A film forming apparatus
By adjusting the stacking direction of the insulation plates in the film-forming device and using insulation components made of carbon fiber cloth, the problem of uneven temperature of the heated components was solved, the uniformity of the temperature of the heated components was improved, and the quality of the substrate reaction was ensured.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WUXI LEADPRO TECH CO LTD
- Filing Date
- 2024-11-29
- Publication Date
- 2026-05-29
AI Technical Summary
In existing film deposition apparatuses, the temperature decays rapidly at the edge of the heated component, resulting in a temperature gradient between the central and edge regions, poor temperature uniformity, and affecting the substrate reaction quality.
The insulation component is made of multi-layer carbon fiber cloth. By adjusting the stacking direction of the insulation boards, the eddy current generated by the first insulation board in the electromagnetic field of the induction coil is smaller than that of the second insulation board. This weakens the heating capacity of the first insulation board and enhances the heating capacity of the second insulation board, thereby slowing down the temperature decay rate of the outer edge area of the heated component and improving the temperature uniformity.
By adjusting the stacking direction of the insulation plates, the temperature gradient between the middle and outer regions of the heated component is reduced, improving the overall temperature uniformity of the heated component and providing a stable temperature environment for the substrate reaction.
Smart Images
Figure CN122105374A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of film-forming equipment technology, specifically relating to a film-forming device. Background Technology
[0002] Currently, in the field of film deposition apparatus, an induced magnetic field is applied to the heated component using an induction coil to provide the temperature field necessary for the substrate reaction. Typically, an insulation layer is installed within the reaction chamber to keep the heated component warm.
[0003] However, the insulation effect of the insulation layer is poor in the edge area of the heated component, resulting in a temperature gradient between the central and edge areas of the heated component, poor temperature uniformity, and affecting the reaction quality of the substrate. Summary of the Invention
[0004] Purpose of the invention: The embodiments of this application provide a film-forming device, which aims to overcome the technical problems of poor heat preservation effect of the current heat insulation layer, temperature gradient between the central area and the edge area of the heated component, and poor temperature uniformity.
[0005] Technical solution: The film-forming apparatus provided in this application includes:
[0006] The shell has a receiving cavity;
[0007] A heat-receiving component, which has a plate-like structure, is disposed within the receiving cavity. The heat-receiving component has a bearing surface for supporting the substrate.
[0008] An induction coil is disposed on the outside of the housing and is at least partially disposed in the vertical direction corresponding to the heated element;
[0009] An insulation component is disposed within the receiving cavity. The insulation component is composed of multiple layered insulation materials stacked together, including carbon fiber cloth. The insulation component includes a first insulation board and a second insulation board. The first insulation board is located between the induction coil and the heated component. The second insulation board surrounds and connects to the first insulation board. On a plane perpendicular to the vertical direction, the orthographic projection of the second insulation board at least covers the outer edge of the heated component. The layered insulation materials of the first insulation board have a first stacking direction, and the layered insulation materials of the second insulation board have a second stacking direction. The first stacking direction is parallel to or at a first angle to the bearing surface, and the second stacking direction is at a second angle to the bearing surface. The first angle is smaller than the second angle.
[0010] In some embodiments, the first angle is between 0 and 45°, and the second angle is 90° or between 45 and 90°.
[0011] In some embodiments, the induction coil is a disc-shaped spiral structure, the induction coil has a central axis, the first stacking direction is parallel to the bearing surface, and the second stacking direction makes an angle of 90° with the bearing surface.
[0012] In some embodiments, the induction coils extend in a row, and each induction coil includes a first portion of coils, which are disposed in a vertical direction corresponding to the heated element, and the first portion of coils are arranged side by side in a second plane.
[0013] The first stacking direction is parallel to the second plane or has a third angle, the second stacking direction is perpendicular to the second plane or has a fourth angle, the third angle is between 0-45°, and the fourth angle is between 45-90°.
[0014] In some embodiments, the multiple layers of insulation material of the first insulation board are stacked circumferentially around the central axis; or, the first insulation board includes multiple insulation blocks, which are arranged circumferentially around the central axis, and adjacent insulation blocks are spliced together to form a plate shape that matches the shape of the heated component.
