Communication circuit board with high structural strength

Abstract

The invention discloses a high-structural-strength circuit board for communication. The high-structural-strength circuit board comprises a circuit board body, a three-dimensional reinforcing assembly, a composite heat dissipation assembly, a multi-dimensional shielding assembly and an adjustable fixing assembly. The circuit board body comprises a conductive circuit layer and an insulating medium layer which are arranged in a stacked mode. The three-dimensional reinforcing assembly comprises a circumferential edge covering reinforcing part, a three-dimensional latticed reinforcing part and a bottom bearing reinforcing part. The composite heat dissipation assembly comprises a heat conduction part and an air cooling flow channel part integrated with the bottom supporting and reinforcing part. The multi-dimensional shielding assembly comprises a plane shielding layer embedded in the insulating medium layer and a circumferential shielding layer integrated in the circumferential edge wrapping reinforcing part. The adjustable fixing assembly comprises a mounting hole and an anti-tearing limiting sleeve. According to the integrated design, stress dispersion and installation adaptability are achieved, the structural strength, heat dissipation, shielding and installation performance of the circuit board are synchronously improved, and the negative effect caused by single optimization in the prior art is avoided.

Description

Technical Field

[0001] This invention relates to the field of communication circuit board technology, and in particular to a communication circuit board with high structural strength. Background Technology

[0002] As a core component of electronic devices such as 5G communication, optical communication, and smart home appliances, the performance of communication circuit boards directly affects the stability and reliability of the entire system. With the development of communication technology towards higher frequencies, higher densities, and smaller sizes, and the increasing diversification of application scenarios, more stringent requirements are being placed on the comprehensive performance of circuit boards, such as structural strength, heat dissipation efficiency, electromagnetic compatibility, and ease of installation.

[0003] In existing technologies, optimization of circuit board performance is often limited to a single dimension. For example, to improve bending resistance, reinforcing strips made of FR material are often glued to the edges of the circuit board, but this increases the board thickness and may obstruct airflow for heat dissipation. To solve the heat dissipation problem, independent aluminum alloy heat sinks or fans are usually installed on the circuit board, but this not only increases assembly complexity, but its weight may also cause the circuit board to deform under vibration. To achieve electromagnetic shielding, a common practice is to weld metal shielding covers to sensitive components, but this only achieves local shielding and cannot suppress electromagnetic leakage between circuit board layers or at the edges, and the shielding cover also hinders heat dissipation. In terms of installation and fixing, the circuit board relies on only a few simple metallized mounting holes, which are prone to cracking at the hole edges or warping of the board due to stress concentration when tightening bolts.

[0004] Therefore, the aforementioned existing technical solutions have significant drawbacks: they are fragmented and difficult to coordinate. The stacking of reinforcements, heat sinks, and shielding covers results in bulky circuit boards, complex assembly, and mutual constraints on various performance aspects, leading to a "one-for-one" problem. For example, the reinforcement structure hinders heat dissipation, while the shielding structure affects heat dissipation and increases size, thus failing to meet the complex operating conditions in multiple scenarios simultaneously.

[0005] Therefore, it is necessary to provide a communication circuit board with high structural strength to overcome the above-mentioned defects. Summary of the Invention

[0006] The purpose of this invention is to provide a communication circuit board with high structural strength, aiming to solve the problem of how to simultaneously achieve three-dimensional structural reinforcement, efficient heat dissipation across the entire range, multi-dimensional electromagnetic shielding across the entire frequency band, and reliable installation and fixation that can be adjusted in multiple scenarios, so as to overcome the limitations of single performance optimization in the prior art and enable the circuit board to stably adapt to various complex application scenarios such as 5G communication, optical communication, and smart home appliances.

