Display device and electronic device including the same

Abstract

Disclosed are display devices and electronic devices including the same. The display device can include a display layer including a plurality of light emitting elements, an optical layer on the display layer, and a window on the optical layer, wherein the window includes a thin film glass layer, a film layer disposed or provided on the thin film glass layer and having a first refractive index, a first protective layer disposed or provided on the film layer and having a second refractive index, and a plurality of adhesive layers each in contact with at least any one of the thin film glass layer, the film layer, and the first protective layer, and each having a third refractive index, wherein the first refractive index has a deviation of about 0.2 or less for each wavelength in a visible light range.

Description

Technical Field

[0001] One or more embodiments of this disclosure relate to display devices having improved or enhanced display quality and electronic devices including display devices. Background Technology

[0002] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles have electronic devices for displaying images. These electronic devices can include organic light-emitting diodes (OLEDs). OLEDs include light-emitting elements that generate light through the recombination of electrons and holes. OLEDs offer advantages such as fast response times and low power consumption. Summary of the Invention

[0003] One or more aspects of embodiments of this disclosure are directed to a display device and an electronic device including the display device that have improved or enhanced display quality by reducing the reflectivity of external light (or reducing the degree or occurrence of the reflectivity of external light) and reducing reflective color defects caused by color deviation (or reducing the degree or occurrence of reflective color defects caused by color deviation).

[0004] Other aspects of the implementation will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practicing the implementations presented in this disclosure.

[0005] One or more embodiments of this disclosure provide a display device, comprising: a display layer including a plurality of light-emitting elements; an optical layer on the display layer; and a window on the optical layer, wherein: the optical layer includes a light-blocking layer and a plurality of color filters, the light-blocking layer having a plurality of openings defined therein and corresponding to a plurality of light-emitting regions, and the plurality of color filters being disposed or provided to correspond to the plurality of openings respectively; the window includes a thin-film glass layer, a film layer disposed or provided on the thin-film glass layer and having a first refractive index, a first protective layer disposed or provided on the film layer and having a second refractive index, and an adhesive layer having a third refractive index in contact with any one selected from the thin-film glass layer, the film layer, and the first protective layer; and the difference between the maximum and minimum values ​​of the first refractive index measured in a wavelength range of about 450 nm to about 650 nm is about 0.2 or less.

[0006] In one or more embodiments, at substantially the same wavelength, the difference between the refractive index of the thin-film glass layer and each of the first, second, and third refractive indices may be about 0.05 or less.

[0007] In one or more embodiments, the adhesive layer may contact each of the film layer and the thin-film glass layer, and the thickness of the adhesive layer may be about 50 μm or less.

[0008] In one or more embodiments, the window may also include a second protective layer beneath the membrane layer, and the membrane layer may include cellulose triacetate (TAC).

[0009] In one or more embodiments, the optical layer may further include a planarization layer covering the color filter and the light blocking layer, and an adhesive layer may be disposed or provided between the film layer and the planarization layer and in contact with the planarization layer.

[0010] In one or more embodiments, the second protective layer may include fluorine.

[0011] In one or more embodiments, the second protective layer may be resilient.

[0012] In one or more embodiments, the modulus of the second protective layer may be about half or less of the modulus of the film layer.

[0013] In one or more embodiments, the thickness of the second protective layer may be from about 5 μm to about 50 μm.

[0014] In one or more embodiments, the difference between the refractive index of the planarization layer and the first refractive index at substantially the same wavelength may be about 0.05 or less.

[0015] In one or more embodiments, the first protective layer may be in contact with the film layer, and the thickness of the first protective layer may be about 5 μm or less.

[0016] In one or more embodiments, the first to third refractive indices may be substantially the same as each other at substantially the same wavelength.

[0017] In one or more embodiments, the electronic device includes: a plurality of housing units, each providing a set or predetermined receiving space; a hinge unit disposed or provided between the housing units and connecting the housing units to each other; and a display device housed in the set or predetermined receiving space, wherein the display device includes: a display layer including a plurality of light-emitting elements; an optical layer on the display layer; and a window on the optical layer, wherein: the optical layer includes a light-blocking layer, a plurality of color filters, and a planarization layer, the light-blocking layer having a plurality of openings defined therein and corresponding to a plurality of light-emitting areas, the plurality of color filters being disposed or provided to correspond to the plurality of openings respectively, and the planarization layer covering the color filters; and the window includes a thin-film glass layer, a film layer disposed or provided on the thin-film glass layer and having a first refractive index, a first protective layer disposed or provided on the film layer and having a second refractive index, and an adhesive layer in contact with at least any one of the thin-film glass layer, the film layer, and the first protective layer and having a third refractive index, wherein the difference between the refractive index of the planarization layer, the refractive index of the thin-film glass layer, and the first refractive index is about 0.05 or less at substantially the same wavelength. In one or more embodiments, at substantially the same wavelength, each of the difference between the refractive index of the planarization layer and the first refractive index of the film layer, and the difference between the refractive index of the thin-film glass layer and the first refractive index of the film layer, can be about 0.05 or less.

