High-heat-resistance quick-curing voice coil batch coating adhesive and preparation method thereof

Abstract

A kind of high heat-resistant fast solidification voice coil batch coating adhesive and preparation method thereof, including the following components by total weight of composition: main material resin, auxiliary material resin, diluent, filler, curing agent, catalyst and other additives.Wherein, the main material resin includes epoxy resin and phenolic resin;The catalyst includes nano metal oxide and nano carbon;The curing agent includes latent curing agent, fast curing agent and high-temperature curing agent.The present application is by using epoxy resin and phenolic resin blend, and cooperate with the composite catalyst including nano metal oxide and nano carbon material, and the composite curing system including latent type, cationic and high-temperature curing agent, so that adhesive forms interpenetrating network structure after curing.The composition has excellent fast curing characteristics and long-term heat resistance, while having good bonding strength, toughness and heat dissipation performance, especially suitable for batch coating, winding and bonding of voice coil of mobile phone, computer, vehicle-mounted loudspeaker and the like.

Description

Technical Field

[0001] This invention relates to the field of adhesives for electronic components, and more particularly to a high heat-resistant, fast-curing voice coil coating adhesive and its preparation method. Background Technology

[0002] Voice coil adhesive, also known as voice coil coating adhesive or coil glue, is a key material in loudspeaker manufacturing. Its performance directly determines the loudspeaker's power handling capacity, operational reliability, and lifespan. The voice coil, as the core driving component of the loudspeaker, is composed of a frame, an enameled coil, and voice coil adhesive. The voice coil adhesive plays two main roles: first, it bonds the coil to the frame into a single structure with sufficient mechanical strength; second, it assists in heat dissipation of the voice coil, effectively reducing its operating temperature rise.

[0003] Currently, the mainstream voice coil adhesives on the market are mainly phenolic resin adhesives and epoxy resin adhesives. However, both types of adhesives have significant drawbacks. While phenolic resin adhesives have excellent heat resistance, their curing conditions are demanding, requiring prolonged high-temperature treatment. Their slow curing speed can easily lead to adhesive displacement or contamination of the magnetic gap, potentially causing noise or voice coil jamming. Furthermore, the cured adhesive is hard and brittle, with poor impact and peel resistance, making it prone to cracking and failure under continuous speaker vibration and thermal cycling conditions. Epoxy resin adhesives, while possessing advantages such as high bonding strength, low shrinkage, and low curing temperature, suffer from insufficient long-term heat resistance. When the voice coil operates at temperatures typically above 200°C, the adhesive strength rapidly decays, resulting in "reinforcement failure," failing to provide durable mechanical fixation for the coil. Summary of the Invention

[0004] Therefore, it is necessary to address the shortcomings of existing technologies by providing a high-heat-resistant, fast-curing voice coil adhesive and its preparation method. This adhesive utilizes an epoxy resin-modified phenolic resin method, maintaining excellent bonding strength, flexibility, and wettability while exhibiting significantly improved long-term high-temperature stability (maintaining stable performance at temperatures above 200°C) and a drastically shortened curing time. This provides an excellent solution to problems commonly encountered in high-power loudspeaker manufacturers, such as adhesive cracking, magnetic gap contamination, and insufficient high-temperature resistance, thus meeting the requirements for voice coil adhesive bonding.

[0005] A high heat-resistant, fast-curing voice coil coating adhesive, comprising the following components by total weight of the composition: Main resin component: 15%–50%; Auxiliary resin: 1%–20%; Diluent: 30% ∽ 60%; Filler: 5% ~ 20%; Hardener: 0.1% to 15%; Catalyst: 0.1%–15%; Other additives: 0%–5%.

[0006] The main resins include epoxy resin and phenolic resin; the catalysts include nano-metal oxides and nano-carbon; and the curing agents include latent curing agents, rapid curing agents, and high-temperature resistant curing agents.

[0007] Furthermore, the epoxy resin is a multifunctional high-temperature resistant epoxy resin; the diluent is selected from at least one of ketone solvents, ester solvents, and hydrocarbon solvents.

[0008] Furthermore, the multifunctional high-temperature resistant epoxy resin is at least one of phenolic epoxy resin, bisphenol A type phenolic epoxy resin, biphenyl type epoxy resin, and naphthalene ring type epoxy resin.