[0015] In some embodiments, the first insulation board includes a plurality of insulation blocks, the plurality of insulation blocks being strip-shaped blocks arranged side by side, and the arrangement direction of the plurality of insulation blocks being parallel to the extension direction of the first portion of the coil.
[0016] In some embodiments, the heat-insulating member includes a third heat-insulating plate, which is disposed around the periphery of the heat-receiving member and cooperates with the first heat-insulating plate and the second heat-insulating plate to form a receiving groove, wherein the heat-receiving member is at least partially disposed within the receiving groove.
[0017] In some embodiments, the heated element is disc-shaped or annular, and in the first radial direction of the heated element, the extension surface of the layered insulation material of the third insulation board is perpendicular to the first radial direction or forms a fifth angle with the first radial direction, wherein the fifth angle is between 45° and 90°.
[0018] In some embodiments, the heating element includes a first heating body and a second heating body, the first heating body and the second heating body are arranged in a vertical direction and are spaced apart to form a reaction chamber, the first heating body is housed in the receiving groove, and the bearing surface is located on the side of the first heating body facing the reaction chamber;
[0019] The insulation component further includes a fourth insulation plate, which is located at least on the side of the second heat-receiving body away from the bearing surface. The fourth insulation plate connects the second heat-receiving body and the shell respectively, and the projection of the fourth insulation plate on a plane perpendicular to the vertical direction covers the second heat-receiving body.
[0020] In some embodiments, the insulation component further includes a fifth insulation plate, which is located between the third insulation plate and the fourth insulation plate and connects the third insulation plate and the fourth insulation plate. The fifth insulation plate is configured as a plate extending in the vertical direction.
[0021] In some embodiments, the film-forming apparatus further includes a rotating assembly that passes through the bottom wall of the housing and is connected to the heated component. A plurality of heat-insulating blocks are arranged around the rotating assembly, and the heat-insulating blocks are clearance-fitted with the rotating assembly.
[0022] Beneficial effects: The film-forming apparatus in this application embodiment includes a housing, a heating element, an induction coil, and a heat-insulating element; wherein, the housing has a receiving cavity; the heating element has a plate-like structure and is disposed in the receiving cavity, and the heating element has a bearing surface for supporting the substrate; the induction coil is disposed on the outside of the housing, and has at least a portion corresponding to the heating element in the vertical direction; the heat-insulating element is disposed in the receiving cavity, and the heat-insulating element is composed of multiple layered heat-insulating materials stacked together, the layered heat-insulating materials including carbon fiber cloth, the heat-insulating element including a first heat-insulating plate and a second heat-insulating plate, the first heat-insulating plate being located between the induction coil and the heating element, and on a plane perpendicular to the vertical direction, the orthographic projection of the second heat-insulating plate at least covers the outer edge of the heating element, the layered heat-insulating materials of the first heat-insulating plate having a first stacking direction, the layered heat-insulating materials of the second heat-insulating plate having a second stacking direction, the first stacking direction being parallel to the bearing surface or arranged at a first angle, the second stacking direction being arranged at a second angle to the bearing surface, and the first angle being smaller than the second angle. By using the different stacking directions of the internal layered insulation materials of the first and second insulation boards, the eddy current generated by the first insulation board in the electromagnetic field of the induction coil is smaller than that generated by the second insulation board. This weakens the heating capacity of the first insulation board and enhances the heating capacity of the second insulation board, slows down the temperature decay rate of the outer edge region of the heated component, and makes the temperature of the middle region and the outer edge region of the heated component more consistent, thereby improving the temperature uniformity. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of the film-forming apparatus according to an embodiment of this application;
[0025] Figure 2This is a partial cross-sectional schematic diagram of the film-forming apparatus according to an embodiment of this application. The diagram shows the positional relationship between the first insulation plate, the second insulation plate, the third insulation plate, the heated component, and the induction coil, and also shows the central axis.
[0026] Figure 3 This is a three-dimensional structural diagram of the film-forming device according to an embodiment of the present application, which shows the third heat-insulating plate, the heated component and the induction coil.
[0027] Figure 4 This is a top view of the first insulation plate in the film-forming apparatus of this application embodiment, and the figure shows the first stacking direction of the layered insulation material inside the first insulation plate.