[0007] To achieve the above objectives, the present invention provides a communication circuit board with high structural strength, comprising: The circuit board body includes a conductive circuit layer and an insulating dielectric layer stacked together. A three-dimensional reinforcement component, comprising a circumferential edge reinforcement portion wrapped around the four edges of the circuit board body, a three-dimensional mesh reinforcement portion embedded inside the circuit board body, and a bottom support reinforcement portion fitted to the bottom surface of the circuit board body; A composite heat dissipation assembly includes a heat-conducting part that is in contact with the heat-generating element of the circuit board body, and an air-cooling channel part that is integrated with the bottom support and reinforcement part. The air-cooling channel part is used to guide the cooling airflow through the bottom surface of the circuit board body. A multidimensional shielding assembly, comprising a planar shielding layer embedded within the insulating dielectric layer and a circumferential shielding layer integrated within the circumferential edge reinforcement portion, wherein the planar shielding layer and the circumferential shielding layer are electrically connected. An adjustable fixing component includes a mounting hole on the circuit board body and a tear-resistant limiting sleeve embedded in the mounting hole to distribute installation stress.

[0008] In a preferred embodiment, the circumferential edge reinforcement includes an insulating edge sleeve that covers the edge of the circuit board body in a C-shape, and reinforcing ribs embedded in the insulating edge sleeve and extending along its length; the inner side of the insulating edge sleeve is also provided with a buffer pad that fits against the side wall of the edge of the circuit board body.

[0009] In a preferred embodiment, the three-dimensional mesh reinforcement includes a grid-shaped reinforcement mesh frame embedded inside the circuit board body, and multiple longitudinal reinforcing fibers that penetrate along the thickness direction of the circuit board body and are fixedly connected to the grid-shaped reinforcement mesh frame; the grid area of ​​the grid-shaped reinforcement mesh frame is offset from the component mounting positions and via positions of the circuit board body.

[0010] In a preferred embodiment, the bottom support reinforcement includes a support substrate that is attached to the bottom surface of the circuit board body, and reinforcing ribs disposed on the bottom surface of the support substrate; a circulating air duct is formed between the reinforcing ribs and communicates with the air-cooling flow channel; the air-cooling flow channel includes a miniature fan disposed at one end of the support substrate and communicates with the circulating air duct.

[0011] In a preferred embodiment, the composite heat dissipation assembly further includes a phase change heat dissipation part embedded inside the circumferential edge reinforcement part; the phase change heat dissipation part includes a sealed phase change cavity and a phase change material filled in the phase change cavity, and the inner wall of the phase change cavity is in contact with the edge heat conduction area of ​​the circuit board body.

[0012] In a preferred embodiment, the planar shielding layer includes two nanocrystalline alloy shielding films and a wave-absorbing material layer sandwiched between the two nanocrystalline alloy shielding films; the circumferential shielding layer is a conductive foam strip embedded inside the circumferential edge reinforcement portion, the conductive foam strip is arranged in a closed loop and is connected to the edge grounding line of the circuit board body.

[0013] In a preferred embodiment, the mounting holes include standard circular mounting holes disposed on the edge of the circuit board body, and / or waist-shaped adjustable mounting slots disposed in the middle of the circuit board body.

[0014] In a preferred embodiment, the tear-resistant limiting sleeve includes an insulating bushing fitted inside the mounting hole, and an upper limiting flange and a lower limiting flange integrally disposed at both ends of the insulating bushing and respectively attached to the top and bottom surfaces of the circuit board body; the upper and lower limiting flanges are respectively attached to the top and bottom surfaces of the circuit board body.

[0015] In a preferred embodiment, the tear-resistant limiting sleeve further includes a metal threaded sleeve embedded inside the insulating bushing, the two ends of which are respectively abutted or fixedly connected to the upper limiting flange and the lower limiting flange.

[0016] In a preferred embodiment, the circuit board body further includes a base core board and a solder resist layer; the conductive circuit layer includes a first copper foil circuit layer and a second copper foil circuit layer respectively disposed on both sides of the insulating dielectric layer; the base core board, the first copper foil circuit layer, the insulating dielectric layer, the second copper foil circuit layer, and the solder resist layer are sequentially stacked and pressed together.

