Dual-purpose solid state disk assembly
By designing a dual-purpose solid-state drive (SSD) component, seamless switching between SATA and USB interfaces and efficient heat dissipation are achieved, solving the problem of single-function SSDs, reducing user purchase costs, and improving data security and drive lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FUJIAN MINXIANG SEMICONDUCTOR CO LTD
- Filing Date
- 2025-12-29
- Publication Date
- 2026-05-26
AI Technical Summary
Existing solid-state drives (SSDs) have limited functionality. Internal SSDs are only equipped with SATA interface sockets, making them unsuitable for portable use, while external SSDs are only equipped with USB interfaces, making them difficult to adapt to the SATA interfaces inside computer cases. Users need to purchase two different devices to meet different needs, increasing the cost of use.
Design a dual-purpose solid-state drive (SSD) assembly, comprising a dual-purpose drive assembly and a drive thermally conductive fixing assembly. The electrical connection between the first and second adapter circuit boards enables signal conversion between the SATA interface and the USB plug. It integrates an automatic switching circuit and a hardware encryption chip, and combines a temperature sensor and a micro fan for heat dissipation management to ensure that the thermally conductive material is in close contact with the drive.
It enables seamless switching between solid-state drives (SSDs) in chassis-integrated and mobile portable scenarios, reducing user purchase costs, improving data security and heat dissipation efficiency, extending hard drive lifespan, and enhancing user experience and reliability.
Smart Images

Figure CN122090888A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of solid-state drive technology, and in particular to a dual-purpose solid-state drive component. Background Technology
[0002] Solid-state drives (SSDs) are high-efficiency storage devices widely used in computer systems and mobile storage applications.
[0003] Existing solid-state drives (SSDs) suffer from limited functionality. Internal SSDs typically only come with a SATA interface socket and need to be installed inside the computer case, making them unsuitable for portable use as external hard drives. External SSDs, on the other hand, only come with a USB interface and are difficult to install in the SATA interface socket inside the computer case. If users need to satisfy both usage scenarios, they need to purchase two separate devices, increasing the cost of use. Summary of the Invention
[0004] The main objective of this invention is to provide a dual-purpose solid-state drive (SSD) component, aiming to solve the problem of single-function SSDs in the prior art. Built-in SSDs are usually only equipped with SATA interface sockets and need to be installed inside the computer case, and cannot be used directly as portable external hard drives; while external SSDs are only equipped with USB interfaces, which are difficult to adapt to the installation requirements of SATA interface sockets inside the computer case. If users need to meet both usage scenarios at the same time, they need to purchase two devices separately, which increases the cost of use.
[0005] To achieve the above-mentioned objectives, the first aspect of the present invention provides a dual-purpose solid-state drive assembly, comprising a first outer shell, a top cover, a second outer shell, and a solid-state drive body, wherein a dual-purpose hard drive assembly and a hard drive heat-conducting fixing assembly are disposed between the first outer shell and the second outer shell. The dual-purpose hard drive assembly includes a first adapter circuit board, a second adapter circuit board, a cable slot, a stop block, a SATA interface socket, a USB plug, and a connecting cable. The first adapter circuit board is fixedly disposed within the space formed by the first housing; the second adapter circuit board is fixedly disposed within the space formed by the second housing; the cable slot is formed on the first adapter circuit board; the SATA interface socket is fixedly installed at one end of the second housing; the USB plug is fixedly installed at the other end of the second housing; and the first adapter circuit board and the second adapter circuit board are electrically connected through a connecting cable. The hard drive thermal fixing assembly also includes a temperature sensor and a micro fan. The temperature sensor is located near the phase change heat sink and is used to monitor the temperature of the solid-state drive body. The micro fan is located on the second casing and automatically starts and stops according to the temperature sensor reading.
