Camera module, manufacturing method thereof and electronic device

Abstract

The application relates to a camera module, a preparation method thereof and an electronic device. The camera module comprises a light path folding assembly, a lens assembly comprising a driver and an optical lens, the optical lens being arranged on the driver, the driver being arranged on the light path folding assembly, a photosensitive assembly arranged on the light path folding assembly, the photosensitive assembly and the lens assembly being located on the same side of the light path folding assembly, the photosensitive assembly comprising a circuit board, an adapter arranged on a side wall of the driver close to the photosensitive assembly, one end of the adapter being electrically connected to the driver, and the other end of the adapter being electrically connected to the circuit board. Light enters the light path folding assembly through the optical lens, is reflected in the light path folding assembly, and then enters the photosensitive assembly. The adapter of the application can shorten the circuit connection distance between the driver and the circuit board, the adapter has a simple structure, the cost of the camera module is reduced, and the impedance performance of the driver is optimized.

Description

Technical Field

[0001] This application relates to the field of camera equipment, and more particularly to a camera module, its manufacturing method, and an electronic device. Background Technology

[0002] Periscope camera modules can fold the optical path to reduce their size. Conventional periscope camera modules use a combination of a prism and a lens; the incident light is folded once by the prism, achieving one optical path fold, before passing through the lens to reach the image sensor. However, the effect of optical path folding in conventional periscope camera modules is not significant, making it difficult to achieve ultra-telephoto shooting.

[0003] To address this, an irregularly shaped prism can be used to fold the optical path multiple times, enhancing the folding effect and enabling ultra-telephoto shooting. In an existing camera module using an irregularly shaped prism, the connection circuit between the lens motor and the circuit board is embedded. A metal circuit is embedded in the camera module's bracket, with one end electrically connected to the motor and the other end electrically connected to the circuit board, thus conducting electricity between the motor and the circuit board. However, the two ends of the metal circuit extend from opposite sides of the bracket, requiring the circuit to extend a considerable distance from one side to the other. This results in a large conduction distance between the motor and the circuit board, affecting the motor's impedance performance. Summary of the Invention

[0004] To address the aforementioned issues, this application provides a camera module, its fabrication method, and an electronic device, which shortens the circuit connection distance between the driver and the circuit board and optimizes the impedance performance of the driver.

[0005] In a first aspect, this application provides a camera module, including:

[0006] Optical path folding component;

[0007] A lens assembly, including a driver and an optical lens, wherein the optical lens is disposed on the driver, and the driver is disposed on the optical path folding assembly;

[0008] A photosensitive component is disposed on the optical path reversing assembly, and the photosensitive component and the lens assembly are located on the same side of the optical path reversing assembly. The photosensitive component includes a circuit board.

[0009] An adapter is disposed on the side wall of the driver near the photosensitive component. One end of the adapter is electrically connected to the driver, and the other end of the adapter is electrically connected to the circuit board.

[0010] In this process, light enters the optical path deflection assembly through the optical lens, is reflected in the optical path deflection assembly, and then enters the photosensitive assembly.

[0011] According to some embodiments of this application, the optical path deflection component includes:

[0012] The housing has a receiving cavity, and both the lens assembly and the photosensitive assembly are disposed on the housing;

[0013] An optical path deflection element is disposed in the receiving cavity, and the optical path deflection element is used to reflect the light.

[0014] According to some embodiments of this application, the adapter includes:

[0015] A fixing part is electrically connected to the driver and extends along the side wall of the driver near the photosensitive component;

[0016] The bent portion is connected at one end to the fixing portion;

[0017] The adapter connects to the other end of the bent portion and is electrically connected to the circuit board.

[0018] According to some embodiments of this application, the adapter includes pins, and the surface of the circuit board is provided with a conductive area adapted to the pins.

[0019] According to some embodiments of this application, the adapter includes gold fingers, and the circuit board is provided with slots adapted to the gold fingers.

