Electronic device

Abstract

The present application discloses an electronic device comprising: a base layer having a display area and a non-display area defined therein; the circuit layer is arranged on the base layer; an element layer disposed on the circuit layer, and including a light emitting element and a light receiving element disposed to correspond to the display area; and a wavelength conversion layer, which is disposed on the element layer, and which overlaps some of the light-receiving elements.

Description

Technical Field

[0001] The embodiments of this disclosure described herein relate to electronic devices with biometric information recognition capabilities. Background Technology

[0002] Electronic devices offer a variety of functions that enable users to interact with them. For example, electronic devices can display images to provide information to users, or they can sense user input. Recent electronic devices include functions for sensing users' biometric information.

[0003] Biometric information can be identified using capacitive sensing techniques that sense changes in capacitance between electrodes, optical sensing techniques that use optical sensors to sense incident light, or ultrasonic sensing techniques that use piezoelectric elements to sense vibrations. Summary of the Invention

[0004] Embodiments of this disclosure provide electronic devices for identifying various biometric information.

[0005] According to an embodiment, the electronic device includes: a base layer having a display area and a non-display area; a circuit layer disposed on the base layer; a component layer disposed on the circuit layer, and the component layer including a light-emitting element and a light-receiving element disposed in the display area; and a wavelength conversion layer disposed on the component layer, and the wavelength conversion layer overlapping some of the light-receiving elements.

[0006] According to an embodiment, the electronic device includes: a base layer having a display area and a non-display area; a circuit layer disposed on the base layer; a component layer disposed on the circuit layer, and the component layer including a first light-emitting element, a second light-emitting element, a first light-receiving element, and a second light-receiving element disposed in the display area; a color filter layer disposed on the component layer, and the color filter layer including a first color filter and a second color filter overlapping with the first light-emitting element and the second light-emitting element respectively, and a first dummy color filter and a first dummy color filter overlapping with the first light-receiving element and the second light-receiving element respectively; and a wavelength conversion layer disposed between the second light-receiving element and the second dummy color filter. Attached Figure Description

[0007] The above and other objects and features of this disclosure will become apparent from the detailed description of embodiments thereof with reference to the accompanying drawings.

[0008] Figure 1 This is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0009] Figure 2A This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0010] Figure 2B This is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0011] Figure 3 This is a plan view of a display panel according to an embodiment of the present disclosure.

[0012] Figure 4 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0013] Figure 5A This is a view illustrating the first sensing operation of an electronic device according to an embodiment of the present disclosure.

[0014] Figure 5B This is a view illustrating a second sensing operation of an electronic device according to an embodiment of the present disclosure.

[0015] Figure 6 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0016] Figure 7A This is a view showing a wavelength conversion layer according to an embodiment of the present disclosure.

[0017] Figure 7B This is a view showing a wavelength conversion layer according to an embodiment of the present disclosure.

[0018] Figure 8 This is a view showing the spacing of chiral liquid crystals included in a liquid crystal layer according to an embodiment of the present disclosure.

[0019] Figure 9A This is a plan view showing the arrangement relationship between the light-emitting element, the light-receiving element, and the wavelength conversion layer according to an embodiment of the present disclosure.

[0020] Figure 9B This is a plan view showing the arrangement relationship between the light-emitting element, the light-receiving element, and the wavelength conversion layer according to an embodiment of the present disclosure.

[0021] Figure 10 This is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0022] Figure 11 A schematic diagram of an electronic device according to various embodiments is shown. Detailed Implementation

[0023] In this specification, when a component (or area, layer, part, etc.) is referred to as being "on" another component, "connected to" or "attached to" another component, it means that the component may be directly on, directly connected to or directly attached to the other component, or that a third component may exist between them.

[0024] The same reference numerals denote the same parts. Furthermore, in the drawings, the thickness, scale, and dimensions of parts are exaggerated for effective description. As used herein, the term "and / or" includes all of one or more combinations defined by the relevant parts.

[0025] Terms such as first, second, etc., may be used to describe various components, but these components should not be limited by these terms. These terms may be used only to distinguish one component from others. For example, without departing from the scope of this disclosure, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. Unless otherwise stated, singular terms may include plural forms.

[0026] Furthermore, terms such as "below," "under," "above," and "above" are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative concepts and are described based on the directions shown in the accompanying drawings.

[0027] It should be understood that terms such as “comprising,” “including,” and “having”, when used herein, specify the presence of the stated features, figures, steps, operations, components, parts, or combinations thereof, but do not exclude the presence or addition of one or more other features, figures, steps, operations, components, parts, or combinations thereof.

[0028] Unless otherwise specified, all terms used herein (including technical or scientific terms) have the same meaning as those commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms, such as those defined in common dictionaries, should be interpreted as having a meaning equivalent to that in the context of the relevant technical field, and should not be interpreted as having an ideal or overly formal meaning unless clearly defined as having such a meaning in this application.

[0029] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0030] Figure 1 This is a perspective view of an electronic device according to an embodiment of the present disclosure. Figure 2A This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. Figure 2B This is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0031] refer to Figure 1 , Figure 2A and Figure 2BAccording to embodiments of the present disclosure, the electronic device DD may have a rectangular shape having a short side parallel to the first direction DR1 and a long side parallel to the second direction DR2 intersecting the first direction DR1. However, it is not limited to this, and the electronic device DD may have various shapes such as a circular shape, other polygonal shapes, etc.

[0032] An electronic device DD can be a device that is activated in response to an electrical signal. An electronic device DD can include various implementations. For example, an electronic device DD can be applied to electronic devices such as smartwatches, tablet computers, laptop computers, computers, smart TVs, etc.

[0033] In the following text, the normal direction that is substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2 is defined as the third direction DR3. The expression "when viewed from above the plane" as used in this text may mean viewing from the third direction DR3.

[0034] refer to Figure 1 The upper surface of the electronic device DD can be defined as the display surface IS, and can be parallel to the plane defined by the first direction DR1 and the second direction DR2. The image IM generated by the electronic device DD can be provided to the user through the display surface IS.

[0035] The display surface IS can be divided into a light-transmitting area TA and a border area BZA. The light-transmitting area TA can be the area on which the image IM is displayed. The user visually identifies the image IM through the light-transmitting area TA. In this embodiment, the light-transmitting area TA is shown in a rounded rectangular shape. However, this is illustrative, and the light-transmitting area TA can have various shapes and is not limited to any one embodiment.

[0036] The border area BZA is adjacent to the light-transmitting area TA. The border area BZA may have a specific color. The border area BZA may surround the light-transmitting area TA. Therefore, the shape of the light-transmitting area TA can be substantially defined by the border area BZA. However, this is illustrative, and the border area BZA may be set adjacent to only one side of the light-transmitting area TA, or it may be omitted.

