Apparatus and method for detecting an electronic component under test

Abstract

One aspect of the present disclosure relates to a device and a method for detecting an electronic component under test. A device for detecting an electronic component under test includes a heating module and a temperature monitoring module. The heating module heats the electronic component under test. The temperature monitoring module is electrically connected to the heating module and monitors and controls a temperature of the electronic component under test.

Description

Technical Field

[0001] This disclosure relates to a testing apparatus for an electronic component under test, and more particularly to a testing apparatus and a testing method for an electronic component under test. Background Technology

[0002] Electronic components under test, such as printed circuit boards (PCBs), wafers, LCD panels, IC substrates, and other products that require heating for electrical testing, typically have circuits and several circuit nodes set on the circuits. Several electronic components are electrically connected to several circuit nodes, and the electronic components are controlled by the circuit. The aforementioned electronic components under test are widely used in various electronic products.

[0003] Among them, the circuit nodes of the electronic components under test, such as printed circuit boards, may fail to conduct properly or have poor contact when heated due to insufficient metal layer thickness, metal layer cracking or falling off, or other factors. Therefore, manufacturers will test the circuit nodes of printed circuit boards when shipping.

[0004] However, traditional circuit node testing uses ceramic contact heating of printed circuit boards, which results in only the part of the printed circuit board that is in contact with the ceramic heating structure being heated, while the other part that is not in contact with the ceramic heating structure is not heated. This leads to problems such as uneven heating and inaccurate yield during the testing process.

[0005] In addition, temperature monitoring of electronic components under test (DUTs), such as PCB products, is also important when heated. It is necessary to maintain the DUTs at a required temperature while avoiding high temperatures that could burn them out, in order to improve yield.

[0006] In view of this, the discloser has devoted himself to studying the aforementioned prior art and applying theoretical principles to try his best to solve the above-mentioned problems, which has become the target of the discloser's development. Summary of the Invention

[0007] This disclosure provides a testing device and a testing method for electronic components under test. The testing device uses a heating module to heat the electronic components under test, thereby achieving the effects of uniform heating of the electronic components under test and improving testing accuracy and yield.

[0008] This disclosure also provides a temperature monitoring unit for monitoring the temperature of an electronic component under test and providing temperature data, and a processing unit electrically connected to a heating module. The processing unit can control the heating state of the heating module and simultaneously acquire the temperature data related to the electronic component under test from the temperature monitoring unit. During heating, the processing unit controls the heating state of the heating module, such as the heating intensity, in real time based on the temperature data to ensure that the temperature of the electronic component under test reaches the required test temperature and is simultaneously stabilized within a preset range. Compared with the traditional method of heating a ceramic contact printed circuit board for circuit node testing, the traditional method involves first contacting the ceramic contact printed circuit board and then performing electrical tests on the circuit node, which can only test one side first, or can only test both sides after the PCB is removed from the ceramic. The electronic component testing device disclosed herein can carry or clamp a portion of the electronic component under test, such as the edge of a PCB, exposing most of both sides of the PCB. This allows for simultaneous testing of both sides of the PCB, including simultaneous heating of the PCB and testing of the electrical properties (e.g., resistivity, capacitance, inductive reactance, withstand voltage, withstand current, etc.) on both sides. This not only reduces testing time but also improves yield and reduces the probability of the entire production batch being scrapped.

[0009] In this embodiment, an apparatus for testing an electronic component under test is provided, comprising a clamp, a heating module, a thermal imager, and a processing unit. The clamp holds the electronic component under test, wherein the electronic component under test has a first surface and a second surface. The heating module is disposed on one side of the electronic component under test and heats the first surface. The thermal imager is disposed on the other side of the electronic component under test and monitors the second surface to monitor a temperature of the electronic component under test. The processing unit is electrically connected to the heating module and the thermal imager, and adjusts the heating module in response to the temperature to stabilize the temperature within a default range.

[0010] In this embodiment of the disclosure, a method for testing an electronic component under test is provided, comprising the following steps: providing an electronic component under test, a holder for holding the electronic component under test, a heating module disposed on one side of the electronic component under test, a temperature monitoring unit disposed on the other side of the electronic component under test, and a processing unit; holding and moving the electronic component under test to the position of the heating module; heating a first surface of the electronic component under test on one side of the electronic component under test; monitoring a second surface of the electronic component under test on the other side of the electronic component under test to monitor a temperature of the electronic component under test; and adjusting the heating module in response to the temperature to stabilize the temperature within a default range.