[0018] In one or more embodiments, the difference between the third refractive index and the refractive index of the thin-film glass layer at substantially the same wavelength can be about 0.05 or less.

[0019] In one or more embodiments, the difference between the maximum and minimum values ​​of the first refractive index measured in the wavelength range of about 450 nm to about 650 nm may be about 0.2 or less.

[0020] In one or more embodiments, the window may further include a second protective layer between the film layer and the optical layer, and the adhesive layer may contact each of the second protective layer and the planarization layer.

[0021] In one or more embodiments, the thickness of the second protective layer may be from about 5 μm to about 50 μm.

[0022] In one or more embodiments, the first protective layer may be in contact with the film layer.

[0023] In one or more embodiments, the first protective layer may further include a low-reflection layer, and the refractive index of the low-reflection layer may be about 1.48 or less.

[0024] In one or more embodiments, the thickness of the thin-film glass layer may be about 30 μm or less.

[0025] In one or more embodiments, each of the first to third refractive indices may be substantially equal to the refractive index of the thin-film glass layer at substantially the same wavelength. Attached Figure Description

[0026] The accompanying drawings are included to provide a further understanding of embodiments of the subject matter of this disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the subject matter of this disclosure and, together with the description, serve to explain the principles of embodiments of the subject matter of this disclosure. In the drawings: Figure 1A It is a perspective view of an electronic device according to one or more embodiments; Figure 1B It is a block diagram of an electronic device according to one or more embodiments; Figure 2 It is a perspective view of an electronic device according to one or more embodiments; Figure 3 This is a cross-sectional view of a display device according to one or more embodiments; Figure 4 This is an enlarged plan view showing a portion of the display layer according to one or more embodiments; Figure 5 It is a cross-sectional view showing a portion of an electronic device according to one or more embodiments; Figure 6 It is a cross-sectional view showing a portion of an electronic device according to one or more embodiments; Figure 7A It is a graph showing the change in refractive index according to the wavelength of the layers that make up the optical layer; Figure 7B This is a graph showing the refractive index variation according to wavelength for a comparative embodiment; and Figure 7C This is a graph showing the variation of reflectivity according to wavelength for a comparative embodiment. Detailed Implementation

[0027] The subject matter of this disclosure will be described more fully below with reference to the accompanying drawings, in which embodiments of the disclosure are illustrated. As those skilled in the art will recognize, the described embodiments may be modified in one or more suitable and different ways without departing from the spirit or scope of this disclosure. The drawings and description are to be considered illustrative rather than restrictive in nature. Throughout the drawings and written description, the same reference numerals denote the same elements, and their repeated description may not be provided in the specification.

[0028] When describing embodiments of this disclosure (e.g., when describing embodiments of this disclosure), the use of "may" refers to "one or more embodiments of this disclosure".

[0029] In the context of this application and unless otherwise defined, the terms “use,” “using,” and “used” may be considered synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively.

[0030] As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Singular expressions include plural expressions unless the context clearly specifies otherwise.

[0031] As used in this document, the terms “and / or” or “or” include any and all combinations of one or more of the related listed items.

[0032] Throughout this disclosure, expressions such as “at least one of,” “one of,” and “selected from” modify the entire list of elements if they follow / before a list element (e.g., when preceding a list element), and do not modify individual elements within the list. For example, “at least one of a, b, and c,” “selected from at least one of a, b, and c,” “selected from at least one of a to c,” etc., mean only a, only b, only c, both a and b (e.g., both a and b), both a and c (e.g., both a and c), both b and c (e.g., both b and c), all of a, b, and c, or variations thereof.

