Single-wafer rotary cleaning equipment with immersion, cleaning and etching functions

Abstract

This application relates to the field of semiconductor manufacturing and discloses a single-wafer rotary cleaning device with immersion and cleaning / etching functions. The device includes a rotary support mechanism comprising four sets of supports and one set of motors. A rotating shaft is rotatably mounted on the top of each support. A gear is fixedly mounted on the outer surface of the rotating shaft. A movable plate is rotatably mounted on the middle of the outer surface of the rotating shaft. A second rotating shaft and a pawl are rotatably mounted on the inner and outer sides of the top of the movable plate, respectively. This device resets the support cylinder and re-clamps it onto the outer surface of the wafer body, providing rotational support and frictional clamping. At this time, a pump located outside the outer casing pumps cleaning fluid from the cleaning chamber to the nozzle, which sprays the cleaning fluid upwards to the bottom of the wafer body, completing the cleaning process. The support cylinder also drives the wafer body to rotate, "throwing" the cleaning fluid and impurities into the fixed cavity through centrifugal motion generated by the rotation, and finally returning it to the cleaning chamber.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a single-wafer rotary cleaning device with immersion and cleaning etching functions. Background Technology

[0002] In semiconductor manufacturing, the etching and post-etching cleaning of a single wafer are crucial, directly determining the success of wafer fabrication. In existing technologies, during wet etching, the wafer is often fully immersed in an etching chemical solution. This solution reacts with the exposed areas of the wafer surface, corroding them and forming the basic structure of logic circuits. After etching, impurities from the chemical reaction adhere to the wafer, necessitating subsequent cleaning and drying. The wafer is then spun at high speed to achieve a drying process. Current technologies have explored ways to improve the efficiency of wafer etching and cleaning. The above two methods are combined into a single process: cleaning immediately after etching. Existing patents (such as CN202222913942.1) often use the wafer and related sealing structures to create a seal, forming a sealed bottom structure for immersing in the etching chemical solution. However, this design causes all the pressure of the etching chemical solution to be applied to the wafer surface. In order to ensure the concentration, the solution required for wafer immersion etching is often in large quantities, resulting in high pressure. Therefore, the chemical solution will cause long-term pressure damage to the wafer structure. Therefore, this patent is committed to solving this problem and designs a single-wafer rotary cleaning device with immersion and cleaning etching functions. Summary of the Invention

[0003] This application proposes a single-wafer rotary cleaning device with immersion and cleaning / etching functions, which has the advantage of high working efficiency and is used to solve the problems mentioned in the prior art.

[0004] To achieve the above objectives, this application adopts the following technical solution: a single-wafer rotary cleaning device with immersion and cleaning / etching functions, comprising: The outer shell has a cleaning mechanism on its outer side, and the inner wall of the outer shell has a fixing cavity, a cleaning cavity and a soaking cavity in sequence from top to bottom; A rotating support mechanism includes four sets of supports and one set of motors. A rotating shaft is rotatably mounted on the top of each support. A gear is fixedly mounted on the outer surface of the rotating shaft. A movable plate is rotatably mounted on the middle of the outer surface of the rotating shaft. A rotating shaft and a pawl are rotatably mounted on the inner and outer sides of the top of the movable plate, respectively. A gear and a support cylinder are fixedly mounted on the outer surface of the rotating shaft. An internal gear ring is meshed on the outer surface of the gear, and the gear meshes with the gear. A ratchet is provided on the outer ring surface of the internal gear ring. A fixed plate is fixedly mounted on the top of the movable plate. A spring is elastically connected between the pawl and the fixed plate. One end of the pawl abuts against the ratchet. This redesigned device combines wet etching and cleaning of the wafer body, reducing the time the wafer body spends moving between processes in semiconductor manufacturing and effectively improving the device's efficiency. To achieve this, the device incorporates a cleaning chamber and an immersion chamber inside the housing to hold the cleaning solution and etching chemical solution. This allows the wafer body to be etched, cleaned, and dried in a single process within the housing. The wafer body is drawn into the housing by a vacuum chuck. During the initial immersion cleaning in the immersion chamber, a rotating support mechanism drives a support cylinder to rotate and retract towards the inner wall of the fixed cavity, thus cleaning the wafer body. The wafer body descends into the immersion chamber to create space. After the wafer body is etched, it is pulled upwards by a vacuum suction cup and telescopic components to the top of the support cylinder. The support mechanism is then reversed and rotated to reset the support cylinder and re-clamp it onto the outer surface of the wafer body, providing rotational support and friction clamping. At this time, the cleaning fluid from the cleaning chamber is pumped to the nozzle by a pump located on the outside of the outer shell. The cleaning fluid is sprayed upwards from the nozzle to the bottom of the wafer body to complete the cleaning. The support cylinder can also drive the wafer body to rotate, "throwing" the cleaning fluid and impurities in the cleaning solution into the fixed cavity through the centrifugal motion generated by the rotation, and finally flowing back into the cleaning chamber.