[0020] According to some embodiments of this application, both the fixing part and the bending part are rigid circuit boards or flexible circuit boards.

[0021] According to some embodiments of this application, the fixing part is a rigid circuit board, and the bending part is a flexible circuit board.

[0022] According to some embodiments of this application, the photosensitive component further includes:

[0023] A base is disposed on the optical path folding assembly, and the circuit board is disposed on the base;

[0024] A photosensitive chip is disposed on the circuit board, and the light reflected by the optical path deflection component is incident on the photosensitive chip;

[0025] A reinforcing plate is disposed on the circuit board, and the reinforcing plate is provided with a limiting groove, the end of the adapter being located in the limiting groove.

[0026] According to some embodiments of this application, the groove wall of the limiting groove is provided with a limiting protrusion, which can abut against the adapter.

[0027] According to some embodiments of this application, the camera module further includes a light-shielding layer located between the lens assembly and the photosensitive assembly.

[0028] Secondly, this application provides a method for manufacturing the above-mentioned camera module, comprising:

[0029] The adapter is disposed on the side wall of the driver, and the adapter is electrically connected to the driver;

[0030] Electrically connect the adapter to the circuit board;

[0031] Apply adhesive to the connection between the adapter and the circuit board.

[0032] According to some embodiments of this application, the method further includes: bending the adapter to form a bent portion.

[0033] According to some embodiments of this application, adhesive is applied between the adapter and the circuit board before the adapter is electrically connected to the circuit board.

[0034] Thirdly, this application provides an electronic device, characterized in that it comprises:

[0035] The electronic device itself;

[0036] The camera module described above is disposed on the electronic device body.

[0037] The adapter of this application abuts against the side wall of the driver near the circuit board, reducing the circuit connection distance between the driver and the circuit board. The adapter has a simple structure, reduces the cost of the camera module, and optimizes the impedance performance of the driver. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without exceeding the scope of protection claimed by this application.

[0039] Figure 1 This is a schematic diagram of the camera module according to an embodiment of this application;

[0040] Figure 2 This is a schematic diagram of the lens assembly according to an embodiment of this application;

[0041] Figure 3 This is a schematic diagram of the photosensitive component according to an embodiment of this application;

[0042] Figure 4 This is a schematic diagram of the optical path folding component according to an embodiment of this application;

[0043] Figure 5 This is an exploded view of the optical path folding component according to an embodiment of this application;

[0044] Figure 6 This is a schematic diagram of the adapter according to an embodiment of this application;

[0045] Figure 7 This is a schematic diagram of the adapter connecting the circuit board according to an embodiment of this application;

[0046] Figure 8 This is an exploded view of the photosensitive component according to an embodiment of this application;

[0047] Figure 9 This is a schematic diagram of the reinforcing plate in an embodiment of this application;

[0048] Figure 10 This is a schematic diagram of the adapter entering the limiting groove according to an embodiment of this application;

[0049] Figure 11 This is a schematic diagram of the limiting protrusion in an embodiment of this application;

[0050] Figure 12 This is a schematic diagram of the light-shielding layer in an embodiment of this application;

[0051] Figure 13 This is a flowchart of the preparation method in the embodiments of this application;

[0052] Figure 14A and Figure 14B A schematic diagram of an electronic device according to an example embodiment of this application is shown.

