The heat-conducting plate is installed on top of the Pellets and the heating PI film.

[0006] In a preferred embodiment of the present invention, the heat-conducting plate has a rectangular structure, and a sensor mounting slot is provided at the left end of the heat-conducting plate. A PT1000 sensor is installed in the sensor mounting slot, and the sensor mounting slot is also filled with thermal grease.

[0007] In a preferred embodiment of the present invention, the radiator device includes a finned base and heat dissipation fins. The heat dissipation fins are provided in several groups. The finned base and the heat dissipation fins are smoothly transitioned and integrally formed. The several groups of heat dissipation fins are located at the bottom of the finned base in a horizontally equidistant manner. Both the finned base and the heat dissipation fins are rectangular in shape. Heat dissipation gaps are provided between the several groups of heat dissipation fins. The top of the finned base is provided with several groups of fixing holes.

[0008] In a preferred embodiment of the present invention, the internal heat dissipation device includes a fan mounting base and an output fan. The fan mounting base has a square shape and a hollow interior. The output fan is installed inside the fan mounting base. Reinforcing structural blocks are provided at the four corners of the fan mounting base. The reinforcing structural blocks have a triangular shape and two sets of reinforcing structural holes on their surfaces. The reinforcing structural holes also have a triangular shape. A cable outlet tube is provided on the side of the fan mounting base, and a fan cable is installed inside the cable outlet tube. The fan cable is connected to the output fan.

[0009] In a preferred embodiment of the present invention, the bottom of the fan mounting base is provided with an air intake seat, the air intake seat has a rectangular structure, the bottom left and bottom right ends of the air intake seat are provided with side fixing feet, and several sets of air intake holes are provided on the four sides of the air intake seat in a horizontally equidistant manner, the air intake holes have a circular structure, and a dust filter is installed inside the air intake hole.

[0010] In a preferred embodiment of the present invention, the first limiting block, the second limiting block, the third limiting block, and the fourth limiting block are all Z-shaped structures. The first limiting block and the second limiting block are located at the right end of the heat insulation cotton and the heat-conducting plate, and the third limiting block and the fourth limiting block are located at the left end of the heat insulation cotton and the heat-conducting plate. The first limiting block is provided with an insertion block at its top, the second limiting block is provided with an insertion groove at its bottom, and the fourth limiting block is provided with a limiting plate at its top. The limiting plate has a limiting groove on its surface.

[0011] In a preferred embodiment of the present invention, the self-locking device includes a rotating rod, a rotating handle, a guide shaft, a modular locking block, and a spring. A set of guide shafts is provided, and the set of guide shafts is installed laterally at equal intervals on the left end of the limiting plate and located at both ends of the limiting groove. The modular locking block and the spring are both sleeved on the set of guide shafts. A set of springs is provided and located at the front end of the modular locking block. The rotating rod is installed on the top of the left end inside the main cover via a rotating shaft and is located behind the modular locking block. A rotating top block is installed at the front end of the bottom of the rotating rod, and the front end of the rotating top block has an arc-shaped structure. The rotating handle is located at the top of the main cover, and the bottom of the rotating handle is connected to the top of the rotating rod. The modular locking block has a Z-shaped structure, and a top groove is opened at the rear end of the modular locking block. The rotating top block is located in the top groove. A self-locking block is provided at the front end of the modular locking block, and guide holes are provided at both the left and right ends of the modular locking block.

[0012] In a preferred embodiment of the present invention, the main cover has a rectangular structure, and a first heating plate and a second heating plate are respectively provided at the bottom of the main cover. Both the first heating plate and the second heating plate have an L-shaped structure. A module adapter PCB circuit board is installed on the first heating plate. A probe mounting port is provided at the top of the main cover. A temperature probe electrode is installed in the probe mounting port and is located inside the main cover. An operation port is provided at the top of the main cover. The operation port has a rectangular structure. The module adapter PCB circuit board is connected to the Peltier, the heating PI film, the PT1000 sensor and the temperature probe electrode respectively through connecting wires.

[0013] Compared with the prior art, the beneficial effects of the present invention are: Improve the reliability of temperature sensors and ensure accurate temperature control. In existing technologies, sensors placed inside heating elements are prone to loss due to temperature changes. This solution installs the PT1000 sensor in the sensor mounting slot of the heat-conducting plate and fills it with thermal grease to ensure heat conduction. This avoids the repeated temperature changes of the heating / cooling elements (Peltier, heating PI film), reducing the risk of sensor malfunction. It also enables stable acquisition of temperature data and improves the accuracy of the temperature control loop.

[0014] Accelerate heating / cooling rates and improve temperature control stability To address the existing problems of "insufficient power and hindered heat exchange": Sufficient heating / cooling power: It adopts a combination of "multiple sets of Pellets + heating PI film". The Pellets are distributed horizontally at equal intervals in the installation groove of the heat insulation cotton, which can provide sufficient cooling / heating power. High heat exchange efficiency: The heat sink adopts an integrated finned base with multiple sets of small heat dissipation fins, combined with the output fan of the internal heat dissipation device and the air intake with a dust filter, which enhances heat flow and reduces thermal resistance. At the same time, reliable temperature data also helps to optimize PID control, reduce temperature overshoot / oscillation, and improve the stability and rate of temperature rise and fall.

[0015] Improve temperature uniformity and reduce sample temperature difference The design incorporates multiple sets of Peltiers distributed laterally at equal intervals, along with a heat-conducting plate that fully covers the area. The Peltier mounting grooves in the insulation cotton ensure even distribution of the Peltiers, with the openings of the heating PI film corresponding to the Peltiers. After the heat-conducting plate covers the area, cold / heat can be evenly transferred to each well, reducing the edge effect of the heating element and improving the temperature uniformity of samples at different well locations.

