Optical module

Abstract

The invention discloses an optical module, comprising: a housing; the PCB is arranged in the shell, and a penetrating part penetrating through the PCB is formed on the PCB; the support plate is arranged in the shell, is arranged at the position of the penetrating part and is connected with the PCB, and a concave part is formed between the support plate and the PCB in a surrounding manner; the electric chip is arranged in the concave part and is in bonding connection with the carrier plate; the optical component is at least partially arranged in the concave part and is in coupling connection with the electric chip; the optical chip is arranged in the concave part; and the connector is arranged in the shell, is electrically connected with a user mainboard and is in contact connection with the PCB. According to the optical module structure provided by the invention, the height occupation space can be reduced, the bonding disc process can be adopted on the carrier plate, the gold wire bonding requirement is ensured, the hard gold disc process can be adopted on the PCB, and the wear resistance of the contact disc when the optical module structure is in contact with the connector is met.

Description

Technical Field

[0001] This invention belongs to the field of optical transceiver module technology, specifically, it relates to an improvement in the structure of an optical module. Background Technology

[0002] With the increasing popularity and application of optical modules in specialized fields, users have raised new demands for them. These demands are mainly reflected in the continuous improvement of communication speeds, from the original 3Gbps per channel to the current 25Gbps per channel, resulting in greater communication bandwidth; and the reduction in overall device size and limited internal layout space, requiring a reduction in the overall size of the optical modules.

[0003] Existing optical modules generally have the following two structural forms.

[0004] Option 1: Single rigid PCB layer-by-layer stacking, such as... Figure 1 As shown, this type of optical module mainly consists of a housing 1000 (including an upper housing and a lower housing), an optical component 1100, an electrical chip 1200, an optical chip 1300, a single rigid board PCB 1400, and an LGA connector 1500.

[0005] The function of the optical module is to convert photoelectric signals. After being installed on the user's motherboard, it transmits optical signals to the outside world through the optical plug on the outside of the optical component, and transmits electrical signals to the user's motherboard through the LGA connector.

[0006] The internal optical path, optoelectronic chip, PCB, and LGA electrical connector are stacked layer by layer, resulting in a relatively high overall module height.

[0007] The upper surface of the PCB requires chip bonding, and the bonding pads need to be fabricated using a nickel-palladium-gold process. The lower surface of the PCB needs to connect with the spring contacts of the LGA connector, and its contact pads need to be fabricated using an electroplated hard gold process. Due to process and cost constraints, to ensure bonding reliability, currently only the nickel-palladium-gold process can be used to fabricate the surface pads on the same PCB board, which cannot simultaneously meet the wear-resistant hard gold requirements of the contact pads.

[0008] Option 2 Figure 2 As shown, this type of optical module mainly consists of a housing 1600 (including an upper housing and a lower housing), an optical component 1700, an electrical chip 1800, an optical chip 1900, a rigid-flexible-rigid PCB 1901, and an LGA connector 1902.

[0009] The optical module has an upper PCB and a lower PCB in the height direction, which is one more PCB than the first type of optical module. At the same time, the bending radius of the flexible PCB in the middle needs to be taken into account. The overall height and horizontal area of ​​the optical module need to be increased, making it difficult to miniaturize the overall size.

[0010] Compared to single-rigid PCBs, rigid-flex-rigid PCBs have a more complex manufacturing process and higher costs. Like single-rigid PCBs, they also cannot accommodate both bonding pads and contact pads for installation and use.

[0011] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0012] This invention addresses the problems of large height and space occupation in existing optical module structures and the inability to simultaneously meet the requirements of bonding pads and contact pads. It proposes a novel optical module structure that can reduce height and space occupation, and can use bonding pad technology on the carrier board to ensure the requirements of gold wire bonding, and can use hard gold pad technology on the PCB board to meet the wear resistance requirements of the contact pads when in contact with the connector.

