Heat dissipation devices and electronic equipment

Abstract

This application discloses a heat dissipation device and an electronic device, belonging to the field of heat dissipation structure technology. The heat dissipation device includes: a heat dissipation shell, which has a receiving cavity and an air inlet and an air outlet communicating with the receiving cavity. The air inlet is used to allow gas to flow into the receiving cavity, and the air outlet is used to allow gas to flow out of the receiving cavity; a fan assembly, which is disposed in the receiving cavity; and a liquid drainage structure, which is disposed in at least a portion of the cavity wall of the receiving cavity and is used to drain liquid that has entered the receiving cavity.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation structure technology, specifically relating to a heat dissipation device and electronic equipment. Background Technology

[0002] With the advancement of technology, electronic devices are becoming increasingly widely used, enabling functions such as capturing images, watching videos, and remote communication. Typically, internal components of electronic devices generate heat during operation, causing their temperature to rise and affecting the device's performance. To address this, heat dissipation devices are installed inside electronic devices, contacting the heat-generating components to dissipate heat. However, in some technologies, liquid may accumulate within these heat dissipation devices, leading to unpleasant odors and negatively impacting the user experience. Summary of the Invention

[0003] This application aims to provide a heat dissipation device and an electronic device, at least to solve the problem that liquid may accumulate in the heat dissipation device, causing odor and affecting the user experience of the electronic device.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application provide a heat dissipation device, the heat dissipation device comprising: A heat dissipation housing is provided with a receiving cavity and an air inlet and an air outlet communicating with the receiving cavity. The air inlet is used to allow gas to flow into the receiving cavity, and the air outlet is used to allow gas to flow out of the receiving cavity. A fan assembly disposed within the receiving cavity; A drainage structure is provided on at least a portion of the cavity wall of the receiving cavity, the drainage structure being used to drain liquid that has entered the receiving cavity.

[0005] In a second aspect, embodiments of this application provide an electronic device, which includes a housing, a heating element, and a heat dissipation device as described in any one of the first aspects above; Both the heating element and the heat dissipation device are disposed in the housing, and the heat dissipation housing is in contact with the heating element.

[0006] In this embodiment, the heat sink housing has a receiving cavity and an air inlet and an air outlet connected to the receiving cavity. The fan assembly is located in the receiving cavity. Therefore, when the heat dissipation device is applied to an electronic device, the heat sink housing can be brought into contact with the heat-generating component in the electronic device. Then, the fan assembly is run, and gas flows into the receiving cavity through the air inlet and flows out through the air outlet. The heat generated by the heat-generating component is transferred to the heat sink housing, and the heat is carried away by the gas, continuously dissipating heat from the heat-generating component. The operation of the fan assembly allows gas outside the heat sink housing to continuously enter the receiving cavity through the air inlet and exit through the air outlet. That is, the gas in the receiving cavity is continuously flowing. Once the heat from the heat-generating component enters the receiving cavity, it is carried away by the gas and discharged to the outside of the heat sink housing, achieving heat dissipation for the heat-generating component. Furthermore, since the drain structure is located on at least a portion of the cavity wall, once liquid enters the receiving cavity, the liquid will be drained by the drain structure, preventing the accumulation of liquid in the receiving cavity and the potential for odor. In other words, in this embodiment of the application, by setting up a heat dissipation shell, a fan assembly and a drain structure, not only can the heat-generating components of the electronic device be cooled, but the drain structure can also drain the liquid that has entered the containment cavity, thereby avoiding the problem of odor that may occur due to the accumulation of liquid in the containment cavity. When the heat dissipation device is applied to electronic devices, the user experience of the electronic devices can be improved. Attached Figure Description

