Chip packaging structure and chip packaging method

Abstract

The invention provides a chip packaging structure and a chip packaging method, and relates to the technical field of semiconductor packaging. The chip packaging method comprises the following steps: providing a substrate on which a chip is mounted; the side, away from the substrate, of the chip is provided with a functional area. The chip is electrically connected with the substrate. A fence is formed on the periphery of the functional area; the fence comprises a plurality of stand columns arranged at intervals. A first gap is formed between every two adjacent stand columns. Pasting a glass plate on the fence; wherein the glass plate is adhered to the fence through a transparent adhesive film, and the transparent adhesive film at least partially covers the first gap. And forming a plastic package body wrapping the chip, the glass plate and the fence on the substrate. The packaging mode is beneficial to improving the heat dissipation performance, slowing down the aging of the adhesive film on the back surface of the glass plate, and improving the reliability and durability of the structure.

Description

[0001] This application is a divisional application based on the parent application filed on December 3, 2025, entitled "Application No.: 2025118044021, Invention Title: Chip Packaging Method and Chip Packaging Structure". Technical Field

[0002] This invention relates to the field of semiconductor packaging technology, and in particular to a chip packaging structure and a chip packaging method. Background Technology

[0003] With the rapid development of the semiconductor industry, chip packaging technology mainly includes: charge-coupled device (CCD) chips, CMOS image processors (GPUs), and optoelectronic chips. Therefore, image chips can receive light signals and convert them into electrical signals, enabling their application in various electronic products such as digital cameras, automotive image sensing modules, and surveillance cameras. As chip functionality and performance improve, the demand for chip processing power increases, necessitating the inclusion of more chips within the packaging structure, such as flash memory and DRAM, to achieve enhanced memory capacity and improve chip performance.

[0004] Existing chip packaging structures use a dispensing process to form the enclosure structure, which is a sealed structure. If the sensing area of ​​a laser chip operates for too long, it is prone to generating high temperatures. The high temperature heat is difficult to dissipate, which can easily lead to aging of the glass adhesive layer, resulting in glass detachment or phenomena such as edge refraction, reflection, ghosting, and double images. Summary of the Invention

[0005] The purpose of this invention is to provide a chip packaging method and chip packaging structure that can improve heat dissipation performance and avoid phenomena such as aging and peeling of adhesive layers or ghosting.

[0006] In a first aspect, the present invention provides a chip packaging method, comprising: A substrate on which a chip is mounted is provided; wherein the chip has a functional area on the side away from the substrate; the chip and the substrate are electrically connected; A fence is formed around the functional area; wherein the fence includes a plurality of spaced-apart posts; and there is a first gap between adjacent posts; A glass panel is attached to the fence; wherein the glass panel is bonded to the fence with a transparent adhesive film, and the transparent adhesive film at least partially covers the first gap; A plastic encapsulation is formed on the substrate to cover the chip, the glass plate, and the enclosure.

[0007] In an optional implementation, the step of forming a fence around the functional area includes: A protective adhesive layer is applied to the functional areas. The fence and cover plate form an integral part around the functional area; An opening corresponding to the functional area is formed on the cover plate; Remove the protective adhesive layer.

[0008] In an optional implementation, the fence and cover are integrally formed around the functional area using 3D printing; An opening corresponding to the functional area is formed on the cover plate using laser cutting.

[0009] In an optional embodiment, in the step of forming the fence and cover plate integrally around the functional area, the cover plate includes a plurality of spaced horizontal bars with a second gap between adjacent horizontal bars.

[0010] In an optional embodiment, in the step of attaching a glass plate to the cover plate: The transparent film at least partially covers the first gap and the second gap.

[0011] In an optional implementation, in the step of forming a fence around the functional area: the fence is formed on the chip.

[0012] In an optional implementation, before or after the step of attaching the glass panel to the fence, the following steps are also included: A transparent thermally conductive medium is filled between the glass plate and the functional area.

