Interface optimization and low-temperature forming method of solid waste-based high-thermal-conductivity heat storage material

Abstract

The application provides an interface optimization and low-temperature forming method of solid waste-based high-thermal-conductivity heat storage material, which comprises the following steps: coal gangue powder with a preset particle size range is immersed in a titanium / silicon bifunctional coupling liquid, and a quaternary covalent bond interface transition layer is constructed on the surface of the powder through step-by-step hydrolysis; in the interface transition layer, the thermal expansion coefficient decreases gradually from the outside to the inside of the transition layer, so as to realize thermal matching with the matrix; surface modified flakes and nano orientation agents are added to the matrix slurry and uniformly dispersed; then, the flake layers are arranged vertically to the heat flow direction by applying a pulse magnetic field before the slurry is solidified; through a low-temperature pressure densification process, the activation energy of interface atomic diffusion is reduced by using the surface hydroxyl dynamic recombination mechanism mediated by water molecules, and the efficient diffusion and strong chemical combination of the interface transition layer at a lower temperature are promoted. One technical effect of the application is that the interface failure and low-temperature forming problem of the solid waste-based heat storage material are better solved.

Description

Technical Field

[0001] This invention belongs to the field of preparation technology of solid waste-based high thermal conductivity thermal storage materials, specifically relating to an interface optimization and low-temperature molding method for solid waste-based high thermal conductivity thermal storage materials. Background Technology

[0002] In the field of solid waste-based high thermal conductivity thermal storage materials, current technologies face challenges related to interface failure and low-temperature molding, which limit the material's performance and application range. Chinese invention patent application CN119928354A discloses a lightweight composite reinforced material that solves the microcrack problem caused by differences in thermal expansion coefficients through a core-shell structure and dynamic aging process, combined with magnetic field-assisted orientation and nano-interface reinforcement. However, its main focus is on lightweight and high strength, rather than the high thermal conductivity and low-temperature molding process of the thermal storage material.

[0003] Therefore, there is an urgent need for an interface optimization and low-temperature forming method for solid waste-based high thermal conductivity thermal storage materials, so as to better solve the problems of interface failure and low-temperature forming of solid waste-based thermal storage materials in the existing technology. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art, and to provide a new technical solution for interface optimization and low-temperature molding method of solid waste-based high thermal conductivity thermal storage material.

[0005] According to a first aspect of the present invention, a method for interface optimization and low-temperature molding of a solid waste-based high thermal conductivity thermal storage material is provided, comprising the following steps: Step S1: Impregnate coal gangue powder within a preset particle size range in a titanium / silicon bifunctional coupling liquid. Construct a Ti-Al-Si-O quaternary covalent bond interface transition layer on the powder surface through stepwise hydrolysis. The interface transition layer is mainly composed of Ti-O-Al and Si-O-Si and also contains Ti-O-Si bonds. In the interface transition layer, the coefficient of thermal expansion decreases gradually from the outside to the inside of the transition layer to achieve thermal matching with the matrix. In step S2, the surface-modified flakes and nano-directing agent are added to the matrix slurry and dispersed uniformly; then, before the slurry is cured, a pulsed magnetic field of 1.0-2.0 T and 0.5 Hz is applied to align the flake layers perpendicular to the heat flow direction to construct an efficient heat conduction network. Step S3 involves using a low-temperature pressure densification process to reduce the activation energy of interfacial atomic diffusion through a water molecule-mediated dynamic recombination mechanism of surface hydroxyl groups. This promotes efficient diffusion and strong chemical bonding of the interfacial transition layer at lower temperatures, thereby achieving high densification and interfacial strengthening of the material.

[0006] Optionally, in step S1, the thickness of the interface transition layer is 80-200 nm.

[0007] Optionally, in step S3, the parameters of the low-temperature pressure densification process are as follows: The temperature is 280-320℃, the pressure is 450-550MPa, and the temperature is maintained for 8-15 minutes in an environment with surface hydroxyl activity.

[0008] Optionally, in step S1, the titanium / silicon bifunctional coupling liquid is prepared as follows: S11, Tetrabutyl titanate and silane coupling agent are added to the ethanol mixture; S12. Slowly add deionized water dropwise while continuously stirring; S23. Continue stirring the reaction at room temperature for 1 hour to obtain the titanium / silicon bifunctional coupling agent.