[0017] The high-strength communication circuit board provided by this invention features a three-dimensional reinforcement component that wraps and supports the circuit board body from the edges, interior, and bottom, fundamentally improving its resistance to bending and impact. The heat-conducting part of the composite heat dissipation component rapidly dissipates heat from hot spots, while the air-cooling channel integrated into the bottom supporting reinforcement achieves uniform heat dissipation over a large area. The multi-dimensional shielding component forms a closed electromagnetic shielding ring by embedding a planar shielding layer internally and integrating a circumferential shielding layer in the circumferential edge reinforcement, effectively preventing internal signal leakage and external interference. The adjustable fixing component, through the cooperation of mounting holes and tear-resistant limiting sleeves, achieves stress dispersion and installation adaptability. This integrated design simultaneously improves the structural strength, heat dissipation, shielding, and installation performance of the circuit board, avoiding the negative effects of single-optimization in existing technologies. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A simplified three-dimensional exploded view of a communication circuit board with high structural strength provided by the present invention; Figure 2 A simplified three-dimensional exploded view of the layered structure of the main body of the circuit board; Figure 3 A simplified three-dimensional cross-sectional view of the circumferential edge reinforcement mechanism; Figure 4 This is a simplified three-dimensional schematic diagram of the adjustable fixing component.

[0020] The diagram labels are as follows: 100, main body of the circuit board; 110, base core board; 120, first copper foil circuit layer; 130, insulating dielectric layer; 140, second copper foil circuit layer; 150, solder resist layer. 200. Three-dimensional reinforcement component; 210. Circumferential edge reinforcement; 211. Insulating edge sleeve; 212. Reinforcing rib; 213. Buffer pad; 220. Three-dimensional mesh reinforcement; 221. Grid-shaped reinforcement frame; 230. Bottom support reinforcement; 231. Supporting substrate; 300. Composite heat dissipation component; 310. Thermal conductive part; 311. Thermal conductive plate; 320. Air-cooled flow channel; 321. Circulating air duct; 330. Phase change heat dissipation part; 400. Multidimensional shielding assembly; 410. Planar shielding layer; 420. Circumferential shielding layer; 500 Adjustable fixing component; 510 Mounting hole; 520 Tear-resistant limit sleeve; 521 Insulating bushing; 522 Upper limit flange; 523 Lower limit flange; 524 Metal threaded sleeve. Detailed Implementation

[0021] To make the objectives, technical solutions, and beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described in this specification are merely for explaining the invention and are not intended to limit the invention.

[0022] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0023] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0024] In an embodiment of the present invention, a communication circuit board with high structural strength is provided. Through an integrated structural design of "layered reinforcement, composite heat dissipation, multi-dimensional shielding, and adjustable fixing", the structural strength, heat dissipation performance, electromagnetic shielding performance, and installation adaptability of the circuit board are improved simultaneously, which greatly improves the operational stability and service life of the circuit board under complex working conditions.

[0025] like Figures 1-4 As shown, this high-strength communication circuit board includes a circuit board body 100, and a three-dimensional reinforcement component 200, a composite heat dissipation component 300, a multi-dimensional shielding component 400, and an adjustable fixing component 500 arranged around the body. These components work together to form a functionally integrated whole. The structure and implementation principle of each component are further explained below.

[0026] The circuit board body 100 is the foundation for carrying electronic components and realizing circuit connections. Combined with... Figure 2 As shown, the circuit board body 100 includes a base core board 110, a first copper foil circuit layer 120, an insulating dielectric layer 130, a second copper foil circuit layer 140, and a solder resist protective layer 150 covering the outermost layer, which are stacked and pressed together from bottom to top.

[0027] The base core board 110 can be made of epoxy fiberglass cloth substrate with a thickness of approximately 0.8mm ± 0.2mm, serving as the supporting core of the circuit board. The first copper foil circuit layer 120 and the second copper foil circuit layer 140 are both conductive circuit layers, for example, using 35μm ± 10μm thick electrolytic copper foil, with the required fine circuit patterns formed through etching. The insulating dielectric layer 130 is used to isolate the first and second copper foil circuit layers, and its material can be a 12μm ± 3μm thick polyimide insulating film (PI film). The solder resist layer 150 is used to protect the circuit and prevent short circuits during soldering, and can use photosensitive solder resist ink with a coating thickness of approximately 20μm ± 5μm.

[0028] The three-dimensional reinforcement component 200 is used to comprehensively improve the mechanical strength of the circuit board in three-dimensional space. It includes a circumferential edge reinforcement part 210, a three-dimensional mesh reinforcement part 220, and a bottom support reinforcement part 230.