[0009] Furthermore, the phenolic resin is selected from at least one of the following: methyl phenolic resin, linear phenolic resin, and phenolic resin obtained by polymerizing natural phenolic compounds containing long-chain alkyl substituents with monomers such as formaldehyde and phenol.

[0010] Furthermore, the auxiliary resin is at least one of rosin resin and nitrile rubber.

[0011] Furthermore, the nano-metal oxide is at least one of nano-magnesium oxide, nano-calcium oxide, nano-titanium dioxide, and zinc oxide, and the nano-carbon is at least one of carbon nanotubes and graphene oxide.

[0012] Furthermore, the catalyst is a mixture of nano-metal oxide modified with a silane coupling agent and graphene oxide.

[0013] Furthermore, the filler is silicon dioxide.

[0014] A method for preparing a high heat-resistant, fast-curing voice coil adhesive, applicable to the preparation of the aforementioned high heat-resistant, fast-curing voice coil adhesive, includes the following steps:

[0015] Step 1: Preparation of component A resin solution: Dissolve the main resin, auxiliary resin, nano-oxides in the catalyst and some other additives in a diluent and mix them evenly;

[0016] Step 2: Preparation of component B filler slurry: The nano-carbon in the filler and catalyst is added to the remaining diluent to form a uniform slurry;

[0017] Step 3: Mixing: Add component B filler slurry to component A resin solution, and then add the curing agent and mix evenly.

[0018] Furthermore, steps one and two are performed under vacuum and at 20-40°C, involving high-speed shear mixing; in step three, the mixture is first cooled to room temperature before adding the curing agent, and then ultrasonically dispersed at a temperature below 30°C; wherein the curing agent must be pre-mixed evenly before being added.

[0019] In summary, this invention, through specific component design, achieves excellent high-temperature reliability and comprehensive mechanical properties while ensuring rapid curing. Specifically, the adhesive exhibits superior high-temperature resistance, thanks to the interpenetrating network structure formed by epoxy resin and phenolic resin, as well as the composite heat-resistant filler. Even after aging at 220°C for 500 hours, the surface remains crack-free, and the tensile shear strength retention rate is still above 80%. Simultaneously, the adhesive possesses highly efficient thermal conductivity; the thermal pathways constructed through special fillers rapidly dissipate heat from the voice coil, ensuring the stability and lifespan of high-power loudspeakers during long-term operation. Regarding the curing process, the adhesive employs a system of multiple curing agents combined with catalysis, enabling rapid reaction at temperatures above 105°C, reaching workable strength within 60 to 90 seconds, followed by deep curing, significantly shortening the production cycle. The voice coil coating adhesive provided by this invention demonstrates outstanding performance in heat resistance, heat dissipation efficiency, and curing speed, meeting the stringent requirements of high-reliability loudspeaker voice coils for bonding materials. It is highly practical and has significant potential for widespread application. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0021] This invention provides a high heat-resistant, fast-curing voice coil bonding adhesive. The composition enables rapid curing and imparts excellent long-term heat resistance, bonding strength, and toughness to the cured adhesive layer. This meets the dual requirements of high-efficiency production and high-power operation. In this embodiment, the high heat-resistant, fast-curing voice coil bonding adhesive is used for bonding and winding voice coils in mobile phones, tablets, computers, and automotive speaker horns.

[0022] The high heat-resistant, fast-curing voice coil coating adhesive comprises the following components: main resin, auxiliary resin, diluent, filler, curing agent, catalyst, and other additives; based on the total weight of the coating adhesive composition, it comprises the following components by weight percentage: Main resin component: 15%–50%; Auxiliary resin: 1%–20%; Diluent: 30% ∽ 60%; Filler: 5% ~ 20%; Hardener: 0.1% to 15%; Catalyst: 0.1%–15%; Other additives: 0%–5%.

[0023] The main resins include epoxy resin and phenolic resin. In this embodiment, phenolic resin is used as the matrix for heat resistance and flame retardancy, and epoxy resin is used as the reactive component for chemical toughening modification and co-curing. Further, the ratio of epoxy resin to phenolic resin is (25-45:44-75).

[0024] The epoxy resin is a high-temperature resistant epoxy resin. In this embodiment, the high-temperature resistant epoxy resin is a multifunctional epoxy resin, such as at least one of phenolic epoxy resin, bisphenol A type phenolic epoxy resin, biphenyl type epoxy resin, and naphthalene ring type epoxy resin.

