Edge clamping type wafer automatic pre-aligner

Abstract

The invention discloses an edge clamping type wafer automatic pre-aligner, which comprises a jacking rotating mechanism, a clamping mechanism and a rack, the jacking rotating mechanism and the clamping mechanism are fixed on the rack, a wafer is carried to a placing table through a mechanical arm, whether a product is on a seat is detected through an on-seat sensor, and the pre-aligner is used for aligning the product. The supporting disc is jacked to a clamping horizontal line through the jacking rotating mechanism, a wafer is clamped through the clamping transmission module, the jacking rotating mechanism descends, then the wafer is rotated through the rotating module, wafer notch angle error correction is judged through external equipment, and the pre-alignment action is achieved. And the wafer is jacked to the clamping horizontal line again, and the clamping transmission module is loosened, so that the wafer is handled and moved away from the manipulator after returning to the placing table.

Description

Technical Field

[0001] This invention relates to the field of semiconductor inspection technology, and in particular to an edge-clamping type automatic wafer pre-aligner. Background Technology

[0002] In the wafer fabrication process, wafer pre-alignment equipment plays a crucial role in ensuring the accurate positioning of the wafer before the processing or inspection station.

[0003] In the prior art, wafer pre-alignment control devices are generally mechanical clamping or vacuum adsorption type. For vacuum adsorption type wafer pre-alignment control devices, a suction cup rotation assembly is usually set up to adsorb and drive the wafer to rotate. A sealing device needs to be fitted on the motor shaft connected to the suction cup to prevent the vacuum gas from leaking out during the rotation of the motor shaft. The sealing device is too large along the motor shaft axis, which makes it difficult to miniaturize the suction cup rotation assembly, and thus makes it difficult to miniaturize the wafer pre-alignment control device, making it difficult to use in situations with limited space. Summary of the Invention

[0004] To address the above problems, this invention provides an edge-clamping automatic wafer pre-aligner, which solves the problem of wafer clamping during pre-alignment.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: an edge-clamping type automatic wafer pre-aligner, including a lifting and rotating mechanism, a clamping mechanism and a frame, wherein the lifting and rotating mechanism and the clamping mechanism are fixed on the frame; The lifting and rotating mechanism includes a lifting motor, a lifting support frame, a main shaft whose bottom end is connected to the upper end of the lifting support frame via a bearing, a lifting and rotating mounting plate sleeved on the outside of the main shaft, a rotating module that rotates in conjunction with the main shaft, and a support plate located at the top of the main shaft. The side wall of the lifting support frame is machined with a transmission groove, and a rack and pinion gear that meshes with the lifting motor is provided in the transmission groove. The lifting motor is mounted on the frame base via a motor mounting seat. The inner side walls of the motor mounting seat and the lifting support frame are provided with corresponding guide rail structures. The rotating module is fixed on one side of the lifting and rotating mounting plate and includes a rotating motor and a transmission module. The transmission module is linked with the rotating motor and the main shaft. The support plate can be set with different sizes to fit the main shaft and is screwed onto the top of the main shaft. Four sets of placement stages for placing wafers are arrayed on the support plate, with the placement stages centered on the main shaft. The clamping mechanism is installed on the upper end of the lifting and rotating mounting plate and includes a clamping mounting plate, two sets of symmetrically distributed clamping plates, four sets of clamping arms installed on the clamping plates, and a clamping transmission module. The clamping transmission module includes a slide rail, a slide groove, and a control slider. The front end of the clamping arm is provided with a clamping claw for clamping the wafer. The clamping arm is centered on the spindle.

[0006] Furthermore, the upper part of the rack is also equipped with an on-site sensor for detecting the wafer position and a feature point sensor for detecting wafer feature points.

[0007] Furthermore, after being lifted, the wafer on the placement stage and the clamping claws are on the same horizontal line, and the clamping claws grasp the wafer on the placement stage through the clamping transmission module.

[0008] Furthermore, several sets of limit switches have been added.

[0009] As can be seen from the above description of the structure of the present invention, compared with the prior art, the present invention has the following advantages: The new clamping method has been changed, and the support plate is replaceable, making it suitable for different types and sizes of wafers.

