Method for manufacturing a packaging structure and packaging aid

Abstract

The application relates to a manufacturing method of a packaging structure and a packaging auxiliary part, and comprises the following steps: providing a packaging auxiliary part, a plurality of magnetic attraction grooves are formed on a substrate of the packaging auxiliary part; arranging the substrate in a magnetic attraction state above a wafer, embedding first ends of all magnetic attraction plugs of the packaging auxiliary part into the magnetic attraction grooves, and making projections of the magnetic attraction plugs in a direction towards a wafer surface fall into projections of to-be-protected grooves in a chip in the wafer in the direction towards the wafer surface; adjusting the substrate to a demagnetization state, making the magnetic attraction plugs fall and embedding second ends of the magnetic attraction plugs into the to-be-protected grooves; forming an electromagnetic shielding layer covering the wafer, the chip and the magnetic attraction plugs; adjusting the substrate to the magnetic attraction state again, embedding the first ends of all the magnetic attraction plugs into the magnetic attraction grooves, so that the electromagnetic shielding layer covers the wafer and the chip and exposes the to-be-protected grooves. The application realizes one-time formation of electromagnetic shielding layers of multiple chips, and reduces or avoids the risk of dislocation or breakage of the electromagnetic shielding layers.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a method for manufacturing a packaging structure and packaging auxiliary components. Background Technology

[0002] In the field of semiconductor technology, there are many integrated circuit (IC) chips that are sensitive to electromagnetic interference, such as radio frequency (RF) chips (especially high-frequency RF chips). Electromagnetic shielding must be done before using such chips to ensure that the chips can operate normally.

[0003] System-in-Package (SiP) is an integrated modular design technology that combines one or more IC chips that perform overall electronic circuit functions, along with their associated discrete components, into a single plastic package. Within a SiP module, the most common shielding method is to use a shielding cover to enclose electromagnetic interference (EMI) sensitive components or components that generate EMI.

[0004] Generally, secondary molding encapsulation and encapsulating components in resin can be used to protect the package and components from mechanical damage, impact, and moisture. This method requires openings on the top and sides of the casing inside the component to facilitate the flow of encapsulating resin. Furthermore, in high-frequency operation, the number and size of these openings must be strictly limited to prevent EMI leakage.

[0005] However, due to the limited flowability of the encapsulating resin, some openings may be blocked by the resin, resulting in residual air inside the casing and the formation of air gaps. This can adversely affect the reliability of the encapsulation structure during subsequent heat transfer, and in severe cases, may even lead to the cracking and displacement of the casing. Summary of the Invention

[0006] Therefore, it is necessary to provide a method for manufacturing a packaging structure and packaging auxiliary components to achieve the one-time formation of electromagnetic shielding layers for multiple chips, thereby reducing or avoiding the risk of electromagnetic shielding layer misalignment or breakage.

[0007] In a first aspect, this application provides a method for manufacturing a packaging structure, including:

[0008] A packaging aid is provided, including a substrate and a plurality of magnetic plugs, wherein a plurality of magnetic grooves are formed on the substrate;

[0009] Adjust the substrate to a magnetic state so that the first ends of all the magnetic plugs are embedded in the magnetic grooves;

[0010] The substrate is placed above the wafer, and the projection of the magnetic plug toward the surface of the wafer falls into the projection of the groove to be protected toward the surface of the wafer. The wafer has multiple chips arranged in an array, and the groove to be protected is formed on the side of the chip away from the wafer.

[0011] Adjust the substrate to a demagnetized state, causing all the magnetic plugs to fall down until the second end of the magnetic plug is embedded in the groove to be protected.

[0012] An electromagnetic shielding layer is formed on the surface of the wafer near the chip, and the electromagnetic shielding layer covers the wafer, the chip and the magnetic plug;

[0013] The substrate is readjusted to the magnetic attraction state so that the first ends of all the magnetic plugs are embedded in the magnetic grooves, so that the remaining electromagnetic shielding layer covers the wafer and the chip and exposes the groove to be protected.

[0014] In one embodiment, the electromagnetic shielding layer is formed using a physical vapor deposition process.

[0015] In one embodiment, after the second end of the magnetic plug is embedded in the groove to be protected, and before an electromagnetic shielding layer is formed on the surface of the wafer near the chip, the method of manufacturing the packaging structure further includes:

[0016] The wafer was pre-cleaned using a capacitively coupled plasma instrument.