[0013] To achieve the above-mentioned invention / design objectives, the present invention adopts the following technical solution: An optical module includes: case; A PCB board is disposed inside the housing, and a through-hole is formed on the PCB board; A carrier plate is disposed inside the housing, located at the through-hole position and connected to the PCB board, and a recess is formed between the carrier plate and the PCB board. An electrical chip is disposed within the recessed portion and bonded to the carrier plate. An optical chip is disposed within the recessed portion; An optical component is at least partially disposed within the recessed portion and coupled to the optical chip. The connector, located inside the housing, is used for electrical connection with the user's motherboard and for contact connection with the PCB board.

[0014] In some embodiments of this application, the carrier board is disposed on the bottom side of the PCB board, overlaps with the edge of the through portion, and is attached to the user's motherboard; The connector is located on the bottom side of the PCB board and is arranged around the carrier board.

[0015] In some embodiments of this application, a first electrical link is formed between the carrier board and the PCB board, between the PCB board and the connector, and on the connector.

[0016] In some embodiments of this application, a protective cover is provided below the PCB board, covering the recessed portion and mating with the housing, forming a wiring channel between the protective cover and the housing to facilitate the routing of optical components. The carrier board is disposed on the top surface of the PCB board, overlapping the edge of the through portion and fitting the housing. The connector is located on the bottom side of the PCB board and is arranged circumferentially around the protective cover.

[0017] In some embodiments of this application, the connector is a loop connector arranged along the circumference of the carrier plate, or it includes a plurality of first sub-connectors, which are respectively arranged along the circumference of the carrier plate.

[0018] In some embodiments of this application, a protective cover is provided below the PCB board, covering the recessed portion and mating with the housing, forming a wiring channel between the protective cover and the first housing to facilitate the routing of optical components. The carrier board is disposed on the top surface of the PCB board, overlaps with the edge of the through portion, and extends through the housing; The connector is located on the bottom side of the PCB board and is arranged circumferentially around the protective cover.

[0019] In some embodiments of this application, a second electrical link is formed between the carrier board and the PCB board, and between the PCB board and the connector.

[0020] In some embodiments of this application, the connector is a U-shaped connector, or includes a plurality of second sub-connectors, which are respectively arranged along the circumference of the protective cover.

[0021] In some embodiments of this application, a bonding pad for bonding with the electrical chip is provided on the carrier board; A hard gold contact pad that connects to the connector is provided on the PCB board.

[0022] Compared with the prior art, the advantages and positive effects of the present invention are: The optical module of the present invention has a housing and a through-hole on a PCB board. A carrier board is placed at the corresponding position of the through-hole. A recess is formed by the PCB board and the carrier board. The electrical chip, optical chip and at least some optical components are assembled in the recess. Compared with the method of stacking the components one by one, the above-mentioned structural method of arranging the chip and at least some optical components in the recess reduces the space occupied by the entire optical module in the height direction and reduces the size of the entire optical module. In this embodiment, the electrical chip, optical chip, and carrier board are connected by bonding. Specifically, bonding pads for bonding the electrical chip and optical chip are provided on the carrier board, and contact pads for connecting the connector are provided on the PCB board. By arranging the bonding pads and contact pads on different boards, the requirements for gold wire bonding are ensured, and the wear resistance assembly requirements of the contact pads when in contact with the connector springs are met by using a hard gold pad process on the PCB board.

