A fluid delivery system including a modular flow channel substrate

Abstract

The delivery system can include a modular flow channel baseplate including an i-block (203) and an i-bridge (205). The i-block (203) can include a first i-block conduit port (209), a second i-block conduit port (211), a plurality of mounting holes (215), a connection recess (219), at least one i-block connection hole, and a fluid path extending between the first i-block conduit port and the second i-block conduit port. The i-bridge (205) can include an i-bridge conduit port (223), a manifold connection conduit port, at least one connection hole (225), at least one mounting hole (227), a connection protrusion (229), and a fluid path extending between the i-bridge conduit port and the manifold connection conduit port. The connection protrusion can be sized and configured to fit within the connection recess of the i-block.

Description

Technical Field

[0001] This disclosure relates to fluid delivery systems, and more particularly to surface-mount fluid delivery systems for extreme flow rates and / or high temperatures in the semiconductor processing and petrochemical industries. Background Technology

[0002] Fluid delivery systems are used in many modern industrial processes to regulate and control fluid flow to provide controlled introduction of desired substances into the process. Practitioners have developed a whole class of fluid delivery systems with fluid handling components removably attached to a flow substrate containing fluid path conduits. The arrangement of such flow substrates establishes a flow sequence through which the fluid handling components provide the desired fluid regulation and control. The interface between such flow substrates and the removable fluid handling components is standardized and has little variation. This fluid delivery system design is often described as a modular or surface-mount system. Representative applications of surface-mount fluid delivery systems include gas panels used in semiconductor manufacturing equipment and sampling systems used in petrochemical refining. Many types of manufacturing equipment used to perform process steps in semiconductor manufacturing are collectively referred to as tooling. Embodiments of the present invention generally relate to fluid delivery systems for semiconductor processing, and specifically to surface-mount fluid delivery systems particularly suitable for extreme flow rates and / or where process fluids will be heated to temperatures above ambient in high-temperature applications. Aspects of the present invention are applicable to surface-mount fluid delivery system designs, whether localized or distributed around semiconductor processing tooling.

[0003] Industrial process fluid delivery systems feature fluid path piping, constructed from materials selected based on their mechanical properties and considering potential chemical interactions with the fluid being delivered. Stainless steel is typically chosen for its corrosion resistance and robustness, but in some cases where cost and ease of manufacture are more important, aluminum or brass may be suitable. In applications where potential ionic contamination of the fluid precludes the use of metals, the fluid path can also be constructed from polymeric materials. Methods for hermetically attaching fluid handling components to the fluid path piping on the flow channel substrate are typically standardized within specific surface mount system designs to minimize the number of different component types. Most attachment methods use deformable gaskets inserted between the fluid component and the flow channel substrate to which it is attached. Gaskets can be simple elastomeric O-rings or specialized metal sealing rings, as seen in U.S. Patent Nos. 5,803,507 and 6,357,760. Since the early days of the semiconductor electronics industry, the controlled delivery of high-purity fluids in semiconductor manufacturing equipment has been a focus, and the construction of fluid delivery systems primarily using metal seals was an early development. An early example of a suitable bellows-sealed valve can be seen in U.S. Patent No. 3,278,156, while a widely used VCR for connecting fluid conduits can be seen in U.S. Patent No. 3,521,910. ® Connectors, and typical early diaphragm-sealed valves can be seen, for example, in U.S. Patent No. 5,730,423. Recent commercial interest in photovoltaic solar cell manufacturing may lead to a resurgence of fluid delivery systems employing resilient seals, where the purity requirements for photovoltaic solar cell manufacturing are less stringent than those required for manufacturing the latest microprocessor devices.

[0004] An assembly of fluid handling components assembled into a sequence designed to handle a single fluid substance is generally referred to as a gas bar. A device subsystem consisting of several gas bars intended to deliver process fluids to a specific semiconductor processing chamber is generally referred to as a gas panel. During the 1990s, several inventors tackled the maintainability and size issues of gas panels by creating gas bars, where the overall fluid flow path consists of a passive metallic structure comprising conduits through which the process fluid moves, valves, and similar active (and passive) fluid handling components are removably attached to it. Passive fluid flow path elements have been referred to differently as manifolds, substrates, blocks, etc., with some inconsistencies even in the work of individual inventors. This application chooses to use the terms flow path substrate or manifold to indicate fluid delivery system elements that include passive fluid flow paths on which other fluid handling devices may be mounted. Summary of the Invention

