Hot air thermoforming of aluminum sheet metal chassis with 3D texturing

Abstract

A method for forming a three-dimensional image on a surface of a chassis of a device is provided. The method includes placing a metal plate mold for a chassis between a first molding unit and a second molding unit of a molding station, preheating the metal plate mold in the molding station, and applying a first air flow from the first molding unit to the metal plate mold to form a three-dimensional image on a surface of the metal plate mold.

Description

Technical Field

[0001] This disclosure relates to information processing systems, and more specifically to hot air thermoforming of aluminum sheet metal chassis with 3D texture. Background Technology

[0002] As the value and use of information continue to grow, individuals and businesses seek additional ways to process and store information. One option is an information processing system. Information processing systems typically process, compile, store, and / or communicate information or data for business, personal, or other purposes. Because technology and information processing needs and requirements can vary across different applications, information processing systems can also vary in terms of what information is processed, how it is processed, how much information is processed, stored, or communicated, and how quickly and efficiently it can be processed, stored, or communicated. Variations in information processing systems allow them to be general-purpose or configured for specific users or purposes (such as financial transaction processing, scheduling, enterprise data storage, or global communications). Furthermore, information processing systems can include a variety of hardware and software resources that can be configured to process, store, and communicate information, and can include one or more computer systems, data storage systems, and networked systems. Summary of the Invention

[0003] The present invention provides a method for forming a three-dimensional image on the surface of a chassis of an apparatus. The method may include placing a metal plate mold for the chassis between a first forming unit and a second forming unit of a forming station, preheating the metal plate mold in the forming station, and applying a first airflow from the first forming unit to the metal plate mold to form a three-dimensional image on the surface of the metal plate mold. Attached Figure Description

[0004] It should be understood that, for the sake of simplicity and clarity, the elements shown in the accompanying drawings are not necessarily drawn to scale. For example, the dimensions of some elements are enlarged relative to others. The accompanying drawings illustrate and describe embodiments incorporating the teachings of this disclosure, in which:

[0005] Figure 1A and Figure 1B A chassis for an information processing system according to an embodiment of this disclosure is shown;

[0006] Figure 2 A method for hot air thermoforming of an aluminum sheet metal chassis with 3D texture is shown according to an embodiment of the present disclosure;

[0007] Figure 3A and Figure 3BA forming station for hot air thermoforming of an aluminum sheet metal chassis with 3D texture, according to an embodiment of the present disclosure, is shown; and

[0008] Figure 4 This is a block diagram illustrating a generalized information processing system according to another embodiment of the present disclosure;

[0009] In different accompanying drawings, the same reference numerals are used to indicate similar or identical items. Detailed Implementation

[0010] The following description, provided in conjunction with the accompanying drawings, aids in understanding the teachings disclosed herein. The discussion below focuses on specific implementations and embodiments of the teachings. This focus is intended to aid in describing the teachings and should not be construed as limiting the scope or applicability of the teachings. However, other teachings may certainly be used in this application as well. These teachings may also be used in other applications and with several different types of architectures, such as distributed computing architectures, client / server architectures, or middleware server architectures, and associated resources.

[0011] Figure 1A and Figure 1B A chassis 100 for an information processing system is shown. The information processing system can represent a mobile computing system, such as a laptop computer, tablet device, mobile phone device, etc., and is characterized by its association with personal computing use. Specifically, chassis 100 represents a casing and cover of a device type typically associated with personalization based on user preferences. For example, a user may choose to pay extra for a special cover treatment, such as embossing. However, embossing is typically not done on the edges of the chassis, but only on the top or bottom surfaces of the device. Chassis 100 has a surface pattern on its top surface 102, which is also provided on the edge surfaces 104 of the chassis. Chassis 100 is made of sheet aluminum material, such as 5052 aluminum, 5252 aluminum, 6063 aluminum, etc. Typical aluminum chassis manufacturing may include die stamping, chassis machining, and chassis finishing. However, chassis 100 is formed in a stamping process that simultaneously applies the decorative pattern to the chassis, including the top surface 102 and the edge surfaces 104, thereby reducing the number of process steps required to finish the chassis, as further described below.

