Miniaturized W-band ultra-large phased array system

Abstract

The present application relates to the technical field of phased array radar, and particularly relates to a miniaturized W-band ultra-large-scale phased array system.The present application comprises: a W-band array antenna unit, a 12-way receiving down-conversion unit, a 1-way transmitting up-conversion unit, a digital baseband processing unit, a wave control unit, a digital baseband processing unit, a power supply processing unit; the W-band array antenna unit, 48 groups of transceiving multifunctional front ends, the 12-way receiving down-conversion unit, the 1-way transmitting up-conversion unit, the digital baseband processing unit, the wave control unit, a frequency synthesis unit, and the power supply processing unit are integrated in one substrate.The present application reduces the connection points and interfaces between separated modules in conventional design, reduces the system failure probability caused by poor connection, contact failure and the like, and improves the reliability and stability of the system.

Description

Technical Field

[0001] This invention relates to the field of phased array radar technology, and more specifically, to a miniaturized W-band ultra-large-scale phased array system. Background Technology

[0002] Existing phased array systems include integrated phased array design, distributed micro-region intelligent thermal control design, micro-sized W-band integrated microsystem packaging design, and 768-element ultra-large-scale miniaturized phased array design.

[0003] Integrated Phased Array Design: Traditional phased array designs employ a modular approach, first using bare MMIC chips housed in a metal shielded box to construct subsystem modules, and then selecting subsystem modules with suitable performance to build the phased array system. This approach results in separate antenna and transceiver components, leading to significant interconnection losses between them, and greatly increasing system size and cost. It suffers from disadvantages such as high cost, large size, and low integration.

[0004] Distributed micro-area intelligent thermal control design: Traditional centralized thermal control needs to cover the entire system. To meet the high heat dissipation requirements of certain areas, it is often necessary to excessively increase the overall heat dissipation power, such as increasing fan speed and water cooling flow, leading to excessive energy consumption, low heat dissipation efficiency, and other problems. At the same time, during the operation of the phased array, some areas, such as the power amplifier area and the power supply area, have higher heat dissipation, and there is uneven heat dissipation within the system. Traditional heat dissipation methods are difficult to cover all of them, and often solve such problems by consuming more energy.

[0005] Micro-sized W-band integrated microsystem packaging design: Currently, some designs employ traditional discrete assembly methods, packaging antenna, TR components, frequency converter chips, control circuits, and other functional modules independently, then interconnecting them via cables, connectors, or multilayer substrates. This results in a loose system structure with low integration, high losses, and poor heat dissipation, making it unsuitable for miniaturized applications. Other designs utilize microsystem packaging, integrating only partial functions. For example, they design separate micro-packages for antenna and TR component chips, frequency converter chips, and power controls, followed by board-level mounting. Compared to traditional methods, this improves integration and shortens the transmission path, but still suffers from low integration, high losses, and high costs.

[0006] 768-element ultra-large-scale miniaturized phased array design: Currently available W-band phased arrays have a relatively small number of elements. For example, some common phased arrays may only have tens to hundreds of elements, and they use separate module splicing, resulting in low integration. Moreover, due to limitations in size and performance, they are mainly used in some scenarios such as ground radar and large communication base stations where size and weight requirements are not so stringent. Summary of the Invention

[0007] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, the purpose of this invention is to propose a miniaturized W-band ultra-large-scale phased array system that fully utilizes the internal gaps of the system for heat dissipation, ensuring device reliability while also considering efficiency, size, and cost.

[0008] To achieve the above and other related objectives, the present invention provides a miniaturized W-band ultra-large-scale phased array system, comprising: W-band array antenna unit, which communicates with 48 transceiver multifunction front-ends; The system includes 12 receiving downconversion units and 1 transmitting upconversion unit, which are connected to the 48 sets of transceiver multi-function front-ends. The digital baseband processing unit is communicatively connected to the 12-channel receiving downconversion unit and the 1-channel transmitting upconversion unit. The beam control unit is connected to the digital baseband processing unit, the 12-channel receiving downconversion unit, the 1-channel transmitting upconversion unit, and the 48 groups of transceiver multi-functional front-ends. The frequency synthesis unit is connected to the 12-channel receiving downconversion unit, the 1-channel transmitting upconversion unit, and the 48 groups of transceiver multi-function front-ends. The power supply unit is used to supply power to the W-band array antenna unit, 48 transceiver multi-function front-ends, 12-channel receiving down-conversion units, 1-channel transmitting up-conversion unit, digital baseband processing unit, wave control unit, and frequency synthesis unit. The W-band array antenna unit, 48 transceiver multi-function front-ends, 12 receiving down-conversion units, 1 transmitting up-conversion unit, digital baseband processing unit, wave control unit, frequency synthesis unit, and power processing unit are integrated into a single substrate.