[0011] In this embodiment, the present disclosure provides an apparatus for testing an electronic component under test, comprising a heating module, a temperature monitoring unit, and a processing unit. The heating module heats the electronic component under test. The temperature monitoring unit monitors a temperature of the electronic component under test. The processing unit is electrically connected to the heating module and the temperature monitoring unit, and adjusts the heating module in response to the temperature to stabilize the temperature within a default range.

[0012] In this embodiment of the disclosure, an apparatus for testing an electronic component under test is provided, comprising a heating module and a temperature monitoring module. The heating module heats the electronic component under test. The temperature monitoring module is electrically connected to the heating module and monitors and controls the temperature of the electronic component under test.

[0013] Based on the above, compared with the conventional method of heating electronic components under test using ceramic contact, the electronic component testing device disclosed herein adopts a heating method in which the heating module irradiates the electronic component under test over a large area. Its first heating source is configured above the support frame and can irradiate the upper surface of the electronic component under test over a large area. Its second heating source may not be configured or may be configured below the support frame and can irradiate the lower surface of the electronic component under test over a large area. The heating module can make the electronic component under test heated evenly, thereby increasing the testing yield. Thus, the electronic component testing device can achieve the effects of uniformly heating the electronic component under test and improving the testing accuracy and yield.

[0014] The disclosed testing device for electronic components under test can also monitor the temperature of the electronic components under test so that the temperature of the electronic components under test can reach the required test temperature and stabilize the temperature of the electronic components under test within a default range. This device and testing method can not only reduce testing time, but also improve yield. Unreliable electronic components under test can be rejected in advance before leaving the factory, and normal electronic components under test can be prevented from being damaged, thereby improving yield and reducing the cost of scrapping the entire batch. Attached Figure Description

[0015] Figure 1 This is a flowchart of the steps in the method for testing electronic components to be tested disclosed in this paper.

[0016] Figure 2 This is a top view schematic diagram of the testing device for the electronic components to be tested disclosed in this paper.

[0017] Figure 3 This is another top view schematic diagram of the testing device for the electronic components to be tested disclosed in this paper.

[0018] Figure 4 This is a front view schematic diagram of the testing device for the electronic components to be tested disclosed in this paper.

[0019] Figure 5This is a schematic diagram showing the translation of the support frame relative to the heating module.

[0020] Figure 6 This is another schematic diagram showing the translation of the support frame relative to the heating module.

[0021] Figure 7 This is another schematic diagram showing the translation of the support frame relative to the heating module in this disclosure.

[0022] Figure 8 This is another schematic diagram showing the translation of the support frame relative to the heating module.

[0023] Figure 9 This is a schematic diagram of a preferred embodiment of the present disclosure for testing an electronic component under test.

[0024] Figure 10 This is a schematic diagram of a device for testing an electronic component under test according to a preferred embodiment of the present disclosure.

[0025] Figure 11 This is a schematic diagram of an apparatus for testing an electronic component under test, according to another preferred embodiment of the present disclosure. Detailed Implementation

[0026] Please refer to the accompanying drawings of this disclosure for detailed description, which are illustrated by way of example to show various different embodiments of this disclosure and to provide an understanding of how to implement this disclosure. This disclosure provides sufficient content for those skilled in the art to implement the embodiments disclosed herein, or embodiments derived from the content disclosed herein. It should be noted that these embodiments are not mutually exclusive, and some embodiments can be appropriately combined with one or more other embodiments to form new embodiments; that is, the implementation of this disclosure is not limited to the embodiments disclosed below. Furthermore, for the sake of brevity and clarity, relevant details are not excessively disclosed in the embodiments; even if specific details are disclosed, they are only illustrative to make the reader clear, and the relevant specific details in the embodiments are not intended to limit the disclosure of this case.

[0027] Please refer to Figures 1 to 8 As shown, this disclosure provides a testing device and a testing method for an electronic component under test (EBT), which is used for an EBT 100. The EBT testing device 10 mainly includes a support frame 1, a heating module 2, and one or more testing modules 3.

[0028] like Figures 1 to 6 As shown, the support frame 1 is used to support the electronic component 100 under test. The support frame 1 has a transparent area inside, through which the two opposite surfaces of the electronic component 100 under test are exposed.

[0029] like Figures 1 to 6As shown, the heating module 2 includes a first heating source 21 and a second heating source 22. The first heating source 21 is disposed on one side of the support frame 1 and irradiates one surface of the electronic component 100 under test. The second heating source 22 is disposed on the other side of the support frame 1 and irradiates the other surface of the electronic component 100 under test. The first heating source 21 and the second heating source 22 are arranged opposite to each other.

