Semiconductor package assembly with water cooling system

Abstract

The invention provides a semiconductor packaging assembly. The semiconductor packaging assembly comprises a substrate; an interposer mounted on the front surface of the substrate via a set of interconnect structures; at least one front-side semiconductor element mounted on a front surface of the interposer; at least one back-side semiconductor element mounted on a back surface of the interposer, where the at least one back-side semiconductor element is spaced apart from the substrate by the set of interconnect structures to define a gap therebetween; a backside cooling device mounted in the gap between the at least one backside semiconductor element and the substrate, where the backside cooling device is thermally coupled to the at least one backside semiconductor element; and a front side cooling device mounted on the at least one front side semiconductor element and thermally coupled to the at least one front side semiconductor element.

Description

Technical Field

[0001] This application generally relates to semiconductor technology, and more specifically, to semiconductor packaging components having a water cooling system, and methods for manufacturing semiconductor packaging components. Background Technology

[0002] The semiconductor industry has consistently faced complex integration challenges as consumers demand smaller, faster, and higher-performing electronics, packing increasing functionality into single devices. In some semiconductor packages, package-in-package (PiP) or package-on-package (PoP) processes are used, combining two or more integrated circuit (IC) packages together. PiP or PoP devices can utilize space more efficiently and reduce the length of signal paths between packages. In a typical PiP or PoP device, one or more pre-molded semiconductor packages can be mounted onto another semiconductor package via an interposer or other similar structure.

[0003] However, it should be noted that certain electronic components in PiP or PoP devices, such as logic circuit chips, may generate significant heat during operation. Due to the compact packaging structure of PiP or PoP devices, this heat may not be effectively dissipated to the external environment. Therefore, further improvements are needed in semiconductor package assemblies with integrated electronic components. Summary of the Invention

[0004] The objective of this application is to provide a semiconductor packaging component with a water cooling system.

[0005] According to one aspect of this application, a semiconductor packaging assembly is disclosed. The semiconductor packaging assembly includes: a substrate; an interposer mounted on a front surface of the substrate via a set of interconnect structures; at least one front-side semiconductor element mounted on the front surface of the interposer; at least one rear-side semiconductor element mounted on a rear surface of the interposer, wherein the at least one rear-side semiconductor element is spaced apart from the substrate by the set of interconnect structures to define a gap therebetween; a rear-side cooling device disposed in the gap between the at least one rear-side semiconductor element and the substrate, wherein the rear-side cooling device is thermally coupled to the at least one rear-side semiconductor element; and a front-side cooling device disposed on and thermally coupled to the at least one front-side semiconductor element.

[0006] According to another aspect of this application, a method for fabricating a semiconductor package assembly is provided. The method includes: providing an interposer package including an interposer layer, at least one front-side semiconductor element mounted on a front surface of the interposer layer, a front-side cooling device mounted on and thermally coupled to the at least one front-side semiconductor element, and at least one rear-side semiconductor element mounted on a rear surface of the interposer layer, and a set of interconnect structures; wherein the height of the set of interconnect structures is greater than the height of the at least one rear-side semiconductor element; providing a substrate having a rear-side cooling device on its front surface; and mounting the interposer package onto the substrate via the set of interconnect structures and the rear-side cooling device to thermally couple the rear-side cooling device to the at least one rear-side semiconductor element.

[0007] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and not intended to limit the invention. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with this specification, serve to explain the principles of the invention. Attached Figure Description

[0008] The accompanying drawings referenced herein form part of this specification. Unless the detailed description clearly indicates otherwise, the features shown in the drawings illustrate only some embodiments of this application, and not all embodiments of this application, and readers of this specification should not draw the contrary inferences.

[0009] Figure 1A A semiconductor packaging assembly according to an embodiment of this application is shown.

[0010] Figure 1B yes Figure 1A The diagram shows a top view of the interposer backside layout of the semiconductor package assembly.

[0011] Figure 1C yes Figure 1A A perspective view of the rear cooling device of the semiconductor package assembly shown.

[0012] Figure 2 A semiconductor packaging assembly according to another embodiment of this application is shown.

[0013] Figure 3 A semiconductor packaging assembly according to another embodiment of this application is shown.