[0007] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is one of the schematic diagrams illustrating a heat dissipation device including a vibrating element according to an embodiment of this application; Figure 2 This represents one of the side views of a heat dissipation device provided in an embodiment of this application; Figure 3 This is a second schematic diagram illustrating a heat dissipation device provided in an embodiment of this application; Figure 4 This is a schematic diagram of the lower housing of a heat dissipation housing provided in an embodiment of this application; Figure 5 This is one of the exploded views of a heat dissipation device provided in an embodiment of this application; Figure 6 This is one of the bottom views of a heat dissipation device provided in an embodiment of this application; Figure 7 express Figure 6 Cross-sectional view at point AA; Figure 8 This is a schematic diagram illustrating a vibration element connected to the outer wall of a lower housing according to an embodiment of this application; Figure 9 This is a schematic diagram of one of the upper housings provided in an embodiment of this application; Figure 10 This is a schematic diagram of one embodiment of a lower housing provided in this application; Figure 11 This is a second schematic diagram illustrating a lower housing provided in an embodiment of this application; Figure 12 This is a second schematic diagram illustrating an upper housing provided in an embodiment of this application; Figure 13 This is the third schematic diagram illustrating a lower housing provided in an embodiment of this application; Figure 14 This diagram illustrates a heat dissipation device including a sound-generating component, as provided in an embodiment of this application. Figure 15 This is a second side view of a heat dissipation device provided in an embodiment of this application; Figure 16 This is the fourth schematic diagram illustrating a lower housing provided in an embodiment of this application; Figure 17 This is a second exploded view of a heat dissipation device provided in an embodiment of this application; Figure 18 This is the fifth schematic diagram illustrating a lower housing provided in an embodiment of this application; Figure 19 This is a second bottom view of a heat dissipation device provided in an embodiment of this application; Figure 20 express Figure 19 Cross-sectional view at point BB; Figure 21 This is the third schematic diagram illustrating an upper housing provided in an embodiment of this application; Figure 22 This is the sixth schematic diagram illustrating a lower housing provided in an embodiment of this application; Figure 23 This is a schematic diagram illustrating that the drainage structure provided in this application embodiment is a capillary structure.

[0008] Figure label: 10: Heat dissipation housing; 11: Upper housing; 12: Lower housing; 101: Receiving cavity; 102: Air inlet; 103: Air outlet; 104: Mounting hole; 105: Through hole; 20: Fan assembly; 30: Drainage structure; 301: Capillary structure; 40: Dust removal assembly; 41: Vibrating component; 42: Sound generating component; 50: Sterilization assembly; 51: Sterilization lamp; 52: Diffuser; 53: Ozone generator; 60: Mounting gasket; 70: Support plate; 100: Sealing gasket. Detailed Implementation

[0009] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0010] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0011] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0012] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0013] This application provides a heat dissipation device, such as... Figure 1 , Figure 3 , Figure 4 , Figure 21 and Figure 22As shown, the heat dissipation device includes: a heat dissipation housing 10, which has a receiving cavity 101 and an air inlet 102 and an air outlet 103 communicating with the receiving cavity 101. The air inlet 102 is used to allow gas to flow into the receiving cavity 101, and the air outlet 103 is used to allow gas to flow out of the receiving cavity 101; a fan assembly 20, which is disposed in the receiving cavity 101; and a liquid drainage structure 30, which is disposed in at least a portion of the cavity wall of the receiving cavity 101 and is used to drain the liquid that enters the receiving cavity 101.

[0014] In this embodiment, since the heat sink 10 is provided with a receiving cavity 101 and an air inlet 102 and an air outlet 103 connected to the receiving cavity 101, and the fan assembly 20 is disposed in the receiving cavity 101, when the heat dissipation device is applied to an electronic device, the heat sink 10 can be brought into contact with the heat-generating component in the electronic device, and then the fan assembly 20 can be run. Gas can flow into the receiving cavity 101 through the air inlet 102, and then the gas flows out from the air outlet 103. Thus, the heat generated by the heat-generating component is transferred to the heat sink 10, and the heat can be carried by the gas, so that the heat-generating component is continuously cooled. The operation of the fan assembly 20 can make the gas outside the heat sink 10 continuously enter the receiving cavity 101 through the air inlet 102, and the gas is discharged from the receiving cavity 101 through the air outlet 103. That is, the gas in the receiving cavity 101 is continuously flowing. After the heat of the heat-generating component is transferred to the heat sink 10, once the heat enters the receiving cavity 101, it can be carried by the gas and the heat is conducted to the outside of the heat sink 10, thereby cooling the heat-generating component. Furthermore, since the drainage structure 30 is located on at least a portion of the cavity wall of the receiving cavity 101, once liquid enters the receiving cavity 101, the liquid will be drained by the drainage structure 30, preventing the accumulation of liquid in the receiving cavity 101 from causing odors. That is, in this embodiment, by providing the heat dissipation housing 10, the fan assembly 20, and the drainage structure 30, not only can the heat-generating components of the electronic device be cooled, but the drainage structure 30 also allows the liquid entering the receiving cavity 101 to be drained, thereby preventing the accumulation of liquid in the receiving cavity 101 from causing odors. When the heat dissipation device is applied to electronic devices, the user experience of the electronic device can be improved.

[0015] It should be noted that, in the embodiments of this application, as Figure 3 , Figure 5 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 16 and Figure 18As shown, the heat dissipation housing 10 may include an upper housing 11 and a lower housing 12. The upper housing 11 and the lower housing 12 are connected to each other to form a receiving cavity 101. The upper housing 11 may be provided with an air outlet 103, and the lower housing 12 may be provided with an air inlet 102. Additionally, the heat dissipation device may include a sealing gasket 100, which is located between the upper housing 11 and the lower housing 12. The sealing gasket 100 can effectively seal the gap between the upper housing 11 and the lower housing 12, preventing liquid from outside the heat dissipation device from entering the receiving cavity 101 through this gap. The sealing gasket 100 can be a silicone gasket, or it can be a rubber gasket. This embodiment of the application does not limit the specific application of the heat dissipation device.

