Circuit board structure and manufacturing method thereof

Abstract

The invention discloses a circuit board structure and a manufacturing method thereof, the circuit board structure comprises a glass substrate, a first circuit layer and a second circuit layer which are located on two opposite surfaces of the glass substrate, and a conduction part which penetrates through the glass substrate and is electrically connected with the two circuit layers, the glass substrate comprises a plurality of glass plates which are arranged in a laminated manner, and a bonding layer is arranged between every two adjacent glass plates. A plurality of first through holes are formed in each glass plate in a penetrating mode, the bonding layer extends into the first through holes in each glass plate to form filling parts, second through holes are formed in the filling parts in a penetrating mode, and the conduction parts are located in the second through holes. According to the manufacturing method of the circuit board structure, the toughness of the glass substrate is improved, the yield is improved, the stacking stability is improved through the filling parts in the first through holes, and the interlayer binding force can be enhanced while the conduction function is guaranteed through the hole-in-hole structure of the glass substrate.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing, and more particularly to a circuit board structure and its manufacturing method. Background Technology

[0002] Because glass substrates have high thermal conductivity and better heat dissipation, they can meet the more complex wiring requirements of higher-density soldered products. Furthermore, glass substrates have higher flatness, are less prone to deformation and warping, and are more likely to achieve breakthroughs in chip transfer technology. Therefore, with the advancement of display technology, glass substrates are increasingly being used in integrated circuit design, especially in emerging display technology fields such as Mini / Micro LED.

[0003] However, the raw material for glass substrates is plain glass, which is fragile and easily damaged. During the production and handling process, physical damage such as collisions and scratches is inevitable, which can lead to product breakage and affect production yield. This problem is even more serious for ultra-thin glass substrates. Summary of the Invention

[0004] In view of this, in order to solve at least one of the above problems, it is necessary to provide a circuit board structure.

[0005] In addition, this application also needs to provide a method for manufacturing a circuit board structure.

[0006] This application provides a circuit board structure comprising: a glass substrate, a first circuit layer on one surface of the glass substrate, a second circuit layer on the surface of the glass substrate away from the first circuit layer, and a conductive portion penetrating the glass substrate and electrically connecting the first circuit layer and the second circuit layer. The glass substrate comprises a plurality of stacked glass plates, with an adhesive layer between adjacent glass plates. A plurality of first through-holes penetrate each glass plate. Along the stacking direction, the projections of the first through-holes on different glass plates overlap on the adhesive layer. The adhesive layer extends into the first through-holes of each glass plate to form a filling portion. Second through-holes are formed through all the filling portions in the same column, and the conductive portion is located within the second through-holes.

[0007] In some possible embodiments, the adhesive layer includes a resin layer and an adhesive layer located on opposite surfaces of the resin layer, the adhesive layer extending into a first through-hole on the glass plate on the same side, and the second through-hole also penetrating the resin layer.

[0008] In some possible embodiments, the resin layer is made of at least one of polyimide, polyethylene terephthalate, and polyethylene.

[0009] In some possible embodiments, the adhesive layer may be made of at least one of epoxy resin, silicone, and rubber.

[0010] In some possible embodiments, the minimum wall thickness of the filling portion is 10 μm to 50 μm.

[0011] In some possible embodiments, the thickness of the glass plate is 100μm to 150μm; the thickness of the adhesive layer is 50μm to 100μm.

[0012] This application embodiment also provides a method for manufacturing a circuit board structure. The method includes: providing a glass substrate, the glass substrate including a plurality of glass plates stacked together, an adhesive layer between two adjacent glass plates, a plurality of first through holes penetrating each glass plate, the projections of the first through holes on different glass plates overlapping on the adhesive layer along the stacking direction, the adhesive layer extending into the first through holes on each layer of glass plates to form a filling portion, and a second through hole forming through all the filling portions in the same column; forming a conductive portion in the second through hole; and forming a first circuit layer and a second circuit layer on opposite surfaces of the glass substrate, wherein the first circuit layer and the second circuit layer are electrically connected through the conductive portion, thereby obtaining the circuit board structure.