[0009] Optionally, in the titanium / silicon bifunctional coupling agent, the mass ratio of tetrabutyl titanate to silane coupling agent is 1:2.

[0010] Optionally, in the titanium / silicon bifunctional coupling agent, the volume ratio of tetrabutyl titanate to silane coupling agent is 1:2.

[0011] Optionally, in step S2, the surface-modified scales are α-FeO.

[0012] Optionally, in step S2, the nanoguide agent is FeO nanopowder.

[0013] Optionally, in step S2, a pulsed magnetic field of 1.5 T is applied.

[0014] Optionally, the preset particle size range is 50-100μm.

[0015] One technical advantage of this invention is that: In this embodiment, a quaternary covalent bond interface transition layer is constructed on the surface of solid waste using a stepped interface bonding reconstruction process and a titanium / silicon bifunctional coupling liquid. This solves the problem of low coverage of traditional single coupling agents and significantly improves the interface shear strength and thermal stability.

[0016] Moreover, by employing a magnetically controlled orientation arrangement process, FeO forms a "template array" under the induction of a magnetic field, constraining the orientation error of the flakes to <5°, thereby achieving precise control of the orientation of the sheet filler, breaking through the theoretical limit of random dispersion, and significantly improving the in-plane thermal conductivity of the material.

[0017] Furthermore, by employing a low-temperature pressure densification process, not only is the sintering temperature reduced, but the diffusion activation energy is also lowered through water molecule-mediated surface hydroxyl recombination, thereby achieving material densification and high thermal conductivity.

[0018] Therefore, this application innovatively employs a titanium / silicon dual coupling agent step reaction, a magnetron orientation alignment process, and a low-temperature pressure densification process to achieve interface optimization and low-temperature molding of solid waste-based high thermal conductivity thermal storage materials. This solves the problems of interface failure and low-temperature molding of solid waste-based thermal storage materials, and provides new ideas and methods for the development of high-performance thermal storage materials. Attached Figure Description

[0019] Figure 1 This is a schematic flowchart of an interface optimization and low-temperature molding method for a solid waste-based high thermal conductivity thermal storage material according to an embodiment of the present invention. Figure 2 A diagram showing the comparison of the microstructure of the interface before and after optimization; Figure 3 A schematic diagram showing the comparison of thermal conductivity changes before and after optimization; Figure 4 A schematic diagram showing the comparison of bright field images before and after optimization; Figure 5 A schematic diagram illustrating the change in thermal conductivity attenuation rate before and after optimization; Figure 6 This is a diagram showing the overall performance comparison before and after optimization.

[0020] In the figure: 1. Large-pore channel; 2. Weakly bonded interface; 3. Loose interface region; 4. Closely contacted interface; 5. Ti-Al-Si-O quaternary covalent bond; 6. Competing adsorption sites; 7. Low thermal conductivity peak value in the low-temperature region before optimization; 8. High thermal conductivity peak value in the medium-temperature region after optimization; 9. Enlargement of amorphous region; 10. Interface gaps and large-pore channel; 11. Ti-Al-Si-O quaternary covalent bond transition layer; 121. Decay point after 400 cycles before optimization; 122. Decay point after 400 cycles after optimization; 131. Decay point after 1000 cycles before optimization; 132. Decay point after 1000 cycles after optimization. Detailed Implementation

[0021] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0022] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0023] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0024] According to a first aspect of the invention, see Figure 1 This paper provides a method for interface optimization and low-temperature molding of a solid waste-based high thermal conductivity thermal storage material, including the following steps: Step S1, Stepped interface bonding reconstruction process: Coal gangue powder within a preset particle size range is impregnated in a titanium / silicon bifunctional coupling liquid. Through stepwise hydrolysis, a Ti-Al-Si-O quaternary covalent bond interface transition layer is constructed on the powder surface, mainly composed of Ti-O-Al and Si-O-Si, and also containing Ti-O-Si bonds. In the interface transition layer, the coefficient of thermal expansion decreases gradually from the outside to the inside of the transition layer to achieve thermal matching with the matrix.