[0010] The interlocking of the support and clamping disks eliminates the need for wafer adsorption, thus avoiding damage to ultra-thin wafers during the clamping process. Attached Figure Description

[0011] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a side view of the structure of the present invention; Figure 3 This is a schematic cross-sectional view of the present invention; Figure 4 This is a partial structural diagram of the present invention; Figure 5 This is a schematic diagram of the overall structure of the lifting and rotating mechanism of the present invention; Figure 6 This is a side view of the lifting and rotating mechanism of the present invention. Figure 7 This is a cross-sectional view of the lifting and rotating mechanism of the present invention. Figure 8 This is a schematic diagram of the overall structure of the clamping mechanism of the present invention; Figure 9 This is a side view of the clamping mechanism of the present invention. Figure 10 This is a cross-sectional view of the clamping mechanism of the present invention. Detailed Implementation

[0012] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Example

[0013] refer to Figure 1 An edge-gripping automatic wafer pre-aligner includes a lifting and rotating mechanism 1, a clamping mechanism 2, and a frame 3, wherein the lifting and rotating mechanism 1 and the clamping mechanism 2 are fixed on the frame 3; refer to Figure 5 , Figure 6 and Figure 7 The lifting and rotating mechanism includes a lifting motor 4, a lifting support frame 5, a main shaft 6 whose bottom end is connected to the upper end of the lifting support frame via a bearing, a lifting and rotating mounting plate 7 sleeved on the outside of the main shaft, a rotating module 8 that rotates in conjunction with the main shaft, and a support plate 9 located at the top of the main shaft. The side wall of the lifting support frame 5 is machined with a transmission groove 10, and a rack 11 is provided in the transmission groove to mesh with the lifting gear 12 that is coupled to the lifting motor. refer to Figure 8 , Figure 9 and Figure 10 The clamping mechanism is installed on the upper end of the lifting and rotating mounting plate, including a clamping mounting plate 13, two symmetrically distributed clamping plates 14, four clamping arms 15 installed on the clamping plates, and a clamping transmission module. The clamping transmission module includes a slide rail 16, a slide groove 17, and a control slider 18.

[0014] refer to Figure 4 The lifting motor 4 is mounted on the base of the frame 3 via the motor mounting base 19. The inner sidewalls of the motor mounting base 19 and the lifting support frame 5 are provided with corresponding guide rail structures 20.

[0015] refer to Figure 2 and Figure 3 The rotating module 8 is fixed on one side of the lifting rotating mounting plate 7, and includes a rotating motor and a transmission module. The transmission module is linked and cooperates with the rotating motor and the main shaft.

[0016] refer to Figure 7 The support disk 9 is screwed onto the top of the spindle 6. Four sets of placement stages 21 for placing wafers are arranged in an array on the support disk, with the placement stages centered on the spindle.

[0017] refer to Figure 8 The clamping arm 15 has a clamping claw 22 at its front end for clamping the wafer, and the clamping arm is centered on the spindle.

[0018] refer to Figure 2 The upper part of the rack is also equipped with an on-site sensor 23 for detecting the wafer position and a feature point sensor 25 for detecting wafer feature points.

[0019] After being lifted, the wafers on the placement stage 21 and the clamping claws 22 are on the same horizontal line. The clamping claws 22 grasp the wafers on the placement stage through the clamping transmission module.

[0020] refer to Figure 3 , Figure 4 and Figure 5 Several sets of limit switches 24 have been added.

[0021] During assembly, the lifting and rotating mechanism 1 and the clamping mechanism 2 are installed on the frame: 1. Assemble the frame; 2. Connect the lifting and rotating mounting plate 7 to the main shaft 6 through the bushing, and fix the lifting and rotating mounting plate 7 to the upper end plate of the frame; 3. The lower end of the spindle is fixed to the upper end of the support frame 5 by bearings and bearing seats; 4. The lifting motor 4 is mounted on the base of the frame 3 via the motor mounting bracket 19. The motor mounting bracket 19 and the lifting support frame 5 are connected and fixed via the corresponding guide rail structure 20. The lifting gear 12 is installed so that it meshes with the rack 11. 5. Assemble and fix the clamping mounting plate 13 and the clamping plate 14 by means of the slide rail 16, the slide groove 17 and the control slider 18; put it on the upper end of the lifting rotating mounting plate and fix the clamping arm firmly; 6. Install the support plate 9, the on-site sensor 23, and the feature point sensor 25 for detecting wafer feature points, including flat edges and noths; 7. Installation of limit switch 24 and other fasteners and electrical components.