[0013] In some possible embodiments, the glass substrate includes a first glass plate and a second glass plate stacked together, with the adhesive layer disposed between the first glass plate and the second glass plate. The method for manufacturing the glass substrate includes: forming a plurality of first through holes on the first glass plate and the second glass plate respectively; stacking the first glass plate and the second glass plate after forming the holes on opposite sides of the adhesive layer, such that the projections of the first through holes on the first glass plate and the first through holes on the second glass plate overlap on the adhesive layer along the stacking direction; pressing the first glass plate, the adhesive layer and the second glass plate together, such that the adhesive layer extends into the first through holes to form a filling portion; and forming a second through hole through all the filling portions in the same column to obtain the glass substrate.

[0014] In some possible embodiments, the adhesive layer includes a resin layer and an adhesive layer located on opposite surfaces of the resin layer, the adhesive layer extending into a first through-hole on the glass plate on the same side, and the second through-hole also penetrating the resin layer.

[0015] In some possible embodiments, the resin layer is made of at least one of polyimide, polyethylene terephthalate, and polyethylene; the adhesive layer can be made of at least one of epoxy resin, silicone, and rubber.

[0016] Compared to existing technologies, the circuit board structure and manufacturing method provided in this application involve bonding multiple thin glass plates together using an adhesive layer to form the glass substrate. This effectively reduces the thickness of the glass substrate while improving its toughness, lowering the risk of breakage during circuit board manufacturing, and increasing yield. Furthermore, the first through-hole in the glass plate contains a filling portion formed by the adhesive layer. This filling portion acts like a rivet, increasing the stability of the glass substrate stack. A second through-hole can be formed on the filling portion, creating a conductive portion for circuit connection, achieving a hole-in-hole configuration. This ensures conductivity while enhancing interlayer bonding. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the circuit board structure provided in an embodiment of this application.

[0018] Figure 2 This is a schematic diagram of the structure of a glass substrate provided in an embodiment of this application.

[0019] Figure 3 for Figure 2 Enlarged view of part A in the middle.

[0020] Figure 4 This is a schematic diagram of the structure of a glass substrate provided in another embodiment of this application.

[0021] Figure 5 This is a top view of a glass substrate provided in an embodiment of this application.

[0022] Figure 6 A flowchart illustrating a method for fabricating a circuit board structure according to an embodiment of this application.

[0023] Figure 7 This is a schematic diagram of a structure in which the first glass plate and the second glass plate are stacked with an adhesive layer.

[0024] Figure 8 To Figure 7 A schematic diagram of the three-layer stacked structure being pressed together.

[0025] Figure 9 In order to be in Figure 8 A schematic diagram of the structure in which a second through hole is formed on the filling part.

[0026] Figure 10 In order to be in Figure 9 A schematic diagram of the structure in which a conductive section is formed inside the second through hole.

[0027] Explanation of main component symbols The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0028] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0029] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component.

[0030] Please see Figure 1 and Figure 2 As shown, this application provides a circuit board structure 100, which includes: a glass substrate 10, a first circuit layer 20 located on a surface of the glass substrate 10, a second circuit layer 30 located on a surface of the glass substrate 10 away from the first circuit layer 20, and a conductive portion 40 that penetrates the glass substrate 10 and electrically connects the first circuit layer 20 and the second circuit layer 30.

[0031] In the circuit board design process, in order to reduce the risk of glass substrate breakage, thicker glass substrates are used. Currently, the conventional glass substrates are usually 0.5mm or 0.7mm thick, with the thinnest reaching 0.4mm. Thinner glass substrates are difficult to use in circuit board production.

[0032] To reduce the thickness of the glass substrate and lower the risk of breakage during production, a novel glass substrate 10 is used in the circuit board structure 100 of this application embodiment. The glass substrate 10 includes multiple stacked glass plates 1. An adhesive layer 2 is provided between adjacent glass plates 1. A first through-hole 3 penetrates each glass plate 1. Along the stacking direction a, the projections of the first through-holes 3 on different glass plates 1 overlap on the adhesive layer 2. The adhesive layer 2 extends into the first through-holes 3 on each layer of glass plates 1 to form a filling portion 4. A second through-hole 5 is formed through all the filling portions 4 stacked in the same column. A conductive portion 40 is located within the second through-hole 5. That is, the first through-holes 3 on the multiple glass plates 1 correspond one-to-one along the stacking direction a, so that a second through-hole 5 can be further formed within the first through-holes 3 in the same column, achieving a hole-in-hole structural design.