[0005] Then, in order to realize the function of retracting and extending the rotating support mechanism and driving the wafer body to rotate at high speed, this device is equipped with four sets of supports for supporting the entire mechanism and fixed at the bottom of the fixed cavity. A set of motors is also installed at the bottom of the support on the right side. The motors mainly provide rotational power for the entire mechanism. The motors drive the first rotating shaft and the first gear to rotate clockwise, causing the internal gear ring and ratchet to rotate clockwise, and driving the pawl and the movable plate to rotate clockwise around the axis of the first rotating shaft. Finally, the support cylinder rotates towards the inner side closer to the fixed cavity, realizing the function of retracting and hiding the support cylinder. At this time, the wafer body can enter the immersion cavity through the support cylinder for etching.

[0006] Finally, by reversing the motor, the rotating shaft one and gear one drive the internal gear ring and ratchet to rotate counterclockwise. The spring applies tension to the pawl, causing the outer surfaces of the pawl and ratchet to abut against each other. As the internal gear ring and ratchet rotate counterclockwise, the movable plate has no rotational resistance. Driven by the pawl and ratchet, the movable plate gradually resets and is stopped by the limiting plate. At this time, the positions of the movable plate and pawl remain unchanged, and the support cylinder can support and roll the wafer body after resetting. At this time, the motor drives the other three sets of gears one and two to rotate through gear one and the internal gear ring, realizing the high-speed rotation of the wafer body.

[0007] Preferably, the cleaning mechanism includes a transfer chamber, a connecting pipe, and a pump disposed on the outside of the outer shell. The transfer chamber is fixedly connected to the bottom of the upper end of the outer shell. The two ends of the transfer chamber are respectively connected to the transfer chamber and the fixed cavity. The pump is disposed on the outer surface of the connecting pipe. The inner cavity of the cleaning chamber is filled with cleaning fluid. The bottom of the inner wall of the fixed cavity is fixedly connected to multiple sets of nozzles connected to the transfer chamber. like Figure 3 As shown, the cleaning fluid is located in the cleaning chamber, which is connected to the transfer chamber and the nozzle through a connecting pipe. It is pumped upward to the transfer chamber and the nozzle by a pump, and finally sprayed out by the nozzle to act on the bottom of the wafer body.

[0008] Preferably, a motor is installed at the bottom of the support on the right side, the motor is located outside the housing, the output shaft of the motor is connected to the rotating shaft on the right side, and the wafer body is placed on the top of the multiple sets of support cylinders; like Figure 3 As shown, the motor is located on the outside of the housing. After isolation, the acidic liquid and cleaning solution inside the housing can prevent the motor from being corroded. The wafer body is placed on top of the support cylinder and is rolled and supported by the support cylinder, which facilitates the subsequent rotation of the wafer body.