[0028] Figure 5 This is a three-dimensional structural schematic diagram of a film-forming apparatus according to another embodiment of this application, and the heat insulation layer and the shell are not shown in the figure;
[0029] Figure 6 This is a schematic diagram of the structure of the heat insulation component in the film forming apparatus of this application embodiment, showing the parallel arrangement of the heat insulation blocks and the first stacking direction;
[0030] Figure 7 for Figure 5 A cross-sectional view along the AA direction is shown in the figure, which also illustrates the insulation layer and the shell.
[0031] Reference numerals: 1. Shell; 10. Receiving cavity; 11. Bottom wall; 2. Heated component; 20. Bearing surface; 3. Induction coil; 4. Insulation component; X, Up and down direction; 41. First insulation plate; 42. Second insulation plate; 40. Receiving groove; S, First stacking direction; Y, Second stacking direction; O, Central axis; 31. First coil; 411. Insulation block; 43. Third insulation plate; 44. Fourth insulation plate; 430. First surface; 21. First heated body; 22. Second heated body; 100. Reaction chamber; 45. Fifth insulation plate; 421. First plate; 422. Second plate; 5. Rotating assembly. Detailed Implementation
[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0033] In the description of this application, it should be understood that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, "multiple" means two or more, and "at least one" can refer to one, two, or more, unless otherwise explicitly specified. The terms "first," "second," and "third," etc., are only for the convenience of description and are used to name parts or embodiments by number, and do not imply any order of importance between the parts or embodiments.
[0034] It should also be noted that in the accompanying drawings of this application, arrows marked with X indicate the vertical direction, arrows marked with S indicate the first stacking direction, and arrows marked with Y indicate the second stacking direction. The introduction of the first stacking direction, second stacking direction, and vertical direction in the description of this application is to more clearly define the structure and relative positional relationships of the components in the film-forming apparatus. In actual implementation, the vertical direction is generally the vertical direction or the height direction. In the description of this application, "vertical" means completely perpendicular to 90° or almost completely perpendicular; for example, an angle of 80° to 100° is considered vertical. Similarly, "parallel" means completely parallel or almost completely parallel; for example, a completely parallel angle of 10° is considered parallel.
[0035] As a preamble to the embodiments of this application, in the field of film deposition apparatus, an induced magnetic field is applied to a heated component using induction coils to provide the temperature field necessary for the substrate reaction. Typically, the arrangement of these induction coils includes at least a portion of the coils directly opposite the mounting surface of the substrate, with this portion of the coils arranged approximately parallel to the mounting surface of the substrate to achieve uniform heating of the substrate. Additionally, a heat insulation layer is usually provided within the reaction chamber to keep the heated component warm. However, compared to the central region of the heated component, the temperature at the edge region decays faster, resulting in poor heat insulation performance of the heat insulation layer. This easily leads to a large temperature gradient between the central and edge regions of the heated component, poor temperature uniformity, and affects the reaction quality of the substrate.
[0036] In view of the above, embodiments of this application provide a film-forming apparatus, which aims to solve at least one of the above-mentioned technical problems.
[0037] Please see Figures 1 to 7As shown, the film-forming apparatus of this application embodiment includes: a housing 1, a heating element 2, an induction coil 3, and a heat-insulating element 4; the housing 1 has a receiving cavity 10; the heating element 2 has a plate-like structure and is disposed within the receiving cavity 10, and the heating element 2 has a bearing surface 20 for supporting the substrate; the induction coil 3 is disposed on the outside of the housing 1, and has at least a portion corresponding to the heating element 2 along the vertical direction X; the heat-insulating element 4 is disposed within the receiving cavity 10, and the heat-insulating element 4 is composed of multiple layered heat-insulating materials stacked together, the layered heat-insulating materials including carbon fiber cloth, and the heat-insulating element 4 includes a first layer of layered heat-insulating material. A first insulation board 41 and a second insulation board 42 are provided. The first insulation board 41 is located between the induction coil 3 and the heated component 2. On a plane perpendicular to the vertical direction X, the orthographic projection of the second insulation board 42 at least covers the outer edge of the heated component 2. The layered insulation material of the first insulation board 41 has a first stacking direction S, and the layered insulation material of the second insulation board 42 has a second stacking direction Y. The first stacking direction S is parallel to the bearing surface 20 or arranged at a first angle, and the second stacking direction Y is arranged at a second angle to the bearing surface 20. The first angle is smaller than the second angle. It should be understood that the first stacking direction S of the first insulation board 41 and the second stacking direction Y of the second insulation board 42 refer to the stacking direction of the internal layered insulation material. By having different stacking directions of the internal layered insulation material of the first insulation board 41 and the second insulation board 42, and by having the angle between the stacking direction and the bearing surface 20 satisfying that the first angle is less than the second angle, the eddy current generated by the first insulation board 41 in the electromagnetic field of the induction coil 3 is less than the eddy current generated by the second insulation board 42. This weakens the heating capacity of the first insulation board 41, enhances the heating capacity of the second insulation board 42, slows down the temperature decay rate of the outer edge region of the heated component 2, makes the temperature of the middle region and the outer edge region of the heated component 2 more consistent, and improves the overall temperature uniformity of the heated component 2.
