Circuit board connection technology and connection structure
By using injection molding to form insulating components that wrap the pins, the complexity and high cost of aluminum substrate insulation processing are solved, achieving simplified production and efficient insulation isolation, and is suitable for various circuit board connection methods.
CN122118489APending Publication Date: 2026-05-29PHYLION BATTERY CO LTD
0 Cites 0 Cited by
Patent Information
- Application Number
- CN202610463039.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-09
- Publication Date
- 2026-05-29
AI Technical Summary
Technical Problem
Existing aluminum substrate insulation processes are complex, costly, and have low yields, making them unsuitable for large-scale production.
Method used
The insulating component is formed by injection molding to wrap the pin. Through stamping, electroplating and encapsulation injection molding, the insert and insulating component are inserted into the through hole of the substrate as a whole, eliminating the need for the groove and filling process.
Benefits of technology
It simplifies the production process, reduces costs, improves production efficiency, and achieves stable electrical connection and insulation between the pins and the aluminum base plate.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses a circuit board connection technology and a connection structure, and the technology comprises the following steps: providing an injection molding part which comprises an insert and an insulating part, the insert comprises a plurality of pins, each pin is wrapped by the insulating part, and the part, extending out of the insulating part, of each pin is used as an electric connection end; a substrate is provided, the substrate comprises a conducting layer, a middle dielectric layer and a bottom plate which are sequentially arranged in a stacked mode, the top of the conducting layer is provided with an electric connection area, the electric connection ends of the pins are connected with the electric connection area of the conducting layer, and the insulating parts make contact with the hole walls of the through holes. The method has the beneficial effects that the insert is formed by stamping the strip made of the metal material, then the pins of the insert are subjected to encapsulation injection molding treatment, and the insert and the insulating part are inserted into the substrate as a whole; in the whole process, the substrate does not need to be insulated, multiple procedures are omitted, the insulation isolation requirement is met by adopting a pin encapsulation injection molding mode, the production and manufacturing cost is reduced to a great extent, and the production efficiency is improved.
Need to check novelty before this filing date? Find Prior Art