[0025] In the above steps, by constructing a Ti-Al-Si-O quaternary covalent bond transition layer (thickness 80-200 nm), the coefficient of thermal expansion (CTE) was graded and controlled, with its value increasing from 8.5 × 10⁻⁶ for the surface layer. -6 / K gradually decreases to 5.5×10 in the inner layer. -6 The / K gradient layer effectively alleviates stress concentration caused by thermal mismatch at the interface. This transition layer significantly enhances the interfacial bonding strength, increasing the interfacial shear strength to 26.5 MPa, an improvement of approximately 8.2% compared to the unoptimized 24.5 MPa. More importantly, after 100 hours of high-temperature oxidation treatment at 800℃, the adhesion retention rate between the coating and the substrate still exceeds 90%, demonstrating excellent high-temperature stability and interfacial durability. These results indicate that the Ti-Al-Si-O gradient transition layer not only effectively improves the interfacial mechanical properties but also significantly enhances the oxidation resistance and structural reliability of the coating system under high-temperature environments.

[0026] It should be noted that the step-by-step hydrolysis is achieved using the following formula: Ti(OR)4+ Al-OH→Ti-O-Al + ROH; Si(OR')4+ Si-OH→Si-O-Si network.

[0027] Step S2, Magnetically controlled orientation alignment process design: Surface-modified flakes and nano-directing agents are added to the matrix slurry and uniformly dispersed; then, before the slurry is cured, a pulsed magnetic field of 1.0-2.0 T and 0.5 Hz is applied to align the flake layers perpendicular to the heat flow direction to construct an efficient heat conduction network.

[0028] In the above steps, under the induction of a magnetic field, FeO nanostructures form an ordered "template array" in situ. Its magnetic anisotropy drives the directional arrangement of the flake-like phases, effectively constraining grain orientation deviations and keeping the orientation error within 5°. This magnetic field regulation mechanism significantly improves the orderliness of the microstructure in multiphase coatings or composite materials, providing a structural basis for achieving interface matching and uniform stress distribution. Furthermore, through ordered microstructure design (such as magnetically induced template arrays or gradient self-assembly), highly interconnected thermal conductive pathways are constructed, achieving a structural connectivity of 92% for the thermal conductive network, significantly higher than the 34% of traditional disordered systems. This high connectivity effectively reduces interfacial thermal resistance and improves the transport efficiency of phonons or charge carriers, providing structural assurance for a significant enhancement of the overall thermal conductivity of the material. In addition, by constructing a highly interconnected thermal conductive network (reaching 92%), the in-plane heat transfer path is significantly optimized, increasing the in-plane thermal conductivity of the material to 14.3 W / (m·K), a 615% improvement compared to traditional disordered systems (approximately 2.0 W / (m·K)). This performance leap stems from the effective connection of phonon transport channels by the ordered microstructure and the synergistic suppression of interfacial thermal resistance, demonstrating the decisive regulatory role of structural design in thermal management performance. Furthermore, the porosity decreased from 5.2% to 0.7%.

[0029] Step S3, Low-temperature pressure densification (synergistic strengthening) process: Through the low-temperature pressure densification process, the activation energy of interfacial atomic diffusion is reduced by the water molecule-mediated dynamic recombination mechanism of surface hydroxyl groups, which promotes efficient diffusion and strong chemical bonding of the interfacial transition layer at a lower temperature, so as to achieve high densification and interfacial strengthening of the material.

[0030] In the above steps, under high pressure, the interfacial atomic interdiffusion kinetics are significantly enhanced, with a diffusion coefficient reaching D = 10 m / s, promoting atomic-level metallurgical bonding between the matrix and the functional layer. Simultaneously, residual water molecules mediate the dynamic recombination of surface hydroxyl groups (-OH) under high pressure, effectively passivating dangling bonds and reconstructing the interfacial chemical environment, significantly reducing the activation energy barrier for atomic diffusion. Moreover, this "high pressure-water molecule synergy" mechanism enables the construction of a dense, low-defect interface, controlling the overall porosity of the material to <0.8%. As a result, the long-term stability of the thermal interface is greatly improved; after 1000 thermal cycles, the thermal conductivity decay rate is ≤4.5%, exhibiting excellent fatigue resistance and durability.

[0031] In this embodiment, a quaternary covalent bond interface transition layer is constructed on the surface of solid waste using a stepped interface bonding reconstruction process and a titanium / silicon bifunctional coupling liquid. This solves the problem of low coverage of traditional single coupling agents and significantly improves the interface shear strength and thermal stability.