[0053] in,

[0054] 100-Camera Module;

[0055] 1-Optical path folding assembly, 11-Housing shell, 12-Optical path folding element, 111-Receiving cavity, 112-Flange;

[0056] 2-Lens assembly, 21-Driver, 22-Optical lens, 211-Side wall of driver, 212-Electrical connection point;

[0057] 3-Photosensitive component, 31-Circuit board, 32-Base, 33-Photosensitive chip, 34-Reinforcing plate, 35-Filter, 36-Connector, 311-Conducting area, 321-Light transmission hole, 322-Mounting slot; 341-Limiting slot, 342-Allowing slot, 343-Limiting protrusion;

[0058] 4-Adapter, 41-Fixing part, 42-Bending part, 43-Adapter part, 431-Pin;

[0059] 5-Light-shielding layer. Detailed Implementation

[0060] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0061] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0062] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or connections that allow for communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0063] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0064] To simplify the disclosure of this application, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0065] The preferred embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0066] Figure 1 This is a schematic diagram of the camera module according to an embodiment of this application, as shown below. Figure 1 As shown, an embodiment of this application provides a camera module 100, which includes an optical path reversal assembly 1, a lens assembly 2, a photosensitive assembly 3, and an adapter 4. The lens assembly 2 and the photosensitive assembly 3 are disposed on the same side of the optical path reversal assembly 1, for example, both the lens assembly 2 and the photosensitive assembly 3 are disposed on the top of the optical path reversal assembly 1. Light is incident through the lens assembly 2, and after the light reaches the optical path reversal assembly 1, the optical path reversal assembly 1 reflects the light to bend the optical path. The light emitted from the optical path reversal assembly 1 enters the photosensitive assembly 3, and the photosensitive assembly 3 converts the optical signal into an electrical signal.

[0067] The optical path deflection component 1 can reflect light. Optionally, the optical path deflection component 1 reflects light multiple times to increase the focal length and total track length (TTL) of the camera module 100, so that the camera module 100 can achieve a larger focal length while miniaturizing the camera module 100.

[0068] Figure 2 This is a schematic diagram of the lens assembly according to an embodiment of this application, as shown below. Figure 2 As shown, the lens assembly 2 includes a driver 21 and an optical lens 22. Optionally, the driver 21 is a motor. The optical lens 22 includes at least one lens element and is disposed on the driver 21. The driver 21 can drive the optical lens 22 to move, thereby achieving optical image stabilization and / or autofocus of the optical lens 22. The driver 21 is disposed on the optical path reversing assembly 1, for example, on the top of the optical path reversing assembly. Optionally, the driver 21 and the optical path reversing assembly 1 are bonded together with adhesive. Light is incident on the optical path reversing assembly 1 through the optical lens 22. Optionally, the driver 21 has an electrical connection point 212 near the side wall 211 of the photosensitive component 3. The electrical connection point 212 can be a pin, and the number of electrical connection points 212 is set according to requirements.

[0069] The photosensitive component 3 is disposed on the optical path reversing assembly 1, for example, on the top of the optical path reversing assembly 1. Optionally, the photosensitive component 3 and the optical path reversing assembly 1 are bonded together with adhesive. The photosensitive component 3 and the lens assembly 2 are located on the same side of the optical path reversing assembly 1, which avoids excessively increasing the height of the camera module 100 along the Z direction, while reducing the size of the camera module 100 along the X and Y directions, thus facilitating the miniaturization of the camera module 100. When the camera module 100 is mounted on an electronic device, the Z direction is the thickness direction of the electronic device.

[0070] Figure 3 This is a schematic diagram of the photosensitive component according to an embodiment of this application, as shown. Figure 3 As shown, the photosensitive component 3 includes a circuit board 31, which can optionally be a rigid circuit board or a flexible circuit board. A connector 36 is provided at the end of the circuit board 31 away from the lens assembly 2. The connector 36 is used to connect the electronic device body to conduct electricity between the camera module 100 and the electronic device body.

[0071] The adapter 4 is located above the optical path folding assembly 1 and between the driver 21 and the photosensitive assembly 3. One end of the adapter 4 is electrically connected to the driver 21, for example, the adapter 4 connects to the electrical connection point 212 of the driver 21. The adapter 4 is disposed on the side wall of the driver 21 near the photosensitive assembly 3, for example, at least part of the adapter 4 extends along the side wall of the driver 21 near the photosensitive assembly 3, and the adapter 4 is bonded to the side wall of the driver 21 by adhesive. The adapter 4 extends to the bottom of the driver 21 and then bends, and the other end of the adapter 4 is located above the circuit board 31, and the other end of the adapter 4 is electrically connected to the circuit board 31 to conduct power between the driver 21 and the circuit board 31. The circuit board 31 supplies power to the driver 21 through the adapter 4, and the driver 21 drives the optical lens 22 to move.