[0012] Figure 2A method 200 for hot air thermoforming of an aluminum sheet metal chassis with 3D texture is shown. Method 200 begins at step 202 with an unformed sheet metal mold and proceeds through a mold pretreatment step 210, a mold heating step 220, a mold forming step 230, a mold post-treatment step 240, and a mold surface treatment step 250 to produce a finished sheet metal chassis. For the purposes of method 200, the term "mold" may refer to the sheet metal mold during any particular step of the method, while the term "chassis" may refer to the final product of the method. Method 200 begins at step 202, where a mold pretreatment 210 is performed on the unformed sheet metal mold. In a first step 212 of the mold pretreatment 210, the sheet metal mold is prepared for forming. Here, a flat sheet metal mold may be stamped to form a chassis blank, which has the basic shape of the finished chassis but may include flash or other trimmings from the stamping process. In the next step 214, the mold undergoes any surface pretreatment, such as cleaning any residue from step 212, applying any coating or surface treatment to prepare for the molding process, or other steps as needed or desired to prepare for the molding process.

[0013] Mold heating 220 continues, and in step 222, preheating is performed on the upper and lower molding units in the molding station. The following section discusses... Figure 3A and Figure 3B Further description of forming station 300. In step 224, the mold is installed into the lower forming unit, and the upper forming unit is closed. In step 226, the mold is preheated in the forming unit. Here, the mold can be heated to a temperature that allows the forming process to proceed as described below in thermoforming. In certain cases, the mold can be heated to a temperature at which the aluminum in the mold becomes malleable. For example, the mold can be heated to 752℉, at which temperature the aluminum in the mold becomes soft enough to bend without altering any tempering or risking blown holes in the mold. In another case, higher temperatures, such as 878℉, or temperatures in the range of 878-986℉, can be used as needed or desired.

[0014] The molding process 230 continues, and in step 232, heating of the upper and lower molding units is shut off, and high-pressure air is injected into the molding units to deform the aluminum, thereby filling the cavities in the molding units. For example, when the bottom molding unit is associated with an inner mold on which a stamped chassis mold is placed, the upper mold can be understood as having cavities that form a negative image of the pattern to be formed on the cover and sides of the chassis mold. That is, the upper molding unit may include cavities that have a pattern of a negative image of the desired surface finish. Here, the lower molding unit may include one or more air inlets that allow high-pressure air to be injected onto the inner surface of the chassis mold. As the metal of the chassis mold is preheated to a temperature that softens the metal, the high-pressure air acts to deform the inner surface of the chassis mold into the cavities in the top cover, thereby forming the desired surface finish on the outer surface of the chassis mold (i.e., the cover and sides). In a particular embodiment, the pressure of the high-pressure air provided is 6 MPa, or in the range of 3-6 MPa. In step 234, the mold and molding unit are cooled. Here, the mold may be kept at the annealing temperature as needed or desired, so as to anneal the mold before it is fully cooled. In step 236, the patterned chassis mold is removed from the molding station.

[0015] Post-processing 240 continues, and in step 242, die punching / stamping is performed. Here, any burrs on the chassis can be removed, holes can be punched in the chassis (such as holes for data communication interfaces and system power supplies), and other operations necessary for the finished chassis can be applied as needed or desired. In step 244, the die is machined to remove any extra metal as needed or desired. Other post-processing steps can be provided as needed or desired. For example, mounting posts, brackets, etc., can be attached to the inner surface of the die, or other components can be added to the die as needed or desired. At this point, the chassis has been machined. That is, the chassis is in a form that can be used to assemble the finished device.

[0016] Surface treatment 250 continues, and in step 252, any final surface treatment is applied to the chassis. For example, the chassis may be anodized, painted, powder-coated, or otherwise processed; decals or stickers may be applied; or other surface treatments may be applied as needed or desired.

[0017] Figure 3AA molding station 300 is shown, which may be used for mold heating 220 and mold forming 230, as described above. The molding station 300 includes a bottom molding unit holder 310 and a top molding unit holder 320. The top and bottom molding unit holders 310 and 320 can be understood as permanent components of the molding station 300. The bottom molding unit holder 310 is typically held in a fixed position throughout the preheating and molding process, and the top molding unit holder 320 is typically movable in the vertical direction to allow for the installation and removal of the mold 330.

[0018] Bottom forming unit holder 310 is fitted with bottom forming unit 312, and top forming unit holder 320 is fitted with top forming unit 322. Bottom forming unit 312 includes heating element 314, and top forming unit 322 includes heating element 324. Heating elements 214 and 324 may represent electrically actuated resistive heating elements, heating channels formed within the respective bottom forming unit 312 and top forming unit 322, through which heating fluid (such as air or another heating fluid) passes to heat the respective bottom and top forming units, as described above with respect to mold heating process 220.

