PCB board capable of preventing bending fracture

Abstract

The application relates to a PCB (printed circuit board) capable of preventing bending fracture, which comprises a substrate layer, a solder pad arranged on the substrate layer, at least one circuit layer and at least one solder resist layer in the thickness direction, characterized in that the PCB has a plurality of relatively independent connecting units in the length direction, and a connecting area is arranged between two adjacent connecting units; at least one via hole penetrating through the substrate layer is arranged at the end of the connecting unit or at least one of the connecting areas, and a conductive circuit on the circuit layer close to the solder pad or on the same surface as the solder pad is arranged.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, and more particularly to a PCB board that is resistant to bending and breakage. Background Technology

[0002] During the assembly and use of electronic devices, PCBs (Printed Circuit Boards) are often subjected to mechanical stresses such as bending and torsion, especially at connector or wire harness pad locations. Traditional PCB designs feature a large, continuous connection between the pads and the PCB substrate. When the PCB is bent at the interface between the pads and the substrate, stress concentration can easily lead to overall cracking of the substrate or circuitry at that interface. Once cracking occurs, power or signal lines will be severed, causing equipment malfunction. Current technology lacks effective measures to prevent the propagation of such cracks and cannot guarantee that the circuit will remain conductive after localized cracking. Summary of the Invention

[0003] In view of the above situation, it is necessary to propose a PCB board that is resistant to bending and breakage.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: a PCB board resistant to bending and breakage, the PCB board including a substrate layer, pads disposed on the substrate layer, at least one circuit layer and at least one solder mask layer along the thickness direction, the PCB board having a plurality of relatively independent connection units along the length direction, and a connection area being provided between two adjacent connection units; at least one via penetrating the substrate layer is provided at the end of the connection unit or in at least one of the connection areas, the via being disposed near the pads or on the conductive lines of the circuit layer located on the same side as the pads.

[0005] Furthermore, there is a non-contact area between the pad and the conductive line of the circuit layer, and the via is located on the side of the non-contact area.

[0006] Furthermore, several of the vias surround the pad or conductive lines on the circuit layer located on the same side as the pad in the non-contact area along an arc or straight line.

[0007] Furthermore, the arc or straight line formed by the via has a plurality of lines.

[0008] Furthermore, the pad is connected to multiple conductive lines, and at least one via is provided between adjacent conductive lines near the pad.

[0009] Furthermore, the diameter of the via is 0.3-1 mm.

[0010] Furthermore, the spacing between adjacent vias is 0.5-2 mm.

[0011] Furthermore, the via is a round hole or an oblong hole.

[0012] Furthermore, each of the connecting units has at least one via at both ends.

[0013] Furthermore, several vias located at the same end of the connecting unit form a via region.

[0014] The beneficial effects of this invention are as follows: When a PCB is bent by external force at the junction of the pads and the substrate, cracks first occur at the stress concentration point and propagate inward. Because the pad area is separated by vias, the stress distribution is altered, effectively blocking the straight-line propagation path of cracks in traditional designs. When the crack propagates to the first via, its propagation path is blocked by the via. Even if the crack continues to cross the via or causes the via to fail, the remaining vias can still maintain the electrical connection between the pads and the internal circuitry of the PCB, thereby ensuring a continuous supply of power or signals. By using vias as "crack-stopping holes" or "dividing points," "complete connection" is transformed into "multi-path parallel connection." Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a PCB board resistant to bending and breakage according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a PCB board resistant to bending and breakage according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a PCB board resistant to bending and breakage according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of a PCB board that is resistant to bending and breakage according to an embodiment of the present invention.

[0016] Label Explanation: 100. PCB board; 110. Substrate layer; 111. Via; 112. Via area; 120. Pad; 130. Circuit layer; 131. Conductive circuit; 132. Front circuit layer; 133. Back circuit layer; 140. Solder resist layer; 141. Window opening; 142. Front solder resist layer; 143. Back solder resist layer; 150. Connection unit; 151. Connection area. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the following detailed description of a PCB board resistant to bending and breakage, in conjunction with the accompanying drawings and embodiments, is provided. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the invention.

[0018] A PCB board 100 is designed to prevent bending and breakage. The PCB board 100 includes a substrate layer 110, pads 120 disposed on the substrate layer 110, at least one circuit layer 130, and at least one solder mask layer 140 along the thickness direction. The PCB board 100 has a plurality of relatively independent connection units 150 along the length direction. A connection area 151 is provided between two adjacent connection units 150. At least one via 111 penetrating the substrate layer 110 is provided at the end of the connection unit 150 or in at least one connection area 151. The via 111 is disposed near the pads 120 or on the conductive line 131 of the circuit layer 130 located on the same side as the pads 120.

