A heat dissipation substrate, a printed circuit board heat exchanger and a preparation method thereof

Abstract

The application belongs to the technical field of heat exchangers, and particularly relates to a heat dissipation base, a printed circuit board type heat exchanger and a preparation method thereof, which comprises: a heat dissipation base, the heat dissipation base comprises a plate body, a first medium groove group and a second medium groove group are arranged in parallel and alternately on the plate body, and the two are located on the same horizontal plane; the two ends of the first medium groove group are communicated with a first channel located on the top surface of the plate body, and the two ends of the second medium groove group are communicated with a second channel located on the bottom surface of the plate body; the printed circuit board type heat exchanger is prepared by periodically stacking a plurality of heat dissipation bases and diffusion welding, so that the grooves of adjacent plate bodies and the slotted groove form independent first medium flow channels and second medium flow channels, cross staggered flow of cold and hot fluids in the same layer is realized, and the heat exchange efficiency in the layer and the flow distribution uniformity are effectively improved. The application also provides a preparation method of the heat exchanger, and the structure is formed through etching and welding processes, and has the advantages of compact structure and good heat transfer performance.

Description

Technical Field

[0001] This invention belongs to the field of heat exchanger technology, and particularly relates to a heat dissipation substrate, a printed circuit board heat exchanger, and a method for preparing the same. Background Technology

[0002] Printed circuit board (PCHE) heat exchangers are a new type of high-efficiency, compact heat exchanger based on a microchannel structure. They utilize photochemical etching to create micron- or millimeter-scale flow channels on metal plates, which are then bonded together into a single core using diffusion welding technology. This structure endows them with extremely high specific surface area and excellent structural strength, allowing their volume to be significantly reduced to 1 / 5 or even 1 / 10 of traditional shell-and-tube heat exchangers while maintaining the same heat exchange capacity. Furthermore, they can operate stably under extreme conditions such as high temperature and high pressure. Therefore, PCHEs have been widely applied in cutting-edge fields such as supercritical carbon dioxide power generation, liquefied natural gas cold energy utilization, hydrogen storage and transportation, and nuclear energy systems, becoming a key device driving energy technology advancement.

[0003] However, traditional printed circuit board heat exchangers typically employ a classic structure with alternating layers of cold and hot fluids. While this allows for effective heat exchange between adjacent layers through a large heat transfer area, it has inherent drawbacks: First, within each single layer, the same fluid flows through all parallel microchannels, preventing effective heat exchange between adjacent channels and limiting further improvements in heat exchange efficiency. This also restricts the dimensional expansion of the heat exchanger along the vertical direction of the channels. Second, due to the limited space at the heat exchanger head, the inlet working fluid tends to preferentially choose the path of least resistance during distribution, leading to uneven flow distribution among the microchannels. This results in insufficient heat exchange in some channels and reduced overall efficiency. Although other solutions exist, such as cross-shaped microchannel heat exchangers produced using additive manufacturing, their high manufacturing costs and limited processes hinder large-scale application.

[0004] Therefore, there is an urgent need for a heat dissipation substrate, a printed circuit board heat exchanger, and a method for its fabrication to solve the core technical problems of low in-layer heat exchange efficiency and uneven flow distribution. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation substrate, a printed circuit board heat exchanger, and a method for preparing the same, in order to solve the above-mentioned problems.

[0006] To achieve the above objectives, the present invention provides the following solution: A heat dissipation substrate includes a plate, on which a first medium groove group and a second medium groove group are formed in parallel. The first medium groove group and the second medium groove group are located on the same horizontal plane and are heat exchanged between the first medium groove group and the second medium groove group. It also includes a first channel connecting the two ends of the first medium tank group and a second channel connecting the two ends of the second medium tank group, wherein the first channel and the second channel are located on the top and bottom surfaces of the plate, respectively. The top of the plate is used to connect with the bottom of the top plate or another heat dissipation substrate. The first medium groove group, the first channel, and the second medium groove group and the second channel at the bottom of the top plate or another heat dissipation substrate together form a first medium flow channel. The bottom of the plate is used to connect with the top of the base plate or another heat dissipation substrate. The second medium groove group and the second channel together with the first medium groove group and the first channel on the top of the base plate or another heat dissipation substrate form a second medium flow channel.