[0033] As used herein, the terms “substantially,” “about,” and similar terms are used as approximations rather than terms of degree, and are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by a person skilled in the art. Given the measurements discussed and the errors associated with the measurement of a particular quantity (e.g., limitations of the measurement system), “about,” as used herein, includes the value and refers to a range of acceptable deviations from the particular value as determined by a person skilled in the art. For example, “about” could mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the value. Furthermore, it should be understood that even if the terms “about,” “approximation,” or “substantially” are not explicitly stated in a given element (e.g., a claim element), the scope of such elements is intended to include non-substantial variations or variations understood by a person skilled in the art. For example, the numerical values ​​and ranges provided herein are intended to include tolerances and measurement uncertainties that would be recognized by a person skilled in the art, and elements (e.g., claim elements) should be interpreted accordingly to include such equivalences.

[0034] Any numerical range described herein is intended to include all subranges containing the same numerical precision within the described range. For example, the range “1.0 to 10.0” is intended to include all subranges between (and inclusive of) the described minimum value of 1.0 and the described maximum value of 10.0, such as having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit described in this disclosure is intended to include all higher numerical limits contained therein. Therefore, the applicant reserves the right to modify this disclosure, including the claims, to clearly describe any subranges contained within the range expressly described herein.

[0035] In this disclosure, it will be understood that if an element (e.g., a region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “linked to” another element (e.g., when an element (e.g., a region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “linked to” another element), then it may be directly on, directly connected to, or directly linked to the other element, or there may be an intermediary element therein. Conversely, if an element is referred to as being “directly” on, directly connected to, or directly linked to another element (e.g., when an element is referred to as being “directly” on, directly connected to, or directly linked to another element), then there is no intermediary element therein.

[0036] In the accompanying drawings, the thickness, ratio, and size of the components may be exaggerated in order to effectively or appropriately illustrate the technical content.

[0037] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe one or more suitable elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element. Similarly, a second element may also be referred to as a first element.

[0038] In this disclosure, for ease of description, terms such as “below,” “down,” “above,” “up,” etc., are used to describe the relationship between one element and another(s) as shown in the accompanying drawings. The foregoing terms are relative concepts and are described based on the directions indicated in the accompanying drawings.

[0039] It will be understood that the terms “includes,” “including,” “has,” and / or “having,” if used in this disclosure (e.g., as used in this disclosure), specify the presence of the stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. For example, it should be understood that the terms “comprise(s)” / “comprising,” “include(s)” / “including” or “have” / “has” / “having” specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Furthermore, the terms “comprise(s)”, “include(s)”, “have”, “has”, or similar terms include or support the terms “composed of” and “substantially composed of”, indicating the presence of the stated feature, whole, step, operation, element, and / or component, while other features, wholes, steps, operations, elements, components, and / or groups thereof are absent or substantially absent.

[0040] The terms "part" or "unit" refer to a software or hardware component that performs a specific (e.g., set or predetermined) function. For example, a hardware component may include a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC). A software component may refer to executable code in addressable storage media and / or data used by the executable code. Thus, for example, a software component may be an object-oriented software component, a class component, and a task component, and may include processes, functions, attributes, procedures, subroutines, program code segments, drivers, firmware, microcode, data, databases, data structures, tables, arrays, and / or variables.

[0041] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have substantially the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formalized sense unless expressly defined herein.

[0042] In the following, one or more embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings.

[0043] Figure 1A It is a perspective view of an electronic device according to one or more embodiments. Figure 1B This is a block diagram of an electronic device according to one or more embodiments. (Refer to...) Figure 1A and Figure 1B One or more embodiments of this disclosure will be described in more detail.

[0044] refer to Figure 1A The electronic device 1000 can be activated by an electrical signal. For example, the electronic device 1000 can be a mobile phone, a foldable mobile phone, a laptop computer, a television, a tablet computer, a car navigation system, a game console, or a wearable device, but embodiments of this disclosure are not limited thereto. Wearable devices can be devices worn on a user's body and include head-mounted displays (HMDs) that implement extended reality (XR). For example, Figure 1A The electronic device 1000 shown is a mobile phone.

[0045] An active region 1000A and a peripheral region 1000NA may be defined in an electronic device 1000. The electronic device 1000 may display an image through the active region 1000A. The active region 1000A may include a surface defined by a first direction DR1 and a second direction DR2. The peripheral region 1000NA may surround (e.g., encircle) the periphery of the active region 1000A. In one or more embodiments, the peripheral region 1000NA may not be provided.

[0046] The thickness direction of the electronic device 1000 may be parallel (e.g., substantially parallel) to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Therefore, the front (or upper) surface and rear (or lower) surface of the components constituting the electronic device 1000 may be defined based on the third direction DR3.