[0029] The circumferential edge reinforcement 210 is used to cover the four edges of the circuit board body 100. Specifically, in conjunction with Figure 3 As shown, the circumferential edge reinforcement 210 includes a C-shaped insulating edge sleeve 211 that covers the edge of the circuit board body and a reinforcing rib 212 embedded in the insulating edge sleeve 211 and extending continuously along its length. The insulating edge sleeve 211 can be made of flame-retardant PC plastic, forming a closed-loop protection for the edge of the circuit board motherboard 100. The reinforcing rib 212 can be made of glass fiber reinforced resin, with a Young's modulus of up to 20 GPa, which can significantly improve the bending rigidity of the edge structure. To prevent damage to the circuit board from hard contact, a buffer pad 213 is also provided on the inner side of the insulating edge sleeve 211, which adheres to the sidewall of the edge of the circuit board body 100. For example, the buffer pad 213 can be made of silicone rubber.

[0030] Combination Figure 2 As shown, a three-dimensional mesh-like reinforcing section 220 is embedded inside the circuit board body 100, specifically inside the base core board 110. It includes a grid-shaped reinforcing mesh frame 221 and multiple longitudinal reinforcing fibers (not shown in the figure). The grid-shaped reinforcing mesh frame 221 can be made of alumina ceramic matrix composite material with a thickness of 0.3mm ± 0.1mm. Its mesh area is staggered with the component mounting positions and via positions on the circuit board body 100 to avoid interfering with normal electrical connections. The multiple longitudinal reinforcing fibers can be made of T700 grade carbon fiber, running through the thickness direction of the base core board 110, with both ends fixedly connected to the upper and lower surfaces of the grid-shaped reinforcing mesh frame 221. This three-dimensional structure of "mesh frame combined with fiber" provides strong tensile and shear strength in the X, Y, and Z coordinate axes, increasing the bending strength inside the circuit board by more than 60%.

[0031] The bottom support and reinforcement part 230 is fitted and disposed on the bottom surface of the circuit board body 100. Figure 1As shown, the bottom support reinforcement 230 includes a support substrate 231 supporting the bottom surface of the circuit board body 100, and multiple crisscrossing reinforcing ribs (not shown) disposed on the bottom surface of the support substrate 231. The support substrate 231 can be made of die-cast aluminum alloy A380 with a thickness of 1mm ± 0.3mm, and can be bonded to the bottom surface of the circuit board body 100 through a layer of thermally conductive insulating adhesive (not shown) with a thickness of 0.1mm ± 0.02mm and a thermal conductivity of 2.0 W / (m·K), providing both uniform bottom support and establishing an efficient heat conduction path. The height of the reinforcing ribs is 2mm ± 1mm, and multiple air-cooling channels are formed between them.

[0032] In this embodiment, the composite heat dissipation component 300 is used to efficiently dissipate the heat generated during the operation of the circuit board, including a heat-conducting part 310, an air-cooled flow channel part 320, and a phase change heat dissipation part 330.

[0033] Specifically, the heat-conducting part 310 is used to quickly conduct heat from the heat-generating element to the heat dissipation structure. The heat-conducting part 310 includes multiple sets of heat-conducting sheets 311 and several heat-conducting copper pillars (not shown in the figure). The heat-conducting sheets 311 can be made of a high thermal conductivity material with a thermal conductivity of 3 W / (m·K), and are attached to the bottom surface of heat-generating components such as power chips and power management ICs on the circuit board body 100, guiding their heat to the supporting substrate 231 below. The heat-conducting copper pillars can be made of brass with a diameter of 0.8 mm ± 0.3 mm, and are arranged through the thickness direction of the circuit board body 100. One end of the heat-conducting copper pillar is connected to the grounding pad of the heat-generating component, and the other end extends to the surface of the supporting substrate 231 and contacts or welds to it, forming a low thermal resistance vertical heat conduction path of "hot spot, ground layer, heat dissipation substrate". To prevent short circuits, polyimide insulating sleeves are provided between the heat-conducting copper pillars and the first copper foil circuit layer 120 and the second copper foil circuit layer 140.