[0007] Optionally, it includes a first plate, the top of which has a plurality of second slots and third slots, the second slots and the third slots being arranged in parallel, and the plurality of second slots and the plurality of third slots being arranged alternately; The second slot and the third slot are not connected to each other, and the second slot and the third slot are heat-exchangeable. The plurality of second slots constitute the first medium tank group; the plurality of third slots constitute the second medium tank group; The two ends of the second slot are respectively connected to the first slot, and the first slot forms the first channel; The two ends of the third slot are respectively connected to the fourth slot, and the fourth slot constitutes the second channel; The first slot and the fourth slot, located on the same side, are on the same vertical plane and are respectively opened at the top and bottom of the first plate.

[0008] Optionally, the opening end of the first slot and the opening end of the fourth slot are located on both sides of the first plate.

[0009] Optionally, a second plate body is included, the top of which is provided with a plurality of fifth slots and a sixth slot, the fifth slots and the sixth slots being arranged in parallel, and the plurality of fifth slots and the plurality of sixth slots being arranged alternately; The fifth slot and the sixth slot are not connected to each other, and the fifth slot and the sixth slot are heat-exchangeable. The plurality of fifth slots constitute the first medium tank group; the plurality of sixth slots constitute the second medium tank group; The two ends of the fifth slot are respectively connected to the seventh slot, and the seventh slot constitutes the first channel; The two ends of the sixth slot are respectively connected to the eighth slot, and the eighth slot constitutes the second channel; The seventh and eighth slots, located on the same side, are situated on the same vertical plane and are respectively located at the top and bottom of the second plate.

[0010] Optionally, the opening ends of the seventh slot and the eighth slot are located on both sides of the second plate.

[0011] A printed circuit board type heat exchanger includes a top plate, a bottom plate, and at least one of the above-mentioned heat dissipation substrates; The top of the plate is connected to the bottom of the top plate or another heat dissipation substrate, and the first medium groove group, the first channel, and the second medium groove group and the second channel at the bottom of the top plate or another heat dissipation substrate together form a first medium flow channel; The bottom of the plate is connected to the top of the base plate or another heat dissipation substrate, and the second medium groove group, the second channel, and the first medium groove group and the first channel on the top of the base plate or another heat dissipation substrate together form a second medium flow channel.

[0012] Optionally, when there is only one heat dissipation substrate, the top of the plate is fixed to the top plate, and the first medium groove group, the first channel and the top plate together form the first medium flow channel; The bottom of the plate is fixed to the base plate, and the second medium tank group, the second channel and the base plate together form a second medium flow channel; The first medium flow channel and the second medium flow channel are respectively introduced into two media at different temperatures.

[0013] Optionally, when there are multiple heat dissipation substrates, the top of the plate of the heat dissipation substrate located at the top is fixed to the top plate, and the first medium groove group, the first channel and the top plate together form the first medium flow channel; The bottom of the heat dissipation substrate located at the bottom is fixed to the base plate, and the second medium tank group, the second channel and the base plate together form the second medium flow channel; The first medium groove group and the first channel opened above the plate of the heat dissipation substrate located in the middle, together with the second medium groove group and the second channel opened on the bottom of the bottom plate of the other heat dissipation substrate located above, form the first medium flow channel; The second medium groove group and the second channel opened below the plate of the heat dissipation substrate located in the middle, together with the first medium groove group and the first channel opened on the top of the bottom plate of the other heat dissipation substrate located below, form the second medium flow channel; The first medium flow channel and the second medium flow channel are respectively introduced into two media at different temperatures.

[0014] Optionally, the inlet and outlet of the first medium flow channel are arranged opposite to the inlet and outlet of the second medium flow channel.

[0015] A method for manufacturing a printed circuit board heat exchanger, comprising the following steps: The first dielectric trench group, the second dielectric trench group, the first channel, and the second channel are etched on the heat dissipation substrate. When there is more than one heat dissipation substrate, the plates of two adjacent heat dissipation substrates are welded and fixed together. The top plate is welded and fixed to the top of the corresponding heat dissipation substrate; The base plate is welded and fixed to the bottom of the corresponding heat dissipation substrate.