[0006] The second adapter circuit board integrates an automatic switching circuit and a hardware encryption chip. The automatic switching circuit is configured to detect the connection status of the SATA interface socket or USB plug and automatically switch the data path to the corresponding interface. The hardware encryption chip is used to encrypt and decrypt the data in the solid-state drive in real time. The hard drive thermal conductive fixing component is evenly attached to the solid-state drive body to ensure close contact between the thermal conductive material and the solid-state drive body.
[0007] Furthermore, the first adapter circuit board is electrically connected to the gold fingers of the solid-state drive body using a quick-connect interface.
[0008] Furthermore, both the SATA interface socket and the USB plug are electrically connected to the second adapter circuit board via wires.
[0009] Furthermore, the cable slot and the stop are spaced apart on one side of the top of the first adapter circuit board.
[0010] Furthermore, the middle part of the connecting wire is sleeved inside the wire slot, and the connecting wire is located on one side of the stop block.
[0011] Furthermore, the top cover is fixedly installed on the top of the first outer shell by bolts, and the second outer shell is rotatably connected to one end of the first outer shell by a rotating shaft structure. The connection between the first outer shell and the top cover after installation is connected to the second outer shell by a damping shaft.
[0012] Furthermore, the hard drive heat-conducting fixing assembly includes an opening, a hollow heat-conducting plate, a clip, a phase change heat-conducting sheet, a chamfer, a hand-clip groove, and coolant. The opening is located in the middle of the upper cover, the hollow heat-conducting plate is located inside the opening, the clip is fixedly connected to one end of the hollow heat-conducting plate, the phase change heat-conducting sheet is located at the bottom of the hollow heat-conducting plate and the top of the solid-state drive body, the chamfer is located at the edge of one end of the opening, the hand-clip groove is located at one end of the hollow heat-conducting plate, and the coolant is filled inside the hollow heat-conducting plate.
[0013] Furthermore, the hollow heat-conducting plate is shaped to match the opening shape. One end of the hollow heat-conducting plate is inserted into the bottom of the opening via a clip, and the other end of the hollow heat-conducting plate is fitted with a bolt. The bolt passes through the fixing hole of the solid-state drive body and connects to the threaded hole on the top of the first adapter circuit board.
[0014] Furthermore, the top surface of the phase change heat conduction sheet abuts against the bottom surface of the hollow heat conduction plate, and the bottom surface of the phase change heat conduction sheet abuts against the top surface of the solid-state drive body.
[0015] Furthermore, the hand buckle groove is located on the chamfered side.
[0016] Beneficial effects: 1. This invention provides a dual-purpose solid-state drive (SSD) component, enabling flexible adaptation to multiple scenarios. A first and second adapter circuit board work together to stably connect the SSD body via a quick-connect interface, achieving signal conversion between SATA interface sockets and USB plugs without the need for additional wiring harnesses, thus solving the problem of traditional SSDs having only one function. The SATA interface socket adapts to in-chassis installation requirements, while the USB plug meets portable use needs. Users do not need to purchase two devices, reducing operating costs. Furthermore, the foldable interface does not affect the original appearance, ensuring aesthetics. An automatic switching circuit enables intelligent interface identification and switching, and a flexible pressure mechanism ensures long-term stability of heat dissipation performance. The combination of these two features significantly improves the user experience and reliability of the dual-purpose SSD component. The temperature sensor and miniature fan in the hard drive thermal fixing assembly can automatically adjust heat dissipation according to the solid-state drive temperature, effectively preventing the solid-state drive from overheating; the hardware encryption chip encrypts and decrypts data in real time, greatly improving data security; the hard drive thermal fixing assembly is evenly attached to the solid-state drive body to ensure heat conduction effect, improve heat dissipation efficiency, and extend the service life of the solid-state drive.