[0017] In one embodiment, the material of the electromagnetic shielding layer includes at least one of metallic and alloy materials.

[0018] In one embodiment, after forming an electromagnetic shielding layer on the surface of the wafer near the chip, the method for manufacturing the packaging structure further includes:

[0019] An electroplating metal process is performed to form a seed layer on the side of the electromagnetic shielding layer away from the wafer.

[0020] In one embodiment, the thickness of the electromagnetic shielding layer ranges from 1µm to 2µm.

[0021] In one embodiment, the magnetic plug is made of a magnetic material, and the substrate includes an electromagnet.

[0022] Secondly, this application also provides a packaging aid for assisting in the manufacture of an electromagnetic shielding layer on a wafer, comprising:

[0023] The substrate is disposed above the wafer at intervals during the auxiliary manufacturing of the electromagnetic shielding layer, including a magnetic attraction state and a non-magnetic demagnetization state. The substrate is provided with a plurality of magnetic attraction grooves, and the arrangement of the magnetic attraction grooves on the substrate is the same as the arrangement of the plurality of chips disposed on the wafer.

[0024] Multiple magnetic plugs, the number of which is the same as the number of magnetic grooves, each magnetic plug including a first end and a second end;

[0025] When the substrate is in a magnetically attracted state, the first end is embedded in the magnetically attracted groove, and the second end is separated from the groove to be protected;

[0026] When the substrate is in a demagnetized state, the second end is embedded in the groove to be protected, and the first end is separated from the magnetic groove.

[0027] In one embodiment, the number of magnetic grooves is the same as the number of grooves to be protected, and the projection of the magnetic grooves toward the surface of the wafer overlaps the projection of the grooves to be protected toward the surface of the wafer.

[0028] In one embodiment, the substrate includes an electromagnet, which is in a magnetically attracted state when the electromagnet is energized and in a demagnetized state when the electromagnet is de-energized.

[0029] In summary, this application provides a method for manufacturing a packaging structure and packaging aids. By adjusting the substrate to a demagnetized state, the magnetic plug is dislodged from the magnetic groove on the substrate and embedded into the groove to be protected of the chip, ensuring that the magnetic plug covers the groove to be protected during the formation of the electromagnetic shielding layer. By adjusting the substrate to a magnetic state after the electromagnetic shielding layer is formed, the magnetic plug is dislodged from the groove to be protected and embedded into the magnetic groove, so that the remaining electromagnetic shielding layer covers the wafer and the chip and exposes the groove to be protected, thereby achieving the one-time formation of electromagnetic shielding layers for multiple chips and reducing or avoiding the risk of misalignment or breakage during the manufacturing process of the electromagnetic shielding layer. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1A flowchart illustrating a method for manufacturing a packaging structure according to one embodiment of this application.

[0032] Figure 2 This is a schematic diagram of the structure corresponding to the step of providing a packaging auxiliary component and adjusting the substrate to a magnetic state in the manufacturing method of the packaging structure provided in one embodiment of this application.

[0033] Figure 3a This is a schematic diagram of the structure corresponding to the step of placing the substrate above the wafer in the manufacturing method of the packaging structure provided in one embodiment of this application.

[0034] Figure 3b for Figure 3a The schematic diagram of the wafer surface corresponding to the steps shown is shown.

[0035] Figure 4a This is a schematic diagram of the structure corresponding to the step of adjusting the substrate to a demagnetized state in the manufacturing method of the packaging structure provided in one embodiment of this application.

[0036] Figure 4b for Figure 4a The schematic diagram of the wafer surface corresponding to the steps shown is shown.

[0037] Figure 5a This is a schematic diagram of the structure corresponding to the step of forming an electromagnetic shielding layer on the surface of the wafer near the chip side in the manufacturing method of the packaging structure provided in one embodiment of this application.

[0038] Figure 5b for Figure 5a The schematic diagram of the wafer surface corresponding to the steps shown is shown.

[0039] Figure 6a This is a schematic diagram of the structure corresponding to the step of readjusting the substrate to a magnetically attracted state in the manufacturing method of the packaging structure provided in one embodiment of this application.

[0040] Figure 6b for Figure 6a The schematic diagram of the wafer surface corresponding to the steps shown is shown.