[0009] In one embodiment of the present invention, the W-band array antenna unit includes 12 antenna array combinations, and each antenna array combination includes 64 W-band antenna arrays in total, each consisting of 8×8 arrays.

[0010] In one embodiment of the present invention, each of the 48 transceiver multifunction front-ends includes a 64-channel transceiver array.

[0011] In one embodiment of the present invention, the 48 transceiver multifunction front-ends are used to amplify, amplitude and phase control, and shift the frequency of the radio frequency signal input to the W-band array antenna unit before outputting it to the 12-channel receiving downconversion unit. The 48 transceiver multifunction front-ends are also used to shift the frequency, amplify, and phase control the signal input to the 1-channel transmitting upconversion unit before outputting it to the W-band array antenna unit.

[0012] In one embodiment of the present invention, the 12-channel receiving downconversion unit includes a low-noise amplifier, a filter, a mixer, a filter, and a digitally controlled attenuator. The 12-channel receiving downconversion unit is used to downconvert the C-band signals input from the 48 groups of transceiver multifunction front-ends to the UHF band, and output them to the digital baseband processing unit after filtering and amplification.

[0013] In one embodiment of the present invention, the 1-channel transmit upconversion unit includes an intermediate frequency amplifier, an intermediate frequency filter, a mixer, a filter, and a digitally controlled attenuator. The 1-channel transmit upconversion unit is used to upconvert the UHF band signal input from the digital baseband processing unit to the C band, and output it to the 48-group transceiver multifunction front end after filtering and amplification.

[0014] In one embodiment of the present invention, the digital baseband processing unit includes a transmitter and a receiver. The transmitter is used to process the radar command output by the application layer into a single-channel transmit signal transmitted by the 1-channel transmit up-conversion unit. The receiver is used to process the digital signals after down-conversion analog-to-digital conversion by the 12-channel receive down-conversion unit, and extract the original data for analysis and processing.

[0015] In one embodiment of the present invention, the beam control unit is used to receive the operation instructions of the digital baseband processing unit and complete the internal instruction conversion processing, and respectively control the receiving and transmitting state switching of the 12-channel receiving downconversion unit, and the amplitude and phase control of the receiving and transmitting links.

[0016] In one embodiment of the present invention, the frequency synthesis unit includes a temperature-controlled 100MHz crystal oscillator, which outputs a fixed 100MHz signal and is output to a phase-locked loop link via a power divider network as a reference clock signal.

[0017] In one embodiment of the present invention, the power processing unit is used to convert an externally input AC +220V voltage into a DC +12V voltage.

[0018] As described above, the miniaturized W-band ultra-large-scale phased array system of the present invention has the following beneficial effects: This invention discloses a miniaturized W-band ultra-large-scale phased array system, comprising a W-band array antenna unit, 48 transceiver multi-function front-ends, 12-channel receive down-conversion units, 1-channel transmit up-conversion unit, a digital baseband processing unit, a beam control unit, a frequency synthesis unit, and a power processing unit. This invention integrates the array antenna, TR components, transceiver channels, power management, beam control links, etc., onto a single substrate, reducing the connection points and interfaces between separate modules in conventional designs, lowering the probability of system failures due to poor connections, contact faults, etc., and improving the reliability and stability of the system.

[0019] The present invention discloses a miniaturized W-band ultra-large-scale phased array system, which adopts a micro-sized W-band integrated microsystem packaging design to form a 16*16mm system-in-package. The micro-sized design also has a lower noise figure and better ERIP characteristics.