[0030] In addition, the first heating source 21 and the second heating source 22 each have a halogen heating lamp tube 23. The halogen heating lamp tube 23 is preferably a gold halogen heating lamp tube. The gold halogen heating lamp tube has the advantages of being able to instantly rise to a high temperature of over 500°C, high infrared radiation efficiency, powerful motor and fast heating speed. Its special gold outer layer covering the lamp tube can be controlled up to 1650 kelvin (a unit of temperature measurement), which makes it more eye-protecting, not dazzling when looking directly at it, with a main emission wavelength between 0.8 and 1.4 microns, output adjustment through a controller, economical price and long service life.

[0031] like Figures 1 to 3 As shown, the detection module 3 includes a moving mechanism 31 and a detection probe 32 installed on the moving mechanism 31. The moving mechanism 31 is set to the support frame 1 and drives the detection probe 32 to detect whether the electronic component 100 under test is properly connected or whether there is poor contact.

[0032] The moving mechanism 31 includes a translation drive group 311, a lifting drive group 312 mounted on the translation drive group 311, and a fixed base 313 mounted on the lifting drive group 312. The detection probe 32 is fixed to the fixed base 313. The fixed base 313 moves up and down in response to the electronic component 100 under test through the lifting drive group 312. The lifting drive group 312 moves left and right in response to the electronic component 100 under test through the translation drive group 311.

[0033] In this embodiment, the number of detection modules 3 is four, but this is not a limitation. Two detection modules 3 are arranged on the left and right sides of one side of the support frame 1, and the other two detection modules 3 are arranged on the left and right sides of the other side of the support frame 1, so that the four detection probes 32 can detect the left and right sides of the upper surface and the left and right sides of the lower surface of the electronic component 100 under test.

[0034] like Figures 1 to 6 As shown, the electronic component testing device 10 disclosed herein also includes a translation mechanism 4. The support frame 1 is installed on the translation mechanism 4 and can follow the translation mechanism 4 to translate left and right relative to the first heating source 21 and the second heating source 22.

[0035] Furthermore, the translation drive group 311, the lifting drive group 312, and the translation mechanism 4 can be common linear slide rails or motor-driven push rods, etc., and are not limited to those disclosed in the drawings of this embodiment.

[0036] like Figures 1 to 6 As shown, the testing device 10 for electronic components under test disclosed herein is used in a manner in which the testing device 10 uses a heating module 2 to heat the electronic component 100 under test. The first heating source 21 is arranged above the support frame 1 and can irradiate a large area of ​​the upper surface of the electronic component 100 under test, and the second heating source 22 is arranged below the support frame 1 and can irradiate a large area of ​​the lower surface of the electronic component 100 under test.

[0037] Therefore, compared with the conventional method of heating electronic components under test using ceramic contact, the electronic component under test testing device 10 disclosed herein uses a heating module 2 to irradiate the electronic component under test 100 over a large area, which can make the electronic component under test 100 be heated more evenly, thereby increasing the testing yield. Thus, the electronic component under test testing device 10 has the effect of uniformly heating the electronic component under test 100 and improving the testing accuracy and yield.

[0038] In addition, the first heating source 21 and the second heating source 22 each have a halogen heating lamp tube 23, so that the heating module 2 has the advantages of instantaneous temperature rise, fast heating speed, high infrared radiation efficiency, economical price and long service life.

[0039] The following is for reference Figure 1 This disclosure describes a method for inspecting electronic components under test. The steps of this method include:

[0040] like Figure 1 Step A and Figures 4 to 5 , Figure 7 As shown, an electronic component under test 100 is provided. The electronic component under test testing device 10 also includes a translation mechanism 4. The support frame 1 is installed on the translation mechanism 4 and moves with the translation mechanism 4. The electronic component under test 100 is divided into a first region 101 and a second region 102.

[0041] like Figure 1 Step B and Figures 4 to 5 , Figure 7 As shown, the first region 101 of the electronic component 100 under test is moved to the position corresponding to the heating module 2 by means of the translation mechanism 4 and the support frame 1.

[0042] like Figure 1 Step C and Figures 4 to 5 , Figure 7 As shown, the first heating source 21 and the second heating source 22 of the heating module 2 heat the first region 101 of the electronic component 100 under test to a default temperature.

