High-thermal-conductivity high-reliability silicone thermal conductive adhesive, preparation method and application thereof

Abstract

The present application relates to the field of heat-conducting adhesive glue, in particular to a high-heat-conducting and high-reliability silicone heat-conducting adhesive glue, a preparation method and application thereof, the silicone heat-conducting adhesive glue comprises the following components by weight: composite heat-conducting filler: 80-100 parts; end-vinyl silicone oil: 10-40 parts; branched polysiloxane: 1-20 parts; hydrogen-containing silicone oil crosslinking agent: 1-10 parts; inhibitor: 0.01-0.5 parts; platinum catalyst: 0.1-2 parts; silane coupling agent: 0.5-5 parts; the branched polysiloxane comprises phenyl, and the silane coupling agent comprises vinyl, epoxy and alkoxy.The branched polysiloxane containing phenyl is introduced in the present application, the flexibility and anti-cracking ability of the glue body are significantly improved while maintaining the high heat-conducting filler filling amount, and the thermal stress is effectively buffered.The multi-functional silane coupling agent with vinyl, epoxy and alkoxy is adopted, the interface bonding strength with various substrates is greatly enhanced, and the long-term durability in harsh environments such as damp heat and cold heat cycle is improved.

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