[0047] refer to Figure 1B The electronic device 1000 can output one or more suitable pieces of information through the display module 40 within the operating system. If the processor 10 executes an application stored in the memory 20 (for example, when the processor 10 executes an application stored in the memory 20), the display module 40 can provide application information to the user through the display panel 41.

[0048] Processor 10 can obtain external input through input module 30 or sensor module 61 and execute the application corresponding to the external input. For example, if the user selects the camera icon displayed on display panel 41 (e.g., when the user selects the camera icon displayed on display panel 41), processor 10 can obtain user input through input sensor 61-2 and activate camera module 71. Processor 10 can send image data corresponding to the captured image obtained by camera module 71 to display module 40. Display module 40 can display the image corresponding to the captured image through display panel 41.

[0049] In one or more embodiments, the operation of the electronic device 1000 has been briefly described. The configuration or arrangement of the electronic device 1000 will be described in more detail below. One or more of the components of the electronic device 1000 as described herein may be provided as an integrated component, and a component may be provided by being separated into two or more components.

[0050] refer to Figure 1B Electronic device 1000 can communicate with external electronic device 1000-A via a network (e.g., a short-range wireless communication network or a long-range wireless communication network). According to one or more embodiments, electronic device 1000 may include a processor 10, a memory 20, an input module 30, a display module 40, a power module 50, a built-in module 60, and an external module 70. According to one or more embodiments, at least one of the components selected from electronic device 1000 as described in one or more embodiments may not be provided, or one or more other components may be added. According to one or more embodiments, one or more of the components described in one or more embodiments (e.g., sensor module 61, antenna module 62, and / or audio output module 63) may be integrated into another component (e.g., display module 40).

[0051] The processor 10 can execute software to control at least one other component (e.g., a hardware component or a software component) connected to the electronic device 1000 and performing one or more suitable data processing or operations. According to one or more embodiments, as at least part of the data processing or operation, the processor 10 can store commands or data received from other components (e.g., input module 30, sensor module 61, or communication module 73) in volatile memory 21, process the commands or data stored in volatile memory 21, and store the resulting data in non-volatile memory 22.

[0052] Processor 10 may include a main processor 11 and an auxiliary processor 12. Main processor 11 may include one or more of a central processing unit (CPU) 11-1 and an application processor (AP). Main processor 11 may also include one or more selected from a graphics processing unit (GPU) 11-2, a communication processor (CP), and an image signal processor (ISP). Main processor 11 may also include a neural network processing unit (NPU) 11-3. Neural network processing unit 11-3 may be a processor specifically designed for processing artificial intelligence models, and the artificial intelligence models may be generated through machine learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the aforementioned networks, but embodiments of this disclosure are not limited to the examples described herein. In addition to hardware architecture, the artificial intelligence model may additionally or alternatively include software architecture. At least two of the processing units and processors selected as described herein may be implemented as a single integrated component (e.g., a single chip), or each may be implemented as a separate component (e.g., multiple chips).

[0053] The auxiliary processor 12 may include a controller 12-1. The controller 12-1 may include interface conversion circuitry and timing control circuitry. The controller 12-1 may receive image signals from the main processor 11, convert the data format of the image signals to match the interface specifications of the display module 40, and output image data. The controller 12-1 may output one or more appropriate control signals required or desired by the display module 40.

[0054] The auxiliary processor 12 may also include a data conversion circuit 12-2, a gamma correction circuit 12-3, a rendering circuit 12-4, etc. The data conversion circuit 12-2 can receive image data from the controller 12-1 and compensate the image data, such that (e.g.) the image is displayed at a desired brightness according to the characteristics of the electronic device 1000 or user settings, or the image data is converted to reduce power consumption or compensate for image retention, etc. The gamma correction circuit 12-3 can convert image data, gamma reference voltage, etc., such that (e.g.) the image displayed on the electronic device 1000 has desired gamma characteristics. The rendering circuit 12-4 can receive image data from the controller 12-1 and render the image data by taking into account the pixel arrangement of the display panel 41 applied to the electronic device 1000, etc. At least one of the data conversion circuit 12-2, gamma correction circuit 12-3, and rendering circuit 12-4 can be integrated into another component (e.g., the main processor 11 or the controller 12-1). At least one of the data conversion circuit 12-2, the gamma correction circuit 12-3, and the rendering circuit 12-4 may also be integrated into the data driver 43, which will be described in more detail herein.

