Circuit board

Abstract

The invention discloses a circuit board, which is characterized by comprising a lead wire for mounting a patch fuse, which forms a circuit pattern and is broken in the middle; a patch fuse which is mounted to a broken portion of the patch fuse mounting lead wire and blocks a current flowing through the circuit pattern when an overcurrent occurs; the pattern fuse wire and the patch fuse mounting wire are arranged in parallel, and the middle of the pattern fuse wire and the patch fuse mounting wire are disconnected; and a pattern fuse which is formed at a broken portion of the pattern fuse wire and blocks a current flowing through the circuit pattern when an overcurrent occurs. Therefore, even if the patch fuse is damaged, the pattern fuse can properly cope with the blocking capacity.

Description

Technical Field

[0001] This invention relates to circuit boards, and more specifically, to a circuit board having an overcurrent blocking function. Background Technology

[0002] Unless otherwise stated in this specification, the content described in the identification items is not part of the prior art of the claims of this application, and the inclusion of such identification items does not imply that the technology is considered prior art.

[0003] Circuit boards, or printed circuit boards, are manufactured to fix and connect multiple electronic components in a standardized manner. These circuit boards are substrates with internal circuits printed on them, and miniaturization and weight reduction of electronic products are achieved by mechanically and electrically combining multiple circuits.

[0004] Circuit boards (PCBs) offer advantages such as stable circuit characteristics, no need to worry about incorrect wiring, and low production costs. Due to these advantages, PCBs are used in various fields and have become an essential core component in all electronic devices. Especially with the recent trend towards miniaturization and lightweight design, the use of flexible PCBs is continuously increasing.

[0005] This type of printed circuit board has a fuse circuit for protecting multiple components mounted on it. This fuse circuit can use surface-mount fuses. However, these surface-mount fuses may lose their function if damaged during soldering to the substrate, or if the solder portion cracks due to external impact while protruding from the substrate surface. Therefore, they cannot function as protective circuits in such situations. Summary of the Invention

[0006] (The technical problem to be solved)

[0007] Embodiments of the present invention are proposed to solve the above-mentioned problems by providing a circuit board that can protect the circuit even if the surface mount fuse is damaged.

[0008] (Solutions)

[0009] To address the aforementioned technical problems, embodiments of the present invention provide a circuit board, characterized in that it comprises: a surface mount fuse mounting wire forming a circuit pattern with a break in the middle; a surface mount fuse mounted to the break in the surface mount fuse mounting wire, which blocks the current flowing through the circuit pattern when an overcurrent occurs; a pattern fuse mounting wire arranged parallel to the surface mount fuse mounting wire, with a break in the middle; and a pattern fuse formed at the break in the pattern fuse mounting wire, which blocks the current flowing through the circuit pattern when an overcurrent occurs.

[0010] Preferably, the patch fuse and the patterned fuse have different blocking capacities.

[0011] Preferably, the blocking capacity of the patterned fuse is greater than that of the patch fuse.

[0012] Preferably, the patch fuse and the patterned fuse are arranged on the same plane.

[0013] Preferably, between the patterned fuse and the patch fuse, there is also a first protective pattern capable of covering one side of the patterned fuse.

[0014] Preferably, on the opposite side of the patterned fuse forming the first protective pattern, a second protective pattern is also included to cover the other side of the patterned fuse.

[0015] Preferably, the surface mount fuse layer forming the surface mount fuse and the patterned fuse layer forming the patterned fuse are stacked and arranged in the thickness direction of the circuit board, and further includes: a via penetrating the surface mount fuse layer and the patterned fuse layer; and a connecting conductor filling the via.

[0016] Preferably, it further includes: a heat capacity reduction section, wherein the circuit pattern is not formed on the patch fuse layer facing the patterned fuse.

[0017] Preferably, it further includes: a rigidity-reinforcing patterned portion formed on the patterned fuse layer, which is not electrically connected to the patterned fuse.

[0018] Furthermore, according to an embodiment of the present invention, a circuit board is provided, characterized in that it includes: a first insulating layer formed of a non-conductive material; a first adhesive layer formed on the upper side of the first insulating layer; a patterned portion formed on the upper side of the first adhesive layer to form a conductive pattern; a second adhesive layer formed on the upper side of the patterned portion; and a second insulating layer formed on the upper side of the second adhesive layer, formed of a non-conductive material, wherein the patterned portion includes a fusible portion that breaks the circuit when a certain or higher current flows in order to form a patterned fuse, and at least one of the first insulating layer and the second insulating layer in which the patterned fuse is located is formed of a transparent material.