[0041] Explanation of reference numerals in the attached drawings: 100-Packaging auxiliary component; 110-Substrate; 111-Magnetic groove; 120-Magnetic plug; 200-Wafer; 210-Chip; 211-Groove to be protected; 220-Electromagnetic shielding layer. Detailed Implementation

[0042] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0044] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, parts, regions, layers, doping types, and / or portions, these elements, parts, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, part, region, layer, doping type, or portion from another element, part, region, layer, doping type, or portion. Therefore, without departing from the teachings of this invention, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion; for example, the first doping type may be referred to as the second doping type, and similarly, the second doping type may be referred to as the first doping type; the first doping type and the second doping type are different doping types, for example, the first doping type may be P-type and the second doping type may be N-type, or the first doping type may be N-type and the second doping type may be P-type.

[0045] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0046] When used herein, the singular forms of “a,” “an,” and “ / the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0047] Generally, electromagnetic shielding of chips involves placing a metal casing around the chip's package or fabricating a metal film outside the package using magnetron sputtering. However, these methods increase the size of the chip package structure, and magnetron sputtering is prone to oversputtering and short circuits during the sputtering process. Furthermore, the metal layer formed by magnetron sputtering has poor adhesion to the package, making it prone to detachment during use.

[0048] System-in-Package (SiP) is an integrated modular design technology that combines one or more IC chips that perform overall electronic circuit functions, along with their associated discrete components, into a single plastic package. Electromagnetic interference (EMI) and radio frequency interference (RFI) are interferences caused by electromagnetic radiation emitted by electronic circuits and components carrying changing electrical signals. In single-package designs, especially when EMI-sensitive components and / or RF components are tightly packed together, EMI is a major factor affecting single-package designs. With the increasing application of wireless technology in small electronic devices, the need to consider EMI during design is growing.

[0049] Within a System-in-Package (SiP) module, the most common shielding method is to use a shield to enclose EMI-sensitive or EMI-generating components. These components are typically mounted on the front side of a support substrate, beneath which is a grounding trace layer. A metal or other shaped conductive enclosure is placed over the component to seal it within. This type of enclosure (including metal and conductive enclosures) occupies a significant portion of the surface area of ​​the support substrate, and the connection between the enclosure and the support substrate may be unstable. The solder joints securing the enclosure to the support substrate are subject to alternating stress, often leading to displacement of the enclosure from the substrate surface.

[0050] Generally, secondary molding encapsulation and encapsulating components (including housings) within resin can protect the package and components from mechanical damage, impact, and moisture corrosion. This method requires openings on the top and sides of the housing to facilitate resin flow, and the number and size of these openings must be strictly limited during high-frequency operation to prevent EMI leakage. However, due to the limited fluidity of the encapsulating resin, some openings may become blocked, leaving air gaps inside the housing. This negatively impacts the reliability of the package structure during subsequent heat transfer, and in severe cases, can even lead to housing breakage and displacement. Furthermore, currently used housings are often too large for high-density board-level packaging.

[0051] Therefore, it is necessary to provide a method for manufacturing a packaging structure and packaging auxiliary components to achieve the one-time formation of electromagnetic shielding layers for multiple chips, so as to reduce or avoid the risk of misalignment or breakage of electromagnetic shielding layers, thereby improving the efficiency and yield of high-density board-level packaging.

[0052] First, refer to Figure 1 One embodiment of this application provides a method for manufacturing a packaging structure, including the following steps S01 to S06.

[0053] Step S01: Provide a packaging auxiliary component, including a substrate and a plurality of magnetic plugs, wherein a plurality of magnetic grooves are formed on the substrate.

[0054] Step S02: Adjust the substrate to a magnetic state so that the first end of all the magnetic plugs is embedded in the magnetic groove.

[0055] Step S03: The substrate is placed above the wafer, and the projection of the magnetic plug toward the surface of the wafer falls into the projection of the groove to be protected toward the surface of the wafer. The wafer is provided with an array of multiple chips, and the groove to be protected is formed on the side of the chip away from the wafer.

[0056] It should be noted that the number and position of the magnetic grooves and the grooves to be protected are one-to-one, so that each groove to be protected on the wafer is embedded with a magnetic plug in the subsequent process, so that all chips can be processed simultaneously and the efficiency of the process can be improved.

[0057] Step S04: Adjust the substrate to the demagnetized state, so that all the magnetic plugs fall down until the second end of the magnetic plug is embedded in the groove to be protected.

[0058] Step S05: An electromagnetic shielding layer is formed on the surface of the wafer near the chip, the electromagnetic shielding layer covering the wafer, the chip and the magnetic plug.