[0005] In one embodiment, the delivery system may include a modular flow channel substrate comprising an I-block and an I-bridge. The I-block may include a first I-block conduit port, a second I-block conduit port, a plurality of mounting holes, a connection recess, at least one I-block connection hole, and a fluid path extending between the first and second I-block conduit ports. The I-bridge may include an I-bridge conduit port, a manifold connection conduit port, at least one connection hole, at least one mounting hole, a connection protrusion, and a fluid path extending between the I-bridge conduit port and the manifold connection conduit port. The size and configuration of the connection protrusion may be designed to fit within the connection recess of the I-block, and the at least one connection hole may be configured to mate with the at least one I-block connection hole to allow fasteners to secure the I-bridge to the I-block to form the modular flow channel substrate. The plurality of mounting holes of the modular flow channel substrate may be configured to couple the modular flow channel substrate to at least one manifold and at least one fluid handling component. Attached Figure Description

[0006] Figure 1 An embodiment of a manifold as seen in the prior art is shown.

[0007] Figure 2 A top view of an embodiment of a modular flow channel substrate coupled to a Kls manifold is shown.

[0008] Figure 3A As shown Figure 2 A side view of an embodiment of a modular flow channel substrate coupled to a Kls manifold.

[0009] Figure 3B It shows along Figure 3A The image shows a cross-sectional view of an embodiment of a modular flow channel substrate coupled to a Kls manifold, taken from line BB.

[0010] Figure 4 As shown Figure 2 An isometric side view of an embodiment of a modular flow channel substrate coupled to a Kls manifold.

[0011] Figure 5 A top view of an embodiment of a modular flow channel substrate coupled to an ICS manifold is shown.

[0012] Figure 6A and Figure 6B As shown Figure 5 A side view of an embodiment of a modular flow channel substrate coupled to an ICS manifold.

[0013] Figure 6C It shows along Figure 6BThe image shows a cross-sectional view of an embodiment of a modular flow channel substrate coupled to an ICS manifold, taken from line BB.

[0014] Figure 7 As shown Figure 5 An isometric side view of an embodiment of a modular flow channel substrate coupled to an ICS manifold.

[0015] Figure 8A A separate isometric side view of an embodiment of the modular flow channel substrate and ICS manifold is shown.

[0016] Figure 8B A separate isometric bottom side view of an embodiment of the modular flow channel substrate and ICS manifold is shown. Detailed Implementation

[0017] This document describes various embodiments of various devices and / or systems. Numerous specific details are set forth to provide a thorough understanding of the overall structure, function, manufacture, and / or use of the embodiments as described in the specification and illustrated in the accompanying drawings. However, those skilled in the art will understand that embodiments can be practiced without such specific details. In other instances, well-known operations, components, and elements have not been described in detail so as not to obscure the embodiments described in the specification. Those skilled in the art will understand that the embodiments described and illustrated herein are non-limiting examples, and therefore it can be understood that the specific structural and functional details disclosed herein may be representative and do not necessarily limit the scope of the embodiments, which is defined only by the appended claims.

[0018] Throughout this specification, references to "various embodiments," "some embodiments," "one embodiment," "an exemplary embodiment," etc., mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Therefore, phrases such as "in various embodiments," "in some embodiments," "in one embodiment," "in an exemplary embodiment," etc., appearing throughout the specification, do not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic can be combined in any suitable manner in one or more embodiments. Thus, a particular feature, structure, or characteristic shown or described in connection with one embodiment can be combined, in whole or in part, with features, structures, or characteristics of one or more other embodiments, provided that such combination is not illogical or non-functional.

[0019] Referring now to the accompanying drawings, the same reference numerals are used to identify the same or similar parts in the various views. Figure 2 The diagram schematically illustrates the basic concept and design overview of the device.

[0020] Embodiments of this invention relate to a surface-mount fluid delivery channel substrate, particularly suitable for extreme flow rate and / or high-temperature applications, wherein process fluids will be heated (or cooled) to temperatures above (or below) the ambient environment. As used herein, and in the context of semiconductor process fluid delivery systems, the expression "extreme flow rate" corresponds to gas flow rates above approximately 50 SLM or below approximately 50 SCCM. An important aspect of this invention is the ability to fabricate channel substrates with fluid passage conduits having a substantially larger or smaller cross-sectional area (dimension) than other surface-mount structures.