[0019] Preferably, at least one of the first adhesive layer and the second adhesive layer containing the patterned fuse contains an irreversible Zion pigment that changes color when the temperature rises.

[0020] The irreversible Zion pigment is one of anhydrous copper sulfate or copper sulfate.

[0021] In addition, embodiments of the present invention provide a circuit board characterized in that it includes: a plurality of patterned fuses arranged in parallel; and a plurality of surface mount portions, which are connected in series with the plurality of patterned fuses and are formed by disconnection, wherein the capacity of the plurality of patterned fuses is different from that of each other.

[0022] Preferably, it further includes a surface mount resistor disposed in one of the plurality of surface mount placement portions.

[0023] Preferably, the chip resistor has an anti-surge function.

[0024] Preferably, it further includes: a jumper pin, which is disposed in one of the plurality of said patch placement portions.

[0025] Preferably, it further includes: a first protective pattern, which is formed to protect one side of each of the patterned fuses.

[0026] Preferably, it further includes: a second protective pattern, which covers the other side of the patterned fuse on the opposite side of the first protective pattern forming the patterned fuse.

[0027] In addition, embodiments of the present invention provide a circuit board characterized in that it includes: a first insulating layer formed of a non-conductive material; a first adhesive layer formed on the upper side of the first insulating layer; a patterned portion formed on the upper side of the first adhesive layer to form a conductive pattern; a second adhesive layer formed on the upper side of the patterned portion; and a second insulating layer formed on the upper side of the second adhesive layer, formed of a non-conductive material, wherein the patterned portion includes a fusible portion that breaks the circuit when a certain or higher current flows through it in order to form a patterned fuse, and a copper and tin alloy layer is formed on the fusible portion.

[0028] The copper and tin alloy layer includes: a first alloy layer formed of Cu3Sn; and a second alloy layer formed on the first alloy layer and formed of Cu6Sn5.

[0029] In addition, the present invention provides a circuit board characterized in that it includes: a first insulating layer formed of a non-conductive material; a first adhesive layer formed on the upper side of the first insulating layer; a patterned portion formed on the upper side of the first adhesive layer to form a conductive pattern; a second adhesive layer formed on the upper side of the patterned portion; and a second insulating layer formed on the upper side of the second adhesive layer, formed of a non-conductive material, wherein the patterned portion, in order to form a patterned fuse, includes a fusible portion that breaks the circuit when a certain or higher current flows through it, and also includes solder paste containing tin coated between the fusible portion and the second adhesive layer.

[0030] Furthermore, the present invention provides a circuit board manufacturing method as a different category, characterized by comprising the following steps: preparing a first insulating layer formed of a non-conductive material; attaching a first adhesive layer to the upper side of the first insulating layer; attaching a pattern portion including a patterned fuse forming a fusible portion to the upper side of the first adhesive layer; applying solder paste containing tin to the upper side of the fusible portion; attaching a second adhesive layer to the upper side of the pattern portion coated with the solder paste; and attaching a second insulating layer formed of a non-conductive material to the upper side of the second adhesive layer.

[0031] Preferably, the step of applying the solder paste includes the following steps: placing a stencil with an open coating portion including the fused portion; and applying the solder paste to the coating portion using a scraper blade.

[0032] (The effect of the invention)

[0033] The present invention can achieve a variety of effects, including the following, through the problem-solving methods described above. However, it is not implying that all of the above effects are necessary for the invention to be valid.

[0034] Firstly, the advantage of the circuit board in the first embodiment of the present invention is that the surface mount fuse and the patterned fuse are formed side by side so that even if the surface mount fuse is damaged, the patterned fuse can properly handle the blocking capacity.

[0035] Furthermore, because it has both a first protective pattern and a second protective pattern, it can prevent copper fragments from scattering and causing short circuits or damage to the insulation of other circuits during the process of the pattern fuse blowing. It also prevents the pattern fuse from being easily bent or broken due to external forces.