[0014] Figures 4A to 4F A method for fabricating a semiconductor package assembly according to embodiments of this application is shown.

[0015] The same reference numerals will be used throughout the accompanying drawings to refer to the same or similar parts. Detailed Implementation

[0016] The following detailed description of exemplary embodiments of this application refers to the accompanying drawings, which form a part of the description. The drawings illustrate specific exemplary embodiments in which this application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art can further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and the scope of the embodiments of this application is defined only by the appended claims.

[0017] In this application, unless otherwise specified, the use of the singular includes the plural. In this application, unless otherwise specified, the use of "or" means "and / or". Furthermore, the use of the term "including" and other forms such as "includes" and "included" is not restrictive. Additionally, unless otherwise specified, terms such as "element" or "part" cover elements and parts that include one unit, as well as elements and parts that include more than one sub-unit. Furthermore, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0018] As used herein, for ease of description, spatially relative terms such as “below,” “under,” “above,” “over,” “upper,” “upper,” “lower,” “left,” “right,” “vertical,” “horizontal,” and “side” may be used to describe the relationship between one element or feature and another element or feature as shown in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, spatially relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein shall be interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, it may be directly connected to or coupled to the other element, or there may be intermediate elements present.

[0019] As previously mentioned, conventional semiconductor packaged assemblies may not exhibit satisfactory heat dissipation performance due to their compact structure and the significant heat generated by the electronic components encapsulated within them. To address this heat dissipation issue, the inventors of this application have conceived of a method for incorporating a cooling system (e.g., a water cooling system) into the semiconductor packaged assembly to provide cooling for the internal electronic components. In some embodiments, the cooling system may include a rear-side cooling pipe and a front-side cooling pipe mounted on both sides of the interposer module of the packaged assembly. The rear-side and front-side cooling pipes may be in fluid communication with each other and further in fluid communication with a heat sink to allow heat transfer from the internal electronic components to the external environment. Alternatively, a heat sink or other suitable passive heat dissipation device, other than the front-side cooling pipe, may be mounted on the front side of the interposer module. In this manner, the heat dissipation performance of the semiconductor packaged assembly can be significantly improved.

[0020] Figure 1A A semiconductor packaging assembly 100 according to an embodiment of this application is shown. For example... Figure 1A As shown, the semiconductor package assembly 100 includes two cooling devices, each thermally coupled to a set of semiconductor elements mounted on one side of the interposer layer of the semiconductor package assembly 100. When the two cooling devices are coupled to the two sets of semiconductor elements respectively, the heat generated by the semiconductor elements within the semiconductor package assembly 100 can be effectively dissipated to the outside of the package assembly. It should be noted that, although in Figure 1A Four semiconductor components are shown as examples, but more semiconductor components can be integrated into the semiconductor package 100 as needed.

[0021] like Figure 1A As shown, the semiconductor package assembly 100 includes a substrate 110 and an interposer 150 mounted on the front surface of the substrate 110 via a set of interconnect structures 112. The interconnect structures 112 provide both mechanical support and electrical connection to the interposer 150. At least one front-side semiconductor element 120 is mounted on the front surface of the interposer 150, and at least one rear-side semiconductor element 160 is mounted on the rear surface of the interposer 150. Since the set of interconnect structures 112 defines a gap between the substrate 110 and the interposer 150, the at least one rear-side semiconductor element 160 mounted on the rear surface of the interposer 150 is spaced apart from the substrate 110, the gap typically having the same height as the height difference between the interconnect structures 112 and the rear-side semiconductor element 160, or the height difference between the highest element in the interconnect structures 112 and the rear-side semiconductor element 160. It is understood that during operation, the semiconductor elements 120 and 160 can generate heat, which needs to be dissipated outside the semiconductor package assembly 100.

[0022] Specifically, a rear-side cooling device 130 is mounted in the gap between the substrate 110 and the rear-side semiconductor element 160, and is thermally coupled to at least one rear-side semiconductor element 160 via, for example, a thermal interface material (TIM) layer. The rear-side cooling device 130 provides a heat dissipation path through the gap from the rear-side semiconductor element 160 to the external environment. Furthermore, a front-side cooling device 140 is mounted on the front surface of at least one front-side semiconductor element 120 via a TIM layer. Unlike the rear-side cooling device 130, which is embedded within the semiconductor package assembly 100, the front-side cooling device 140 can be mounted at the very top of the entire semiconductor package assembly 100 and is therefore exposed to the external environment. Thus, the front-side cooling device 140 may provide a shorter heat dissipation path compared to the heat dissipation path provided by the rear-side cooling device 130.