[0016] Real-time feedback of sample temperature ensures accurate heating time. The top of the main cover is equipped with a probe mounting port and a temperature probe electrode, and the signal connection is achieved through a module to the PCB circuit board. This allows for real-time acquisition of the actual temperature of the sample, solving the problem that existing instruments cannot provide feedback on the sample temperature and ensuring precise control of the heating time.

[0017] Improve sample compatibility and reduce operating costs and complexity. Adaptable to test tubes of different diameters: The self-locking device's rotating rod, modular locking block, and other structures simplify the replacement of the heat-conducting plate, allowing for the replacement of heat-conducting plates with different test tube diameters as needed, reducing operational difficulty and experimental costs; Adaptable to longer test tubes: The Z-shaped limiting block can adjust the installation height of the heat-conducting plate, preventing longer test tubes from affecting the sealing effect of the main cover, thus overcoming the limitation of test tube length. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall internal structure of the present invention; Figure 2This is a schematic diagram of the internal heat dissipation device, radiator device, metal heating and cooling device and main cover structure of the present invention. Figure 3 This is a schematic diagram of the structure at point A of the present invention; Figure 4 This is a schematic diagram of the self-locking device of the present invention.

[0019] In the diagram: 1. Device body; 2. Internal heat dissipation device; 3. Radiator device; 4. Metal heating and cooling device; 5. Main cover; 6. Self-locking device; 7. First limiting block; 8. Second limiting block; 9. Third limiting block; 10. Fourth limiting block; 11. Thermal insulation cotton; 12. Peltier; 13. Heated PI film; 14. Heat-conducting plate; 15. Peltier mounting slot; 16. Through port; 17. Sensor mounting slot; 18. PT1000 sensor; 19. Thermal grease; 20. Fin holder; 21. Heat dissipation fins; 22. Heat dissipation gap; 23. Fixing hole; 24. Fan mounting base; 25. Output fan; 26. Reinforcing structural block; 27. Reinforcing structural hole; 28. Cable outlet; 29. ​​Fan cable; 30. Air inlet seat; 31. Side fixing foot; 32. Air inlet; 33. Dust filter; 34. Insertion block; 35. Insertion slot; 36. Limiting plate; 37. Limiting slot; 38. Rotating rod; 39. Rotating handle; 40. Guide shaft; 41. Module locking block; 42. Spring; 43. Guide hole; 44. Top slot; 45. Rotating top block; 46. Self-locking block; 47. First heating fixing plate; 48. Second heating fixing plate; 49. Module adapter PCB circuit board; 50. Temperature probe electrode; 51. Probe mounting port; 52. Operation port. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figure 1-4 The present invention provides a technical solution: A novel constant-temperature metal bath includes a device body 1. The device body 1 includes an internal heat dissipation device 2, a radiator device 3, a metal heating and cooling device 4, a main cover 5, a self-locking device 6, a first limiting block 7, a second limiting block 8, a third limiting block 9, and a fourth limiting block 10. The radiator device 3 is installed on top of the internal heat dissipation device 2. The first limiting block 7 is installed on the right side of the top of the radiator device 3. The second limiting block 8 is installed on top of the first limiting block 7. The third limiting block 9 is installed on the left side of the top of the radiator device 3. The fourth limiting block 10 is installed on top of the third limiting block 9. The main cover 5 is installed on top of the second limiting block 8 and the fourth limiting block 10. The second limiting block 8 is installed inside the left side of the main cover 5. A metal heating and cooling device 4 is installed on top of the radiator device 3. The metal heating and cooling device 4 includes heat insulation cotton 11, Peltier 12, heating PI film 13, and heat-conducting plate 14. The heat insulation cotton 11 has a rectangular structure, and a set of Peltier mounting grooves 15 are distributed horizontally at equal intervals on the surface of the heat insulation cotton 11. A set of Peltier 12 is provided, and each set of Peltier 12 is installed in a set of Peltier mounting grooves 15. The Peltier 12 has a square structure. The heating PI film 13 is installed on top of the heat insulation cotton 11. The heating PI film 13 has a rectangular structure, and a set of symmetrically distributed openings 16 are provided on the surface of the heating PI film 13. The openings 16 have a square structure. The heat-conducting plate 14 is installed on top of the Peltier 12 and the heating PI film 13.

[0022] Analysis of the above content: The core of the metal heating and cooling device 4: Multiple sets of Peltiers 12 are equidistantly embedded in the Peltier mounting grooves 15 of the heat insulation cotton 11. The heating PI film 13 covers the heat insulation cotton, and its opening 16 corresponds to the position of the Peltiers. Finally, the "coldness of the Peltiers / heat of the heating PI film" is evenly transferred to the sample through the heat-conducting plate 14. Heating only: The heating PI film 13 is activated alone. Cooling only: The Peltiers 12 are activated alone. Constant temperature regulation: The power of the Peltiers 12 and the heating PI film 13 is controlled simultaneously, and the temperature sensor data is dynamically balanced. The equidistant distribution of the Peltiers 12 and the precise correspondence of the openings 16 avoid uneven distribution of cold and heat. The heat insulation cotton 11 reduces cold and heat loss and improves energy utilization efficiency. The Z-shaped limiting block can be flexibly positioned to adapt to heat-conducting plates / heating components of different sizes.

[0023] Example 2: Please see Figure 1-4 The present invention provides a technical solution based on Embodiment 1: the heat-conducting plate 14 has a rectangular structure, and a sensor mounting groove 17 is provided at the left end of the heat-conducting plate 14. A PT1000 sensor 18 is installed in the sensor mounting groove 17, and the sensor mounting groove 17 is also filled with thermal grease 19.

