Preparation method of ultrathin elastic biological electrode based on liquid metal

Abstract

The invention provides a preparation method of an ultrathin elastic biological electrode based on liquid metal. The preparation method comprises the following steps: spin-coating a sacrificial layer on the surface of a rigid substrate; spin-coating the sacrificial layer with a diluted solution of an elastic high polymer material, and performing semi-curing treatment on the rigid substrate to obtain a semi-cured elastic substrate; normal-temperature solid metal deposition and low-temperature liquid metal deposition are sequentially carried out on the semi-cured elastic substrate, and the semi-cured elastic substrate is completely cured through heat generated in the deposition process to form an elastic substrate; biogel is generated on the surface of the liquid metal film formed through deposition in an electrostatic spinning mode; the sacrificial layer is dissolved to release the elastic substrate deposited on the sacrificial layer and the solid metal film and the liquid metal film on the elastic substrate, and the ultrathin elastic biological electrode patch is obtained. The ultra-thin elastic biological electrode prepared by the method is good in conductivity, high in conformality with the skin and relatively high in adhesion capacity, and has a good application prospect in the field of elastic electronic skin.

Description

Technical Field

[0001] This invention relates to the fields of human health monitoring and biomedical technology, and more specifically, to a method for preparing an ultrathin elastic bioelectrode based on liquid metal. Background Technology

[0002] With the development of flexible electronics, flexible electronic devices are playing an increasingly important role in human health monitoring and biomedicine. The detection of human physiological signals has also become a research hotspot. Electrodes that come into direct contact with the skin are crucial for obtaining high-quality signals. Obtaining high-quality signals requires electrodes with high conductivity, low modulus, stretchability, and good skin conformability. Existing bioelectrodes are mostly rigid dry electrodes or flexible hydrogel electrodes. The former has a modulus much higher than that of human tissue, resulting in poor wearing comfort and poor skin conformability, affecting the high-quality sensing of dynamic signals. The latter is prone to losing conductivity due to water loss during long-term placement.

[0003] Room temperature liquid metals are liquid at room temperature, meeting the requirement of low modulus, and maintain good conductivity under tension. Therefore, using liquid metals to prepare bioelectrodes is an ideal solution. Patent document CN106419895A proposes using a sealing adhesive to fix liquid metal droplets on the skin surface and then using leads for detection. However, this method may cause skin allergies with prolonged wear. Patent document CN116110636A proposes using a method of printing thermally sinterable liquid metal nanoparticles / thermally expandable microsphere ink to prepare bioelectrodes, but this method requires activation treatment of the liquid metal nanoparticles.

[0004] To address the above issues, there is an urgent need for a method that can use liquid metal to prepare ultrathin elastic bioelectrodes. Summary of the Invention

[0005] In view of the above problems, the purpose of this invention is to provide a method for preparing an ultrathin elastic bioelectrode based on liquid metal. The prepared ultrathin elastic bioelectrode has a thickness in the submicron range, can form a good conformal shape with the skin, and has high conductivity.

[0006] This invention provides a method for preparing an ultrathin elastic bioelectrode based on liquid metal, comprising the following steps:

[0007] S1: Spin-coating a sacrificial layer onto the surface of a rigid substrate, and diluting the selected elastic polymer material with an organic solvent;

[0008] S2: Spin-coat a diluted solution of elastic polymer material onto the sacrificial layer, and perform a semi-curing treatment on the elastic polymer material on the rigid substrate to obtain a semi-cured elastic substrate;

[0009] S3: Room temperature solid metal deposition and low temperature liquid metal deposition are sequentially performed on the semi-cured elastic substrate, and the heat generated during the deposition process is used to completely solidify the semi-cured elastic substrate to form an elastic substrate.

[0010] S4: Bio-adhesive is generated on the surface of the deposited liquid metal film by electrospinning, wherein the bio-adhesive is used to encapsulate the deposited solid metal film and liquid metal film together;

[0011] S5: Dissolve the sacrificial layer to release the elastic substrate on the sacrificial layer and the solid metal film and liquid metal film on the elastic substrate to obtain an ultrathin elastic bioelectrode patch.

[0012] Preferably, the rigid substrate is any one of silicon, silicon oxide, glass, and stainless steel.