[0023] Still referencing Figure 1A A rear encapsulant 172 is formed on the rear surface of the interposer 150 to at least partially encapsulate the interconnect structure 112 and at least one rear semiconductor element 160. The rear encapsulant 172 can provide structural support for the interconnect structure 112 and at least one rear semiconductor element 160. Specifically, the rear encapsulant 172 can expose the front surfaces of one or more rear semiconductor elements 160, i.e., only one or more lateral surfaces of the rear semiconductor elements 160 are covered by the rear encapsulant 172. The exposed front surfaces of one or more rear semiconductor elements 160 provide an interface for heat transfer or dissipation to the rear cooling device 130 and further to the external space, as will be described later. In some embodiments, the rear encapsulant 172 can form an excess of molding material on at least one rear semiconductor element 160, which can be later removed (e.g., etched) to expose the front surface of at least one rear semiconductor element 160. Preferably, the exposed surfaces of the plurality of rear-side semiconductor elements 160 may be at the same height relative to the rear surface of the interposer 150 to facilitate mounting of the rear-side cooling device 130 with the rear-side semiconductor elements and the interposer. In some embodiments, the rear-side encapsulant 172 may be made partly or entirely of a polymer composite material, such as a filled epoxy resin, a filled epoxy acrylate, or a polymer with suitable fillers.

[0024] Similar to the back-side encapsulant 172, the semiconductor package assembly 100 also includes a front-side encapsulant 174 formed on the front surface of the interposer 150 to at least partially encapsulate at least one front-side semiconductor element 120. As described above, the exposed front surface of at least one front-side semiconductor element 120 provides an interface for heat transfer or dissipation to the front-side cooling device 140 and further to the external space, as will be described later. At least one front-side semiconductor element 120 may be mounted on the front surface of the interposer 150 via solder bumps or similar structures. In some other embodiments, in addition to these elements on the front surface of the interposer 150, one or more other electronic components (e.g., resistors, inductors, capacitors, or other similar discrete devices or smaller semiconductor elements) may be mounted on the front surface of the interposer 150.

[0025] At least one front-side semiconductor element 120 and at least one rear-side semiconductor element 160 may comprise any of various types of semiconductor dies, semiconductor packages, or discrete devices. For example, at least one front-side semiconductor element 120 and at least one rear-side semiconductor element 160 may comprise logic circuit chips such as central processing units (CPUs) or graphics processing units (GPUs), memory devices such as high-bandwidth memory (HBM), digital signal processors (DSPs), radio frequency (RF) circuits, wireless baseband system-on-chip (SoC) processors, sensors, application-specific integrated circuits (ASICs), etc. At least one front-side semiconductor element 120 and at least one rear-side semiconductor element 160 may be passive components, such as resistors, capacitors, inductors, switches, or any other suitable electronic devices. Interposer 150 may provide support and connectivity for electronic components and devices mounted thereon. For example, conductive lines, such as redistribution layers, may be formed in interposer 150, wherein exposed patterns serve as conductive patterns that can connect electronic components and devices.

[0026] As previously described, the rear-side cooling device 130 is thermally coupled to at least one rear-side semiconductor element 160. In an embodiment, the rear-side cooling device 130 includes a rear-side cooling pipe 132 for containing a coolant liquid, such as water, flowing therein to transfer heat generated by the at least one rear-side semiconductor element 160 to the external environment of the semiconductor package assembly 100. A pipe 134a is used to couple the outlet of the rear-side cooling pipe 132 to a pump 136, and another pipe 134b is used to couple the inlet of the rear-side cooling pipe 132 to the pump 136 or another pump. Depending on the configuration of the pump 136, pipe 134b can carry coolant liquid into the rear-side cooling pipe 132, and pipe 134a can carry coolant liquid away from the rear-side cooling pipe 132, thereby circulating the coolant liquid within pipes 134a and 134b and within the rear-side cooling pipe 132. In some embodiments, the rear cooling pipe 132 and pipes 134a and 134b may comprise polyvinyl chloride (PVC), polyurethane (PU), polyethylene terephthalate (PETG), metals such as copper or aluminum, etc. In some embodiments where pipes 132, 134a, and 134b are made of metal or similar conductive materials, electrical isolation between the pipes and the interconnect structure 112, conductive patterns, and other conductive structures or components can be achieved, for example, by adding insulating material or by routing and placing the pipes.