[0059] Step S06: Adjust the substrate to the magnetic state again, so that the first end of all the magnetic plugs is embedded in the magnetic groove, so that the remaining electromagnetic shielding layer covers the wafer and the chip and exposes the groove to be protected.

[0060] As can be seen, the final electromagnetic shielding layer, while covering the wafer and the chip, exposes the grooves inside the chip that need to be protected. This achieves electromagnetic shielding of the chip and facilitates the smooth progress of subsequent packaging processes.

[0061] The manufacturing method of the packaging structure described above involves adjusting the substrate to a demagnetized state, causing the magnetic plug to detach from the magnetic groove on the substrate and embed into the groove to be protected of the chip, thereby ensuring that the magnetic plug covers the groove to be protected during the formation of the electromagnetic shielding layer. After the electromagnetic shielding layer is formed, the substrate is adjusted to a magnetic state, causing the magnetic plug to detach from the groove to be protected and embed into the magnetic groove, so that the remaining electromagnetic shielding layer covers the wafer and the chip while exposing the groove to be protected. This achieves the one-time formation of electromagnetic shielding layers for multiple chips, reducing or avoiding the risk of misalignment or breakage during the manufacturing process of the electromagnetic shielding layer.

[0062] See Figure 2 In one embodiment, a packaging aid 100 is provided, including a substrate 110 and a plurality of magnetic plugs 120, wherein a plurality of magnetic grooves 111 are formed on the substrate 110; the substrate 110 is adjusted to a magnetic state so that the first ends of all magnetic plugs 120 are embedded in the magnetic grooves 111.

[0063] In one embodiment, the magnetic plug is made of a magnetic material; the substrate includes an electromagnet, and the substrate is in a magnetic state when the electromagnet is energized and in a demagnetized state when the electromagnet is de-energized.

[0064] See Figure 3a and Figure 3b ( Figure 3a The wafer 200 shown is Figure 3b (A schematic diagram of the cross-sectional structure of the wafer 200 along the AB direction). In one embodiment, the substrate 110 is disposed above the wafer 200, and the projection of the magnetic plug 120 toward the surface of the wafer 200 falls into the projection of the groove to be protected 211 toward the surface of the wafer 200. The wafer 200 is provided with a plurality of chips 210 arranged in an array, and the groove to be protected 211 is formed on the side of the chip 210 away from the wafer 200.

[0065] It should be noted that the number of magnetic grooves, magnetic components, and chips are all the same. The arrangement of the magnetic grooves on the substrate is the same as the arrangement of the chips on the wafer, to ensure that the magnetic auxiliary components can assist in the manufacture of the electromagnetic shielding layer of all chips on the wafer at one time.

[0066] In one embodiment, the shape and size of the substrate can correspond to the shape and size of the wafer, and alignment marks are provided on both the substrate and the wafer to achieve alignment of the substrate and the wafer in a direction perpendicular to the wafer surface, thereby reducing or avoiding the probability of misalignment of the electromagnetic shielding layer subsequently prepared.

[0067] See Figure 4a and Figure 4b ( Figure 4aThe wafer 200 shown is Figure 4b (A cross-sectional view of the wafer 200 along the AB direction) In one embodiment, the substrate 110 is adjusted to a demagnetized state, causing all the magnetic plugs 120 to fall down until the second end of the magnetic plug 120 is embedded in the groove 211 to be protected.

[0068] In one embodiment, the second end of the magnetic plug can be inserted into the groove to be protected first, and then the substrate can be adjusted to a demagnetized state to ensure that the magnetic plug can fall accurately into the groove to be protected under the action of gravity, thereby reducing or avoiding the probability of the magnetic plug accidentally falling outside the groove to be protected, and ensuring the smooth progress of subsequent packaging processes.

[0069] See Figure 5a and Figure 5b ( Figure 5a The wafer 200 shown is Figure 5b (A schematic cross-sectional view of wafer 200 along the AB direction is shown). In one embodiment, an electromagnetic shielding layer 220 is formed on the surface of wafer 200 near chip 210 using physical vapor deposition (PVD). The electromagnetic shielding layer 220 covers wafer 200, chip 210, and magnetic plug 120. Optionally, the material of the electromagnetic shielding layer 220 includes at least one of metallic and alloy materials. Optionally, the thickness of the electromagnetic shielding layer 220 ranges from 1µm to 2µm.