[0038] It should be understood that the insulation component 4 can be a rigid insulation felt, which can be made by stacking and sintering multiple layers of carbon fiber and other ceramic layers. It has a fiber extension surface and a stacking direction. Since the fiber extension surface is conductive and there is insulating material in the stacking direction, the conductivity in the fiber extension surface is greater than the conductivity in the stacking direction, and the thermal conductivity in the fiber extension surface is greater than the thermal conductivity in the stacking direction.
[0039] Furthermore, the stacking direction of the first insulation board 41 is parallel to the bearing surface 20. Since the arrangement of the coils of the induction coil 3 opposite to the bearing surface 20 is basically parallel to the bearing surface 20, the fiber extension surface inside the first insulation board 41 is arranged perpendicularly to the arrangement surface of the induction coil 3, making the first insulation board 41 difficult to be heated by the induction coil 3. On the other hand, the stacking direction of the second insulation board 42 is perpendicular to the bearing surface 20, and the fiber extension surface inside the second insulation board 42 is arranged parallel to the arrangement surface of the induction coil 3, making the second insulation board 42 easier to be heated by the induction coil 3. The eddy current inside the second insulation board 42 is larger than the eddy current inside the first insulation board 41, and the heating power is also greater. In the heat conduction path, the temperature difference between the heated component 2 and the second insulation board 42 is smaller than the temperature difference between the heated component 2 and the first insulation board 41. The heat conduction efficiency between the heated component 2 and the second insulation board 42 is lower than the heat conduction efficiency between the heated component 2 and the first insulation board 41. Furthermore, since the self-heating efficiency of the second insulation plate 42 is much higher than that of the first insulation plate 41, when the temperature is sufficient, the second insulation plate 42 can provide temperature compensation for the outer edge region of the heated component 2, further slowing down the temperature decay rate of the outer edge region of the heated component 2. As a result, the second insulation plate 42 has better insulation performance, reduces the temperature gradient between the middle region and the outer edge region of the heated component 2, and improves the overall temperature uniformity of the heated component 2.
[0040] In some embodiments, the first angle is between 0 and 45°, and the second angle is 90° or between 45 and 90°. It should be understood that the first angle can be any angle or a range between any two angles, including 0°, 5°, 15°, 20°, 25°, 30°, 35°, 40°, and 45°; the second angle can be any angle or a range between any two angles, including 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, and 90°. Within the range of 0-45°, the smaller the first angle, the smaller the angle between the first stacking direction S and the corresponding arrangement surface of the induction coil 3, and the larger the angle between the fiber extension surface of the first insulation board 41 and the arrangement surface of the induction coil 3. According to Faraday's law of electromagnetic induction and Lenz's law, the induced current generated by the first insulation board 41 in the alternating magnetic field generated by the induction coil 3 will be significantly reduced, thus weakening the ability of the first insulation board 41 to be heated by the electromagnetic field of the induction coil 3. Within the range of 45-90°, the larger the second angle, the larger the angle between the second stacking direction Y and the corresponding arrangement surface of the induction coil 3, and the smaller the angle between the fiber extension surface of the second insulation plate 42 and the arrangement surface of the induction coil 3. The induced current generated by the second insulation plate 42 in the alternating magnetic field generated by the induction coil 3 will significantly increase, thus enhancing the ability of the second insulation plate 42 to be heated by the electromagnetic field of the induction coil 3. Therefore, compared to the first insulation plate 41, the second insulation plate 42 has better insulation capabilities, providing temperature compensation for the outer edge region of the heated component 2, slowing down the temperature decay rate in the edge region, making the temperature of the middle region and the outer edge region of the heated component 2 more consistent, and improving the overall temperature uniformity of the heated component 2.
