High-broadband signal source conditioning circuit and implementation method thereof

Abstract

The invention relates to a high-bandwidth signal source conditioning circuit and an implementation method thereof, and the circuit comprises a signal input interface which is used for receiving an external to-be-conditioned high-bandwidth signal; the input end of the AC / DC switching module is connected with the signal input interface and is used for carrying out component identification on the high-broadband signal; the input end of the DC signal conditioning module is connected with the AC / DC switching module and performs first signal conditioning on the DC component signal; the input end of the AC signal conditioning module is connected with the AC / DC switching module and performs second signal conditioning on the AC component signal; the multi-stage filter bank is matched with the MEMS switch array and is used for switching an adaptive filtering path according to signal frequency band characteristics and providing filtering support for the first signal conditioning or the second signal conditioning; the input end of the signal synthesis module is connected with the DC signal conditioning module and the AC signal conditioning module, the conditioned DC component signal and the conditioned AC component signal are synthesized to obtain a synthesized signal, and the synthesized signal is output through the signal output interface.

Description

Technical Field

[0001] This application relates to the fields of semiconductor testing and optical communication technology, and in particular to a high-bandwidth signal source conditioning circuit and its implementation method. Background Technology

[0002] As the electronic information industry develops towards high speed and high precision, the requirements for bandwidth, accuracy, and response speed in key areas such as high-speed data acquisition and radar detection are becoming increasingly stringent. In these scenarios, high-bandwidth signal conditioning (bandwidth ≥ 8GHz, with some high-end scenarios covering DC to 15GHz and above) is the core of signal processing, and its performance determines the system's accuracy and reliability. For example, in radar detection systems, the bandwidth and frequency characteristics of the echo signal are crucial to the accuracy of capturing key target information, requiring a high-bandwidth conditioning link to achieve distortion-free signal amplification and clutter suppression; in high-speed data acquisition equipment, the sensor output signal contains DC bias and high-frequency dynamic signals, requiring the conditioning link to cover the entire frequency band to prevent data loss; in the field of optical communication, high-speed optical module testing requires a high-bandwidth conditioning link to match the electrical domain conversion characteristics of the optical signal to ensure accurate test results. However, current mainstream high-bandwidth signal conditioning link technologies have many technical bottlenecks in practical applications, making it difficult to meet the high requirements of related fields. The specific problems are as follows: 1. Incomplete frequency band coverage and gaps in DC and high-frequency signal conditioning: Existing conditioning links mostly rely on single amplification devices. RF amplifiers, limited by circuit topology, cannot handle DC and near-DC frequency band signals, covering only a few hundred kHz to high frequencies. While traditional DC amplifiers can handle DC signals, their high-frequency bandwidth is limited to within 5 GHz. To cover the DC to 15 GHz frequency band, multiple independent conditioning circuits need to be built, increasing system size, cost, and power consumption. This can also easily lead to signal distortion or gaps at frequency band junctions, affecting the overall signal conditioning performance.

[0003] 2. Insufficient high-frequency signal conditioning performance, making it difficult to overcome bandwidth and distortion bottlenecks: Traditional high-bandwidth conditioning schemes are based on differential amplifiers. However, they are limited by the decreasing common-mode rejection ratio with increasing frequency and the attenuation effect of parasitic capacitance and inductance on high-frequency signals, making it difficult to exceed 5GHz in practical usable bandwidth. Even if the bandwidth approaches 5GHz, high-frequency signal distortion will increase, with gain fluctuations exceeding 3dB, failing to meet the requirements of "high bandwidth, low distortion".

[0004] 3. Uneven filtering performance across a wide frequency band, making it difficult to achieve the desired performance across multiple frequency bands: The filtering units in the conditioning link need to suppress clutter interference, but existing solutions mostly use single-parameter filters. A single filter cannot simultaneously achieve the desired filtering performance across different frequency bands over a wide frequency band. Filters optimized for low frequencies experience increased insertion loss and decreased out-of-band rejection at high frequencies; filters optimized for high frequencies are prone to in-band ripple at low frequencies, reducing the conditioning accuracy of low-frequency signals and failing to provide a stable and clean signal source.