[0017] 2. The present invention provides a dual-purpose solid-state drive assembly that achieves both efficient heat dissipation and stable installation through a heat-conducting and fixing component for the hard drive. The hollow heat-conducting plate is precisely matched with the opening, and the coolant filled inside, together with the bottom phase change heat-conducting sheet, forms multiple heat dissipation paths, which can quickly dissipate the heat generated by the solid-state drive body during operation and avoid performance degradation or shortened lifespan due to overheating. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of a dual-purpose solid-state drive assembly according to an embodiment of the present invention; Figure 2 This is a partial top cross-sectional view of a dual-purpose solid-state drive assembly according to an embodiment of the present invention; Figure 3 This is an exploded view of the structure of a dual-purpose solid-state drive assembly according to an embodiment of the present invention; Figure 4 This is a partial structural diagram of a heat-conducting fixing component for a dual-purpose solid-state drive assembly according to an embodiment of the present invention. Figure 5 This is a schematic cross-sectional view of the second outer casing of a dual-purpose solid-state drive assembly according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the second housing structure of a dual-purpose solid-state drive assembly according to an embodiment of the present invention.
[0019] in: 1. First outer casing; 2. Top cover; 3. Second outer casing; 4. Solid-state drive body; 601. First adapter circuit board; 602. Second adapter circuit board; 603. Cable slot; 604. Stop block; 605. SATA interface socket; 606. USB plug; 607. Connecting cable; 608. Temperature sensor; 609. Miniature fan; 701. Opening; 702. Hollow heat-conducting plate; 703. Clip; 704. Phase change heat-conducting sheet; 705. Chamfer; 706. Hand clip slot; 707. Coolant.
[0020] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0021] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.
[0023] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0025] Reference Figures 1-6 The present invention provides a dual-purpose solid-state drive assembly in an embodiment, including a first outer shell 1, a top cover 2, a second outer shell 3 and a solid-state drive body 4, wherein a dual-purpose hard drive assembly and a hard drive heat conduction fixing assembly are disposed between the first outer shell 1 and the second outer shell 3. The dual-purpose hard drive assembly includes a first adapter circuit board 601, a second adapter circuit board 602, a cable tray 603, a stop block 604, a SATA interface socket 605, a USB plug 606, and a connecting cable 607. The first adapter circuit board 601 is fixedly disposed within the space formed by the first housing 1; the second adapter circuit board 602 is fixedly disposed within the space formed by the second housing 3; the cable tray 603 is formed on the first adapter circuit board 601; and the SATA interface socket 605 is fixedly installed at one end of the second housing 3. The USB plug 606 is fixedly installed at the other end of the second housing 3. The first adapter circuit board 601 and the second adapter circuit board 602 are electrically connected by a connecting line 607. The middle part of the connecting line 607 is sleeved inside the wire slot 603. The connecting line 607 is located on one side of the stop block 604. The top cover 2 is fixedly installed on the top of the first housing 1 by bolts. The second housing 3 is rotatably connected to one end of the first housing 1 by a rotating shaft structure. The connection between the first housing 1 and the top cover 2 after installation is connected to the second housing 3 by a damping shaft. The hard drive heat dissipation fixing assembly also includes a temperature sensor 608 and a micro fan 609. The temperature sensor is located near the phase change heat conduction plate 704 and is used to monitor the temperature of the solid-state drive body 4. The micro fan is located on the second housing 3 and automatically starts and stops according to the temperature sensor reading.
[0026] The second adapter circuit board 602 integrates an automatic switching circuit and a hardware encryption chip. The automatic switching circuit is configured to detect the connection status of the SATA interface socket 605 or the USB plug 606 and automatically switch the data path to the corresponding interface. The hardware encryption chip is used to encrypt and decrypt the data in the solid-state drive body 4 in real time. The hard disk heat-conducting fixing component is evenly attached to the solid-state hard disk body 4 to ensure close contact between the heat-conducting material and the solid-state hard disk body 4.