[0034] In this embodiment, the air-cooled flow channel 320 and the bottom support reinforcement 230 are integrated into one unit to guide the cooling airflow across the bottom surface of the circuit board body 100. Figure 4As shown, the air-cooled flow channel 320 includes a miniature fan (not shown) disposed at one end of the supporting substrate 231 and communicates with a circulating air duct 321 formed by staggered spacing based on reinforcing ribs 232. For example, the miniature fan can be a 5V DC miniature axial fan, and its air outlet is connected to the air inlet of the circulating air duct 321. The circulating air duct 321 can be designed in an S-shape to increase the airflow path and heat exchange area. Furthermore, its inner wall is coated with a graphene thermally conductive coating with a thermal conductivity of up to 500 W / (m·K), which can efficiently absorb the heat from the supporting substrate 231. An array of air outlets is provided at the other end of the supporting substrate 231, and the air outlet of the circulating air duct 321 is connected to these air outlets, from which the cooling airflow is finally discharged, carrying away the heat.

[0035] Furthermore, the phase change heat dissipation part 330 is embedded inside the circumferential edge reinforcement part 210 to absorb and buffer transient thermal shocks. Combined with Figure 3 As shown, the phase change heat dissipation unit 330 includes a sealed phase change cavity (which can be reused inside the reinforcing rib 212) and a phase change material filling the cavity. The phase change cavity extends continuously along the length of the insulating edging sleeve 211, and its inner wall is in contact with the edge heat-conducting area of ​​the circuit board body 100 (e.g., copper foil at the edge). The phase change material can be a paraffin-based composite phase change material with a phase change temperature of 45°C. When the edge temperature of the circuit board exceeds 45°C, the phase change material absorbs heat and undergoes a solid-liquid phase change, storing the heat as latent heat, thereby suppressing a rapid temperature rise; when the temperature decreases, the phase change material solidifies, slowly releasing the stored heat. This passive heat dissipation method effectively solves the problems of auxiliary heat dissipation and thermal buffering in the edge area.

[0036] In an embodiment of the present invention, the multi-dimensional shielding component 400 is used to achieve full-band electromagnetic interference shielding of the circuit board, including a planar shielding layer 410 and a circumferential shielding layer 420.

[0037] A planar shielding layer 410 is embedded within the insulating dielectric layer 130 to suppress interlayer signal crosstalk and external vertical electromagnetic interference. Figure 2As shown, the planar shielding layer 410 in this embodiment is a composite structure, including two layers of nanocrystalline alloy shielding films (not shown in the figure) and a ferrite absorbing material layer (not shown in the figure) sandwiched between the two nanocrystalline alloy shielding films. The nanocrystalline alloy shielding film has a thickness of 15μm±3μm and has extremely high magnetic permeability, providing good shielding effect against low-frequency magnetic fields; while the ferrite absorbing material layer has a thickness of 20μm±5μm, effectively absorbing high-frequency electromagnetic waves and reducing reflection. This planar shielding layer 410 completely covers the high-frequency signal transmission area of ​​the circuit board body 100. The grounding terminals of the two nanocrystalline alloy shielding films are electrically connected to the grounding pad of the circuit board body 100 through metallized vias, forming an effective discharge path. To prevent short circuits with the circuit layers, polyimide insulating sleeves are provided between the planar shielding layer 410 and the first copper foil circuit layer 120 and the second copper foil circuit layer 140.

[0038] Specifically, the circumferential shielding layer 420 is integrated inside the circumferential edge reinforcement part 210 and is electrically connected to the planar shielding layer 410, forming a closed-loop shielding system. Figure 3 As shown, in this embodiment, the circumferential shielding layer 420 is a conductive foam strip embedded inside the insulating edging sleeve 211. This conductive foam strip is arranged in a closed loop along the circumference of the insulating edging sleeve 211. Its inner side is in contact with the grounded copper foil at the edge of the circuit board body 100 for conduction. Simultaneously, its ends or sides contact the edge of the inner planar shielding layer 410 or are connected via conductive adhesive, thereby achieving conductivity. This design effectively solves the problem of electromagnetic signal leakage from the edge of the circuit board.