[0025] The phenolic resin is selected from one or more of the following: methyl phenolic resin, linear phenolic resin, and phenolic resin obtained by polymerizing natural phenolic compounds containing long-chain alkyl substituents (e.g., cashew nut phenol derived from jaronut shell liquid) with monomers such as formaldehyde and phenol. The introduction of the long-chain alkyl group (usually C8-C22 alkyl or alkenyl groups) can impart better toughness and hydrophobicity to the cured product while maintaining the resin's heat resistance.

[0026] This invention utilizes a blend of epoxy resin and phenolic resin with the aforementioned specific composition for curing, resulting in a cured product with improved overall performance. The epoxy resin contributes excellent adhesion, mechanical strength, and chemical resistance, while the phenolic resin provides superior heat resistance and intrinsic flame retardancy. The interpenetrating or cross-linked network structure formed through blending and curing allows the cured product to simultaneously improve its heat resistance, flame retardancy, and mechanical strength while retaining the respective advantages of both epoxy and phenolic resins. This makes the adhesive suitable for applications requiring high temperature resistance and reliability.

[0027] The auxiliary resin is one or more of rosin resin and nitrile rubber. As a preferred rosin resin, modified rosin, such as hydrogenated rosin, disproportionated rosin, or polymerized rosin, can be used. These modified rosins have higher thermal stability and softening point, and better compatibility with the host resin. More preferably, to obtain a better balance of tackification, compatibility, and toughness, rosin-modified terpene resin can be used. As a preferred nitrile rubber, reactive liquid nitrile rubber, such as carboxyl-terminated liquid nitrile rubber (CTBN), can be used. Its lower viscosity and active end groups facilitate uniform dispersion in the composition and can participate in crosslinking reactions, thereby effectively improving the toughness of the cured product.

[0028] Depending on the different requirements for the final performance of the adhesive and the production process, the auxiliary resins can be selectively added: when the focus is on improving the impact toughness and crack resistance of the adhesive, nitrile rubber can be added as a toughening component; when the focus is on improving the application viscosity, wettability and processability of the adhesive, rosin-modified terpene resin can be added as a tackifying component; when it is necessary to simultaneously consider excellent toughness, heat resistance and good application process, nitrile rubber and rosin-modified terpene resin can be added together.

[0029] The filler is nano-silica (such as fumed silica and precipitated silica), which is used to enhance the mechanical properties of the adhesive, regulate its overall consistency, and improve the thixotropic index to improve processing performance.

[0030] The catalyst comprises nano-metal oxides and nano-carbon. The nano-metal oxides are one or more selected from nano-magnesium oxide, nano-calcium oxide, nano-titanium dioxide, and zinc oxide. The nano-carbon is one or more selected from carbon nanotubes and graphene oxide. The catalyst can promote the blending and curing reaction of the epoxy-phenolic resin through surface effects, acid-base catalysis, or by providing a thermally / electrically conductive network.

[0031] Preferably, the catalyst is a mixture of nano-metal oxide modified with a silane coupling agent and graphene oxide. The silane coupling agent-modified nano-metal oxide (especially strongly alkaline magnesium oxide, calcium oxide, etc.) can act as an alkaline catalyst, providing a locally alkaline environment for the reaction, promoting the decomposition of the curing agent. It can also act as an acid absorber / stabilizer, neutralizing byproducts and ensuring smooth curing of the resin. Furthermore, it can form coordinate or ionic bonds with the lone pair electrons on the oxygen atoms of phenolic hydroxyl groups. One metal ion can simultaneously coordinate with two or more phenolic ions, thereby forming an additional crosslinking point between polymer chains, bridged by metal ions, greatly enhancing the crosslinking density of the resin.

[0032] The carbon nanotubes and graphene oxide surfaces contain abundant functional groups such as carboxyl and epoxy groups (especially in graphene oxide). Their surface -COOH and -OH groups can directly react with epoxy groups or phenolic hydroxyl groups, becoming part of the network and altering the local chemical environment. Carbon nanotubes and graphene oxide have strong interactions with the benzene rings of phenolic resins, adsorbing and activating phenolic molecules. Furthermore, carbon nanotubes and graphene oxide possess extremely high thermal conductivity, enabling uniform and rapid heat transfer during curing, reducing internal temperature differences, and promoting overall curing from an engineering perspective. Due to their catalytic role, they remain in the system after the adhesive has fully cured, further improving the adhesive's thermal conductivity.