[0032] Moreover, by employing a magnetically controlled orientation arrangement process, FeO forms a "template array" under the induction of a magnetic field, constraining the orientation error of the flakes to <5°, thereby achieving precise control of the orientation of the sheet filler, breaking through the theoretical limit of random dispersion, and significantly improving the in-plane thermal conductivity of the material.

[0033] Furthermore, by employing a low-temperature pressure densification process, not only is the sintering temperature reduced, but the diffusion activation energy is also lowered through water molecule-mediated surface hydroxyl recombination, thereby achieving material densification and high thermal conductivity.

[0034] Therefore, this application innovatively employs a titanium / silicon dual coupling agent step reaction, a magnetron orientation alignment process, and a low-temperature pressure densification process to achieve interface optimization and low-temperature molding of solid waste-based high thermal conductivity thermal storage materials. This solves the problems of interface failure and low-temperature molding of solid waste-based thermal storage materials, and provides new ideas and methods for the development of high-performance thermal storage materials.

[0035] Optionally, in step S1, the thickness of the interface transition layer is 80-200nm, which not only effectively alleviates thermal stress but also helps to optimize the interface bonding strength, achieving the synergistic goal of "lightweight + high-efficiency enhancement".

[0036] Optionally, in step S3, the parameters of the low-temperature pressure densification process are as follows: At temperatures of 280-320℃ and pressures of 450-550MPa, the material is kept at a temperature of 8-15 minutes in an environment with active surface hydroxyl groups. This not only maintains the nanoscale properties and functional stability of the material, but also promotes particle rearrangement and plastic deformation under high pressure, achieving a relative density of >95% at low temperatures. In addition, the surface hydroxyl (-OH) environment enhances interfacial reactions and bonding, achieving "low-temperature chemical densification" and significantly improving interfacial bonding strength.

[0037] Optionally, in step S1, the titanium / silicon bifunctional coupling liquid is prepared as follows: S11, Tetrabutyl titanate and silane coupling agent are added to the ethanol mixture; S12. Slowly add deionized water dropwise while continuously stirring; S23. Continue stirring the reaction at room temperature for 1 hour to obtain the titanium / silicon bifunctional coupling agent.

[0038] In the above embodiments, molecular-level synergistic coupling of titanium and silicon is achieved, and the reaction conditions are mild, energy-saving and environmentally friendly, and the hydrolysis process is controllable, which can avoid excessively rapid gelation and the generation of active intermediates, and significantly improve the interfacial bonding force.

[0039] Optionally, in the titanium / silicon bifunctional coupling agent, the mass ratio of tetrabutyl titanate to silane coupling agent is 1:2. This not only achieves synergistic optimization of titanium and silicon functional groups, but also obtains a uniform, transparent, and stable coupling liquid, avoids early gelation, and helps improve the flexibility and durability of the final material.

[0040] Optionally, in the titanium / silicon bifunctional coupling agent, the volume ratio of tetrabutyl titanate to silane coupling agent is 1:2, which is simple to operate, conducive to industrial scale-up, and also helps to maintain a reasonable distribution of functional groups and reaction equilibrium.

[0041] Optionally, in step S2, the surface-modified flakes are α-FeO. Using α-FeO ​​as the surface-modified flake material not only improves the physicochemical properties of the composite material, but also has environmental friendliness and cost advantages.

[0042] Optionally, in step S2, the nanoguide agent is FeO nanoparticles, which not only have good biocompatibility and degradability, but also magnetic responsiveness.

[0043] Optionally, in step S2, a pulsed magnetic field of 1.5 T is applied to achieve the orderly distribution or layered stacking of micro and nano fillers in the matrix, which helps to improve the compactness, barrier properties, and thermal / electrical conductivity of the material.

[0044] Optionally, the preset particle size range is 50-100μm, the specific surface area of ​​the coal gangue powder is moderate, which is conducive to uniform impregnation and reaction, and the synergistic effect of the two functional groups significantly improves the interfacial compatibility.