[0013] Preferably, the sacrificial layer is any one of polyvinyl alcohol, dextran, polymethyl methacrylate, and photoresist.

[0014] Preferably, the organic solvent is any one of the following suitable for the selected elastic polymer: butanone, cyclohexane, n-hexane, n-butyl acetate, tert-butanol, acetone, ethyl acetate, cyclic ether, and dichloromethane.

[0015] Preferably, the elastic polymer material is any one of polydimethylsiloxane, polyurethane, platinum-catalyzed silica gel, styrene-based thermoplastic elastomer, hydrogenated styrene-based thermoplastic elastomer, silk fibroin, and cellulose.

[0016] Preferably, the semi-cured material is any one of thermocuring, photocuring, or chemical curing.

[0017] Preferably, in step S3, the room-temperature solid metal deposition includes: obtaining the solid metal thin film by evaporating solid metal with an electron beam at room temperature.

[0018] Preferably, the solid metal includes one or more of gold, copper, tungsten, molybdenum, and iron.

[0019] Preferably, in step S3, the cryogenic liquid metal deposition includes:

[0020] The semi-cured elastic substrate on which the solid metal film is deposited is subjected to a cooling treatment, and the temperature is lowered to below -30°C;

[0021] Liquid metal films were deposited on solid metal films on semi-cured elastic substrates after cooling using a vacuum thermal evaporation method; wherein the vacuum degree during the deposition process was 10. -4 -10 -6 Pa.

[0022] Preferably, the liquid metal is a conductive metallic material that is liquid at room temperature, including one or more of mercury, gallium, indium, tin, gallium-indium alloy, gallium-indium-tin alloy, transition metal, gallium-indium alloy doped with solid non-metallic elements, and gallium-indium-tin alloy.

[0023] Preferably, the bio-adhesive includes one or more of n-octyl cyanoacrylate, polydioxanone, and methyl acrylate.

[0024] Preferably, in step S5, the dissolution treatment of the sacrificial layer includes:

[0025] The elastic substrate is immersed in the dissolving solution until the sacrificial layer is completely dissolved;

[0026] The ultrathin elastic bioelectrode patch is obtained by releasing the solid metal film and liquid metal film encapsulated together by the bio-adhesive and the elastic substrate into the solution.

[0027] Preferably, the solvent is any one of water, ethanol, acetone, or N-methylpyrrolidone.

[0028] Preferably, the ultrathin elastic bioelectrode patch has a thickness of 900nm-30µm and a conductivity of 5×10⁻⁶. 5 S / m-4×10 6 S / m.

[0029] As can be seen from the above technical solution, the method for preparing an ultrathin elastic bioelectrode based on liquid metal provided by this invention involves depositing a solid metal film on a prepared semi-cured elastic substrate as a nucleation electrode, then depositing a liquid metal film using a low-temperature deposition method, and finally encapsulating the solid metal film and liquid metal film together using an electrospinning technique to form an ultrathin elastic bioelectrode. The prepared ultrathin elastic bioelectrode exhibits good conformability and adhesion to the skin, and stable conductivity under tension, showing promising application prospects in human health monitoring and biomedical fields.

[0030] To achieve the foregoing and related objectives, one or more aspects of the invention include the features that will be described in detail below. The following description and accompanying drawings illustrate certain exemplary aspects of the invention. However, these aspects indicate only a few of the various ways in which the principles of the invention can be used. Furthermore, the invention is intended to encompass all such aspects and their equivalents. Attached Figure Description

[0031] Other objects and results of the invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings. In the drawings:

[0032] Figure 1 This is a schematic diagram of the overall structure after low-temperature deposition of liquid metal in Embodiment 1 of the present invention.

[0033] Figure 2 This is a schematic diagram of the liquid metal ultrathin elastic bioelectrode obtained in Embodiment 1 of the present invention.

[0034] Figure 3 A photograph of an ultrathin elastic bioelectrode of liquid metal attached to a leaf, obtained in embodiment 1 of the present invention.

[0035] Figure 4 This is a photograph of the patterned liquid metal ultrathin elastic bioelectrode obtained in Embodiment 2 of the present invention attached to the skin of the wrist.

