Continuous large-size high-precision die bonder and die bonding method

Abstract

The invention provides a continuous large-size high-precision die bonder and a die bonding method, and relates to the technical field of die bonders. A continuous large-size high-precision die bonder comprises a workbench, an adsorption bearing device, a dispensing device, a wafer feeding device, a swing arm device and a bottom side detection device. The adsorption bearing device is used for adsorbing a film material, the dispensing device is used for dispensing the film material, and the wafer supply device is used for bearing a wafer; the swing arm device comprises a swing mechanism, a rotary adjusting mechanism and a suction nozzle; the swing mechanism is arranged on the workbench, the suction nozzle is arranged on the swing mechanism and used for sucking a wafer, and the swing mechanism drives the suction nozzle to move, so that the suction nozzle transfers the wafer located on the wafer feeding device to a film material; the rotary adjusting mechanism is arranged on the swinging mechanism and drives the suction nozzle to rotate; the bottom side detection device is used for detecting the angle of the wafer on the suction nozzle. The problem that the die bonding precision of the large-size film material is not high can be solved.

Description

Technical Field

[0001] This application relates to the technical field of die bonders, and in particular to a continuous, large-size, high-precision die bonder and a die bonding method. Background Technology

[0002] Die bonding machines use adhesives to bond wafers to designated areas of a film material. Generally, die bonding machines include a wafer feeding device, a swing arm device, a dispensing device, and a suction-and-carry device. The suction-and-carry device holds the film material, the dispensing device dispenses adhesive onto the film material, and the wafer feeding device holds a blue film sheet, on which the wafer is placed. The swing arm device moves above the blue film sheet, and the wafer feeding device, including a ejector mechanism, lifts the wafer from the blue film sheet. Subsequently, the swing arm device picks up the wafer and transfers it onto the film material, thus bonding the wafer to the film.

[0003] With the development of the semiconductor industry and continuous advancements in die bonding technology, efficiency and accuracy issues remain for die bonding of large-size films. Currently, most die bonding equipment on the market is designed for small-size films, and conventional equipment often cannot meet the needs of large-size films. Common practices for die bonding of large-size films include multiple positioning and segmented die bonding, or the use of specialized large-size die bonding machines. However, these methods all suffer from low accuracy. Multiple positioning and segmented die bonding affect die bonding accuracy and efficiency, while specialized large-size die bonding machines are expensive and not widely applicable. Summary of the Invention

[0004] To improve the problem of low precision and efficiency in die bonding of large-size films, this application provides a continuous large-size high-precision die bonding machine and die bonding method.

[0005] In a first aspect, this application provides a continuous, large-size, high-precision die bonder, employing the following technical solution: A continuous, large-size, high-precision die bonder includes: Workbench; An adsorption support device is disposed on the worktable and is used to adsorb membrane material. A dispensing device is disposed on the worktable and dispenses adhesive onto the film material. A wafer feeding device is disposed on the worktable and is used to carry wafers; A swing arm device includes a swing mechanism, a rotation adjustment mechanism, and a suction nozzle. The swing mechanism is disposed on the worktable, and the suction nozzle is disposed on the swing mechanism. The suction nozzle is used to pick up wafers. The swing mechanism drives the suction nozzle to move, so that the suction nozzle transfers the wafers located on the wafer feeding device to the film material. The rotation adjustment mechanism is disposed on the swing mechanism and drives the suction nozzle to rotate. A bottom-side detection device is used to detect the angle of the wafer located on the nozzle.

[0006] By adopting the above technical solution, the adsorption carrier device can adsorb the film material, the dispensing device can dispense adhesive onto the film material, and the wafer feeding device can carry the wafer. The swing mechanism drives the nozzle to move, which can transfer the wafer from the wafer feeding device to the film material. The bottom detection device can detect the angle of the wafer on the nozzle, and the rotation adjustment mechanism drives the nozzle to rotate, thereby calibrating the angle of the wafer on the nozzle and improving the accuracy of wafer bonding to the film material. In related technologies, a calibration table is generally used to calibrate the angle of the wafer, that is, the wafer needs to be placed on the calibration table for calibration, and then the wafer is picked up and transferred. However, in this application, the wafer is calibrated during the movement from the wafer feeding device to the film material, which can improve the calibration efficiency.