[0021] Figure 1 An embodiment of a flow channel substrate 101 as seen in the prior art is illustrated. The flow channel substrate 101 may be formed from a solid block of material, wherein machined portions form a first conduit port 103, a second conduit port 105, a third conduit port 107, and a plurality of mounting holes 109. The flow channel substrate 101 may include various configurations required for various delivery flow systems. Fluid passages may be established between the conduit ports to allow fluid to move through the flow channel substrate. In some embodiments, the flow channel substrate 101 may include multiple different fluid paths. Figure 1 As shown, the flow channel substrate 101 is formed from a single piece of material, which is machined to create fluid paths, mounting holes, and other portions within the flow channel substrate. Excess material is removed from the flow channel substrate 101 to produce the finished product. However, the materials used in the flow channel substrate 101 can be expensive, and manufacturing the flow channel substrate in this manner incurs excessive material and processing costs. Furthermore, as... Figure 1 The fluid paths and other components of the flow channel substrate shown cannot be easily modified or altered after production. Instead, the independent components of the flow channel substrate as described herein limit the amount of material removed from the finished product and allow for more modular design and production of finished flow channel substrates.

[0022] Although Figure 1 The flow channel substrate seen in the image allows for changes in the direction of the fluid, but Figure 1The flow channel substrates described above require specialized fabrication to be incorporated into integrated subassemblies. The flow channel substrates seen above may require larger blocks for initial machining, generating additional waste and manufacturing processes. In some embodiments described herein, modular flow channel substrates can be used instead of existing methods and materials to achieve material savings of 10% to 20%. In contrast, the modular flow channel substrates described below minimize the number of fluid conduit ports and seals required to construct standardized fluid delivery bars. The flow channel substrate for each fluid delivery bar can be fastened to a standardized support, and each fluid delivery bar arrangement can be assembled and tested as an integrated subassembly. The use of modular flow channel substrates described herein allows for changes in fluid direction without requiring additional material width to create deflection ports. Furthermore, modular flow channel substrates can allow fluid or gas to be redirected from linear flow paths without increasing the width of standard fluid delivery system material, while providing multiple flow direction paths for transfer from linear flow paths. In some embodiments described herein, the linear flow path may include multiple I-block assemblies, and I-bridges may be used to divert fluid or gas away from the linear flow path. Therefore, standardized components can be used in linear flow paths, while redirecting components can be added when the path needs to be redirected, but omitted from the linear flow path components when not needed. This allows for the use of standardized materials, which can reduce manufacturing costs, material waste, the number of different components within integrated subassemblies, and simplify component assembly. As seen and described throughout the application, redirected fluid paths from linear flow paths can include any three-dimensional direction without requiring dedicated linear flow path components for that segment of the subassembly. Furthermore, Figure 1 The prior art flow channel substrates shown require soldering to manifolds, such as ICS manifolds, KLS manifolds, or other types. In contrast, as seen herein, the i-bridge component of the modular flow channel substrate includes at least one mounting hole for securing the i-bridge to the manifold during assembly. This reduces design complexity within the system before, during, or after installation and facilitates removal, replacement, or reconfiguration. Furthermore, the assembly can be more easily completed at the customer facility when the component described herein is coupled by fasteners, pins, screws, or other types of engagement devices.

[0023] Figure 2An embodiment of a modular flow channel substrate 201 is shown, which includes an i-block 203 and an i-bridge 205 coupled to a KIs manifold 217. Both the i-block 203 and the i-bridge 205 may comprise solid blocks of material (such as stainless steel) and may include component attachment surfaces to which another component, such as a fluid handling component (i.e., a valve, pressure transducer, filter, regulator, etc.), may be attached. The i-block 203 may include an i-block component attachment surface 207, a first i-block conduit port 209, a second i-block conduit port 211, a leak port 213, a plurality of mounting holes 215, a connection recess 219, and a fluid path. In the illustrated embodiment, the first i-block conduit port 209 and the second i-block conduit port 211 are engaged via the fluid path. The i-bridge 205 may include an i-bridge component attachment surface 221, an i-bridge conduit port 223, a fluid path extending from the i-bridge conduit port, at least one connection hole 225, at least one mounting hole 227, a connection protrusion 229, a leakage port 231, a weld cap, and a manifold connection conduit port. In the illustrated embodiment, the i-bridge connection protrusion 229 may include a protrusion extending from the i-bridge and engaging within a connection recess 219 of the i-block 203, allowing two components of the modular flow channel substrate to be joined. In the illustrated embodiment, the i-bridge 205 may include two connection holes 225. The connection holes 225 in the illustrated embodiment may be aligned with the i-bridge conduit port 223. In other embodiments, the i-bridge may include two or more connection holes asymmetrically positioned relative to the i-bridge conduit port. In other embodiments, the i-bridge may include a single connection hole. A single connection hole may be positioned adjacent to the leakage port of the I-bridge conduit port, or opposite the leakage port of the I-bridge conduit port, or alternatively positioned to allow the I-block and I-bridge to be coupled or otherwise connected to form a modular flow channel substrate. The I-block 203 and I-bridge 205 can be engaged or coupled by placing a pin or screw through at least one connection hole 225 to secure the I-bridge 205 to the I-block 203. In the illustrated embodiment, the corners of the I-block recess 219 and the I-bridge protrusion 229 are rounded. In other embodiments, the corners may include right angles, flat edges, or other configurations to allow easy placement of the I-bridge within the I-block during assembly to form a modular flow channel substrate. Throughout the application, the I-block conduit port and the I-bridge conduit port may generally be referred to as component conduit ports or conduit ports.