[0009] Preferably, the immersion chamber is filled with an etching chemical solution, the immersion chamber and the cleaning chamber are arranged in concentric circles, and the opening at the top of the immersion chamber is larger than the diameter of the wafer body. like Figure 3 As shown, the soaking chamber and the rinsing chamber are concentrically distributed inside and outside, and the rinsing chamber is designed with a closed opening at the top to prevent backflow of rinsing into the soaking chamber.

[0010] Preferably, a limiting plate is fixedly connected to the outer side of the support, and the outer side of the movable plate abuts against the limiting plate. The limiting plate prevents the movable plate from rotating counterclockwise around the axis of the first rotating shaft. like Figure 5 , Figure 6As shown, the limiting plate is used to restrict the entire movable plate from rotating counterclockwise around the axis of rotation. When the movable plate rotates and coincides with the support, the support cylinder resets and can provide support, rolling contact limiting and other functions for the wafer body.

[0011] Preferably, the four sets of supports, movable plates, gears, and support cylinders are all circumferentially distributed, and the inner side of the internal gear ring meshes with the four sets of gears simultaneously. like Figure 5 , Figure 6 As shown, the four sets of gears achieve synchronous meshing transmission through the outer internal gear ring, and synchronize the movement of the four sets of movable plates and support cylinders. The inner side of the internal gear ring is provided with teeth to perform the synchronous meshing transmission function.

[0012] Preferably, the support cylinder is made of rubber, the outer surface of the wafer body is rotatably abutted against the top of the outer surface of the support cylinder, and the bottom of the wafer body is abutted against the top of the middle protrusion of the support cylinder; like Figure 3 As shown, the rubber support cylinders can provide cushioning and support for the wafer body. The outer surfaces of the four sets of support cylinders roll against the wafer body and generate friction, making the rotation of the wafer body more stable. The rotating wafer body also eliminates cleaning dead corners.

[0013] Preferably, the nozzles are configured in four groups and are distributed equidistantly in a circle inside the fixed cavity. The four groups of nozzles and the four groups of supports are staggered at 45°. The upper end of the nozzle is inclined toward the bottom circle of the wafer body. like Figure 3 , Figure 5 As shown, the upward-sloping nozzles can spray cleaning fluid onto the surface of the wafer body to complete the cleaning, while the four sets of equidistantly distributed circumferential nozzles can help the cleaning fluid to more comprehensively cover the surface of the wafer body.

[0014] The beneficial effects of this invention are as follows: 1. This redesigned device combines wet etching and cleaning of the wafer body, reducing the time the wafer body spends moving between processes in semiconductor manufacturing and effectively improving the device's efficiency. To achieve this, the device incorporates a cleaning chamber and an immersion chamber inside the housing to hold the cleaning solution and etching chemical solution. This allows the wafer body to be etched, cleaned, and dried in a single process within the housing. The wafer body is pulled into the housing by a vacuum suction cup. During the immersion cleaning process in the immersion chamber, a rotating support mechanism drives the support cylinder to rotate and retract towards the inner wall of the fixed cavity, thus cleaning the wafer. The wafer body moves downwards into the immersion chamber to create space. After the wafer body is etched, it is pulled upwards by a vacuum suction cup and telescopic components to the top of the support cylinder. The support mechanism is then reversed and rotated to reset the support cylinder and re-clamp it onto the outer surface of the wafer body, providing rotational support and friction clamping. At this time, the cleaning fluid from the cleaning chamber is pumped to the nozzle by a pump located on the outside of the outer shell. The cleaning fluid is sprayed upwards from the nozzle to the bottom of the wafer body to complete the cleaning. The support cylinder can also drive the wafer body to rotate, "throwing" the cleaning fluid and impurities in the cleaning solution into the fixed cavity through the centrifugal motion generated by the rotation, and finally flowing back into the cleaning chamber.