[0020] The present invention discloses a miniaturized W-band ultra-large-scale phased array system, which adopts a 768-element ultra-large-scale miniaturized phased array design, has integrated transceiver function, output ERIP≥63dBm, and can be flexibly applied to various guidance head projects. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention; Figure 2 This is a structural block diagram of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention; Figure 3 This is a schematic diagram of a W-band array antenna element of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention; Figure 4 This is a schematic diagram of 48 transceiver multifunctional front-end elements of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention. Figure 5 This is a schematic diagram of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention, showing a 12-channel receiving down-conversion unit and a 1-channel transmitting up-conversion unit. Figure 6 This is a schematic diagram of the digital baseband processing unit of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the wave control unit of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the frequency synthesizer unit of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the power processing unit of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention.

[0022] The components include: 1. W-band array antenna unit; 2. 48 groups of transceiver multi-function front-ends; 31. 12-channel receive down-conversion unit; 32. 1-channel transmit up-conversion unit; 4. Digital baseband processing unit; 5. Beam control unit; 6. Frequency synthesis unit; 7. Power supply processing unit. Detailed Implementation

[0023] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0024] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0025] Terms such as "first" or "second" may be used to describe various components, but these components are not limited by the terms described above. The terms described above are used to distinguish one component from another; for example, without departing from the scope of the concept according to this disclosure, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component.

[0026] Furthermore, "connected / linked" indicates that one component is directly electrically connected to another component or indirectly electrically connected through another component. Unless otherwise explicitly stated in the sentence, the singular form may include the plural form. Additionally, the terms "comprising / including" or "containing / including" as used in this specification indicate the presence or addition of one or more components, steps, operations, and elements. Specific structural or functional descriptions of examples of embodiments of the concepts disclosed in this specification are merely illustrative to describe examples of embodiments of the concepts, and examples of embodiments of the concepts can be implemented in various forms, but these descriptions are not limited to the examples of embodiments described in this specification.

[0027] Based on the concept, various modifications and changes can be applied to examples of embodiments, such that examples of embodiments will be illustrated in the accompanying drawings and described in the specification. However, examples of embodiments based on the concept are not limited to specific embodiments, but include all changes, equivalents, or substitutions included within the spirit and scope of this disclosure.

[0028] It should be understood that when describing an element as "connected" or "linked" to another element, the element may be directly connected or linked to the other element, or it may be connected or linked to the other element via a third element. Conversely, it should be understood that when an element is described as "directly connected to" or "directly linked to" another element, no other element is placed between them. Other expressions describing relationships between components (i.e., "between" and "directly between" or "adjacent to" and "directly adjacent to") need to be interpreted in the same way.

[0029] The terminology used in this specification is for the purpose of describing specific examples of implementations only and is not intended to limit this disclosure. The singular form may include the plural form unless there is an explicit contrary meaning in the context. It should be understood in this specification that the terms "comprising" or "having" indicate the presence of the features, quantities, steps, operations, components, parts, or combinations thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof.

[0030] Unless otherwise defined, all terms used herein (including technical or scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art. If a term is not clearly defined in a common dictionary in this specification, it shall be interpreted as having the same meaning as in the context of the relevant art, and not as an ideal or overly formal meaning.

[0031] Descriptions of known components and processing techniques may be omitted to avoid unnecessarily obscuring the embodiments of this disclosure.

[0032] Throughout this specification, the same reference numerals refer to the same elements. Therefore, even if a reference numeral is not mentioned or described with reference to one drawing, it may be mentioned or described with reference to another drawing. Furthermore, even if a reference numeral is not shown in one drawing, it may be mentioned or described with reference to another drawing.

[0033] Additionally, the logic level of a signal may be different from or opposite to the logic level described. For example, a signal described as having a logic "high" level may optionally have a logic "low" level, and a signal described as having a logic "low" level may optionally have a logic "high" level.