[0027] It should be noted that an automatic switching circuit is integrated on the second adapter circuit board 602. This automatic switching circuit consists of a detection unit and a switching unit. The detection unit continuously monitors the pin voltage of the SATA interface socket 605 and the VBUS pin voltage of the USB plug 606. When a SATA interface is detected being inserted into the motherboard, its corresponding pin generates a high-level signal, and the detection unit controls the switching unit to connect the data path to the SATA interface socket 605. Conversely, when a USB plug 606 is detected being inserted into the host, its VBUS pin voltage is pulled high, and the detection unit controls the switching unit to automatically switch the data path to the USB plug 606. This process is completely automatic, requiring no manual intervention from the user, greatly improving the convenience and reliability of use.
[0028] The first adapter circuit board 601 and the second adapter circuit board 602 are electrically connected via a flexible connecting line 607 (such as an FPC cable). To organize the internal wiring and prevent the connecting line 607 from becoming loose or interfering with other components during movement, a wire-locking groove 603 and a stop 604 are integrally formed on one side of the top of the first adapter circuit board 601. The middle part of the connecting line 607 is embedded inside the wire-locking groove 603 and is limited by the stop 604, thereby ensuring the stability of the connection.
[0029] The hard drive thermal fixing assembly is responsible for fixing and dissipating heat from the solid-state drive body 4. Its core function is to ensure tight and stable contact between the heat dissipation components and the hard drive chip surface. The hard drive thermal fixing assembly includes an opening 701 in the middle of the upper cover 2, a hollow heat-conducting plate 702, a clip 703, a phase change heat-conducting sheet 704, a chamfer 705, a hand-clip groove 706, and coolant 707. The hollow heat-conducting plate 702 is made of a metal with high thermal conductivity (such as aluminum or copper) and encapsulates coolant 707 inside, which can efficiently diffuse point heat sources into surface heat sources, improving heat dissipation efficiency. The phase change heat-conducting sheet 704 is attached to the bottom of the hollow heat-conducting plate 702. Its characteristic is that it is solid at room temperature, but it undergoes a phase change and softens after reaching the operating temperature of 45-50℃, better filling the microscopic gaps between the heat dissipation surface and the hard drive chip, reducing contact thermal resistance.
[0030] The hard drive thermal mounting assembly also includes a temperature sensor 608 and a miniature fan 609. The temperature sensor 608 is located near the phase change heat sink 704 to monitor the temperature of the solid-state drive body 4. The miniature fan 609 is located on the second housing 3 and automatically starts and stops based on the reading of the temperature sensor 608. The second adapter circuit board 602 integrates an automatic switching circuit and a hardware encryption chip. The automatic switching circuit is configured to detect the connection status of the SATA interface socket 605 or the USB plug 606 and automatically switch the data path to the corresponding interface. The hardware encryption chip is used to encrypt and decrypt the data in the solid-state drive body 4 in real time. The hard drive thermal mounting assembly is uniformly attached to the solid-state drive body 4 to ensure close contact between the thermally conductive material and the solid-state drive body 4.
[0031] The first adapter circuit board 601 uses an FR-4 material PCB board, and its quick-connect interface with the solid-state drive body 4 is a 2.5-inch hard drive standard interface, ensuring a stable connection and convenient plugging and unplugging. The rotation angle range of the second housing 3 is 0°-180°. The damping shaft setting makes the second housing 3 have a smooth damping feel during opening and closing, preventing structural damage or interface wear caused by rapid opening or closing, improving user experience and product life. The damping shaft is made of rubber material.
[0032] In one embodiment, the first adapter circuit board 601 is electrically connected to the gold fingers of the solid-state drive body 4 via a quick-connect interface.
[0033] The first adapter circuit board 601 and the solid-state drive body 4 use a quick-connect interface instead of the traditional soldering or screw fixing method, making the installation and replacement of the solid-state drive body 4 more convenient. Disassembly and assembly can be completed without tools, improving maintenance efficiency. The quick-connect interface has good contact stability and vibration resistance, effectively preventing poor contact problems caused by vibration during transportation or movement.