[0024] In one embodiment, the component conduit ports of the I-blocks and I-bridges formed in the attachment surface can be configured to fluidly communicate with a fluid handling component having an asymmetrical port arrangement. In one embodiment, component mounting holes can be formed in the attachment surface to receive threaded fasteners, which can mount fluid handling components that are sealingly engaged with the various component conduit ports of the modular flow channel substrate. In various embodiments, the modular flow channel substrate can be formed from a suitable solid material block, such as stainless steel, 36L stainless steel, Hastelloy, or, where the application permits, aluminum or brass. Where ion contamination may be a problem, polymeric materials can be used, and the flow channel substrate can be formed from a material block other than a solid material block (e.g., by molding). Additionally, other materials can be used to form the modular flow channel substrate blocks, depending on pressure, flow rate, fluid material, material cost, manufacturability, or other variables, as is known to those skilled in the art.

[0025] One or more component conduit ports may be formed in the component attachment surface of the modular flow channel substrate. In one embodiment, one conduit port may fluidly connect to a port (inlet or outlet) of a first fluid handling component, while a second conduit port may fluidly connect to a port (outlet or inlet) of a second fluid handling component, different from the first fluid handling component. In another embodiment, each of the conduit ports may connect to the same fluid handling component. As seen in the illustrated embodiment, the modular flow substate may include a pair of mounting holes. In one embodiment, at least one of the mounting holes may be internally threaded and may receive the threaded end of a fastener. Each fluid handling component may be attached to one or more of the modular flow channel substrate or other flow channel substrates via four fasteners. In various embodiments, the fluid handling component may be attached to a single modular flow channel substrate or to two or more modular flow channel substrates. Each of the fluid handling components may be mounted to at least one modular flow channel substrate, sealingly engaging with one or more of the conduit ports. The fluid delivery system described herein may also include a seal at each conduit port of an I-block, I-bridge, fluid handling component, manifold, or other component. The seal ensures that the connection is fluid-tight and reduces or eliminates leakage of any gas or liquid moving through the fluid delivery system.

[0026] like Figure 2 As shown, the leakage port is associated with a pair of conduit ports in the type I component. The type I bridge portion of the modular flow channel substrate also includes a leakage port associated with the conduit port. In some embodiments, a through-hole may extend between the leakage port associated with the conduit port and the attachment surface of the modular flow channel substrate, allowing for detection of fault seals between the manifold and the flow channel substrate from above.

[0027] In some embodiments, a plurality of locating pin holes may be formed within one or more components of the modular flow channel substrate and may extend from the attachment surface through the modular flow channel substrate. Each of these locating pin holes is configured to receive a locating pin and is available for backward compatibility with existing systems, and may be omitted where backward compatibility is not an issue. Existing systems may include KLS systems or other types of existing systems.

[0028] Multiple countersunk manifold mounting holes may be formed in the component attachment surface of the modular flow channel substrate and extend through the lower surface of the modular flow channel substrate. Each of these holes may accommodate a threaded fastener that extends through the modular flow channel substrate and can be accommodated in the threaded mounting hole of a manifold. The conduit port of the manifold may be pulled into a sealing engagement with the manifold connection conduit port of the I-bridge of the modular flow channel substrate. In one embodiment, instead of using countersunk holes, fasteners with heads having a diameter appropriately larger than the hole diameter may be used for the manifold mounting holes.