[0005] 4. Slow switching speed and high loss of high-frequency signals affect link response efficiency: When conditioning multi-channel signals or switching frequency bands, switching devices are required to switch signal paths. Currently, electromagnetic relays are the mainstream choice, but their mechanical structure has defects: First, the switching speed is slow and cannot meet the requirements of high-speed data acquisition for fast switching; second, the high-frequency parasitic parameters are large, which will produce significant attenuation and phase shift in high-frequency signal transmission, resulting in a decrease in signal integrity; at the same time, the isolation of electromagnetic relays is insufficient, which can easily cause crosstalk between channels and affect the overall performance of the conditioning link. Therefore, there is an urgent need to develop a high-bandwidth signal source conditioning circuit and its implementation method to solve one or more of the above-mentioned problems. Summary of the Invention

[0006] In view of this, in order to solve the above-mentioned technical problems or some of the technical problems, the present invention provides a high-bandwidth signal source conditioning circuit and its implementation method.

[0007] In a first aspect, this application provides a high-bandwidth signal source conditioning circuit, the circuit comprising: a signal input interface, an AC / DC switching module, a DC signal conditioning module, an AC signal conditioning module, a multi-stage filter bank, a MEMS switch array, a signal synthesis module, and a signal output interface; The signal input interface is used to receive external high-bandwidth signals to be conditioned and to send the high-bandwidth signals to the AC / DC switching module. The input terminal of the AC / DC switching module is connected to the signal input interface, and is used to receive the high-bandwidth signal sent by the signal input interface, and to identify the components of the high-bandwidth signal to determine whether the high-bandwidth signal is a DC component signal or an AC component signal. If it is a DC component signal, it is sent to the DC signal conditioning module; if it is an AC component signal, it is sent to the AC signal conditioning module. The input terminal of the DC signal conditioning module is connected to the AC / DC switching module, and is used to receive the DC component signal sent by the AC / DC switching module, perform first signal conditioning on the DC component signal, and send the conditioned DC component signal to the signal synthesis module. The first signal conditioning includes low noise amplification, linearity optimization and gain adjustment. The input terminal of the AC signal conditioning module is connected to the AC / DC switching module, and is used to receive the AC component signal sent by the AC / DC switching module, perform second signal conditioning on the AC component signal, and send the conditioned AC component signal to the signal synthesis module. The second signal conditioning includes signal enhancement and configuration filtering. The multi-level filter bank works in conjunction with the MEMS switch array to switch the appropriate filtering path according to the signal frequency band characteristics, providing filtering support for the first signal conditioning or the second signal conditioning. The input terminal of the signal synthesis module is connected to the DC signal conditioning module and the AC signal conditioning module respectively. It is used to receive the conditioned DC component signal sent by the DC signal conditioning module and the conditioned AC component signal sent by the AC signal conditioning module, and synthesize the conditioned DC component signal and the conditioned AC component signal to obtain a synthesized signal, which will be output through the signal output interface.

[0008] In one possible implementation, the circuit further includes a logic control module; The logic control module is connected to the MEMS switch array and the multi-stage filter bank, and is used to automatically control the MEMS switch array to switch to the matching filter path according to the frequency band characteristics of the input signal.

[0009] In one possible implementation, the AC / DC switching module includes a coupling circuit consisting of a coupling capacitor and an isolation resistor, used to separate the DC component signal from the AC component signal.

[0010] In one possible implementation, the DC signal conditioning module includes a high-speed, high-precision amplification unit, which employs a low-noise operational amplifier to amplify the DC component signal to reduce noise. The AC signal conditioning module includes a radio frequency amplifier, which is equipped with a suitable peripheral matching circuit and auxiliary amplification structure to improve the gain stability and linearity of high-frequency signals.

[0011] In one possible implementation, the DC signal conditioning module further includes a fully differential amplifier for converting the input differential signal into a single-ended signal and enhancing the signal gain.

[0012] In one possible implementation, the AC signal conditioning module switches the AC component signal to N parallel channels via a MEMS switch array. Each of the parallel channels is equipped with a filter adapted to the channel frequency band characteristics. The conditioned N signals are combined by the MEMS switch array and then transmitted to the signal synthesis module.

[0013] In one possible implementation, the multi-stage filter bank consists of multiple dedicated filters, each of which is optimized for a specific frequency band; The MEMS switch array is an RF MEMS switch. The RF MEMS switch, together with a dedicated driving circuit and impedance matching design, is used to achieve rapid switching of high-frequency signal paths.