[0037] The electronic device DD can sense external input applied from the outside. External input can include various types of input provided from outside the electronic device DD. For example, external input can include not only contact with a part of the user's body (such as the user's hand US_F) or contact with a separate device (e.g., an active pen or digitizer), but also external input applied close to or at a distance from the electronic device DD (e.g., hovering). Furthermore, external input can take various forms such as force, pressure, temperature, light, etc.

[0038] The electronic device DD can sense the user's biometric information applied from the outside. The biometric information sensing area capable of sensing the user's biometric information can be set on the display surface IS of the electronic device DD. The biometric information sensing area can be set in the entire light-transmitting area TA, or it can be set in a part of the light-transmitting area TA. Figure 1 An example of the entire light-transmitting area TA used as a biometric information sensing area is shown.

[0039] refer to Figure 2A The electronic device DD may include a window WM, a display module DM, and a housing EDC. In this embodiment, the window WM and the housing EDC are connected to each other to form the appearance of the electronic device DD.

[0040] The front surface of the window WM defines the display surface IS of the electronic device DD. The window WM may include an optically transparent insulating material. For example, the window WM may include glass or plastic. The window WM may have a multilayer structure or a single-layer structure. For example, the window WM may include multiple plastic films bonded by adhesive, or it may include a glass substrate and a plastic film bonded by adhesive.

[0041] The display module (DM) may include a display panel (DP) and an input sensing layer (ISL). The display panel (DP) can display an image in response to an electrical signal, and the input sensing layer (ISL) can sense external input applied from the outside. External input can be provided in various forms.

[0042] The display panel DP according to embodiments of this disclosure can be a self-emissive display panel, but is not particularly limited. For example, the display panel DP can be an organic light-emitting display panel, an inorganic light-emitting display panel, or a quantum dot light-emitting display panel. The emitting layer of an organic light-emitting display panel may include organic light-emitting materials, and the emitting layer of an inorganic light-emitting display panel may include inorganic light-emitting materials. The emitting layer of a quantum dot light-emitting display panel may include quantum dots and quantum rods. Hereinafter, examples will be given of display panels DP that are organic light-emitting display panels.

[0043] refer to Figure 2B The display panel DP includes a base layer BL, a circuit layer DP_CL, a component layer DP_ED, and a packaging layer TFE. The display panel DP according to this disclosure can be a flexible display panel. However, this disclosure is not limited thereto. For example, the display panel DP can be a foldable display panel that folds around a folding axis, or it can be a rigid display panel.

[0044] The base layer BL may include a synthetic resin layer. The synthetic resin layer may be a polyimide-based resin layer, and there are no particular limitations on the material of the synthetic resin layer. Furthermore, the base layer BL may include a glass substrate, a metal substrate, or an organic / inorganic composite substrate.

[0045] A circuit layer DP_CL is disposed on the base layer BL. The circuit layer DP_CL is disposed between the base layer BL and the component layer DP_ED. The circuit layer DP_CL includes at least one insulating layer and circuit elements. Hereinafter, the insulating layer included in the circuit layer DP_CL is referred to as an intermediate insulating layer. The intermediate insulating layer includes at least one intermediate inorganic film and at least one intermediate organic film. The circuit elements may include pixel driving circuitry and sensor driving circuitry, wherein the pixel driving circuitry is included in each of a plurality of pixels for displaying an image, and the sensor driving circuitry is included in each of a plurality of sensors for recognizing external information. The external information may be biometric information. In embodiments of this disclosure, the sensors may be fingerprint recognition sensors, proximity sensors, iris recognition sensors, oxygen saturation sensors, blood pressure measurement sensors, illuminance sensors, etc. In embodiments, the sensors may be optical sensors for optically recognizing biometric information. The circuit layer DP_CL may also include signal lines connected to the pixel driving circuitry and / or the sensor driving circuitry.

[0046] The element layer DP_ED may include a light-emitting element in each of the pixels and a light-receiving element in each of the sensors. In embodiments of this disclosure, the light-receiving element may be a photodiode. The light-receiving element may be a sensor that senses or reacts to light reflected from a user's fingerprint or blood flow.

[0047] The encapsulation layer TFE seals the element layer DP_ED. The encapsulation layer TFE may include at least one organic film and at least one inorganic film. The inorganic film may include inorganic materials and can protect the element layer DP_ED from moisture / oxygen. The inorganic film may include, but is not particularly limited to, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic film may include organic materials and can protect the element layer DP_ED from foreign matter such as dust particles.

[0048] An input sensing layer (ISL) can be formed on the display panel (DP). The input sensing layer (ISL) can be directly disposed on the encapsulation layer (TFE). According to embodiments of this disclosure, the input sensing layer (ISL) can be formed on the display panel (DP) through a continuous process. That is, when the input sensing layer (ISL) is directly disposed on the display panel (DP), the adhesive film is not disposed between the input sensing layer (ISL) and the encapsulation layer (TFE). In embodiments, the adhesive film can be disposed between the input sensing layer (ISL) and the display panel (DP). In this case, the input sensing layer (ISL) can be manufactured on the display panel (DP) without a continuous process, and can be manufactured separately from the display panel (DP), and fixed to the upper surface of the display panel (DP) by the adhesive film.

[0049] The Input Sensing Layer (ISL) can sense external inputs (e.g., a user's touch), convert the sensed external inputs into specific input signals, and provide these signals to the Display Panel (DP). The ISL may include multiple sensing electrodes for sensing external inputs. These electrodes can sense the external inputs capacitively. The Display Panel (DP) can receive the input signals from the ISL and generate an image corresponding to the input signals.

[0050] The display module DM may further include a color filter layer CFL. In embodiments of this disclosure, the color filter layer CFL may be disposed on the input sensing layer ISL. However, this disclosure is not limited thereto. The color filter layer CFL may be disposed between the display panel DP and the input sensing layer ISL. The color filter layer CFL may include multiple color filters and a black matrix.

[0051] The structure of the input sensing layer (ISL) and the color filter layer (CFL) will be described in detail below.

[0052] The electronic device DD according to embodiments of the present disclosure may further include an adhesive layer AL. The window WM can be attached to the color filter layer CFL via the adhesive layer AL. The adhesive layer AL may include an optically clear adhesive, an optically clear adhesive resin, or a pressure-sensitive adhesive (PSA).

[0053] refer to Figure 2A The display module DM may further include a driver chip DIC and sensor chips SIC1 and SIC2. In embodiments of this disclosure, the driver chip DIC and sensor chips SIC1 and SIC2 may be mounted on the display panel DP. The driver chip DIC and sensor chips SIC1 and SIC2 may be disposed adjacent to one end of the display panel DP (hereinafter referred to as the first end). Although Figure 2A The diagram shows a structure in which the driver chip DIC and sensor chips SIC1 and SIC2 are disposed adjacent to the first end of the display panel DP, but this disclosure is not limited thereto. For example, the driver chip DIC may be disposed adjacent to the first end of the display panel DP, and the sensor chips SIC1 and SIC2 may be disposed adjacent to the second end of the display panel DP opposite to the first end.