[0027] refer to Figure 1B Provided Figure 1A The diagram shows a top view of the rear-side layout of the interposer 150. It can be understood that the rear-side layout of the interposer 150 can be similar to the front-side layout of the substrate 110, since the interposer and substrate are aligned and connected to each other via interconnect structures. Specifically, the set of interconnect structures 112 is mounted on the interposer 150 and can be arranged around at least one rear-side semiconductor element 160, and therefore does not need to be in direct contact with the rear-side cooling device 132. Furthermore, the rear-side cooling device 130 can have an enlarged portion close to the rear-side semiconductor element 160 for better thermal communication with it.

[0028] refer to Figure 1C A 3D view of the rear cooling pipe 132 is provided. Figure 1A and 1CAs shown, the rear cooling pipe 132 includes a heat exchange portion 132-1 and a first guide portion 132-2 and a second guide portion 132-3 on two opposite sides of the heat exchange portion 132-1. The heat exchange portion 132-1 can be horizontal with the interposer when mounted to it. The first guide portion 132-2 and the second guide portion 132-3 can be, for example, perpendicular to the interposer and the heat exchange portion 132-1. Specifically, the heat exchange portion 132-1 can have a rectangular shape, corresponding to the shape or layout of the at least one rear semiconductor element 160. It is understood that the heat exchange portion 132-1 can have other shapes, such as a Z-shape or a spiral shape. In some embodiments, the rear cooling pipe 132 can have the same height as the gap between the rear semiconductor element 160 and the substrate 110. Therefore, the substrate 110 and the at least one rear semiconductor element 160 can be thermally coupled to the lower and upper surfaces of the heat exchange portion 132-1 of the rear cooling pipe, respectively. However, in some other embodiments, the substrate 110 may not be in direct contact with the rear cooling pipe 132 because there may be no heat-generating elements requiring heat dissipation mounted on the interposer. Furthermore, the first guide portion 132-2 and the second guide portion 132-3 are in fluid communication with the heat exchange portion 132-1, thereby serving as liquid guides between the heat exchange portion 132-1 and the pipes 134a and 134b. The guide portions 132-2 and 132-3 may have a smaller width than the heat exchange portion 132-1, so that they do not occupy too much area of ​​the interposer 150, which may be necessary for mounting the interconnect structure 112. Specifically, the first guide portion 132-2 may serve as an outlet for the rear cooling pipe 132 to discharge coolant liquid from the heat exchange portion 132-1 to dissipate heat to the external environment, such as to a coolant pool or tank, and the second guide portion 132-3 may serve as an inlet for the rear cooling pipe 132 to receive coolant liquid at a lower temperature.

[0029] However, the rear cooling pipe 132 is not limited to Figure 1B and 1C The structure and configuration are shown in the figure. In some other embodiments, the heat exchange portion 132-1 may include multiple branches extending between the first guide portion 132-2 and the second guide portion 132-3, or have a zigzag shape that meanders between the first guide portion 132-2 and the second guide portion 130-3. It is understood that the cooling pipe 132 may adopt other suitable shapes to increase its contact area with the at least one rear semiconductor element 160, or to further increase its contact area with the substrate 110.