[0029] In one embodiment, the component conduit port and manifold connection conduit port can be machined cost-effectively, wherein each conduit port and manifold connection conduit port has a corresponding axis of symmetry perpendicular to the plane of the surface of the pierced flow channel substrate. In this embodiment, the fluid path can be machined either by piercing the plane of the surface of the flow channel substrate or by machining along the length of the axis, as shown in the I-block connection attachment surface. In another embodiment, the component conduit port, manifold connection conduit port, and fluid path can be machined cost-effectively, wherein each conduit port has a corresponding axis of symmetry perpendicular to the plane of the surface of the pierced flow channel substrate. As seen throughout the application, the respective component conduit ports can be formed by machining from the component attachment surface, connection attachment surface, or side surface into the body of the modular flow channel substrate. The I-bridge manifold connection conduit port can be formed by machining from the connection attachment surface of the I-bridge into the body of the I-bridge. The fluid path of the I-block can be formed by machining from the I-block component attachment surface, the I-block connection attachment surface, and the side surface of the I-block into the body of the I-block. After machining, the fluid paths are sealed with path caps, which are welded in place to form a fluid seal. In the illustrated embodiment, each of the fluid paths can be sealed with a corresponding path cap, which is welded in place after machining to form a fluid seal. In an alternative embodiment where the fluid paths are machined from one side of the modular flow channel substrate, the fluid paths can be sealed with end caps, which are welded in place to form a fluid seal. In one embodiment, the path caps and / or end caps can be formed from stainless steel sheets by laser cutting, waterjet cutting, or other suitable techniques. In other embodiments, other materials such as brass or aluminum can be used, and where ionic contamination is a concern and the flow channel substrate is formed of a polymer material, the caps can be formed, for example, by molding a polymer material and then bonded in place with epoxy resin. As seen throughout the application, in some embodiments, the fluid paths of the I-bridge can run in a plane orthogonal to the axis of the fluid paths of the I-block. In other embodiments, the fluid paths of the I-bridge can be angled relative to the axis of the fluid paths of the I-block. Additionally, other embodiments may include I-bridge fluid paths that can be three-dimensionally moved, folded back, arranged in a ring, or otherwise shaped within the I-bridge using the manufacturing processes described herein. In some embodiments, these additional sections of the fluid paths may be sealed with additional welded caps or by other processes known to those skilled in the art. In the illustrated embodiment, the axis of the fluid path of the I-block may be parallel to the longitudinal axis of the I-block. In some embodiments, the axis of the fluid path of the I-block may be aligned with the longitudinal axis of the I-block. In other embodiments, the axis of the fluid path of the I-block may be angled relative to the longitudinal axis of the I-block.

[0030] Additionally, the mounting holes for the i-blocks and i-bridges described herein can be formed in the connection attachment surfaces of the corresponding modular flow channel substrates, and can be internally threaded to accommodate fasteners for mounting the flow channel substrates to the fluid delivery bar components.

[0031] In the embodiments disclosed herein, at least a portion of the i-bridge component of the modular flow channel substrate may extend beyond other portions of the modular flow channel substrate, such that fasteners securing the fluid handling components to the flow channel substrate and fasteners securing the manifold to the flow channel substrate can be accessed from a single direction without any interference from other structures.

[0032] Figure 3A It shows the coupling to Figure 2 The image shows a side view of the modular flow channel substrate 201 of the Kls manifold 217 described herein. The modular flow channel substrate 201 includes an i-block 203 and an i-bridge 205. The i-bridge 205 also includes a weld cap 233 in its outward-facing side 235. The Kls manifold 217 also includes a conduit port 237 fluidly coupled to the i-bridge 205, as shown in... Figure 3B What we see further in the middle. Figure 3B It shows along Figure 3A The view captured by the BB line. Figure 3B The fluid path formed when the modular flow channel substrate 201 is coupled to the Kls manifold 217 is also illustrated. A fluid path is formed between the i-bridge conduit port 223, the i-bridge fluid path 239, the manifold connection conduit port 241, the manifold conduit port 243, and the Kls fluid path 245. A weld cap 233 can be attached to the side surface of the i-bridge 205 to seal the machined openings used to form the fluid path. The fluid path can be generated by the process described herein.

[0033] While the illustrated embodiment shows an I-bridge fluid path with 90-degree turns between sections within the I-bridge, other configurations may be possible within the component. In various embodiments, the fluid path may include a single path without bends, additional bends within the fluid path, or alternative configurations. Additionally, while the illustrated embodiment discloses an I-bridge fluid path 239 following a single plane perpendicular to the outer surface of the I-block, alternative embodiments may include an I-bridge fluid path angled relative to the outer surface of the I-block. Furthermore, other embodiments may include I-bridge fluid paths that can be three-dimensionally moved, folded back, arranged in a ring, or otherwise shaped within the I-bridge using the manufacturing processes described herein. In some embodiments, these additional sections of the fluid path may be sealed with additional weld caps or by other processes known to those skilled in the art. In other embodiments, the manifold connection conduit ports of the I-bridge may be located... Figure 3BThe location of the weld cap is shown in the diagram. In these embodiments, the fluid path of the I-bridge will deflect below the component attachment surface of the I-bridge, but will then continue laterally relative to the I-block, and along... Figure 3B The downward direction is indicated before exiting the I-bridge. These embodiments will allow lateral movement of fluid or gas within the I-bridge without requiring a manifold as described herein.