[0016] Compared with existing technologies, this invention has the following advantages and technical effects: By setting alternating media grooves and distribution slots at the top and bottom of the first and second plates, and periodically stacking the two plates, hot and cold fluids can form parallel flows with adjacent intervals within the same plate plane. This cross-shaped flow pattern significantly enhances the heat transfer capacity between fluids and improves heat transfer efficiency. Simultaneously, the unique slotting design optimizes the uniformity of flow distribution in each channel, improving the problem of uneven flow distribution present in traditional structures. This solution achieves integral molding through diffusion welding, resulting in a compact and reliable structure suitable for harsh conditions such as high temperature and high pressure, providing a highly efficient heat exchange solution for fields such as energy and chemical engineering. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 This is a schematic diagram of the first plate structure of the present invention; Figure 2 This is a cross-sectional view of the first plate structure of the present invention; Figure 3 This is a schematic diagram of the second plate structure of the present invention; Figure 4 This is a cross-sectional structural diagram of the first plate and the second plate of the present invention in a stacked state; Figure 5 This is a schematic diagram of a printed circuit board heat exchanger structure made by stacking a first plate and a second plate according to the present invention. Among them, 1. First plate; 2. First slot; 3. Second slot; 4. Third slot; 5. Fourth slot; 6. Second plate; 7. Fifth slot; 8. Sixth slot; 9. Seventh slot; 10. Eighth slot. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] Reference Figures 1 to 5 The present invention discloses a heat dissipation substrate, including a plate, on which a first medium groove group and a second medium groove group are formed in parallel. The first medium groove group and the second medium groove group are located on the same horizontal plane and are heat exchanged. It also includes a first channel connecting the two ends of the first medium tank group and a second channel connecting the two ends of the second medium tank group, the first channel and the second channel being located on the top and bottom surfaces of the plate, respectively; The top of the plate is used to connect with the bottom of the top plate or another heat dissipation substrate. The first medium groove group and the first channel together with the second medium groove group and the second channel at the bottom of the top plate or another heat dissipation substrate form the first medium flow channel. The bottom of the plate is used to connect with the top of the base plate or another heat dissipation substrate. The second medium groove group and the second channel together with the first medium groove group and the first channel on the top of the base plate or another heat dissipation substrate form a second medium flow channel.

[0021] During operation, hot and cold media flow into the first and second media channels, respectively. Since the first and second media tanks are located on the same horizontal plane and are configured for heat exchange, the hot and cold media can exchange heat in a plane, achieving efficient heat dissipation. Taking the periodic stacking of multiple plates as an example, adjacent plates are connected with their tops and bottoms facing each other and solidified into a single unit using a diffusion welding process, forming the heat exchanger core. During this process, the second media tank and second channel located at the bottom of the upper plate are aligned with the first media tank and first channel located at the top of the lower plate. When the top and bottom plates are connected to the core, they enclose and alternately distribute the first and second media channels. During operation, the first medium, such as a cold fluid, is injected into the first media channel from one side of the core, flowing through the channel enclosed by the first media tank and the upper or top plate; simultaneously, the second medium, such as a hot fluid, is injected into the second media channel, flowing through the channel enclosed by the second media tank and the lower or bottom plate. Because the first and second medium tank groups are located on the same horizontal plane of the same plate and arranged parallel to each other, the first and second media can form a close-knit, alternating flow pattern within the plate plane when flowing through their respective channels. This structure enables the two media to exchange heat efficiently through the plate itself, with a large heat exchange area and a short path. At the same time, the alternating distribution of the channels in three-dimensional space promotes uniform flow distribution, thereby greatly improving the overall heat exchange efficiency and stability.

[0022] As an optional implementation, it includes a first plate 1, with a plurality of second slots 3 and third slots 4 formed on the top of the first plate 1. The second slots 3 and third slots 4 are arranged in parallel, and the plurality of second slots 3 and third slots 4 are arranged alternately. The second slot 3 and the third slot 4 are not connected to each other, and the second slot 3 and the third slot 4 are heat-exchangeable. Among them, multiple second slots 3 constitute the first medium tank group; multiple third slots 4 constitute the second medium tank group; The two ends of the second slot 3 are respectively connected to the first slot 2, and the first slot 2 forms the first channel; The two ends of the third slot 4 are respectively connected to the fourth slot 5, and the fourth slot 5 forms the second channel; The first slot 2 and the fourth slot 5, located on the same side, are on the same vertical plane and are respectively opened at the top and bottom of the first plate 1.