[0014] In one possible implementation, the signal synthesis module includes impedance matching elements and phase calibration elements to achieve the integrity of the synthesized signal.

[0015] In one possible implementation, the circuit further includes a programmable attenuator and a bias circuit unit; The programmable attenuator is used to adjust the amplitude of the signal; The bias circuit unit is used to provide the corresponding bias voltage according to the needs of the actual application scenario.

[0016] Secondly, this application provides a method for implementing a high-bandwidth signal source conditioning circuit, the method comprising: Receives high-bandwidth signals from external sources that require conditioning; Component identification is performed on the high-bandwidth signal to determine whether the high-bandwidth signal is a DC component signal or an AC component signal; The DC component signal is subjected to a first signal conditioning, which includes low-noise amplification, linearity optimization, and gain adjustment. The AC component signal is subjected to a second signal conditioning process, which includes signal enhancement and configuration filtering. The appropriate filtering path is switched according to the signal frequency band characteristics to provide filtering support for the first signal conditioning or the second signal conditioning. The conditioned DC component signal and the conditioned AC component signal are combined to obtain a composite signal, which is then output.

[0017] Compared with the prior art, the technical solution provided in this application has the following advantages: The link provided in this application, through AC / DC separation and collaborative conditioning architecture design, successfully overcomes many problems existing in the current technology; it effectively addresses the discontinuity phenomenon that occurs between DC signals and high-frequency signals during conditioning, and optimizes the connection and cooperation between the two. Simultaneously, this architecture significantly improves the processing performance of high-frequency signals, solving the previous problem of insufficient high-frequency performance, making signal transmission more stable and efficient; furthermore, for the case of unbalanced filtering, a more uniform filtering effect is achieved through precise design, thereby ensuring the consistency of signal quality; finally, in terms of switching efficiency, the speed and stability of signal switching are greatly improved, providing strong support for the improvement of overall system performance. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0021] Figure 1 A circuit diagram of a high-bandwidth signal source conditioning circuit provided in an embodiment of this application; Figure 2 A schematic diagram of the AC / DC signal separation and synthesis circuit provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the multi-stage filter bank and intelligent switching circuit provided in the embodiments of this application; Figure 4 This is a flowchart illustrating a method for implementing a high-bandwidth signal source conditioning circuit according to an embodiment of this application. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0024] To address the shortcomings of existing conditioning links, which often rely on single amplification devices for signal processing, RF amplifiers, limited by circuit topology, cannot handle DC and near-DC signals, covering only a few hundred kHz to high frequencies. While traditional DC amplifiers can handle DC signals, their high-frequency bandwidth is limited to within 5 GHz, failing to meet high-bandwidth requirements. To cover the DC to 15 GHz band, multiple independent conditioning circuits are needed, increasing system size, cost, and power consumption. This also increases the risk of interference during signal switching, leading to signal distortion or gaps at band junctions and affecting continuous conditioning performance across the entire frequency band. Furthermore, traditional high-bandwidth conditioning schemes use differential amplifiers, but their common-mode rejection ratio decreases significantly with increasing frequency, and parasitic capacitance and inductance attenuate high-frequency signals, making it difficult to achieve a usable bandwidth exceeding 5 GHz. Even with optimization to approach 5 GHz, high-frequency signal distortion increases, with gain fluctuations exceeding 3 dB, failing to meet the "high bandwidth, low distortion" requirement. Finally, the filtering units in the conditioning link need to suppress noise; existing solutions often use single-parameter filters, which struggle to balance filtering performance across different frequency bands. Filters optimized for low frequencies suffer from increased insertion loss and decreased out-of-band rejection at high frequencies; conversely, filters optimized for high frequencies are prone to in-band ripple at low frequencies, reducing the conditioning accuracy of low-frequency signals and failing to provide a stable and clean signal source. Multi-channel signal conditioning or frequency band switching requires switching devices to change the signal path. Currently, electromagnetic relays are the mainstream choice, but their mechanical structure has drawbacks: slow switching speed, failing to meet the demands of high-speed data acquisition; large high-frequency parasitic parameters, leading to high-frequency signal attenuation and phase shift, reducing signal integrity; and insufficient isolation, easily causing inter-channel crosstalk, affecting the overall performance of the conditioning link. This application provides a high-bandwidth signal source conditioning circuit and its implementation method, addressing the shortcomings in frequency band coverage, high-frequency amplification, wide-band filtering, and high-frequency switching, which have become key bottlenecks restricting the performance improvement of high-speed electronic equipment. It achieves a high-bandwidth signal conditioning link technology with full-band coverage from DC to high frequencies, low high-frequency distortion, multi-band filtering equalization, and fast, low-loss high-frequency switching, meeting urgent practical needs and possessing significant technical value.