[0007] Optionally, the swing mechanism includes a support base, a swing arm drive assembly, a rotating base, and a movable swing arm; the support base is connected to the worktable, the rotating base is rotatably connected to the support base, the movable swing arm is disposed on the rotating base, the suction nozzle is connected to the movable swing arm, and the swing arm drive assembly drives the movable swing arm to rotate and move up and down.

[0008] By adopting the above technical solution, the support base is connected to the worktable, the rotating base is rotatably connected to the support base, and the swing arm drive assembly drives the moving swing arm to rotate and move up and down, so that the suction nozzle can rotate and move up and down, thereby realizing the function of transferring the wafer located on the wafer feeding device to the film material.

[0009] Optionally, the swing arm drive assembly includes a swing arm rotation drive source and a lifting drive source. The swing arm rotation drive source is connected to the bearing support base, and the swing arm rotation drive source drives the rotating base to rotate. The lifting drive source is connected to the rotating base. The lifting drive source is connected to a swing arm mounting base, and the movable swing arm is connected to the swing arm mounting base. The lifting drive source drives the swing arm mounting base to move up and down.

[0010] By adopting the above technical solution, the lifting drive source drives the swing arm mounting base to move up and down, and the swing arm mounting base drives the moving swing arm and the suction nozzle to move up and down, so that the suction nozzle can get closer to the carrier plate to pick up the wafer, and it is also easier to place the wafer more accurately on the film material.

[0011] Optionally, a swing arm mounting base may have two movable swing arms and two suction nozzles, with each suction nozzle corresponding to one of the two movable swing arms.

[0012] By adopting the above technical solution, the two movable swing arms and the two suction nozzles can work simultaneously, thereby improving work efficiency.

[0013] Optionally, a material drop box is connected to the worktable, and the bottom side detection device is also used to detect whether the wafer has appearance defects; When one of the suction nozzles is located above the bottom detection device, the other suction nozzle is located above the dropping box, and the suction nozzle places the wafer with appearance defects into the dropping box; when one of the suction nozzles is located above the wafer feeding device, the other suction nozzle is located above the adsorption carrier device.

[0014] By adopting the above technical solution, when one suction nozzle is located above the bottom detection device and the other suction nozzle is located above the dropping box, the operations of detecting the bottom of the wafer and discarding the wafer can be performed simultaneously, improving work efficiency. When one suction nozzle is located above the wafer feeding device and the other suction nozzle is located above the adsorption carrier device, one suction nozzle can pick up the wafer and the other suction nozzle can place the wafer on the film material, further improving work efficiency.

[0015] Optionally, the rotation adjustment mechanism includes a rotation drive and a transmission assembly. The rotation drive is mounted on the swing mechanism, and the rotation drive drives the nozzle to rotate through the transmission assembly.

[0016] By adopting the above technical solution, after the bottom side detection component detects the angle of the wafer, the rotation drive component drives the nozzle to rotate through the transmission component, thereby calibrating the angle of the wafer.

[0017] Optionally, the transmission assembly includes a transmission belt, a driving pulley, and a driven pulley; both the driving pulley and the driven pulley are rotatably connected to the movable swing arm, and the transmission belt is sleeved on the driving pulley and the driven pulley; the suction nozzle is connected to the driven pulley, the rotary drive member drives the driving pulley to rotate, and the driving pulley drives the suction nozzle to rotate through the transmission belt and the driven pulley.