[0034] Both the SATA interface socket 605 and the USB plug 606 are electrically connected to the second adapter circuit board 602 via wires.
[0035] Both the SATA interface socket 605 and the USB plug 606 are integrated on the second adapter circuit board 602 and connected by wires, facilitating unified signal protocol conversion. For example, the SATA to USB controller can be integrated into the second adapter circuit board 602, simplifying circuit layout. The separate design of the interface and the circuit board allows for flexible placement of the interface at both ends of the second housing 3, optimizing space utilization and improving ergonomics.
[0036] The cable retaining groove 603 and the stop block 604 are spaced apart and disposed on one side of the top of the first adapter circuit board 601. The cable retaining groove 603 and the stop block 604 together form a cable limiting structure, which effectively restricts the direction of the connecting wire 607 and prevents it from getting tangled, rubbing or coming off during equipment operation or flipping.
[0037] This embodiment enables seamless switching between solid-state drives (SSDs) in chassis-integrated and portable scenarios. Through the dual adapter circuit board and dual interface design, signal adaptation can be completed without additional conversion wiring harnesses. The fixing structure of the cable slot 603 and the stop block 604 ensures the long-term stability of the circuit connection. The rotating damping shell improves the ease of use and structural aesthetics, effectively solving the problem of the single function of traditional SSDs.
[0038] Optionally, the SATA interface socket 605 can be a SATAIII 6Gbps interface, and the USB plug 606 can be a USB3.2 Gen2 Type-C interface to improve the data transfer rate; the first shell 1 and the second shell 3 can be made of ABS flame-retardant material or aluminum alloy material to balance lightweight and structural strength.
[0039] In one embodiment, the hard disk heat-conducting fixing assembly includes an opening 701, a hollow heat-conducting plate 702, a clip 703, a phase change heat-conducting sheet 704, a chamfer 705, a hand-clip groove 706, and coolant 707. The opening 701 is located in the middle of the upper cover 2. The hollow heat-conducting plate 702 is located inside the opening 701. The clip 703 is fixedly connected to one end of the hollow heat-conducting plate 702. The phase change heat-conducting sheet 704 is located at the bottom of the hollow heat-conducting plate 702 and the top of the solid-state drive body 4. The chamfer 705 is located at the edge of one end of the opening 701. The hand-clip groove 706 is located at one end of the hollow heat-conducting plate 702. The coolant 707 is filled inside the hollow heat-conducting plate 702. The hollow heat-conducting plate 702 is shaped to match the opening 701. One end of the hollow heat-conducting plate 702 is inserted into the bottom of one end of the opening 701 via a clip 703. The other end of the hollow heat-conducting plate 702 is fitted with a bolt. The bolt passes through the fixing hole of the solid-state drive body 4 and is connected to the threaded hole at the top of the first adapter circuit board 601. The top surface of the phase change heat-conducting sheet 704 abuts against the bottom surface of the hollow heat-conducting plate 702, and the bottom surface of the phase change heat-conducting sheet 704 abuts against the top surface of the solid-state drive body 4. The hand-clip groove 706 is located on one side of the chamfer 705.
[0040] The hollow heat-conducting plate 702 is filled with coolant 707, forming a dual high-efficiency heat conduction system in conjunction with the phase change heat-conducting sheet 704: the phase change heat-conducting sheet 704 quickly absorbs heat from the chip, while the hollow heat-conducting plate 702 absorbs heat through the vaporization of the internal coolant 707 and diffuses the heat to the entire plate surface, significantly improving heat dissipation efficiency. The hollow heat-conducting plate 702 also serves as a structural support and heat dissipation function, and is connected to the first adapter circuit board 601 by bolts. During the tightening process, the heat-conducting interface is simultaneously pressed to ensure a stable and reliable heat conduction path. The handle groove 706 and the chamfer 705 greatly facilitate the disassembly, assembly, and maintenance of the hollow heat-conducting plate 702, improving maintainability.