[0041] Please see Figures 1 to 4 As shown, in some embodiments, the induction coil 3 has a disc-shaped spiral structure with a central axis O. The first stacking direction S is parallel to the bearing surface 20, and the second stacking direction Y makes a 90° angle with the bearing surface 20. It should be understood that the disc-shaped spiral induction coil 3 is arranged on the side of the insulation component 4 away from the heated component 2, and is directly opposite to the heated component 2 in the vertical direction X. By arranging it parallel to the bearing surface 20 in the first stacking direction S and perpendicular to the bearing surface 20 in the second stacking direction Y, compared to the first insulation plate 41, the fiber extension surface in the second insulation plate 42 can generate a larger eddy current in the electromagnetic field of the induction coil 3, thereby creating a uniform temperature difference between the first insulation plate 41 and the second insulation plate 42, improving the overall temperature uniformity of the heated component 2.
[0042] Please see Figure 5 and Figure 7As shown, in some embodiments, the induction coils 3 extend in a row, and each induction coil 3 includes a first portion coil 31. The first portion coil 31 is arranged in the vertical direction X, corresponding to the heated element 2, and is arranged side by side in a second plane. The first stacking direction S is parallel to the second plane or has a third angle, and the second stacking direction Y is perpendicular to the second plane or has a fourth angle. The third angle is between 0-45°, and the fourth angle is between 45-90°. It should be understood that the induction coils 3, which extend in a row, are arranged around the outer periphery of the housing 1. The first portion coil 31, which corresponds to the heated element 2 in the vertical direction X, is arranged parallel to the bearing surface 20 of the heated element 2 and extends in the surrounding direction. Its extension direction is within the range of 0-180° from the stacking direction of the insulation element 4. The third angle can be any angle or a range between any two angles, including 0°, 5°, 15°, 20°, 25°, 30°, 35°, 40°, and 45°. The fourth angle can be any angle from 45°, 55°, 65°, 75°, 85°, 90°, or any value between any two angles. When the third angle is in the range of 0-45°, the smaller the third angle, the closer the angle between the fiber extension surface in the first insulation plate 41 and the induction coil 3 is to 90°. At this time, the eddy current generated inside the first insulation plate 41 is smaller, the first insulation plate 41 is less easily heated, and the power loss to the induction coil 3 is low. Similarly, when the fourth angle is in the range of 45-90°, the closer the fourth angle is to 90°, the closer the angle between the fiber extension surface in the second insulation plate 42 and the induction coil 3 is to 0°. At this time, the eddy current generated inside the second insulation plate 42 is larger, the second insulation plate 42 is more easily heated in the electromagnetic field of the induction coil 3, thus possessing temperature compensation capability, slowing down the temperature decay rate in the edge area, making the temperature of the middle area and the outer edge area of the heated component 2 tend to be consistent, and improving the overall temperature uniformity of the heated component 2.
[0043] Please see Figure 4As shown, in some embodiments, multiple layers of insulation material of the first insulation board 41 are stacked circumferentially around the central axis O; or, the first insulation board 41 includes multiple insulation blocks 411, which are arranged circumferentially around the central axis O, and adjacent insulation blocks 411 are spliced together to form a plate shape that matches the shape of the heated component 2. It should be understood that when the induction coil 3 is a disc-shaped spiral structure, by setting the stacking direction of the first insulation board 41 to be stacked circumferentially around the central axis O, the angle between the first stacking direction S and the extension direction of the induction coil 3 is further reduced, thereby ensuring that eddy currents are not easily generated inside the first insulation board 41, thus weakening the heating capacity of the first insulation board 41. In other embodiments, the first insulation board 41 can be arranged by splicing multiple insulation blocks 411, thereby reducing the conductive path of the fiber extension surface inside the first insulation board 41, and thus reducing the eddy currents generated when the electromagnetic field of the induction coil 3 passes through the insulation layer, further weakening the heating capacity of the first insulation board 41.