[0033] The two materials in the catalyst have different functions, but their combined use yields unexpected benefits. When metal oxides are used alone to catalyze the reaction, the heat released during adhesive curing is concentrated, easily leading to uneven internal temperature, internal stress, and defects. When nano-carbon (such as graphene oxide) is used alone for curing, graphene oxide in the organic phase resin prepolymer (usually an alcohol solution or bulk) is prone to re-stacking and agglomeration due to van der Waals forces and π-π interactions. Agglomeration significantly reduces its effective catalytic surface area, resulting in inefficient catalysis and a relatively low degree and slow rate of curing reaction. Therefore, when nano-metal oxides and graphene oxide are used in combination, the thermally conductive network formed by graphene oxide in the system can quickly dissipate the localized heat generated during the curing reaction, helping to improve the heat concentration problem during resin curing catalyzed by nano-metal oxides. This allows the metal oxides to maximize their catalytic effect, resulting in a more synchronized and stable curing process for the entire resin system, reducing thermal stress, avoiding pre-curing or degradation due to localized overheating, and ultimately obtaining a cured product with a more uniform structure and fewer defects. In contrast, nano-metal oxides, as zero-dimensional reinforcing agents, can be anchored onto graphene oxide sheets or dispersed in resin, acting as physical spacers between graphene oxide sheets. This effectively prevents the face-to-face aggregation of graphene oxide, allowing it to maintain a better exfoliation and dispersion state in the resin. Together, they construct a surface-point combined composite toughening network, effectively hindering crack propagation and molecular chain movement.

[0034] The diluent is selected from one or more of ketone solvents, ester solvents, and hydrocarbon solvents. Specifically, the ketone solvent is selected from at least one of methyl ethyl ketone, isopropanone, cyclohexanone, and methyl isobutyl ketone; the ester solvent is selected from at least one of ethyl acetate and dimethyl carbonate; and the hydrocarbon solvent is selected from at least one of toluene, xylene, and chloroform.

[0035] One embodiment of the diluent used in this invention is a mixture of methyl ethyl ketone: methyl isobutyl ketone: chloroform in a ratio of 8-6: 2-4: a small amount (e.g., 0.5). Methyl ethyl ketone exhibits excellent solubility in resins, possessing strong dissolving power and fast drying characteristics. Methyl isobutyl ketone also has strong dissolving power, but its higher boiling point results in slow drying. Using methyl ethyl ketone as the main solvent helps the adhesive dry quickly. Adding a certain proportion of methyl isobutyl ketone can regulate the drying rate, preventing the adhesive from drying too quickly and resulting in surface defects and internal solvent residue after curing. The small amount of chloroform acts as a co-solvent for dissolving the curing agent and the main solvent, helping the curing agent to disperse better in the system. It is understood that anhydrous ethanol can be used instead in other embodiments.

[0036] The curing agent comprises a latent curing agent, a rapid curing agent, and a high-temperature curing agent. The latent curing agent is one or more selected from hexamethylenetetramine, paraformaldehyde, toluenesulfonic acid, phosphate esters, and DOPO derivatives. The rapid curing agent is a cationic curing agent, preferably a boron trifluoride ethylamine complex that has been microencapsulated or coordinated modified. The high-temperature curing agent is an aromatic amine curing agent (such as diaminodiphenyl sulfone DDS, m-phenylenediamine m-PDA) or an anhydride curing agent (such as modified methylnadic anhydride MNA).

[0037] The three curing agents mentioned above differ in decomposition temperature, reaction rate, and curing mechanism. The different decomposition temperatures create a stepped curing process: rapid pre-curing at medium temperature with fast curing agents, full curing at medium to high temperature with latent curing agents, and finally, high-temperature post-curing dominated by high-temperature resistant curing agents. This significantly improves processability, reduces internal stress generated by direct high-temperature curing, and allows for the molding of thicker products. Regarding the improved reaction rate, fast curing agents provide initial reaction motive force, preventing excessively slow initial curing; latent curing agents greatly enhance reactivity and final crosslinking density; and high-temperature resistant curing agents offer the highest heat resistance potential. In terms of curing mechanism, the three mechanisms can foster a hybrid hybrid system where epoxy and phenolic networks interpenetrate. This structure effectively prevents crack propagation, significantly improving the material's toughness and crack resistance while maintaining high heat resistance and high modulus, achieving a balance between rigidity and toughness. Furthermore, the epoxy and phenolic networks cured by the high-temperature resistant curing agent are tightly bonded, preventing the tendency for single-network segments to move or decompose at high temperatures.