[0016] In another possible embodiment, at least part of the drain structure 30 extends to the air outlet 103, so that once liquid enters the receiving cavity 101, the liquid will be transported by the drain structure 30 to the air outlet 103 and discharged through the air outlet 103, avoiding the problem of odor caused by liquid accumulation in the receiving cavity 101.

[0017] In addition, in this embodiment, the fan assembly 20 can be an axial fan. Of course, the fan assembly 20 can also be other types of fans. This embodiment does not limit the specific type of fan.

[0018] Additionally, in the embodiments of this application, such as Figure 3 , Figure 5 , Figure 9 , Figure 11 and Figure 13 As shown, when the heat sink housing 10 includes an upper housing 11 and a lower housing 12, the lower housing 12 can be provided with a through hole 105. The fan assembly 20 passes through the through hole 105 and is located inside the receiving cavity 101. A support plate 70 can be provided at the bottom of the lower housing 12. The support plate 70 is connected to the outer wall of the lower housing 12 to support the fan assembly 20 and ensure that the fan assembly 20 is relatively stable.

[0019] Additionally, in the embodiments of this application, such as Figure 5 As shown, the heat dissipation device may also include a mounting pad 60, which is disposed outside the receiving cavity 101 and connected to the outer wall of the heat dissipation housing 10. The mounting pad 60 is located at the air outlet 103 and is used to contact the inner wall of the electronic device, thereby facilitating the installation of the heat dissipation device.

[0020] Additionally, in some embodiments, such as Figure 1 and Figure 2 As shown, the heat dissipation device may also include a dust removal component 40, which is disposed in the heat dissipation housing 10 and is used to remove dust from the receiving cavity 101.

[0021] Since the dust removal component 40 is located within the heat sink housing 10, once dust or impurities enter the receiving cavity 101, the dust removal component 40 can remove the dust from the receiving cavity 101, preventing dust accumulation and ensuring the heat dissipation effect of the heat sink housing 10 is not affected. In other words, by installing the dust removal component 40, dust in the receiving cavity 101 of the heat sink housing 10 can be effectively removed, ensuring a cleaner receiving cavity 101. This facilitates airflow within the receiving cavity 101 during fan assembly 20 operation, thereby improving the heat dissipation effect of the heat sink. Furthermore, reduced dust in the receiving cavity 101 also improves the cleanliness of electronic devices when applied to them, thus enhancing the user experience.

[0022] Additionally, in some embodiments, such as Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the dust removal assembly 40 may include a vibrator 41, which is connected to the heat dissipation housing 10. When the vibrator 41 is in operation, the vibrator 41 drives the heat dissipation housing 10 to vibrate, so that the dust on the cavity wall of the receiving cavity 101 falls off.

[0023] Since the vibrating element 41 is connected to the heat sink housing 10, once the vibrating element 41 is running, it can cause the heat sink housing 10 to vibrate due to its own vibration. This causes the dust on the cavity wall of the receiving cavity 101 of the heat sink housing 10 to fall off due to the vibration. Thus, when the fan assembly 20 is running, the dust can be carried to the outside of the heat sink housing 10 by the airflow from the air outlet 103. In other words, the dust is removed from the receiving cavity 101, or the dust that falls off the cavity wall of the receiving cavity 101 is transferred to the outside of the heat sink housing 10 through the air outlet 103 with the airflow in the receiving cavity 101. This avoids the problem that the dust may be adsorbed on the cavity wall of the receiving cavity 101 after falling on it, which would make the dust difficult to remove. By setting the vibrating element 41, the dust on the cavity wall of the receiving cavity 101 can be easily removed, thereby making the dust easier to be removed to the outside of the heat sink housing 10, making the inside of the heat sink housing 10 cleaner, which is beneficial to improving the cleanliness of the heat sink device, and thus improving the cleanliness of the electronic device when the heat sink device is applied to electronic devices.

[0024] It should be noted that the vibrating element 41 can be a motor. Of course, the vibrating element 41 can also be other devices capable of vibration. For example, the vibrating element 41 is a motor connected to a moving part, which is driven to move at high frequency through electrodes, thereby achieving vibration. The specific type of the vibrating element 41 is not limited in this embodiment.

[0025] In addition, in this embodiment, the vibrating element 41 can be connected to the outer wall of the heat sink housing 10. Of course, in some embodiments, the vibrating element 41 can also be connected to the inner wall of the heat sink housing 10. This embodiment does not limit the scope of the application.