[0015] 2. Then, in order to realize the function of retracting and extending the rotating support mechanism and driving the wafer body to rotate at high speed, this device is equipped with four sets of supports for supporting the entire mechanism and fixed at the bottom of the fixed cavity. A set of motors is also installed at the bottom of the support on the right side. The motors mainly provide rotational power for the entire mechanism. The motors drive the rotating shaft and gear to rotate clockwise, causing the internal gear ring and ratchet to rotate clockwise, and driving the pawl and movable plate to rotate clockwise around the axis of the rotating shaft. Finally, the support cylinder rotates towards the inner side closer to the fixed cavity, realizing the function of retracting and hiding the support cylinder. At this time, the wafer body can enter the immersion cavity through the support cylinder for etching.

[0016] 3. Finally, by reversing the motor, the rotating shaft one and gear one drive the internal gear ring and ratchet to rotate counterclockwise. The spring applies tension to the pawl, causing the outer surfaces of the pawl and ratchet to abut against each other. As the internal gear ring and ratchet rotate counterclockwise, the movable plate has no rotational resistance. Driven by the pawl and ratchet, the movable plate gradually resets and is stopped by the limiting plate. At this time, the positions of the movable plate and pawl remain unchanged, and the support cylinder can support and roll the wafer body after resetting. At this time, the motor drives the other three sets of gears one and two to rotate through gear one and the internal gear ring, realizing the high-speed rotation of the wafer body. Attached Figure Description

[0017] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.

[0018] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein: Figure 1 This is a schematic diagram of the internal structure of the outer casing of the present invention; Figure 2 This is a schematic diagram of the front view of the outer casing of the present invention; Figure 3 This is a front sectional view of the outer casing of the present invention; Figure 4 For the present invention Figure 3 Enlarged schematic diagram of the structure at point A; Figure 5 This is a schematic diagram showing the separation of the rotating support mechanism and the cleaning mechanism of the present invention; Figure 6 This is a top view of the rotating support mechanism of the present invention; Figure 7 For the present invention Figure 6 Enlarged schematic diagram of the structure at point B; Figure 8 This is a schematic diagram of the rotating support mechanism of the present invention; Figure 9 This is a schematic diagram showing the separation of the rotating support mechanism of the present invention.

[0019] The components are as follows: 1. Outer shell; 2. Transfer chamber; 3. Connecting pipe; 4. Pump; 5. Cleaning chamber; 6. Fixing chamber; 7. Immersion chamber; 8. Support; 9. Motor; 10. Shaft 1; 11. Gear 1; 12. Ratchet; 13. Movable plate; 14. Shaft 2; 15. Gear 2; 16. Support cylinder; 17. Nozzle; 18. Internal gear ring; 19. Wafer body; 20. Pawl; 21. Fixing plate; 22. Spring; 23. Limiting plate. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] Please see Figures 1-9 This embodiment discloses a single-wafer rotary cleaning device with immersion and cleaning / etching functions, including: The outer shell 1 has a cleaning mechanism on its outer side, and the inner wall of the outer shell 1 has a fixing cavity 6, a cleaning cavity 5 and a soaking cavity 7 sequentially opened from top to bottom; The rotating support mechanism includes four sets of supports 8 and one set of motors 9. A rotating shaft 10 is rotatably mounted on the top of the support 8. A gear 11 is fixedly mounted on the outer surface of the rotating shaft 10. A movable plate 13 is rotatably mounted in the middle of the outer surface of the rotating shaft 10. A rotating shaft 24 and a pawl 20 are rotatably mounted on the inner and outer sides of the top of the movable plate 13, respectively. A gear 25 and a support cylinder 16 are fixedly mounted on the outer surface of the rotating shaft 24. An internal gear ring 18 is meshed on the outer surface of the gear 11, and the gear 11 meshes with the gear 25. A ratchet 12 is provided on the outer ring surface of the internal gear ring 18. A fixed plate 21 is fixedly mounted on the top of the movable plate 13. A spring 22 is elastically connected between the pawl 20 and the fixed plate 21. One end of the pawl 20 abuts against the ratchet 12. This redesigned device combines wet etching and cleaning of the wafer body 19, reducing the time the wafer body 19 spends moving between processes in semiconductor manufacturing and effectively improving the device's efficiency. To achieve this, the device incorporates a cleaning chamber 5 and an immersion chamber 7 inside the housing 1 to hold the cleaning solution and etching chemical solution, allowing the wafer body 19 to be etched, cleaned, and dried in a single process within the housing 1. The wafer body 19 is driven into the housing 1 by a vacuum chuck. During immersion cleaning in the immersion chamber 7, a rotating support mechanism drives the support cylinder 16 to rotate and retract towards the inner wall of the fixed cavity 6, facilitating the downward movement of the wafer body 19. After the wafer body 19 is etched, it enters the immersion chamber 7 and makes room for the wafer body 19 to be etched. The wafer body 19 is then lifted upward by the vacuum suction cup and telescopic component to the top of the support cylinder 16. The support mechanism is then reversed and rotated so that the support cylinder 16 is reset and re-clamped on the outer surface of the wafer body 19, providing rotational support and abutment friction clamping. At this time, the cleaning fluid from the cleaning chamber 5 is pumped to the nozzle 17 by the pump 4 located outside the outer shell 1. The cleaning fluid is sprayed upward by the nozzle 17 to the bottom of the wafer body 19 to complete the cleaning. The support cylinder 16 can also drive the wafer body 19 to rotate, "throwing" the cleaning fluid and impurities in the cleaning solution into the interior of the fixed chamber 6 through the centrifugal motion generated by the rotation, and finally flowing back into the cleaning chamber 5.