[0023] As an optional implementation, the opening ends of the first slot 2 and the fourth slot 5 are located on both sides of the first plate 1, respectively.

[0024] As an optional implementation, it includes a second plate 6, the top of which is provided with a plurality of fifth slots 7 and sixth slots 8, the fifth slots 7 and sixth slots 8 are arranged in parallel, and the plurality of fifth slots 7 and the plurality of sixth slots 8 are arranged alternately. The fifth slot 7 and the sixth slot 8 are not connected to each other, and the fifth slot 7 and the sixth slot 8 are heat-exchangeable. Among them, multiple fifth slots 7 constitute the first medium tank group; multiple sixth slots 8 constitute the second medium tank group; The two ends of the fifth slot 7 are respectively connected to the seventh slot 9, and the seventh slot 9 forms the first channel; The two ends of the sixth slot 8 are respectively connected to the eighth slot 10, and the eighth slot 10 forms the second channel; The seventh slot 9 and the eighth slot 10, located on the same side, are on the same vertical plane and are respectively opened at the top and bottom of the second plate 6.

[0025] As an optional implementation, the opening ends of the seventh slot 9 and the eighth slot 10 are located on both sides of the second plate 6.

[0026] Multiple sets of parallel and alternating second slots 3 and third slots 4 are etched onto the top surface of the first plate 1. The two ends of the second slot 3 connect to the first slot 2 located at one end of the plate, while the two ends of the third slot 4 connect to the fourth slot 5 located at the other end of the plate. Crucially, although the first slot 2 and fourth slot 5 on the same side are on the same vertical projection plane, the first slot 2 is actually formed on the top surface of the first plate 1, while the fourth slot 5 is formed on its bottom surface, with their openings facing opposite sides of the plate. This allows the second slot 3 on the top surface of the first plate 1 to obtain a fluid passage through the first slot 2, while the third slot 4 on the same plate obtains an independent fluid passage through the fourth slot 5 at the bottom.

[0027] Similarly, alternating fifth slots 7 and sixth slots 8 are etched on the top surface of the second plate 6. The two ends of the fifth slot 7 communicate with the seventh slot 9, and the two ends of the sixth slot 8 communicate with the eighth slot 10. Likewise, the seventh slot 9 and the eighth slot 10, located on the same side, are spatially aligned, but the seventh slot 9 is located on the top surface of the second plate 6, and the eighth slot 10 is located on its bottom surface, with opposite opening directions.

[0028] The structural differences between the first plate 1 and the second plate 6 are mainly reflected in the opening direction and connection relationship of these distribution grooves.

[0029] In actual assembly, the first plate 1 and the second plate 6 are periodically stacked alternately, top to bottom. When the bottom of the first plate 1 is in contact with the top of the second plate 6, the opening of the fourth slot 5 on the bottom of the first plate 1 is spatially aligned with the opening of the seventh slot 9 on the top of the second plate 6. Subsequently, the entire stacked structure is bonded into an inseparable heat exchanger core using a diffusion welding process. During this process, the opening of the eighth slot 10 on the bottom of the upper second plate 6 is aligned with the opening of the first slot 2 on the top of the lower first plate 1. After welding, flow collection cavities are formed at both ends of the core through aligned slots.

[0030] The operation process is as follows: A working fluid, such as a cold fluid, is injected from the collection chamber on one side of the core. This fluid enters the second slot 3 on the first plate 1 through the first slot 2 at the top of the first plate 1. Because the first slot 2 and the eighth slot 10 at the bottom of the second plate 6 are misaligned and not directly connected, the fluid is confined to a flow channel formed by the second slot 3 of the first plate 1 and the bottom of the second plate 6 above it. This flow channel constitutes the first medium flow channel. At the same time, another working fluid, such as a hot fluid, is injected in reverse from the collection chamber on the other side of the core. This fluid enters the sixth slot 8 on the second plate 6 through the seventh slot 9 at the top of the second plate 6. Because the seventh slot 9 is aligned and connected with the fourth slot 5 at the bottom of the first plate 1, the hot fluid can enter the flow channel formed by the sixth slot 8 of the second plate 6 and the top of the first plate 1 below it. This flow channel constitutes the second medium flow channel.