[0055] The memory 20 may store one or more suitable data used by at least one component of the electronic device 1000 (e.g., processor 10 or sensor module 61), as well as input or output data for commands associated therewith. The memory 20 may include at least one of volatile memory 21 and non-volatile memory 22.

[0056] The input module 30 can receive commands or data from outside the electronic device 1000 (e.g., from a user or external electronic device 1000-A) for components of the electronic device 1000 (e.g., processor 10, sensor module 61, or audio output module 63).

[0057] Input module 30 may include a first input module 31 in which commands or data from a user are input, and a second input module 32 in which commands or data from an external electronic device 1000-A are input. The first input module 31 may include a microphone, mouse, keyboard, keys (e.g., buttons), and / or a pen (e.g., a passive or active pen). The second input module 32 may support a specified protocol for connecting the second input module 32 to the external electronic device 1000-A via wired or wireless means. According to one or more embodiments, the second input module 32 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. The second input module 32 may include a connector for physically connecting the second input module 32 to the external electronic device 1000-A, such as an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0058] Display module 40 can visually provide information to the user. Display module 40 may include display panel 41, scan driver 42, and data driver 43. Display module 40 may also include a base, bracket, and window to protect display panel 41.

[0059] The display panel 41 may include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel, and the type or variety of the display panel 41 is not particularly limited thereto. The display panel 41 may be a rigid type or variety, or a flexible type or variety that can be rolled or folded. The display module 40 may also include heat dissipation components, brackets, and / or support members that support the display panel 41.

[0060] The scan driver 42 can be mounted as a driver chip on the display panel 41. In one or more embodiments, the scan driver 42 can be integrated into the display panel 41. For example, the scan driver 42 may include an amorphous (e.g., non-crystalline) silicon TFT gate driver circuit (ASG), a low-temperature polycrystalline silicon (LTPS) TFT gate driver circuit, and / or an oxide semiconductor TFT gate driver circuit (OSG) embedded in the display panel 41. The scan driver 42 can receive control signals from the controller 12-1 and output scan signals to the display panel 41 in response to the control signals.

[0061] The display panel 41 may also include a light-emitting driver. The light-emitting driver can output a light-emitting control signal to the display panel 41 in response to a control signal received from the controller 12-1. The light-emitting driver may be formed or provided separately from the scan driver 42, or integrated into the scan driver 42.

[0062] The data driver 43 can receive control signals from the controller 12-1, convert image data into analog voltages (e.g., data voltages) in response to the control signals, and then output the data voltages to the display panel 41.

[0063] The data driver 43 can be integrated into another component (e.g., controller 12-1). The functions of the interface conversion circuitry and timing control circuitry of controller 12-1 as described in one or more embodiments can also be integrated into the data driver 43.

[0064] The display module 40 may also include a light-emitting driver, a voltage generating circuit, etc. The voltage generating circuit can output one or more suitable voltages required or desired to drive the display panel 41.

[0065] Power module 50 can supply power to components of electronic device 1000. Power module 50 may include a battery that is charged to a power supply voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. Power module 50 may include a power management integrated circuit (PMIC). The PMIC can supply optimized power for each of the modules described in one or more embodiments and the modules described herein. Power module 50 may include a wireless power transmitting / receiving component electrically connected to the battery. The wireless power transmitting / receiving component may include a plurality of coil-shaped antenna radiators.

[0066] The electronic device 1000 may also include a built-in module 60 and an external module 70. The built-in module 60 may include a sensor module 61, an antenna module 62, and an audio output module 63. The external module 70 may include a camera module 71, an optical module 72, and a communication module 73.

[0067] The sensor module 61 can sense input from the user's body or from the pen in the first input module 31, and generate an electrical signal or data value corresponding to the input. The sensor module 61 may include at least one of a fingerprint sensor 61-1, an input sensor 61-2, and a digitizer 61-3.

[0068] The fingerprint sensor 61-1 can generate data values ​​corresponding to the user's fingerprint. The fingerprint sensor 61-1 may include an optical fingerprint sensor or a capacitive fingerprint sensor.

[0069] Input sensor 61-2 can generate data values ​​corresponding to the coordinate information of input from a user's body part or a pen. Input sensor 61-2 can generate data values ​​based on the amount of capacitance change caused by the input. Input sensor 61-2 can sense input from a passive pen or send data to / receive data from an active pen.