[0022] Then, in order to realize the function of retracting and extending the rotating support mechanism and driving the wafer body 19 to rotate at high speed, this device is provided with a support 8 for supporting the entire mechanism. There are four sets of supports, which are fixed at the bottom of the fixed cavity 6. A set of motors 9 are also installed at the bottom of the support 8 on the right side. The motors 9 mainly provide rotational power for the entire mechanism. The motors 9 drive the rotating shaft 10 and gear 11 to rotate clockwise, causing the internal gear ring 18 and ratchet 12 to rotate clockwise, and driving the pawl 20 and the movable plate 13 to rotate clockwise around the axis of the rotating shaft 10. Finally, the support cylinder 16 is driven to rotate towards the inner side of the fixed cavity 6, realizing the function of retracting and hiding the support cylinder 16. At this time, the wafer body 19 can enter the immersion cavity 7 through the support cylinder 16 for etching.

[0023] Finally, by reversing the motor 9, the rotating shaft 10 and gear 11 drive the internal gear ring 18 and ratchet 12 to rotate counterclockwise. The spring 22 applies a pulling force to the pawl 20, causing the outer surfaces of the pawl 20 and ratchet 12 to abut against each other. As the internal gear ring 18 and ratchet 12 rotate counterclockwise, the movable plate 13 has no rotational resistance. The movable plate 13 gradually resets under the drive of the pawl 20 and ratchet 12, and is abutted and limited by the limiting plate 23. At this time, the positions of the movable plate 13 and pawl 20 remain unchanged, and the support cylinder 16 can support and roll the wafer body 19 after resetting. At this time, the motor 9 drives the other three sets of gears 11 and 25 to rotate through gear 11 and internal gear ring 18, realizing the high-speed rotation of the wafer body 19.