[0025] Figure 1 A circuit diagram of a high-bandwidth signal source conditioning circuit provided in an embodiment of this application is shown below. Figure 1 As shown, the circuit includes: a signal input interface, an AC / DC switching module, a DC signal conditioning module, an AC signal conditioning module, a multi-stage filter bank, a MEMS switch array, a signal synthesis module, and a signal output interface; The signal input interface is used to receive external high-bandwidth signals to be conditioned and to send the high-bandwidth signals to the AC / DC switching module. The input terminal of the AC / DC switching module is connected to the signal input interface, and is used to receive the high-bandwidth signal sent by the signal input interface, and to identify the components of the high-bandwidth signal to determine whether the high-bandwidth signal is a DC component signal or an AC component signal. If it is a DC component signal, it is sent to the DC signal conditioning module; if it is an AC component signal, it is sent to the AC signal conditioning module. The input terminal of the DC signal conditioning module is connected to the AC / DC switching module, and is used to receive the DC component signal sent by the AC / DC switching module, perform first signal conditioning on the DC component signal, and send the conditioned DC component signal to the signal synthesis module. The first signal conditioning includes low noise amplification, linearity optimization and gain adjustment. The input terminal of the AC signal conditioning module is connected to the AC / DC switching module, and is used to receive the AC component signal sent by the AC / DC switching module, perform second signal conditioning on the AC component signal, and send the conditioned AC component signal to the signal synthesis module. The second signal conditioning includes signal enhancement and configuration filtering. The multi-level filter bank works in conjunction with the MEMS switch array to switch the appropriate filtering path according to the signal frequency band characteristics, providing filtering support for the first signal conditioning or the second signal conditioning. The input terminal of the signal synthesis module is connected to the DC signal conditioning module and the AC signal conditioning module respectively. It is used to receive the conditioned DC component signal sent by the DC signal conditioning module and the conditioned AC component signal sent by the AC signal conditioning module, and synthesize the conditioned DC component signal and the conditioned AC component signal to obtain a synthesized signal, which will be output through the signal output interface.

[0026] The high-bandwidth signal source conditioning circuit provided in this application mainly includes a signal input interface, an AC / DC switching module, a DC signal conditioning module, an AC signal conditioning module, a multi-stage filter bank, a MEMS switch array, a signal synthesis module, a signal output interface, a power management module, and a logic control module. The data output from the DAC first passes through the first-stage MEMS switch. The FPGA controls the MEMS switch to switch the data stream to either a DC link or an AC link according to the user's configuration, thus forming two different signal conditioning paths. In an optional embodiment of the present invention, the circuit further includes a logic control module; The logic control module is connected to the MEMS switch array and the multi-stage filter bank, and is used to automatically control the MEMS switch array to switch to the matching filter path according to the frequency band characteristics of the input signal.

[0027] In this embodiment, to overcome the shortcomings of traditional electromagnetic relays in high-frequency applications, such as slow switching speed and large parasitic parameters, this invention uses an RF MEMS switch as the core switching element, combined with a dedicated drive circuit and impedance matching design, to form a fast switching system for high-frequency signal paths. This design helps reduce link insertion loss, improve signal response speed, and better maintain the integrity of high-frequency signals.

[0028] In an optional embodiment of the present invention, the AC / DC switching module includes a coupling circuit, which consists of a coupling capacitor and an isolation resistor, and is used to separate the DC component signal from the AC component signal.

[0029] In an optional embodiment of the present invention, the DC signal conditioning module includes a high-speed, high-precision amplification unit, which employs a low-noise operational amplifier to amplify the DC component signal to reduce noise. The AC signal conditioning module includes a radio frequency amplifier, which is equipped with a suitable peripheral matching circuit and auxiliary amplification structure to improve the gain stability and linearity of high-frequency signals.