[0039] Furthermore, in the non-component soldering area of ​​the outermost solder mask layer 150 of the circuit board body 100, a surface shielding coating (not shown in the figure) is also coated. This coating can be formed by screen printing using graphene conductive ink, with a thickness of 10μm, and is electrically connected to the grounding pad, further enhancing the surface's electromagnetic interference resistance.

[0040] In an embodiment of the present invention, an adjustable fixing component 500 is used to achieve reliable installation and stress distribution of the circuit board, including mounting holes 510 and tear-resistant limiting sleeves 520.

[0041] Specifically, mounting holes 510 are provided on the circuit board body 100 for fixing the circuit board to a chassis or bracket using fasteners such as bolts. In this embodiment, as shown... Figure 1As shown, the mounting holes 510 include standard circular mounting holes located at the four corners of the circuit board body 100 and / or two oblong adjustable mounting slots (not shown in the figure) located in the middle of the circuit board body 100. The standard mounting holes have a diameter of φ3.2mm and are used for conventional positioning installation. The adjustable mounting slots can be M3 size oblong slot structures, with a certain adjustment margin in the long axis direction to adapt to different mounting hole spacing scenarios, improving the versatility of the circuit board. To enhance wear resistance and grounding performance, the inner walls of both the standard mounting holes and the adjustable mounting slots are provided with a metal plating layer.

[0042] The tear-resistant limiting sleeve 520 is embedded in the mounting hole 510 to distribute installation stress. Figure 4 As shown, the tear-resistant limiting sleeve 520 includes an insulating bushing 521 fitted into the mounting hole 510, and an upper limit flange 522 and a lower limit flange 523 integrally formed at both ends of the insulating bushing 521. The insulating bushing 521 can be made of PA66 nylon, which has good insulation and a certain degree of elasticity. The upper limit flange 522 and the lower limit flange 523 are respectively attached to the top and bottom surfaces of the circuit board body 100, expanding the stress area around the mounting hole to the entire flange surface. To further improve the connection strength and wear resistance, the tear-resistant limiting sleeve 520 also includes a metal threaded sleeve 524 embedded inside the insulating bushing 521. It should be noted that... Figure 4 In this design, the middle portion of the insulating bushing 521 is concealed to allow for easy and direct visualization of the metal threaded sleeve 524. The metal threaded sleeve 524 can be an M3 brass threaded sleeve, with its two ends abutting against the upper limit flange 522 and the lower limit flange 523, respectively. When the bolts are tightened, the preload is evenly distributed across a large area of ​​the circuit board body 100 through the metal threaded sleeve 524 and the upper and lower flanges, effectively preventing stress concentration that could lead to tearing of the mounting holes and bending of the board.

[0043] In summary, the high-strength communication circuit board provided by this invention features a three-dimensional reinforcement component 200 that provides three-dimensional wrapping and support to the circuit board body 100 from the edges, interior, and bottom, fundamentally improving its resistance to bending and impact. The heat-conducting part 310 in the composite heat dissipation component 300 quickly dissipates heat from hot spots, while the air-cooling channel part 320 integrated on the bottom supporting reinforcement part 230 achieves uniform heat dissipation over a large area. The multi-dimensional shielding component 400 forms a closed electromagnetic shielding ring by embedding a planar shielding layer 410 internally and integrating a circumferential shielding layer 420 in the circumferential edge reinforcement part 210, effectively preventing internal signal leakage and external interference. The adjustable fixing component 500 achieves stress dispersion and installation adaptability through the cooperation of the mounting hole 510 and the tear-resistant limiting sleeve 520. This integrated design allows for simultaneous improvement in the structural strength, heat dissipation, shielding, and installation performance of the circuit board, avoiding the negative effects of single-optimization in existing technologies.

[0044] The present invention is not limited to the description in the specification and embodiments, and thus other advantages and modifications can be readily realized by those skilled in the art. Therefore, the present invention is not limited to the specific details, representative devices and illustrated examples shown and described herein without departing from the spirit and scope of the general concept as defined by the claims and their equivalents.