[0026] In addition, in this embodiment, the vibrating element 41 can be bonded to the outer wall of the heat sink housing 10 with adhesive. Of course, the vibrating element 41 can also be connected to the outer wall of the heat sink housing 10 with screws, pins or other components. This embodiment does not limit the specific connection.

[0027] In addition, in this embodiment of the application, when the heat dissipation device is applied to an electronic device, the vibrating element 41 can be a motor, and the motor can be the motor inside the electronic device, that is, the motor inside the electronic device can be reused, and there is no need to set up an additional motor.

[0028] Additionally, in the embodiments of this application, such as Figure 6 and Figure 7 As shown, when the heat dissipation housing 10 includes an upper housing 11 and a lower housing 12, and the lower housing 12 is provided with an air inlet 102, the motor can be connected to the outer wall of the lower housing 12. When the gas enters the interior of the receiving cavity 101 through the air inlet 102, the motor can run and generate vibration, causing the lower housing 12 to vibrate, which in turn causes the upper housing 11 to vibrate. This ensures that the dust entering the receiving cavity 101 with the gas is not easily adsorbed on the inner wall of the receiving cavity 101 by the vibration, and facilitates the dust to be carried to the outside of the receiving cavity 101 by the gas.

[0029] Additionally, in some embodiments, such as Figure 14 , Figure 17 , Figure 19 and Figure 20 As shown, the dust removal assembly 40 may include a sound-generating assembly 42. The outer wall of the heat dissipation housing 10 is provided with a mounting hole 104, and the mounting hole 104 penetrates through the outer wall of the heat dissipation housing 10. At least a portion of the sound-generating assembly 42 passes through the mounting hole 104, and the sound-generating end of the sound-generating assembly 42 faces the interior of the receiving cavity 101. When the sound-generating assembly 42 is in operation, the sound-generating assembly 42 emits sound waves to vibrate the air inside the receiving cavity 101, causing the dust on the cavity wall of the receiving cavity 101 to fall off.

[0030] Since the outer wall of the heat sink housing 10 has a mounting hole 104 that penetrates through the outer wall of the heat sink housing 10, and at least part of the sound-generating component 42 passes through the mounting hole 104 with the sound-generating end of the sound-generating component 42 facing the interior of the receiving cavity 101, the sound waves emitted by the sound-generating component 42 will be transmitted in the receiving cavity 101 when the sound-generating component 42 is running. The sound waves will cause the air in the receiving cavity 101 to vibrate, and the vibration of the air in the receiving cavity 101 will cause the dust that has fallen on the cavity wall in the receiving cavity 101 to be moved. Dust on the cavity wall of cavity 101 will fall off from the cavity wall of cavity 101. When the fan assembly 20 is running, the dust can be carried by the airflow from the air outlet 103 to the outside of the heat sink 10, thus removing dust from the cavity 101. Alternatively, dust falling off the cavity wall of cavity 101 can be carried by the airflow within cavity 101 to the outside of the heat sink 10 through the air outlet 103. This prevents dust from falling onto the cavity wall of cavity 101 and adhering there, thus avoiding the problem of dust being difficult to remove. In other words, by providing the sound-emitting assembly 42, dust on the cavity wall of cavity 101 can be easily detached and removed to the outside of the heat sink 10, making the inside of the heat sink 10 cleaner. This improves the cleanliness of the heat dissipation device and, consequently, the cleanliness of the electronic device when it is used in electronic devices.

[0031] It should be noted that in this embodiment, the sound-generating component 42 can be a loudspeaker; of course, the sound-generating component 42 can also be an ultrasonic device capable of emitting ultrasonic waves. The specific type of the sound-generating component 42 is not limited in this embodiment.

[0032] Additionally, in the embodiments of this application, such as Figure 20 As shown, the sound-generating component 42 can be inserted through the mounting hole 104. The sound-generating component 42 can be bonded to the wall of the mounting hole 104 with adhesive, thereby fixing the sound-generating component 42 and preventing the sound-generating component 42 from easily falling off the heat sink housing 10. This ensures that the sound-generating component 42 can stably emit sound waves into the receiving cavity 101 to remove dust from the cavity wall of the receiving cavity 101. Of course, the sound-generating component 42 can also be connected to the heat sink housing 10 by screws. This embodiment of the application does not limit this.

[0033] In addition, in this embodiment of the application, when the heat dissipation device is applied to an electronic device, the sound-generating component 42 can be a speaker inside the electronic device, that is, the speaker inside the electronic device can be reused, and there is no need to set up an additional speaker; of course, when the heat dissipation device is applied to an electronic device, the sound-generating component 42 can also be an ultrasonic device, that is, the ultrasonic device inside the electronic device can be reused, and there is no need to set up an additional ultrasonic device.