[0036] Figure 5 This is a photograph of uled working with the wrist bent in Embodiment 2 of the present invention.

[0037] Figure 6 This is a schematic diagram of a method for preparing an ultrathin elastic bioelectrode based on liquid metal according to an embodiment of the present invention.

[0038] Among them, 1. bio-adhesive, 2. gallium film, 3. polydimethylsiloxane, 4. dextran, and 5. silicon wafer.

[0039] In all the accompanying drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Implementation

[0040] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0041] It should be understood that the terminology used in this invention is merely for describing particular embodiments and is not intended to limit the invention. Furthermore, with respect to numerical ranges in this invention, it should be understood that each intermediate value between the upper and lower limits of the range is also specifically disclosed. Every smaller range between any stated value or intermediate value within a stated range, and any other stated value or intermediate value within said range, is also included in this invention. The upper and lower limits of these smaller ranges may be independently included or excluded from the range.

[0042] Various modifications and variations can be made to the specific embodiments described in this specification without departing from the scope or spirit of the invention, as will be apparent to those skilled in the art. Other embodiments derived from this specification will also be readily apparent to those skilled in the art. This application specification and embodiments are merely exemplary.

[0043] To fabricate bioelectrodes that exhibit good conformability to skin, strong adhesion, and high conductivity, this invention proposes a method for preparing an ultrathin elastic bioelectrode based on liquid metal. The method involves depositing a solid metal film as a nucleation charge on a pre-prepared semi-cured elastic substrate, followed by depositing a liquid metal film using a low-temperature deposition method. An adhesive encapsulation layer is then used to encapsulate the solid and liquid metal films together, forming the ultrathin elastic bioelectrode. The prepared ultrathin elastic bioelectrode exhibits excellent conductivity, high conformability to skin, and strong adhesion, demonstrating promising application prospects in the field of elastic electronic skin.

[0044] This invention provides a method for preparing an ultrathin elastic bioelectrode based on liquid metal. Figure 6 A method flow diagram for preparing an ultrathin elastic bioelectrode based on liquid metal according to an embodiment of the present invention is shown.

[0045] like Figure 6 As shown, this invention provides a method for preparing an ultrathin elastic bioelectrode based on liquid metal, comprising the following steps:

[0046] S1: Spin-coating a sacrificial layer onto the surface of a rigid substrate, and diluting the selected elastic polymer material with an organic solvent;

[0047] S2: Spin-coat a diluted solution of elastic polymer material onto the sacrificial layer, and perform a semi-curing treatment on the elastic polymer material on the rigid substrate to obtain a semi-cured elastic substrate;

[0048] S3: Room temperature solid metal deposition and low temperature liquid metal deposition are performed sequentially on the semi-cured elastic substrate, and the heat generated during the deposition process is used to completely solidify the semi-cured elastic substrate to form an elastic substrate.

[0049] S4: Bio-adhesive is generated on the surface of the deposited liquid metal film by electrospinning, wherein the bio-adhesive is used to encapsulate the deposited solid metal film and liquid metal film together;

[0050] S5: Dissolve the sacrificial layer to release the solid metal film and liquid metal film deposited on the elastic substrate and the elastic substrate, thereby obtaining an ultrathin elastic bioelectrode patch.

[0051] In step S1, a suitable rigid substrate is selected, which can be any one of silicon, silicon oxide, glass, or stainless steel. The sacrificial layer can be any one of polyvinyl alcohol, dextran, polymethyl methacrylate, or photoresist. In specific applications, a rigid substrate and a sacrificial layer of suitable materials are selected according to actual needs.

[0052] In this process, an elastic polymer is selected and diluted using an organic solvent. The organic solvent is any one of the following suitable for the selected elastic polymer: methyl ethyl ketone (MEK), cyclohexane, n-hexane, n-butyl acetate, tert-butanol, acetone, ethyl acetate, cyclic ethers, and dichloromethane. The solvent used is any one of the following: polydimethylsiloxane (PDMS), polyurethane (PU), platinum-catalyzed silica gel (Ecoflex), styrene-based thermoplastic elastomer (SBS), hydrogenated styrene-based thermoplastic elastomer (SEBS), silk fibroin, and cellulose. In specific applications, appropriate organic solvents and suitable elastic polymers are selected according to actual needs.