[0034] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this disclosure to facilitate a better understanding of the disclosure. However, the technical solutions claimed in this disclosure can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0035] Integrated phased array design: This design integrates the array antenna, TR components, transceiver channels, power management, and beam control links onto a single substrate. This reduces the connection points and interfaces between separate modules in conventional designs, lowering the probability of system failures due to poor connections or contact faults. Simultaneously, the high-density integration directly translates to reduced size, weight, and cost. Block-style phased array designs rely on the combined design of individual modules, resulting in module volume, weight, and cost several times greater than this design. The integrated packaging structure also better protects internal components, enhances the system's vibration and shock resistance, and improves system reliability and stability.

[0036] Distributed Micro-region Intelligent Thermal Control Design: While integrated design offers higher integration, it also leads to more concentrated thermal effects. This necessitates a breakthrough thermal control solution in the overall design. This invention employs a novel and advanced thermal control scheme, using a metal frame as the heat carrier. Corresponding bump structures are designed for the heat-generating areas of the micro-packages on the phased array surface to capture heat flow. A distributed topology layout of the metal frame is used to achieve distributed micro-region intelligent thermal control. Simultaneously, multiple distributed voltage, current, and temperature sensors are deployed within the system, working collaboratively through intelligent algorithms to achieve "on-demand cooling" and "thermal energy scheduling." This ensures that local hotspots do not overheat while maintaining optimal overall energy efficiency, thereby constructing a more reliable thermal control management system.

[0037] Micro-sized W-band integrated microsystem package design: Standardized antenna arrays, transceiver chips, frequency converter chips, and power control chips are integrated into a standardized, miniaturized, and lightweight 16*16mm system-in-package. Simultaneously, the micro-sized design provides better transmission loss, solving the problem of excessive signal attenuation in W-band transmission, and features a lower noise figure and superior ERIP characteristics.

[0038] The 768-element ultra-large-scale miniaturized phased array design features innovative technologies such as integrated phased array design, distributed micro-area intelligent thermal control design, and micro-sized W-band integrated microsystem packaging design. It has invented and designed an ultra-large-scale miniaturized phased array with 768 elements, integrating transceiver functionality, output ERIP≥63dBm, 12 intermediate frequency outputs / 1 intermediate frequency baseband signal, 1 intermediate frequency input signal, a built-in frequency synthesis unit, and integrated local oscillator, reference, and power control networks. The antenna array size is less than ∮70mm, making it flexible for various guidance head projects.

[0039] This invention employs an integrated design approach that integrates the W-band antenna, TR chip, frequency converter chip, power management chip, and other components onto a single substrate. This integrated design shortens the signal transmission path, reducing signal loss and interference during transmission. Simultaneously, it allows for better control of signal phase and amplitude, improving the beamforming accuracy and radiation efficiency of the phased array, and enhancing the overall system performance.

[0040] This invention utilizes a distributed micro-region intelligent thermal control design to allocate heat dissipation resources on demand. Thermal control measures are applied only to high-heat-generating areas, while low-heat-generating areas employ passive cooling, thus reducing power consumption. Specifically, a distributed microfluidic design is employed to fully utilize internal system gaps for heat dissipation, ensuring device reliability while balancing efficiency, size, and cost.

[0041] This solution integrates all antennas and active links into a single micropackage, achieving the entire link's functionality within a smaller size through a three-dimensional stacked design. This significantly shortens the transmission path of the W-band RF signal, reduces signal attenuation, and improves signal quality. The package's enclosed structure better isolates the internal circuitry from the external electromagnetic environment, reducing electromagnetic interference. Furthermore, the fine-pitch micro-bump vertical transmission layer, employing a ball grid array design, also helps reduce electromagnetic leakage and improve the system's electromagnetic compatibility.