[0034] Figure 4 Describes coupling to Figure 2 An isometric side view of the modular flow channel substrate 201 of the KIs manifold 217 described herein. The modular flow channel substrate 201 includes an i-block 203 and an i-bridge 205 as described herein. The KIs manifold 217 is coupled to the lower surface of the i-bridge 205 via fasteners within mounting holes 227 of the i-bridge 205.

[0035] Figure 5A modular flow channel substrate 301 is depicted, comprising an I-block 303 and an I-bridge 305 coupled to an ICS manifold 317. Both the I-block 303 and the I-bridge 305 may comprise solid blocks of material (such as stainless steel) and may include component attachment surfaces to which another component of a fluid handling component (i.e., a valve, pressure transducer, filter, regulator, etc.) may be attached. The I-block 303 may include an I-block component attachment surface 307, a first I-block conduit port 309, a second I-block conduit port 311, a leakage port 313, a plurality of mounting holes 315, a connection recess 319, and a fluid path. In the illustrated embodiment, the first I-block conduit port 309 and the second I-block conduit port 311 are engaged via the fluid path. The i-bridge 303 may include an i-bridge component attachment surface 321, an i-bridge conduit port 323, a fluid path extending from the i-bridge conduit port, at least one connection hole 325, at least one mounting hole 327, a connection protrusion 329, a leakage port 331, a weld cap, and a manifold connection conduit port. In the illustrated embodiment, the i-bridge connection protrusion 329 may include a protrusion extending from the i-bridge and engaging within a connection recess 319 of the i-block 303, allowing two components of the modular flow channel substrate to be joined. In the illustrated embodiment, the i-bridge 305 may include two connection holes 325. The connection holes 325 in the illustrated embodiment may be aligned with the i-bridge conduit port 323. In other embodiments, the i-bridge may include two or more connection holes asymmetrically positioned relative to the i-bridge conduit port. In other embodiments, the i-bridge may include a single connection hole. A single connection hole may be positioned adjacent to the leakage port of the I-bridge conduit port, or opposite the leakage port of the I-bridge conduit port, or alternatively positioned to allow the I-block and I-bridge to be coupled or otherwise connected to form a modular flow channel substrate. The I-block 303 and I-bridge 305 can be engaged or coupled by placing a pin or screw through at least one connection hole 325 to secure the I-bridge 305 to the I-block 303. The ICS manifold 317 may include a manifold conduit port and at least one manifold mounting hole. The manifold conduit port can be fluidly connected to the I-bridge conduit port and directs fluid to or from the I-bridge component of the modular flow channel substrate. Additionally, at least one manifold mounting hole can be used to secure the ICS manifold to another component of the system or to mount additional components to the ICS manifold.

[0036] Figure 6A and Figure 6BTwo side views of a modular flow channel substrate 301 are depicted, which includes an I-block 303 and an I-bridge 305 coupled to an ICS manifold 317, as shown in Figure 5. A weld cap 333 can be attached to the side surface of the I-bridge 305 to seal the machined opening for forming a fluid path. The fluid path can be generated by the process described herein. The ICS manifold 317 also includes a first conduit port 343 and a second conduit port 347 fluidly coupled to the I-bridge 305, as shown in Figure 5. Figure 6C What we see further in the middle. Figure 6C It shows along Figure 6B The view captured by the BB line. Figure 6C The fluid path formed when the modular flow channel substrate 301 is coupled to the ICS manifold 317 is also illustrated. A fluid path is formed between the i-bridge conduit port 323, the i-bridge fluid path 339, the manifold connection conduit port 341, the manifold third conduit port 349, the manifold first conduit port 343, the manifold second conduit port 347, and the ICS fluid path 345. A weld cap 333 can be attached to the side surface of the i-bridge 305 to seal the machined openings used to form the fluid path. The fluid path can be generated using the process described herein.

[0037] Figure 7 Describes coupling to Figure 5 An isometric side view of the modular flow channel substrate 301 of the ICS manifold 317 described herein. The modular flow channel substrate 301 includes an i-block 303 and an i-bridge 305 as described herein. The ICS manifold 317 is coupled to the lower surface of the i-bridge 305 via fasteners within mounting holes 327 of the i-bridge 305.