[0053] In step S2, the semi-curing is any one of thermal curing, photocuring, or chemical curing. The semi-curing treatment is performed on the selected elastic polymer material using thermal curing, photocuring, or chemical curing. The specific curing conditions are selected according to the actual situation, and the curing treatment ends before the rigid substrate is completely cured.

[0054] In step S3, the room-temperature solid-state metal deposition includes: evaporating solid metal at room temperature using an electron beam to obtain the solid metal film. The solid metal includes one or more of gold, copper, tungsten, molybdenum, and iron.

[0055] The low-temperature liquid metal deposition includes: cooling the semi-cured elastic substrate on which the solid metal film is deposited, and cooling it to below -30°C (i.e., below the liquid-solid transition temperature of the liquid metal);

[0056] Liquid metal films were deposited on solid metal films on semi-cured elastic substrates after cooling using a vacuum thermal evaporation method; wherein the vacuum degree during the deposition process was 10. -4 -10 -6 Pa. In other words, low-temperature deposition requires cooling the semi-cured elastic substrate before depositing a liquid metal film on it using a vacuum thermal evaporation method.

[0057] The liquid metal is a conductive metallic material that is liquid at room temperature, including one or more of mercury, gallium, indium, tin, gallium-indium alloy, gallium-indium-tin alloy, transition metals, gallium-indium alloy doped with solid non-metallic elements, and gallium-indium-tin alloy.

[0058] In step S4, a bio-adhesive film is attached to the surface of the prepared liquid metal conductive film using electrospinning to form an adhesive encapsulation layer; the bio-adhesive is used to encapsulate the deposited solid metal film and liquid metal film together. The bio-adhesive includes one or more of n-octyl cyanoacrylate, polydioxanone, and MA (methyl acrylate).

[0059] In step S5, the process of dissolving the sacrificial layer includes: immersing the elastic substrate in a dissolving solution until the sacrificial layer is completely dissolved; and releasing the solid metal film and liquid metal film encapsulated together by the bio-adhesive, as well as the elastic substrate, into the dissolving solution to obtain the ultrathin elastic bioelectrode patch.

[0060] The solvent is any one of water, ethanol, acetone, or N-methylpyrrolidone. The thickness of the ultrathin elastic bioelectrode patch is 900 nm to 30 μm, and its thickness can be controlled by the dilution ratio, spin-coating speed and time, and evaporation time. The conductivity of the ultrathin elastic bioelectrode patch is 5 × 10⁻⁶. 5 S / m-4×10 6 S / m.

[0061] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings. It should be noted that the embodiments described below are intended to facilitate the understanding of the present invention and do not limit it in any way.

[0062] Example 1:

[0063] In this embodiment, Si is selected as the rigid substrate, dextran is selected as the sacrificial layer, PDMS is selected as the elastic polymer material, gold is selected as the traditional metal, pure gallium is selected as the liquid metal, pure water is selected as the solution, and MA is selected as the medical adhesive.

[0064] Step 1: Spin-coat a 10% concentration of dextran onto a Si substrate at 2000 rpm for 30 seconds, and dry at 180°C to obtain a rigid substrate with a sacrificial layer;

[0065] Step 2: Dilute PDMS with n-hexane at a volume ratio of 10:1 to obtain a diluted solution;

[0066] Step 3: Spin-coat the diluted PDMS solution onto a rigid substrate with a sacrificial layer at a speed of 4000 rpm for 30 seconds;

[0067] Step 4: Hold at 100℃ for 5 minutes to allow PDMS to complete the semi-curing process and obtain an elastic substrate;

[0068] Step 5: Place the elastic substrate into the thermal evaporation vacuum chamber, and add 0.1 ml of liquid Ga metal into the evaporation boat. Close the vacuum chamber and evacuate to a vacuum level of 1.0 × 10⁻⁶. -5 Pa;

[0069] Step Six: Evaporate Au using an electron beam, controlling the evaporation rate to be... Au layer

[0070]

[0071] Step 7: Cool the substrate to -50°C at a rate of 2°C / min using a refrigerant and hold for 1 hour, then continue evacuating to a vacuum level of 3.0 × 10⁻⁶. -4 Pa;

[0072] Step 8: Electrically heated evaporation boat. Heating parameters: The current is increased from 30A / min to 175A, and the current is kept constant. The liquid metal is heated and evaporated, and deposited on a low-temperature substrate. Evaporation continues until the liquid metal in the boat is completely evaporated, and a continuous conductive film of liquid metal is obtained on the elastic substrate.