[0054] In embodiments of this disclosure, sensor chips SIC1 and SIC2 may include a first sensor chip SIC1 disposed on one side of the driver chip DIC (hereinafter referred to as the first side) and a second sensor chip SIC2 disposed on a second side of the driver chip DIC that is different from the first side. However, in embodiments, the first sensor chip SIC1 and the second sensor chip SIC2 may be integrated into a single sensor chip, and this single sensor chip may be disposed adjacent to the driver chip DIC. In this disclosure, there are no particular limitations on the number of sensor chips SIC1 and SIC2 or the number of driver chips DIC.

[0055] The housing EDC is connected to the window WM. The housing EDC, connected to the window WM, provides a certain internal space. The display module DM can be housed within this internal space. The housing EDC may comprise a material with relatively high rigidity. For example, the housing EDC may comprise glass, plastic, or metal, or may comprise multiple frames and / or panels formed by combinations thereof. The housing EDC can stably protect the components of the electronic device DD housed within the internal space from external impacts. Although not shown, a battery module for powering the overall operation of the electronic device DD may be disposed between the display module DM and the housing EDC.

[0056] Figure 3 This is a plan view of a display panel according to an embodiment of the present disclosure.

[0057] refer to Figure 3 The display panel DP may include the light-transmitting area TA ( Figure 1 The display area DA corresponding to the border area BZA (as shown in the figure) and the border area BZA (as shown in the figure) Figure 1 The non-display area NDA corresponds to the area shown in the diagram.

[0058] The display panel DP may include a plurality of pixels PX disposed in the display area DA and a plurality of sensors FX disposed in the display area DA. In embodiments of this disclosure, each of the plurality of sensors FX may be disposed between two adjacent pixels PX. The plurality of pixels PX and the plurality of sensors FX may alternate with each other in a first direction DR1 and a second direction DR2. However, this disclosure is not limited thereto. That is, two or more pixels PX may be disposed between two adjacent sensors FX in the first direction DR1, or two or more pixels PX may be disposed between two adjacent sensors FX in the second direction DR2.

[0059] The display panel (DP) may also include signal lines connected to the pixels (PX) and the sensor (FX). These signal lines may include scan lines, data lines, readout lines, and voltage lines.

[0060] Figure 4 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0061] refer to Figure 4 The display panel DP can include a base layer BL, a circuit layer DP_CL, and a component layer DP_ED.

[0062] The base layer BL may include a synthetic resin layer. The synthetic resin layer may include a thermosetting resin. Specifically, the synthetic resin layer may be a polyimide-based resin layer, and the material of the synthetic resin layer is not particularly limited. The synthetic resin layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, ethylene-based resin, epoxy resin, urethane-based resin, cellulose resin, siloxane-based resin, polyamide resin, and dinaphthalene-based resin. Furthermore, the base layer BL may include a glass substrate, a metal substrate, or an organic / inorganic composite substrate.

[0063] At least one inorganic layer is formed on the upper surface of the base layer BL. The inorganic layer may include at least one of alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed from multiple layers.

[0064] A first electrode layer is disposed on the circuit layer DP_CL. A pixel defining layer PDL is formed on the first electrode layer. The first electrode layer may include a red anode electrode R_AE and a green anode electrode G_AE. The first electrode layer may also include a blue anode electrode. A first light-emitting opening OP1_1 and a second light-emitting opening OP1_2 of the pixel defining layer PDL expose at least a portion of the red anode electrode R_AE and at least a portion of the green anode electrode G_AE, respectively. A third light-emitting opening of the pixel defining layer PDL may expose the blue anode electrode.

[0065] In embodiments of this disclosure, the pixel defining layer (PDL) may further include a black material. The PDL may also include a black organic dye / pigment such as carbon black or aniline black. The PDL can be formed by mixing a blue organic material and a black organic material. The PDL may also include a hydrophobic organic material.

[0066] like Figure 4As shown, the display panel DP may include a first emitting region PXA-R, a second emitting region PXA-G, and a non-emitting region NPA adjacent to the first emitting region PXA-R and the second emitting region PXA-G. The non-emitting region NPA may surround the corresponding emitting regions PXA-R and PXA-G. In this embodiment, the first emitting region PXA-R is defined to correspond to the portion of the red anode electrode R_AE exposed by the first light-emitting opening OP1_1. The second emitting region PXA-G is defined to correspond to the portion of the green anode electrode G_AE exposed by the second light-emitting opening OP1_2. The display panel DP also includes a third emitting region, and the third emitting region is defined to correspond to the portion of the blue anode electrode exposed by the third light-emitting opening.

[0067] An emitting layer may be disposed on the first electrode layer. The emitting layer may include a red emitting layer R_EL and a green emitting layer G_EL. The red emitting layer R_EL may be disposed in the region corresponding to the first light-emitting opening OP1_1, and the green emitting layer G_EL may be disposed in the region corresponding to the second light-emitting opening OP1_2. The emitting layer also includes a blue emitting layer disposed on the blue anode electrode corresponding to the third light-emitting opening. The red emitting layer R_EL, the green emitting layer G_EL, and the blue emitting layer may be formed separately from each other. Each of the red emitting layer R_EL, the green emitting layer G_EL, and the blue emitting layer may comprise organic and / or inorganic materials. The red emitting layer R_EL, the green emitting layer G_EL, and the blue emitting layer can produce light of a specific color. For example, the red emitting layer R_EL can produce red light, the green emitting layer G_EL can produce green light, and the blue emitting layer can produce blue light.

[0068] Although patterned red emitting layer R_EL and green emitting layer G_EL are shown in this embodiment, an emitting layer can be commonly disposed in the first emitting region PXA-R, the second emitting region PXA-G, and the third emitting region. In this case, the emitting layer can produce white light or blue light. Furthermore, the emitting layer can have a multilayer structure referred to as a tandem structure.

[0069] Each of the red emitting layer R_EL and the green emitting layer G_EL may comprise a low-molecular-weight organic material or a high-molecular-weight organic material as the luminescent material. In an embodiment, each of the red emitting layer R_EL and the green emitting layer G_EL may comprise a quantum dot material as the luminescent material. The core of the quantum dot may be selected from group II-VI compounds, group III-V compounds, group IV-VI compounds, group IV elements, group IV compounds, and combinations thereof.

[0070] A second electrode layer is disposed on the red emitting layer R_EL, the green emitting layer G_EL, and the blue emitting layer. The second electrode layer may include a red cathode electrode R_CE and a green cathode electrode G_CE. The red cathode electrode R_CE and the green cathode electrode G_CE may be electrically connected to each other. In embodiments of this disclosure, the red cathode electrode R_CE and the green cathode electrode G_CE may be combined into a single body shape. In this case, the red cathode electrode R_CE and the green cathode electrode G_CE may be commonly disposed in the first emitting region PXA-R, the second emitting region PXA-G, and the non-emitting region NPA.