[0072] Light enters the optical lens 22 of the lens assembly 2 and is incident on the optical path refraction assembly 1. The light is reflected in the optical path refraction assembly, and the light reflected from the optical path refraction assembly 1 enters the photosensitive assembly 3.

[0073] Optionally, during the fabrication of the camera module 100, the adapter 4 can be electrically connected to the driver 21 first, and the adapter 4 can be fixedly connected to the side wall of the driver 21. Then, the adapter 4 can be electrically connected to the circuit board 31 to avoid displacement when the adapter 4 is electrically connected to the circuit board 31 and reduce the possibility of poor soldering during the electrical connection.

[0074] In this embodiment, the adapter 4 abuts against the side wall of the driver 21 near the circuit board 31, reducing the circuit connection distance between the driver 21 and the circuit board 31. The adapter 4 has a simple structure, reduces the cost of the camera module 100, and optimizes the impedance performance of the driver 21.

[0075] Figure 4 This is a schematic diagram of the optical path folding component according to an embodiment of this application. Figure 5 This is an exploded view of the optical path folding component according to an embodiment of this application, as shown below. Figure 4 and Figure 5 As shown, in some embodiments, the optical path folding assembly 1 includes: a housing 11 and an optical path folding element 12.

[0076] The housing 11 is provided with a receiving cavity 111, the top of which is open, and the receiving cavity 111 is adapted to the optical path deflection element 12. The lens assembly 2 and the photosensitive assembly 3 are both disposed on the housing 11. Optionally, the top edge of the housing 11 is provided with a flange 112 to facilitate the housing 11 in providing support for the lens assembly 2 and the photosensitive assembly 3.

[0077] The optical path deflection element 12 is disposed in the receiving cavity 111 and is used to reflect light. The optical path deflection element 12 can be any existing optical path deflection element, for example, an irregularly shaped prism capable of reflecting light multiple times. Light enters the optical path deflection element 12 after passing through the optical lens 22, where it is reflected. The light emitted from the optical path deflection element 12 then enters the photosensitive component 3.

[0078] Figure 6 This is a schematic diagram of the adapter according to an embodiment of this application, as shown. Figure 6 As shown, in some embodiments, the adapter 4 includes a fixing portion 41, a bending portion 42, and an adapter portion 43. The fixing portion 41 is electrically connected to the driver 21 and extends downward along the side wall of the driver 21 near the photosensitive assembly 3. The bending portion 42 is located below the fixing portion 41, with one end connected to the fixing portion 41; optionally, the bending portion 42 forms a 90° bend. The adapter portion 43 connects to the other end of the bending portion 42 and is located above the circuit board 31. For example, the adapter portion 43 abuts against the upper surface of the circuit board 31, and the adapter portion 43 is electrically connected to the circuit board 31. The circuit board 31 supplies power to the driver 21 through the adapter 4. The adapter 4 has a simple structure and is easy to manufacture.

[0079] Optionally, adhesive is provided between the fixing part 41 and the side wall of the driver 21 to bond the fixing part 41 to the driver 21. If necessary, the fixing part 41 and the driver 21 can also be connected by a snap-fit ​​or latching method.