[0018] By adopting the above technical solution, the rotary drive component drives the active pulley to rotate, the active pulley drives the driven pulley to rotate through the transmission belt, and the driven pulley drives the nozzle to rotate, which facilitates the calibration of the angle of the wafer on the nozzle and improves the accuracy of wafer bonding on the film material.

[0019] Optionally, the wafer feeding device includes a wafer feeding adjustment mechanism, a carrier disk, a ejector mechanism, and a wafer calibration and detection device; the wafer feeding adjustment mechanism is disposed on the worktable, the carrier disk is disposed on the wafer feeding adjustment mechanism, the carrier disk is used to carry the wafer, and the wafer feeding adjustment mechanism drives the carrier disk to move and rotate; The wafer calibration detection device is connected to the worktable and is used to detect the position and angle of the wafer located on the carrier plate; the ejector mechanism is disposed on the wafer supply adjustment mechanism and is used to lift the wafer located on the carrier plate.

[0020] By adopting the above technical solution, the wafer calibration tester detects the position and angle of the wafer on the carrier disk, and the wafer adjustment mechanism drives the wafer to move and rotate, thereby initially calibrating the position and angle of the wafer.

[0021] Optionally, the crystal supply adjustment mechanism includes a feeding moving component and a rotary drive source. The feeding moving component is disposed on the worktable, and the carrier plate is rotatably disposed on the feeding moving component. The rotary drive source drives the carrier plate to rotate, and the feeding moving component drives the carrier plate to move on a plane.

[0022] By adopting the above technical solution, the wafer calibration and testing device detects the position and angle of the wafer on the carrier plate, the feeding and moving component drives the wafer to move, and the rotation drive source drives the carrier plate to rotate, which facilitates the adjustment and calibration of the wafer's position and angle.

[0023] Secondly, this application also provides a die bonding method using the aforementioned continuous large-size high-precision die bonder, comprising the following steps: The membrane material is fixed on the adsorption carrier device, and the blue membrane is fixed on the carrier plate. The blue membrane carries the crystal. The dispensing device dispenses adhesive onto the membrane material. The wafer calibration and testing device captures an image of the wafer on the blue film. The feeding and moving component moves the carrier disk, and the rotation drive source rotates the carrier disk to adjust the position and angle of the wafer. The swing mechanism positions the nozzle above the carrier plate, the ejector mechanism lifts the wafer on the blue film, and then the nozzle picks up the wafer; The swing mechanism moves the nozzle to above the bottom detection device, which then photographs the angle of the chip on the nozzle and whether there are any appearance defects. If the wafer on the nozzle has no visible defects, the rotation adjustment mechanism drives the nozzle to rotate, calibrating the angle of the wafer on the nozzle. Then, the swing mechanism drives the nozzle to move and fix the wafer onto the film. If the chip on the suction nozzle has an appearance defect, the swing mechanism will move the suction nozzle above the dropping box, and the suction nozzle will discard the chip with the appearance defect into the dropping box.

[0024] In summary, this application includes at least one of the following beneficial effects: 1. The adsorption carrier device adsorbs the film material, the dispensing device dispenses adhesive onto the film material, the swing arm rotation drive source drives the moving swing arm to rotate through the rotating seat, and the lifting drive source drives the swing arm mounting seat to lift and move, so that the suction nozzle can move flexibly to transfer the wafer from the wafer feeding device to the film material, thereby realizing wafer bonding. 2. The rotary drive unit drives the active pulley to rotate, which in turn drives the nozzle to rotate via the transmission belt and the driven pulley. The bottom detection device detects the angle of the wafer on the nozzle and calibrates the wafer angle based on the detection results, which can effectively improve the die bonding accuracy. 3. The wafer calibration and testing component detects the angle of the wafer located on the carrier plate. The feeding moving component moves the carrier plate on the horizontal plane, and the rotation drive source drives the carrier plate to rotate. Through the movement of the feeding moving component and the rotation of the rotation drive source, the position and angle of the wafer can be initially adjusted and calibrated, thereby improving the subsequent die bonding accuracy. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of a continuous large-size high-precision die bonder according to Embodiment 1 of this application; Figure 2 This is a schematic diagram of the swing arm device in Embodiment 1 of this application; Figure 3 This is a schematic diagram of the rotating adjustment mechanism in Embodiment 1 of this application; Figure 4 This is a schematic diagram of the overall structure of a continuous large-size high-precision die bonder according to Embodiment 2 of this application; Figure 5 This is a schematic diagram of the structure of the rotation adjustment mechanism, bottom detection device and material drop box in Embodiment 2 of this application.