[0071] The element layer DP_ED may further include a first light-receiving element OPD1 and a second light-receiving element OPD2. Each of the first light-receiving element OPD1 and the second light-receiving element OPD2 may be a photodiode. The pixel-defining layer PDL may further include a first light-receiving aperture OP2_1 and a second light-receiving aperture OP2_2 configured to correspond to the first light-receiving element OPD1 and the second light-receiving element OPD2. The display panel DP may further include a sensing area SA corresponding to the first light-receiving element OPD1 and the second light-receiving element OPD2. A non-emitting area NPA may surround the sensing area SA.

[0072] The first light-receiving element OPD1 may include a first sensing anode electrode O_AE1, a first photoelectric conversion layer O_RL1, and a first sensing cathode electrode O_CE1. The second light-receiving element OPD2 may include a second sensing anode electrode O_AE2, a second photoelectric conversion layer O_RL2, and a second sensing cathode electrode O_CE2. The first sensing anode electrode O_AE1 and the second sensing anode electrode O_AE2 may be disposed on the same layer as the first electrode layer. That is, the first sensing anode electrode O_AE1 and the second sensing anode electrode O_AE2 may be disposed on the circuit layer DP_CL, and may be formed simultaneously using the same process as the red anode electrode R_AE and the green anode electrode G_AE.

[0073] The first light-receiving opening OP2_1 and the second light-receiving opening OP2_2 of the pixel-defined layer PDL expose at least a portion of the first sensing anode electrode O_AE1 and at least a portion of the second sensing anode electrode O_AE2, respectively. A first photoelectric conversion layer O_RL1 is disposed on the first sensing anode electrode O_AE1 exposed by the first light-receiving opening OP2_1, and a second photoelectric conversion layer O_RL2 is disposed on the second sensing anode electrode O_AE2 exposed by the second light-receiving opening OP2_2. The first photoelectric conversion layer O_RL1 and the second photoelectric conversion layer O_RL2 may include organic photosensitive materials. The first photoelectric conversion layer O_RL1 and the second photoelectric conversion layer O_RL2 may include photosensitive materials that respond to light in the same wavelength band (e.g., green light).

[0074] A first sensing cathode electrode O_CE1 can be disposed on a first photoelectric conversion layer O_RL1, and a second sensing cathode electrode O_CE2 can be disposed on a second photoelectric conversion layer O_RL2. The first sensing cathode electrode O_CE1 and the second sensing cathode electrode O_CE2 can be formed simultaneously using the same process as the red cathode electrode R_CE and the green cathode electrode G_CE. In embodiments of this disclosure, the first sensing cathode electrode O_CE1 and the second sensing cathode electrode O_CE2 can be combined with the red cathode electrode R_CE and the green cathode electrode G_CE to form a single main body shape, thereby forming a common cathode electrode.

[0075] The element layer DP_ED may also include a wavelength conversion layer WCL. The wavelength conversion layer WCL is disposed on the second sensing cathode electrode O_CE2. That is, the wavelength conversion layer WCL can be disposed on the common cathode electrode to correspond to the second light receiving element OPD2. When viewed from above the plane, the wavelength conversion layer WCL may overlap with the second light receiving element OPD2, but may not overlap with the first light receiving element OPD1.

[0076] In embodiments of this disclosure, the wavelength conversion layer (WCL) can be formed on a common cathode electrode using a photolithography process.

[0077] A TFE (Transformer Embedded Element) layer is disposed on the DP_ED (Device Component Layer). The wavelength conversion layer (WCL) and the common cathode electrode may be covered by the TFE layer. The TFE layer comprises at least an inorganic layer or an organic layer. In embodiments of this disclosure, the TFE layer may comprise two inorganic layers and an organic layer disposed between the two inorganic layers. In embodiments of this disclosure, the TFE layer may comprise a plurality of inorganic layers and a plurality of organic layers stacked alternately on top of each other.

[0078] The inorganic layer protects the red light-emitting element ED_R (also known as the first light-emitting element) and the green light-emitting element ED_G (also known as the second light-emitting element), the first light-receiving element OPD1, and the second light-receiving element OPD2 from moisture / oxygen, while the organic layer protects the red light-emitting element ED_R and the green light-emitting element ED_G, the first light-receiving element OPD1, and the second light-receiving element OPD2 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but is not particularly limited thereto. The organic layer may include an acrylic organic layer, but is not particularly limited thereto.

[0079] The electronic device DD includes an input sensing layer ISL disposed on the display panel DP and a color filter layer CFL disposed on the input sensing layer ISL.

[0080] The input sensing layer (ISL) can be directly disposed on the encapsulation layer (TFE). The input sensing layer (ISL) includes a first conductive layer (ICL1), an insulating layer (IL), a second conductive layer (ICL2), and a protective layer (PL). The first conductive layer (ICL1) can be disposed on the encapsulation layer (TFE). Although Figure 4 The diagram shows a structure in which the first conductive layer ICL1 is directly disposed on the encapsulation layer TFE, but this disclosure is not limited thereto. The input sensing layer ISL may further include a base insulating layer disposed between the first conductive layer ICL1 and the encapsulation layer TFE. In this case, the encapsulation layer TFE may be covered by the base insulating layer, and the first conductive layer ICL1 may be disposed on the base insulating layer. In embodiments of this disclosure, the base insulating layer may include an inorganic insulating material.

[0081] The insulating layer IL can cover the first conductive layer ICL1. The second conductive layer ICL2 is disposed on the insulating layer IL. Although... Figure 4 The diagram illustrates a structure in which the input sensing layer ISL includes a first conductive layer ICL1 and a second conductive layer ICL2, but this disclosure is not limited thereto. For example, the input sensing layer ISL may include only one of the first conductive layer ICL1 and the second conductive layer ICL2.

[0082] A protective layer PL may be disposed on the second conductive layer ICL2. The protective layer PL may include an organic insulating material. The protective layer PL can be used to protect the first conductive layer ICL1 and the second conductive layer ICL2 from moisture / oxygen, and can also be used to protect the first conductive layer ICL1 and the second conductive layer ICL2 from foreign matter.

[0083] A color filter layer (CFL) can be disposed on the input sensing layer (ISL). The color filter layer (CFL) can also be directly disposed on the protective layer (PL). The color filter layer (CFL) may include a first color filter (CF_R) and a second color filter (CF_G). The first color filter (CF_R) has a first color, and the second color filter (CF_G) has a second color. The first color filter (CF_R) overlaps with a first light-emitting element (ED_R), and the second color filter (CF_G) overlaps with a second light-emitting element (ED_G). The color filter layer (CFL) may also include a third color filter that overlaps with a third light-emitting element and has a third color. In embodiments of this disclosure, the first color may be red, the second color may be green, and the third color may be blue.