[0080] Figure 7 This is a schematic diagram of the adapter connecting the circuit board according to an embodiment of this application, as shown below. Figure 7As shown, in some embodiments, the adapter 43 includes a pin 431, and the end of the bent portion 42 is connected to the pin 431. Optionally, the edge of the pin 431 is provided with a stamp hole. The upper surface of the circuit board 31 is provided with a conductive area 311 adapted to the pin 431. The pin 431 is disposed on the circuit board 31, the projection of the pin 431 overlaps with the circuit board 31, and the pin 431 is soldered to the conductive area 311 to connect the circuit board 31 and the adapter 4.

[0081] In some embodiments, the adapter 43 includes gold fingers, and the end of the bent portion 42 is connected to the gold fingers. A slot adapted to the gold fingers is provided at the end of the circuit board 31 near the lens assembly 2. The gold fingers are inserted into the slot to establish communication between the circuit board 31 and the adapter 4.

[0082] In some embodiments, the fixing portion 41 and the bending portion 42 of the adapter 4 are both rigid circuit boards. For example, the fixing portion 41 and the bending portion 42 are integrally formed, and the bending portion 42 is formed by bending the rigid circuit board. Since both the fixing portion 41 and the bending portion 42 are rigid circuit boards, they can carry a large amount of power, which is beneficial for the driver 21 to provide a larger thrust to the optical lens 22.

[0083] In some embodiments, both the fixing portion 41 and the bending portion 42 of the adapter 4 are flexible circuit boards. Flexible circuit boards are easy to bend and shape, which facilitates the formation of the bending portion 42.

[0084] In some embodiments, the fixing part 41 of the adapter 4 is a rigid circuit board, and the bending part 42 is a flexible circuit board. The fixing part 41 is a rigid circuit board, which facilitates the electrical connection of the fixing part 41 to the driver 21, and the bending part 42 is a flexible circuit board, which facilitates the bending part 42 to be bent into shape.

[0085] Optionally, the process of bending the adapter 4 to form the bent portion 42 can be performed before or after the adapter 4 is connected to the driver 21.

[0086] Figure 8 This is an exploded view of the photosensitive component according to an embodiment of this application, as shown below. Figure 8 As shown, in some embodiments, the photosensitive component 3 further includes a base 32, a photosensitive chip 33, and a reinforcing plate 34.

[0087] The base 32 is disposed on the optical path folding assembly 1. For example, the base 32 is disposed on the top of the housing 11, and the base 32 and the housing 11 are bonded together by adhesive. The circuit board 31 is disposed on the base 32, for example, the circuit board 31 is located above the base 32. Optionally, the base 32 and the circuit board 31 are bonded together by adhesive, and the base 32 can also be molded onto the circuit board 31 by molding. The base 32 covers at least a portion of the electronic components on the circuit board 31, providing protection for the electronic components.

[0088] The photosensitive chip 33 is disposed on the circuit board 31. For example, the photosensitive chip 33 is located on the surface of the circuit board 31 where the base 32 is located, or the photosensitive chip 33 is embedded in the circuit board 31. The photosensitive chip 33 is electrically connected to the circuit board 31, and one way to connect the photosensitive chip 33 to the circuit board 31 is through gold wire connection. The base 32 is provided with a light-transmitting hole 321. The light reflected by the light path deflection component 1 enters the photosensitive chip 33 through the light-transmitting hole 321, and the photosensitive chip 33 can convert the light signal into an electrical signal. Optionally, the base 32 covers part of the non-photosensitive area of ​​the photosensitive chip 33, which helps to reduce the size of the photosensitive component 3.

[0089] A reinforcing plate 34 is disposed on the circuit board 31, with the surface of the circuit board 31 furthest from the base 32 as the upper surface of the circuit board 31. Optionally, the reinforcing plate 34 is bonded to the circuit board 31 with adhesive. The reinforcing plate 34 can be a steel plate. Distributing the reinforcing plate 34 on the surface of the circuit board 31 helps reduce deformation of the circuit board 31, improves its flatness, thereby reducing deformation of the photosensitive chip 33 and improving the imaging clarity of the camera module 100.