[0044] Please see Figure 6 As shown, in some embodiments, the first insulation plate 41 includes multiple insulation blocks 411, which are strip-shaped blocks arranged side by side, and the arrangement direction of the multiple insulation blocks 411 is parallel to the extension direction of the first portion of the coil 31. When the induction coil 3 is arranged in a row, the multiple insulation blocks 411 are strip-shaped blocks arranged side by side. Similarly, the arrangement of the insulation blocks 411 further reduces the angle between the first stacking direction S and the extension direction of the induction coil 3, thereby ensuring that eddy currents are not easily generated inside the first insulation plate 41, thus weakening the heating capacity of the first insulation plate 41.
[0045] Please see Figure 1 , Figure 2 and Figure 7 As shown, in some embodiments, the orthographic projection of the second insulation plate 42 on a plane perpendicular to the vertical direction X at least covers the outer edge of the heated component 2. By defining the orthographic projection relationship between the second insulation plate 42 and the heated component 2 on a plane perpendicular to the vertical direction X, the second insulation plate 42 is at least partially corresponding to the outer edge of the heated component 2 in the vertical direction X. This ensures that the second insulation plate 42 can provide temperature compensation for the outer edge of the heated component 2, slowing down the temperature decay rate in the outer edge region of the heated component 2, making the temperature of the middle region and the outer edge region of the heated component 2 more consistent, improving the overall temperature uniformity of the heated component 2, and providing protection for the reaction environment of the substrate.
[0046] Please see Figures 1 to 3As shown, in some embodiments, the heat insulation member 4 includes a third heat insulation plate 43, which is adjacent to the second heat insulation plate 42 and is disposed around the circumferential side of the heat receiving member 2. The third heat insulation plate 43, the first heat insulation plate 41 and the second heat insulation plate 42 cooperate to enclose a receiving groove 40, and at least a part of the heat receiving member 2 is disposed in the receiving groove 40. Specifically, the third heat insulation plate 43 has a first surface 430 facing away from the bottom wall 11 of the receiving cavity 10, and the first surface 430 is not lower than the bearing surface 20 relative to the bottom wall 11 of the receiving cavity 10. It should be understood that the dimension of the fourth heat insulation plate 44 in the up-and-down direction X is not less than the dimension of the heat receiving member 2 in the up-and-down direction X to ensure that the fourth heat insulation plate 44 can completely cover the edge area of the heat receiving member 2 in the up-and-down direction X. Specifically, the heat receiving member 2 is disc-shaped or annular, and in the first radial direction of the heat receiving member 2, the extension surface of the layered heat insulation material of the third heat insulation plate 43 is perpendicular to the first radial direction or forms a fifth angle, and the fifth angle is between 45° and 90°. Since the thermal conductivity of the heat insulation plate in the stacking direction of the layered heat insulation material is much smaller than the thermal conductivity in the extension surface of the layered heat insulation material, maintaining the above angle characteristics of the extension surface of the layered heat insulation material of the third heat insulation plate 43 makes it difficult for the heat received by the inner side wall of the third heat insulation plate 43 facing the heat receiving member 2 to be transferred to the outer side wall of the third heat insulation plate 43 facing away from the heat receiving member 2, thereby improving the heat insulation effect on the edge position of the heat receiving member 2, making the temperature of the middle area and the outer edge area of the heat receiving member 2 tend to be consistent, and further improving the overall temperature uniformity of the heat receiving member 2.