[0041] The entire heat-conducting component is integrated into area 2 of the top cover, without taking up additional internal space, achieving a compact design.
[0042] The bottom surface of the phase change heat sink 704 abuts against the top surface of the solid-state drive body 4, and the hand-clip groove 706 is located on one side of the chamfer 705.
[0043] Among them, the hollow heat-conducting plate 702 is made of aluminum alloy, and the internal coolant 707 is a silicon-based heat-conducting liquid with a thermal conductivity of ≥0.6W / (m•K), with a filling volume of 80%-90% of the hollow cavity volume; the phase change heat-conducting sheet 704 has a phase change temperature of 45℃-50℃ and a thickness of 1.5mm-2mm at room temperature. After being heated, it can tightly adhere to the surface of the hard drive and the heat-conducting plate, eliminating contact gaps.
[0044] This embodiment achieves both efficient heat dissipation and stable fixation of the solid-state drive. The combined design of the phase change heat conduction sheet 704 and the hollow heat conduction plate 702 greatly improves the heat transfer efficiency. The convection effect of the coolant 707 can quickly diffuse local high temperatures. The dual fixing structure of the clip 703 and the bolt ensures the installation stability of the hard drive in moving or vibrating environments. The design of the hand clip groove 706 and the chamfer 705 simplifies the maintenance of the heat dissipation components.
[0045] Optionally, the phase change heat transfer sheet 704 can be made of graphite-based composite phase change material, and the surface of the hollow heat transfer plate 702 can be anodized to enhance corrosion resistance; the coolant 707 can be made of non-conductive insulating heat transfer fluid to improve safety in use.
[0046] Instructions: When using the dual-purpose solid-state drive assembly described in this invention, first insert the solid-state drive body 4 into the quick-connect interface on the first adapter circuit board 601 through its gold fingers to achieve a quick electrical connection. Installation can be completed without tools. Then, align the top cover 2 with the top of the first outer shell 1 and tighten it with bolts to form a complete main shell structure. At this time, the solid-state drive body 4 is stably encapsulated inside the first outer shell 1. If it needs to be used as an internal SATA solid-state drive, the user can keep the second outer shell 3 closed and install it into the hard drive bay of a desktop or laptop computer. Connect the SATA interface socket 605 to the motherboard via an external SATA data cable, and the power supply will provide power. Reading and writing data; if it needs to be used as an external portable solid-state drive, the second outer shell 3 can be manually flipped over, and it will rotate and unfold relative to the first outer shell 1 through a hinge structure. Under the action of the damping shaft, it will open smoothly to a suitable angle, exposing the USB plug 606 located at the other end of the second outer shell 3. Then, the USB plug 606 can be directly inserted into the interface of a computer, mobile phone or other device that supports the USB protocol. At this time, the second adapter circuit board 602 will automatically complete the signal protocol conversion between SATA and USB, realizing plug-and-play high-speed data transmission. The entire component has a compact structure, is easy to operate, and has efficient heat dissipation. It combines the high performance of an internal hard drive with the portability of an external device, meeting the data storage needs of various application scenarios.
[0047] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.