[0084] The color filter layer CFL may further include a first dummy color filter DCF_G and a second dummy color filter DCF_R. The first dummy color filter DCF_G and the second dummy color filter DCF_R may overlap with the sensing area SA. When viewed from above the plane, the first dummy color filter DCF_G may overlap with the first light receiving element OPD1, and the second dummy color filter DCF_R may overlap with the second light receiving element OPD2. In embodiments of this disclosure, each of the first dummy color filter DCF_G and the second dummy color filter DCF_R may have the same color as one of the first color filter CF_R, the second color filter CF_G, and the third color filter. In embodiments of this disclosure, the first dummy color filter DCF_G may have the same green as the second color filter CF_G, and the second dummy color filter DCF_R may have the same red as the first color filter CF_R.

[0085] The color filter layer CFL may further include a black matrix BM. The black matrix BM may be configured to correspond to the non-emitting region NPA. The black matrix BM may be configured to overlap with the first conductive layer ICL1 and the second conductive layer ICL2 in the non-emitting region NPA. In embodiments of this disclosure, the black matrix BM may not overlap with the first emitting region PXA-R, the second emitting region PXA-G, and the sensing region SA.

[0086] In embodiments of this disclosure, a wavelength conversion layer (WCL) can be disposed between the second dummy color filter (DCF_R) and the second light receiving element (OPD2). Therefore, the wavelength conversion layer (WCL) can convert the wavelength of light passing through the second dummy color filter (DCF_R) and provide the converted light to the second light receiving element (OPD2). When the second light receiving element (OPD2) is a green-type light receiving element that senses light in the green wavelength band, the wavelength conversion layer (WCL) can convert light in the red wavelength band passing through the second dummy color filter (DCF_R) into light in the green wavelength band.

[0087] The color filter layer CFL may also include an outer coating OCL. The outer coating OCL may include an organic insulating material. The outer coating OCL may have a thickness sufficient to remove the steps between the first color filter CF_R and the second color filter CF_G, the first dummy color filter DCF_G and the second dummy color filter DCF_R and the black matrix BM. Without any particular limitations, the outer coating OCL may include any material having a certain thickness and capable of planarizing the upper surface of the color filter layer CFL. For example, the outer coating OCL may include an acrylic organic material.

[0088] Figure 5A This is a view illustrating the first sensing operation of an electronic device according to an embodiment of the present disclosure, and Figure 5BThis is a view illustrating a second sensing operation of an electronic device according to an embodiment of the present disclosure.

[0089] refer to Figure 5A and Figure 5B When electronic device DD (reference) Figure 1 During operation, each of the red light-emitting element ED_R and the green light-emitting element ED_G can output light. The red light-emitting element ED_R (referred to as the second light-emitting element) emits red light Lr1 (referred to as the second light) in the red wavelength band, and the green light-emitting element ED_G (referred to as the first light-emitting element) emits green light Lg1 (referred to as the first light) in the green wavelength band. In embodiments of this disclosure, each of the first light-receiving element OPD1 and the second light-receiving element OPD2 can be a green-type light-receiving element that senses light in the green wavelength band. That is, the first light-receiving element OPD1 and the second light-receiving element OPD2 can be the same type of light-receiving element.

[0090] When the electronic device DD performs the first sensing operation to sense the user's fingerprint (that is, when the electronic device DD operates in fingerprint sensing mode (or first sensing mode)), the first light receiving element OPD1 can receive the first reflected light Lg2 generated by the reflection of green light Lg1 from the green light emitting element ED_G by the user's fingerprint. In fingerprint sensing mode, the first light receiving element OPD1 can be operated (can be activated), and the second light receiving element OPD2 can be deactivated (can be inactive).

[0091] The first reflected light Lg2 can be light in the green wavelength band. A first dummy color filter DCF_G is disposed on the first light receiving element OPD1. The first dummy color filter DCF_G can be green. Therefore, the first reflected light Lg2 can pass through the first dummy color filter DCF_G and can be incident on the first light receiving element OPD1. The electronic device DD can sense the valleys and ridges of the fingerprint based on the intensity of the first reflected light Lg2 sensed by the first light receiving element OPD1.

[0092] In fingerprint sensing mode, the red light Lr1 output from the red light-emitting element ED_R can also be reflected by the user's hand US_F. For example, when the light generated by the reflection of the red light Lr1 output from the red light-emitting element ED_R by the user's hand US_F is defined as the second reflected light Lr2, the second reflected light Lr2 may not be able to pass through the first dummy color filter DCF_G and may be absorbed by the first dummy color filter DCF_G. Therefore, since the second reflected light Lr2 cannot pass through the first dummy color filter DCF_G, the second reflected light Lr2 cannot be incident on the first light receiving element OPD1. Similarly, even if blue light is reflected by the user's hand US_F, the blue light can be absorbed by the first dummy color filter DCF_G. Therefore, only the first reflected light Lg2 can be provided to the first light receiving element OPD1.

[0093] Since the second light receiving element OPD2 is in a deactivated state in fingerprint sensing mode, the light incident on the second light receiving element OPD2 cannot be used to sense fingerprints.

[0094] When the electronic device DD performs a second sensing operation to sense the user's oxygen saturation (that is, when the electronic device DD operates in oxygen saturation sensing mode (or second sensing mode), both the first light-receiving element OPD1 and the second light-receiving element OPD2 can be activated. Oxygen saturation is the ratio of oxyhemoglobin (HbO2) to total hemoglobin (Hb) in the blood. Oxyhemoglobin (HbO2) has high light absorption at 530 nm, 585 nm, and 900 nm, while hemoglobin (Hb) has high light absorption at 685 nm. In other words, in the red wavelength band, hemoglobin (Hb) has a higher light absorption than oxyhemoglobin. Therefore, oxygen saturation can be measured using light in both the green and red wavelength bands.

[0095] In oxygen saturation sensing mode, the first light receiving element OPD1 can receive the first reflected light Lg2 generated by the reflection of green light Lg1 from the green light emitting element ED_G by the user's blood. The first reflected light Lg2 can be light in the green wavelength band. A first dummy color filter DCF_G is disposed on the first light receiving element OPD1. The first reflected light Lg2 can pass through the first dummy color filter DCF_G and can be incident on the first light receiving element OPD1.

[0096] In oxygen saturation sensing mode, a second reflected light Lr2, generated by the user's blood reflecting red light Lr1 output from the red light-emitting element ED_R, can be incident on a second dummy color filter DCF_R. The second reflected light Lr2 can be light in the red wavelength band, and the second dummy color filter DCF_R can be red. Therefore, after passing through the second dummy color filter DCF_R, the second reflected light Lr2 is incident on the wavelength conversion layer WCL. The wavelength conversion layer WCL converts the wavelength of the second reflected light Lr2 and outputs a first converted light C_Lg. In embodiments of this disclosure, the first converted light C_Lg can be light in the green wavelength band. The first converted light C_Lg can be incident on a second light receiving element OPD2.

[0097] In oxygen saturation sensing mode, the electronic device DD can sense oxygen saturation based on the ratio between the intensity of the first reflected light Lg2 sensed by the first light receiving element OPD1 and the intensity of the first converted light C_Lg sensed by the second light receiving element OPD2.