[0023] Other features and advantages of the present invention will become clearer after reading the detailed embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the optical module structure of the existing technology's Scheme 1; Figure 2 This is a schematic diagram of the optical module structure of the second solution in the prior art; Figure 3 This is a cross-sectional view of the internal structure of an embodiment of the optical module of the present invention; Figure 4 yes Figure 3 A schematic diagram of the first electrical link of the optical module in the diagram; Figure 5 This is an exploded structural diagram of an embodiment of the optical module of the present invention; Figure 6 This is a schematic diagram of the connector arrangement structure of an embodiment of the optical module of the present invention; Figure 7 This is a cross-sectional view of the internal structure of an optical module according to another embodiment of the present invention; Figure 8 yes Figure 7 A schematic diagram of the second electrical link of the optical module in the diagram; Figure 9 This is an exploded structural diagram of another embodiment of the optical module of the present invention; Figure 10 This is a cross-sectional view of the internal structure of an optical module according to another embodiment of the present invention; Figure 11 yes Figure 9 A schematic diagram of the second electrical link of the optical module in the diagram; Figure 12 This is a schematic diagram of the structure of a connector of one embodiment of the optical module of the present invention; Figure 13 This is a schematic diagram of another embodiment of the connector of an optical module according to an embodiment of the present invention.

[0026] In the diagram, 100 is the housing; 200 is the PCB board; 210 is the through section; 220 is the hard gold contact pad; 230 is the BGA ball; 300 is the carrier board; 310 is the bonding pad; 400 is the recess; 510 is the electrical chip; 520 is the optical chip; 530 is the optical component; 600 is the connector; 610 is the first sub-connector; 620 is the second sub-connector; 700 is the user motherboard; 800 is the protective cover; and 900 is the wiring channel. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. In the description of embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0030] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0031] In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0032] In some embodiments of this application, an optical module is proposed, with reference to Figures 3-9 As shown, it includes: Casing 100; The PCB board 200 has a through portion 210 formed therethrough.

[0033] During the arrangement, the PCB board 200 is arranged horizontally, and the through part 210 is a through hole opened on the PCB board 200 from top to bottom.

[0034] The carrier board 300 is connected to the PCB board 200 and seals the through portion 210. The carrier board 300 can be a PCB, HTCC, LTCC, etc.

[0035] When arranged, the carrier board 300 is placed horizontally and can be connected to the top or bottom of the PCB board 200. It is positioned at the through-hole 210 and blocks one end of the through-hole 210.

[0036] During connection, the carrier board 300 and the PCB board 200 are fixed together by soldering BGA balls 230 to achieve signal connection and transmission.

[0037] A recessed portion 400 is formed between the carrier board 300 and the PCB board 200.

[0038] The optical component 530 is at least partially disposed within the recess 400, and transmits optical signals to the outside world through an external optical plug.

[0039] The electrical chip 510 is disposed in the recess 400 and bonded to the carrier plate 300.

[0040] The optical chip 520 is disposed within the recess 400 and coupled to the optical component 530.

[0041] During setup, a bonding pad 310 for wire bonding connection with the electrical chip 510 can be provided on the carrier board 300. The electrical chip 510 can be bonded to the bonding pad 310 by gold wire bonding.

[0042] When arranging the optical module, at least a portion of the optical component 530, the optical chip 520, and the electrical chip 510 are all built into the recessed portion 400, which can reduce the space occupied by the entire optical module in the height direction.

[0043] The optical chip 520 is a laser and / or a detector.

[0044] Connector 600 is used for electrical connection with user motherboard 700 and for contact connection with PCB board 200.

[0045] Specifically, during setup, a hard gold contact plate 220 is provided on the PCB board 200, and the connector 600 makes contact with the contact plate through its spring contacts.

[0046] Connector 600 is an LGA connector 600, which enables the transmission of electrical signals with the user's motherboard 700.

[0047] In this embodiment, the optical module structure is configured such that the bonding pads 310 of the electrical chip 510 are placed on the carrier board 300, while the contact pads of the LGA connector 600 are arranged on the optical module PCB board 200. The carrier board 300 and the PCB are manufactured separately. The carrier board 300 can use the bonding pad 310 process to ensure the requirements of gold wire bonding, while the PCB board 200 can use the hard gold pad process to meet the wear resistance requirements of the contact pads when in contact with the spring contacts of the connector 600. The two do not restrict each other. In use, the two boards are mounted together using the SMT process with BGA balls 230.