[0090] Optionally, the photosensitive component 3 also includes a filter 35. The base 32 is provided with a mounting groove 322 adapted to the filter 35, and the filter 35 is disposed in the mounting groove 322. The filter 35 is located in the optical path of the photosensitive component 3 and is used to filter out stray light such as infrared light to improve the image quality of the camera module.

[0091] Figure 9 This is a schematic diagram of the reinforcing plate in an embodiment of this application. Figure 10 This is a schematic diagram of the adapter entering the limiting groove according to an embodiment of this application, as shown. Figure 9 and Figure 10 As shown, a limiting groove 341 is provided at the end of the reinforcing plate 34 near the lens assembly 2, and the end of the adapter 4 is located in the limiting groove 341. For example, the adapter portion 43 of the adapter 4 can enter the limiting groove 341. The width D1 of the limiting groove 341 is slightly larger than the width of the adapter portion 43. The adapter portion 43 entering the limiting groove 341 facilitates the alignment of the adapter portion 43 with the conductive area 311 of the circuit board 31.

[0092] Optionally, the bottom of the limiting groove 341 is provided with a clearance groove 342, which is used to avoid the conductive area 311 of the circuit board 31, so as to prevent the reinforcing plate 34 from blocking the conductive area 311. The width D2 of the clearance groove 342 is smaller than the width D1 of the limiting groove 341.

[0093] Figure 11 This is a schematic diagram of the limiting protrusion in an embodiment of this application, as shown below. Figure 11As shown, in some embodiments, the groove wall of the limiting groove 341 is provided with a limiting protrusion 343, which can abut against the adapter portion 43 of the adapter 4. The limiting protrusion 343 is made of a flexible material, such as rubber. When the adapter portion 43 enters the limiting groove 341, the limiting protrusion 343 slightly abuts against the side wall of the adapter portion 43 to accurately position the adapter portion 43. As needed, limiting protrusions 343 can be provided on both opposite side walls of the limiting groove 341. This embodiment does not limit the shape of the limiting protrusion 343; for example, the shape of the limiting protrusion 343 can be hemispherical or conical.

[0094] Figure 12 This is a schematic diagram of the light-shielding layer in an embodiment of this application, as shown. Figure 12 As shown, in some embodiments, the camera module 100 further includes a light-shielding layer 5 located between the lens assembly 2 and the photosensitive assembly 3. After the lens assembly 2 and the photosensitive assembly 3 are assembled onto the optical path reversing assembly 1, a gap exists between them, allowing communication between the interior and exterior of the optical path reversing assembly 1. Light from inside the optical path reversing assembly 1 may leak out through the gap between the lens assembly 2 and the photosensitive assembly 3, and external light may also enter the optical path reversing assembly 1 through the gap, thus affecting the imaging of the camera module 100. The light-shielding layer 5 seals the gap between the lens assembly 2 and the photosensitive assembly 3.

[0095] For example, the light-shielding layer 5 is an opaque light-shielding adhesive. The lens assembly 2 and the photosensitive assembly 3 are assembled onto the optical path folding assembly 1. Then, the adapter 4 is placed on the driver 21 and electrically connected to the circuit board 31. Light-shielding adhesive is applied between the lens assembly 2 and the photosensitive assembly 3, sealing the gap between them and covering at least part of the adapter 4. After curing, the light-shielding adhesive forms the light-shielding layer 5.

[0096] In this embodiment, the camera module 100 has the electrical connection point 212 of the driver 21 located on the side wall of the driver 21 near the circuit board 31. An adapter 4 is provided on the side wall of the driver 21 near the circuit board 31. One end of the adapter 4 is electrically connected to the electrical connection point 212 of the driver 21, and the other end of the adapter 4 is electrically connected to the circuit board 31, thereby connecting the circuit board 31 and the driver 21. The adapter 4 has a simple structure and a short length, reducing manufacturing costs while optimizing the impedance performance of the driver 21.