[0098] Figure 6 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure. Figure 6 Among the components shown, with Figure 4 The same parts shown will be given the same reference numerals, and detailed descriptions thereof will be omitted.

[0099] refer to Figure 6 The wavelength conversion layer WCLa can be disposed between the second dummy color filter DCF_R and the second optical receiving element OPD2. In particular, the wavelength conversion layer WCLa can be disposed on the encapsulation layer TFE.

[0100] although Figure 6 The diagram illustrates a structure in which the wavelength conversion layer WCLa is disposed on the same layer as the first conductive layer ICL1, but this disclosure is not limited thereto. For example, when a base insulating layer is further disposed between the first conductive layer ICL1 and the encapsulation layer TFE, the wavelength conversion layer WCLa may be disposed on the encapsulation layer TFE, and the first conductive layer ICL1 may be disposed on the base insulating layer. In embodiments, both the first conductive layer ICL1 and the wavelength conversion layer WCLa may be disposed on the base insulating layer.

[0101] When viewed from above the plane, the wavelength conversion layer WCLa can overlap with the second light receiving element OPD2. The wavelength conversion layer WCLa can convert the wavelength of light passing through the second dummy color filter DCF_R and can provide the converted light to the second light receiving element OPD2.

[0102] When the second light receiving element OPD2 is a green type light receiving element that senses light in the green wavelength band, the wavelength conversion layer WCLa can convert light in the red wavelength band that passes through the second dummy color filter DCF_R into light in the green wavelength band.

[0103] Figure 7A This is a view showing a wavelength conversion layer according to an embodiment of the present disclosure. Figure 7B This is a view showing a wavelength conversion layer according to an embodiment of the present disclosure. Figure 8 This is a view showing the spacing of chiral liquid crystals included in a liquid crystal layer according to an embodiment of the present disclosure.

[0104] refer to Figure 7A and Figure 8 The wavelength conversion layer (WCL) may include a chiral liquid crystal (CLC) and brightness enhancement particles (BEP). Alternatively, the WCL may be a layer in which the chiral liquid crystal (CLC) and brightness enhancement particles (BEP) are mixed.

[0105] Chiral liquid crystal CLCs convert the second reflected light Lr2 into the first converted light C_Lg. In embodiments of this disclosure, the chiral liquid crystal CLC may include chiral tetraphenyl-ethylene-cholesterol (chiral TPE-Chol) crystals.

[0106] The wavelength of the first converted light C_Lg can be determined based on the refractive index of the chiral liquid crystal CLC and the spacing PT1. With a fixed refractive index, the wavelength of the first converted light C_Lg can increase with increasing spacing PT1. That is, the spacing PT1 of the chiral liquid crystal CLC can be set such that the first converted light C_Lg has a green wavelength band. The chiral liquid crystal CLC can have a helical structure arranged in a twisted manner along a helical axis. Here, the spacing PT1 of the chiral liquid crystal CLC can be defined as the helical period and can be referred to as the helical pitch.

[0107] Brightness enhancement particles (BEPs) can enhance the brightness of the first converted light C_Lg. The BEPs may include non-chiral quinoline malononitrile (QM12). Compared to a structure that only includes a chiral liquid crystal CLC, a wavelength conversion layer (WCL) with added BEPs can increase the amount of the first converted light C_Lg, thereby improving the sensing sensitivity of the electronic device DD.

[0108] refer to Figure 7B and Figure 8The wavelength conversion layer WCLb may include a liquid crystal layer LCL and a brightness enhancement layer BEL. The liquid crystal layer LCL may include a chiral liquid crystal CLC, and the brightness enhancement layer BEL may include brightness enhancement particles BEP. The liquid crystal layer LCL uses the chiral liquid crystal CLC to convert the second reflected light Lr2 into the first converted light C_Lg. The brightness enhancement layer BEL may use the brightness enhancement particles BEP to enhance the brightness of the first converted light C_Lg.

[0109] In embodiments of this disclosure, the brightness enhancement layer BEL can be disposed in the liquid crystal layer LCL and the second light receiving element OPD2 (reference). Figure 4 Between the brightness enhancement layer BEL and the second dummy color filter DCF_R (see reference). Figure 4 )between.

[0110] Figure 9A This is a plan view showing the arrangement of the light-emitting element, the light-receiving element, and the wavelength conversion layer according to an embodiment of the present disclosure. Figure 9B This is a plan view showing the arrangement relationship between the light-emitting element, the light-receiving element, and the wavelength conversion layer according to an embodiment of the present disclosure.

[0111] refer to Figure 9A Component layer DP_ED (reference) Figure 2B It includes multiple light-emitting elements ED_R, ED_G1, ED_G2 and ED_B, and multiple light-receiving elements OPD1 and OPD2.

[0112] Multiple light-emitting elements ED_R, ED_G1, ED_G2, and ED_B can be grouped into multiple reference units. In embodiments of this disclosure, each reference unit may include four light-emitting elements, namely, a red light-emitting element ED_R, a blue light-emitting element ED_B, and a first green light-emitting element ED_G1 and a second green light-emitting element ED_G2. However, the number of light-emitting elements included in each reference unit is not limited to this. In an embodiment, each reference unit may include three light-emitting elements, namely, a red light-emitting element ED_R, a blue light-emitting element ED_B, and a green light-emitting element (one of the first green light-emitting element ED_G1 and the second green light-emitting element ED_G2).

[0113] In embodiments of this disclosure, the red light-emitting element ED_R outputs red light, and the blue light-emitting element ED_B outputs blue light. Each of the first green light-emitting element ED_G1 and the second green light-emitting element ED_G2 outputs green light. The green light output from the first green light-emitting element ED_G1 may have the same green wavelength band as the green light output from the second green light-emitting element ED_G2.

[0114] Red light-emitting element ED_R and blue light-emitting element ED_B can alternate with each other in the first direction DR1 and the second direction DR2. First green light-emitting element ED_G1 and second green light-emitting element ED_G2 can alternate with each other in the first direction DR1 and the second direction DR2.

[0115] In embodiments of this disclosure, the red light-emitting element ED_R may have a larger size than the first green light-emitting element ED_G1 and the second green light-emitting element ED_G2. Furthermore, the blue light-emitting element ED_B may have a size greater than or equal to the size of the red light-emitting element ED_R. The sizes of the light-emitting elements ED_R, ED_G1, ED_G2, and ED_B are not limited thereto and can be modified in various ways. For example, in embodiments of this disclosure, the light-emitting elements ED_R, ED_G1, ED_G2, and ED_B may have the same size.