[0043] like Figure 1 Step D and Figures 4 to 5 , Figure 7 As shown, the moving mechanism 31 drives the detection probe 32 to perform electrical detection on the first region 101 of the electronic component under test 100 when it reaches the default temperature.

[0044] like Figure 1 Step E and Figure 4 , Figure 6 , Figure 8 As shown, the first region 101 of the electronic component under test 100, which has completed electrical testing, is moved away from the heating module 2 by the translation mechanism 4 and the carrier frame 1, and then the second region 102 of the electronic component under test 100 is moved to the position corresponding to the heating module 2.

[0045] like Figure 1 Step F and Figure 4 , Figure 6 , Figure 8 As shown, the first heating source 21 and the second heating source 22 of the heating module 2 heat the second region 102 of the electronic component 100 under test to a default temperature.

[0046] like Figure 1 Step G and Figure 4 , Figure 6 , Figure 8 As shown, the moving mechanism 31 drives the detection probe 32 to perform electrical detection on the second region 102 of the electronic component under test 100 when it reaches the default temperature.

[0047] Among them, such as Figures 5 to 6 As shown, the first region 101 may be located on the left side of the electronic component 100 under test, and the second region 102 may be located in the middle of the electronic component 100 under test; or, as... Figures 7 to 8 As shown, the first region 101 may be located in the middle of the electronic component 100 under test, and the second region 102 may be located on the right side of the electronic component 100 under test, without limitation to this embodiment.

[0048] Please refer to both together. Figure 2 and Figure 4The first heating source 21 can be replaced by a thermal imager 24. The apparatus 10 for detecting an electronic component under test includes a support frame 1 or clamp 1', a heating module 2, a thermal imager 24, and a processing unit 25. The clamp 1' holds the electronic component under test 100, which has a surface 100S1 and a surface 100S2. The heating module 2 is disposed on one side of the electronic component under test 100 and heats the surface 100S1. The thermal imager 24 is disposed on the other side of the electronic component under test 100 and monitors the surface 100S2 to monitor a temperature of the electronic component under test 100. The processing unit 25 is electrically connected to the heating module 2 and the thermal imager 24, and adjusts the heating module 2 in response to the temperature to stabilize the temperature within a default range.

[0049] The temperature is a target temperature, which can be a temperature required by the manufacturer, such as approximately 125 degrees Celsius when testing the electronic component 100 under test. The temperature control method includes: a heating start-up procedure, where the temperature monitored in real-time by the thermal imager 24 is far below the target temperature, and the heating module 2 begins to continuously increase its power for heating; a near-target temperature procedure, where the temperature monitored in real-time by the thermal imager 24 approaches the target temperature, and the heating module 2 gradually reduces its heating power; and a target temperature maintenance procedure, where the thermal imager 24 monitors temperature fluctuations in real-time, and the heating module 2 continuously and slightly increases or decreases its heating power to achieve a constant temperature effect. For example, the processing unit 25 can control the heating module 2 to reduce its heating intensity before the thermal imager 24 detects that the temperature of the electronic component 100 under test has not reached 125 degrees Celsius. Conversely, before the thermal imager 24 detects that the temperature of the electronic component 100 under test is below 100 degrees Celsius, the processing unit 25 controls the heating module 2 to increase its heating intensity. Figure 4 The heating module 2 can contain only the second heating source 22, heating only the second surface 100S2 of the electronic component 100 under test. The thermal imager 24 can monitor the temperature of the electronic component 100 under test in real time and transmit the relevant temperature data to the processing unit 25 in real time. The processing unit 25 can be configured independently, built into the thermal imager 24, or configured in the heating module 2, without limitation.

[0050] Please see Figure 9 This is S10 of the preferred embodiment of the present disclosure for detecting the electronic component under test; please refer to both. Figure 24,9, Method S10 includes the following steps: Step S101, providing an electronic component under test 100, a holder 1” for holding the electronic component under test 100, a heating module 2 disposed on one side of the electronic component under test 100, a temperature monitoring unit 26 disposed on the other side of the electronic component under test 100, and a processing unit 25. Step S102, holding and moving the electronic component under test 100 to the position of the heating module 2. Step S103, heating a surface 100S2 of the electronic component under test 100 on one side of the electronic component under test 100. Step S104, monitoring a surface 100S1 of the electronic component under test 100 on the other side of the electronic component under test 100 to monitor a temperature of the electronic component under test 100. Step S105, adjusting the heating module 2 in response to the temperature to stabilize the temperature within a default range.