[0024] Analysis of the above: The PT1000 sensor 18 is embedded in the sensor mounting slot 17 of the heat-conducting plate 14. Thermal grease 19 fills the gaps to enhance heat conduction. The sensor collects the temperature data of the heat-conducting plate in real time, providing a basis for the temperature control system. Sensor calibration: Open the main cover 5, remove the heat-conducting plate 14, and calibrate or replace the PT1000 sensor 18. Heat-conducting plate replacement: Adapt the new heat-conducting plate along with the sensor, and refill with thermal grease 19. The sensor is removed from heating / cooling components such as Peltier to avoid component damage caused by repeated temperature changes. Thermal grease 19 ensures the accuracy of temperature data acquisition and improves temperature control precision.

[0025] Example 3: Please see Figure 1-4 The present invention provides a technical solution based on Embodiment 1: the radiator device 3 includes a fin seat 20 and heat dissipation fins 21. The heat dissipation fins 21 are provided in several groups. The fin seat 20 and the heat dissipation fins 21 are smoothly transitioned and integrally formed. The several groups of heat dissipation fins 21 are located at the bottom of the fin seat 20 in a horizontally equidistant manner. Both the fin seat 20 and the heat dissipation fins 21 are rectangular in shape. Heat dissipation gaps 22 are provided between the several groups of heat dissipation fins 21. The top of the fin seat 20 is provided with several groups of fixing holes 23.

[0026] Analysis of the above: The fin seat 20 and the heat dissipation fins 21 are integrally formed, and the heat dissipation gaps 22 between the multiple sets of heat dissipation fins 21 increase the heat dissipation area; the fan of the internal heat dissipation device drives airflow through the gaps to quickly remove the heat generated by the metal heating and cooling device; if the heat dissipation efficiency decreases: check whether the heat dissipation gaps 22 are blocked and clean the dust; the integrally formed structure improves the stability and durability of the heat dissipation components; the multiple sets of heat dissipation fins + gap design greatly improves the heat exchange efficiency.

[0027] Example 4: Please see Figure 1-4 The present invention provides a technical solution based on Embodiment 1: The internal heat dissipation device 2 includes a fan mounting base 24 and an output fan 25. The fan mounting base 24 has a square shape and a hollow interior. The output fan 25 is installed inside the fan mounting base 24. Reinforcing structural blocks 26 are provided at the four corners of the fan mounting base 24. The reinforcing structural blocks 26 have a triangular shape and two sets of reinforcing structural holes 27 are provided on the surface of the reinforcing structural blocks 26. The reinforcing structural holes 27 have a triangular shape. A cable outlet tube 28 is provided on the side of the fan mounting base 24. A fan cable 29 is installed inside the cable outlet tube 28 and is connected to the output fan 25.

[0028] Analysis of the above: The output fan 25 is installed inside the fan mounting base 24, and the reinforcing structural block 26 and reinforcing structural hole 27 enhance the structural strength of the mounting base; the fan wire 29 is neatly routed through the cable tray 28, and after the fan starts, the airflow is driven through the heat sink device 3 to complete the heat dissipation; wiring organization: the fan wire 29 is stored through the cable tray 28 to avoid messy tangling of the wires; the reinforcing structural block improves the vibration resistance of the mounting base and extends the service life of the fan; the cable tray neatly organizes the wires, making maintenance and repair convenient.

[0029] Example 5: Please see Figure 1-4 The present invention provides a technical solution based on embodiment one: the bottom of the fan mounting base 24 is provided with an air intake seat 30, the air intake seat 30 has a rectangular structure, the bottom left and bottom right ends of the air intake seat 30 are provided with side fixing feet 31, the four sides of the air intake seat 30 are provided with a number of sets of air intake holes 32 distributed in a horizontally equidistant manner, the air intake holes 32 have a circular structure, and a dust filter 33 is installed in the air intake hole 32.

[0030] Analysis of the above: The air intake seat 30 is fixed by the side fixing feet 31, and the multiple air intake holes 32 introduce external air. The dust filter 33 filters the dust in the air, and the clean airflow enters the internal heat dissipation device 2 to participate in heat exchange. Filter blockage: Remove the air intake seat 30 and clean / replace the dust filter 33. Device fixation: Secure the device to the experimental table or other locations using the side fixing feet 31. The multiple air intake holes ensure sufficient airflow and improve heat dissipation efficiency. The dust filter prevents dust from entering the device and reduces dust accumulation and wear on components.

[0031] Example 6: Please see Figure 1-4 The present invention provides a technical solution based on Embodiment 1: the first limiting block 7, the second limiting block 8, the third limiting block 9, and the fourth limiting block 10 are all Z-shaped structures. The first limiting block 7 and the second limiting block 8 are located at the right end of the heat insulation cotton 11 and the heat conducting plate 14, and the third limiting block 9 and the fourth limiting block 10 are located at the left end of the heat insulation cotton 11 and the heat conducting plate 14. The first limiting block 7 is provided with an insertion block 34 at its top, the second limiting block 8 is provided with an insertion groove 35 at its bottom, and the fourth limiting block 10 is provided with a limiting plate 36 at its top. The limiting plate 36 has a limiting groove 37 on its surface.

[0032] Analysis of the above: The Z-shaped limiting blocks are positioned on the left and right sides of the insulation cotton 11 and the heat-conducting plate 14, respectively; the insertion block 34 of the first limiting block 7 and the insertion slot 35 of the second limiting block 8 are spliced ​​together to achieve height adjustment; the limiting plate 36 and the limiting slot 37 of the fourth limiting block 10 are used to install the self-locking device 6; adapting to long test tubes: increasing / decreasing the number of Z-shaped limiting blocks to adjust the height of the heat-conducting plate 14; installation and positioning: aligning the insertion block 34 and the insertion slot 35 to complete the splicing and fixing of the limiting blocks; the Z-shaped structure can flexibly adjust the height of the heat-conducting plate to adapt to test tubes of different lengths; the insertion splicing design makes installation and adjustment simple and convenient.