[0030] Continue to refer to Figure 1AThe interconnect structure 112 is formed between the substrate 110 and the interposer 150 to electrically connect electronic components mounted thereon. In embodiments, the interconnect structure 112 may be a solder bump, while in some alternative embodiments, the interconnect structure 112 may be other interconnect components, such as metal pillars or e-bar modules. In addition to electrically connecting the substrate 110 and the interposer 150 to each other, the interconnect structure 112 may also provide mechanical support therebetween. Specifically, the interconnect structure 112 may extend through the back-side encapsulant 172 and protrude from the back surface of the back-side encapsulant 172 (i.e., the back surface of at least one back-side semiconductor element 160). In this way, a gap can be formed between at least one back-side semiconductor element 160 and the substrate 110. In other words, the interconnect structure 112 is arranged to allow a back-side cooling device 130 to be mounted in the gap for filling and flow of coolant, which will be described in detail below.

[0031] It is understood that when at least one rear-side semiconductor element 160 is mounted on the interposer 150, they can have different heights, with the highest one or more rear-side semiconductor elements potentially needing to be cooled by the rear-side cooling device 130 and thus exposed, while other rear-side semiconductor elements generating less heat can be completely encapsulated. Furthermore, in some embodiments, the position of the semiconductor elements can vary between at least one front-side semiconductor element 120 and at least one rear-side semiconductor element 160, depending on the specific electronic component encapsulated in the package, or specifically, the corresponding maximum junction temperature acceptable to the electronic component. For example, an HBM element or module can withstand a maximum junction temperature of 85 to 95 degrees Celsius, while a general-purpose logic die can withstand a maximum junction temperature of 120 degrees Celsius. In this case, the HBM element or module can be positioned closer to the inlet of the rear-side cooling pipe 132, while the general-purpose logic die can be positioned further away from the inlet. Thus, after flowing through the HBM element or similar relatively low-temperature component, the coolant liquid can further flow through the logic die or similar relatively high-temperature component and absorb heat from it.

[0032] Still referencing Figure 1A Two valves 131 can be respectively located at the inlet and outlet of the rear cooling pipe 132 to regulate the flow rate of the coolant liquid flowing within the rear cooling pipe 132. For example, when the semiconductor package assembly 100 operates at higher power, i.e., when more heat can be generated during operation, valve 131 can be adjusted to increase the flow rate of the coolant liquid. Conversely, when the semiconductor package assembly 100 operates at lower power, i.e., when less heat can be generated during operation, valve 131 can be adjusted to decrease the flow rate of the coolant liquid. Figure 1AAs shown, radiator 138 is coupled to pump 136 to cool the coolant liquid as it flows out through pump 136. Radiator 138 can be a passive or active radiator that can cool the coolant liquid to a lower temperature, such as room temperature. Therefore, the coolant liquid in the rear cooling pipe 132 can be effectively circulated (by pump 136 and radiator 138) through pump 136. Figure 1A (The arrow in the image indicates) and cooling.

[0033] As previously described, at least one front-side semiconductor element 120 may be exposed from the front-side encapsulant 174. In some embodiments, the front-side cooling device 140 may include a heat sink, such as a metal plate, attached to at least one front-side semiconductor element 120 via a TIM layer to allow heat exchange from the front-side semiconductor element 120 to the external environment. In this way, heat generated by the front-side semiconductor element 120 and the rear-side semiconductor element 160 can be simultaneously transferred away from the semiconductor package assembly 100.

[0034] The substrate 110 has a front surface 110a and a rear surface 110b opposite to the front surface 110a. Conductive bumps 190 can be mounted on the rear surface 110b of the substrate 110 to allow the entire semiconductor package assembly 100 to be mounted on or connected to an external device when needed. For example, the substrate 110 may include a printed circuit board (PCB), a carrier substrate, a semiconductor substrate with electrical interconnects, a ceramic substrate, a laminated interposer, a laminated interposer, a lead frame, or other suitable substrate. The substrate 110 may include any structure on which or in which an integrated circuit system can be fabricated. In some examples, the substrate 110 may include a redistribution structure having one or more dielectric layers and one or more conductive layers between and through the dielectric layers. The conductive layers may define pads, traces, and plugs through which electrical signals or voltages can be distributed horizontally and vertically across the redistribution structure.

[0035] exist Figure 1A In the example shown, the conductive bump 190 is depicted as a solder bump, but this application is not limited thereto. In some other embodiments, the conductive bump 190 may include conductive pillars, copper balls, etc. When the semiconductor package assembly 100 is mounted on an external device or substrate, such as a printed circuit board (PCB), the conductive bump 190 can be used to electrically connect the semiconductor package assembly 100 to the external device or substrate.