[0070] In one embodiment, after the second end of the magnetic plug is embedded in the groove to be protected (i.e., after step S04) and before an electromagnetic shielding layer is formed on the surface of the wafer near the chip (i.e., before step S05), the method for manufacturing the package structure further includes: pre-cleaning the wafer using a capacitively coupled (CCP) plasma machine to remove dust and impurity particles from the wafer and chip surfaces.

[0071] In one embodiment, after forming an electromagnetic shielding layer on the surface of the wafer near the chip, the method for manufacturing the package structure further includes performing an electroplating metal process to form a seed layer (not shown) on the side of the electromagnetic shielding layer away from the wafer. In subsequent packaging processes, the seed layer can serve as a transition layer between the electromagnetic shielding layer and the encapsulating resin, increasing the adhesion between different film layers and thereby improving the stability of the final package structure.

[0072] See Figure 6a and Figure 6b ( Figure 6a The wafer 200 shown is Figure 6b(Schematic diagram of cross-sectional structure of wafer 200 along the AB direction). In one embodiment, the substrate 110 is adjusted to a magnetic state again, so that the first ends of all magnetic plugs 120 are embedded in the magnetic grooves 111, so that the remaining electromagnetic shielding layer 220 covers the wafer 200 and the chip 210 and exposes the groove 211 to be protected.

[0073] In one embodiment, the first end of the magnetic plug can be inserted into the magnetic groove first, and then the substrate can be adjusted to the magnetic state to ensure that the magnetic plug can be accurately embedded in the magnetic groove under the magnetic attraction, thereby reducing or avoiding the probability of the magnetic plug coming out of the magnetic groove, and ensuring the smooth progress of the next packaging process.

[0074] In one embodiment, the packaging structure manufacturing method produces a high-density board-level packaging structure (i.e., a board-level packaging structure with a size greater than 300mm × 300mm), which prepares electromagnetic shielding layers for multiple chips in a one-time, batch, and high-density manner, thereby reducing packaging costs and improving packaging efficiency.

[0075] Accordingly, this application also provides a packaging aid for assisting in the fabrication of an electromagnetic shielding layer on a wafer. See also... Figure 2 and Figure 4a In one embodiment, the packaging aid 100 includes a substrate 110 and a plurality of magnetic plugs 120. The substrate 110 is spaced above the wafer 200 during the auxiliary fabrication of the electromagnetic shielding layer, including a magnetically attracted state and a non-magnetically demagnetized state. The substrate 110 has a plurality of magnetically attracted grooves 111, and the arrangement of the magnetically attracted grooves 111 on the substrate 110 is the same as the arrangement of the plurality of chips 210 disposed on the wafer 200. The number of magnetically attracted plugs 120 is the same as the number of magnetically attracted grooves 111, and each magnetically attracted plug 120 includes a first end and a second end. (See also...) Figure 2 When the substrate 110 is in a magnetically attracted state, the first end of the magnetic plug 120 is embedded in the magnetically attracted groove 111, and the second end of the magnetic plug 120 is separated from the groove 211 to be protected; see reference Figure 4a When the substrate 110 is in a demagnetized state, the second end of the magnetic plug 120 is embedded in the groove 211 to be protected, and the first end of the magnetic plug 120 is separated from the magnetic groove 111.

[0076] As described above, the packaging auxiliary components can assist in the manufacturing process of the electromagnetic shielding layer on the wafer during the packaging structure manufacturing process, enabling the one-time formation of the electromagnetic shielding layer of multiple chips, reducing or avoiding the risk of misalignment or breakage during the manufacturing process of the electromagnetic shielding layer.

[0077] In one embodiment, the number of magnetic grooves is the same as the number of grooves to be protected, and the projection of the magnetic grooves toward the surface of the wafer covers the projection of the grooves to be protected toward the surface of the wafer, so as to ensure that the magnetic plugs can be smoothly embedded into the grooves to be protected or the magnetic grooves.

[0078] In one embodiment, the shape and size of the substrate can correspond to the shape and size of the wafer, and alignment marks are provided on both the substrate and the wafer to achieve alignment of the substrate and the wafer in a direction perpendicular to the wafer surface, thereby reducing or avoiding the probability of misalignment of the electromagnetic shielding layer subsequently prepared.

[0079] In one embodiment, the substrate includes an electromagnet. When the electromagnet is energized, the substrate is in a magnetic attraction state, and when the electromagnet is de-energized, the substrate is in a demagnetized state. The magnetic attraction state and the demagnetized state of the substrate can be switched by controlling the electromagnet to be energized or de-energized.