[0047] Refer to Figure 1As shown, in some embodiments, the heat-receiving member 2 includes a first heat-receiving body 21 and a second heat-receiving body 22. The first heat-receiving body 21 and the second heat-receiving body 22 are arranged along the vertical direction X, and are spaced apart to enclose a reaction chamber 100. The first heat-receiving body 21 is received in the accommodating groove 40, and the bearing surface 20 is located on the side of the first heat-receiving body 21 facing the reaction chamber 100; the heat-insulating member 4 further includes a fourth heat-insulating plate 44. The fourth heat-insulating plate 44 is at least located on the side of the second heat-receiving body 22背离 the bearing surface 20. The fourth heat-insulating plate 44 is respectively connected to the second heat-receiving body 22 and the housing 1. The projection of the fourth heat-insulating plate 44 on the plane perpendicular to the vertical direction X covers the second heat-receiving body 22. It should be understood that the second heat-receiving body 22 is also received in the accommodating cavity 10 of the housing 1 and is connected to the top wall of the accommodating cavity 10. The second heat-receiving body 22 is located directly above the first heat-receiving body 21 and defines the reaction chamber 100 with the first heat-receiving body 21 to provide a place for the reaction gas to react with the substrate. The fourth heat-insulating plate 44 is at least partially disposed between the second heat-receiving body 22 and the housing 1, and both sides of the fourth heat-insulating plate 44 in the vertical direction X can be respectively connected to the second heat-receiving body 22 and the housing 1. The fourth heat-insulating plate 44 is used to insulate the second heat-receiving body 22, so as to ensure that the reaction chamber 100 can maintain a relatively high temperature, reduce the temperature gradient of the reaction chamber 100 in the vertical direction X, and ensure the uniformity of the substrate reaction temperature.
[0048] As shown Figure 1 As shown, in some embodiments, the heat-insulating member 4 further includes a fifth heat-insulating plate 45. The fifth heat-insulating plate 45 is located between the third heat-insulating plate 43 and the fourth heat-insulating plate 44 and connects the third heat-insulating plate 43 and the fourth heat-insulating plate 44. The fifth heat-insulating plate 45 is configured as a plate body extending in the vertical direction X. It should be understood that the fifth heat-insulating plate 45 can be arranged around the second heat-receiving body 22. By jointly wrapping the heat-receiving member 2 with the first heat-insulating plate 41, the second heat-insulating plate 42, the third heat-insulating plate 43, the fourth heat-insulating plate 44 and the fifth heat-insulating plate 45, a complete heat-insulating space can be provided for the heat-receiving member 2, and thus stable reaction conditions can be provided for the substrate reaction.
[0049] Furthermore, the fourth insulation board 44 can also adopt the same configuration as the combination of the first insulation board 41 and the second insulation board 42, that is, the stacking direction of the internal layered insulation material in the middle region of the fourth insulation board 44 is the same as the stacking direction of the internal layered insulation material in the first insulation board 41, and the stacking direction of the internal layered insulation material in the outer region is the same as the stacking direction of the internal layered insulation material in the second insulation board 42; or, the angle between the aforementioned stacking direction of the middle region of the fourth insulation board 44 and the bearing surface 20 satisfies the range of the first angle, so that the induced current generated in the middle region of the fourth insulation board 44 in the alternating magnetic field generated by the adjacent induction coil 3 is reduced, and the ability of the fourth insulation board 44 to be heated by the electromagnetic field of the induction coil 3 is weaker. The angle between the aforementioned stacking direction of its outer region and the bearing surface 20 satisfies the range of the second angle, so that the induced current generated in the outer region of the fourth insulation board 44 in the alternating magnetic field generated by the adjacent induction coil 3 is relatively large, and the ability of the fourth insulation board 44 to be heated by the electromagnetic field of the induction coil 3 is relatively stronger, thereby making the temperature of the second heated component 2 more uniform.
[0050] In some embodiments, the film-forming apparatus further includes a rotating assembly that passes through the bottom wall 11 of the housing 1 and is connected to the heated element 2. A plurality of heat-insulating blocks 411 are arranged around the rotating assembly, and the heat-insulating blocks 411 are fitted with the rotating assembly with a clearance.
[0051] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0052] The film-forming apparatus provided in the embodiments of this application has been described in detail above, and specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A film-forming apparatus, characterized in that, include: The shell (1) has a receiving cavity (10); The heating element (2) has a plate-like structure and is disposed in the receiving cavity (10). The heating element (2) has a bearing surface (20) for supporting the substrate. An induction coil (3) is disposed on the outside of the housing (1) and has at least a portion disposed in the vertical direction (X) corresponding to the heated element (2); A heat-insulating component (4) is disposed in the receiving cavity (10). The heat-insulating component (4) is composed of multiple layered heat-insulating materials stacked together. The layered heat-insulating materials include carbon fiber cloth. The heat-insulating component (4) includes a first heat-insulating plate (41) and a second heat-insulating plate (42). The first heat-insulating plate (41) is located between the induction coil (3) and the heat-receiving component (2). The second heat-insulating plate (42) surrounds and connects to the first heat-insulating plate (41). On a plane perpendicular to the vertical direction (X), the orthographic projection of the second heat-insulating plate (42) at least covers the outer edge of the heat-receiving component (2). The layered heat-insulating material of the first heat-insulating plate (41) has a first stacking direction (S). The layered heat-insulating material of the second heat-insulating plate (42) has a second stacking direction (Y). The first stacking direction (S) is parallel to the bearing surface (20) or arranged at a first angle. The second stacking direction (Y) is arranged at a second angle to the bearing surface (20). The first angle is smaller than the second angle.