[0031] Its revolutionary effect lies in the fluid distribution pattern: within any plane formed by the stacked first plate 1 and second plate 6, the parallel flow microchannels, i.e., the enclosed flow paths, are no longer dominated by a single fluid. Instead, due to the second slot 3 on the first plate 1 carrying the cold fluid and the sixth slot 8 on the second plate 6 carrying the hot fluid, and these channels being arranged alternately at the same horizontal level after stacking, a "cross-shaped flow state" is achieved. This means that for any channel carrying the cold fluid, the surrounding channels are all carrying the hot fluid, greatly enhancing the heat transfer gradient and efficiency. Simultaneously, since the fluid must enter its respective channel through the alternating distribution slots, this design balances the inflow resistance of each parallel channel, effectively improving the problem of uneven flow distribution in traditional structures, making heat transfer more uniform and efficient. The entire system, through ingenious slot design and plate stacking, achieves complex flow field control with simple processes, resulting in a significant improvement in overall performance.

[0032] A printed circuit board type heat exchanger includes a top plate, a bottom plate, and at least one of the above-mentioned heat dissipation substrates; The top of the plate is connected to the bottom of the top plate or another heat dissipation substrate, and the first medium tank group and the first channel together with the second medium tank group and the second channel at the bottom of the top plate or another heat dissipation substrate form the first medium flow channel; The bottom of the plate is connected to the top of the base plate or another heat dissipation substrate, and the second medium tank group and the second channel together with the first medium tank group and the first channel on the top of the base plate or another heat dissipation substrate form a second medium flow channel.

[0033] As an optional implementation, when there is only one heat dissipation substrate, the top of the plate is fixed to the top plate, and the first medium groove group, the first channel and the top plate together form a first medium flow channel; The bottom of the plate is fixed to the base plate, and the second medium tank group, the second channel and the base plate together form the second medium flow channel; The first medium flow channel and the second medium flow channel are respectively introduced into two media at different temperatures.

[0034] As an optional implementation, when there are multiple heat dissipation substrates, the top of the heat dissipation substrate plate located at the top is fixed to the top plate, and the first medium groove group, the first channel and the top plate together form a first medium flow channel; The bottom of the heat dissipation substrate plate is fixed to the base plate, and the second medium tank group, the second channel and the base plate together form the second medium flow channel; The first medium groove group and the first channel opened on the plate of the heat dissipation base located in the middle, together with the second medium groove group and the second channel opened on the bottom of the bottom plate of the other heat dissipation base located above, form the first medium flow channel; The second medium channel is formed by the second medium groove group and the second channel opened below the plate of the heat dissipation base located in the middle, together with the first medium groove group and the first channel opened on the top of the bottom plate of the other heat dissipation base located below. The first medium flow channel and the second medium flow channel are respectively introduced into two media at different temperatures.

[0035] As an optional implementation, the inlet and outlet of the first medium flow channel are arranged opposite to the inlet and outlet of the second medium flow channel.

[0036] When only one heat dissipation substrate is included, the top of the plate is fixed to the top plate, so that the first medium tank group and the first channel on it are enclosed with the top plate to form a closed first medium flow channel; at the same time, the bottom of the plate is fixed to the bottom plate, so that the second medium tank group and the second channel are enclosed with the bottom plate to form a second medium flow channel. Two media with different temperatures are respectively introduced into these two independent flow channels for heat exchange.

[0037] When multiple heat dissipation substrates are included, they are periodically stacked and diffused welded together. The top heat dissipation substrate has its top plate fixed to the top plate, forming the first medium flow channel of the first layer; the bottom heat dissipation substrate has its bottom plate fixed to the bottom plate, forming the second medium flow channel of the last layer; and for each heat dissipation substrate in the middle, the first medium groove and first channel above the plate are combined with the second medium groove and second channel at the bottom of the adjacent heat dissipation substrate above to form the first medium flow channel, while the structure below the plate is combined with the adjacent substrate below to form the second medium flow channel. The inlets and outlets of the first and second medium flow channels are arranged opposite each other, usually forming a counter-current heat exchange mode. This structure enables the first and second medium flow channels to be alternately arranged adjacent to each other in any plane formed by the stacking of all heat dissipation substrates, forming a highly efficient "cross-shaped" flow, allowing the hot and cold fluids to fully exchange heat at each layer, greatly improving the heat exchange efficiency; at the same time, the complex interconnection of the channels in three-dimensional space promotes uniform fluid distribution, solving the problem of uneven flow, making the heat exchanger compact and highly efficient.