[0036] Furthermore, since one of the first and second insulating layers is made of a transparent material, it is easy to confirm from the outside whether the fused portion has melted or not.

[0037] Furthermore, due to the addition of irreversible Zion pigment, when the fused section melts, it will reach the melting temperature of copper, 1083°C, and the color will change due to the irreversible Zion pigment. As a result, it is easier to confirm from the outside whether the fused section has melted or not.

[0038] Furthermore, by forming a copper and tin alloy layer at the fused section, the location of the fused section can be identified.

[0039] In the second embodiment, by arranging patterned fuses and surface mount fuses side by side in the thickness direction, it has the advantage of reducing the area occupied on the plane even when the patterned fuses and surface mount fuses are arranged side by side.

[0040] In the third embodiment, the circuit board has multiple patterned fuses of different capacities arranged side-by-side, and a surface mount resistor can be connected to a surface mount mounting portion that is connected to the patterned fuse of the desired capacity. Therefore, it is not necessary to manufacture separate substrates with multiple capacities; a single substrate can be used to utilize patterned fuses of various capacities. Attached Figure Description

[0041] Figure 1 This is a plan view of the circuit board according to the first embodiment of the present invention.

[0042] Figure 2 Based on Figure 1 Sectional view of cutting line II-II.

[0043] Figure 3 and Figure 4 Based on Figure 1 Sectional view of cutting line III-III, Figure 3 This is a cross-sectional view of the fuse section before the temperature rises. Figure 4 It is a cross-sectional view of the state in which the temperature of the fused section rises and forms a copper and tin alloy layer.

[0044] Figures 5 to 7 It includes Figure 3 A simplified cross-sectional view of the circuit board manufacturing method for the fused section.

[0045] Figure 8 and Figure 9 It is shown Figure 6 A cross-sectional view of the detailed process of applying solder paste.

[0046] Figure 10 This is a cross-sectional view of a circuit board illustrating a second embodiment of the present invention.

[0047] Figure 11 and Figure 12 The circuit board shown is from the third embodiment. Figure 11 This is a plan view of the circuit board in the third embodiment. Figure 12 yes Figure 11 A plan view showing the arrangement of surface mount resistors on a circuit board. Detailed Implementation

[0048] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0049] Figure 1 This is a plan view of the circuit board according to the first embodiment of the present invention. Figure 2 Based on Figure 1 Sectional view of cutting line II-II.

[0050] like Figure 1As shown, the circuit board of the first embodiment of the present invention includes: a surface mount fuse mounting wire 310, on which a circuit pattern is formed, with a break in the middle; a surface mount fuse 200, which is mounted to the break in the surface mount fuse mounting wire 310, and blocks the current flowing through the circuit pattern when an overcurrent occurs; a pattern fuse wire 320, which is arranged side by side with the surface mount fuse mounting wire 310, with a break in the middle; a pattern fuse 400, which is formed on the break in the pattern fuse wire 320, and blocks the current flowing through the circuit pattern when an overcurrent occurs; a first protective pattern 510, which is formed between the pattern fuse 400 and the surface mount fuse 200, and covers one side of the pattern fuse; and a second protective pattern 520, which is formed on the opposite side of the first protective pattern 510 that forms the pattern fuse 400, and covers the other side of the pattern fuse 400.

[0051] And, as Figure 2 As shown in the cross-sectional view, the circuit board 100 includes: a first insulating layer 110 formed of a non-conductive material in the thickness direction; a first adhesive layer 120 formed on the upper side of the first insulating layer 110; a patterned portion 130 formed on the upper side of the first adhesive layer 120 to form a conductive pattern; a second adhesive layer 140 formed on the upper side of the patterned portion 130; and a second insulating layer 150 formed on the upper side of the second adhesive layer 140 and formed of a non-conductive material.

[0052] A surface mount fuse 200, as a surface mount fuse, is a component that breaks the internal circuitry when the current flowing through its terminals exceeds its capacity. Surface mount fuses 200 are generally well-known, so a detailed explanation is omitted. Because this type of surface mount fuse may be damaged during soldering to the substrate or protrude from the substrate surface, the solder joint may crack under external impact, potentially causing it to lose its function. In such cases, it provides almost no protection for the circuit.