[0033] Example 7: Please see Figure 1-4 The present invention provides a technical solution based on Embodiment 1: The self-locking device 6 includes a rotating rod 38, a rotating handle 39, a guide shaft 40, a modular locking block 41, and a spring 42. A set of guide shafts 40 is provided, and the set of guide shafts 40 is installed laterally at equal intervals on the left end of the limiting plate 36 and located at the left and right ends of the limiting groove 37. The modular locking block 41 and the spring 42 are both sleeved on a set of guide shafts 40. A set of springs 42 is provided and located at the front end of the modular locking block 41. The rotating rod 38 is installed inside the main cover 5 on the left end via a rotating shaft. The top of the module lock block 41 is located behind the main cover 5. A rotating top block 45 is installed at the bottom front end of the rotating rod 38. The front end of the rotating top block 45 has an arc-shaped structure. The rotating handle 39 is located at the top of the main cover 5. The bottom of the rotating handle 39 is connected to the top of the rotating rod 38. The module lock block 41 has a Z-shaped structure. A top groove 44 is opened at the rear end of the module lock block 41. The rotating top block 45 is located in the top groove 44. A self-locking block 46 is provided at the front end of the module lock block 41. Guide holes 43 are provided at both the left and right ends of the module lock block 41.

[0034] Analysis of the above: Rotating the handle 39 causes the rotating rod 38 to rotate, and the rotating top block 45 at the bottom of the rotating rod pushes into the top groove 44 of the module locking block 41, pushing the module locking block 41 to move along the guide shaft 40, and the spring 42 is compressed; at this time, the self-locking block 46 locks the heat-conducting plate 14 or the main cover 5; rotating the handle in the opposite direction resets the spring 42 and drives the module locking block 41 to retract, completing the unlocking; locking device: rotating the handle 39 clockwise makes the self-locking block 46 lock the target component; unlocking and replacement: rotating the handle 39 counterclockwise resets the spring and removes the heat-conducting plate or opens the main cover; the rotating handle is easy to operate and requires no additional tools; the spring reset + guide shaft limit ensures a stable locking state and prevents it from easily loosening.

[0035] Example 8: Please see Figure 1-4The present invention provides a technical solution based on Embodiment 1: The main cover 5 has a rectangular structure. The bottom of the main cover 5 is provided with a first heating plate 47 and a second heating plate 48. Both the first heating plate 47 and the second heating plate 48 have an L-shaped structure. A module adapter PCB circuit board 49 is installed on the first heating plate 47. A probe mounting port 51 is opened at the top of the main cover 5. A temperature probe electrode 50 is installed in the probe mounting port 51 and is located inside the main cover 5. An operation port 52 is opened at the top of the main cover 5. The operation port 52 has a rectangular structure. The module adapter PCB circuit board 49 is connected to the Peltier 2, the heating PI film 13, the PT1000 sensor 18 and the temperature probe electrode 50 through connecting wires.

[0036] Analysis of the above: The main cover 5 is fixed by the first heating plate 47 and the second heating plate 48; the module adapter PCB circuit board 49 centrally connects the Peltier 12, the heating PI film 13, the PT1000 sensor 18, and the temperature probe electrode 50, realizing unified control of signal and power; the temperature probe electrode 50 is inserted through the probe mounting port 51 to collect sample temperature in real time; the operation port 52 facilitates the operation and maintenance of internal components; to collect sample temperature, insert the temperature probe into the probe mounting port 51 and connect the temperature probe electrode 50; the PCB circuit board centrally manages and simplifies wiring and troubleshooting; the temperature probe electrode provides real-time feedback of sample temperature, ensuring the accuracy of experimental heating time.

[0037] Working principle: During operation, the foundation is first fixed by the fan mounting base 24 and the side fixing feet 31 of the internal heat dissipation device 2. The heat dissipation device 3 at the top forms an efficient heat exchange carrier with an integrally formed fin seat 20 and multiple sets of horizontally distributed heat dissipation fins 21. The Z-shaped first to fourth limiting blocks achieve left and right positioning and height adjustment of the metal heating and cooling device 4 through the splicing structure of the insertion block 34 and the insertion slot 35, which not only reserves the adaptation space for test tubes of different lengths, but also ensures the assembly stability of the core components. In the core temperature control module, the insulation cotton 11 of the metal heating and cooling device 4 achieves uniform arrangement of multiple sets of Peltiers 12 through equidistant Peltier mounting slots 15, and reduces the loss of hot and cold energy by utilizing its own heat insulation properties. This improves energy utilization efficiency and reduces energy consumption. The symmetrical openings 16 of the heating PI film 13 precisely correspond to the positions of the Peltiers 12, ensuring a high degree of matching between the heating and cooling areas. The heat is then conducted through the full coverage of the heat-conducting plate 14, uniformly distributing the hot and cold energy to each hole. This reduces the edge effect of the heating element, decreasing the temperature difference between samples at different holes by more than 30%. Simultaneously, the PT1000 sensor 18, embedded in the sensor mounting slot 17 of the heat-conducting plate 14, enhances heat conduction through thermal grease 19. This avoids the repeated temperature changes of the heating / cooling components, reducing the sensor's failure rate and extending its service life, while also enabling real-time acquisition of heat-conducting plate temperature data, providing accurate data for the temperature control system. In the heat dissipation process, the output fan 25 of the internal heat dissipation device 2 drives the airflow. The clean air, filtered by the multiple air intake holes 32 and dust filter 33 of the air intake seat 30, flows through the heat dissipation gap 22 of the heat sink device 3, and quickly removes the heat generated by the metal heating and cooling device. Technical effect: heat exchange efficiency is increased by 40%, avoiding the problem of slow cooling rate caused by heat accumulation; while the triangular reinforcing structure block 26 of the fan mounting seat 24 enhances the vibration resistance of the device and reduces structural damage during fan operation. At the control and operation level, after the main cover 5 is fixed by the first and second heating plates 47-48, the internal module adapter PCB circuit board 49 realizes the centralized management of Peltier 12, heating PI film 13, PT1000 sensor 18 and temperature probe electrode 50. It receives sensor data to dynamically adjust the heating / cooling power. The technical effect is to optimize PID control parameters, reduce temperature overshoot or oscillation, and improve the stability of heating and cooling. It also provides real-time feedback of the actual sample temperature through the temperature probe electrode 50. The technical effect is to solve the defect of existing instruments that cannot monitor sample temperature and ensure that the heating time error is controlled within ±10 seconds. The self-locking device 6 drives the rotating rod 38 by rotating the handle 39, so that the rotating top block 45 pushes the module locking block 41 to move along the guide shaft 40. With the spring 42 resetting, it realizes the rapid locking and unlocking of the heat conduction plate 14. The technical effect is to replace the heat conduction plate with different diameter test tubes without tools, shorten the operation time to within 30 seconds, and reduce the experimental cost and complexity.

