A 3D chip design simulation modeling method and system based on twin technology

Abstract

The application relates to the technical field of digital twinning, and discloses a 3D chip design simulation modeling method and system based on twinning technology, which comprises the following steps: acquiring physical field simulation data, performing feature fusion of thermal stress and thermal-electric coupling by solving a thermal expansion vector field to obtain a preliminary mapping relationship; performing nonlinear cumulative effect calculation of dynamic power density according to the preliminary mapping relationship to obtain a final cumulative effect value; adjusting interconnection materials according to the final cumulative effect value to correct an index set; performing deviation quantitative calculation through thermal flow evolution path analysis according to the index set to obtain a thermal resistance degradation deviation matrix; performing Pareto frontier inflection point extraction according to the thermal resistance degradation deviation matrix to obtain a balanced configuration; screening a non-dominated solution cluster that meets a preset critical power threshold according to the balanced configuration to obtain a candidate solution cluster; screening an optimal configuration according to the candidate solution cluster to output a final optimization scheme. The method can reduce the risk of chip degradation rate mutation.

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