[0053] The pattern section 130 is formed of a conductive material such as copper. On the pattern section 130, the surface mount fuse mounting wire 310, the pattern fuse wire 320, the pattern fuse 400, the first protection pattern 510, and the second protection pattern 520 are formed as conductive patterns. In particular, the surface mount fuse mounting wire 310 and the pattern fuse wire 320 are pattern wires 300 that constitute the circuit. The surface mount fuse mounting wire 310 is formed by breaking the wire, so that the surface mount fuse 200 can connect the two broken parts.

[0054] The patterned fuse wire 320 and the surface mount fuse wire 310 are formed side by side. That is, even if the surface mount fuse 200 is damaged and cannot be energized through the surface mount fuse wire 310, it can still be energized through the patterned fuse wire 320.

[0055] The cross-sectional area of ​​the patterned fuse 400 is smaller than that of the other patterned sections 130, and it melts when the current flowing through it exceeds a certain level. The patterned fuse 400 is configured in a zigzag shape, and has a fusing section 410 in the center that breaks the circuit when the current flowing through it exceeds a certain level.

[0056] The surface mount fuse 200 and the patterned fuse 400 have different blocking capacities. Specifically, preferably, the blocking capacity of the patterned fuse 400 is greater than that of the surface mount fuse. When configured this way, if the current flowing is too large, the surface mount fuse 200 will blow first, followed by the patterned fuse. Furthermore, even if the surface mount fuse 200 is damaged, the patterned fuse 400 can adequately handle the blocking capacity. The surface mount fuse 200 and the patterned fuse 400 of the first embodiment are arranged side-by-side on the same plane.

[0057] The first protective pattern 510 and the second protective pattern 520 are separate copper patterns and therefore do not constitute a circuit. The function of the first protective pattern 510 and the second protective pattern 520 is to prevent copper fragments from scattering and causing short circuits or damaging the insulation performance of other circuits when the pattern fuse 400 experiences an abnormal current and melts. Additionally, they also prevent the pattern fuse 400 from being easily bent or broken due to external forces.

[0058] The first insulating layer 110 and the second insulating layer 150 are formed of a non-conductive material. Furthermore, at least one of the first insulating layer 110 and the second insulating layer 150, where the patterned fuse 400 is located, is formed of a transparent material. As described above, because one of the first insulating layer 110 and the second insulating layer 150 is formed of a transparent material, it is easy to confirm from the outside whether the fusible portion 410 has melted.

[0059] Furthermore, at least one of the first adhesive layer 120 and the second adhesive layer 140 where the patterned fuse 400 is located is covered with an irreversible Zion pigment that changes color upon temperature rise. Preferably, the irreversible Zion pigment is selected from anhydrous copper sulfate or copper sulfate (CuSO4). As described above, due to the addition of the irreversible Zion pigment, when the fuse breaks, the melting temperature of copper, i.e., 1083°C, will be reached, and the color of the irreversible Zion pigment will change. As a result, it is easier to confirm from the outside whether the fuse 410 has broken.

[0060] Figure 3 and Figure 4 Based on Figure 1 Sectional view of cutting line III-III, Figure 3 This is a cross-sectional view of the fuse section before the temperature rises. Figure 4It is a cross-sectional view of the state in which the temperature of the fused section rises and forms a copper and tin alloy layer.

[0061] First, observe Figure 3 It also includes solder paste 411, which is applied between the fused portion 410 and the second adhesive layer 140 and contains tin. Solder paste 411 has tin (Sn) as its main component.

[0062] Figure 4 An alloy layer is formed by energizing the fusible portion 410, and a copper and tin alloy layer 415 is formed on the fusible portion 410. The copper and tin alloy layer 415 includes a first alloy layer 416 formed with a Cu3Sn composition on top of the patterned portion 130 formed of copper, and a second alloy layer 417 formed with a Cu6Sn5 composition on top of the first alloy layer 416. The tin layer 418 of the solder paste 411 is located on top of the second alloy layer 417.

[0063] When an electric current is applied, the copper and tin alloy layer 415 heats up, causing tin to penetrate between the copper molecules. The melting temperature of the copper and tin alloy layer 415 is lower than that of copper; therefore, when an electric current passes through, melting occurs in the fusion-breaking portion 410 of the copper and tin alloy layer 415. Specifically, the melting temperature of copper is 1083°C, the melting temperature of tin is 232°C, the temperature of the first alloy layer 416 is 730°C, and the melting temperature of the second alloy layer 417 is 635°C.