[0051] In any embodiment of this disclosure, method S10 further includes the following steps: enabling the processing unit to acquire temperature data from the thermal imager in real time, and comparing the temperature data with a target temperature and a threshold temperature, to perform: controlling the heating module to reduce a heating intensity before the temperature data is lower than and close to the target temperature; and controlling the heating module to increase the heating intensity before the temperature data is higher than and close to the threshold temperature, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the electronic component under test and the heating module. The threshold temperature here refers to the temperature at which the heating power needs to be increased if the temperature drops too much after approaching the target temperature; it can also be set manually, for example, to reduce temperature fluctuations, the threshold temperature is set closer to the target temperature. The heat source intensity here is equivalent to the heating power.

[0052] In any embodiment of this disclosure, the electronic component under test 100 is at least one of an IC substrate, a liquid crystal panel, and a circuit board. The heating module 2 includes a halogen lamp. The device 10 further includes a detection module 3, which includes a moving mechanism 31 and a detection probe 32 mounted on the moving mechanism 31. The moving mechanism 31 is configured corresponding to the fixture 1' and drives the detection probe 32 to detect the electronic component under test 100. The moving mechanism 3 includes a translation drive group 311, a lifting drive group 312 mounted on the translation drive group 311, and a fixed base 313 mounted on the lifting drive group 312. The detection probe 32 is fixed to the fixed base 313, and the translation drive group 311 and the lifting drive group 312 are respectively a linear slide rail and a motor-driven push rod. The device 10 further includes a moving mechanism 4', wherein the fixture is mounted on the moving mechanism and can move relative to the heating module 2 following the moving mechanism 4'.

[0053] In any embodiment of this disclosure, the clamp 1' includes two symmetrical clamping components to clamp the PCB, which can be placed vertically on a horizontal plane (e.g., the ground plane). The heating module 2 can be disposed near the surface of the PCB, and the irradiation direction of the heating module 2 is perpendicular to the surface of the PCB, i.e., parallel to the horizontal plane. For example, when heating and testing the PCB, the PCB is fixed vertically by the clamp 1', which reduces the planar space occupied by the entire heating and testing device. The device 10 also includes at least one detection module 3, and the number of the at least one detection module 3 is four, wherein two of the detection modules 3 are disposed on the left and right sides of one side of the clamp 1', and the other two detection modules 3 are disposed on the left and right sides of the other side of the clamp 1'. The device 10 of this disclosure can simultaneously heat and test the electronic component 100 under test. The device 10 also includes a support frame 1, the interior of which has a transparent area, exposing the opposite two surfaces of the electronic component 100 under test through the transparent area.

[0054] Please see Figure 10 The preferred embodiment of this disclosure describes an apparatus 50 for testing an electronic component 500 under test, comprising a heating module 52, a temperature monitoring unit 526, and a processing unit 525. The heating module 52 heats the electronic component 500 under test. The temperature monitoring unit 526 monitors a temperature of the electronic component 500 under test. The processing unit 525 is electrically connected to the heating module 52 and the temperature monitoring unit 526, and adjusts the heating module 526 in response to the temperature to stabilize the temperature within a default range.

[0055] In any embodiment of the invention, the temperature monitoring unit 26,526 is a thermal imager 24. The electronic component under test 100,500 is at least one of an IC substrate, a liquid crystal panel, and a circuit board. The holder 1” is a clamp 1’ for holding the electronic component under test 100,500. The electronic component under test 100,500 has a surface 100S1 and a surface 100S2. The heating module 2,52 is disposed on one side of the electronic component under test 100,500 and heats the surface 100S2. The temperature monitoring unit 26,526 is disposed on the other side of the electronic component under test 100,500 and monitors the surface 100S1 to monitor the electronic component under test 100,500. A temperature of 0. The processing unit 25,525 acquires temperature data from the temperature monitoring unit 26,526 in real time to perform the following actions: before the temperature data is lower than and close to a first temperature, control the heating module 2,52 to reduce the heating intensity; before the temperature data is higher than and close to a second temperature, control the heating module 2,52 to increase the heating intensity, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the electronic component under test and the heating module.

