Novel SMIF lead screw transmission system and method, storage medium and electronic equipment

By employing a high-precision ball screw and servo motor drive system in the SMIF transfer structure, the problem of ball screw system jitter was solved, achieving high-precision wafer transfer and equipment stability, and improving production efficiency and wafer protection.

CN122094447APending Publication Date: 2026-05-26GUANGDONG XINYUENENG SEMICON CO LTD
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Patent Information

Application Number
CN202512019106.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-30
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing SMIF transmission structures, the lead screw system is susceptible to vibration, insufficient preload, load changes, and other factors, which can cause vibration during operation, affecting transmission and positioning accuracy, and even causing damage to the wafer surface or wear on the equipment.

Method used

High-precision ball screws are used to replace traditional through screws. Combined with servo motor drive and integrated reducer, motor and driver design, the screw structure is optimized through coupling and bearing mounting to achieve high stability and low vibration.

Benefits of technology

It improves the stability and positioning accuracy during wafer transport, reduces deformation and jitter caused by load changes, and enhances the operational reliability and production efficiency of the equipment.

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Abstract

The invention discloses a novel SMIF lead screw transmission system which comprises a shell of a groove structure. The movement part comprises a first movement assembly and a second movement assembly, the first movement assembly is arranged on the upper portion of the shell and fixed to a bottom plate of the shell, and the second movement assembly is arranged on the lower portion of the first movement assembly and fixed to a bottom plate of the shell; the second movement assembly is driven by the first movement assembly to do up-down linear movement along the inner wall of the shell, and the first movement assembly is driven by a servo motor; and the SMIF lead screw adopts a ball screw and is arranged between the first movement assembly and the second movement assembly, and the first movement assembly drives the second movement assembly to convey wafers through the ball screw. The high-precision ball screw is adopted to replace a traditional penetrating screw, the ball screw is in rolling friction through line contact, higher bearing capacity and impact resistance are achieved, and load stress is effectively dispersed.
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