[0038] Figure 8AAn enlarged isometric side view of an embodiment of a modular flow channel substrate 401 coupled to an ICS manifold 417 is shown. As seen in the figure, both the i-block 403 and the i-bridge 405 may comprise solid material blocks and may include component attachment surfaces to which another component may be attached as described herein. The i-block 405 may include an i-block component attachment surface 407, a first i-block conduit port 409, a second i-block conduit port 411, a leak port 413, a plurality of mounting holes 415, a connection recess 419, at least one i-block connection hole 451, and a fluid path. The i-bridge 405 may include an i-bridge component attachment surface 421, an i-bridge conduit port 423, a fluid path extending from the i-bridge conduit port, at least one connection hole 425, at least one alignment screw 453, at least one mounting hole 427, a connection protrusion 429, a leak port 431, a weld cap 433, a first fastener 455, a second fastener 457, and a manifold connection conduit port. In the illustrated embodiment, the connecting protrusion 429 of the I-bridge may include a protrusion 419 extending from the I-bridge and fitting within the connecting recess 419 of the I-block, allowing two components of the modular flow channel substrate to be joined. In the illustrated embodiment, the I-bridge 405 may include two connecting holes 451. At least one alignment screw 453 may be inserted through the connecting holes, extending through the I-bridge 405, and having a distal end disposed within the connecting hole of the I-block. The size and shape of the at least one alignment screw 453 may be designed to fit within at least one connecting port 451 of the I-block to facilitate coupling of the I-bridge to the I-block during assembly. In some embodiments, after at least one alignment screw 453 has been positioned within at least one connecting hole 451 of the I-block, additional processing, such as welding or other fastening mechanisms, may further secure the I-block and the I-bridge. In the illustrated embodiment, the connecting hole 425 of the I-bridge 405 may be aligned with the I-bridge conduit port 423. In other embodiments, the I-bridge may include two or more connecting holes positioned asymmetrically with respect to the I-bridge conduit port. In other embodiments, the I-bridge may include a single connection hole. The single connection hole may be located adjacent to a leak port of the I-bridge conduit port, or it may be positioned opposite a leak port of the I-bridge conduit port, or alternatively positioned to allow the I-block and I-bridge to be coupled or otherwise connected to form a modular flow channel substrate. The ICS manifold 417 may include a first manifold conduit port 449, a second manifold conduit port 443, a third manifold conduit port 447, a fourth manifold conduit port 459, at least one manifold mounting hole 461, an upper surface 463, and a manifold fluid path connecting the first manifold conduit port 449, the second manifold conduit port 443, the third manifold conduit port 447, the fourth manifold conduit port 459, and any additional fluid outlets of the ICS manifold.The first manifold conduit port 449 can be fluidly connected to and adjacent to the i-bridge conduit port, and guides fluid to or from the i-bridge component of the modular flow channel substrate. Additionally, at least one manifold mounting hole can be used to secure the ICS manifold to another component of the system or to mount additional components to the ICS manifold. In the illustrated embodiment, a first fastener 455 can be installed in the first of at least one i-bridge mounting hole 427, and a second fastener 457 can be installed in the second of at least one i-bridge mounting hole. Figure 8A As shown, the first fastener 455 and the second fastener 457 can be used to secure the i-bridge 405 to the ICS manifold 417 by securing the distal end of each fastener within one of the mounting holes of the ICS manifold 417.

[0039] Figure 8B It shows the coupling to Figure 8A A partially unfolded bottom isometric view of an embodiment of the modular flow channel substrate 401 of the ICS manifold 417 shown. Figure 8B As shown, the i-block 403 also includes an i-block connection attachment surface 465, a path cap 467, and at least one attachment surface hole 469. The path cap 467 can be used to fluidly seal voids created during the manufacture of the fluid passage by sealing a portion of the i-block connection attachment surface 465. When the modular flow channel substrate is coupled to the ICS manifold 417, the i-block connection attachment surface 465 can be positioned adjacent to the ICS manifold 417. The at least one attachment surface hole 469 can include holes as described herein to receive fasteners to secure another component to the i-block 403. The i-bridge 405 also includes a manifold connection conduit port 441, an i-bridge connection attachment surface 471, and at least one i-bridge hole outlet 473. A first fastener 455 and a second fastener 457 can each pass through a corresponding one of the at least one i-bridge hole outlet 473 to secure the i-bridge 405 to the ICS manifold 417. As described herein, manifold connection conduit port 441 can be hermetically coupled to the conduit port of ICS manifold 417 to fluidly couple the i-bridge 405 to ICS manifold 417.

[0040] Additional information relating to the fluid transport substrate can be found in U.S. Patent No. 8,49,029, which is incorporated herein by reference as if fully set forth herein.