[0056] exist Figure 10 The heating module 52 and temperature monitoring unit 526 can be configured on either side of the electronic component under test 100, or on the same side of the electronic component under test 100. Although the configuration is more crowded when both are on the same side, as long as the field of vision (FOV) of the temperature monitoring unit 526 can cover the entire area of ​​the electronic component under test 100, or the distance between the temperature monitoring unit 526 and the electronic component under test 100 is adjusted, it is acceptable. Basically, the heating module 526 is configured directly above the electronic component under test 100, so that the temperature of the electronic component under test 100 can be controlled by the heating module 526. This method includes adjusting the distance between the heating module 526 and the electronic component under test 100, and adjusting the heating intensity between the heating module 526 and the electronic component under test 100, etc. The temperature monitoring unit 526 does not need to be configured directly above the electronic component under test 100. On the other hand, at least one of the heating module 526 and the temperature monitoring unit 526 can be configured above the electronic component under test 100.

[0057] Please see Figure 11 The preferred embodiment of this disclosure describes a device 60 for testing an electronic component 500 under test, comprising a heating module 52 and a temperature monitoring module 62. The heating module 52 heats the electronic component 500 under test. The temperature monitoring module 62 is electrically connected to the heating module 52 and monitors and controls the temperature of the electronic component 500 under test.

[0058] Figure 10 The embodiments in 11 or 11 can be compared with Figures 1-9The embodiments can be combined to form new embodiments. For example, in any embodiment of this disclosure, the temperature monitoring module 62 includes a temperature monitoring unit 526 and a processing unit 525. The temperature monitoring unit 526 is a thermal imager 24. The electronic component under test 100, 500 is at least one of an IC substrate, a liquid crystal panel, and a circuit board. The device 10, 50, 60 further includes a holder 1” to hold the electronic component under test 100, 500. The holder 1” is a clamp 1’ for clamping the electronic component under test 100, 500. The holder 1” and the heating module 2 are arranged vertically or horizontally relative to each other. For example, if the heated surface of the PCB or IC carrier can be vertically aligned with the ground plane, then in order to simultaneously heat and monitor its temperature, the holder 1” and the heating module 2 are arranged horizontally relative to the electronic component under test 100, 500; when the PCB or IC carrier is horizontally aligned with the ground plane, the holder 1” and the heating module 2 are arranged vertically relative to the electronic component under test 100, 500. The electronic component under test 100, 500 has a first surface 100. S1 and a second surface 100S2. The heating module 2 includes a halogen lamp, such as a halogen heating lamp tube 23. The heating module 2 is disposed on one side of the electronic component under test 100, 500 and heats the first surface 100S1. The temperature monitoring unit 100, 500 is disposed on the other side of the electronic component under test 100, 500 and monitors the second surface 100S2 to monitor a temperature of the electronic component under test 100, 500. The processing unit 25, 525 acquires a temperature reading from the temperature monitoring unit 26, 526 in real time. The device 10, 50, 60 is configured to perform the following actions: controlling the heating module 2, 52 to reduce a heating intensity before the temperature data is lower than and close to a first temperature; and controlling the heating module 2, 52 to increase the heating intensity before the temperature data is higher than and close to a second temperature, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the electronic component under test 100, 500 and the heating module 2, 52. The device 10, 50, 60 also includes a detection module 3, which includes a moving mechanism 31 and a mounting mechanism. A detection probe 32 is located on the moving mechanism 31, and the moving mechanism 31 is configured corresponding to the fixture 1', driving the detection probe 32 to detect the electronic components 100, 500 under test. The moving mechanism 31 includes a translation drive group 311, a lifting drive group 312 mounted on the translation drive group 311, and a fixed base 313 mounted on the lifting drive group 312, wherein the detection probe 32 is fixed to the fixed base 313, and the translation drive group 311 and the lifting drive group 312 are respectively a linear slide rail and a motor-driven push rod.The testing device 10, 50, 60 for the electronic components under test further includes a moving mechanism 4, such as a translation mechanism 4, wherein the holder 1” is mounted on the moving mechanism 4 and can move relative to the heating module 2, 52 following the moving mechanism 4. Heating of the electronic components under test 100, 500 and testing of the electronic components under test 100, 500 are performed simultaneously. The device 10, 50, 60 further includes a support frame 1, the interior of which has a transparent area, exposing the two opposing surfaces 100S1, 100S2 of the electronic components under test 100, 500 through the transparent area.

[0059] In summary, the testing device and method for electronic components under test disclosed herein have not been seen in similar products or publicly used, and possess industrial applicability, novelty, and inventiveness, fully meeting the requirements for patent application. Therefore, this application is filed in accordance with the Patent Act to protect the inventor's rights.