[0033] Specifically, the glass substrate 10 may include two glass plates 1, for example, such as Figure 2As shown, the glass substrate 10 may include a first glass plate 11 and a second glass plate 12. An adhesive layer 2 is disposed between the first glass plate 11 and the second glass plate 12. The first through hole 3 on the first glass plate 11 and the first through hole 3 on the second glass plate 12 correspond one-to-one along the stacking direction a. The adhesive layer 2 located in the middle can extend into the first through hole 3 and the second through hole 5 at the same time. In this way, a filling part 4 can be formed in the first through hole 3 on the first glass plate 11 and the first through hole 3 on the second glass plate 12. Along the stacking direction a, multiple filling parts 4 correspond one-to-one, and second through holes 5 can be formed by the filling parts 4 passing through the same row to realize a hole-in-hole.

[0034] In some embodiments, the thickness of the glass plate 1 can be 100μm to 150μm.

[0035] The adhesive layer 2 includes a resin layer 21 and an adhesive layer 22 located on opposite surfaces of the resin layer 21. The adhesive layer 22 extends into the first through-hole 3 on the glass plate 1 on the same side, and the second through-hole 5 also penetrates the resin layer 21. Compared to the bonding between metal and glass plate 1, the adhesive layer 22 can form a stronger chemical bond with the surface of glass plate 1, especially when the surface of glass plate 1 undergoes appropriate chemical treatment (such as plasma treatment or silanization), the bonding force is even stronger. Moreover, the double-sided adhesive layer 2 has high bonding strength and heat resistance between the glass plates 1, thus maintaining good bonding performance even in high-temperature environments. In addition, the adhesive layer 2 with resin layer 21 has good flexibility. Compared to the stress caused by the mismatch in thermal expansion coefficients between metal and glass plate 1, the adhesive layer 2 can alleviate the internal stress of the glass substrate 10, thereby helping to improve the bonding force between the glass plate 1 and the adhesive layer 2, and improving the toughness and strength of the glass substrate 10.

[0036] In some embodiments, the resin layer 21 is made of at least one of polyimide, polyethylene terephthalate, and polyethylene. This type of resin layer 21 has good flexibility, which can improve the flexibility of the glass substrate 10, alleviate the internal stress of the glass substrate 10, reduce the risk of breakage when using an ultra-thin glass plate 1 alone, and also facilitate the reduction of the overall thickness of the glass substrate 10.

[0037] In some embodiments, the adhesive layer 22 can be made of at least one of epoxy resin, silicone, and rubber. Using the above adhesive layer 22, when the two glass plates 1 are pressed together, the adhesive layer 22 has a certain fluidity and can fill the first through hole 3 to form a filling portion 4 within the first through hole 3. The adhesive layer 22 can be cured, and subsequently, a second through hole 5 can be formed on the filling portion 4. The filling portion 4 can act as a rivet, further improving the connection stability of the glass substrate 10 laminated structure. It also facilitates the formation of through-holes, enabling circuit continuity. Compared to directly forming holes on the glass plate 1, forming the second through hole 5 on the cured adhesive layer 22 (i.e., the filling portion 4) is simpler. Moreover, compared to directly electroplating on the glass, electroplating on the filling portion 4 to form the conductive portion 40 is easier, has stronger adhesion, and improves the stability of circuit continuity.

[0038] In some embodiments, the thickness of the adhesive layer 2 can be 50μm to 100μm. For example, the thickness of a conventional glass substrate can only be reduced to 0.4mm, while the glass substrate 10 provided in this embodiment can achieve a thickness of less than 0.25mm (0.1mm + 0.05mm + 0.1mm). This significantly reduces the thickness of the glass substrate 10 while improving its toughness.

[0039] Understandably, in other embodiments, the adhesive layer may also be a substrate-free double-sided adhesive, which can further reduce the thickness of the glass substrate 10.

[0040] like Figure 3 As shown, the apertures of the first through hole 3 and the second through hole 4 can be adjusted according to actual needs. Simultaneously, the minimum distance L between the second through hole 5 and the first through hole 3 is ensured to be 10μm~50μm, or the minimum wall thickness L of the filling part 4 is 10μm~50μm. By controlling the minimum wall thickness L of the filling part 4 within the aforementioned range, the riveting effect of the filling part 4 can be strengthened, further improving the stability of the laminated structure, and also increasing the adhesion of the conductive part 40 to the sidewall of the filling part 4.