[0048] In this embodiment, the optical module is configured with a housing 100 and a through-hole 210 on a PCB board 200. A carrier board 300 is positioned at the location of the through-hole 210. A recess 400 is formed by the PCB board 200 and the carrier board 300. The electrical chip 510, the optical chip 520, and at least some optical components 530 are assembled in the recess 400. Compared with the method of stacking the components one by one, the above-mentioned arrangement of the chip and at least some optical components 530 in the recess 400 reduces the space occupied by the entire optical module in the height direction and reduces the size of the entire optical module. In this embodiment, the electrical chip is bonded to the carrier board 300. Specifically, a bonding pad 310 for bonding the electrical chip is provided on the carrier board 300, and a corresponding contact pad for connecting to the connector 600 is provided on the PCB board 200. By arranging the bonding pad 310 and the contact pad on different boards, the requirements for gold wire bonding are ensured, and the wear resistance assembly requirements of the contact pad when in contact with the spring contacts of the connector 600 are met by using a hard gold pad process on the PCB board 200.

[0049] In some embodiments of this application, reference is made to Figures 3-5 As shown, the carrier board 300 is located on the bottom side of the PCB board 200, overlaps with the edge of the through portion 210, and is attached to the user motherboard 700.

[0050] When the carrier board 300 is set up, it is attached to the bottom surface of the PCB board 200 and the position corresponding to the through part 210. The outer edge of the carrier board 300 and the PCB board 200 around the through part 210 are soldered together with BGA balls 230 to realize signal connection.

[0051] The housing 100 is an open-bottomed shell that wraps around the outside of the PCB board 200 from top to bottom; The connector 600 is located on the bottom side of the PCB board 200 and is arranged around the carrier board 300.

[0052] An optical chip 520 and an electrical chip 510 are mounted on the upper surface of the carrier board 300 inside the cavity to transmit optical signals with the optical component 530 above. The lower surface of the carrier board 300 is attached to the user motherboard 700, which can directly transfer the heat of the optical chip 520 and electrical chip 510 to the user motherboard 700 for heat dissipation, thereby improving heat dissipation efficiency.

[0053] The LGA connector 600 is attached to the bottom side of the PCB board 200 and arranged around the carrier board 300. This arrangement can reduce the height occupied. Compared with the first type of "single rigid PCB layer-by-layer stacking" optical module and the second type of "rigid-flexible-rigid PCB" optical module structure in the prior art, the overall height of the optical module can be reduced.

[0054] The specific packaging process is as follows: 1) Place BGA balls 230 on the carrier board 300, and then mount it together with the PCB board 200 of the optical module; 2) The electrical chip 510 is mounted on the upper surface of the carrier board 300, located in the recess 400 formed by the carrier board 300 and the PCB board 200. 3) Couple and fix the optical component 530 to the optical chip 520; 4) Mount the assembly formed by the above three steps into the housing 100 and secure it. 5) Install the LGA connector 600 at the bottom to complete the packaging of the entire product.

[0055] In some embodiments of this application, a first electrical link is formed between the carrier board 300 and the PCB board 200, between the PCB board 200 and the connector 600, and on the connector 600. The first electrical link is the transmission path of the first electrical signal, as shown below. Figure 4 As shown.

[0056] In some embodiments of this application, two electrical chips 510 are provided and arranged side by side on the carrier board 300, and two optical chips 520 are correspondingly provided.

[0057] Since the electrical chip 510 is arranged on the upper surface of the carrier board 300 and the PCB board 200 is connected to the carrier board 300, a transmission path for the first electrical signal will be formed between the carrier board 300 and the PCB board 200, between the PCB board 200 and the connector 600, and on the connector 600.

[0058] In the existing first and second schemes, the first electrical link of the optical module needs to be drilled in the PCB board 200 because it passes through the PCB board 200. The electrical link is relatively long and the signal quality is affected.