[0042] Due to limitations in size and performance, it is mainly used in scenarios such as ground radar and large communication base stations where size and weight requirements are not so stringent. This invention's 768-element ultra-large-scale miniaturized phased array achieves a significant increase in the number of elements and a high degree of system integration through innovative integration technology. The large-scale array allows for further refinement of beam control, achieving higher angular and range resolution, suitable for applications with extremely high precision requirements, such as UAV-borne radar, small satellite communications, and portable millimeter-wave communication devices. Simultaneously, a pioneering heat dissipation structure design solves the heat dissipation problem caused by the high power density of the W-band, ensuring system stability during long-term operation. Large-scale integrated production reduces the cost of individual components, while also reducing assembly and debugging workload and time, thereby lowering overall system production and maintenance costs. Figure 1 The diagram shows the W-band integrated phased array system of this invention, featuring a high-density integrated phased array design. The antenna and active links are all integrated into a single micro-package, achieving the entire link's functionality within a 16*16mm size through a three-dimensional stacking design. Simultaneously, it innovatively integrates the W-band antenna, TR chip, frequency converter chip, and power management chip into a central substrate using a unified approach. Distributed micro-region intelligent thermal control design allocates heat dissipation resources on demand, specifically employing a distributed microfluidic design to fully utilize internal system gaps for heat dissipation, ensuring device reliability while balancing efficiency, size, and cost.

[0043] Please see Figure 1 , Figure 2 , Figure 1 This is a schematic diagram of the structure of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention; Figure 2 This is a structural block diagram of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention. The present invention provides a miniaturized W-band ultra-large-scale phased array system, comprising: W-band array antenna unit 1, which is connected to 48 transceiver multi-function front-ends 2 for communication. The unit consists of a 12-channel receiving downconversion unit 31 and a 1-channel transmitting upconversion unit 32, which are connected to the 48 groups of transceiver multi-functional front-ends 2. The digital baseband processing unit 4 is communicatively connected to the 12-channel receiving downconversion unit 31 and the 1-channel transmitting upconversion unit 32. The wave control unit 5 is connected to the digital baseband processing unit 4, the 12-channel receiving downconversion unit 31, the 1-channel transmitting upconversion unit 32, and the 48-group transceiver multi-functional front-end 2. The frequency synthesis unit 6 is connected to the 12-channel receiving down-conversion unit 31, the 1-channel transmitting up-conversion unit 32, and the 48-group transceiver multi-functional front-end 2. The power supply processing unit 7 is used to supply power to the W-band array antenna unit 1, the 48 groups of transceiver multi-function front-ends 2, the 12-channel receiving down-conversion unit 31, the 1-channel transmitting up-conversion unit 32, the digital baseband processing unit 4, the wave control unit 5, and the frequency synthesis unit 6. The W-band array antenna unit 1, 48 transceiver multi-function front-ends 2, 12-channel receive down-conversion unit 31, 1-channel transmit up-conversion unit 32, digital baseband processing unit 4, wave control unit 5, frequency synthesis unit 6, and power processing unit 7 are integrated on a single substrate.

[0044] Please see Figure 3 , Figure 3This is a schematic diagram of a W-band array antenna element of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention. The W-band array antenna element 1 includes 12 antenna array combinations, and each antenna array combination includes 64 W-band antenna arrays in a total of 8×8.

[0045] The core function of the W-band array antenna 1 is to realize the transmission and reception conversion of W-band radio frequency signals, including receiving W-band signals in space and outputting W-band signals from the back end. Figure 3 As shown, the antenna aperture contains 12 antenna array combinations, and each array combination contains a total of 64 W-band antenna arrays in an 8*8 configuration.

[0046] Please see Figure 4 , Figure 4 This is a schematic diagram of 48 transceiver multifunctional front-end elements in a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention. The 48 transceiver multifunctional front-end elements 2 are used to amplify, amplitude and phase control, and perform a single frequency shift on the radio frequency signal input from the W-band array antenna unit 1 before outputting it to the 12-channel receiving down-conversion unit 31. The 48 transceiver multifunctional front-end elements 2 are also used to perform frequency shifting, amplification, and phase control on the signal input from the 1-channel transmitting up-conversion unit 32 before outputting it to the W-band array antenna unit 1.

[0047] In one embodiment of the present invention, the 48 transceiver multifunction front-ends 2 are transceiver array designs, each group having 64 transceiver array channels. The receiving function amplifies, controls the amplitude and phase of the input RF signal, and performs a single frequency shift before outputting it to the subsequent stage. The transmitting function performs frequency shifting, amplification, and phase control on the signal input from the back-end before outputting it to the antenna. Specifically, as follows... Figure 4 As shown, the receiving function involves the antenna processing the received radio frequency signal through functional devices such as a digitally controlled attenuator, a phase-shifting attenuator, an amplifier, and a combiner, before outputting it to an internal primary frequency conversion unit. This internal unit down-converts the input W-band signal to a C-band signal and then outputs it to the next unit circuit. The transmitting function involves the intermediate frequency input port receiving the C-band signal from the next unit, up-converting it to a W-band signal after passing through the internal primary frequency conversion unit, and then transmitting it to the antenna for radiation output after passing through an amplitude and phase controller.