[0116] The red light-emitting element ED_R and the blue light-emitting element ED_B, the first green light-emitting element ED_G1 and the second green light-emitting element ED_G2 can each have a polygonal shape (e.g., a rhombus, a square, a rectangle, a hexagon, and an octagon). The first green light-emitting element ED_G1 and the second green light-emitting element ED_G2 can have a shape different from that of the red light-emitting element ED_R and the blue light-emitting element ED_B. In embodiments of this disclosure, each of the red light-emitting element ED_R and the blue light-emitting element ED_B can have a rounded rhombus shape, and each of the first green light-emitting element ED_G1 and the second green light-emitting element ED_G2 can have an octagonal shape. The first green light-emitting element ED_G1 and the second green light-emitting element ED_G2 can each have an octagonal shape extending in a specific direction, and the extension direction of the first green light-emitting element ED_G1 can intersect (or be perpendicular to) the extension direction of the second green light-emitting element ED_G2. The extension direction of the first green light-emitting element ED_G1 and the second green light-emitting element ED_G2 can be a direction that is inclined relative to the first direction DR1 and the second direction DR2 (e.g., a diagonal direction).

[0117] One of the multiple optical receiving elements OPD1 and OPD2 can be configured to correspond to each reference unit. However, the number of optical receiving elements OPD1 and OPD2 configured to correspond to each reference unit is not limited to this. For example, two optical receiving elements OPD1 and OPD2 can be configured to correspond to each reference unit.

[0118] Multiple optical receiving elements OPD1 and OPD2 may include a first optical receiving element OPD1 and a second optical receiving element OPD2. In embodiments of this disclosure, each of the first optical receiving element OPD1 and the second optical receiving element OPD2 may be a green-type optical receiving element for sensing light in the green wavelength band. That is, the first optical receiving element OPD1 and the second optical receiving element OPD2 may be the same type of optical receiving element.

[0119] The first optical receiving element OPD1 and the second optical receiving element OPD2 are arranged in the first direction DR1 and the second direction DR2. Each of the first optical receiving element OPD1 and the second optical receiving element OPD2 is disposed between the red light-emitting element ED_R and the blue light-emitting element ED_B in the first direction DR1, and is disposed between the first green light-emitting element ED_G1 and the second green light-emitting element ED_G2 in the second direction DR2.

[0120] In embodiments of this disclosure, each of the first light-receiving element OPD1 and the second light-receiving element OPD2 may have the same or different shape as each of the light-emitting elements ED_G1, ED_G2, ED_R, and ED_B. Figure 9A In this embodiment, each of the first optical receiving element OPD1 and the second optical receiving element OPD2 has a square shape. However, the first optical receiving element OPD1 and the second optical receiving element OPD2 may have different polygonal shapes (e.g., rhombus, rectangle, hexagon or octagon).

[0121] like Figure 9A As shown, the first optical receiving element OPD1 and the second optical receiving element OPD2 can have the same shape and the same size. However, this disclosure is not limited thereto. For example, the shape of the second optical receiving element OPD2 can be different from that of the first optical receiving element OPD1, and the size of the second optical receiving element OPD2 can be larger than that of the first optical receiving element OPD1.

[0122] Each of the first light-receiving element OPD1 and the second light-receiving element OPD2 may have a size less than or equal to the size of the first green light-emitting element ED_G1 and the second green light-emitting element ED_G2. However, there are no particular limitations on the size of the first light-receiving element OPD1 and the second light-receiving element OPD2, and they may be modified in various ways.

[0123] The wavelength conversion layer (WCL) can be disposed on the element layer DP_ED. The wavelength conversion layer (WCL) can overlap with the second optical receiver element OPD2, but can not overlap with the first optical receiver element OPD1. That is, the wavelength conversion layer (WCL) can be configured to correspond to the second optical receiver element OPD2.

[0124] In embodiments of this disclosure, when viewed from above the plane, the wavelength conversion layer WCL may have the same shape as the second optical receiver element OPD2. That is, when the second optical receiver element OPD2 has a square shape, the wavelength conversion layer WCL may also have a square shape. The wavelength conversion layer WCL may have a size greater than or equal to the size of the second optical receiver element OPD2. However, this disclosure is not limited thereto, and the wavelength conversion layer WCL may have a shape different from that of the second optical receiver element OPD2. For example, when the second optical receiver element OPD2 has a square shape, the wavelength conversion layer WCL may have a circular shape.

[0125] refer to Figure 9B The red light-emitting element ED_R, the blue light-emitting element ED_B, the first green light-emitting element ED_G1, and the second green light-emitting element ED_G2 can each have a circular or elliptical shape. The red light-emitting element ED_R can have a larger size than the first green light-emitting element ED_G1 and the second green light-emitting element ED_G2. Furthermore, the blue light-emitting element ED_B can have a size greater than or equal to that of the red light-emitting element ED_R. The dimensions of the light-emitting elements ED_R, ED_G1, ED_G2, and ED_B are not limited to these dimensions and can be modified in various ways.

[0126] Each of the first light-receiving element OPD1 and the second light-receiving element OPD2 may have the same or different shape as each of the light-emitting elements ED_G1, ED_G2, ED_R, and ED_B. Figure 9B In this design, each of the first optical receiving element OPD1 and the second optical receiving element OPD2 has a circular shape. However, each of the first optical receiving element OPD1 and the second optical receiving element OPD2 can have various shapes such as polygonal and elliptical shapes.

[0127] The first optical receiving element OPD1 and the second optical receiving element OPD2 may have the same shape and the same size. However, this disclosure is not limited thereto. For example, the shape of the second optical receiving element OPD2 may be different from that of the first optical receiving element OPD1, and the size of the second optical receiving element OPD2 may be larger than that of the first optical receiving element OPD1.

[0128] The wavelength conversion layer (WCL) can be disposed on the element layer DP_ED. The wavelength conversion layer (WCL) can overlap with the second optical receiver element OPD2, but can not overlap with the first optical receiver element OPD1. That is, the wavelength conversion layer (WCL) can be configured to correspond to the second optical receiver element OPD2.

[0129] In embodiments of this disclosure, when viewed from above the plane, the wavelength conversion layer WCL may have the same shape as the second optical receiver element OPD2. That is, when the second optical receiver element OPD2 has a circular shape, the wavelength conversion layer WCL may also have a circular shape. The wavelength conversion layer WCL may have a size greater than or equal to the size of the second optical receiver element OPD2. However, this disclosure is not limited thereto, and the wavelength conversion layer WCL may have a shape different from that of the second optical receiver element OPD2. For example, when the second optical receiver element OPD2 has a circular shape, the wavelength conversion layer WCL may have an elliptical shape or a polygonal shape.

[0130] The display module according to the embodiments can be applied to various electronic devices. The electronic device according to the embodiments may include the display module described above, and may also include modules or devices with other additional functions besides the display device.

[0131] Figure 10 This is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0132] refer to Figure 10 The electronic device 10 according to the embodiment may include a display module 11, a processor 12, a memory 13 and a power module 14.

[0133] Processor 12 can control the operation of display module 11 and may include at least one of a central processing unit (CPU), application processor (AP), graphics processing unit (GPU), communication processor (CP), image signal processor (ISP), and controller. Processor 12 may include one or more processors. The one or more processors may be configured to operate individually as a set or as a portion of a set. For example, two-thirds of the processors in the device may operate together to run an application.