[0041] like Figure 4 As shown, in other embodiments, a filling portion 4a that does not require the second through hole 5 and the conductive portion 40 can also be provided. In this case, the main function of the filling portion 4a is to act as a rivet to further improve the connection stability of the stacked structure. It is understood that the first through holes 3 on the stacked multilayer glass plates 1 can also be staggered and do not need to correspond one-to-one.

[0042] like Figure 5As shown, the glass substrate 10 may include a functional area 101 and a non-functional area 102 located around the periphery of the functional area 101. The functional area 101 is generally located in the middle of the glass substrate 10, and the non-functional area 102 is disposed around the functional area 101. The first through-hole 3 with a filling portion 4a can be located in the non-functional area 102, and the first through-hole 3 with a filling portion 4a can be located in the functional area 101, making them easy to distinguish and not interfering with each other.

[0043] The conductive part 40 can be made of electroplated metal or filled with conductive paste.

[0044] The first circuit layer 20 and the second circuit layer 30 can be metal circuits, formed on opposite surfaces of the glass substrate 10 using conventional circuit fabrication processes. It is understood that the first circuit layer 20 and the second circuit layer 30 can also be formed by printing conductive paste onto the surface of the glass substrate 10, which can improve the adhesion between the circuit layers and the glass substrate 10, while further reducing the thickness of the circuit board structure 100.

[0045] In some embodiments, the two opposing surfaces of the glass substrate 10 may be surface treated to improve the bonding strength with the first circuit layer 20 and the second circuit layer 30.

[0046] The circuit board structure 100 provided in this application embodiment forms a glass substrate 10 by bonding multiple glass plates 1 together with an adhesive layer 2. This allows for the stacking of multiple ultra-thin glass plates 1, effectively reducing the total thickness of the glass substrate 10 while improving its toughness and reducing the risk of breakage during transfer and handling. Furthermore, each glass plate 1 has a filling portion 4 formed by the adhesive layer 2 within its first through-hole. This filling portion 4 acts like a rivet, increasing the stability of the glass substrate 10 stack. A second through-hole 5 can be formed on the filling portion 4, and a conductive portion 6 can be formed within the second through-hole 5 to achieve a hole-in-hole configuration, ensuring conductivity while enhancing interlayer bonding.

[0047] Please see Figure 6 Please refer to both together. Figures 7 to 10 This application also provides a method for manufacturing a circuit board structure 100, which includes the following steps: Step S1, as follows Figures 7 to 10As shown, a glass substrate 10 is provided, the glass substrate 10 includes a plurality of glass plates 1 stacked together, an adhesive layer 2 is provided between two adjacent glass plates 1, a first through hole 3 is provided through each glass plate 1, the projections of the first through holes 3 located on different glass plates 1 overlap on the adhesive layer 2 along the stacking direction a, the adhesive layer 2 extends into the first through holes 3 on each layer of glass plates 1 to form a filling portion 4, and a second through hole 5 is formed through all the filling portions 4.

[0048] Specifically, the glass substrate 10 may include two glass plates 1, specifically including a first glass plate 11 and a second glass plate 12 stacked together, with the adhesive layer 2 provided between the first glass plate 11 and the second glass plate 12.

[0049] At this time, the method for manufacturing the glass substrate 10 includes the following steps: Step S11, as follows Figure 7 As shown, first through holes 3 are formed on the first glass plate 11 and the second glass plate 12, respectively. Specifically, the first through holes 3 can be formed on the first glass plate 11 and the second glass plate 12 using through glass via (TGV) technology.

[0050] In some embodiments, the first glass plate 11 and the second glass plate 12 can be ultra-thin glass plates, with a thickness of, for example, 100 μm to 150 μm. If ultra-thin glass is manufactured using conventional circuit board forming methods, it requires multiple process steps and is handled repeatedly, making it very fragile and difficult to form. The method described in this application, which combines the ultra-thin first glass plate 11 and the second glass plate 12 with an adhesive layer 2, can effectively improve the toughness of the glass substrate 10 and reduce the risk of breakage during handling.