[0048] Please see Figure 5 , Figure 5This is a schematic diagram of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention, comprising a 12-channel receive down-conversion unit and a 1-channel transmit up-conversion unit. The 12-channel receive down-conversion unit 31 includes a low-noise amplifier, a filter, a mixer, a filter, and a digitally controlled attenuator. This unit is used to down-convert the C-band signal input from the 48 groups of transceiver multifunction front-ends 2 to the UHF band, and output it to the digital baseband processing unit 4 after filtering and amplification. The 1-channel transmit up-conversion unit 32 includes an intermediate frequency amplifier, an intermediate frequency filter, a mixer, a filter, and a digitally controlled attenuator. This unit is used to up-convert the UHF band signal input from the digital baseband processing unit 4 to the C-band, and output it to the 48 groups of transceiver multifunction front-ends 2 after filtering and amplification.

[0049] In one embodiment of the present invention, the main function of the 12-channel receive downconversion / 1-channel transmit upconversion 3 is to realize the frequency conversion between the radio frequency (RF) signal and the baseband intermediate frequency (IF) signal. The receive downconversion needs to complete signal amplification and filtering, possessing low noise, high linearity, and other electrical performance characteristics. The transmit upconversion completes the filtering, mixing, and amplification functions of the IF input signal, possessing high power, low power consumption, and other electrical performance characteristics. The upconversion / upconversion link is a key channel connecting the antenna and the signal processing unit. For example... Figure 5 As shown, the 12-channel receive downconversion unit is an internal secondary frequency conversion unit, including a low-noise amplifier, filter, mixer, filter, digitally controlled attenuator, etc. Its main function is to downconvert the C-band signal input from the front-end to the UHF band, and output it to the subsequent digital baseband processing unit after filtering and amplification. The 1-channel transmit upconversion unit is an internal secondary frequency conversion unit, including an intermediate frequency amplifier, intermediate frequency filter, mixer, filter, digitally controlled attenuator, etc. Its main function is to upconvert the UHF band signal input from the subsequent digital baseband processing unit to the C-band, and output it to the front-end transceiver multi-function front-end unit after filtering and amplification.

[0050] Please see Figure 6 , Figure 6 This is a schematic diagram of the digital baseband processing unit of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention. The digital baseband processing unit 4 includes a transmitter and a receiver. The transmitter is used to process the radar commands output from the application layer into a single-channel transmit signal transmitted by the 1-channel transmit up-conversion unit 32. The receiver is used to process the digital signals after down-conversion analog-to-digital conversion by the 12-channel receive down-conversion unit 31, and extract the original data for analysis and processing.

[0051] In one embodiment of the present invention, the digital baseband processing unit 4 is the core module responsible for digital signal processing. Its main functions include modulation, demodulation, filtering, encoding, and decoding of the intermediate frequency baseband digital signals, converting transmitable signals into understandable data, and achieving signal optimization and system control. The transmitting end processes the radar commands output from the application layer into a single-channel transmit signal suitable for RF front-end transmission. The receiving end processes the 12-channel front-end down-conversion analog-to-digital conversion digital signals, extracting the raw data for analysis and processing. For example... Figure 6 As shown, the single-channel signal generation uses 1920Msps sampling, with an intermediate frequency in the UHF band, 14-bit quantization, and a signal bandwidth of no less than 160MHz. The signal processor integrates an FPGA and a multi-core DSP, providing computing resources to support real-time target detection and tracking. It also includes an embedded GPU, supporting GPU / CUDA-based post-processing and data storage functions.