[0059] The first electrical link in this embodiment is: (e.g.) Figure 4 As shown, the electrical signal emitted by the electrical chip 510 first passes between the carrier board 300 and the PCB board 200, then across the surfaces of the carrier board 300 and the PCB board 200, and then enters between the PCB board 200 and the connector 600, that is, across the surfaces of the PCB board 200 and the connector 600, and then passes through the connector 600 before being transmitted out. During the electrical signal transmission process, there is no need to drill holes in the PCB board 200. Compared with the electrical links in the existing optical modules of Scheme 1 and Scheme 2, the electrical link is shortened, which improves the signal transmission quality.

[0060] In some embodiments of this application, such as Figure 6 As shown, the connector 600 is a loop connector 600 arranged circumferentially along the carrier plate 300, or it includes a plurality of first sub-connectors 610, which are respectively arranged circumferentially along the carrier plate 300.

[0061] In some embodiments of this application, reference is made to Figures 7-9 As shown, it includes a protective cover 800, which is disposed below the PCB board 200, covering the recessed portion 400, and mating with the housing 100. A wiring channel 900 is formed between the protective cover 800 and the housing 100 to facilitate the routing of the optical component 530. The protective cover 800 has a smaller cross-sectional area than the PCB board 200 and is attached to the bottom surface of the PCB board 200. The housing 100 is attached to the top of the PCB board 200.

[0062] The carrier plate 300 is disposed on the top surface of the PCB board 200, overlaps with the edge of the through portion 210 and fits against the housing 100.

[0063] When the carrier board 300 is arranged, it is sealed on the top of the through-hole 210, and its periphery is soldered to the PCB board 200 around the through-hole 210 through BGA balls 230 to achieve signal connection.

[0064] The electrical chip 510 is bonded to the bottom surface of the carrier 300, and the optical chip 520 is arranged on the bottom surface of the carrier 300 for coupling with the optical component 530.

[0065] The carrier board 300 is attached to the housing 100. The heat generated by the electrical chip 510 and the optical chip 520 can be transferred to the housing 100 through the carrier board 300, and then dissipated directly to the outside through the housing 100, achieving a more efficient heat dissipation effect.

[0066] The connector 600 is located on the bottom side of the PCB board 200 and surrounds the protective cover 800. The LGA connector 600 is attached to the bottom side of the PCB board 200 and arranged around the protective cover 800. This arrangement can reduce the height occupied. Compared with the first type of "single rigid PCB layer-by-layer stacking" optical module and the second type of "rigid-flexible-rigid PCB" optical module structure in the prior art, the overall height of the optical module can be reduced.

[0067] The specific packaging process of the optical module in this embodiment is as follows: 1) Place BGA balls 230 on the carrier board 300, and then mount it together with the PCB board 200 of the optical module; 2) The electrical chip 510 and the optical chip 520 are mounted on the lower surface of the carrier board 300, so that they are located in the recess 400 formed by the carrier board 300 and the PCB board 200. 3) Couple and fix the optical component 530 to the optical chip 520; 4) Assemble a protective cover 800 to protect the electrical chip 510 and optical component 530 inside the recess 400; 5) Mount the assembly formed by the above four steps into the housing 100 and secure it. 6) Install the LGA connector 600 at the bottom to complete the packaging of the entire product.

[0068] In some embodiments of this application, reference is made to Figures 10-11 As shown, it includes a protective cover 800, which is disposed below the PCB board 200, covering the recessed portion 400, and mating with the housing 100. A wiring channel 900 is formed between the protective cover 800 and the first housing 100 to facilitate the routing of the optical component 530.

[0069] The carrier plate 300 is disposed on the top surface of the PCB board 200, overlaps with the edge of the through portion 210 and extends from the housing 100; The connector 600 is located on the bottom side of the PCB board 200 and is arranged circumferentially around the protective cover 800.

[0070] During installation, a through cavity is formed on the housing 100, and the carrier plate 300 is placed inside the through cavity, with its top surface exposed above the top surface of the housing 100. This allows the carrier plate 300 to directly contact the external space, achieving a better heat dissipation effect.