[0064] As mentioned above, since the copper and tin alloy layer 415 is formed in the fusion fracture portion, it has the advantage of being able to determine the location of the fusion fracture portion 410 where melting occurs.

[0065] The following describes a method for manufacturing a circuit board including the fuse portion of the first embodiment.

[0066] Figures 5 to 7 It includes Figure 3 A simplified cross-sectional view of the circuit board manufacturing method for the fused section. Figure 8 and Figure 9 It is shown Figure 6 A cross-sectional view of the detailed process of applying solder paste.

[0067] As shown in these figures, the steps include: preparing a first insulating layer 110 formed of a non-conductive material ( Figure 5 The step of attaching the first adhesive layer 120 to the upper side of the first insulating layer 110 (); Figure 5 The step of attaching the patterned portion 130 of the patterned fuse 400, which forms the fusible portion 410, onto the top of the first adhesive layer 120 ( Figure 5 The step of applying solder paste 411 containing tin to the top of the fused portion 410 (); Figure 6 ); the step of attaching the second adhesive layer 140 to the upper side of the patterned portion 130 coated with the solder paste 411 ( Figure 7 ); on top of the second adhesive layer 140, a second insulating layer 150 formed of a non-conductive material is adhered ( Figure 7 ).

[0068] One of the characteristic features of this invention is the step of applying solder paste 411. Figure 6 Therefore, refer to Figure 8 and Figure 9 Provide a detailed explanation, and omit the rest of the explanation.

[0069] The solder paste 411 coating step includes: placing a film 2100 including the coating portion with an open top surface of the weld break 410. Figure 8 ); and the step of applying the solder paste 411 to the coating portion 2110 using a scraper blade 2200 ( Figure 9 That is, the open portion of the plate 2100 is the coating portion 2110, which is positioned above the fused portion 410. Then, solder paste is applied to the plate 2100 using a scraper blade 2200.

[0070] As described above, the circuit board manufacturing method of the present invention has the advantage of being able to apply an accurate amount of solder paste 411 at the desired location of the fused portion.

[0071] Figure 10 This is a cross-sectional view of a circuit board illustrating a second embodiment of the present invention.

[0072] The circuit board of the second embodiment is characterized in that the surface mount fuse 200 and the patterned fuse 400 are arranged side by side in the thickness direction of the circuit board.

[0073] That is, in the circuit board according to the second embodiment, the surface mount fuse layer 1110 forming the surface mount fuse 200 and the patterned fuse layer 1120 forming the patterned fuse 400 are stacked and arranged in the thickness direction of the circuit board 100. In addition, it also includes: a via 1130 through the surface mount fuse layer 1110 and the patterned fuse layer 1120; and a connecting conductor 1140 filling the via 1130.

[0074] More specifically, the circuit board 100 is bonded by stacking the first insulating layer 1210, the first adhesive layer 1220, the patterned fuse layer 1120, the second adhesive layer 1230, the second insulating layer 1240, the third adhesive layer 1250, the surface mount fuse layer 1110, the fourth adhesive layer 1260, and the third insulating layer 1270 in sequence from bottom to top, based on a cross-section.

[0075] The materials of the first insulating layer 1210, the second insulating layer 1240, and the third insulating layer 1270 are the same as those of the first insulating layer 110 and the second insulating layer 150 in the first embodiment. Furthermore, the materials and structures of the first adhesive layer 1220, the second adhesive layer 1230, the third adhesive layer 1250, and the fourth adhesive layer 1260 are the same as those of the first adhesive layer 120 and the second adhesive layer 140 in the first embodiment.

[0076] The via 1130 is formed by penetrating the entire circuit board 100. The connecting conductor 1140 fills the interior of the via 1130, connecting the patterned fuse layer 1120 and the surface mount fuse layer 1110. The connecting conductor 1140, the patterned fuse layer 1120, and the surface mount fuse layer 1110 are formed of a conductive material such as copper.