[0030] In an optional embodiment of the present invention, the DC signal conditioning module further includes a fully differential amplifier, which is used to convert the input differential signal into a single-ended signal and enhance the signal gain.

[0031] In this embodiment, addressing the issue that existing RF amplifiers struggle to effectively cover DC and low-frequency signals, a system architecture for separate AC and DC signal processing is proposed. This architecture achieves effective separation of AC and DC components through a dedicated coupling circuit, with each component processed by an independent conditioning unit: DC and low-frequency signals are conditioned by a high-speed, high-precision amplification unit, while AC and high-frequency signals are processed by the RF amplification unit. Finally, a signal synthesis unit re-merges the two signals, achieving continuous frequency band coverage from DC to high frequencies, effectively broadening the overall operating bandwidth of the signal conditioning link.

[0032] like Figure 2 As shown in the figure, this diagram presents the specific implementation structures of a dedicated coupling circuit (including coupling capacitors and isolation resistors), a DC signal amplification circuit (using a low-noise operational amplifier), an AC signal amplification circuit (based on an RF amplifier), and a signal synthesis circuit (including impedance matching and phase calibration components).

[0033] exist Figure 2 In this process, the data output from the DAC first passes through a first-stage MEMS switch. Based on user configuration, the FPGA controls this MEMS switch to switch the data stream to either a DC link or an AC link, thus creating two different signal conditioning paths: Path 1: Data flow via DC link When the data stream passes through the DC link, it goes through the following processing stages in sequence: First, the signal enters the first-stage fully differential amplifier (FDA), which converts the differential signal into a single-ended signal. Subsequently, spurious signals in the link are suppressed by a filter; For bias requirements in some application scenarios, the system is also equipped with a bias circuit unit, and users can set the corresponding bias voltage according to actual needs; Finally, the signal is sequentially passed through a programmable attenuator and a fully differential amplifier for amplitude adjustment and drive enhancement, and is finally output to the device under test.

[0034] Path 2: Data flow via AC link When a user needs to send a high-frequency signal, the data stream enters the AC link, and its processing flow is as follows: The signal first passes through a balun, converting the differential signal output by the DAC into a single-ended signal; The converted signal is distributed into N parallel channels via MEMS switches, and each channel is equipped with a set of filters; the filters can be selected as low-pass, band-pass or high-pass types according to actual design needs; When the insertion loss of a high-frequency link is large, the signal can be appropriately conditioned by programmable attenuators and amplifiers in each channel to ensure signal quality. The conditioned N signals are then combined by a MEMS switch to form a single output; Finally, the signal undergoes conditioning by a combination of amplifiers and programmable attenuators to further optimize output performance.

[0035] The high-bandwidth signal source conditioning circuit provided in this application embodiment has good scalability and flexibility in design. The number and model of amplifiers and attenuators used in the specific link can be reasonably selected and configured according to the specific design goals of the project.

[0036] In one optional embodiment of the present invention, the AC signal conditioning module switches the AC component signal to N parallel channels via a MEMS switch array. Each of the parallel channels is equipped with a filter adapted to the channel frequency band characteristics. The conditioned N signals are combined by the MEMS switch array and then transmitted to the signal synthesis module.

[0037] In one optional embodiment of the present invention, the multi-stage filter bank consists of multiple dedicated filters, each of which is optimized for a specific frequency band; The MEMS switch array is an RF MEMS switch. The RF MEMS switch, together with a dedicated driving circuit and impedance matching design, is used to achieve rapid switching of high-frequency signal paths.

[0038] like Figure 3 The diagram illustrates the circuit topology of multiple frequency band filter banks, as well as the connection relationships between the logic control unit (such as FPGA), drive circuit, and status detection circuit and the filter banks.

[0039] In this embodiment, to address the performance limitations of traditional differential amplifiers in high-frequency scenarios, a high-performance radio frequency amplifier is selected as the core amplification device, and supporting circuit optimizations are performed around it. By selecting optimal device types, designing compatible peripheral matching circuits, and combining auxiliary amplification structures, the signal gain stability and linearity in the high-frequency band are improved, significantly extending the high-frequency operating bandwidth of the link and improving the transmission quality of high-frequency signals.