[0013] Secondly, the present invention provides a chip packaging structure, comprising: substrate; A chip is mounted on the substrate and electrically connected to the substrate; the chip has a functional area on the side away from the substrate. A fence; the fence is located around the functional area; the fence includes a plurality of spaced-apart posts; there is a first gap between adjacent posts; A glass panel; the glass panel is disposed on the fence; A transparent adhesive film is disposed between the glass plate and the fence, and the transparent adhesive film is at least partially embedded in the first gap; A molding compound, which is disposed on the substrate and covers the chip, the glass plate and the enclosure.

[0014] In an optional implementation, a cover plate connected to the fence is also included, the cover plate having an opening corresponding to the functional area.

[0015] In an optional embodiment, the cover plate includes a plurality of spaced-apart horizontal strips, with a second gap between adjacent horizontal strips; the transparent film at least partially covers the first gap and the second gap.

[0016] In an optional embodiment, the opening is circular or square; Alternatively, the cover plate and the fence are integrally formed.

[0017] In an alternative implementation, the fence is formed on the chip.

[0018] The chip packaging method and chip packaging structure provided in this invention have the following beneficial effects: The functional area of ​​the chip is surrounded by a fence, which is made up of columns arranged at intervals. The first gap between adjacent columns can improve heat dissipation performance, help the heat of the functional area to be transferred to the outside, prevent the aging and cracking of the transparent film layer above the functional area, avoid ghosting or double images, improve the reliability and durability of the structure, and improve the quality of the packaged product. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 One of the process diagrams of the chip packaging method provided in the embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the fence and cover plate formed by 3D printing in the chip packaging method provided in the embodiment of the present invention; Figure 3 A second schematic diagram of the chip packaging method provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of a first structure in which an opening is formed in the cover plate in the chip packaging method provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of a second structure in which an opening is formed in the cover plate in the chip packaging method provided in an embodiment of the present invention; Figure 6 A schematic diagram showing a through-hole corresponding to a functional area on a transparent adhesive film in a chip packaging method provided in an embodiment of the present invention; Figure 7 The third schematic diagram of the chip packaging method provided in the embodiment of the present invention; Figure 8This is a schematic diagram of a first type of chip packaging structure provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of a second structure of the chip packaging structure provided in an embodiment of the present invention; Figure 10 Another structural schematic diagram of the support pillars, fences, and cover plates of the chip packaging structure provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of a third chip packaging structure provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of a fourth chip packaging structure provided in an embodiment of the present invention; Figure 13 This is a schematic diagram of the fifth chip packaging structure provided in an embodiment of the present invention.

[0021] Icons: 100 - Chip package structure; 110 - Substrate; 111 - First pad; 112 - Second pad; 120 - Chip; 121 - Functional area; 122 - Third pad; 123 - Protective adhesive layer; 124 - Lead; 130 - Fence; 131 - Post; 132 - First gap; 135 - Support post; 140 - Cover plate; 141 - Opening; 142 - Horizontal bar; 143 - Mounting section; 144 - Second gap; 145 - Recessed platform; 150 - Glass plate; 151 - Transparent adhesive film; 1511 - Through hole; 152 - First glass sheet; 153 - Second glass sheet; 160 - Molded enclosure; 170 - Transparent thermal conductive medium. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0027] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0029] The chip packaging method proposed in this invention helps to transfer heat from the functional area to the outside, prevents the transparent film above the functional area from aging and cracking, and avoids ghosting or double-image phenomena.

[0030] The chip packaging method generally includes the following steps: Please combine Figure 1 and Figure 2 Step S1: Provide a substrate 110 on which the chip 120 is mounted.

[0031] Optionally, a substrate 110 is selected, which has two surfaces, a first surface and a second surface, arranged opposite to each other. The first surface is provided with a first pad 111, and the second surface is provided with a second pad 112. The first pad 111 is used for connection with the chip 120, and the second pad 112 is used for ball bonding.

[0032] The chip 120 has a functional region 121 on the side away from the substrate 110. A third pad 122 is provided around the functional region 121 of the chip 120. The chip 120 and the substrate 110 are electrically connected. In this embodiment, the chip 120 and the substrate 110 are electrically connected by wire bonding 124. One end of the wire 124 is soldered to the first pad 111 of the substrate 110, and the other end is soldered to the third pad 122 on the chip 120. The type of chip 120 is not limited; a suitable chip 120 can be selected according to actual needs. The chip 120 includes, but is not limited to, charge-coupled devices (CCDs), CMOS chips, and optoelectronic chips. The functional region 121 of the chip 120 can be a charge-coupled region, a CMOS chip pattern processing region, or a photoelectric sensing region, etc.