[0073] Step Nine: Select MA adhesive on the surface of the liquid metal thin film using electrospinning technology. Receive the adhesive filaments for 10 minutes under the following conditions: injection speed 0.06 mm / min, receiving distance 10 mm, and voltage -2 to 7 kV (at this point, the overall structure is as follows). Figure 1 As shown, from top to bottom, they are: bio-adhesive 1, gallium film 2, polydimethylsiloxane 3, dextran 4, and silicon wafer 5);

[0074] Step 10: Immerse the substrate in pure water for 20 minutes until the dextran sacrificial layer is completely dissolved. The liquid metal ultrathin elastic bioelectrode is then released and floats on the water surface, as shown below. Figure 2 As shown;

[0075] The ultrathin, elastic liquid metal bioelectrode prepared through the above experimental steps can be attached to leaves, such as... Figure 3 As shown.

[0076] Example 2:

[0077] In this embodiment, the rigid substrate with the sacrificial layer is paper with a built-in PVA layer that is adhered to the silicon wafer, the polymer material is PMDS, the traditional metal is Cu, the liquid metal is pure gallium, the solution is pure water, and the medical adhesive is MA.

[0078] Step 1: Dilute PDMS with n-hexane at a volume ratio of 14:1 to obtain a diluted solution;

[0079] Step 2: Spin-coat the diluted PDMS solution onto a rigid substrate with a sacrificial layer at a speed of 4000 rpm for 30 seconds;

[0080] Step 3: Keep at 80℃ for 15 minutes to allow PDMS to complete the semi-curing process and obtain an elastic substrate;

[0081] Step 4: Place the pre-designed rigid mask on the surface of the elastic substrate;

[0082] Step 5: Place the elastic substrate into the thermal evaporation vacuum chamber, and add 0.15 ml of liquid Ga metal into the evaporation boat. Close the vacuum chamber and evacuate to a vacuum level of 1.0 × 10⁻⁶. -3 Pa;

[0083] Step Six: Cool the substrate to -80°C at a rate of 2°C / min using a refrigerant and hold for 1 hour, then continue evacuating to 8.0 × 10⁻⁶. -5 Pa;

[0084] Step 7: Evaporate Cu using an electron beam, controlling the evaporation rate to be... Cu deposit layer

[0085]

[0086] Step 8: Electrically heated evaporation boat. Heating parameters: The current is increased from 30A / min to 180A, and the current is kept constant. The liquid metal is heated and evaporated, and deposited on the low-temperature substrate. The liquid metal in the evaporation boat is completely evaporated, and a continuous conductive film of liquid metal is obtained on the elastic substrate.

[0087] Step 9: After removing the rigid mask, prepare an MA adhesive layer on its surface by electrospinning. The spinning conditions are: injection speed: 0.05 mm / min, receiving distance: 10 mm, and receiving adhesive filaments for 10 min under voltage conditions of -2 to 7 kV.

[0088] Step 10: Remove the paper substrate from the silicon wafer and place it on pure water for 30 seconds to dissolve the PVA layer, releasing the patterned liquid metal ultrathin elastic bioelectrode. Transfer it to the skin on the wrist. Figure 4 As shown;

[0089] Step 11: Place the ULD on the electrode and supply a 3V voltage. Bend your wrist to verify its good conductivity under bending. Figure 5 As shown.

[0090] Example 3:

[0091] The only difference from Example 1 is that in this example, a glass substrate is used as the rigid substrate. Everything else is the same as in Example 1, and will not be repeated here.

[0092] Example 4:

[0093] The only difference from Example 1 is that in this example, the sacrificial layer is AZ5214 photoresist, and the dissolving solvent is acetone and ethanol. Everything else is the same as in Example 1, and will not be repeated here.