[0038] A method for manufacturing a printed circuit board heat exchanger, comprising the following steps: The first dielectric trench group, the second dielectric trench group, the first channel, and the second channel are etched on the heat dissipation substrate. When there is more than one heat dissipation substrate, the plates of two adjacent heat dissipation substrates are welded and fixed together; The top plate is welded and fixed to the top of the corresponding heat dissipation substrate. The base plate is welded and fixed to the bottom of the corresponding heat dissipation substrate.

[0039] The preparation method first uses a photochemical etching process to precisely etch parallel first and second dielectric trench groups, as well as first and second channels that are connected to their respective ends, on a metal heat dissipation substrate.

[0040] When fabricating multi-layered heat exchangers, multiple etched heat dissipation substrates are stacked and aligned alternately in a specific order, such as a first plate and a second plate, ensuring accurate correspondence between grooves and slots on adjacent substrates. Subsequently, a high-temperature, high-pressure diffusion welding process is used to bond the stacked heat dissipation substrates, along with their top and bottom plates, into a robust and sealed whole. This method directly creates a physical structure that enables "cross-shaped flow": precise etching forms alternating flow channel inlets, while diffusion welding achieves integral forming without damaging the microstructure. The final result is a uniform distribution of flow channels within the heat exchanger core, ensuring that hot and cold fluids can form closely alternating flow states at any cross-section, thereby significantly improving intra-layer heat transfer efficiency and flow distribution uniformity, achieving highly efficient and compact heat transfer performance.

[0041] Specifically, after placing the plate horizontally, all the channels on the front of the plate are engraved on it using precision machinery. Half of the flow area on both sides is engraved first. Then the plate is flipped over and the entrance and exit channels are engraved. The remaining distance of the flow area on both sides is then engraved to ensure that the flow channels are unobstructed.

[0042] Alternatively, a chemical etching process can be used. The board is placed horizontally, and photoresist is laid on it, leaving all channel positions. Photoresist needs to be laid on the sides of the flow channels. Then, chemical reagents are applied for etching, and the reverse side is etched in the same way. After etching, the side flow channels need to be milled with precision machinery to ensure unobstructed flow.

[0043] After the plates are stacked alternately, they are sent into a vacuum or inert gas sealed box for high-temperature and high-pressure diffusion welding. Note that the top, bottom and left and right sides of the core after stacking need pressure support to ensure the welding effect.

[0044] Compared to traditional technologies that can only be manufactured through 3D printing, this invention uses a structural design to facilitate photolithography and then fixes the substrate into a whole through diffusion welding. This simplified manufacturing process significantly reduces manufacturing costs and improves manufacturing efficiency.

[0045] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0046] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A heat dissipation substrate, characterized in that, The plate includes a plate body, on which a first medium tank group and a second medium tank group are formed in parallel. The first medium tank group and the second medium tank group are located on the same horizontal plane and are heat exchanged. It also includes a first channel connecting the two ends of the first medium tank group and a second channel connecting the two ends of the second medium tank group, wherein the first channel and the second channel are located on the top and bottom surfaces of the plate, respectively. The top of the plate is used to connect with the bottom of the top plate or another heat dissipation substrate. The first medium groove group, the first channel, and the second medium groove group and the second channel at the bottom of the top plate or another heat dissipation substrate together form a first medium flow channel. The bottom of the plate is used to connect with the top of the base plate or another heat dissipation substrate. The second medium groove group and the second channel together with the first medium groove group and the first channel on the top of the base plate or another heat dissipation substrate form a second medium flow channel.

2. The heat dissipation substrate according to claim 1, characterized in that, It includes a first plate (1), the top of the first plate (1) has a plurality of second slots (3) and third slots (4), the second slots (3) and the third slots (4) are arranged in parallel, and the plurality of second slots (3) and the plurality of third slots (4) are arranged alternately; The second slot (3) and the third slot (4) are not connected to each other, and the second slot (3) and the third slot (4) are heat exchanged. Among them, a plurality of second slots (3) constitute the first medium tank group; a plurality of third slots (4) constitute the second medium tank group; The two ends of the second slot (3) are respectively connected to the first slot (2), and the first slot (2) constitutes the first channel; The two ends of the third slot (4) are respectively connected to the fourth slot (5), and the fourth slot (5) constitutes the second channel; The first slot (2) and the fourth slot (5) located on the same side are located on the same vertical plane and are respectively opened at the top and bottom of the first plate (1).