[0033] Step S2: A fence 130 is formed around the functional area 121; wherein the fence 130 includes a plurality of spaced posts 131; and there is a first gap 132 between adjacent posts 131.

[0034] Optionally, in step S2, a protective adhesive layer 123 is covered on the functional area 121; an integral fence 130 and a cover plate 140 are formed around the functional area 121; an opening 141 corresponding to the functional area 121 is formed on the cover plate 140; and the protective adhesive layer 123 is removed.

[0035] In this embodiment, a protective adhesive layer 123 is formed on the functional area 121 of the chip 120 using processes such as coating or dispensing. The protective adhesive layer 123 protects the functional area 121. A fence 130 and a cover plate 140 can be formed on the chip 120 using 3D printing. The fence 130 and the cover plate 140 cover the functional area 121 of the chip 120.

[0036] Optionally, a fence 130 is formed on the chip 120. The fence 130 and the cover plate 140 are integrally formed by 3D printing. Both the fence 130 and the cover plate 140 adopt a hollow design. That is, the fence 130 includes multiple spaced columns 131, and the cover plate 140 includes multiple spaced horizontal bars 142. There is a first gap 132 between adjacent columns 131 and a second gap 144 between adjacent horizontal bars 142. The first gap 132 and the second gap 144 can be equal or unequal. The setting of the first gap 132 and the second gap 144 is beneficial to improving heat dissipation performance, and the first gap 132 and the second gap 144 also have a certain filtering function. If the first gap 132 and the second gap 144 are smaller than the wavelength emitted by the functional area 121, the scattering of the waves emitted by the functional area 121 can be avoided. Furthermore, the first gap 132 and the second gap 144 are both smaller than the diameter of the filling particles of the encapsulant 160, thereby preventing the encapsulant 160 from entering the functional area 121 and preventing the functional area 121 from being contaminated by the encapsulant 160. In actual processes, the encapsulant 160 particles can also be prevented from entering the functional area 121 by adjusting the encapsulation process parameters, but the filling of the first gap 132 by the encapsulant 160 particles can be allowed.

[0037] Using 3D printing results in higher forming precision and more reliable structures. It should be noted that the first gap 132 and the second gap 144 can be formed during the printing process, or they can be formed after printing using machining, laser, or electron beam processing.

[0038] Please combine Figures 3 to 5 In this embodiment, when printing the cover plate 140, the cover plate 140 is connected to the surrounding fence 130, meaning the cover plate 140 covers the entire functional area 121. After forming the cover plate 140, a groove is cut into the cover plate 140 to form an opening 141 exposing the functional area 121. The opening 141 can be formed using laser grooving. The protective adhesive layer 123 effectively protects the functional area 121 during the 3D printing process and during the laser forming of the opening 141, preventing foreign matter from contaminating the functional area 121 during printing or preventing damage to the functional area 121 during laser grooving. Of course, in some embodiments, the opening 141 on the cover plate 140 can also be integrally formed during the printing process; this is not specifically limited here.

[0039] Optionally, the shape, number, and position of the openings 141 can be set according to actual needs, ensuring that each functional area 121 corresponds to one opening 141. The shape of the opening 141 is adapted to the shape of the functional area 121. For example, if the functional area 121 is circular, the opening 141 is circular. If the functional area 121 is square, the opening 141 is square. If a chip 120 has multiple functional areas 121, then multiple openings 141 are correspondingly provided. If the substrate 110 has multiple chips 120, and each chip 120 has a functional area 121, then the multiple openings 141 on the cover plate 140 correspond one-to-one with the multiple functional areas 121.

[0040] It is understandable that after the opening 141 is formed, the cover plate 140 retains a portion of the mounting part 143 connected to the fence 130. The mounting part 143 and the fence 130 are used together to mount and support the glass plate 150, increasing the contact area with the glass plate 150 and making the structure more stable and reliable.