[0019] In certain cases, the bottom forming unit 312 is provided as a common forming unit for forming patterns. That is, the bottom forming unit 312 can be used for multiple patterns and is configured to provide a high-pressure airflow on the bottom side of each patterned top forming unit 322. In this case, a single airflow inlet 316, or several airflow inlets similar to the airflow inlet 316, is provided on the bottom (or inner) side of the mold 330. In another case, the bottom forming unit 312 is patterned similarly to the top forming unit 322, wherein a separate airflow 316 is provided to each cavity 328 in the top forming unit.

[0020] exist Figure 3BIn this process, after mold heating 220, mold forming 320 begins, introducing a high-pressure airflow into inlet 316, which deforms mold 330 upward into cavity 328 in upper top forming unit 322. This forms the desired pattern on the surface of mold 330. In a particular embodiment, the pattern formed in mold 330 has a texturing accuracy of + / -0.05 mm, a texture linewidth accuracy of 0.05 mm, a texture depth possibly smaller than the linewidth, a texture radius of 0.3 mm, and the pattern can be texturized without draft. In a particular embodiment, the textured pattern is provided in a computer-aided design (CAD) file, and the blank top forming unit is laser-etched to form a negative image of the textured pattern. In another embodiment, bottom forming unit 322 represents the outer forming unit for mold 330, and air pressure forms the pattern in the top and side surfaces of the mold as indentations from outside the mold. In another embodiment, both the bottom forming unit 312 and the top forming unit 322 are configured to apply airflow to the pattern mold 330 as raised and lowered features as needed or desired.

[0021] Figure 4 A generalized embodiment of an information processing system 400, similar to information processing system 400, is illustrated. For the purposes of this disclosure, an information processing system may include any tool or set of tools that can be used to calculate, classify, process, transmit, receive, retrieve, initiate, convert, store, display, indicate, detect, record, reproduce, dispose of, or utilize information, intelligence, or data of any form for commercial, scientific, control, entertainment, or other purposes. For example, information processing system 400 may be a personal computer, laptop computer, smartphone, tablet device, or other consumer electronic device, web server, network storage device, switching router, or other network communication device, or any other suitable device, and may vary in size, shape, performance, functionality, and price. Furthermore, information processing system 400 may include processing resources for executing machine-executable code, such as a central processing unit (CPU), a programmable logic array (PLA), an embedded device (such as a system-on-a-chip (SoC)), or other control logic hardware. Information processing system 400 may also include one or more computer-readable media for storing machine-executable code such as software or data. Additional components of the information processing system 400 may include one or more storage devices for storing machine-executable code, one or more communication ports for communicating with external devices, and various input and output (I / O) devices, such as a keyboard, mouse, and video display. The information processing system 400 may also include one or more buses operable to transfer information between various hardware components.

[0022] Information processing system 400 may include one or more of the means or modules described below, and operates to perform one or more of the methods described below. Information processing system 400 includes processors 402 and 404, input / output (I / O) interfaces 410, memory 420 and 425, a graphics interface 430, a Basic Input / Output System / General Purpose Extensible Firmware Interface (BIOS / UEFI) module 440, a disk controller 450, a hard disk drive (HDD) 454, an optical disk drive (ODD) 456, a disk emulator 460 connected to an external solid-state drive (SSD) 462, an I / O bridge 470, one or more additional resources 474, a Trusted Platform Module (TPM) 476, a network interface 480, a management device 490, and a power supply 495. Processors 402 and 404, I / O interface 410, memory 420, graphics interface 430, BIOS / UEFI module 440, disk controller 450, HDD 454, ODD 456, disk emulator 460, SSD 462, I / O bridge 470, additional resources 474, TPM 476, and network interface 480 operate together to provide a host environment for information processing system 400, which operates to provide the data processing functionality of the information processing system. The host environment operates to execute machine-executable code, including platform BIOS / UEFI code, device firmware, operating system code, applications, programs, etc., to perform data processing tasks associated with information processing system 400.

[0023] In a host environment, processor 402 is connected to I / O interface 410 via processor interface 406, and processor 404 is connected to I / O interface 408. Memory 420 is connected to processor 402 via memory interface 422. Memory 425 is connected to processor 404 via memory interface 427. Graphics interface 430 is connected to I / O interface 410 via graphics interface 432 and provides video display output 436 to video display 434. In a particular embodiment, information processing system 400 includes separate memory dedicated to each of processors 402 and 404 via separate memory interfaces. Examples of memories 420 and 430 include random access memory (RAM) (such as static RAM (SRAM), dynamic RAM (DRAM), non-volatile RAM (NV-RAM), etc.), read-only memory (ROM), another type of memory, or a combination thereof.