[0034] Additionally, in the embodiments of this application, such as Figure 20 As shown, when the heat dissipation housing 10 includes an upper housing 11 and a lower housing 12, and the lower housing 12 is provided with an air inlet 102, the lower housing 12 can be provided with a mounting hole 104. The sound-generating component 42 can pass through the mounting hole 104 of the lower housing 12 and be connected to the lower housing 12. Thus, when the fan assembly 20 is running, when the gas enters the interior of the receiving cavity 101 through the air inlet 102, the sound-generating component 42 can operate, thereby causing the air inside the receiving cavity 101 to vibrate. This ensures that the dust entering the receiving cavity 101 with the gas is vibrated and is not easily adsorbed on the inner wall of the receiving cavity 101, making it easier for the dust to be carried to the outside of the receiving cavity 101 by the gas. Of course, the sound-generating component 42 can also emit sound waves into the interior of the receiving cavity 101 when the fan assembly 20 is not running. In this respect, the embodiments of this application do not limit the scope of the application.

[0035] Additionally, in some embodiments, such as Figure 1 and Figure 5 As shown, the heat dissipation device may also include a sterilization component 50, which is disposed inside the receiving cavity 101 and is used to sterilize the inside of the receiving cavity 101.

[0036] Since the sterilization component 50 is located inside the receiving cavity 101, it can be operated to sterilize the interior of the receiving cavity 101. This prevents a high bacterial count in the receiving cavity 101 from causing the gas flowing out of the heat sink 10 to carry a large number of bacteria, which could potentially affect the user's health. In other words, by setting up the sterilization component 50, the interior of the receiving cavity 101 can be effectively sterilized, ensuring a low bacterial count. This improves the cleanliness of the electronic device when the heat sink is applied to it, benefiting the user's health. Furthermore, the reduced bacteria in the receiving cavity 101 also lowers the probability of unpleasant odors developing inside, thereby improving the user experience.

[0037] Additionally, in some embodiments, such as Figure 5 and Figure 11 As shown, the sterilization assembly 50 may include a sterilization lamp 51, which is disposed in the receiving cavity 101 and is close to the air inlet 102.

[0038] Because the sterilization lamp 51 is located in the receiving cavity 101 and close to the air inlet 102, after the gas outside the heat sink housing 10 enters the receiving cavity 101 through the air inlet 102, the gas is irradiated by the light emitted by the sterilization lamp 51, thereby eliminating bacteria in the gas. The bacteria-free gas continues to flow in the receiving cavity 101 and then flows out from the air outlet 103, effectively reducing the number of bacteria in the receiving cavity 101. In other words, by placing the sterilization lamp 51 in the receiving cavity 101 and close to the air inlet 102, the gas flowing into the receiving cavity 101 can be effectively sterilized, reducing the number of bacteria in the receiving cavity 101, improving the cleanliness of the electronic device, which is beneficial to the user's health. Furthermore, the reduction in bacteria in the receiving cavity 101 also reduces the probability of odors that may arise inside the receiving cavity 101, thereby improving the user's experience of using the electronic device.

[0039] It should be noted that in this embodiment, the sterilization lamp 51 can be an ultraviolet lamp. Of course, the sterilization lamp 51 can also be other lamps capable of emitting sterilization light. In this respect, this embodiment does not limit the application.

[0040] In addition, in this embodiment, the sterilization lamp 51 can be bonded to the inner wall of the receiving cavity 101 with adhesive. Of course, the sterilization lamp 51 can also be connected to the inner wall of the receiving cavity 101 with screws, pins, or other components. When the heat dissipation housing 10 includes an upper housing 11 and a lower housing 12, and the lower housing 12 is provided with an air inlet 102, the sterilization lamp 51 can be connected to the lower housing 12.

[0041] Additionally, in some embodiments, such as Figure 5 and Figure 11 As shown, the sterilization assembly 50 may also include a light diffuser 52, which is disposed in the receiving cavity 101. The light diffuser 52 is distributed at intervals with the sterilization lamp 51, and the light-emitting surface of the sterilization lamp 51 faces the light diffuser 52. The light diffuser 52 is used to scatter the light from the sterilization lamp 51 onto the light diffuser 52 into the receiving cavity 101.