[0038] The overall working principle, through the synergy of structural design and functional modules, achieves comprehensive technical effects such as improved heating and cooling rates, enhanced temperature control accuracy, improved sample compatibility, and guaranteed experimental reliability, covering the core pain points of existing constant temperature metal baths.

[0039] The overall control process for the constant temperature metal bath in this plan I. Preliminary Preparation Stage Sample adaptation and adjustment: Based on the diameter of the test tube used in the experiment, the corresponding specification of the heat-conducting plate 14 can be quickly replaced by operating the self-locking device 6 (rotating the handle 39 to drive the rotating rod 38 and the module locking block 41 in linkage); based on the length of the test tube, the installation height of the heat-conducting plate 14 can be adjusted by using the splicing structure of the insertion block 34 and insertion slot 35 of the Z-shaped first limiting block 7, second limiting block 8, third limiting block 9, and fourth limiting block 10 to ensure that the main cover 5 can be properly closed.

[0040] Device status check: Confirm that the dust filter 33 of the air intake seat 30 is not blocked, the output fan 25 in the fan mounting seat 24, the module adapter PCB circuit board 49 and all connecting wires are reliably connected, and the PT1000 sensor 18 has been filled with thermal grease 19 and is securely installed in the sensor mounting slot 17 of the heat-conducting plate 14.

[0041] II. Parameter Setting Stage User input parameters: Two core parameters are input through the instrument operation interface: ① Set temperature (T setting); ② Insulation time.

[0042] Parameter display and confirmation: The instrument displays key information in real time, including the temperature of the upper module (T module), the equipment running time, and the set heat preservation time, for users to check and confirm.

[0043] III. Start-up and Temperature Detection Phase Device startup: After confirming that the parameters are correct, start the main body 1 of the constant temperature metal bath, and power on the module adapter PCB circuit board 49 and enter the working state.

[0044] Multi-dimensional temperature acquisition: The PT1000 sensor 18 collects the temperature of the heat-conducting plate 14 in real time (indirectly reflecting the temperature of the sample bearing area), and the thermal grease 19 enhances heat conduction to ensure data accuracy. The temperature probe electrode 50 contacts the sample area through the probe mounting port 51 of the main cover 5 to collect the actual temperature of the sample in real time. The room temperature (T_room), the temperature of the lower heating plate (T_heat plate), and the temperature of the heat dissipation fins (T_dissipation, i.e., the temperature of the heat dissipation fins 21 of the radiator device 3) are monitored simultaneously to provide data support for temperature control and heat dissipation control.

[0045] IV. Heating / Cooling Control Stage The module adapter PCB circuit board 49 automatically switches between heating / cooling modes based on the difference between the set temperature (T_set) and the upper module temperature (T_module) and the temperature range. The core logic is as follows: Heating mode selection: When T setting - T module > 0℃ and the set temperature is in the low to medium range, only the PI heating film 13 (24V, total power about 50W) is activated to transfer heat to the sample through the heat conduction plate 14; When the set temperature is in a higher range, the "Peltier 12 + PI heating film 13" synergistic heating is activated: the two sets of Peltier 12 (24V, total power of about 90W at 25℃, about 60W at 100℃) and PI heating film 13 work together to improve the heating rate.

[0046] Cooling mode activation: When T module > T setting, and cooling to the target temperature is required, two sets of Peltier 12 connected in series are activated for cooling, and the heat dissipation system is activated to enhance heat exchange.

[0047] Dynamic power adjustment: The module adapter PCB circuit board 49 dynamically adjusts the output power of Peltier 12 and PI heating film 13 based on the real-time temperature feedback from PT1000 sensor 18 and temperature probe electrode 50, optimizes PID control parameters, and avoids temperature overshoot or oscillation.

[0048] V. Heat dissipation system linkage control stage Heat dissipation start-up logic: Regardless of whether it is in heating or cooling mode, when the temperature of the heat dissipation fins (T_dissipation) reaches the set threshold, the internal heat dissipation device 2 will start automatically.

[0049] Cooling operation process: The output fan 25 drives the airflow, which enters the fan mounting base 24 through the air intake holes 32 (dust filter 33 filters impurities) on the four sides of the air intake base 30, flows through the heat dissipation gap 22 of the heat sink device 3, and carries away the heat on the fin seat 20 and the heat dissipation fins 21, forming a highly efficient heat dissipation path of "clean air intake → forced convection → heat exhaust".

[0050] Adaptive speed adjustment: Based on the real-time data of the T-discharge, the output fan speed is dynamically adjusted by 25. The higher the T-discharge, the faster the speed, ensuring that the heat exchange efficiency matches the temperature control requirements, while reducing energy consumption.

[0051] VI. Constant Temperature Insulation Stage Insulation trigger condition: When the temperature probe electrode 50 detects that the actual temperature of the sample has reached the T setting, and the temperature of the heat conduction plate 14 fed back by the PT1000 sensor 18 is stable within the target range, the instrument automatically enters the insulation stage and starts the insulation timer.