[0036] Can be Figure 1A The semiconductor packaging component 100 shown has been modified in various ways. Figure 2 and 3 Two semiconductor packaging assemblies 200 and 300 according to other embodiments of this application are shown respectively, wherein... Figure 1AThe semiconductor packaging component 100 shown has undergone some changes.

[0037] exist Figure 2 In the example shown, interconnect structure 212 is a solder ball extending between interposer 250 and substrate 210. Solder ball 212 may be pre-formed on interposer 250 or substrate 210 and encapsulated by back-side encapsulant 272. Interconnect structure 212 can provide mechanical support and electrical connection between interposer 250 and substrate 210. The semiconductor package assembly 200 and... will not be repeated herein. Figure 1A Similar or identical portions between the semiconductor packaging components 100 shown.

[0038] exist Figure 3 In the semiconductor package assembly 300 shown, the front cooling device mounted on the front semiconductor element 320 includes a front cooling pipe 340 for containing coolant liquid flowing therein to transfer heat generated by at least one front semiconductor element 320 to the external environment of the semiconductor package assembly 300, similar to the rear cooling pipe 332 mounted on the rear semiconductor element 360. Therefore, a set of inlet valves 341 and a set of outlet valves 342 can be in fluid communication with the front cooling pipe 340 and the rear cooling pipe 332. A pump 336 can be in fluid communication with the front cooling pipe 340 and the rear cooling pipe 332 to circulate the coolant liquid within the front cooling pipe 340 and the rear cooling pipe 332. It should be understood that although the rear cooling pipe 332 and the front cooling pipe 340 are connected by a set of pipes 334a and 334b ​​in this embodiment, other methods exist for flowing coolant liquid. For example, cooling pipes 332 and 340 can be connected to separate valves, pumps, or even separate coolant containers. In this way, the coolant liquid can flow within a fluid path including the front cooling pipe and the rear cooling pipe to dissipate the heat generated by the internal electronic components to the outside of the semiconductor package assembly 300.

[0039] Figures 4A to 4F A method for fabricating a semiconductor package assembly according to embodiments of this application is illustrated. With some modifications, the method can be used to fabricate... Figure 1A The semiconductor packaging component 100 shown may be used to manufacture Figure 2 The semiconductor packaging component 200 shown is or Figure 3 The semiconductor packaging component 300 shown is illustrated.

[0040] like Figure 4AAs shown, an interposer 450 is provided, and at least one back-side semiconductor element 460 is mounted to the interposer 450 via solder bumps. An underfill material 407 may be filled between the at least one back-side semiconductor element 460 and the interposer 450, and around the solder bumps of the at least one back-side semiconductor element 460, to enhance the attachment of the at least one back-side semiconductor element 460 to the interposer 450. Furthermore, a back-side encapsulant 472 may be formed on the interposer 450 to encapsulate at least one back-side semiconductor element 460 and a set of interconnect structures 412. For example, the back-side encapsulant 472 may be formed using injection molding or compression molding processes. In some other embodiments, the back-side encapsulant 472 may be formed using paste printing, transfer molding, liquid encapsulant molding, vacuum lamination, spin coating, or other suitable processes. For example, grinding processes and other suitable etching processes can be used to remove excess portions of the molding material of the back-side encapsulant 472 above the back surface of at least one back-side semiconductor element 460, to expose the back surface of at least one back-side semiconductor element 460 and the set of interconnect structures 412.

[0041] Next, as Figure 4B As shown, the interposer 450 can be flipped so that its front surface faces upward. At least one front-side semiconductor element 420 is mounted to the front surface of the interposer 450 via solder bumps. A front-side encapsulant 474 can be formed on the front surface of the interposer 450 to encapsulate at least one front-side semiconductor element 420. Excess portions of the molding material of the front-side encapsulant 474 above at least one front-side semiconductor element 420 can be removed.