[0024] The BIOS / UEFI module 440, disk controller 450, and I / O bridge 470 are connected to the I / O interface 410 via I / O channel 412. Examples of I / O channels 412 include Peripheral Component Interconnect (PCI) interfaces, extended PCI (PCI-X) interfaces, high-speed PCI-Express (PCIe) interfaces, other industry-standard or proprietary communication interfaces, or combinations thereof. The I / O interface 410 may also include one or more other I / O interfaces, including Industry Standard Architecture (ISA) interfaces, Small Computer Serial Interface (SCSI) interfaces, and Inter-Integrated Circuit (I / O) interfaces. 2 C) Interfaces such as System Packet Interface (SPI), Universal Serial Bus (USB), another interface, or combinations thereof. The BIOS / UEFI module 440 includes BIOS / UEFI code operable to detect resources within the information processing system 400, provide drivers for those resources, initialize those resources, and access those resources. The BIOS / UEFI module 440 includes code operable to detect resources within the information processing system 400, provide drivers for those resources, initialize those resources, and access those resources.

[0025] Disk controller 450 includes a disk interface 452 that connects the disk controller to HDD 454, ODD 456, and disk emulator 460. Examples of disk interface 452 include an Integrated Drive Electronics (IDE) interface, an Advanced Technology Attachment (ATA) interface such as a Parallel ATA (PATA) interface or a Serial ATA (SATA) interface, a SCSI interface, a USB interface, a proprietary interface, or a combination thereof. Disk emulator 460 allows SSD 464 to be connected to information processing system 400 via external interface 462. Examples of external interface 462 include a USB interface, an IEEE 1394 (FireWire) interface, a proprietary interface, or a combination thereof. Alternatively, solid-state drive 464 may be located within information processing system 400.

[0026] I / O bridge 470 includes a peripheral interface 472 that connects the I / O bridge to additional resources 474, TPM 476, and network interface 480. Peripheral interface 472 can be the same type of interface as I / O channel 412, or it can be a different type of interface. Thus, when peripheral interface 472 and I / O channel 412 are of the same type, I / O bridge 470 expands the capability of the I / O channel, and when they are of different types, I / O bridge converts information from a format suitable for the I / O channel to a format suitable for peripheral channel 472. Additional resources 474 may include a data storage system, an additional graphics interface, a network interface card (NIC), a voice / video processing card, another additional resource, or a combination thereof. Additional resources 474 may be located on the main circuit board, on a separate circuit board or additional card disposed within the information processing system 400, on a device external to the information processing system, or a combination thereof.

[0027] Network interface 480 represents a NIC, which is located within information processing system 400, on the main circuit board of the information processing system, integrated into another component such as I / O interface 410, in another suitable location, or a combination thereof. Network interface device 480 includes network channels 482 and 484, which provide interfaces to devices external to information processing system 400. In certain embodiments, network channels 482 and 484 are of a different type from peripheral channel 472, and network interface 480 converts information from a format suitable for the peripheral channel to a format suitable for external devices. Examples of network channels 482 and 484 include InfiniBand channels, Fibre Channel channels, Gigabit Ethernet channels, proprietary channel architectures, or combinations thereof. Network channels 482 and 484 can connect to external network resources (not shown). These network resources may include another information processing system, a data storage system, another network, a grid management system, another suitable resource, or a combination thereof.

[0028] Management device 490 refers to one or more processing devices, such as a dedicated backplane management controller (BMC), a system-on-a-chip (SoC) device, one or more associated storage devices, one or more network interface devices, a complex programmable logic device (CPLD), etc., that operate together to provide a management environment for information processing system 400. Specifically, management device 490 connects to various components of the host environment via various internal communication interfaces, such as low pin count (LPC) interfaces, inter-integrated circuit (I2C) interfaces, PCIe interfaces, etc., to provide out-of-band (OOB) mechanisms for retrieving information related to the operation of the host environment, providing BIOS / UEFI or system firmware updates, and managing non-processing components of information processing system 400 (such as system cooling fans and power supplies). Management device 490 may include a network connection to an external management system, and the management device may communicate with the management system to report status information of information processing system 400, receive BIOS / UEFI or system firmware updates, or perform other tasks for managing and controlling the operation of information processing system 400. Management device 490 can operate outside the power plane of components in the host environment, allowing it to receive power to manage the information processing system when the information processing system 400 is otherwise shut down. Examples of management device 490 include commercially available BMC products or other devices operating according to the Intelligent Platform Management Initiative (IPMI) specification, Web Services Management (WSMan) interface, Redfish application programming interface (API), another Distributed Management Task Force (DMTF), or other management standards, and may include integrated Dell Remote Access Controller (iDRAC), embedded controllers (EC), etc. Management device 490 may also include associated memory devices, logic devices, security devices, etc., as needed or desired.