2. The film-forming apparatus according to claim 1, characterized in that, The first angle is between 0 and 45°, and the second angle is 90° or between 45 and 90°.
3. The film-forming apparatus according to claim 1, characterized in that, The induction coil (3) has a disc-shaped spiral structure, the first stacking direction (S) is parallel to the bearing surface (20), and the second stacking direction (Y) is at an angle of 90° to the bearing surface (20).
4. The film-forming apparatus according to claim 1, characterized in that, The induction coils (3) are arranged in a row. The induction coils (3) include a first part coil (31). The first part coil (31) is arranged in the vertical direction (X) corresponding to the heated element (2). The first part coil (31) is arranged side by side in the second plane. The first stacking direction (S) is parallel to the second plane or has a third angle, the second stacking direction (Y) is perpendicular to the second plane or has a fourth angle, the third angle is between 0 and 45°, and the fourth angle is between 45 and 90°.
5. The film-forming apparatus according to claim 3, characterized in that, The induction coil (3) has a central axis (O). Multiple layers of insulation material of the first insulation board (41) are stacked around the central axis (O) in a circumferential direction; or, the first insulation board (41) includes multiple insulation blocks (411), which are arranged around the central axis (O) in a circumferential direction, and adjacent two insulation blocks (411) are spliced together to form a plate shape that matches the shape of the heated component (2).
6. The film-forming apparatus according to claim 4, characterized in that, The first insulation board (41) includes a plurality of insulation blocks (411), which are strip blocks arranged side by side, and the arrangement direction of the plurality of insulation blocks (411) is parallel to the extension direction of the first portion of the coil (31).
7. The film-forming apparatus according to claim 1, characterized in that, The heat insulation component (4) includes a third heat insulation plate (43), which is arranged around the periphery of the heat-receiving component (2) and cooperates with the first heat insulation plate (41) and the second heat insulation plate (42) to form a receiving groove (40). The heat-receiving component (2) is at least partially disposed in the receiving groove (40).
8. The film-forming apparatus according to claim 7, characterized in that, The heat-receiving component (2) is disc-shaped or annular. On the first radial direction of the heat-receiving component (2), the extension surface of the layered insulation material of the third insulation board (43) is perpendicular to the first radial direction or forms a fifth angle with the first radial direction, the fifth angle being between 45° and 90°.
9. The film-forming apparatus according to claim 7, characterized in that, The heating element (2) includes a first heating body (21) and a second heating body (22). The first heating body (21) and the second heating body (22) are arranged in the vertical direction (X) and are spaced apart to form a reaction chamber (100). The first heating body (21) is housed in the receiving groove (40). The bearing surface (20) is located on the side of the first heating body (21) facing the reaction chamber (100). The insulation component (4) further includes a fourth insulation plate (44), which is located at least on the side of the second heat-receiving body (22) away from the bearing surface (20). The fourth insulation plate (44) connects the second heat-receiving body (22) and the shell (1) respectively. The projection of the fourth insulation plate (44) on the plane perpendicular to the vertical direction (X) covers the second heat-receiving body (22).
10. The film-forming apparatus according to claim 9, characterized in that, The insulation component (4) further includes a fifth insulation plate (45), which is located between the third insulation plate (43) and the fourth insulation plate (44) and connects the third insulation plate (43) and the fourth insulation plate (44). The fifth insulation plate (45) is configured as a plate extending in the vertical direction (X).
11. The film-forming apparatus according to claim 5, characterized in that, The film-forming device further includes a rotating component, which passes through the bottom wall (11) of the housing (1) and is connected to the heated component (2). A plurality of heat-insulating blocks (411) are arranged around the rotating component, and the heat-insulating blocks (411) are fitted with the rotating component with a clearance.