[0040] To address the challenge of maintaining good performance across a wide frequency band with a single filter, this embodiment presents a configurable filtering architecture composed of multiple dedicated filters, covering different signal frequency bands. Each filter is optimized for a specific frequency band and equipped with an intelligent switching circuit that automatically selects the matching filter path based on the frequency band characteristics of the input signal. This achieves good in-band flatness and low insertion loss across the entire frequency band, improving the overall filtering balance of the link.

[0041] To overcome the shortcomings of traditional electromagnetic relays in high-frequency applications, such as slow switching speed and large parasitic parameters, this embodiment uses an RF MEMS switch as the core switching element, combined with a dedicated drive circuit and impedance matching design, to form a fast switching system for high-frequency signal paths. This design helps reduce link insertion loss, improve signal response speed, and better maintain the integrity of high-frequency signals.

[0042] In an optional embodiment of the present invention, the signal synthesis module includes an impedance matching element and a phase calibration element to achieve the integrity of the synthesized signal.

[0043] In an optional embodiment of the present invention, the circuit further includes a programmable attenuator and a bias circuit unit; The programmable attenuator is used to adjust the amplitude of the signal; The bias circuit unit is used to provide the corresponding bias voltage according to the needs of the actual application scenario.

[0044] In this embodiment, to achieve accurate synthesis of the DC and AC component signals and ensure the continuity and integrity of the synthesized signal across the entire frequency band, this invention integrates a precision impedance matching network and a dynamic phase calibration unit in the signal synthesis module. The impedance matching network, by selecting high-precision surface-mount resistors, capacitors, and inductors, combined with a microstrip line structure design, uniformly matches the output impedances of the DC and AC conditioning links to the system characteristic impedance (typically 50Ω), effectively eliminating signal reflection loss at the synthesis node and reducing the VSWR. The phase calibration unit, based on the FPGA, acquires the phase information of the DC and AC component signals in real time, calculates the phase difference between them using a built-in phase compensation algorithm, and drives an adjustable phase shifter to fine-tune the phase of one of the signals. This ensures that the two signals remain in phase during synthesis, avoiding signal cancellation or distortion due to phase mismatch. Especially at the junction of the DC and AC frequency bands (such as around several hundred kHz), it significantly improves the smoothness of the signal transition, ensuring that the amplitude fluctuation of the synthesized signal is controlled within ±1dB and the phase shift does not exceed 5°.

[0045] Figure 4 A flowchart illustrating an implementation method for a high-bandwidth signal source conditioning circuit provided in this application embodiment is shown below. Figure 4 As shown, the method includes: S401, Receives external high-bandwidth signals to be conditioned; S402. Perform component identification on the high-bandwidth signal to determine whether the high-bandwidth signal is a DC component signal or an AC component signal. S403. Perform first signal conditioning on the DC component signal, the first signal conditioning including low noise amplification, linearity optimization and gain adjustment; S404. Perform second signal conditioning on the AC component signal, the second signal conditioning including signal enhancement and configuration filtering; S405. Switch the appropriate filtering path according to the signal frequency band characteristics to provide filtering support for the first signal conditioning or the second signal conditioning; S406. The conditioned DC component signal and the conditioned AC component signal are combined to obtain a composite signal, and the composite signal is output.

[0046] The implementation method of the high-bandwidth signal source conditioning circuit provided in this application embodiment achieves precise conditioning of wideband signals through step-by-step processing and intelligent collaboration.