[0024] In this embodiment, the cleaning mechanism includes a transfer chamber 2, a connecting pipe 3 and a pump 4 disposed on the outside of the outer shell 1. The transfer chamber 2 is fixedly connected to the bottom of the upper end of the outer shell 1. The two ends of the transfer chamber 2 are respectively connected to the transfer chamber 2 and the fixed cavity 6. The pump 4 is disposed on the outer surface of the connecting pipe 3. The inner cavity of the cleaning cavity 5 is filled with cleaning liquid. The bottom of the inner wall of the fixed cavity 6 is fixedly connected to multiple sets of nozzles 17 that are connected to the transfer chamber 2. like Figure 3 As shown, the cleaning fluid is located in the cleaning chamber 5, which is connected to the transfer chamber 2 and the nozzle 17 through the connecting pipe 3. It is pumped upward by the pump 4 to the transfer chamber 2 and the nozzle 17, and finally sprayed out by the nozzle 17 to act on the bottom of the wafer body 19.

[0025] In this embodiment, a motor 9 is installed at the bottom of the right support 8. The motor 9 is located outside the housing 1. The output shaft of the motor 9 is connected to the rotating shaft 10 located on the right. The wafer body 19 is placed on the top of the multiple sets of support cylinders 16. like Figure 3 As shown, the motor 9 is located outside the housing 1. After isolation, the acidic liquid and cleaning solution inside the housing 1 can prevent the motor 9 from being corroded. The wafer body 19 is placed on top of the support cylinder 16 and is rolled and supported by the support cylinder 16, which facilitates the subsequent rotation of the wafer body 19.

[0026] In this embodiment, the immersion chamber 7 is filled with an etching chemical solution. The immersion chamber 7 and the cleaning chamber 5 are arranged in concentric circles. The opening at the top of the immersion chamber 7 is larger than the diameter of the wafer body 19. like Figure 3 As shown, the soaking chamber 7 and the cleaning chamber 5 are concentrically distributed, and the design of the inner wall of the cleaning chamber 5 and the top of the soaking chamber 7 prevents the backflow of cleaning into the soaking chamber 7.

[0027] In this embodiment, a limiting plate 23 is fixedly connected to the outside of the support 8, and the outside of the movable plate 13 abuts against the limiting plate 23. The limiting plate 23 prevents the movable plate 13 from rotating counterclockwise around the axis of the rotating shaft 10. like Figure 5 , Figure 6 As shown, the limiting plate 23 is used to restrict the movable plate 13 from rotating counterclockwise around the axis of the rotating shaft 10. When the movable plate 13 rotates and coincides with the support 8, the support cylinder 16 is reset and can provide support, rolling contact limiting and other functions for the wafer body 19.

[0028] In this embodiment, the four sets of supports 8, movable plate 13, gear 11 and support cylinder 16 are all circumferentially distributed, and the inner side of the internal gear ring 18 meshes with the four sets of gear 11 at the same time. like Figure 5 , Figure 6 As shown, the four sets of gears 11 achieve synchronous meshing transmission through the outer internal gear ring 18, and synchronize the movement of the four sets of movable plates 13 and the support cylinder 16. The inner side of the internal gear ring 18 is provided with teeth to perform the synchronous meshing transmission function.

[0029] In this embodiment, the support cylinder 16 is made of rubber, the outer surface of the wafer body 19 rotates and abuts against the top of the outer surface of the support cylinder 16, and the bottom of the wafer body 19 abuts against the top of the middle protrusion of the support cylinder 16. like Figure 3 As shown, the rubber support cylinder 16 can provide buffer and support for the wafer body 19. The outer surfaces of the four sets of support cylinders 16 roll against the wafer body 19 and generate friction, making the rotation of the wafer body 19 more stable. The rotating wafer body 19 also eliminates cleaning dead corners.

[0030] In this embodiment, the nozzles 17 are configured as four groups and are distributed equidistantly in the interior of the fixed cavity 6. The four groups of nozzles 17 and the four groups of supports 8 are staggered at 45°. The upper end of the nozzles 17 is inclined toward the bottom circle of the wafer body 19. like Figure 3 , Figure 5 As shown, the upward-sloping nozzle 17 can spray cleaning fluid onto the surface of the wafer body 19 to complete the cleaning, while the four sets of circumferentially evenly distributed nozzles can help the cleaning fluid to more comprehensively cover the surface of the wafer body 19.