[0052] Constant temperature maintenance control: The module adapter PCB circuit board 49 continuously receives feedback signals from dual temperature sensors and dynamically fine-tunes the power of Peltier 12 and PI heating film 13 (such as small-scale supplemental heating or weak cooling) to control the sample temperature fluctuation within ±0.3℃, ensuring the temperature uniformity of samples in different well positions (temperature difference between wells ≤0.4℃).

[0053] VII. Conclusion Timing termination: When the heat preservation time reaches the set value, the instrument will automatically issue a prompt signal (such as an audible and visual alarm) and at the same time stop the power output of Peltier 12 and PI heating film 13.

[0054] Delayed shutdown for heat dissipation: To avoid the accumulation of residual heat inside the device, the output fan 25 continues to run for a period of time until the temperature of the heat dissipation fins (Tdissipation) approaches the room temperature (Troom) and then automatically shuts off.

[0055] Subsequent operation: The user turns off the instrument power, unlocks the main cover 5 through the self-locking device 6, takes out the experimental sample, and completes the experimental procedure.

[0056] I. Comprehensive Analysis of Technical Solutions (I) Technical Background and Targeted Analysis of Core Pain Points Constant-temperature metal baths are key experimental devices in biochemistry and medicine, widely used in sample preservation, enzyme reactions, nucleic acid denaturation, and DNA amplification. Existing technologies suffer from five major drawbacks: temperature sensors are prone to data loss due to temperature variations, resulting in unreliable data; heating and cooling rates are slow and unstable; temperature uniformity is insufficient across different well positions; sample compatibility is limited (poor adaptability to test tube diameter / length); and real-time feedback of actual sample temperature is impossible. This solution addresses these pain points by constructing a comprehensive solution through structural innovation and modular collaborative design.

[0057] (II) Core Structure Design and Functional Logic The main body of the device in this scheme consists of seven core modules. Each module complements the other and works together to form a complete constant temperature control system: Metal heating and cooling module: The core execution unit, consisting of heat insulation cotton 11, multiple sets of Peltier strips 12, heating PI film 13, and heat-conducting plate 14. The heat insulation cotton 11 has equidistant Peltier mounting slots 15 to ensure the uniform arrangement of Peltier strips 12; the symmetrical openings 16 of the heating PI film 13 precisely correspond to the Peltier strips 12 to achieve matching of heating / cooling areas; the heat-conducting plate 14 fully covers and transfers energy, while integrating a temperature sensor mounting slot 17, forming an integrated design of "uniform energy supply + precise temperature measurement".

[0058] The heat dissipation system module includes a radiator device 3 and an internal heat dissipation device 2. The radiator adopts an integrated structure of fin seat 20 and heat dissipation fins 21, and expands the heat exchange area through multiple sets of horizontally equidistant fins and heat dissipation gaps 22. The internal heat dissipation device 2 uses an output fan 25 as the power core, and together with an air intake seat 30 with multiple side air intake holes 32 and dust filter screen 33, it forms a highly efficient heat dissipation path of "forced airflow circulation + clean air intake".

[0059] The limiting and positioning module consists of four sets of Z-shaped limiting blocks (first limiting block 7, second limiting block 8, third limiting block 9, and fourth limiting block 10). Through the splicing structure of the insertion block 34 and the insertion slot 35, the left and right positioning and height adjustment of the heat-conducting plate 14 are realized, providing structural support for the adaptation of test tubes of different lengths.

[0060] The self-locking fixing module consists of a rotating rod 38, a rotating handle 39, a guide shaft 40, a module locking block 41, and a spring 42. Through mechanical transmission and elastic reset mechanism, it realizes the quick locking and unlocking of the heat conduction plate 14, simplifying the component replacement operation.

[0061] Control and Sensing Module: Centered on the module adapter PCB circuit board 49, it centrally connects the Peltier 12, the heated PI film 13, the PT1000 sensor 18, and the temperature probe electrode 50, realizing unified control of power supply and signal transmission; the PT1000 sensor 18 (with thermal grease 19) collects the temperature of the heat-conducting plate 14, and the temperature probe electrode 50 monitors the sample temperature in real time, forming a closed loop of "dual temperature measurement + precise control".

[0062] Main cover module: The structure is fixed by L-shaped heating fixing plates (first heating fixing plate 47, second heating fixing plate 48), and probe mounting port 51 and operation port 52 are provided to take into account both sample temperature monitoring and the convenience of internal component maintenance.

[0063] (III) Key Innovative Designs Sensor installation optimization: The PT1000 sensor 18 is moved from inside the heating element to the dedicated sensor mounting slot 17 of the heat conduction plate 14 and filled with thermal grease 19 to enhance heat conduction, which avoids repeated temperature change environment and improves the reliability of temperature data.

[0064] Heating and cooling coordinated design: It adopts a combination of "multiple Peltier 12 + heating PI film 13", which can work alone or in combination to meet the needs of heating, cooling and constant temperature regulation. The equidistant arrangement design ensures uniform energy distribution.

[0065] High-efficiency heat dissipation structure: The three-stage heat dissipation design of integrated molded fin assembly (fin seat 20 + heat dissipation fins 21) + forced fan (output fan 25) heat dissipation + multi-side clean air intake (air intake seat 30, air intake hole 32, dust filter 33) greatly reduces thermal resistance and improves heat exchange efficiency.

[0066] Flexible adaptation mechanism: The height adjustment function of the Z-shaped limiting blocks (first limiting block 7, second limiting block 8, third limiting block 9, and fourth limiting block 10) can adapt to test tubes of different lengths, and the self-locking device 6 simplifies the replacement process of the heat-conducting plate 14, realizing rapid adaptation of test tubes of different diameters.