[0060] Symbol Explanation

[0061] 100, 500: Electronic components under test

[0062] 101: Area 1

[0063] 102: Second Area

[0064] 10, 50, 60: Testing device for electronic components under test

[0065] 1: Support frame

[0066] 1': Fixture

[0067] 1”: Holder

[0068] 2,52: Heating module

[0069] 21: First heating source

[0070] 22: Second heating source

[0071] 23: Halogen heating lamp tube

[0072] 24: Thermal Imager

[0073] 25,525: Processing Unit

[0074] 26,526: Temperature monitoring unit

[0075] 3: Detection Module

[0076] 31: Mobile mechanism

[0077] 311: Translation drive group

[0078] 312: Lifting drive unit

[0079] 313: Fixed base

[0080] 32: Detection probe

[0081] 4: Translation mechanism

[0082] 6: Temperature monitoring module

Claims

1. An apparatus for testing an electronic component under test, comprising: A clamp holds the electronic component under test, wherein the electronic component under test has a first surface and a second surface: A heating module is disposed on one side of the electronic component under test and heats the first surface; A thermal imager is positioned on the other side of the electronic component under test and monitors the second surface to monitor the temperature of the electronic component under test; as well as The processing unit is electrically connected to the heating module and the thermal imager, and adjusts the heating module in response to the temperature so that the temperature is stabilized within a default range.

2. The apparatus according to claim 1, wherein: The electronic component under test is at least one of an IC substrate, a liquid crystal panel, and a circuit board; The heating module includes a halogen lamp; The device further includes a detection module, which includes a first moving mechanism and a detection probe mounted on the first moving mechanism. The first moving mechanism is configured to correspond to the fixture and drives the detection probe to detect the electronic component under test. The first moving mechanism includes a translation drive group, a lifting drive group installed on the translation drive group, and a fixed base installed on the lifting drive group, wherein the detection probe is fixed on the fixed base, and the translation drive group and the lifting drive group are respectively a linear slide rail and a motor-driven push rod; The device further includes a second moving mechanism, wherein the clamp is mounted on the second moving mechanism and is capable of moving relative to the heating module following the second moving mechanism; The heated surface of the electronic component under test is set vertically to the horizontal plane; The device further includes at least four detection modules, two of which are disposed on the left and right sides of one side of the clamp, and the other two of which are disposed on the left and right sides of the other side of the clamp. Heating of the electronic component under test and testing of the electronic component under test are performed simultaneously; and The device also includes a support frame with an open area inside, through which the two opposing surfaces of the electronic component under test are exposed.

3. The apparatus according to claim 1, wherein: The processing unit acquires temperature data from the thermal imager in real time and compares the temperature data with the target temperature and the threshold temperature to perform the following: Before the temperature data falls below and approaches the target temperature, the heating module is controlled to reduce the heating intensity; and Before the temperature data is higher than and close to the threshold temperature, the heating module is controlled to increase the heating intensity, wherein the heating intensity includes at least one of the heat source intensity, heating interval time, and the distance between the electronic component under test and the heating module.

4. A method for testing an electronic component under test, comprising the following steps: The system provides an electronic component under test (DUT), a holder for holding the DUT, a heating module disposed on one side of the DUT, a temperature monitoring unit disposed on the other side of the DUT, and a processing unit. Hold and move the electronic component under test to the position of the heating module: The first surface of the electronic component under test is heated on one side of the electronic component under test; The temperature of the electronic component under test is monitored on the second surface of the electronic component under test from the other side of the electronic component under test. as well as The heating module is adjusted in response to the temperature to stabilize the temperature within a default range.

5. The method according to claim 4, further comprising the following steps: The processing unit acquires temperature data from the thermal imager in real time and compares the temperature data with the target temperature and the threshold temperature to perform the following: Before the temperature data falls below and approaches the target temperature, the heating module is controlled to reduce the heating intensity; and Before the temperature data is higher than and close to the threshold temperature, the heating module is controlled to increase the heating intensity, wherein the heating intensity includes at least one of the heat source intensity, heating interval time, and the distance between the electronic component under test and the heating module.

6. The method according to claim 4, wherein: The temperature monitoring unit is a thermal imager; The electronic component under test is at least one of an IC substrate, a liquid crystal panel, and a circuit board; The method further includes the following steps: providing a detection module, the detection module including a first moving mechanism and a detection probe mounted on the first moving mechanism, wherein the first moving mechanism is configured corresponding to the fixture and drives the detection probe to detect the electronic component under test; The method further includes the following steps: providing a second moving mechanism, wherein the retainer is mounted on the second moving mechanism and is capable of moving relative to the heating module following the second moving mechanism; The heated surface of the electronic component under test is positioned vertically to the horizontal plane; and The heating of the electronic component under test and the testing of the electronic component under test are performed simultaneously.