[0051] Step S12, as follows Figure 8 As shown, the first glass plate 11 and the second glass plate 12 after being perforated are stacked on opposite sides of the adhesive layer 2. Along the stacking direction a, the projections of the first through hole 3 on the first glass plate 11 and the first through hole 3 on the second glass plate 12 on the adhesive layer 2 overlap.

[0052] Since it is necessary to realize a hole-in-hole in the future to achieve the conduction of double-sided circuits, the stacked first through hole 3 needs to be aligned at the required position according to actual needs, so as to form a second through hole 5 that penetrates the glass substrate 10.

[0053] Step S13, as follows Figure 9 As shown, the first glass plate 11, the adhesive layer 2 and the second glass plate 12 are pressed together, so that the adhesive layer 2 extends into the first through hole 3 to form a filling portion 4.

[0054] In some embodiments, the adhesive layer 2 includes a resin layer 21 and an adhesive layer 22 located on opposite surfaces of the resin layer 21, the adhesive layer 22 extending into the first through hole 3.

[0055] In some embodiments, the resin layer 21 is made of at least one of polyimide, polyethylene terephthalate, and polyethylene.

[0056] In some embodiments, the adhesive layer 22 may be made of at least one of epoxy resin, silicone, and rubber. Such an adhesive layer 22 facilitates filling the first through hole 3 after pressing.

[0057] Understandably, the adhesive layer can also be a substrate-free double-sided adhesive, that is, without an intermediate resin layer.

[0058] In step S14, as shown in the figure, the second through hole 5 is formed by passing through all the filling portions 4 in the same column to obtain the glass substrate 10.

[0059] It is easier to form holes in the filling part 4, and it is less likely to damage the first glass plate 11 and the second glass plate 12, thus improving the product yield.

[0060] When the adhesive layer 2 includes the resin layer 21, the second through hole 5 also penetrates the resin layer 21, thereby forming a through hole that penetrates the entire glass substrate 10, so as to facilitate the subsequent setting of the circuit conduction structure.

[0061] Understandably, depending on actual needs, a second through hole 5 can be formed on the filling part 4 where a conductive structure is required, while the filling part 4a where a conductive structure is not required can be left undrilled (in conjunction with...). Figure 4 (As shown).

[0062] Step S2, as follows Figure 10 As shown, a conductive portion 40 is formed within the second through hole 5.

[0063] Specifically, the conductive part 40 can be formed in the second through hole 5 by electroplating. Compared with electroplating directly in the glass through hole, it is easier to electroplat on the inner wall of the filling part 4, and the bonding force between the conductive part 40 and the inner wall of the filling part 4 is stronger, which can improve the stability of the circuit connection.

[0064] While forming the conductive portion 40, metal layers 50 can also be electroplated on the opposite surfaces of the glass substrate 10.

[0065] Understandably, the two opposing surfaces of the glass substrate 10 can be surface treated to improve the adhesion of the metal layer 50 to the glass substrate 10.

[0066] In some embodiments, combined with Figure 3 As shown, the minimum distance L between the second through hole 5 and the first through hole 3 is 10μm to 50μm, or the minimum wall thickness L of the filling part 4 is 10μm to 50μm. By controlling the minimum wall thickness L of the filling part 4 within the aforementioned range, the riveting effect of the filling part 4 can be strengthened, further improving the stability of the laminated structure, and the adhesion of the conductive part 40 to the side wall of the filling part 4 can also be improved.

[0067] Step S3, combined Figure 1 As shown, a first circuit layer 20 and a second circuit layer 30 are formed on opposite surfaces of the glass substrate 10, and the first circuit layer 20 and the second circuit layer 30 are electrically connected through the conductive portion 40, thereby obtaining the circuit board structure 100.

[0068] Specifically, the two metal layers 50 are patterned through processes such as coating, developing, and etching, thereby forming the first circuit layer 20 and the second circuit layer 30 respectively.