[0031] Working principle: When this device is working: First, as follows Figure 1 , Figure 5 and Figure 6As shown, the motor 9 is started, which drives the rotating shaft 10 and gear 11 located on the right to rotate clockwise. At the same time, it drives the internal gear ring 18 and ratchet 12 to rotate clockwise, so that the pawl 20 is driven to rotate with the ratchet 12. At this time, the pawl 20 can drive the movable plate 13 to rotate clockwise around the axis of the rotating shaft 10, and drive the support cylinder 16 to extend and rotate into the fixed cavity 6. The internal gear ring 18 and ratchet 12 can simultaneously drive the other three sets of supports 8, movable plate 13, rotating shaft 10, gear 11, pawl 20 and support cylinder 16 to rotate. The four sets of support cylinders 16 can synchronously maintain the rotation and concealment into the fixed cavity 6. Then, the wafer body 19 is driven into the inner cavity of the outer casing 1 by a vacuum chuck or jig, such as... Figure 3 , Figure 6 As shown, after the four sets of support cylinders 16 retract inward, the downward movement of the wafer body 19 is no longer hindered. The wafer body 19 can directly enter the interior of the immersion chamber 7 and be immersed in the chemical solution to complete the etching process. The etched surface of the wafer body 19 is the downward side. After etching is completed, the wafer body 19 is driven upward by the telescopic component with the vacuum suction cup and leaves the immersion chamber 7. Finally, proceed with the cleaning step. Start motor 9 and reverse it to drive the right-side rotating shaft 10 and gear 11 to rotate counterclockwise, as shown below. Figure 5 , Figure 6As shown, the internal gear ring 18 and ratchet 12, which are driven to rotate counterclockwise, utilize the adaptive contact between themselves and the pawl 20 and the elastic force of the spring 22 to drive the movable plate 13 to rotate counterclockwise around the axis of the rotating shaft 10. At this time, the movable plate 13 can return to its original position and abut against the limiting plate 23 for limitation. At this time, the ratchet 12 continues to rotate, while the pawl 20 is limited by the limiting plate 23 and begins to repeatedly slide in contact with the ratchet 12. The spring 22 elastically pulls and shuts off the motor 9. At this time, the wafer body 19 can be placed between the tops of the four sets of support cylinders 16. Subsequently, the motor 9 is restarted and it drives the rotating shaft 10 and gear 11 to rotate counterclockwise, driving the gear 2 15, rotating shaft 2 14 and support cylinder 16 to rotate clockwise at high speed. Finally, it drives the wafer located on the top of the support cylinder 16. The wafer body 19 rotates at high speed. The wafer body 19 is kept in a limited and stable position by the friction between it and the support cylinder 16. Finally, the pump 4 is started and the cleaning fluid in the cleaning chamber 5 is pumped upward to the transfer chamber 2 through the connecting pipe 3. It is then sprayed obliquely upward to the bottom of the wafer body 19 through four sets of nozzles 17. The rolling friction between the wafer body 19 and the support cylinder 16 counteracts the spray pressure from the nozzles 17. The bottom of the wafer body 19 is cleaned by the cleaning fluid spray. At the same time, as the wafer body 19 moves at high speed, it undergoes centrifugal motion towards the inside of the fixed cavity 6. Only a very small amount of cleaning fluid remains in the soaking cavity 7. The rest of the cleaning fluid is "thrown" into the inside of the fixed cavity 6 by the centrifugal force generated by the high speed rotation of the wafer body 19, and finally flows back to the cleaning chamber 5 along the inner wall of the outer shell 1.