[0041] As shown and described herein and in the incorporated patents / applications, the manifold or substrate body may be formed from a solid block of material and have associated weld caps, each of which may be formed from a suitable material (such as stainless steel) depending on the intended use of the flow channel substrate. Primarily for cost reasons, but also to ensure the use of non-metallic materials (such as in cases where ion contamination is a concern), the manifold or flow channel substrate body and / or weld caps may also be formed from polymeric materials (such as plastics) (e.g., molded or machined). The use of other materials such as plastics allows the flow channel substrate to be particularly suitable for chemical delivery applications or biological applications where ion contamination is a concern, and / or where cost is a concern.

[0042] The weld cap can be coupled to the manifold or substrate body using an adhesive (i.e., glue) or a similar mechanism (e.g., industrial metal or non-metal adhesives to create an bonded joint). The adhesive can be applied to the manifold or substrate body, the weld cap, or both using any application method (e.g., spraying, tape wrapping, dispensing, brushing, etc.). This configuration can be used for coupling metals, plastics, composites, and other non-metallic applications where welding is not desirable. The adhesive can be selected based on the type of material resistant to the flow through the system to allow for leak-free coupling (i.e., joints, connections, etc.). The benefits of using an adhesive to couple the weld cap to the manifold or substrate body include the ability to create a leak-free coupling resistant to the materials flowing through the system without incurring the time and costs associated with welding the weld cap to the manifold or substrate body.

[0043] It should be understood that the details of the foregoing embodiments given for illustrative purposes should not be construed as limiting the scope of this application. Although several embodiments of this application have been described in detail above, those skilled in the art will readily understand that many modifications are possible in the exemplary embodiments without substantially departing from the novel teachings and advantages of this application. Therefore, all such modifications are intended to be included within the scope of this application, which is further defined by the transformed utility model and the appended claims. Furthermore, it should be recognized that numerous embodiments that do not achieve all the advantages of certain embodiments (especially preferred embodiments) can be conceived; however, the absence of a particular advantage in an embodiment should not be construed as necessarily falling outside the scope of protection of this disclosure.

Claims

1. A conveying system, comprising: Modular flow channel substrate, comprising i-type blocks and i-type bridges; The i-type block includes a first i-type block conduit port, a second i-type block conduit port, a plurality of mounting holes, a connecting recess, at least one i-type block connecting hole, and a fluid path extending between the first i-type block conduit port and the second i-type block conduit port. The i-bridge includes an i-bridge conduit port, a manifold connection conduit port, at least one connection hole, at least one mounting hole, a connection protrusion, and a fluid path extending between the i-bridge conduit port and the manifold connection conduit port. The connection protrusion is sized and constructed to fit within the connection recess of the i-block. The at least one connection hole is configured to mate with the at least one i-type connection hole to allow fasteners to secure the i-bridge to the i-block to form the modular flow channel substrate. The plurality of mounting holes of the modular flow channel substrate are configured to couple the modular flow channel substrate to at least one manifold and at least one fluid handling component.

2. The conveying system as claimed in claim 1, wherein, The i-type bridge includes a component attachment surface.

3. The conveying system as described in claim 2, wherein, Valves, pressure transducers, filters, or regulators are attached to the attachment surface of the component.

4. The conveying system as claimed in claim 1, wherein, The at least one manifold is configured to be connected to the type I bridge via the manifold connection conduit port.

5. The conveying system as claimed in claim 1, wherein, The connecting protrusion and the connecting recess include corresponding rounded edges.

6. The conveying system as claimed in claim 1, wherein, The connecting protrusion and the connecting recess include corresponding right-angled edges.

7. The conveying system as claimed in claim 1, wherein, The i-type bridge conduit port is defined within the connection protrusion.

8. The conveying system as claimed in claim 1, wherein, The i-type bridge includes two connection holes, wherein the connection holes are aligned with the conduit ports of the i-type bridge.

9. The conveying system as claimed in claim 8, wherein, The i-bridge includes two connection holes, wherein the connection holes are asymmetrically arranged relative to the conduit port of the i-bridge.

10. The conveying system as claimed in claim 1, wherein, The modular flow channel substrate is formed from a solid material block including stainless steel, Hastelloy, aluminum, brass, or polymer.

11. The conveying system as claimed in claim 1, wherein, The first i-type block conduit port and the second i-type block conduit port are defined in the component attachment surface of the i-type block.

12. The conveying system as claimed in claim 1, wherein, The i-type bridge conduit port includes a leakage port.

13. The conveying system as claimed in claim 1, wherein, The K1S manifold is connected to the lower surface of the i-type bridge.

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