Claims

1. A communication circuit board with high structural strength, characterized in that, include: The circuit board body includes a conductive circuit layer and an insulating dielectric layer stacked together. A three-dimensional reinforcement component, comprising a circumferential edge reinforcement portion wrapped around the four edges of the circuit board body, a three-dimensional mesh reinforcement portion embedded inside the circuit board body, and a bottom support reinforcement portion fitted to the bottom surface of the circuit board body; A composite heat dissipation assembly includes a heat-conducting part that is in contact with the heat-generating element of the circuit board body, and an air-cooling channel part that is integrated with the bottom support and reinforcement part. The air-cooling channel part is used to guide the cooling airflow through the bottom surface of the circuit board body. A multidimensional shielding assembly, comprising a planar shielding layer embedded within the insulating dielectric layer and a circumferential shielding layer integrated within the circumferential edge reinforcement portion, wherein the planar shielding layer and the circumferential shielding layer are electrically connected. An adjustable fixing component includes a mounting hole on the circuit board body and a tear-resistant limiting sleeve embedded in the mounting hole to distribute installation stress.

2. The high-strength communication circuit board as described in claim 1, characterized in that, The circumferential edge reinforcement includes an insulating edge sleeve that covers the edge of the circuit board body in a C-shape, and a reinforcing rib embedded in the insulating edge sleeve and extending along its length; the inner side of the insulating edge sleeve is also provided with a buffer pad that fits against the side wall of the edge of the circuit board body.

3. The high-strength communication circuit board as described in claim 1, characterized in that, The three-dimensional mesh reinforcement includes a grid-shaped reinforcement mesh frame embedded inside the circuit board body, and multiple longitudinal reinforcing fibers that run through the circuit board body along its thickness direction and are fixedly connected to the grid-shaped reinforcement mesh frame; the grid area of ​​the grid-shaped reinforcement mesh frame is offset from the component mounting positions and via positions of the circuit board body.

4. The high-strength communication circuit board as described in claim 1, characterized in that, The bottom support and reinforcement part includes a support base plate that is attached to the bottom surface of the circuit board body, and reinforcing ribs disposed on the bottom surface of the support base plate; a circulating air duct is formed between the reinforcing ribs and is connected to the air-cooling flow channel part; the air-cooling flow channel part includes a miniature fan disposed at one end of the support base plate and connected to the circulating air duct.

5. The high-strength communication circuit board as described in claim 4, characterized in that, The composite heat dissipation assembly further includes a phase change heat dissipation part embedded inside the circumferential edge reinforcement part; the phase change heat dissipation part includes a sealed phase change cavity and a phase change material filled in the phase change cavity, and the inner wall of the phase change cavity is in contact with the edge heat conduction area of ​​the circuit board body.

6. The high-strength communication circuit board as described in claim 1, characterized in that, The planar shielding layer includes two layers of nanocrystalline alloy shielding film and a wave-absorbing material layer sandwiched between the two layers of nanocrystalline alloy shielding film; the circumferential shielding layer is a conductive foam strip embedded in the circumferential edge reinforcement part, the conductive foam strip is arranged in a closed loop and is connected to the edge grounding line of the circuit board body.

7. The high-strength communication circuit board as described in claim 1, characterized in that, The mounting holes include standard circular mounting holes located on the edge of the circuit board body, and / or waist-shaped adjustable mounting slots located in the middle of the circuit board body.

8. The high-strength communication circuit board as described in claim 7, characterized in that, The tear-resistant limiting sleeve includes an insulating bushing fitted inside the mounting hole, and an upper limiting flange and a lower limiting flange integrally formed at both ends of the insulating bushing and respectively attached to the top and bottom surfaces of the circuit board body; the upper and lower limiting flanges are respectively attached to the top and bottom surfaces of the circuit board body.

9. The high-strength communication circuit board as described in claim 8, characterized in that, The tear-resistant limiting sleeve also includes a metal threaded sleeve embedded inside the insulating bushing, the two ends of which are respectively abutted or fixedly connected to the upper limit flange and the lower limit flange.

10. The high-strength communication circuit board as described in claim 1, characterized in that, The circuit board body also includes a base core board and a solder resist layer; the conductive circuit layer includes a first copper foil circuit layer and a second copper foil circuit layer respectively disposed on both sides of the insulating dielectric layer; the base core board, the first copper foil circuit layer, the insulating dielectric layer, the second copper foil circuit layer, and the solder resist layer are sequentially stacked and pressed together.

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