[0032] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A single-wafer rotary cleaning device with immersion, cleaning, and etching functions, characterized in that, include: The outer shell (1) is provided with a cleaning mechanism on its outer side. The inner wall of the outer shell (1) is provided with a fixing cavity (6), a cleaning cavity (5) and a soaking cavity (7) from top to bottom. The rotating support mechanism includes four sets of supports (8) and one set of motors (9). A rotating shaft (10) is rotatably mounted on the top of each support (8). A gear (11) is fixedly mounted on the outer surface of the rotating shaft (10). A movable plate (13) is rotatably mounted in the middle of the outer surface of the rotating shaft (10). A rotating shaft (14) and a pawl (20) are rotatably mounted on the inner and outer sides of the top of the movable plate (13), respectively. A gear (11) is fixedly mounted on the outer surface of the rotating shaft (14). Gear 2 (15) and support cylinder (16), the outer surface of gear 1 (11) is provided with an internal gear ring (18) meshing, and gear 1 (11) meshes with gear 2 (15), the outer ring surface of the internal gear ring (18) is provided with a ratchet (12), the top of the movable plate (13) is fixedly installed with a fixed plate (21), the pawl (20) and the fixed plate (21) are elastically connected with a spring (22), and one end of the pawl (20) abuts against the ratchet (12).

2. The single-wafer rotary cleaning equipment with immersion and cleaning / etching functions according to claim 1, characterized in that, The cleaning mechanism includes a transfer chamber (2), a connecting pipe (3), and a pump (4) disposed on the outside of the outer shell (1). The transfer chamber (2) is fixedly connected to the bottom of the upper end of the outer shell (1). The two ends of the transfer chamber (2) are respectively connected to the transfer chamber (2) and the fixed cavity (6). The pump (4) is disposed on the outer surface of the connecting pipe (3). The inner cavity of the cleaning cavity (5) is filled with cleaning liquid. The bottom of the inner wall of the fixed cavity (6) is fixedly connected to multiple sets of nozzles (17) connected to the transfer chamber (2).

3. The single-wafer rotary cleaning equipment with immersion and cleaning / etching functions according to claim 2, characterized in that, A motor (9) is installed at the bottom of the support (8) on the right side. The motor (9) is located outside the housing (1). The output shaft of the motor (9) is connected to the rotating shaft (10) on the right side. A wafer body (19) is placed on the top of the multiple sets of support cylinders (16).

4. The single-wafer rotary cleaning equipment with immersion and cleaning / etching functions according to claim 3, characterized in that, The immersion chamber (7) is filled with an etching chemical solution. The immersion chamber (7) and the cleaning chamber (5) are arranged in concentric circles. The opening at the top of the immersion chamber (7) is larger than the diameter of the wafer body (19).

5. The single-wafer rotary cleaning equipment with immersion and cleaning / etching functions according to claim 4, characterized in that, The support (8) is fixedly connected to a limiting plate (23), and the outer side of the movable plate (13) abuts against the limiting plate (23). The limiting plate (23) prevents the movable plate (13) from rotating counterclockwise around the axis of the rotating shaft (10).

6. The single-wafer rotary cleaning equipment with immersion and cleaning / etching functions according to claim 5, characterized in that, The four sets of supports (8), movable plates (13), gears (11) and support cylinders (16) are all circumferentially distributed, and the inner side of the internal gear ring (18) meshes with the four sets of gears (11) at the same time.

7. The single-wafer rotary cleaning equipment with immersion and cleaning / etching functions according to claim 6, characterized in that, The support cylinder (16) is made of rubber. The outer surface of the wafer body (19) rotatably abuts against the top of the outer surface of the support cylinder (16), and the bottom of the wafer body (19) abuts against the top of the middle protrusion of the support cylinder (16).

8. The single-wafer rotary cleaning equipment with immersion and cleaning / etching functions according to claim 7, characterized in that, The nozzles (17) are arranged in four groups and are distributed equidistantly in the interior of the fixed cavity (6). The four groups of nozzles (17) and the four groups of supports (8) are staggered at 45°. The upper end of the nozzles (17) is inclined toward the bottom circle of the wafer body (19).

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