[0041] Optionally, if the functional area 121 is circular, the diameter W1 of the opening 141 is equal to the diameter W2 of the functional area 121 (see...). Figure 8 Alternatively, if functional area 121 is square, the width of opening 141 is equal to the width of functional area 121. This prevents the light signal from refracting or reflecting at the edge of opening 141, thus reducing the risk of signal interference. Using laser grooving helps improve the precision of opening 141, thereby avoiding ghosting and improving signal quality.

[0042] Optionally, the fence 130 and the cover plate 140 may be made of the same material, including but not limited to compositions formed from epoxy resin, polyurethane resin and polymers.

[0043] After forming the opening 141, the protective adhesive layer 123 is removed to expose the functional area 121. The protective adhesive layer 123 can be photoresist or other removable adhesives. If photoresist is used as the protective adhesive layer 123, it can be removed using a wet stripper, solvent, or plasma cleaning. Wet strippers include, but are not limited to, organic amines such as monoethanolamine. Solvents include, but are not limited to, NMP and oxidants.

[0044] Step S3: Install a glass plate 150 on the fence 130; wherein the glass plate 150 is bonded to the fence 130 with a transparent adhesive film 151, and the transparent adhesive film 151 at least partially covers the first gap 132.

[0045] Optionally, a transparent adhesive film 151 is pre-formed on the surface of the glass plate 150 facing the substrate 110. When mounting the glass plate 150, the transparent adhesive film 151 can be embedded into the first gap 132 and the second gap 144. The high thermal conductivity of the transparent adhesive film 151 improves heat dissipation performance and enhances the adhesion between the transparent adhesive film 151 and the fence 130, resulting in more reliable fixation of the glass plate 150. The transparent adhesive film 151 includes, but is not limited to, materials made of highly thermally conductive epoxy resin or ABF film. In some embodiments, the transparent adhesive film 151 only covers the second gap 144 of the cover plate 140, or only covers the first gap 132 of the fence 130.

[0046] Optional, please refer to Figure 6 The transparent film 151 has a through hole 1511 at a position corresponding to the functional area 121, which can improve the light transmittance of the optical path and increase the sensing efficiency. Alternatively, in some embodiments, the through hole 1511 can be omitted.

[0047] Please combine Figure 7 Step S4: Form a plastic encapsulation body 160 on the substrate 110, which encapsulates the chip 120, the glass plate 150 and the fence 130.

[0048] Optionally, after mounting the glass plate 150, wire bonding is performed between the chip 120 and the substrate 110. The wire bonding step can be performed after mounting the chip 120 or after mounting the glass plate 150; no specific limitation is made here. A molding compound 160 is formed using a molding process to protect the mounted glass plate 150, chip 120, enclosure 130, cover plate 140, and leads 124, etc.

[0049] Next, solder balls are formed on the second pad 112 of the second surface of the substrate 110. In some processes, the solder ball formation process can be omitted. Finally, the product is separated into individual products using a dicing process, completing the manufacturing process.

[0050] Optionally, when mounting the glass plate 150, a transparent thermally conductive medium 170 is filled between the glass plate 150 and the functional area 121 (see...). Figure 13 The transparent thermally conductive medium 170 can be a transparent adhesive layer, which can fill the first gap 132, the second gap 144, and the entire cavity formed by the enclosure 130, the cover plate 140, and the chip 120. Alternatively, the transparent thermally conductive medium 170 can be a transparent molding compound, which fills the first gap 132 and the entire cavity formed by the enclosure 130, the cover plate 140, and the chip 120; the transparent adhesive film 151 fills the second gap 144. This improves heat dissipation performance.