3. The heat dissipation substrate according to claim 2, characterized in that, The opening end of the first slot (2) and the opening end of the fourth slot (5) are located on both sides of the first plate (1).

4. The heat dissipation substrate according to claim 1, characterized in that, Includes a second plate (6), the top of the second plate (6) is provided with a plurality of fifth slots (7) and sixth slots (8), the fifth slots (7) and the sixth slots (8) are arranged in parallel, and the plurality of fifth slots (7) and the plurality of sixth slots (8) are arranged alternately; The fifth slot (7) and the sixth slot (8) are not connected to each other, and the fifth slot (7) and the sixth slot (8) are heat exchanged. Among them, the plurality of fifth slots (7) constitute the first medium tank group; the plurality of sixth slots (8) constitute the second medium tank group; The two ends of the fifth slot (7) are respectively connected to the seventh slot (9), and the seventh slot (9) constitutes the first channel; The two ends of the sixth slot (8) are respectively connected to the eighth slot (10), and the eighth slot (10) constitutes the second channel; The seventh slot (9) and the eighth slot (10) located on the same side are located on the same vertical plane and are respectively opened at the top and bottom of the second plate (6).

5. A heat dissipation substrate according to claim 4, characterized in that, The opening ends of the seventh slot (9) and the eighth slot (10) are located on both sides of the second plate (6).

6. A printed circuit board heat exchanger, characterized in that, Includes a top plate, a bottom plate, and at least one heat dissipation substrate as described in any one of claims 1-5; The top of the plate is connected to the bottom of the top plate or another heat dissipation substrate, and the first medium groove group, the first channel, and the second medium groove group and the second channel at the bottom of the top plate or another heat dissipation substrate together form a first medium flow channel; The bottom of the plate is connected to the top of the base plate or another heat dissipation substrate, and the second medium groove group, the second channel, and the first medium groove group and the first channel on the top of the base plate or another heat dissipation substrate together form a second medium flow channel.

7. A printed circuit board heat exchanger according to claim 6, characterized in that, When there is one heat dissipation substrate, the top of the plate is fixed to the top plate, and the first medium groove group, the first channel and the top plate together form the first medium flow channel; The bottom of the plate is fixed to the base plate, and the second medium tank group, the second channel and the base plate together form a second medium flow channel; The first medium flow channel and the second medium flow channel are respectively introduced into two media at different temperatures.

8. A printed circuit board heat exchanger according to claim 6, characterized in that, When there are multiple heat dissipation substrates, the top of the plate of the heat dissipation substrate located at the top is fixed to the top plate, and the first medium tank group, the first channel and the top plate together form the first medium flow channel; The bottom of the heat dissipation substrate located at the bottom is fixed to the base plate, and the second medium tank group, the second channel and the base plate together form the second medium flow channel; The first medium groove group and the first channel opened above the plate of the heat dissipation substrate located in the middle, together with the second medium groove group and the second channel opened on the bottom of the bottom plate of the other heat dissipation substrate located above, form the first medium flow channel; The second medium groove group and the second channel opened below the plate of the heat dissipation substrate located in the middle, together with the first medium groove group and the first channel opened on the top of the bottom plate of the other heat dissipation substrate located below, form the second medium flow channel; The first medium flow channel and the second medium flow channel are respectively introduced into two media at different temperatures.

9. A printed circuit board heat exchanger according to claim 6, characterized in that, The inlet and outlet of the first medium flow channel are arranged opposite to the inlet and outlet of the second medium flow channel.

10. A method for preparing a printed circuit board heat exchanger, used to prepare a printed circuit board heat exchanger according to any one of claims 6-9, characterized in that, Includes the following steps: The first dielectric trench group, the second dielectric trench group, the first channel, and the second channel are etched on the heat dissipation substrate. When there is more than one heat dissipation substrate, the plates of two adjacent heat dissipation substrates are welded and fixed together. The top plate is welded and fixed to the top of the corresponding heat dissipation substrate; The base plate is welded and fixed to the bottom of the corresponding heat dissipation substrate.

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