[0026] Explanation of reference numerals in the attached drawings: 1. Worktable; 2. Wafer feeding device; 21. Wafer feeding adjustment mechanism; 211. Feeding moving component; 212. Rotary drive source; 22. Support plate; 23. Ejector pin mechanism; 24. Wafer calibration and inspection component; 3. Swing arm device; 31. Swinging mechanism; 311. Support base; 312. Swing arm drive component; 3121. Swing arm rotation drive source; 3122. Lifting drive source; 313. Rotating seat; 314. Swing arm mounting seat; 315. Moving swing arm; 32. Rotation adjustment mechanism; 321. Rotation drive component; 322. Transmission component; 3221. Transmission belt; 3222. Driving pulley; 3223. Driven pulley; 33. Nozzle; 4. Bottom side inspection device; 5. Dispensing device; 6. Adsorption support device; 61. Moving drive component; 62. Vacuum adsorption stage; 7. Die bonding inspection device; 8. Drop box. Detailed Implementation

[0027] The following combination Figures 1 to 5 This application will be described in further detail.

[0028] Example 1:

[0029] Embodiment 1 of this application provides a continuous, large-size, high-precision die bonder.

[0030] refer to Figure 1 and Figure 2 A continuous large-size high-precision die bonder includes a worktable 1, a wafer feeding device 2, a swing arm device 3, a dispensing device 5, an adsorption and support device 6, a bottom-side detection device 4, and a die bond detection device 7.

[0031] refer to Figure 1 and Figure 2 The wafer feeding device 2 includes a wafer feeding adjustment mechanism 21, a carrier plate 22, a ejector mechanism 23, and a wafer calibration and detection component 24. The wafer feeding adjustment mechanism 21 includes a feeding movement component 211 and a rotary drive source 212. The feeding movement component 211 is specifically a two-axis linear module, and the rotary drive source 212 is specifically a motor. The body of the feeding movement component 211 is fixedly connected to the worktable 1, and the carrier plate 22 is rotatably connected to the output end of the feeding movement component 211. A blue diaphragm is fixedly mounted on the carrier plate 22, and the wafer is carried on the blue diaphragm. The feeding movement component 211 can drive the carrier plate 22 to move two-dimensionally on a plane, thereby adjusting the position of the wafer. The body of the rotary drive source 212 is fixedly connected to the output end of the feeding movement component 211, and the output end of the rotary drive source 212 drives the carrier plate 22 to rotate, thereby adjusting the angle of the wafer.

[0032] refer to Figure 1 and Figure 2The ejector mechanism 23 is fixedly connected to the output end of the feeding moving assembly 211. The ejector mechanism 23 can move on a horizontal plane and lift the blue diaphragm upwards, thereby lifting the wafer. The wafer calibration detection device 24 is specifically a camera, which is fixedly connected to the worktable 1. The wafer calibration detection device 24 captures images of the wafer located on the carrier plate 22, thereby obtaining the wafer's position and angle information. The feeding moving assembly 211 adjusts the wafer's position, and the rotation drive source 212 adjusts the wafer's angle, thereby initially adjusting the wafer's position and angle and improving the accuracy of wafer feeding.