[0094] Example 5:

[0095] The only difference from Example 1 is that in this example, the elastic substrate is TPU and the diluent is methyl ethyl ketone (MEK). Everything else is the same as in Example 1 and will not be repeated here.

[0096] The embodiments described above provide a detailed explanation of the technical solution of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, additions, or similar substitutions made within the scope of the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for preparing an ultrathin elastic bioelectrode based on liquid metal, characterized in that, Includes the following steps: S1: Spin-coating a sacrificial layer onto the surface of a rigid substrate, and diluting the selected elastic polymer material with an organic solvent; S2: Spin-coat a diluted solution of elastic polymer material onto the sacrificial layer, and perform a semi-curing treatment on the elastic polymer material on the rigid substrate to obtain a semi-cured elastic substrate; S3: Room temperature solid metal deposition and low temperature liquid metal deposition are performed sequentially on the semi-cured elastic substrate, and the heat generated during the deposition process is used to completely solidify the semi-cured elastic substrate to form an elastic substrate. S4: Bio-adhesive is generated on the surface of the deposited liquid metal film by electrospinning, wherein the bio-adhesive is used to encapsulate the deposited solid metal film and liquid metal film together; S5: Dissolve the sacrificial layer to release the elastic substrate deposited on the sacrificial layer, as well as the solid metal film and liquid metal film on the elastic substrate, to obtain an ultrathin elastic bioelectrode patch.

2. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 1, characterized in that, The rigid substrate is any one of silicon, silicon oxide, glass, or stainless steel.

3. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 1, characterized in that, The sacrificial layer is any one of polyvinyl alcohol, dextran, polymethyl methacrylate, and photoresist.

4. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 1, characterized in that, The organic solvent is any one of the following suitable for the selected elastic polymer: butanone, cyclohexane, n-hexane, n-butyl acetate, tert-butanol, acetone, ethyl acetate, cyclic ether, and dichloromethane.

5. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 1, characterized in that, The elastic polymer material is any one of polydimethylsiloxane, polyurethane, platinum-catalyzed silica gel, styrene-based thermoplastic elastomer, hydrogenated styrene-based thermoplastic elastomer, silk fibroin, and cellulose.

6. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 1, characterized in that, The semi-cured product is any one of thermocuring, photocuring, or chemical curing.

7. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 1, characterized in that, In step S3, the room temperature solid metal deposition includes: evaporating solid metal by electron beam at room temperature to obtain the solid metal film.

8. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 7, characterized in that, The solid metal includes one or more of gold, copper, tungsten, molybdenum, and iron.

9. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 7, characterized in that, In step S3, the cryogenic liquid metal deposition includes: The semi-cured elastic substrate on which the solid metal film is deposited is subjected to a cooling treatment, and the temperature is lowered to below -30°C; Liquid metal films were deposited on solid metal films on semi-cured elastic substrates after cooling using a vacuum thermal evaporation method; wherein the vacuum degree during the deposition process was 10. -4 -10 -6 Pa.

10. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 9, characterized in that, The liquid metal is a conductive metallic material that is liquid at room temperature, including one or more of mercury, gallium, indium, tin, gallium-indium alloys, gallium-indium-tin alloys, transition metals, gallium-indium alloys doped with solid non-metallic elements, and gallium-indium-tin alloys.

11. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 1, characterized in that, The bio-adhesive includes one or more of n-octyl cyanoacrylate, polydioxanone, and methyl acrylate.

12. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 1, characterized in that, In step S5, the dissolution process of the sacrificial layer includes: The elastic substrate is immersed in the dissolving solution until the sacrificial layer is completely dissolved; The ultrathin elastic bioelectrode patch is obtained by releasing the solid metal film and liquid metal film encapsulated together by the bio-adhesive and the elastic substrate into the solution.

13. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 12, characterized in that, The solvent is any one of water, ethanol, acetone, or N-methylpyrrolidone.

14. The method for preparing an ultrathin elastic bioelectrode based on liquid metal as described in claim 1, characterized in that, The ultrathin elastic bioelectrode patch has a thickness of 900nm-30µm and a conductivity of 5×10⁻⁶. 5 S / m-4×10 6 S / m.

Images