[0077] The surface mount fuse layer 1110 further includes: a surface mount fuse adhesive portion 1111 for attaching both ends of the surface mount fuse 200; and a heat capacity reduction portion 1150, on which the circuit pattern is not formed on the surface mount fuse layer 1110 facing the patterned fuse 400. The heat capacity reduction portion 1150 is filled with the adhesive of the third adhesive layer 1250 and the fourth adhesive layer 1260. The heat capacity reduction portion 1150 reduces the ability to contain or transfer heat generated by the patterned fuse 400, causing the patterned fuse 400 to melt at the desired time.

[0078] The patterned fuse layer 1120 includes a patterned fuse 400 that functions as a fuse and a rigidity-reinforcing pattern 1160 formed on the patterned fuse layer 1120 but not electrically connected to the patterned fuse 400. The rigidity-reinforcing pattern 1160 is a dummy pattern, which can prevent the rigidity of the unpatterned parts from decreasing.

[0079] The patterned fuse 400 and the surface mount fuse 200 are the same as the patterned fuse and surface mount fuse of the first embodiment, so detailed description is omitted.

[0080] As described above, the circuit board of the second embodiment also has surface mount fuses and patterned fuses arranged side by side in the same manner as in the first embodiment, so that even if the surface mount fuse is damaged, the patterned fuse can properly handle the blocking capacity.

[0081] Furthermore, the advantage of the second embodiment is that even when patterned fuses and patch fuses are arranged side by side, the area occupied on the plane can be reduced.

[0082] Figure 11 and Figure 12 The circuit board shown is from the third embodiment. Figure 11 This is a plan view of the circuit board in the third embodiment. Figure 12 yes Figure 11A plan view showing the arrangement of surface mount resistors on a circuit board.

[0083] The circuit board of the third embodiment includes: a plurality of patterned fuses 400 arranged in parallel; a plurality of surface mount units 3100 connected in series with the plurality of patterned fuses 400 and formed by disconnection; and a surface mount resistor 3200 disposed in one of the plurality of surface mount units 3100.

[0084] The capacities of the multiple patterned fuses 400 are different from each other. For example, Figure 11 The permissible currents of the four patterned fuses 400 shown are 0.75A, 1A, 2A, and 3A respectively on the upper side. Furthermore, a first protective pattern 3510 is formed, spaced apart to protect one side of each of the patterned fuses 400; a second protective pattern 3520 is formed on the opposite side of the first protective pattern 3510 forming the patterned fuse, covering the other side of the patterned fuse.

[0085] The detailed configuration of the cross-sectional direction of the patterned fuse 400 and the substrate is the same as that of the patterned fuse 400 and the substrate in the first embodiment. The configuration of the first protective pattern 3510 and the second protective pattern 3520 is the same as that of the first protective pattern 510 and the second protective pattern 520 in the first embodiment.

[0086] The surface mount resistor 3200 has an anti-surge function.

[0087] As described above, on a circuit board with multiple patterned fuses of different capacities arranged side by side, the required surface mount resistor can be connected to the surface mount mounting portion 3100 and thus connected to the patterned fuse 400 of the required capacity. Therefore, it is not necessary to manufacture a separate board with multiple capacities; a single board can be used to utilize patterned fuses of multiple capacities.

[0088] Alternatively, a jumper pin set in one of the plurality of said chip mounting portions 3100 may be used to replace the chip resistor 3200.

[0089] The preferred embodiments of the present invention have been illustrated above, but the scope of the present invention is not limited to these specific embodiments, and appropriate modifications may be made within the scope of the claims.

Claims

1. A circuit board, characterized in that, include: The mounting wire (310) for the surface mount fuse forms a circuit pattern with a break in the middle; A surface mount fuse (200) is installed on a broken portion of the surface mount fuse mounting wire (310) to block the current flowing through the circuit pattern when an overcurrent occurs; The patterned fuse wire (320) is arranged side by side with the patch fuse mounting wire (310), with a break in the middle; as well as A patterned fuse (400) is formed at a break in the conductor (120) of the patterned fuse, which blocks the current flowing through the circuit pattern when an overcurrent occurs.

2. The circuit board according to claim 1, characterized in that, The patch fuse (200) and the patterned fuse (400) have different blocking capacities.

3. The circuit board according to claim 2, characterized in that, The blocking capacity of the patterned fuse (400) is greater than that of the patch fuse.