[0038] Other additives include leveling agents (such as polyether-modified polysiloxane), defoamers, and colorants (such as carbon black).

[0039] The present invention discloses a method for preparing a high heat-resistant, fast-curing voice coil coating adhesive, the specific steps of which are as follows:

[0040] Step 1: Preparation of Component A Resin Solution: Under light-protected and dry conditions, dissolve the main resins (epoxy resin and phenolic resin), auxiliary resins, nano-oxides in the catalyst, and some other additives in approximately 70%–80% of the total amount of diluent. Mix at high speed under vacuum at 20–40°C until completely dissolved and homogeneous. Cool to room temperature for later use.

[0041] Step 2: Preparation of Component B filler slurry: The nano-carbon (carbon nanotubes or graphene oxide) from the filler and catalyst is slowly added to the remaining diluent while stirring. Under vacuum conditions, the mixture is dispersed by high-speed shear stirring to form a uniform slurry.

[0042] Step 3: Mixing: Slowly add the B component filler slurry to the A component resin solution at a temperature below 30°C. Mix thoroughly in an ultrasonic disperser. After the mixture has completely cooled to room temperature, add all the pre-mixed curing agents (latent curing agent, fast curing agent, and high-temperature resistant curing agent). Mix thoroughly at low speed and with gentle stirring to avoid introducing too many air bubbles and prematurely initiating the reaction. Finally, add the remaining additives, mix thoroughly, discharge the mixture, immediately seal and package it, and store it in a cool, dry place.

[0043] To more clearly illustrate the technical solution and beneficial effects of the present invention, a comparison is made below with specific embodiments and comparative examples. Examples 1 and 2 represent preferred embodiments of the present invention; comparative examples 1-2 are used to compare and illustrate the effect of using the catalyst alone; and comparative example 3 is a commercially available conventional voice coil coating adhesive product. The amounts of each component are expressed in parts by weight, where "appropriate amount" indicates a conventional addition amount in the art (e.g., 0.1-5 parts). Specific proportions are shown in Table 1.

[0044] Table 1: Proportions of voice coil coating adhesives prepared in the examples and comparative examples

[0045] The voice coil adhesives for the above examples and comparative examples were prepared according to the preparation method of the high heat-resistant, fast-curing voice coil adhesive. Each adhesive was uniformly applied to the same standard copper wire-skeleton test piece and cured under the following stepped curing conditions: First stage: 105°C for 90 seconds; Second stage: 150°C for 5 minutes. The performance test results of the cured samples are shown in Table 2.

[0046] Table 2: Performance Tests of Voice Coil Coating Adhesives Prepared in Examples and Comparative Examples

[0047] It should be understood that the above embodiments are merely illustrative of the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

[0048] The test results in Table 2 show that:

[0049] 1. Regarding curing speed: The gel time of Examples 1-2 of this invention is significantly shorter than that of all comparative examples, which confirms that the multi-curing agent and catalyst compound system greatly improves the reaction rate.

[0050] 2. Regarding high-temperature resistance: The high-temperature shear strength at 200℃ and the strength retention rate after aging at 220℃ for 500 hours in the embodiments of this invention are both far superior to those of comparative examples 1-3. This directly demonstrates the synergistic enhancement effect of the epoxy-phenolic interpenetrating network structure and the composite catalyst system on high-temperature performance.

[0051] 3. In terms of overall performance: Comparative Example 1 (using only nano-metal oxides) and Comparative Example 2 (using only graphene oxide) have obvious shortcomings in various properties (such as slow curing, insufficient heat resistance or appearance defects). However, the embodiments of the present invention overcome the shortcomings of single materials by combining the two, and achieve comprehensive and balanced excellent performance, which is significantly better than the conventional product of Comparative Example 3.