Claims
1. A dual-purpose solid-state drive component, characterized in that, It comprises a first shell (1), an upper cover (2), a second shell (3) and a solid state disk main body (4), and a hard disk dual-purpose assembly and a hard disk heat-conducting fixing assembly are arranged between the first shell (1) and the second shell (3). The hard disk dual-purpose assembly comprises a first adapter circuit board (601), a second adapter circuit board (602), a wire slot (603), a stop block (604), a SATA interface socket (605), a USB plug (606) and a connecting wire (607), the first adapter circuit board (601) is fixedly arranged in the space formed by the first shell (1), the second adapter circuit board (602) is fixedly arranged in the space formed by the second shell (3), the wire slot (603) is formed in the first adapter circuit board (601), the SATA interface socket (605) is fixedly installed at one end of the second shell (3), the USB plug (606) is fixedly installed at the other end of the second shell (3), and the first adapter circuit board (601) and the second adapter circuit board (602) are electrically connected through the connecting wire (607). The hard disk heat-conducting fixing assembly further comprises a temperature sensor (608) and a micro fan (609), the temperature sensor is arranged near the phase-change heat-conducting sheet (704) and is used for monitoring the temperature of the solid state disk main body (4), and the micro fan is arranged on the second shell (3) and is automatically started and stopped according to the reading of the temperature sensor. The second adapter circuit board (602) is integrated with an automatic switching circuit and a hardware encryption chip, the automatic switching circuit is configured to detect the connection state of the SATA interface socket (605) or the USB plug (606) and automatically switch the data path to the corresponding interface, and the hardware encryption chip is used for real-time encryption and decryption of data in the solid state disk main body (4). The hard disk heat-conducting fixing assembly and the solid state disk main body (4) are uniformly attached to ensure the close contact of the heat-conducting material with the solid state disk main body (4).
2. The dual-purpose SSD assembly of claim 1, wherein, The first adapter circuit board (601) and the gold finger of the solid state disk main body (4) are electrically connected through a quick plug interface.
3. The dual-purpose SSD assembly of claim 1, wherein, The SATA interface socket (605) and the USB plug (606) are electrically connected with the second adapter circuit board (602) through wires.
4. The dual-purpose SSD assembly of claim 1, wherein, The wire slot (603) and the stop block (604) are arranged at one side of the top of the first adapter circuit board (601).
5. The dual-purpose SSD assembly of claim 1, wherein, The middle part of the connecting wire (607) is sleeved on the inside of the wire slot (603), and the connecting wire (607) is located at one side of the stop block (604).
6. The dual-purpose SSD assembly of claim 1, wherein, The upper cover (2) is fixedly installed on the top of the first shell (1) through bolts, the second shell (3) is rotationally connected to one end of the first shell (1) through a rotating shaft structure, and the connecting part of the first shell (1) and the upper cover (2) after installation is connected with the second shell (3) through a damping shaft.
7. The dual-purpose SSD assembly of claim 1, wherein, The hard disk heat-conducting fixing assembly comprises an opening (701), a hollow heat-conducting plate (702), a clamping head (703), a phase-change heat-conducting sheet (704), a chamfer (705), a hand buckle groove (706) and cooling liquid (707), the opening (701) is arranged in the middle of the upper cover (2), the hollow heat-conducting plate (702) is arranged on the inner side of the opening (701), the clamping head (703) is fixedly connected to one end of the hollow heat-conducting plate (702), the phase-change heat-conducting sheet (704) is arranged on the bottom of the hollow heat-conducting plate (702) and the top of the solid-state hard disk body (4), the chamfer (705) is arranged at the edge of one end of the opening (701), the hand buckle groove (706) is arranged at one end of the hollow heat-conducting plate (702), and the cooling liquid (707) is filled in the hollow heat-conducting plate (702).
8. The dual-purpose SSD assembly of claim 7, wherein, The hollow heat-conducting plate (702) is matched with the shape of the opening (701), one end of the hollow heat-conducting plate (702) is inserted into the bottom of one end of the opening (701) through the clamping head (703), and the other end of the hollow heat-conducting plate (702) is provided with a bolt, the bolt penetrates the fixing hole of the solid-state hard disk body (4) and is connected with the threaded hole on the top of the first adapter circuit board (601).
9. The dual-purpose SSD assembly of claim 7, wherein, The top surface of the phase-change heat-conducting sheet (704) is arranged on the bottom surface of the hollow heat-conducting plate (702), and the bottom surface of the phase-change heat-conducting sheet (704) is arranged on the top surface of the solid-state hard disk body (4).
10. The dual-purpose SSD assembly of claim 7, wherein, The hand buckle groove (706) is arranged on one side of the chamfer (705).