[0051] Please combine Figure 8This invention also provides a chip packaging structure 100, manufactured using the chip packaging method described above. The chip packaging structure 100 includes a substrate 110, a chip 120, a perimeter 130, a glass plate 150, a transparent adhesive film 151, and a molding compound 160. The chip 120 is mounted on the substrate 110, and the chip 120 and the substrate 110 are electrically connected. In this embodiment, the chip 120 and the substrate 110 are electrically connected using wire bonding 124. The chip 120 has a functional area 121 on the side away from the substrate 110. Depending on the type of chip 120, this functional area 121 can emit or receive different laser or other wave signals. The perimeter 130 is located around the functional area 121; optionally, the perimeter 130 is located on the chip 120. The perimeter 130 includes a plurality of spaced-apart pillars 131; a first gap 132 exists between adjacent pillars 131. A glass plate 150 is disposed on a fence 130, and a transparent film 151 is disposed between the glass plate 150 and the fence 130, with the transparent film 151 at least partially embedded in the first gap 132. A molding compound 160 is disposed on a substrate 110 and covers the chip 120, the glass plate 150, and the fence 130.

[0052] By setting the first gap 132, heat dissipation performance and the adhesion of the transparent film 151 can be improved, thereby enhancing the stability of the glass plate 150. Furthermore, if the first gap 132 is smaller than the wavelength emitted by the functional area 121, scattering of the waves emitted by the functional area 121 can be avoided, while other shorter wavelength clutter can pass through, thus providing a certain filtering effect. In addition, if the first gap 132 is smaller than the diameter of the filling particles in the encapsulant 160, it can prevent the encapsulant 160 from entering the functional area 121, preventing contamination of the functional area 121 by the encapsulant 160.

[0053] Optionally, the chip package structure 100 also includes a cover plate 140 connected to the fence 130, and the cover plate 140 has an opening 141 corresponding to the functional area 121. The cross-sectional shape and size of the opening 141 are consistent with the shape and size of the functional area 121, which can prevent light signals from being refracted or reflected at the edge of the opening 141, thus preventing ghosting or double images, reducing the risk of signal interference, and improving signal quality.

[0054] Optional, combined Figure 4 Functional area 121 is quadrilateral. Multiple posts 131 are arranged around the perimeter of functional area 121. Each side of functional area 121 has multiple spaced posts 131. There are relatively larger gaps at the corners of the quadrilateral, that is, the gap between adjacent posts 131 is greater than the first gap 132. This arrangement helps to improve the bonding strength between the fence 130 and the plastic sealant 160, making the structure more reliable and preventing cracking or delamination at the edges or corners of the plastic sealant 160.

[0055] Optionally, the cover plate 140 includes a plurality of spaced-apart horizontal strips 142, with a second gap 144 between adjacent horizontal strips 142; the transparent film 151 at least partially covers the first gap 132 and the second gap 144. Similar to the first gap 132, the second gap 144 can improve heat dissipation performance, enhance the adhesion of the transparent film 151 and the stability and reliability of the glass plate 150, and also play a certain role in filtering or preventing wave scattering. The cover plate 140 increases the contact area between the fence 130 and the glass plate 150, improves the adhesion between the transparent film 151 and the fence 130, etc., and makes the structure more stable and reliable.

[0056] Optionally, the opening 141 on the cover 140 can be circular or square, and can be adapted to the actual functional area 121, making the design flexible and the application scenario flexible.

[0057] Optionally, the cover plate 140 and the fence 130 can be integrally formed, which can improve structural reliability and stability. Of course, in some other embodiments, the cover plate 140 and the fence 130 can also be connected separately, which is not specifically limited here.

[0058] Please combine Figure 9 and Figure 10 Optionally, if there are multiple functional areas 121, a support pillar 135 is provided between the multiple functional areas 121, and the height of the support pillar 135 is flush with the surface of the glass plate 150. The support pillar 135 serves to strengthen the structure and provide support, which helps to prevent the glass edge from cracking and falling off due to warping of the molding compound 160. The multiple functional areas 121 here can be understood as two, three or more functional areas 121 on one chip 120, or multiple chips 120 each having one or more functional areas 121, without specific limitation here.

[0059] Please combine Figure 11 Optionally, a recessed platform 145 is provided on the cover plate 140, and the glass plate 150 is disposed on the recessed platform 145. In this embodiment, the recessed platform 145 is provided on the side of the cover plate 140 facing the substrate 110, and the recessed platform 145 forms an opening 141 corresponding to the functional area 121. Optionally, the recess depth of the recessed platform 145 is approximately equal to the thickness of the glass plate 150, so that after the glass plate 150 is attached to the recessed platform 145, the surface of the glass plate 150 is flush with the upper surface of the cover plate 140. This arrangement makes the structure more compact, which is beneficial to reducing the height of the entire packaging structure and to achieving miniaturized packaging.