[0042] Next, as Figure 4C As shown, a front-side cooling device 440 is stacked on the front surface of at least one front-side semiconductor element 420 via a TIM layer to cover at least one front-side semiconductor element 420. It should be noted that other forms of front-side cooling devices, besides heat sinks, can also be used, such as... Figure 3 The front cooling pipe is shown in the diagram. In this case, the front cooling pipe can be attached to at least one front semiconductor element via a pipe that allows coolant liquid to enter or exit the front cooling pipe. Figures 4A to 4C After the steps shown, the intermediary layer encapsulation 401 can be obtained.

[0043] Next, as Figure 4DAs shown, the rear cooling pipe 432 is mounted to the substrate 410, for example, via a TIM layer. In some embodiments, the rear cooling pipe 432 may be attached to the substrate 410 via an additional adhesive material. Alternatively, the rear cooling pipe 432 may be mounted to the substrate 410 via small spacers or supports, such that the rear cooling pipe 432 does not directly contact the substrate 410. In some alternative embodiments, after the rear cooling pipe 432 is mounted, an encapsulant layer or similar structure may be formed on the substrate 410 to further improve the connection between the rear cooling pipe 432 and the substrate 410. It is understood that the encapsulant layer may not occupy an area of ​​the substrate 410 where interconnect structures may be later mounted or connected. Alternatively, the encapsulant layer may be formed after the interposer package 401 is mounted to the substrate 410, similar to the underfill layer between the rear semiconductor element 460 and the substrate 410.

[0044] Next, the intermediary layer encapsulates 401 via... Figure 4E The rear cooling pipe 432 is mounted onto the substrate 410. A set of solder bumps can be formed and reflowed to form an interconnect structure 412 between the interposer 450 and the substrate 410. The interposer 450 includes a set of conductive patterns on its rear surface, which are aligned with another set of conductive patterns formed on the front surface of the substrate 410, such that the two sets of conductive patterns are electrically connected to each other through the interconnect structure 412. Subsequently, a plurality of conductive bumps 490 are formed on the rear surface of the substrate 410. Figure 4E In the example shown, the conductive bump 490 is depicted as a solder bump, but this application is not limited thereto. In some other embodiments, the conductive bump 490 may include conductive pillars, copper balls, microbumps, etc.

[0045] Next, as Figure 4F As shown, pump 436 is coupled to a semiconductor package assembly, which is in fluid communication with a rear cooling pipe 432 via cooling pipes 434a and 434b to allow coolant liquid to circulate within the rear cooling pipe 432. Additionally, a radiator 438 is coupled to pump 436 to cool the coolant liquid. Two valves 431 are installed in the rear cooling pipe 432 to regulate the flow rate of the coolant liquid within it.

[0046] exist Figures 4A to 4F After the steps shown, a semiconductor package assembly can be obtained.

[0047] The discussion herein includes numerous illustrative figures illustrating various parts of a semiconductor package assembly with a direct cooling system and methods for fabricating such a semiconductor package assembly. For clarity, these figures do not show all aspects of each example semiconductor package. Any example package provided herein may share any or all characteristics with any or all other packages provided herein.

[0048] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and alterations can be made thereto, and other embodiments may be practiced, without departing from the broader scope of the invention as set forth in the appended claims. Furthermore, other embodiments will be apparent to those skilled in the art upon consideration of the description and practice of one or more embodiments of the invention disclosed herein. Therefore, the examples in this application and herein are intended to be considered exemplary only, and the true scope and spirit of the invention are indicated by the list of exemplary claims appended.

Claims

1. A semiconductor packaging component, characterized in that, include: substrate; An interposer layer is mounted on the front surface of the substrate via a set of interconnect structures; At least one front-side semiconductor element, said front-side semiconductor element being mounted on the front surface of the interposer layer; At least one rear-side semiconductor element is mounted on the rear surface of the interposer, wherein the at least one rear-side semiconductor element is spaced apart from the substrate by the set of interconnect structures to define a gap therebetween; A rear-side cooling device is installed in the gap between the at least one rear-side semiconductor element and the substrate, wherein the rear-side cooling device is thermally coupled to the at least one rear-side semiconductor element; as well as A front cooling device is mounted on and thermally coupled to the at least one front semiconductor element.

2. The semiconductor packaging assembly according to claim 1, characterized in that, The semiconductor packaging assembly further includes: A back-side encapsulant is formed between the interposer and the substrate to at least partially encapsulate the set of interconnect structures and the at least one back-side semiconductor element.