4. The circuit board according to claim 1, characterized in that, The patch fuse (200) and the patterned fuse (400) are arranged on the same plane.

5. The circuit board according to claim 4, characterized in that, Between the patterned fuse (400) and the patch fuse (200), there is also a first protective pattern (510) that can cover one side of the patterned fuse.

6. The circuit board according to claim 5, characterized in that, On the opposite side of the pattern fuse (400) forming the first protective pattern (510), a second protective pattern (520) is also included to cover the other side of the pattern fuse (400).

7. The circuit board according to claim 1, characterized in that, The surface mount fuse layer (1110) forming the surface mount fuse (200) and the patterned fuse layer (1120) forming the patterned fuse (400) are stacked and arranged in the thickness direction of the circuit board (100). It also includes: a via (1130) penetrating the patch fuse layer (1110) and the patterned fuse layer (1120); and a connecting conductor (1140) filling the via (1130).

8. The circuit board according to claim 7, characterized in that, It also includes a heat capacity reduction section (1150) in which the circuit pattern is not formed on the patch fuse layer (1110) facing the patterned fuse (400).

9. The circuit board according to claim 7, characterized in that, It also includes a rigidity-enhancing patterned portion (1160) formed on the patterned fuse layer (1120) and not electrically connected to the patterned fuse (400).

10. The circuit board according to claim 1, Its features are, Includes: a first insulating layer (110) formed of a non-conductive material; A first adhesive layer (120) is formed on the upper side of the first insulating layer (110); The patterned portion (130) is formed on the top of the first adhesive layer (120) to form a conductive pattern; A second adhesive layer (140) is formed on the upper side of the patterned portion (130); as well as A second insulating layer (150) is formed on the upper side of the second adhesive layer (140) and is made of a non-conductive material. The patterned section (130) includes a fuse section (410) that breaks the wire when a certain or higher current flows in order to form a patterned fuse (400). At least one of the first insulating layer (110) and the second insulating layer (150) where the patterned fuse (400) is located is formed of a transparent material.

11. The circuit board according to claim 10, characterized in that, An irreversible Zion pigment that changes color when the temperature rises is added to at least one of the first adhesive layer (120) and the second adhesive layer (140) where the patterned fuse (400) is located.

12. The circuit board according to claim 11, characterized in that, The irreversible Zion pigment is one of anhydrous copper sulfate or copper sulfate (CuSo4).

13. The circuit board according to claim 1, Its features are, Includes: a first insulating layer (110) formed of a non-conductive material; A first adhesive layer (120) is formed on the upper side of the first insulating layer (110); The patterned portion (130) is formed on the top of the first adhesive layer (120) to form a conductive pattern; A second adhesive layer (140) is formed on the upper side of the patterned portion (130); and A second insulating layer (150) is formed on the upper side of the second adhesive layer (140) and is made of a non-conductive material. The patterned portion (130) includes a fuse portion (410) that breaks when a certain or higher current flows in order to form the patterned fuse (400). A copper and tin alloy layer (415) is formed on the fused portion (410).

14. The circuit board according to claim 13, characterized in that, The copper and tin alloy layer (415) includes: a first alloy layer (416) formed of Cu3Sn composition; and A second alloy layer (417) is formed on top of the first alloy layer (416) and is composed of Cu6Sn5.

15. The circuit board according to claim 1, Its features are, Includes: a first insulating layer (110) formed of a non-conductive material; A first adhesive layer (120) is formed on the upper side of the first insulating layer (110); The patterned portion (130) is formed on the top of the first adhesive layer (120) to form a conductive pattern; A second adhesive layer (140) is formed on the upper side of the patterned portion (130); and A second insulating layer (150) is formed on the upper side of the second adhesive layer (140) and is made of a non-conductive material. The patterned portion (130) includes a fuse portion (410) that breaks when a certain or higher current flows in order to form the patterned fuse (400). It also includes solder paste (411) that is applied between the fused portion (410) and the second adhesive layer (140) and contains tin.