[0042] Since the diffuser 52 is disposed in the receiving cavity 101 and is distributed at intervals with the sterilization lamp 51, and the light-emitting surface of the sterilization lamp 51 faces the diffuser 52, once the sterilization lamp 51 is turned on, the sterilizing light emitted by the sterilization lamp 51 will shine on the diffuser 52, and the diffuser 52 can scatter the light, so that the scattered light can illuminate all the spaces inside the receiving cavity 101 as much as possible, ensuring that all the spaces inside the receiving cavity 101 can be sterilized, which is beneficial to further reduce the number of bacteria in the receiving cavity 101. In other words, by setting up the diffuser 52, it can be ensured that all spaces inside the cavity 101 can be irradiated by the light emitted by the sterilization lamp 51, further eliminating bacteria inside the cavity 101, and further reducing the bacteria in the gas flowing out of the cavity 101. When the heat dissipation device is applied to electronic devices, the cleanliness of the electronic devices is further improved, which is more beneficial to the health of users. Furthermore, the further reduction of bacteria in the cavity 101 can also further reduce the probability of odors that may be generated inside the cavity 101, thereby improving the user's experience of using electronic devices.

[0043] It should be noted that the diffuser 52 can be a convex lens, and the light-emitting surface of the sterilization lamp 51 faces the convex surface. Of course, the diffuser 52 can also be a plane mirror. Utilizing the principle of light refraction by a plane mirror, multiple plane mirrors can be arranged in the receiving cavity 101, so that the light emitted by the sterilization lamp 51 is refracted by multiple plane mirrors, thereby ensuring that the light emitted by the sterilization lamp 51 illuminates only the entire interior space of the receiving cavity 101.

[0044] Additionally, in some embodiments, such as Figure 15 , Figure 17 and Figure 20 As shown, the sterilization assembly 50 may include an ozone generator 53, which is disposed in the receiving cavity 101. When the ozone generator 53 is powered on, the ozone generator 53 generates ozone in the receiving cavity 101 so that the ozone sterilizes the interior of the receiving cavity 101.

[0045] Since the ozone generator 53 is disposed within the receiving cavity 101, when sterilization of the interior of the receiving cavity 101 is required, the ozone generator 53 can be energized. The ozone generator 53 then generates high-speed electrons by applying current to its electrodes. These high-speed electrons collide with oxygen molecules in the air within the receiving cavity 101, causing a corona discharge. The gas is ionized and forms ozone molecules, thus producing ozone. The ozone can then sterilize the air within the receiving cavity 101, effectively sterilizing the interior of the receiving cavity 101. In other words, by incorporating the ozone generator 53, sterilization of the interior of the receiving cavity 101 is facilitated, resulting in less bacteria carried by the gas flowing out of the receiving cavity 101. This improves the cleanliness of electronic devices when heat dissipation devices are applied to them, benefiting user health. Furthermore, the reduced bacteria in the receiving cavity 101 lowers the probability of unpleasant odors developing inside, thereby improving the user experience of the electronic devices.

[0046] Additionally, in some embodiments, such as Figure 21 , Figure 22 and Figure 23 As shown, the drainage structure 30 may include a hydrophobic layer, a capillary structure 301, and a hydrophobic microstructure; wherein, the hydrophobic microstructure includes multiple spaced protrusions, and the capillary structure 301 includes capillaries or capillary channels.

[0047] When the drainage structure 30 includes a hydrophobic layer, it is equivalent to coating the cavity wall of the receiving cavity 101 with a hydrophobic layer. Thus, once liquid enters the receiving cavity 101 and falls onto the inner wall of the cavity 101, the liquid essentially falls onto the hydrophobic layer. Due to its hydrophobicity, the liquid can easily flow within the hydrophobic layer. Therefore, once gas flows within the receiving cavity 101, the liquid on the cavity wall of the receiving cavity 101 will move with the gas flow, facilitating the discharge of gas to the outside of the receiving cavity 101. The hydrophobic layer can be formed by coating with a hydrophobic material.

[0048] When the drainage structure 30 includes a capillary structure 301, it is equivalent to setting a capillary tube or a capillary channel in the wall of the receiving cavity 101. Thus, once liquid enters the receiving cavity 101 and falls onto the inner wall of the receiving cavity 101, the liquid essentially falls onto the capillary structure 301. The capillary effect of the capillary structure 301 itself allows the liquid to move, thereby moving to the air outlet 103 for discharge. The capillary tube or capillary channel can be a nanoscale capillary tube or capillary channel, meaning the diameter of the capillary tube or the inner diameter of the capillary channel is at the nanoscale.