[0045] In the embodiments of this application, such as Figure 2 As shown, before optimization, there are large-pore channels 1 at the interface between the solid waste matrix and the reinforcing material (i.e., coating), and the interface is a weakly bonded interface 2, with a loose interface region 3. The weak bonding of the interface leads to a rapid decay of the material properties. After optimization, a tight competitive adsorption interface (i.e., tight contact interface 4) is formed between the solid waste matrix and the reinforcing material. There are Ti-Al-Si-O quaternary covalent bonds 5 between the solid waste matrix and the tight contact interface 4, and the tight contact interface 4 has competitive adsorption sites 6. The interface bonding strength is enhanced, and the thermal conductivity is improved.

[0046] like Figure 3 As shown, Figure 3Figures a and b show the trend of thermal conductivity changes before and after optimization: After interface optimization, the proportion of the amorphous region at the outer edge of the sample increases and the peak value shifts to a lower temperature range, indicating that the rapidly softened interface layer enhances the heat transfer capacity on both sides of the interface, which is beneficial for heat transfer to deeper parts.

[0047] Specifically, Figure 3 The diagram shows the low thermal conductivity peak value 7 in the low-temperature region before optimization, the high thermal conductivity peak value 8 in the mid-temperature region after optimization, and the expansion of the amorphous region 9. Figure 3 This paper analyzes the trend of thermal conductivity variation in the medium and examines the characteristics of thermal conductivity change with temperature. Before optimization (a): The peak thermal conductivity appears in the low temperature region (50℃), but the peak value is low (2.3W / m·K) and decreases rapidly with increasing temperature.

[0048] After optimization (b): the peak thermal conductivity is significantly improved (14.3 W / m·K) and shifts to the medium temperature range (150℃), while the thermal conductivity in the high temperature range is significantly improved.

[0049] Technical significance: The precise orientation structure (error <5°) formed by Fe3O4 magnetic template guiding technology increases the connectivity of the heat conduction network from 34% to 92%, significantly improving the in-plane thermal conductivity of the material. The shift in peak temperature indicates that interface optimization enhances heat transfer efficiency.

[0050] like Figure 4 As shown, Figure 4 The diagram shows the interface gaps and large-diameter channels 10 before optimization, and the Ti-Al-Si-O quaternary covalent bond transition layer 11 after optimization. Figure 4 Comparison of bright-field images of the interface, a and b: After interface optimization, the two interfaces of the sample have a high degree of adhesion, and the gaps have almost disappeared.

[0051] Specifically, for Figure 4 The microstructure of the interface was analyzed, and the bright-field images of the interface were compared as follows: Before optimization (a): The interface has obvious gaps and large-diameter channels (porosity > 5%), resulting in low interfacial bonding strength.

[0052] After optimization (b): the interface gaps disappear, forming a uniform and continuous Ti-Al-Si-O quaternary covalent bond transition layer (thickness 80-200nm).

[0053] Technical significance: The stepped interface bonding reconstruction process solves the problem of low coverage of traditional single coupling agents, and the coefficient of thermal expansion is gradient controlled (surface layer 8.5×10). -6 / K→Inner layer 5.5×10 -6 / K significantly improves interfacial shear strength and thermal stability, with a bonding strength retention rate of >90% after oxidation at 800℃ for 100h.

[0054] like Figure 5 As shown, Figure 5 The graph shows the variation of the thermal conductivity decay rate of the sample: the sample with optimized interface has good cyclic stability, and the cooling rate did not decrease significantly after 1000 hours of high-temperature storage.

[0055] Specifically, Figure 5 In the optimization, the decay point for the first 400 cycles is 121, the decay point for the next 400 cycles is 122, the decay point for the first 1000 cycles is 131, and the decay point for the next 1000 cycles is 132. Figure 5 The thermal cycling stability was analyzed, and the thermal conductivity decay rate changed with the number of thermal cycles as follows: Before optimization, the thermal conductivity degraded rapidly with the number of thermal cycles, with a degradation rate of 22.8% after 1000 cycles.

[0056] After optimization, the thermal conductivity decay rate is significantly reduced, with a decay rate of ≤4.5% after 1000 cycles.

[0057] Technical significance: The low-temperature pressure densification process (280-320℃, 450-550MPa) combined with the water molecule-mediated surface hydroxyl recombination mechanism reduces the porosity of the material to below 0.8%, significantly improving the thermal cycling stability of the material. After 1000 hours of high-temperature storage, the cooling rate did not show a significant decrease.