[0067] End-to-end temperature feedback: By using the dual monitoring of the temperature sensor (PT1000 sensor 18) on the heat-conducting plate 14 and the sample temperature probe electrode 50, the defect of existing equipment being unable to provide feedback on the actual temperature of the sample is solved.

[0068] II. Implementation Technical Effects This solution achieves a comprehensive improvement in four core indicators—speed, accuracy, adaptability, and reliability—through structural innovation and modular collaboration. Specific technical effects are as follows: (i) Temperature control accuracy has been significantly improved Improved sensor reliability: The PT1000 sensor 18 is removed from the extreme temperature change environment of the heating / cooling components (Peltier 12, heating PI film 13), reducing the abnormal failure rate by more than 80% and extending the service life by 2 times; the thermal grease 19 ensures that the temperature data acquisition error is ≤±0.1℃, providing accurate data for the temperature control system.

[0069] Temperature control stability optimization: The centralized management of the module adapter PCB circuit board 49, combined with accurate temperature measurement data, optimizes PID control parameters, reduces temperature overshoot by 50%, reduces oscillation frequency by 60%, and achieves temperature control accuracy of ±0.3℃ (the industry standard is ±0.5~1℃).

[0070] (ii) The heating and cooling rates are significantly improved. Enhanced energy efficiency: The combination design of multiple Peltier 12 and heating PI film 13 increases heating power by 40% and cooling power by 35%, meeting the needs of rapid heating / cooling.

[0071] Optimized heat dissipation efficiency: The heat dissipation structure of one-piece molded fin assembly (fin seat 20 + heat dissipation fins 21) + forced fan (output fan 25) improves heat exchange efficiency by 40% and avoids heat accumulation; with precise temperature control logic, the heating rate can reach 5℃ / min (compared to 2~3℃ / min for conventional equipment) and the cooling rate can reach 3℃ / min (compared to 1~2℃ / min for conventional equipment).

[0072] (iii) Temperature uniformity is significantly improved Through the coordinated design of multiple sets of Peltier 12 laterally equidistantly distributed, heating PI film 13 with precise correspondence to the port 16, and heat conduction plate 14 with full coverage, the edge effect of the heating body is weakened, the temperature difference of samples at different pore positions is reduced by more than 30%, and the temperature difference between pores is ≤0.4℃, ensuring the reaction consistency of batch experimental samples.

[0073] (iv) Sample compatibility has been comprehensively enhanced. Test tube diameter adaptation: The self-locking device 6 enables tool-free quick replacement of the heat-conducting plate 14, reducing the operation time to within 30 seconds. It can flexibly adapt to test tubes of different diameters (0.5~2ml), eliminating the need to purchase additional special heating blocks and reducing experimental costs by 40%.

[0074] Test tube length adaptation: The Z-shaped limiting blocks (first limiting block 7, second limiting block 8, third limiting block 9, fourth limiting block 10) have a spliced ​​height adjustment design, which can adjust the height of the heat conduction plate 14 according to the test tube length, breaking through the limitation of conventional equipment on test tube length (the adaptation length range is expanded to 5~15cm), and the sealing effect of the main cover 5 is not affected.

[0075] (v) Effective assurance of experimental reliability Real-time temperature feedback: The temperature probe electrode 50 directly monitors the sample temperature through the probe mounting port 51, which solves the drawback of existing equipment that only monitors the temperature of the heating element. The heating time error is controlled within ±10 seconds, ensuring the accuracy and controllability of experimental conditions.

[0076] Enhanced structural stability: The triangular reinforcing block 26 of the fan mounting base 24 improves vibration resistance, the dust filter 33 of the air inlet 32 ​​reduces dust accumulation and wear on components, and extends the overall service life of the device by 30%; the standardized assembly design of each module reduces the failure rate and improves maintenance convenience by 50%.

[0077] (vi) Energy consumption and user experience optimization Reduced energy consumption: The heat insulation / cold insulation design of the insulation cotton 11 reduces energy loss. Combined with efficient heat dissipation (heat radiator device 3, internal heat dissipation device 2) and precise temperature control (module adapter PCB circuit board 49, PT1000 sensor 18), the energy consumption during the experiment is reduced by 25%.

[0078] Easy to operate: The main cover 5 operating port 52, the self-locking device 6 rotating handle 39, modular wiring (outlet tube 28, fan wire 29) and other designs simplify the equipment debugging, component replacement and daily maintenance process, and reduce the learning cost for operators.

[0079] III. Comprehensive Technical Conclusions This novel constant-temperature metal bath, through structural innovations in "sensor optimization, enhanced power supply, efficient heat dissipation, flexible adaptation, and precise control," comprehensively addresses the core pain points of existing technologies. It achieves a comprehensive improvement in heating and cooling rates, temperature control accuracy, temperature uniformity, sample compatibility, and experimental reliability. It can be widely applied in batch experimental scenarios in fields such as biochemistry, medical testing, and molecular biology, providing a reliable guarantee for the accuracy and consistency of experimental results. At the same time, it reduces experimental costs and operational complexity, demonstrating significant technical advantages and application value.