7. An apparatus for testing an electronic component under test, comprising: The heating module heats the electronic component under test; A temperature monitoring unit monitors the temperature of the electronic component under test; and The processing unit is electrically connected to the heating module and the temperature monitoring unit, and adjusts the heating module in response to the temperature so that the temperature is stabilized within a default range.

8. The apparatus according to claim 7, wherein: The temperature monitoring unit is a thermal imager; The electronic component under test is at least one of an IC substrate, a liquid crystal panel, and a circuit board; The device also includes a holder for holding the electronic component under test: The holder is a clamp used to hold the electronic component under test; The heated surface of the electronic component under test is set vertically to the horizontal plane; The electronic component under test has a first surface and a second surface; The heating module includes a halogen lamp; The heating module is disposed on one side of the electronic component under test and heats the first surface; The temperature monitoring unit is disposed on the other side of the electronic component under test and monitors the second surface to monitor the temperature of the electronic component under test; The processing unit acquires temperature data from the temperature monitoring unit in real time to perform: Before the temperature data falls below and approaches a first temperature, the heating module is controlled to reduce the heating intensity; and Before the temperature data is higher than and close to the second temperature, the heating module is controlled to increase the heating intensity, wherein the heating intensity includes at least one of the heat source intensity, heating interval time, and the distance between the electronic component under test and the heating module; The device further includes a detection module, which includes a first moving mechanism and a detection probe mounted on the first moving mechanism. The first moving mechanism is configured to correspond to the fixture and drives the detection probe to detect the electronic component under test. The first moving mechanism includes a translation drive group, a lifting drive group installed on the translation drive group, and a fixed base installed on the lifting drive group, wherein the detection probe is fixed to the fixed base, and the translation drive group and the lifting drive group are respectively a linear slide rail and a motor-driven push rod. The testing device for the electronic component under test further includes a second moving mechanism, wherein the holder is mounted on the second moving mechanism and is capable of moving relative to the heating module following the second moving mechanism; Heating of the electronic component under test and testing of the electronic component under test are performed simultaneously; and The device also includes a support frame with an open area inside, through which the two opposing surfaces of the electronic component under test are exposed.

9. An apparatus for testing an electronic component under test, comprising: The heating module heats the electronic component under test; and A temperature monitoring module is electrically connected to the heating module and monitors and controls the temperature of the electronic component under test.

10. The apparatus according to claim 9, wherein: The temperature monitoring module includes a temperature monitoring unit and a processing unit; The temperature monitoring unit is a thermal imager; The electronic component under test is at least one of an IC substrate, a liquid crystal panel, and a circuit board; The device also includes a holder for holding the electronic component under test: The holder is a clamp used to hold the electronic component under test; The heated surface of the electronic component under test is set vertically to the horizontal plane; The electronic component under test has a first surface and a second surface; The heating module includes a halogen lamp; The heating module is disposed on one side of the electronic component under test and heats the first surface; The temperature monitoring unit is disposed on the other side of the electronic component under test and monitors the second surface to monitor the temperature of the electronic component under test; The processing unit acquires temperature data from the temperature monitoring unit in real time to perform: Before the temperature data falls below and approaches a first temperature, the heating module is controlled to reduce the heating intensity; and Before the temperature data is higher than and close to the second temperature, the heating module is controlled to increase the heating intensity, wherein the heating intensity includes at least one of the heat source intensity, heating interval time, and the distance between the electronic component under test and the heating module; The device further includes a detection module, which includes a first moving mechanism and a detection probe mounted on the first moving mechanism. The first moving mechanism is configured to correspond to the fixture and drives the detection probe to detect the electronic component under test. The first moving mechanism includes a translation drive group, a lifting drive group installed on the translation drive group, and a fixed base installed on the lifting drive group, wherein the detection probe is fixed on the fixed base, and the translation drive group and the lifting drive group are respectively a linear slide rail and a motor-driven push rod; The testing device for the electronic component under test further includes a second moving mechanism, wherein the holder is mounted on the second moving mechanism and is capable of moving relative to the heating module following the second moving mechanism; Heating of the electronic component under test and testing of the electronic component under test are performed simultaneously; and The device also includes a support frame with an open area inside, through which the two opposing surfaces of the electronic component under test are exposed.

Images