[0019] When the PCB is bent by external force at the junction of pad 120 and substrate, cracks first appear at the stress concentration point and propagate inward. Because the area of ​​pad 120 is separated by vias 111, the stress distribution is altered, effectively blocking the straight-line propagation path of the crack in traditional designs. When the crack propagates to the location of the first via 111, its propagation path is blocked by the via 111. Even if the crack continues to cross the via 111 or causes the via 111 to fail, the remaining vias 111 can still maintain the electrical connection between pad 120 and the internal circuitry of the PCB, thus ensuring a continuous supply of power or signals. Using vias 111 as "crack-stopping holes" or "splitting points" transforms "complete connection" into "multi-path parallel connection."

[0020] Furthermore, there is a non-contact area between the pad 120 and the conductive line 131 of the circuit layer 130, and the via 111 is located on the side where the non-contact area is located.

[0021] Furthermore, several vias 111 surround the pad 120 or conductive lines 131 on the circuit layer 130 located on the same side as the pad 120 in an arc or straight line in the non-contact area.

[0022] Furthermore, the arc or straight line formed by the via 111 has multiple lines.

[0023] Furthermore, the pad 120 is connected to multiple conductive lines 131, and at least one via 111 is provided between adjacent conductive lines 131 near the pad 120.

[0024] Furthermore, the diameter of via 111 is 0.3-1mm.

[0025] Furthermore, the spacing between adjacent vias 111 is 0.5-2mm.

[0026] Furthermore, the via 111 is a round hole or an oblong hole.

[0027] Furthermore, each connection unit 150 has at least one through hole 111 at both ends.

[0028] Furthermore, several vias 111 located at the same end of the connecting unit 150 form a via region 112.

[0029] Typically, the circuit layer 130 has two layers: a front circuit layer 132130 and a back circuit layer 133130. The solder mask layer 140 also includes two layers: a front solder mask layer 142140 and a back solder mask layer 143140. Understandably, the front solder mask layer 142140 has an opening 141 for exposing the solder pads 120.

[0030] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0031] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0032] In summary, the PCB board provided by this invention is designed to prevent bending and breakage. When the PCB is bent by external force at the interface between the pads and the substrate, cracks first appear at the stress concentration point and propagate inward. Because the pad area is separated by vias, the stress distribution is altered, effectively blocking the straight-line propagation path of cracks in traditional designs. When the crack propagates to the first via, its propagation path is blocked by the via. Even if the crack continues to cross the via or causes the via to fail, the remaining vias can still maintain the electrical connection between the pads and the internal circuitry of the PCB, thereby ensuring a continuous supply of power or signals. By using vias as "crack-stopping holes" or "splitting points," a "complete connection" is transformed into a "multi-path parallel connection."

[0033] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A PCB board resistant to bending and breakage, the PCB board comprising, along its thickness direction, a substrate layer, pads disposed on the substrate layer, at least one circuit layer, and at least one solder mask layer, characterized in that, The PCB board has several relatively independent connection units along its length, and a connection area is provided between two adjacent connection units; at the end of the connection unit or at least one of the connection areas, at least one through-hole is provided that penetrates the substrate layer, and the through-hole is provided near the pad or on the circuit layer on the same side as the pad.

2. The PCB board resistant to bending and breakage according to claim 1, characterized in that, There is a non-contact area between the pad and the conductive line of the circuit layer, and the via is located on the side of the non-contact area.

3. A PCB board resistant to bending and breakage according to claim 2, characterized in that, Several vias surround the pad or conductive lines on the circuit layer located on the same side as the pad in the non-contact area along an arc or straight line.

4. A PCB board resistant to bending and breakage according to claim 3, characterized in that, The vias form multiple arcs or straight lines.

5. A PCB board resistant to bending and breakage according to claim 2, characterized in that, The pad is connected to multiple conductive lines, and at least one via is provided between adjacent conductive lines near the pad.

6. A PCB board resistant to bending and breakage according to claim 1, characterized in that, The diameter of the via is 0.3-1 mm.

7. A PCB board resistant to bending and breakage according to claim 1, characterized in that, The spacing between adjacent vias is 0.5-2mm.

8. A PCB board resistant to bending and breakage according to claim 1, characterized in that, The via is a round hole or an oblong hole.

9. A PCB board resistant to bending and breakage according to claim 1, characterized in that, Each of the connecting units has at least one via at both ends.

10. A PCB board resistant to bending and breakage according to claim 1, characterized in that, A plurality of vias located at the same end of the connection unit form a via region.

Images