[0049] When the capillary structure 301 includes hydrophobic microstructures, it is equivalent to the cavity wall of the receiving cavity 101 being provided with spaced protrusions, the size of which is in the micrometer or nanometer range, and the hydrophobic microstructures are lotus leaf-shaped. The tops of the protrusions can be provided with nanoscale crystals. When liquid enters the receiving cavity 101 and falls onto the inner wall of the receiving cavity 101, the liquid is equivalent to falling onto the hydrophobic microstructures. The liquid cannot completely wet and penetrate into the gaps of the hydrophobic microstructures; instead, the liquid can only contact the tops of these protrusions of the hydrophobic microstructures, and the liquid... In this structure, a large amount of air is trapped within the gaps of the hydrophobic microstructure, forming a stable "air cushion" that prevents liquid from entering. Furthermore, because the cohesive force between liquid molecules is much greater than the adhesion force between the liquid and the surface of the lotus leaf-shaped hydrophobic microstructure, and given the small contact area of ​​the liquid, it contracts into a near-perfect sphere to maintain its lowest energy state. This facilitates the liquid's movement; once gas flows within the containment cavity 101, the liquid flows with the gas to the outlet 103 and is discharged. The contact angle between the liquid and the hydrophobic microstructure is greater than 160°. Additionally, the hydrophobic microstructure can be a biomimetic microstructure.

[0050] It should be noted that, in the embodiments of this application, the drainage structure 30 may only include a hydrophobic layer, in which case it is equivalent to the entire cavity wall of the receiving cavity 101 being coated with a hydrophobic layer; the drainage structure 30 may also only include a capillary structure 301, in which case it is equivalent to the cavity wall of the receiving cavity 101 being provided with a capillary structure 301; the drainage structure 30 may also only include a hydrophobic microstructure, in which case it is equivalent to the cavity wall of the receiving cavity 101 being provided with a hydrophobic microstructure; of course, the drainage structure 30 may also include a hydrophobic layer and a capillary structure 301, in which case it is equivalent to a portion of the cavity wall of the receiving cavity 101 being provided with a hydrophobic layer and another portion of the cavity wall being provided with a capillary structure 301. For example, when the heat dissipation housing 10 includes an upper housing 11 and a lower housing 12, a hydrophobic layer may be provided on the inner wall of the upper housing 11 and a capillary structure 301 may be provided on the inner wall of the lower housing 12. The capillary structure 301 is provided; the drainage structure 30 may also include a hydrophobic layer and a hydrophobic microstructure. In this case, it is equivalent to a part of the cavity wall of the receiving cavity 101 being provided with a hydrophobic layer and another part of the cavity wall being provided with a hydrophobic microstructure. For example, when the heat dissipation housing 10 includes an upper housing 11 and a lower housing 12, a hydrophobic layer may be provided on the inner wall of the upper housing 11 and a hydrophobic microstructure may be provided on the inner wall of the lower housing 12. The drainage structure 30 may also include a capillary structure 301 and a hydrophobic microstructure. In this case, it is equivalent to a part of the cavity wall of the receiving cavity 101 being provided with a capillary structure 301 and another part of the cavity wall being provided with a hydrophobic microstructure. For example, when the heat dissipation housing 10 includes an upper housing 11 and a lower housing 12, a capillary structure 301 may be provided on the inner wall of the upper housing 11 and a hydrophobic microstructure may be provided on the inner wall of the lower housing 12. Of course, in the embodiments of this application, the drainage structure 30 may also include a hydrophobic layer, a capillary structure 301, and a hydrophobic microstructure. In this case, it is equivalent to a portion of the cavity wall of the receiving cavity 101 being provided with a capillary structure 301, a portion of the cavity wall being provided with a hydrophobic microstructure, and a portion of the cavity wall being provided with a hydrophobic layer. In this respect, the embodiments of this application are not limited.

[0051] It should be noted that, in the embodiments of this application, hydrophobic microstructures can be formed on the cavity wall of the receiving cavity 101 by laser double-slit interference.

[0052] In this embodiment, since the heat sink 10 is provided with a receiving cavity 101 and an air inlet 102 and an air outlet 103 connected to the receiving cavity 101, and the fan assembly 20 is disposed in the receiving cavity 101, when the heat dissipation device is applied to an electronic device, the heat sink 10 can be brought into contact with the heat-generating component in the electronic device, and then the fan assembly 20 can be run. Gas can flow into the receiving cavity 101 through the air inlet 102, and then the gas flows out from the air outlet 103. Thus, the heat generated by the heat-generating component is transferred to the heat sink 10, and the heat can be carried by the gas, so that the heat-generating component is continuously cooled. The operation of the fan assembly 20 can make the gas outside the heat sink 10 continuously enter the receiving cavity 101 through the air inlet 102, and the gas is discharged from the receiving cavity 101 through the air outlet 103. That is, the gas in the receiving cavity 101 is continuously flowing. After the heat of the heat-generating component is transferred to the heat sink 10, once the heat enters the receiving cavity 101, it can be carried by the gas and the heat is conducted to the outside of the heat sink 10, thereby cooling the heat-generating component. Furthermore, since the drainage structure 30 is located on at least a portion of the cavity wall of the receiving cavity 101, once liquid enters the receiving cavity 101, the liquid will be drained by the drainage structure 30, preventing the accumulation of liquid in the receiving cavity 101 from causing odors. That is, in this embodiment, by providing the heat dissipation housing 10, the fan assembly 20, and the drainage structure 30, not only can the heat-generating components of the electronic device be cooled, but the drainage structure 30 also allows the liquid entering the receiving cavity 101 to be drained, thereby preventing the accumulation of liquid in the receiving cavity 101 from causing odors. When the heat dissipation device is applied to electronic devices, the user experience of the electronic device can be improved.