[0052] Please see Figure 7 , Figure 7 This is a schematic diagram of the beam control unit of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention. The beam control unit 5 is used to receive the operation instructions of the digital baseband processing unit 4 and complete the internal instruction conversion processing, and respectively control the receiving and transmitting state switching of the 12-channel receiving downconversion unit 31, as well as the amplitude and phase control of the receiving and transmitting links.

[0053] In one embodiment of the present invention, the beam control unit 5 is the beam command core of the W-band ultra-large-scale miniaturized phased array system. It calculates and issues transmit / receive control commands, phase and amplitude control commands, power control commands, and feedback commands according to the instructions of the digital baseband processing unit. This drives the TR chip, up / down converter chip, power management chip, etc., in the array to work collaboratively, realizing functions such as rapid scanning, directional tracking, and beamforming of the antenna beam, thereby improving the system's response speed and flexibility. Figure 7 As shown, the beam control unit receives operation commands from the digital baseband and completes internal command conversion processing. It controls a series of functions, including switching the receive and transmit states of the 12-channel transceiver multifunction receiver, controlling the amplitude and phase of the transceiver link, and switching the operating frequency of the phase-locked source. Simultaneously, it outputs internal alarm indicators, including phase-locked source lock indication, current monitoring, and temperature monitoring information.

[0054] Please see Figure 8 , Figure 8 This is a schematic diagram of the frequency synthesizer unit of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention. The frequency synthesizer unit 6 includes a temperature-controlled 100MHz crystal oscillator, which outputs a fixed 100MHz signal and outputs it to a phase-locked loop link as a reference clock signal through a power divider network.

[0055] In one embodiment of the present invention, the frequency synthesis unit 6 provides a stable local oscillator signal and clock signal for the W-band phased array. Its main internal functions include crystal oscillator reference clock processing, frequency synthesis processing, phase-locked source local oscillator output processing, and various other active circuits. Figure 8 As shown, the frequency synthesizer unit includes a temperature-controlled 100MHz crystal oscillator, which outputs a fixed 100MHz signal, which is then output to the phase-locked loop (PLL) link via a power divider network as a reference clock signal. In addition to the PLL reference clock, a separate 100MHz signal is output as the reference signal for the baseband processing unit.

[0056] Please see Figure 9 , Figure 9 This is a schematic diagram of the power processing unit of a miniaturized W-band ultra-large-scale phased array system according to an embodiment of the present invention. The power processing unit 7 is used to convert the externally input AC +220V voltage into DC +12V voltage.

[0057] In one embodiment of the present invention, the power supply processing unit 7 provides power to all active units of the entire W-band ultra-large-scale miniaturized phased array, including the TR unit, frequency conversion unit, control unit, digital signal processing unit, frequency synthesizer unit, etc. in the phased array, providing a stable and reliable power supply, and managing and monitoring the power supply to ensure the normal operation of the phased array system. Figure 9 As shown, the primary voltage regulation circuit of the power supply unit converts the externally input AC +220V voltage to DC +12V voltage. The secondary voltage regulation circuit of the power supply unit converts the primary regulated +12V input to +5V, -5V, +3.3V, and +1V, which are then input to the active devices in each unit's circuit.

[0058] In summary, the miniaturized W-band ultra-large-scale phased array system of the present invention includes a W-band array antenna unit, 48 transceiver multi-function front-ends, 12 receiving down-conversion units, 1 transmitting up-conversion unit, a digital baseband processing unit, a beam control unit, a frequency synthesizer unit, and a power processing unit. The present invention integrates the array antenna, TR components, transceiver channels, power management, beam control links, etc., into the same substrate, reducing the connection points and interfaces between separate modules in conventional designs, reducing the probability of system failures due to poor connections, contact failures, etc., and improving the reliability and stability of the system.