[0134] Data information used for the operation of processor 12 or display module 11 can be stored in memory 13. When processor 12 runs the application stored in memory 13, image data signals and / or input control signals can be transmitted to display module 11, and display module 11 can process the provided signals and output image information through the display screen.

[0135] The power module 14 may include: a power supply module, such as a power adapter or battery device; and a power conversion module that converts the power supplied by the power supply module and generates power for the operation of the electronic device 10.

[0136] At least one of the components of the electronic device 10 described above may be included in the display module according to the embodiments described above. Furthermore, several individual modules functionally included in one module may be included in the display module, and other individual modules may be provided separately from the display module. For example, the display module 11 may be included within the display device, and the processor 12, memory 13, and power module 14 may be disposed within the electronic device 10 in the form of other devices, rather than within the display device.

[0137] Figure 11 A schematic diagram of an electronic device according to various embodiments is shown.

[0138] refer to Figure 11 The electronic devices to which the display module is applied, according to various embodiments, may include not only electronic devices for displaying images, such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, TVs 10_1d, or desktop monitors 10_1e, but also wearable electronic devices, such as smart glasses 10_2a, head-mounted displays 10_2b, or smartwatches 10_2c, and vehicle electronic devices 10_3, such as central information displays (CIDs) or rearview mirror displays installed on the dashboard, center console, and instrument panel of a vehicle.

[0139] As described above, the wavelength conversion layer can be disposed on some of the light receiving elements, and thus various biometric information can be sensed using only the same type of light receiving elements.

[0140] Furthermore, since the same type of light-receiving element is used, the light-receiving element can be placed throughout the entire area of ​​the display panel, and thus the display panel can sense biometric information throughout the entire area.

[0141] Although this disclosure has been described with reference to embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications may be made thereto without departing from the spirit and scope of this disclosure as set forth in the appended claims.

Claims

1. Electronic devices, including: The base layer includes both display and non-display areas; A circuit layer is disposed on the base layer; A component layer is disposed on the circuit layer, and the component layer includes light-emitting elements and light-receiving elements respectively disposed in the display area; as well as A wavelength conversion layer is disposed on the element layer and configured to overlap with some of the optical receiving elements.

2. The electronic device according to claim 1, wherein, The light-emitting element includes: A first light-emitting element is configured to output first light in a first wavelength band; and The second light-emitting element is configured to output a second light in a second wavelength band that is different from the first wavelength band of the first light.

3. The electronic device according to claim 2, wherein, The wavelength conversion layer receives the second reflected light generated by the reflection of the second light, and converts the wavelength of the second reflected light to output the first converted light.

4. The electronic device according to claim 3, wherein, The optical receiving element includes: A first light receiving element is configured to receive first reflected light generated by the reflection of the first light; and A second optical receiving element is configured to receive the first converted light, and The wavelength conversion layer overlaps with the second optical receiving element but does not overlap with the first optical receiving element.

5. The electronic device according to claim 4, wherein, The first light is light in the green wavelength band, and the second light is light in the red wavelength band. Each of the first reflected light and the first converted light is light in the green wavelength band.

6. The electronic device according to claim 4, wherein, The wavelength conversion layer includes: Chiral liquid crystal, configured to convert the second reflected light into the first converted light; and Brightness-enhancing particles are configured to enhance the brightness of the first converted light.

7. The electronic device according to claim 4, wherein, The wavelength conversion layer includes: A liquid crystal layer, including a chiral liquid crystal, the liquid crystal layer being configured to convert the second reflected light into the first converted light; and A brightness enhancement layer is disposed between the liquid crystal layer and the second light receiving element, and is configured to enhance the brightness of the first converted light.

8. The electronic device according to claim 4, further comprising: A color filter layer is disposed on the element layer. The color filter layer includes: A first color filter is configured to overlap with the first light-emitting element, and the first color filter has a first color; A second color filter is configured to overlap with the second light-emitting element, and the second color filter has a second color. A first dummy color filter is configured to overlap with the first light-receiving element, the first dummy color filter having the first color; and A second dummy color filter is configured to overlap with the second light receiving element, and the second dummy color filter has the second color.

9. The electronic device according to claim 8, wherein, The wavelength conversion layer is disposed between the second light receiving element and the second dummy color filter.

10. The electronic device according to claim 8, further comprising: An encapsulation layer is disposed between the component layer and the color filter layer. The wavelength conversion layer is disposed between the component layer and the packaging layer.

11. The electronic device according to claim 8, further comprising: An encapsulation layer configured to cover the component layer; as well as An input sensing layer is disposed between the encapsulation layer and the color filter layer. The wavelength conversion layer is disposed between the encapsulation layer and the color filter layer.

12. The electronic device according to claim 4, wherein, The wavelength conversion layer has a shape corresponding to the shape of the second optical receiving element.

13. Electronic devices, including: The base layer includes both display and non-display areas; A circuit layer is disposed on the base layer; A component layer is disposed on the circuit layer, and the component layer includes a first light-emitting element, a second light-emitting element, a first light-receiving element, and a second light-receiving element, each disposed in the display area; A color filter layer is disposed on the element layer, the color filter layer comprising: a first color filter and a second color filter configured to overlap with the first light-emitting element and the second light-emitting element, respectively; and a first dummy color filter and a second dummy color filter configured to overlap with the first light-receiving element and the second light-receiving element, respectively; and A wavelength conversion layer is disposed between the second light receiving element and the second dummy color filter.

14. The electronic device according to claim 13, wherein, The first light-emitting element outputs the first light in the first wavelength band. The second light-emitting element outputs a second light in a second wavelength band that is different from the first wavelength band of the first light, and The wavelength conversion layer receives the second reflected light generated by the reflection of the second light, and converts the wavelength of the second reflected light to output the first converted light.

15. The electronic device according to claim 14, wherein, The first light receiving element receives the first reflected light generated by the reflection of the first light. Wherein, the second optical receiving element receives the first converted light, and The wavelength conversion layer overlaps with the second optical receiving element but does not overlap with the first optical receiving element.

16. The electronic device according to claim 15, wherein, The first light is light in the green wavelength band, and the second light is light in the red wavelength band. Each of the first reflected light and the first converted light is light in the green wavelength band.

17. The electronic device of claim 13, further comprising: An encapsulation layer is disposed between the component layer and the color filter layer. The wavelength conversion layer is disposed between the component layer and the packaging layer.

18. The electronic device of claim 13, further comprising: An encapsulation layer configured to cover the component layer; as well as An input sensing layer is disposed between the encapsulation layer and the color filter layer. The wavelength conversion layer is disposed between the encapsulation layer and the color filter layer.

19. The electronic device according to claim 13, wherein, The wavelength conversion layer has a shape corresponding to the shape of the second optical receiving element.

20. The electronic device according to claim 13, wherein, The wavelength conversion layer includes chiral liquid crystal.

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