[0033] refer to Figure 1 and Figure 2 The swing arm device 3 includes a swing mechanism 31, a rotation adjustment mechanism 32, and a suction nozzle 33. The swing mechanism 31 includes a support base 311, a swing arm drive assembly 312, a rotating seat 313, a swing arm mounting base 314, and a movable swing arm 315. The swing arm drive assembly 312 includes a swing arm rotation drive source 3121 and a lifting drive source 3122. The support base 311 is fixedly connected to the worktable 1. The swing arm rotation drive source 3121 is specifically a motor. The rotating seat 313 is rotatably connected to the support base 311. The body of the swing arm rotation drive source 3121 is fixedly connected to the support base 311. The output end of the swing arm rotation drive source 3121 drives the rotating seat 313 to rotate.

[0034] refer to Figure 1 and Figure 2 The lifting drive source 3122 specifically adopts a linear module. The body of the lifting drive source 3122 is fixedly connected to the rotating seat 313, and the output end of the lifting drive source 3122 is fixedly connected to the swing arm mounting seat 314. The lifting drive source 3122 can drive the swing arm mounting seat 314 to move up and down, and the swing arm mounting seat 314 drives the moving swing arm 315 to move up and down.

[0035] refer to Figure 2 and Figure 3The rotary adjustment mechanism 32 includes a rotary drive component 321 and a transmission assembly 322. The transmission assembly 322 includes a transmission belt 3221, a drive pulley 3222, and a driven pulley 3223. The rotary drive component 321 is specifically a motor. The body of the rotary drive component 321 is fixedly connected to the swing arm mounting base 314. Both the drive pulley 3222 and the driven pulley 3223 are rotatably connected to the movable swing arm 315. The transmission belt 3221 is sleeved on the drive pulley 3222 and the driven pulley 3223. The suction nozzle 33 is rotatably connected to the movable swing arm 315 and is used to pick up wafers. The suction nozzle 33 is fixedly connected to the driven pulley 3223. When the rotary drive 321 drives the drive pulley 3222 to rotate, the drive pulley 3222 drives the driven pulley 3223 to rotate through the transmission belt 3221. The driven pulley 3223 drives the nozzle 33 to rotate, thereby driving the wafer located on the nozzle 33 to rotate, so as to adjust the angle of the wafer.

[0036] refer to Figure 1 and Figure 2 After the wafer feeding device 2 initially adjusts the position and angle of the wafer, the swing arm rotation drive source 3121 drives the rotating seat 313 to rotate, causing the movable swing arm 315 to rotate, so that the suction nozzle 33 is positioned above the carrier plate 22. Subsequently, the ejector mechanism 23 lifts the wafer, and the lifting drive source 3122 drives the swing arm mounting seat 314 to descend, causing the movable swing arm 315 to drive the suction nozzle 33 to descend, so that the suction nozzle 33 picks up the wafer.

[0037] refer to Figure 1 and Figure 2 A bottom-side inspection device 4 is fixedly connected to the worktable 1. The bottom-side inspection device 4 is specifically a camera. The swing arm device 3 moves the wafer above the bottom-side inspection device 4, and the bottom-side inspection device 4 captures an image of the wafer located on the suction nozzle 33, thereby obtaining the wafer's angle information and whether there are any appearance defects. After the bottom-side inspection device 4 detects the wafer's angle, the rotation adjustment mechanism 32 causes the suction nozzle 33 to rotate, recalibrating the angle of the wafer located on the suction nozzle 33, thereby further improving the accuracy of the wafer's angle on the suction nozzle 33.

[0038] refer to Figure 1 The adsorption support device 6 includes a moving drive assembly 61 and a vacuum adsorption stage 62. The moving drive assembly 61 is specifically a two-axis linear module. The body of the moving drive assembly 61 is fixedly connected to the worktable 1, and the vacuum adsorption stage 62 is fixedly connected to the output end of the moving drive assembly 61. The vacuum adsorption stage 62 is used to adsorb and support the membrane material. The moving drive assembly 61 drives the vacuum adsorption stage 62 to move two-dimensionally on the horizontal plane, thereby adjusting the position of the membrane material.