[0097] like Figure 13 As shown, an embodiment of this application provides a method for manufacturing a camera module as described above, the method comprising:

[0098] S1. Place the adapter 4 on the side wall of the driver 21 and electrically connect the adapter 4 to the driver 21.

[0099] The adapter 4 and the driver 21 can be bonded together with adhesive to securely connect the adapter 4 and the driver 21. The adapter 4 is electrically connected to the electrical connection point 212 of the driver 21, for example, by soldering the adapter 4 to the electrical connection point 212.

[0100] Optionally, after assembling the lens assembly 2 and the photosensitive assembly 3 onto the optical path folding assembly 1, the adapter 4 is disposed on the side wall of the driver 21. In another embodiment, the adapter 4 is first disposed on the side wall of the driver 21, and then the lens assembly 2 and the photosensitive assembly 3 are assembled onto the optical path folding assembly 1.

[0101] S2. Connect the adapter 4 to the circuit board 31 electrically.

[0102] After the adapter 4 is disposed on the side wall of the driver 21, the adapter portion 43 of the adapter 4 is positioned above the circuit board 31. For example, the adapter portion 43 enters the limiting groove 341 of the reinforcing plate 34, corresponding to the conductive area 311 of the circuit board 31. The adapter portion 43 is soldered to the conductive area 311 to connect the circuit board 31 and the adapter 4.

[0103] S3. Apply glue to the connection between the adapter 4 and the circuit board 31.

[0104] For example, glue is applied to the welding point between the adapter 43 and the conductive area 311 to strengthen the connection between the adapter 4 and the circuit board 31 and prevent short circuits, disconnection, etc.

[0105] In some embodiments, the manufacturing method further includes bending the adapter 4 to form a bent portion 42. Bending the adapter 4 can be performed either before or after the adapter 4 is connected to the driver 21.

[0106] The bending of the adapter 4 can be assisted by a jig, for example, by using a jig to press down the adapter 43 to ensure that the surfaces of the adapter 43 and the circuit board 31 are completely in contact, thereby improving the welding yield of the adapter 43 and the circuit board 31.

[0107] In some embodiments, before step S2, when the adapter 4 is electrically connected to the circuit board 31, adhesive is applied between the adapter 4 and the circuit board 3. For example, adhesive is applied between the adapter 43 and the circuit board 3 to pre-fix the adapter 43, preventing the adapter 43 from detaching from the circuit board 31 before soldering, thereby improving the assembly accuracy of the camera module 100.

[0108] Optionally, the preparation method further includes: applying a light-shielding adhesive between the lens assembly 2 and the photosensitive assembly 3, sealing the gap between the lens assembly 2 and the photosensitive assembly 3 with the light-shielding adhesive, and forming a light-shielding layer 5 after the light-shielding adhesive is cured, so as to prevent the internal light of the optical path reversing assembly 1 from leaking out through the gap between the lens assembly 2 and the photosensitive assembly 3, or the external light from entering the optical path reversing assembly 1 through the gap between the lens assembly 2 and the photosensitive assembly 3.

[0109] Figure 14A and Figure 14B A schematic diagram of an electronic device illustrating an example embodiment of this application is shown. Figure 14A and Figure 14B As shown, according to another aspect of this application, an embodiment of this application provides an electronic device, wherein the electronic device includes an electronic device body 200 and at least one camera module 100 as described above. Each camera module 100 is respectively disposed on the electronic device body 200 for acquiring images. It is worth mentioning that the type of electronic device body 200 is not limited; for example, the electronic device body 200 can be a smartphone, tablet computer, laptop computer, e-reader, personal digital assistant, camera, or any electronic device that can be configured with a camera module 100. Those skilled in the art will understand that, although the appended... Figure 14A and attached Figure 14B The example of the electronic device body 200 being implemented as a smartphone is not intended to limit the content and scope of this application.

