A novel tpi copper clad substrate

Abstract

The application belongs to the technical field of circuit board, and particularly relates to a novel TPI copper-clad substrate, which comprises a PI film in the middle, TPI adhesive layers on both sides of the PI film, and copper foils on the outer sides of the TPI adhesive layers. The TPI copper-clad substrate is completely transparent in appearance and does not affect the appearance of the material, is more beautiful after bonding, has good adhesion, strong weather resistance, good waterproofness, strong customizability, good flexibility and fast curing speed.

Description

Technical Field

[0001] This invention belongs to the field of circuit board technology, specifically relating to a novel TPI copper-clad substrate. Background Technology

[0002] Flexible printed circuit boards (FPCs) have advantages such as the ability to bend, roll, and fold freely, to be arranged arbitrarily according to spatial layout requirements, to move and stretch freely in three-dimensional space, good heat dissipation, and solderability. They meet the needs of electronic products to develop towards high density, miniaturization, and high reliability, and are therefore widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, and digital cameras.

[0003] Existing copper-clad substrate materials exhibit significant performance dispersion, poor aging resistance, low resistance to damp heat, and inadequate transverse properties and interlaminar shear strength. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a novel TPI copper-clad substrate.

[0005] To achieve the above objectives, the technical solution of the present invention is as follows: A novel TPI copper-clad substrate is characterized by comprising a central PI film, TPI adhesive layers on both sides of the PI film, and copper foil on the outer side of the TPI adhesive layers. Beneficial effects

[0006] This invention is completely transparent and will not affect the appearance of the material. It is more aesthetically pleasing after bonding, has good adhesion, strong weather resistance, good waterproof performance, high temperature resistance, strong customizability, good flexibility, and fast curing speed. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 A schematic diagram of the structure of a novel TPI copper-clad substrate provided by the present invention; Explanation of reference numerals in the attached diagram: 1. PI film; 2. TPI adhesive layer; 3. Copper foil. Detailed Implementation

[0009] The present invention will be described below with reference to specific embodiments. Those skilled in the art will understand that these embodiments are for illustrative purposes only and do not limit the scope of the invention in any way. Example

[0010] A novel TPI copper-clad substrate includes a central PI film, TPI adhesive layers on both sides of the PI film, and copper foil on the outer side of the TPI adhesive layers. In practice: Copper foil thickness: Q: 9μm (1 / 4oz), T: 12μm (1 / 3oz), 0: 18μm (1 / 2oz), S: 22μm, F: 25μm (0.8oz), E: 1230μm, 1: 35μm (1oz), W: 50μm (1.5oz) and so on; PI coating thickness: 0: 12.5μm (1mil), 1: 25μm (1mil), 2: 50μm (2mil) and so on; Performance indicators of the TPI copper-clad substrate in this embodiment:

[0011] Note: ①: The standard thickness of the SZ1Y type double-sided panel is 54±3μm; ②: Standard width values ​​are generally 250mm and 500mm; The product appearance standard of this embodiment is as follows:

Claims

1. A novel TPI copper-clad substrate, characterized in that, It includes a PI film in the middle, TPI adhesive layers on both sides of the PI film, and copper foil on the outside of the TPI adhesive layers.

Images