[0039] refer to Figure 1 and Figure 2The dispensing device 5 is fixedly connected to the worktable 1. After the adsorption and support device 6 adjusts the position of the film material, the dispensing device 5 can dispense adhesive to different positions of the film material. The film material size in this embodiment is 1.1m × 1.5m. The die bonding machine of this application can bond large-size film materials. Large-size film materials refer to film materials with a size exceeding 1m × 1m.

[0040] refer to Figure 1 and Figure 2 After the dispensing device 5 dispenses adhesive onto the film material, the adsorption and support device 6 moves the film material to a predetermined position, and the swing arm device 3 places the wafer on the film material, thus bonding the wafer to the film material. The die bonding detection device 7 is fixedly connected to the worktable 1. The die bonding detection device 7 specifically uses a camera to capture images of the wafer located on the film material, obtain the position and angle of the wafer, and thus determine whether the wafer has been accurately bonded.

[0041] refer to Figure 1 The wafer feeding device 2, the swing arm device 3, the bottom side detection device 4, the dispensing device 5, and the die bonding detection device 7 of this application are all symmetrically arranged in two sets, which can alternately perform die bonding on the same large-size film material, thereby improving the die bonding efficiency.

[0042] The implementation principle of a continuous large-size high-precision die bonder according to Embodiment 1 of this application is as follows: A wafer calibration and detection device 24 can detect the position and angle of the wafer located on the carrier plate 22, and a die supply adjustment mechanism 21 can adjust the position and angle of the wafer. A swing mechanism 31 positions the suction nozzle 33 above the carrier plate 22, a pin mechanism 23 lifts the wafer, and the suction nozzle 33 picks up the wafer. A bottom-side detection device 4 detects the angle of the wafer located on the suction nozzle 33, and a rotation adjustment mechanism 32 calibrates the angle of the wafer. A dispensing device 5 dispenses adhesive to the film material, an adsorption carrier device 6 adjusts the position of the film material, and a swing arm device 3 bonds the wafer to the film material.

[0043] Example 2:

[0044] Embodiment 2 of this application provides a continuous large-size high-precision die bonder. The difference between Embodiment 2 and Embodiment 1 is as follows: refer to Figure 4 and Figure 5 In this embodiment, the swing arm device 3 has two movable swing arms 315 and two suction nozzles 33, with each suction nozzle 33 corresponding to one of the two movable swing arms 315. The swing arm device 3 also has two rotation adjustment mechanisms 32, each corresponding to one of the two suction nozzles 33. The two movable swing arms 315 are located on the same straight line. When one suction nozzle 33 is above the support plate 22, the other suction nozzle 33 is above the film material, thus enabling simultaneous crystal picking and crystal bonding operations, improving processing efficiency.

[0045] refer to Figure 4 and Figure 5 A detachable loading box 8 is attached to the worktable 1. When one suction nozzle 33 is positioned above the bottom-side inspection device 4, the other suction nozzle 33 is positioned above the loading box 8. When the bottom-side inspection device 4 detects a surface defect on a wafer located on the suction nozzle 33, the swing arm device 3 moves the wafer with the surface defect to above the loading box 8, and the suction nozzle 33 releases its grip on the wafer, allowing the wafer to fall into the loading box 8. The wafer inspection operation of the bottom-side inspection device 4 and the wafer placement operation of the suction nozzle 33 in the loading box 8 can be performed simultaneously, thereby improving processing efficiency.