16. A method for manufacturing a circuit board, characterized in that, Includes the following steps: Prepare a first insulating layer (110) formed of a non-conductive material; A first adhesive layer (120) is attached to the upper side of the first insulating layer (110); A patterned portion (130) of a patterned fuse (400) including a fusible portion (410) is pasted onto the top of the first adhesive layer (120); Solder paste (411) containing tin is applied to the top of the fused portion (410); A second adhesive layer (140) is attached to the upper side of the patterned portion (130) coated with the solder paste (411); and On top of the second adhesive layer (140), a second insulating layer (150) made of a non-conductive material is attached.

17. The circuit board manufacturing method according to claim 16, characterized in that, The step of applying the solder paste includes the following steps: A film (2100) is placed on which the top-open coating portion (2110) including the fuse portion (410) is placed; and The solder paste (411) is applied to the coating section (2110) using a scraper blade (2200).

18. A circuit board, Its features are, Includes: a first insulating layer (110) formed of a non-conductive material; A first adhesive layer (120) is formed on the upper side of the first insulating layer (110); The patterned portion (130) is formed on the top of the first adhesive layer (120) to form a conductive pattern; A second adhesive layer (140) is formed on the upper side of the patterned portion (130); and A second insulating layer (150) is formed on the upper side of the second adhesive layer (140) and is made of a non-conductive material. The pattern section (130) includes: a patterned fuse (400), including a fusible part (410) that breaks the circuit when a certain or higher current flows through it. At least one of the first insulating layer (110) and the second insulating layer (150) where the patterned fuse (400) is located is formed of a transparent material.

19. The circuit board according to claim 18, characterized in that, An irreversible Zion pigment that changes color when the temperature rises is added to at least one of the first adhesive layer (120) and the second adhesive layer (140) where the patterned fuse (400) is located.

20. The circuit board according to claim 19, characterized in that, The irreversible Zion pigment is one of anhydrous copper sulfate or copper sulfate (CuSo4).

21. A circuit board, Its features are, include: Multiple patterned fuses (400) arranged side by side; and Multiple patch mounting sections (3100) are connected in series with multiple patterned fuses (400) and are formed by disconnection. The capacities of the multiple patterned fuses (400) are different from each other.

22. The circuit board according to claim 21, characterized in that, It also includes a surface mount resistor (3200) disposed in one of the plurality of surface mount placement portions (3100).

23. The circuit board according to claim 22, characterized in that, The surface mount resistor (3200) has an anti-surge function.

24. The circuit board according to claim 21, characterized in that, It also includes: a jumper pin, which is set to one of the plurality of said patch placement portions (3100).

25. The circuit board according to claim 21, characterized in that, It also includes: a first protective pattern (3510), which is spaced apart to protect one side of each of the patterned fuses (400).

26. The circuit board according to claim 25, characterized in that, It also includes a second protective pattern (3520) that covers the other side of the patterned fuse on the opposite side of the first protective pattern (3510) forming the patterned fuse.

27. A circuit board, Its features are, Includes: a first insulating layer (110) formed of a non-conductive material; A first adhesive layer (120) is formed on the upper side of the first insulating layer (110); The patterned portion (130) is formed on the top of the first adhesive layer (120) to form a conductive pattern; A second adhesive layer (140) is formed on the upper side of the patterned portion (130); and A second insulating layer (150) is formed on the upper side of the second adhesive layer (140) and is made of a non-conductive material. The pattern section includes: a patterned fuse (400), including a fusible part (410) that breaks the circuit when a certain or higher current flows through it. A copper and tin alloy layer (415) is formed on the fused portion (410).

28. The circuit board according to claim 27, characterized in that, The copper and tin alloy layer (415) includes: a first alloy layer (416) formed of Cu3Sn composition; and A second alloy layer (417) is formed on top of the first alloy layer (416) and is composed of Cu6Sn5.

29. A circuit board, Its features are, Includes: a first insulating layer (110) formed of a non-conductive material; A first adhesive layer (120) is formed on the upper side of the first insulating layer (110); The patterned portion (130) is formed on the top of the first adhesive layer (120) to form a conductive pattern; A second adhesive layer (140) is formed on the upper side of the patterned portion (130); and A second insulating layer (150) is formed on the upper side of the second adhesive layer (140) and is made of a non-conductive material. The pattern section (130) includes: a patterned fuse (400), including a fusible part (410) that breaks the circuit when a certain or higher current flows through it. It also includes solder paste (411) that is applied between the fused portion (410) and the second adhesive layer (140) and contains tin.

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