[0110] For example, such as Figure 14A As shown, the camera module 100 is disposed on the electronic device body 200 and faces the front of the electronic device body 200, so that the camera module 100 serves as a front-facing camera of the electronic device for capturing images of objects in the space in front of the electronic device body 200.

[0111] In addition, such as Figure 14B As shown, the camera module 100 is disposed on the electronic device body 200 and faces the rear side of the electronic device body 200, so that the camera module 100 serves as a rear camera of the electronic device for capturing images of objects in the space behind the electronic device body 200.

[0112] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the technical solutions and core ideas of this application. Therefore, any changes or modifications made by those skilled in the art based on the ideas of this application, and on the specific implementation methods and application scope of this application, are all within the scope of protection of this application. In summary, the content of this specification should not be construed as a limitation of this application.

Claims

1. A camera module, characterized in that, include: Optical path folding component; A lens assembly, including a driver and an optical lens, wherein the optical lens is disposed on the driver, and the driver is disposed on the optical path folding assembly; A photosensitive component is disposed on the optical path reversing assembly, and the photosensitive component and the lens assembly are located on the same side of the optical path reversing assembly. The photosensitive component includes a circuit board. An adapter is disposed on the side wall of the driver near the photosensitive component. One end of the adapter is electrically connected to the driver, and the other end of the adapter is electrically connected to the circuit board. In this process, light enters the optical path deflection assembly through the optical lens, is reflected in the optical path deflection assembly, and then enters the photosensitive assembly.

2. The camera module according to claim 1, characterized in that, The optical path deflection component includes: The housing has a receiving cavity, and both the lens assembly and the photosensitive assembly are disposed on the housing; An optical path deflection element is disposed in the receiving cavity, and the optical path deflection element is used to reflect the light.

3. The camera module according to claim 1, characterized in that, The adapter includes: A fixing part is electrically connected to the driver and extends along the side wall of the driver near the photosensitive component; The bent portion is connected at one end to the fixing portion; The adapter connects to the other end of the bent portion and is electrically connected to the circuit board.

4. The camera module according to claim 3, characterized in that, The adapter includes pins, and the surface of the circuit board is provided with a conductive area adapted to the pins.

5. The camera module according to claim 3, characterized in that, The adapter includes gold fingers, and the circuit board is provided with slots that are compatible with the gold fingers.

6. The camera module according to claim 3, characterized in that, Both the fixing part and the bending part are rigid circuit boards or flexible circuit boards.

7. The camera module according to claim 3, characterized in that, The fixing part is a rigid circuit board, and the bending part is a flexible circuit board.

8. The camera module according to claim 1, characterized in that, The photosensitive component also includes: A base is disposed on the optical path folding assembly, and the circuit board is disposed on the base; A photosensitive chip is disposed on the circuit board, and the light reflected by the optical path deflection component is incident on the photosensitive chip; A reinforcing plate is disposed on the circuit board, and the reinforcing plate is provided with a limiting groove, the end of the adapter being located in the limiting groove.

9. The camera module according to claim 8, characterized in that, The groove wall of the limiting groove is provided with a limiting protrusion, which can abut against the adapter.

10. The camera module according to claim 1, characterized in that, It also includes a light-shielding layer located between the lens assembly and the photosensitive assembly.

11. A method for manufacturing the camera module according to claim 1, characterized in that, include: The adapter is disposed on the side wall of the driver, and the adapter is electrically connected to the driver; Electrically connect the adapter to the circuit board; Apply adhesive to the connection between the adapter and the circuit board.

12. The method according to claim 11, characterized in that, Also includes: The adapter is bent to form a bent portion.

13. The method according to claim 11, characterized in that, Before the adapter is electrically connected to the circuit board, adhesive is applied between the adapter and the circuit board.

14. An electronic device, characterized in that, include: The electronic device itself; The camera module as described in any one of claims 1 to 10 is disposed on the electronic device body.

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