[0058] like Figure 6 As shown, Figure 6 The diagram shows a comparison of the overall performance before and after optimization. As can be seen, the optimized sample has improved thermal conductivity, increased interfacial strength, reduced porosity, and improved thermal stability.

[0059] Specifically, Figure 6 The overall performance comparison analysis is shown in Table 1.

[0060] Table 1 shows the overall performance comparison.

[0061] In summary, this application innovatively employs a titanium / silicon dual coupling agent stepwise reaction to construct a quaternary covalent bond transition layer, and the Fe3O4 magnetic template guiding technology achieves precise orientation of the sheet-like filler (error <5°). Furthermore, water-mediated low-temperature densification technology achieves ultra-low porosity (<0.8%).

[0062] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A method for interface optimization and low-temperature molding of a solid waste-based high thermal conductivity thermal storage material, characterized in that, Includes the following steps: Step S1: Impregnate coal gangue powder within a preset particle size range in a titanium / silicon bifunctional coupling liquid. Construct a Ti-Al-Si-O quaternary covalent bond interface transition layer on the powder surface through stepwise hydrolysis. The interface transition layer is mainly composed of Ti-O-Al and Si-O-Si and also contains Ti-O-Si bonds. In the interface transition layer, the coefficient of thermal expansion decreases gradually from the outside to the inside of the transition layer to achieve thermal matching with the matrix. In step S2, the surface-modified flakes and nano-directing agent are added to the matrix slurry and dispersed uniformly; then, before the slurry is cured, a pulsed magnetic field of 1.0-2.0 T and 0.5 Hz is applied to align the flake layers perpendicular to the heat flow direction to construct an efficient heat conduction network. Step S3 involves using a low-temperature pressure densification process to reduce the activation energy of interfacial atomic diffusion through a water molecule-mediated dynamic recombination mechanism of surface hydroxyl groups. This promotes efficient diffusion and strong chemical bonding of the interfacial transition layer at lower temperatures, thereby achieving high densification and interfacial strengthening of the material.

2. The interface optimization and low-temperature molding method for solid waste-based high thermal conductivity heat storage materials according to claim 1, characterized in that, In step S1, the thickness of the interface transition layer is 80-200 nm.

3. The interface optimization and low-temperature molding method for solid waste-based high thermal conductivity heat storage materials according to claim 1, characterized in that, In step S3, the parameters of the low-temperature pressure densification process are as follows: The temperature is 280-320℃, the pressure is 450-550MPa, and the temperature is maintained for 8-15 minutes in an environment with surface hydroxyl activity.

4. The interface optimization and low-temperature molding method for solid waste-based high thermal conductivity heat storage materials according to claim 1, characterized in that, In step S1, the preparation method of the titanium / silicon bifunctional coupling liquid is as follows: S11, Tetrabutyl titanate and silane coupling agent are added to the ethanol mixture; S12. Slowly add deionized water dropwise while continuously stirring; S23. Continue stirring the reaction at room temperature for 1 hour to obtain the titanium / silicon bifunctional coupling agent.

5. The interface optimization and low-temperature molding method for solid waste-based high thermal conductivity heat storage materials according to claim 4, characterized in that, In titanium / silicon bifunctional coupling agents, the mass ratio of tetrabutyl titanate to silane coupling agent is 1:

2.

6. The interface optimization and low-temperature molding method for solid waste-based high thermal conductivity heat storage materials according to claim 4, characterized in that, In the titanium / silicon bifunctional coupling agent, the volume ratio of tetrabutyl titanate to silane coupling agent is 1:

2.

7. The interface optimization and low-temperature molding method for solid waste-based high thermal conductivity heat storage materials according to claim 1, characterized in that, In step S2, the surface-modified scales are α-FeO.

8. The interface optimization and low-temperature molding method for solid waste-based high thermal conductivity heat storage materials according to claim 1, characterized in that, In step S2, the nanoguide agent is FeO nanopowder.

9. The interface optimization and low-temperature molding method for solid waste-based high thermal conductivity heat storage materials according to claim 1, characterized in that, In step S2, a pulsed magnetic field of 1.5 T is applied.

10. The interface optimization and low-temperature molding method for solid waste-based high thermal conductivity heat storage materials according to claim 1, characterized in that, The preset particle size range is 50-100μm.

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