[0059] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A miniaturized W-band ultra-large-scale phased array system, characterized in that, include: W-band array antenna unit (1), which is connected to 48 transceiver multifunction front-ends (2) for communication; The unit consists of 12 receiving downconversion units (31) and 1 transmitting upconversion unit (32), which are connected to the 48 transceiver multi-function front-ends (2) for communication. The digital baseband processing unit (4) is communicatively connected to the 12-channel receiving downconversion unit (31) and the 1-channel transmitting upconversion unit (32); The wave control unit (5) is connected to the digital baseband processing unit (4), the 12-channel receiving downconversion unit (31), the 1-channel transmitting upconversion unit (32), and the 48-group transceiver multi-function front-end (2); The frequency synthesis unit (6) is connected to the 12-channel receiving downconversion unit (31), the 1-channel transmitting upconversion unit (32), and the 48-group transceiver multi-function front-end (2) for communication. The power supply processing unit (7) is used to supply power to the W-band array antenna unit (1), 48 transceiver multi-function front-ends (2), 12-channel receiving down-conversion unit (31), 1-channel transmitting up-conversion unit (32), digital baseband processing unit (4), wave control unit (5), and frequency synthesis unit (6); The W-band array antenna unit (1), 48 transceiver multi-function front-ends (2), 12-channel receiving down-conversion units (31), 1-channel transmitting up-conversion unit (32), digital baseband processing unit (4), wave control unit (5), frequency synthesis unit (6), and power processing unit (7) are integrated on a single substrate.

2. The miniaturized W-band ultra-large-scale phased array system according to claim 1, characterized in that: The W-band array antenna unit (1) includes 12 antenna array combinations, and each antenna array combination includes 64 W-band antenna arrays in total, which are 8×8.

3. A miniaturized W-band ultra-large-scale phased array system according to claim 1, characterized in that: Each of the 48 transceiver multifunction front-ends (2) includes a 64-channel transceiver array.

4. A miniaturized W-band ultra-large-scale phased array system according to claim 3, characterized in that: The 48 transceiver multifunction front-ends (2) are used to amplify, control the amplitude and phase, and shift the frequency of the radio frequency signal input from the W-band array antenna unit (1) before outputting it to the 12-channel receiving downconversion unit (31). The 48 transceiver multifunction front-ends (2) are also used to shift the frequency, amplify, and control the phase of the signal input from the 1-channel transmitting upconversion unit (32) before outputting it to the W-band array antenna unit (1).

5. A miniaturized W-band ultra-large-scale phased array system according to claim 1, characterized in that: The 12-channel receiving downconversion unit (31) includes a low-noise amplifier, a filter, a mixer, a filter, and a digitally controlled attenuator. The 12-channel receiving downconversion unit (31) is used to downconvert the C-band signal input from the 48 groups of transceiver multi-function front-ends (2) to the UHF band, and output it to the digital baseband processing unit (4) after filtering and amplification.

6. A miniaturized W-band ultra-large-scale phased array system according to claim 5, characterized in that: The 1-channel transmit upconversion unit (32) includes an intermediate frequency amplifier, an intermediate frequency filter, a mixer, a filter, and a digitally controlled attenuator. The 1-channel transmit upconversion unit (32) is used to upconvert the UHF band signal input from the digital baseband processing unit (4) to the C band, and output it to the 48-group transceiver multi-function front end (2) after filtering and amplification.

7. A miniaturized W-band ultra-large-scale phased array system according to claim 1, characterized in that: The digital baseband processing unit (4) includes a transmitter and a receiver. The transmitter is used to process the radar command output by the application layer into a single-channel transmission signal transmitted by the 1-channel up-conversion unit (32). The receiver is used to process the digital signal after down-conversion analog-to-digital conversion by the 12-channel down-conversion unit (31) and extract the original data for analysis and processing.

8. A miniaturized W-band ultra-large-scale phased array system according to claim 1, characterized in that: The wave control unit (5) is used to receive the operation instructions of the digital baseband processing unit (4) and complete the internal instruction conversion processing, and respectively control the receiving and transmitting state switching of the 12-channel receiving downconversion unit (31) and the amplitude and phase control of the receiving and transmitting links.

9. A miniaturized W-band ultra-large-scale phased array system according to claim 1, characterized in that: The frequency synthesis unit (6) includes a temperature-controlled 100MHz crystal oscillator, which outputs a fixed 100MHz signal and outputs it to the phase-locked loop link as a reference clock signal through a power divider network.

10. A miniaturized W-band ultra-large-scale phased array system according to claim 1, characterized in that: The power processing unit (7) is used to convert the externally input AC +220V voltage into DC +12V voltage.

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