[0071] Users can install a heat-conducting cold plate on the top surface to contact it, further improving heat dissipation efficiency.

[0072] In some embodiments of this application, reference is made to Figure 8 , Figure 11 As shown, a second electrical link is formed between the carrier board 300 and the PCB board 200, and between the PCB board 200 and the connector 600.

[0073] Since the carrier board 300 is positioned above the PCB board 200, the electrical signal propagation path of the second electrical link is as follows: after the electrical chip 510 emits an electrical signal, it passes through the surfaces of the carrier board 300 and the PCB board 200, then passes through the PCB board 200, and directly enters the connector 600 from the PCB board 200, and is transmitted to the user motherboard 700 through the connector 600.

[0074] The second electrical signal propagation path passes between the carrier board 300 and the PCB board 200, and between the PCB board 200 and the connector 600. Compared with the existing schemes one and two, its electrical link is shortened.

[0075] In some embodiments of this application, the connector 600 is a U-shaped connector 600 arranged along the circumference of the protective cover 800, or it includes a plurality of first sub-connectors 610, which are respectively arranged along the circumference of the protective cover 800.

[0076] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions claimed by the present invention.

Claims

1. An optical module, characterized in that, Including: case; A PCB board is disposed inside the housing, and a through-hole is formed on the PCB board; A carrier plate is disposed inside the housing, located at the through-hole position and connected to the PCB board, and a recess is formed between the carrier plate and the PCB board. An electrical chip is disposed within the recessed portion and bonded to the carrier plate. An optical chip is disposed within the recessed portion; An optical component is at least partially disposed within the recessed portion and coupled to the optical chip. The connector, located inside the housing, is used for electrical connection with the user's motherboard and for contact connection with the PCB board.

2. The optical module according to claim 1, characterized in that, The carrier board is located on the bottom side of the PCB board, overlaps with the edge of the through portion, and is attached to the user's motherboard. The electrical chip and the optical chip are located on the top surface of the carrier board. The connector is located on the bottom side of the PCB board and is arranged around the carrier board.

3. The optical module according to claim 2, characterized in that, A first electrical link is formed between the carrier board and the PCB board, between the PCB board and the connector, and on the connector.

4. The optical module according to claim 1, characterized in that, Including: A protective cover is disposed below the PCB board, covering the recessed area, and mating with the housing to form a wiring channel between the protective cover and the first housing for easy routing of optical components. The carrier board is disposed on the top surface of the PCB board, overlapping the edge of the through portion and fitting the housing. The electrical chip and the optical chip are disposed on the bottom surface of the carrier plate; The connector is located on the bottom side of the PCB board and is arranged circumferentially around the protective cover.

5. The optical module according to claim 1, characterized in that, The connector is a loop connector arranged along the circumference of the carrier plate, or it includes multiple first sub-connectors, which are respectively arranged along the circumference of the carrier plate.

6. The optical module according to claim 1, characterized in that, It includes a protective cover, which is located below the PCB board and covers the recessed area. It is mated and cooperates with the housing, forming a wiring channel between the protective cover and the first housing to facilitate the routing of optical components. The carrier board is disposed on the top surface of the PCB board, overlaps with the edge of the through portion, and extends outward from the housing; The connector is located on the bottom side of the PCB board and is arranged circumferentially around the protective cover.

7. The optical module according to claim 1, characterized in that, A second electrical link is formed between the carrier board and the PCB board, and between the PCB board and the connector.

8. The optical module according to claim 6, characterized in that, The connector is a U-shaped connector, or it includes multiple second sub-connectors, which are respectively arranged along the circumference of the protective cover.

9. The optical module according to claim 1, characterized in that, A bonding pad for bonding connection with the electrical chip is provided on the carrier plate; A hard gold contact pad that connects to the connector is provided on the PCB board.

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