[0046] Embodiment 2 of this application also provides a die bonding method, including the following steps: The membrane material is fixed on the adsorption carrier device 6, and the blue membrane is fixed on the carrier plate 22. The blue membrane carries the wafer. The dispensing device 5 dispenses adhesive onto the membrane material; The wafer calibration and detection device 24 captures an image of the wafer on the blue film, the feeding moving component 211 moves the carrier disk 22, and the rotation drive source 212 drives the carrier disk 22 to rotate in order to adjust the position and angle of the wafer. The swing mechanism 31 positions the suction nozzle 33 above the carrier plate 22, the ejector mechanism 23 lifts the wafer on the blue film, and then the suction nozzle 33 picks up the wafer; The swing mechanism 31 drives the suction nozzle 33 to move above the bottom detection device 4, and the bottom detection device 4 takes pictures of the angle of the chip on the suction nozzle 33 and whether there are any appearance defects. If the wafer on the suction nozzle 33 has no appearance defects, the rotation adjustment mechanism 32 drives the suction nozzle 33 to rotate, calibrating the angle of the wafer on the suction nozzle 33. Then the swing mechanism 31 drives the suction nozzle 33 to move and fix the wafer onto the film. If the chip on the suction nozzle 33 has an appearance defect, the swing mechanism 31 drives the suction nozzle 33 to move above the dropping box 8, and the suction nozzle 33 discards the chip with the appearance defect into the dropping box 8.

[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A continuous, large-size, high-precision die bonder, characterized in that: include: Workbench (1); An adsorption support device (6) is provided on the worktable (1) and is used to adsorb membrane material. A dispensing device (5) is provided on the worktable (1) and dispenses adhesive onto the film material. A wafer feeding device (2) is disposed on the worktable (1) and is used to carry wafers; The swing arm device (3) includes a swing mechanism (31), a rotation adjustment mechanism (32), and a suction nozzle (33). The swing mechanism (31) is disposed on the worktable (1), and the suction nozzle (33) is disposed on the swing mechanism (31). The suction nozzle (33) is used to pick up wafers. The swing mechanism (31) drives the suction nozzle (33) to move, so that the suction nozzle (33) transfers the wafers located on the wafer feeding device (2) to the film material. The rotation adjustment mechanism (32) is disposed on the swing mechanism (31), and the rotation adjustment mechanism (32) drives the suction nozzle (33) to rotate. Bottom-side detection device (4), which is used to detect the angle of the wafer located on the nozzle (33).

2. The continuous large-size high-precision die bonder according to claim 1, characterized in that: The swing mechanism (31) includes a support base (311), a swing arm drive assembly (312), a rotating seat (313), and a movable swing arm (315). The support base (311) is connected to the worktable (1), the rotating seat (313) is rotatably connected to the support base (311), the movable swing arm (315) is disposed on the rotating seat (313), the suction nozzle (33) is connected to the movable swing arm (315), and the swing arm drive assembly (312) drives the movable swing arm (315) to rotate and move up and down.

3. The continuous large-size high-precision die bonder according to claim 2, characterized in that: The swing arm drive assembly (312) includes a swing arm rotation drive source (3121) and a lifting drive source (3122). The swing arm rotation drive source (3121) is connected to the bearing support base (311). The swing arm rotation drive source (3121) drives the rotating base (313) to rotate. The lifting drive source (3122) is connected to the rotating base (313). The lifting drive source (3122) is connected to a swing arm mounting base (314). The movable swing arm (315) is connected to the swing arm mounting base (314). The lifting drive source (3122) drives the swing arm mounting base (314) to move up and down.

4. A continuous large-size, high-precision die bonder according to claim 3, characterized in that: Two movable swing arms (315) are provided on one of the swing arm mounting bases (314), and two suction nozzles (33) are provided, with the two suction nozzles (33) corresponding one-to-one with the two movable swing arms (315).

5. A continuous large-size high-precision die bonder according to claim 4, characterized in that: The workbench (1) is connected to a material drop box (8), and the bottom side detection device (4) is also used to detect whether the wafer has appearance defects; When one of the suction nozzles (33) is above the bottom detection device (4), the other suction nozzle (33) is above the dropping box (8), and the suction nozzle (33) places the wafer with appearance defects into the dropping box (8); when one of the suction nozzles (33) is above the wafer feeding device (2), the other suction nozzle (33) is above the adsorption carrier device (6).