[0022] In use, a robotic arm transports the wafer to the placement stage 21. The presence of the wafer is detected by the placement sensor 23. The lifting and rotating mechanism 1 lifts the support plate 9 to the clamping level. The clamping transmission module clamps the wafer, i.e., the slider 18 is tightened, causing the two sets of clamping plates 14 to close. The clamping claws 21 clamp the wafer at multiple points along the edges. The lifting and rotating mechanism 1 descends, and the rotating module 8 drives the spindle to rotate. An external device is used to determine the wafer notch angle error correction and achieve pre-alignment. After the data collection is completed, the lifting and rotating mechanism 1 is lifted to the clamping level again. The clamping mechanism releases the clamping transmission module, allowing the wafer to return to the placement stage and be handled and removed by the robotic arm.

[0023] The rotary module 8 includes a rotary motor and a transmission module. The transmission module works in conjunction with the rotary motor and the main shaft, and is an existing integrated product.

[0024] The lifting action is driven by the lifting motor 4, which drives the lifting gear 12 and rack 11 to mesh and move upward, thereby lifting the main shaft.

Claims

1. An edge-clamping type automatic wafer pre-aligner, characterized in that: It includes a lifting and rotating mechanism (1), a clamping mechanism (2), and a frame (3), wherein the lifting and rotating mechanism (1) and the clamping mechanism (2) are fixed on the frame (3); The lifting and rotating mechanism includes a lifting motor (4), a lifting support frame (5), a main shaft (6) whose bottom end is connected to the upper end of the lifting support frame via a bearing, a lifting and rotating mounting plate (7) sleeved on the outside of the main shaft, a rotating module (8) that rotates in conjunction with the main shaft, and a support plate (9) located at the top of the main shaft. The side wall of the lifting support frame (5) is machined with a transmission groove (10), and a rack (11) is provided in the transmission groove to mesh with the lifting gear (12) that is connected to the lifting motor. The clamping mechanism is installed on the upper end of the lifting and rotating mounting plate and includes a clamping mounting plate (13), two symmetrically distributed clamping plates (14), four clamping arms (15) installed on the clamping plates, and a clamping transmission module. The clamping transmission module includes a slide rail (16), a slide groove (17), and a control slider (18).

2. The edge-clamping automatic wafer pre-aligner according to claim 1, characterized in that: The lifting motor (4) is mounted on the base of the frame (3) via a motor mounting bracket (19). The inner sidewalls of the motor mounting bracket (19) and the lifting support frame (5) are provided with corresponding guide rail structures (20). According to claim 1, the edge clamping type automatic wafer pre-aligner is characterized in that: the lifting motor (4) is mounted on the base of the frame (3) through the motor fixing seat (19), and the inner sidewalls of the motor fixing seat (19) and the lifting support frame (5) are provided with corresponding guide rail structures (20).

3. The edge-clamping automatic wafer pre-aligner according to claim 1, characterized in that: The rotating module (8) is fixed on one side of the lifting rotating mounting plate (7) and includes a rotating motor and a transmission module. The transmission module is linked and cooperates with the rotating motor and the main shaft.

4. The edge-clamping automatic wafer pre-aligner according to claim 1, characterized in that: The support disk (9) is threaded onto the top of the spindle (6). Four sets of placement stages (21) for placing wafers are arranged in an array on the support disk, with the placement stages centered on the spindle.

5. The edge-clamping automatic wafer pre-aligner according to claim 1, characterized in that: The clamping arm (15) has a clamping claw (22) at its front end for clamping the wafer, and the clamping arm is centered on the main shaft.

6. The edge-clamping automatic wafer pre-aligner according to claim 1, characterized in that: The upper end of the rack is also provided with an in-situ sensor (23) for detecting the wafer position and a feature point sensor (25) for detecting wafer feature points.

7. The edge-clamping automatic wafer pre-aligner according to claim 1, characterized in that: After being lifted, the wafer on the placement stage (21) and the clamping claw (22) are on the same horizontal line. The clamping claw (22) grips the wafer on the placement stage through the clamping transmission module.

8. The edge-clamping automatic wafer pre-aligner according to any one of claims 1-7, characterized in that: Several sets of limit switches (24) are added.

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