[0052] In summary, this invention, through specific component design, achieves excellent high-temperature reliability and comprehensive mechanical properties while ensuring rapid curing. Specifically, the adhesive exhibits superior high-temperature resistance, thanks to the interpenetrating network structure formed by epoxy resin and phenolic resin, as well as the composite heat-resistant filler. Even after aging at 220°C for 500 hours, the surface remains crack-free, and the tensile shear strength retention rate is still above 80%. Simultaneously, the adhesive possesses highly efficient thermal conductivity; the thermal pathways constructed through special fillers rapidly dissipate heat from the voice coil, ensuring the stability and lifespan of high-power loudspeakers during long-term operation. Regarding the curing process, the adhesive employs a system of multiple curing agents combined with catalysis, enabling rapid reaction at temperatures above 105°C, reaching workable strength within 60 to 90 seconds, followed by deep curing, significantly shortening the production cycle. The voice coil coating adhesive provided by this invention demonstrates outstanding performance in heat resistance, heat dissipation efficiency, and curing speed, meeting the stringent requirements of high-reliability loudspeaker voice coils for bonding materials. It is highly practical and has significant potential for widespread application.

[0053] The embodiments described above only illustrate some implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A high heat-resistant, fast-curing voice coil coating adhesive, characterized in that: The composition comprises the following components by total weight: Main resin component: 15%–50%; Auxiliary resin: 1%–20%; Diluent: 30% ∽ 60%; Filler: 5% ~ 20%; Hardener: 0.1% to 15%; Catalyst: 0.1%–15%; Other additives: 0%–5%; The main resins include epoxy resin and phenolic resin; the catalysts include nano-metal oxides and nano-carbon; and the curing agents include latent curing agents, rapid curing agents, and high-temperature resistant curing agents.

2. The high heat-resistant, fast-curing voice coil coating adhesive as described in claim 1, characterized in that: The epoxy resin is a multifunctional high-temperature resistant epoxy resin, and the diluent is selected from at least one of ketone solvents, ester solvents, and hydrocarbon solvents.

3. The high heat-resistant, fast-curing voice coil coating adhesive as described in claim 2, characterized in that: The multifunctional high-temperature resistant epoxy resin is at least one of phenolic epoxy resin, bisphenol A type phenolic epoxy resin, biphenyl type epoxy resin, and naphthalene ring type epoxy resin.

4. The high heat-resistant, fast-curing voice coil coating adhesive as described in claim 1, characterized in that: The phenolic resin is selected from at least one of the following: methyl phenolic resin, linear phenolic resin, and phenolic resin obtained by polymerizing natural phenolic compounds containing long-chain alkyl substituents with monomers such as formaldehyde and phenol.

5. The high heat-resistant, fast-curing voice coil coating adhesive as described in claim 1, characterized in that: The auxiliary resin is at least one of rosin resin and nitrile rubber.

6. The high heat-resistant, fast-curing voice coil coating adhesive as described in claim 1, characterized in that: The nano-metal oxide is at least one of nano-magnesium oxide, nano-calcium oxide, nano-titanium dioxide, and zinc oxide, and the nano-carbon is at least one of carbon nanotubes and graphene oxide.

7. The high heat-resistant, fast-curing voice coil coating adhesive as described in claim 1, characterized in that: The catalyst is a mixture of nano-metal oxides modified with silane coupling agents and graphene oxide.

8. The high heat-resistant, fast-curing voice coil coating adhesive as described in claim 1, characterized in that: The filler is silicon dioxide.

9. A method for preparing a high heat-resistant, fast-curing voice coil adhesive, used to prepare the high heat-resistant, fast-curing voice coil adhesive as described in any one of claims 1 to 8, characterized in that: Includes the following steps: Step 1: Preparation of component A resin solution: Dissolve the main resin, auxiliary resin, nano-oxides in the catalyst and some other additives in a diluent and mix them evenly; Step 2: Preparation of component B filler slurry: The nano-carbon in the filler and catalyst is added to the remaining diluent to form a uniform slurry; Step 3: Mixing: Add component B filler slurry to component A resin solution, and then add the curing agent and mix evenly.

10. The preparation method of the high heat-resistant, fast-curing voice coil coating adhesive as described in claim 9, characterized in that: Steps one and two involve high-speed shear mixing under vacuum and 20-40°C conditions; in step three, the mixture is first cooled to room temperature before adding the curing agent, and then ultrasonically dispersed at a temperature below 30°C; the curing agent must be pre-mixed evenly before being added.

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