[0080] In summary, this application provides a method for manufacturing a packaging structure and packaging aids. By adjusting the substrate to a demagnetized state, the magnetic plug is dislodged from the magnetic groove on the substrate and embedded into the groove to be protected of the chip, ensuring that the magnetic plug covers the groove to be protected during the formation of the electromagnetic shielding layer. By adjusting the substrate to a magnetic state after the electromagnetic shielding layer is formed, the magnetic plug is dislodged from the groove to be protected and embedded into the magnetic groove, so that the remaining electromagnetic shielding layer covers the wafer and the chip and exposes the groove to be protected, thereby achieving the one-time formation of electromagnetic shielding layers for multiple chips and reducing or avoiding the risk of misalignment or breakage during the manufacturing process of the electromagnetic shielding layer.

[0081] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for manufacturing a packaging structure, characterized in that, include: A packaging aid is provided, including a substrate and a plurality of magnetic plugs, wherein a plurality of magnetic grooves are formed on the substrate; Adjust the substrate to a magnetic state so that the first ends of all the magnetic plugs are embedded in the magnetic grooves; The substrate is placed above the wafer, and the projection of the magnetic plug toward the surface of the wafer falls into the projection of the groove to be protected toward the surface of the wafer. The wafer has multiple chips arranged in an array, and the groove to be protected is formed on the side of the chip away from the wafer. Adjust the substrate to a demagnetized state, causing all the magnetic plugs to fall down until the second end of the magnetic plug is embedded in the groove to be protected. An electromagnetic shielding layer is formed on the surface of the wafer near the chip, and the electromagnetic shielding layer covers the wafer, the chip and the magnetic plug; The substrate is readjusted to the magnetic attraction state so that the first ends of all the magnetic plugs are embedded in the magnetic grooves, so that the remaining electromagnetic shielding layer covers the wafer and the chip and exposes the groove to be protected.

2. The method for manufacturing the packaging structure according to claim 1, characterized in that, The electromagnetic shielding layer is formed using a physical vapor deposition process.

3. The method for manufacturing the packaging structure according to claim 2, characterized in that, After the second end of the magnetic plug is embedded in the groove to be protected, and before an electromagnetic shielding layer is formed on the surface of the wafer near the chip, the method for manufacturing the packaging structure further includes: The wafer was pre-cleaned using a capacitively coupled plasma instrument.

4. The method for manufacturing the packaging structure according to claim 1, characterized in that, The material of the electromagnetic shielding layer includes at least one of metallic materials and alloy materials.

5. The method for manufacturing the packaging structure according to claim 4, characterized in that, After forming an electromagnetic shielding layer on the surface of the wafer near the chip, the method for manufacturing the packaging structure further includes: An electroplating metal process is performed to form a seed layer on the side of the electromagnetic shielding layer away from the wafer.

6. The method for manufacturing the packaging structure according to claim 1, characterized in that, The thickness of the electromagnetic shielding layer ranges from 1µm to 2µm.

7. The method for manufacturing the packaging structure according to claim 1, characterized in that, The magnetic plug is made of magnetic material, and the substrate includes an electromagnet.

8. A packaging auxiliary component for assisting in the manufacture of an electromagnetic shielding layer on a wafer, characterized in that, include: The substrate is disposed above the wafer at intervals during the auxiliary manufacturing of the electromagnetic shielding layer, including a magnetic attraction state and a non-magnetic demagnetization state. The substrate is provided with a plurality of magnetic attraction grooves, and the arrangement of the magnetic attraction grooves on the substrate is the same as the arrangement of the plurality of chips disposed on the wafer. Multiple magnetic plugs, the number of which is the same as the number of magnetic grooves, each magnetic plug including a first end and a second end; When the substrate is in a magnetically attracted state, the first end is embedded in the magnetically attracted groove, and the second end is separated from the groove to be protected; When the substrate is in a demagnetized state, the second end is embedded in the groove to be protected, and the first end is separated from the magnetic groove.

9. The packaging auxiliary component according to claim 8, characterized in that, The number of magnetic grooves is the same as the number of grooves to be protected, and the projection of the magnetic grooves toward the surface of the wafer covers the projection of the grooves to be protected toward the surface of the wafer.

10. The packaging auxiliary component according to claim 8, characterized in that, The substrate includes an electromagnet. When the electromagnet is energized, the substrate is in a magnetically attracted state, and when the electromagnet is de-energized, the substrate is in a demagnetized state.

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