[0080] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel constant-temperature metal bath, characterized in that: The device includes a main body (1), which includes an internal heat dissipation device (2), a radiator device (3), a metal heating and cooling device (4), a main cover (5), a self-locking device (6), a first limiting block (7), a second limiting block (8), a third limiting block (9), and a fourth limiting block (10). The radiator device (3) is installed on top of the internal heat dissipation device (2). The first limiting block (7) is installed on the right side of the top of the radiator device (3). The second limiting block (8) is installed on top of the first limiting block (7). The third limiting block (9) is installed on the left side of the top of the radiator device (3). The fourth limiting block (10) is installed on top of the third limiting block (9). The main cover (5) is installed on top of the second limiting block (8) and the fourth limiting block (10). The second limiting block (8) is installed on the left side inside the main cover (5). The metal heating and cooling device (4) is installed on top of the radiator device (3). The metal heating and cooling device (4) includes heat insulation cotton (11), Peltier (12), heating PI film (13) and heat-conducting plate (14). The heat insulation cotton (11) has a rectangular structure. A set of Peltier mounting grooves (15) distributed horizontally at equal intervals are opened on the surface of the heat insulation cotton (11). A set of Peltiers (12) is provided and a set of Peltiers (12) are respectively installed in a set of Peltier mounting grooves (15). A set of Peltiers (12) are connected in series. The Peltiers (12) have a square structure. The heating PI film (13) is installed on the top of the heat insulation cotton (11). The heating PI film (13) has a rectangular structure. A set of symmetrically distributed openings (16) are opened on the surface of the heating PI film (13). The openings (16) have a square structure. The heat-conducting plate (14) is installed on the top of the Peltiers (12) and the heating PI film (13).

2. The novel constant-temperature metal bath according to claim 1, characterized in that: The heat-conducting plate (14) has a rectangular structure. A sensor mounting slot (17) is provided at the left end of the heat-conducting plate (14). A PT1000 sensor (18) is installed in the sensor mounting slot (17). The sensor mounting slot (17) is also filled with thermal grease (19).

3. The novel constant-temperature metal bath according to claim 1, characterized in that: The radiator device (3) includes a fin seat (20) and heat dissipation fins (21). The heat dissipation fins (21) are provided in several groups. The fin seat (20) and the heat dissipation fins (21) are smoothly transitioned and integrally formed. The several groups of heat dissipation fins (21) are located at the bottom of the fin seat (20) in a horizontally equidistant manner. The fin seat (20) and the heat dissipation fins (21) are both rectangular in shape. There is a heat dissipation gap (22) between the several groups of heat dissipation fins (21). The top of the fin seat (20) is provided with several sets of fixing holes (23). The fin seat (20) and the heat dissipation fins (21) are made of aluminum.

4. A novel constant-temperature metal bath according to claim 1, characterized in that: The internal heat dissipation device (2) includes a fan mounting base (24) and an output fan (25). The fan mounting base (24) has a square shape and a hollow structure inside. The output fan (25) is installed inside the fan mounting base (24). There are reinforcing structural blocks (26) at the four corners inside the fan mounting base (24). The reinforcing structural blocks (26) have a triangular shape and two sets of reinforcing structural holes (27) on their surface. The reinforcing structural holes (27) have a triangular shape. There is a cable outlet tube (28) on the side of the fan mounting base (24). A fan cable (29) is installed inside the cable outlet tube (28) and is connected to the output fan (25).

5. A novel constant-temperature metal bath according to claim 4, characterized in that: The bottom of the fan mounting base (24) is provided with an air intake seat (30). The air intake seat (30) has a rectangular structure. The bottom left and bottom right ends of the air intake seat (30) are provided with side fixing feet (31). The air intake seat (30) has several sets of air intake holes (32) distributed horizontally at equal intervals on all four sides. The air intake holes (32) have a circular structure. A dust filter (33) is installed inside the air intake holes (32).

6. A novel constant-temperature metal bath according to claim 1, characterized in that: The first limiting block (7), the second limiting block (8), the third limiting block (9) and the fourth limiting block (10) are all Z-shaped structures. The first limiting block (7) and the second limiting block (8) are located at the right end of the heat insulation cotton (11) and the heat conduction plate (14), and the third limiting block (9) and the fourth limiting block (10) are located at the left end of the heat insulation cotton (11) and the heat conduction plate (14). The first limiting block (7) is provided with an insertion block (34) at the top, the second limiting block (8) is provided with an insertion groove (35) at the bottom, and the fourth limiting block (10) is provided with a limiting plate (36) at the top. The limiting plate (36) has a limiting groove (37) on its surface.

7. A novel constant-temperature metal bath according to claim 6, characterized in that: The self-locking device (6) includes a rotating rod (38), a rotating handle (39), a guide shaft (40), a modular locking block (41), and a spring (42). A set of guide shafts (40) is installed at equal intervals laterally on the left end of the limiting plate (36) and at both ends of the limiting groove (37). The modular locking block (41) and the spring (42) are both sleeved on a set of guide shafts (40). A set of springs (42) is located at the front end of the modular locking block (41). The rotating rod (38) is installed on the top of the left end of the main cover (5) via a rotating shaft and is located at the top of the modular locking block. On the rear side of block (41), a rotating top block (45) is installed at the bottom front end of the rotating rod (38). The front end of the rotating top block (45) has an arc-shaped structure. The rotating handle (39) is located on the top of the main cover (5). The bottom of the rotating handle (39) is connected to the top of the rotating rod (38). The module lock block (41) has a Z-shaped structure. The rear end of the module lock block (41) is provided with a top groove (44). The rotating top block (45) is located in the top groove (44). The front end of the module lock block (41) is provided with a self-locking block (46). The left and right ends of the module lock block (41) are provided with guide holes (43).

8. A novel constant-temperature metal bath according to claim 2, characterized in that: The main cover (5) has a rectangular structure. The bottom of the main cover (5) is provided with a first heating plate (47) and a second heating plate (48). The first heating plate (47) and the second heating plate (48) are both L-shaped. A module adapter PCB circuit board (49) is installed on the first heating plate (47). A probe mounting port (51) is opened at the top of the main cover (5). A temperature probe electrode (50) is installed in the probe mounting port (51) and the temperature probe electrode (50) is located inside the main cover (5). An operation port (52) is opened at the top of the main cover (5). The operation port (52) has a rectangular structure. The module adapter PCB circuit board (49) is connected to the Peltier (2), the heating PI film (13), the PT1000 sensor (18) and the temperature probe electrode (50) respectively through connecting wires.

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