[0047] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented using software plus a general-purpose hardware platform, or of course, using hardware. Based on this understanding, the above technical solutions, in essence or the parts that contribute to the related technology, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0048] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0049] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A high-bandwidth signal source conditioning circuit, characterized in that, The circuit includes: a signal input interface, an AC / DC switching module, a DC signal conditioning module, an AC signal conditioning module, a multi-stage filter bank, a MEMS switch array, a signal synthesis module, and a signal output interface; The signal input interface is used to receive external high-bandwidth signals to be conditioned and to send the high-bandwidth signals to the AC / DC switching module. The input terminal of the AC / DC switching module is connected to the signal input interface, and is used to receive the high-bandwidth signal sent by the signal input interface, and to identify the components of the high-bandwidth signal to determine whether the high-bandwidth signal is a DC component signal or an AC component signal. If it is a DC component signal, it is sent to the DC signal conditioning module; if it is an AC component signal, it is sent to the AC signal conditioning module. The input terminal of the DC signal conditioning module is connected to the AC / DC switching module, and is used to receive the DC component signal sent by the AC / DC switching module, perform first signal conditioning on the DC component signal, and send the conditioned DC component signal to the signal synthesis module. The first signal conditioning includes low noise amplification, linearity optimization and gain adjustment. The input terminal of the AC signal conditioning module is connected to the AC / DC switching module, and is used to receive the AC component signal sent by the AC / DC switching module, perform second signal conditioning on the AC component signal, and send the conditioned AC component signal to the signal synthesis module. The second signal conditioning includes signal enhancement and configuration filtering. The multi-level filter bank works in conjunction with the MEMS switch array to switch the appropriate filtering path according to the signal frequency band characteristics, providing filtering support for the first signal conditioning or the second signal conditioning. The input terminal of the signal synthesis module is connected to the DC signal conditioning module and the AC signal conditioning module respectively. It is used to receive the conditioned DC component signal sent by the DC signal conditioning module and the conditioned AC component signal sent by the AC signal conditioning module, and synthesize the conditioned DC component signal and the conditioned AC component signal to obtain a synthesized signal, which will be output through the signal output interface.

2. The circuit according to claim 1, characterized in that, The circuit also includes a logic control module; The logic control module is connected to the MEMS switch array and the multi-stage filter bank, and is used to automatically control the MEMS switch array to switch to the matching filter path according to the frequency band characteristics of the input signal.

3. The circuit according to claim 1, characterized in that, The AC / DC switching module includes a coupling circuit, which consists of a coupling capacitor and an isolation resistor, and is used to separate the DC component signal from the AC component signal.

4. The circuit according to claim 1, characterized in that, The DC signal conditioning module includes a high-speed, high-precision amplification unit, which employs a low-noise operational amplifier to amplify the DC component signal to reduce noise. The AC signal conditioning module includes a radio frequency amplifier, which is equipped with a suitable peripheral matching circuit and auxiliary amplification structure to improve the gain stability and linearity of high-frequency signals.

5. The circuit according to claim 4, characterized in that, The DC signal conditioning module also includes a fully differential amplifier, which is used to convert the input differential signal into a single-ended signal and enhance the signal gain.

6. In the circuit according to claim 4, the AC signal conditioning module switches the AC component signal to N parallel channels via a MEMS switch array. Each of the parallel channels is equipped with a filter adapted to the channel frequency band characteristics. The conditioned N signals are combined by the MEMS switch array and then transmitted to the signal synthesis module.

7. The circuit according to claim 1, characterized in that, The multi-stage filter bank consists of multiple dedicated filters, each of which is optimized for a specific frequency band; The MEMS switch array is an RF MEMS switch. The RF MEMS switch, together with a dedicated driving circuit and impedance matching design, is used to achieve rapid switching of high-frequency signal paths.

8. The circuit according to claim 1, characterized in that, The signal synthesis module includes impedance matching elements and phase calibration elements to ensure the integrity of the synthesized signal.

9. The circuit according to claim 1, characterized in that, The circuit also includes a programmable attenuator and a bias circuit unit; The programmable attenuator is used to adjust the amplitude of the signal; The bias circuit unit is used to provide the corresponding bias voltage according to the needs of the actual application scenario.

10. A method for implementing a high-bandwidth signal source conditioning circuit, characterized in that, The implementation method is applied to the circuit as described in any one of claims 1-9, and the method includes: Receives high-bandwidth signals from external sources that require conditioning; Component identification is performed on the high-bandwidth signal to determine whether the high-bandwidth signal is a DC component signal or an AC component signal; The DC component signal is subjected to a first signal conditioning, which includes low-noise amplification, linearity optimization, and gain adjustment. The AC component signal is subjected to a second signal conditioning process, which includes signal enhancement and configuration filtering. The appropriate filtering path is switched according to the signal frequency band characteristics to provide filtering support for the first signal conditioning or the second signal conditioning. The conditioned DC component signal and the conditioned AC component signal are combined to obtain a composite signal, which is then output.

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