[0069] Compared to existing technologies, the method for manufacturing the circuit board structure 100 provided in this application involves bonding multiple thin glass plates 1 together with an adhesive layer 2 to form the glass substrate 10. This effectively improves the toughness of the glass substrate 10, reduces the risk of breakage during production, and increases product yield. Furthermore, the number of glass plate layers 1 can be adjusted according to actual needs to control the thickness of the glass substrate 10, which can be approximately 0.25mm thick, a significant reduction compared to the traditional 0.4mm thickness, thus facilitating the thinning of the circuit board structure 100. Moreover, the first through-hole 3 of the glass plate 1 contains a filling portion 4 formed by the adhesive layer 2. This filling portion 4 acts like a rivet, increasing the stability of the glass substrate 10 stack. A second through-hole 5 can be formed on the filling portion 4, creating a conductive portion 40 for circuit connection, achieving a hole-in-hole configuration. This ensures conductivity while enhancing interlayer bonding. In addition, the manufacturing method of the circuit board structure 100 in this application embodiment is simple, easy to operate, low in cost, and easy to achieve large-scale mass production.

Claims

1. A circuit board structure, characterized in that, include: A glass substrate, a first circuit layer located on one surface of the glass substrate, a second circuit layer located on the surface of the glass substrate away from the first circuit layer, and a conductive portion penetrating the glass substrate and electrically connecting the first circuit layer and the second circuit layer. The glass substrate comprises a plurality of glass plates stacked together, an adhesive layer is provided between two adjacent glass plates, a plurality of first through holes are provided through each glass plate, the projections of the first through holes on different glass plates on the adhesive layer overlap along the stacking direction, the adhesive layer extends into the first through holes of each layer of glass plates to form a filling portion, and a second through hole is formed through all the filling portions in the same column, the conductive portion being located in the second through hole.

2. The circuit board structure as described in claim 1, characterized in that, The adhesive layer includes a resin layer and an adhesive layer located on opposite surfaces of the resin layer. The adhesive layer extends into the first through hole on the glass plate on the same side, and the second through hole also penetrates the resin layer.

3. The circuit board structure as described in claim 2, characterized in that, The resin layer is made of at least one of polyimide, polyethylene terephthalate, and polyethylene.

4. The circuit board structure as described in claim 2, characterized in that, The adhesive layer can be made of at least one of epoxy resin, silicone, and rubber.

5. The circuit board structure as described in claim 1, characterized in that, The minimum wall thickness of the filling part is 10μm~50μm.

6. The circuit board structure as described in claim 1, characterized in that, The thickness of the glass plate is 100μm~150μm; The thickness of the adhesive layer is 50μm~100μm.

7. A method for manufacturing a circuit board structure, characterized in that, include: A glass substrate is provided, the glass substrate comprising a plurality of glass plates stacked together, an adhesive layer being provided between two adjacent glass plates, a plurality of first through holes being provided through each glass plate, the projections of the first through holes on different glass plates overlapping on the adhesive layer along the stacking direction, the adhesive layer extending into the first through holes on each layer of glass plates to form a filling portion, and a second through hole being formed through all the filling portions in the same column. A conductive portion is formed within the second through hole; as well as A first circuit layer and a second circuit layer are formed on opposite surfaces of the glass substrate, and the first circuit layer and the second circuit layer are electrically connected through the conductive portion to obtain the circuit board structure.

8. The method for manufacturing the circuit board structure as described in claim 7, characterized in that, The glass substrate includes a first glass plate and a second glass plate stacked together, with the adhesive layer provided between the first glass plate and the second glass plate. The method for manufacturing the glass substrate includes: A plurality of first through holes are formed on the first glass plate and the second glass plate respectively; The first glass plate and the second glass plate after forming holes are stacked on opposite sides of the adhesive layer. Along the stacking direction, the projection of the first through hole in the first glass plate and the first through hole in the second glass plate on the adhesive layer overlaps. The first glass plate, the adhesive layer, and the second glass plate are pressed together, so that the adhesive layer extends into the first through hole to form a filling portion; The second through-hole is formed by passing through all the filling portions in the same column to obtain the glass substrate.

9. The method for manufacturing the circuit board structure as described in claim 7, characterized in that, The adhesive layer includes a resin layer and an adhesive layer located on opposite surfaces of the resin layer. The adhesive layer extends into the first through hole on the glass plate on the same side, and the second through hole also penetrates the resin layer.

10. The method for manufacturing the circuit board structure as described in claim 9, characterized in that, The resin layer is made of at least one of polyimide, polyethylene terephthalate, and polyethylene. The adhesive layer can be made of at least one of epoxy resin, silicone, and rubber.

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