[0053] This application also provides an electronic device, which includes a housing, a heating element, and a heat dissipation device as described in any of the above embodiments; the heating element and the heat dissipation device are both disposed in the housing, and the heat dissipation housing 10 is in contact with the heating element.

[0054] Among them, the heating element can be the controller of the electronic device. Of course, the heating element can also be other components in the electronic device that are prone to heat generation.

[0055] It should be noted that, in the embodiments of this application, electronic devices include, but are not limited to, controllers, smart devices, terminal products, etc., wherein smart devices include, for example, smartphones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices, etc., and terminal products include, for example, personal computers, tablet computers, etc.

[0056] In addition, in this embodiment, the electronic device has a motor inside, which can be used as a vibrating element 41 in the heat dissipation device, that is, the motor inside the electronic device can be directly reused. Furthermore, the electronic device has a sound-generating component 42 inside, which can be directly reused in the heat dissipation device, avoiding the need for an additional sound-generating component 42. The sound-generating component 42 can be a speaker; of course, it can also be an ultrasonic component, that is, using an ultrasonic component to emit ultrasonic waves to vibrate the air, thereby achieving air vibration inside the accommodating cavity 101.

[0057] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0058] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device comprises: a heat dissipation housing provided with a receiving cavity, an air inlet and an air outlet, the air inlet being configured to allow gas to flow into the receiving cavity, and the air outlet being configured to allow gas in the receiving cavity to flow out; a fan assembly arranged in the receiving cavity; a liquid discharge structure arranged on at least part of the cavity wall of the receiving cavity, the liquid discharge structure being configured to discharge liquid entering the receiving cavity.

2. The heat dissipating device according to claim 1, wherein The heat dissipation device further comprises a dust removal assembly arranged on the heat dissipation housing, the dust removal assembly being configured to remove dust in the receiving cavity.

3. The heat dissipating device according to claim 2, wherein The dust removal assembly comprises a vibrating member connected to the heat dissipation housing; When the vibrating member is in operation, the vibrating member drives the heat dissipation housing to vibrate, so that dust on the cavity wall of the receiving cavity falls off.

4. The heat dissipating device of claim 2, wherein The dust removal assembly comprises a sound emitting assembly, the outer wall of the heat dissipation housing is provided with a mounting hole penetrating through the outer wall of the heat dissipation housing, at least part of the sound emitting assembly is arranged in the mounting hole, and a sound emitting end of the sound emitting assembly faces the inside of the receiving cavity; When the sound emitting assembly is in operation, the sound emitting assembly emits sound waves to vibrate air in the receiving cavity, so that dust on the cavity wall of the receiving cavity falls off.

5. The heat dissipating device of claim 1, wherein The heat dissipation device further comprises a sterilization assembly arranged in the inside of the receiving cavity, the sterilization assembly being configured to sterilize the inside of the receiving cavity.

6. The heat dissipating device according to claim 5, wherein The sterilization assembly comprises a sterilization lamp arranged in the receiving cavity, and the sterilization lamp is close to the air inlet.

7. The heat dissipating device according to claim 6, wherein The sterilization assembly further comprises a light scattering member arranged in the receiving cavity, the light scattering member is spaced apart from the sterilization lamp, a light emitting surface of the sterilization lamp faces the light scattering member, and the light scattering member is configured to scatter light emitted by the sterilization lamp on the light scattering member to the receiving cavity.

8. The heat dissipating device of claim 5, wherein, The sterilization assembly comprises an ozone generating member arranged in the receiving cavity; When the ozone generating member is powered on, the ozone generating member generates ozone in the receiving cavity, so that the ozone sterilizes the inside of the receiving cavity.

9. The heat dissipating device according to any one of claims 1 to 8, wherein The liquid discharge structure comprises at least one of a hydrophobic layer, a capillary structure, and a hydrophobic microstructure; The hydrophobic microstructure comprises a plurality of spaced-apart protrusions, and the capillary structure comprises a capillary tube or a capillary channel.

10. An electronic device, comprising: The electronic device comprises a housing, a heat generating member, and the heat dissipation device according to any one of claims 1-9; The heat generating member and the heat dissipation device are arranged in the housing, and the heat dissipation housing is in contact with the heat generating member.

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