[0060] Please combine Figure 12 Optionally, multiple glass plates 150 may be included, and these glass plates 150 may be stacked. For example, different glass plates 150 may serve different filtering or light filtering functions. Figure 12The glass plate 150 is shown to include a first glass sheet 152 and a second glass sheet 153 stacked together. The first glass sheet 152 is disposed on a recessed platform 145, and the second glass sheet 153 is stacked on top of the first glass sheet 152. The second glass sheet 153 is flush with the surface of the molding compound 160. This arrangement not only helps to reduce the package height and make the structure compact, but also provides richer filtering functions, adapting to various chip packages with personalized requirements, and offering good product flexibility.

[0061] Please combine Figure 13 Optionally, the entire cavity enclosed by the enclosure 130, cover plate 140, and chip 120 can be filled with a transparent thermally conductive medium 170 to improve thermal conductivity and heat dissipation performance. The molding compound 160 can be a transparent molding compound, which can serve as the transparent thermally conductive medium 170, filling the cavity between the cover plate 140 and the functional area 121. Of course, the transparent thermally conductive medium 170 can also be other transparent colloids, etc., without specific limitations.

[0062] In summary, the chip packaging method and chip packaging structure 100 provided in the embodiments of the present invention have the following beneficial effects, including: A fence 130 is formed around the functional area 121 of chip 120. The fence 130 is formed by the spaced arrangement of pillars 131. The first gap 132 between adjacent pillars 131 can improve heat dissipation performance, helping the heat of functional area 121 to be transferred to the outside, preventing aging and cracking of the transparent film 151 layer above functional area 121, avoiding ghosting or double-image phenomena, improving the reliability and durability of the structure, and improving the quality of the packaged product. A cover plate 140 is integrally formed above the fence 130. The cover plate 140 has an opening 141 formed by laser drilling. The high drilling precision helps to prevent photoelectric signals from being refracted or reflected at the edge of the opening 141, thus preventing ghosting and reducing the risk of signal interference. The setting of the first gap 132 and the second gap 144 helps to improve heat dissipation, improve bonding, and play a certain filtering role, reducing signal interference.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of the present invention.

Claims

1. A chip packaging structure, characterized in that, include: substrate; A chip is mounted on the substrate and electrically connected to the substrate; the chip has a functional area on the side away from the substrate. A fence; the fence is located around the functional area; the fence includes a plurality of spaced-apart posts; there is a first gap between adjacent posts; A glass panel; the glass panel is disposed on the fence; A transparent adhesive film is disposed between the glass plate and the fence, and the transparent adhesive film is at least partially embedded in the first gap; A molding compound, which is disposed on the substrate and covers the chip, the glass plate and the enclosure.

2. The chip packaging structure according to claim 1, characterized in that, It also includes a cover plate connected to the fence, the cover plate having an opening corresponding to the functional area.

3. The chip packaging structure according to claim 2, characterized in that, The cover plate includes a plurality of spaced horizontal bars, with a second gap between adjacent horizontal bars; the transparent film at least partially covers the first gap and the second gap.

4. The chip packaging structure according to claim 2, characterized in that, The opening is circular or square.

5. The chip packaging structure according to claim 2, characterized in that, The cover plate and the fence are integrally formed.

6. The chip packaging structure according to claim 1, characterized in that, The particle diameter of the encapsulated material is larger than the first gap.

7. The chip packaging structure according to claim 1, characterized in that, The first gap is smaller than the wavelength emitted by the functional area.

8. The chip packaging structure according to claim 1, characterized in that, Support columns are provided between the multiple functional areas, and the height of the support columns is flush with the surface of the glass plate.

9. The chip packaging structure according to any one of claims 1 to 8, characterized in that, The fence is formed on the chip.

10. A chip packaging method, characterized in that, Used to prepare a chip packaging structure as described in any one of claims 1 to 9.

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