3. The semiconductor packaging assembly according to claim 1, characterized in that, The semiconductor packaging assembly further includes: A front encapsulating agent is formed on the front surface of the interposer to at least partially encapsulate the at least one front semiconductor element.

4. The semiconductor packaging assembly according to claim 1, characterized in that, The rear cooling device is further thermally coupled to the substrate, and the rear cooling device is thermally coupled to the substrate and the at least one rear semiconductor element via a thermal interface material.

5. The semiconductor packaging assembly according to claim 1, characterized in that, The rear-side cooling device includes a rear-side cooling pipe for containing a coolant liquid flowing therein to transfer heat generated by the at least one rear-side semiconductor element to the external environment of the semiconductor package assembly.

6. The semiconductor packaging assembly according to claim 5, characterized in that, The semiconductor packaging assembly further includes: A pump, which is in fluid communication with the rear cooling pipe to circulate the coolant liquid within the rear cooling pipe; and A radiator, which is in fluid communication with the pump to cool the coolant liquid.

7. The semiconductor packaging assembly according to claim 5, characterized in that, The front cooling device includes a front cooling pipe for containing a coolant liquid flowing therein to transfer heat generated by the at least one front semiconductor element to the external environment of the semiconductor package assembly.

8. The semiconductor packaging assembly according to claim 7, characterized in that, Also includes: A pump, which is in fluid communication with the front cooling pipe and the rear cooling pipe, so as to circulate the coolant liquid within the front cooling pipe and the rear cooling pipe; as well as A radiator, which is in fluid communication with the pump to cool the coolant liquid.

9. The semiconductor packaging assembly according to claim 5, characterized in that, The at least one rear-side semiconductor element includes a logic circuit semiconductor element and a memory circuit semiconductor element, wherein the memory circuit semiconductor element is located upstream of the logic circuit semiconductor element relative to the rear-side cooling pipe.

10. The semiconductor packaging assembly according to claim 1, characterized in that, The front cooling device includes a heat sink attached to the at least one front semiconductor element.

11. A method for forming a semiconductor package assembly, characterized in that, The method includes: An interposer package is provided, the interposer package including an interposer, at least one front-side semiconductor element mounted on a front surface of the interposer, a front-side cooling device mounted on and thermally coupled to the at least one front-side semiconductor element, and at least one rear-side semiconductor element mounted on a rear surface of the interposer and a set of interconnect structures; wherein the height of the set of interconnect structures is greater than the height of the at least one rear-side semiconductor element; Provides a substrate having a rear-side cooling device on its front surface; and The interposer is packaged and mounted onto the substrate via the set of interconnect structures and the rear-side cooling device to thermally couple the rear-side cooling device to the at least one rear-side semiconductor element.

12. The method according to claim 11, characterized in that, Providing intermediary layer encapsulation further includes: The at least one rear-side semiconductor element and the set of interconnect structures are mounted on the rear surface of the interposer layer; A back-side encapsulating agent is formed on the back surface of the interposer to at least partially encapsulate the at least one back-side semiconductor element and the set of interconnect structures; The at least one front-side semiconductor element is mounted on the front surface of the interposer layer; A front-side encapsulating agent is formed on the front surface of the interposer to at least partially encapsulate the at least one front-side semiconductor element; and The front cooling device is mounted on the at least one front semiconductor element.

13. The method according to claim 11, characterized in that, The rear cooling device includes a rear cooling pipe for containing coolant liquid flowing therein, and a substrate having the rear cooling device on its front surface includes: The rear cooling pipe is mounted onto the substrate.

14. The method according to claim 11, characterized in that, The front cooling device includes a front cooling pipe for containing coolant liquid flowing therein.

15. The method according to claim 11, characterized in that, The front cooling device includes a heat sink attached to the at least one front semiconductor element.

16. The method according to claim 11, characterized in that, The rear cooling device includes a rear cooling pipe for containing coolant liquid flowing therein, and the method further includes: Couple the pump to the rear cooling pipe to circulate the coolant liquid within the rear cooling pipe; and The radiator is coupled to the pump to dissipate heat from the coolant liquid away from the rear cooling pipe.

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