6. A continuous large-size high-precision die bonder according to claim 2, characterized in that: The rotation adjustment mechanism (32) includes a rotation drive (321) and a transmission assembly (322). The rotation drive (321) is disposed on the swing mechanism (31). The rotation drive (321) drives the nozzle (33) to rotate through the transmission assembly (322).

7. A continuous large-size high-precision die bonder according to claim 6, characterized in that: The transmission assembly (322) includes a transmission belt (3221), a drive pulley (3222), and a driven pulley (3223); the drive pulley (3222) and the driven pulley (3223) are rotatably connected to the movable swing arm (315), and the transmission belt (3221) is sleeved on the drive pulley (3222) and the driven pulley (3223); the suction nozzle (33) is connected to the driven pulley (3223), the rotary drive (321) drives the drive pulley (3222) to rotate, and the drive pulley (3222) drives the suction nozzle (33) to rotate through the transmission belt (3221) and the driven pulley (3223).

8. A continuous large-size high-precision die bonder according to claim 1, characterized in that: The wafer feeding device (2) includes a wafer feeding adjustment mechanism (21), a carrier disk (22), a pin mechanism (23), and a wafer calibration and detection device (24); the wafer feeding adjustment mechanism (21) is disposed on the worktable (1), the carrier disk (22) is disposed on the wafer feeding adjustment mechanism (21), the carrier disk (22) is used to carry the wafer, and the wafer feeding adjustment mechanism (21) drives the carrier disk (22) to move and rotate; The wafer calibration detection device (24) is connected to the worktable (1). The wafer calibration detection device (24) is used to detect the position and angle of the wafer located on the carrier plate (22). The ejector mechanism (23) is disposed on the wafer supply adjustment mechanism (21). The ejector mechanism (23) is used to lift the wafer located on the carrier plate (22).

9. A continuous large-size high-precision die bonder according to claim 8, characterized in that: The crystal supply adjustment mechanism (21) includes a feeding moving component (211) and a rotary drive source (212). The feeding moving component (211) is disposed on the worktable (1). The bearing disk (22) is rotatably disposed on the feeding moving component (211). The rotary drive source (212) drives the bearing disk (22) to rotate. The feeding moving component (211) drives the bearing disk (22) to move on the plane.

10. A method for solidification, characterized in that: Using a continuous large-size, high-precision die bonder as described in any one of claims 1-9, the process includes the following steps: The membrane material is fixed on the adsorption support device (6), and the blue membrane is fixed on the support plate (22). The blue membrane carries the wafer. The dispensing device (5) dispenses adhesive onto the membrane material; The wafer calibration and testing device (24) captures an image of the wafer on the blue film. The feeding moving component (211) moves the carrier disk (22), and the rotation driving source (212) rotates the carrier disk (22) to adjust the position and angle of the wafer. The swing mechanism (31) positions the suction nozzle (33) above the carrier disk (22), the ejector mechanism (23) lifts the wafer on the blue film, and then the suction nozzle (33) picks up the wafer; The swing mechanism (31) drives the nozzle (33) to move above the bottom detection device (4), and the bottom detection device (4) takes pictures of the angle of the chip on the nozzle (33) and whether there are any appearance defects. If the wafer on the suction nozzle (33) has no appearance defects, the rotation adjustment mechanism (32) drives the suction nozzle (33) to rotate, calibrates the angle of the wafer on the suction nozzle (33), and then the swing mechanism (31) drives the suction nozzle (33) to move and fix the wafer onto the film material; If the chip on the suction nozzle (33) has an appearance defect, the swing mechanism (31) drives the suction nozzle (33) to move above the dropping box (8), and the suction nozzle (33) discards the chip with the appearance defect into the dropping box (8).

Images