[0029] Although only a few exemplary embodiments have been described in detail herein, those skilled in the art will readily understand that many modifications may be made to the exemplary embodiments without substantially departing from the novelty teachings and advantages of the embodiments of this disclosure. Therefore, all such modifications are intended to be included within the scope of the embodiments of this disclosure as defined in the appended claims. In the claims, the entries for "means plus function" are intended to cover structures described herein as performing the stated functions, and not only structural equivalents but also equivalent structures.

[0030] The subject matter disclosed above should be considered illustrative rather than restrictive, and the appended claims are intended to cover any or all such modifications, enhancements, and other embodiments falling within the scope of this invention. Therefore, to the fullest extent permitted by law, the scope of this invention is determined by the broadest possible interpretation of the appended claims and their equivalents, and should not be construed as limited by the foregoing detailed descriptions.

Claims

1. A method comprising: The metal plate mold for the chassis of the information processing system is placed between the first forming unit and the second forming unit of the forming station; Preheat the metal plate mold in the forming station; as well as A first airflow is applied from the first forming unit to the metal plate mold to form a three-dimensional image on the surface of the metal plate mold.

2. The method of claim 1, wherein after applying the first airflow, the method further comprises: Cool the metal plate mold in the forming station.

3. The method of claim 2, wherein cooling the metal plate mold causes the metal plate mold to anneal.

4. The method of claim 1, wherein the first molding unit includes a first heating element, and the second molding unit includes a second heating element.

5. The method of claim 1, wherein the second molding unit includes a cavity.

6. The method of claim 5, wherein, during the formation of the three-dimensional image, the first airflow compresses the metal plate mold into the cavity.

7. The method of claim 1, wherein the second molding unit comprises a negative image of the three-dimensional image.

8. The method of claim 1, wherein when forming the three-dimensional image, the method further comprises: A second airflow is applied from the second forming unit to the metal plate mold.

9. The method of claim 8, wherein the first molding unit includes a cavity.

10. The method of claim 5, wherein, during the formation of the three-dimensional image, the second airflow compresses the metal plate mold into the cavity.

11. A non-transitory computer-readable medium comprising code for causing an information processing system to perform the following operations: The metal plate mold for the chassis of the mobile device is placed between the first forming unit and the second forming unit of the forming station; Preheat the metal plate mold in the forming station; as well as A first airflow is applied from the first forming unit to the metal plate mold to form a three-dimensional image on the surface of the metal plate mold.

12. The non-transitory computer-readable medium of claim 11, wherein after the first airflow is applied, the information processing system further: Cool the metal plate mold in the forming station.

13. The non-transitory computer-readable medium of claim 12, wherein cooling the metal plate mold causes the metal plate mold to anneal.

14. The non-transitory computer-readable medium of claim 11, wherein the first molding unit includes a first heating element, and the second molding unit includes a second heating element.

15. The non-transitory computer-readable medium of claim 11, wherein the second molding unit includes a cavity.

16. The non-transitory computer-readable medium of claim 15, wherein, during the formation of the three-dimensional image, the first airflow compresses the metal plate mold into the cavity.

17. The non-transitory computer-readable medium of claim 11, wherein the second shaping unit comprises a negative image of the three-dimensional image.

18. The non-transitory computer-readable medium of claim 11, wherein, in forming the three-dimensional image, the information processing system further includes: A second airflow is applied from the second forming unit to the metal plate mold.

19. The non-transitory computer-readable medium of claim 18, wherein the first molding unit includes a cavity, wherein, during the formation of the three-dimensional image, the second airflow compresses the metal plate mold into the cavity.

20. A method comprising: A metal plate mold for the chassis of the information processing system is placed between a first forming unit and a second forming unit in the forming station, wherein the first forming unit includes a first heating element and the second forming unit includes a second heating element. Preheat the metal plate mold in the forming station; A first airflow is applied from the first forming unit to the metal plate mold to form a three-dimensional image on the surface of the metal plate mold; as well as Cool the metal plate mold in the forming station.

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