[0070] Input sensor 61-2 can also measure biometric signals such as blood pressure, hydration levels, or body fat. For example, if a user touches the sensor layer or sensing panel with a part of his / her body and does not move it for a certain (e.g., a set or predetermined) period of time (e.g., when a user touches the sensor layer or sensing panel with a part of his / her body and does not move it for a certain (e.g., a set or predetermined) period of time), input sensor 61-2 can sense the biometric signal based on the change in the electric field caused by that part of his / her body and output the information desired by the user to display module 40.

[0071] The digitizer 61-3 can generate data values ​​corresponding to the coordinate information input by the pen. The digitizer 61-3 can generate data values ​​based on the change in electromagnetic force caused by the input. The digitizer 61-3 can sense input from a passive pen or send data to / receive data from an active pen.

[0072] At least one of the fingerprint sensor 61-1, the input sensor 61-2, and the digitizer 61-3 can be implemented as a sensor layer formed or provided on the display panel 41 by a continuous process. The fingerprint sensor 61-1, the input sensor 61-2, and the digitizer 61-3 can be disposed or provided on the upper side of the display panel 41, and any one of the fingerprint sensor 61-1, the input sensor 61-2, and the digitizer 61-3 (e.g., the digitizer 61-3) can be disposed or provided on the lower side of the display panel 41.

[0073] At least two of the fingerprint sensor 61-1, input sensor 61-2, and digitizer 61-3 can be formed or provided as integrated into a single sensing panel using substantially the same process. If integrated into a single sensing panel (e.g., when integrated into a single sensing panel), the sensing panel can be positioned or provided between the display panel 41 and a window positioned or provided on the upper side of the display panel 41. According to one or more embodiments, the sensing panel can be positioned or provided on the window, and the location of the sensing panel is not particularly limited.

[0074] At least one of the fingerprint sensor 61-1, the input sensor 61-2, and the digitizer 61-3 can be integrated into the display panel 41. For example, at least one of the fingerprint sensor 61-1, the input sensor 61-2, and the digitizer 61-3 can be formed or provided simultaneously (e.g., concurrently) by the processes used to form or provide elements (e.g., light-emitting elements, transistors, etc.) included in the display panel 41.

[0075] In one or more embodiments, sensor module 61 may generate electrical signals or data values ​​corresponding to the internal or external state of electronic device 1000. Sensor module 61 may also include, for example, gesture sensors, gyroscope sensors, pressure sensors, magnetic sensors, accelerometers, grip sensors, proximity sensors, color sensors, infrared (IR) sensors, biometric sensors, temperature sensors, humidity sensors, and / or illuminance sensors.

[0076] Antenna module 62 may include one or more antennas for transmitting or receiving signals or power from external sources. According to one or more embodiments, communication module 73 may transmit signals to or receive signals from external electronic device 1000-A via an antenna suitable for a communication method. The antenna pattern of antenna module 62 may be integrated into a component of display module 40 (e.g., display panel 41), input sensor 61-2, etc.

[0077] The audio output module 63 may be a device that outputs audio signals to the outside of the electronic device 1000, and may include, for example, a speaker for general purposes (such as multimedia playback or recording playback) and a receiver specifically for telephone reception. According to one or more embodiments, the receiver may be integrally formed or provided with the speaker, or separately formed or provided from the speaker. The audio output mode of the audio output module 63 may be integrated into the display module 40.

[0078] Camera module 71 can capture still images and / or moving images. According to one or more embodiments, camera module 71 may include one or more lenses, image sensors, or image signal processors. Camera module 71 may also include an infrared camera capable of measuring the presence, position, gaze, etc. of a user.

[0079] The optical module 72 can provide light. The optical module 72 may include a light-emitting diode or a xenon lamp. The optical module 72 can operate in conjunction with the camera module 71 or independently.

[0080] Communication module 73 can support the establishment of a wired or wireless communication channel between electronic device 1000 and external electronic device 1000-A, and the performance of communication through the established communication channel. Communication module 73 may include any or all of wireless communication modules (such as cellular communication modules, short-range wireless communication modules, or Global Navigation Satellite System (GNSS) communication modules) and wired communication modules (such as local area network (LAN) communication modules or power line communication modules). Communication module 73 can communicate with external electronic device 1000-A via short-range communication networks such as Bluetooth, WiFi Direct, or Infrared Data Association (IrDA) or long-range communication networks such as cellular networks, the Internet, or computer networks (e.g., LANs or WANs). One or more suitable types or kinds of communication modules 73 as described herein may be implemented as a single chip, or each type or kind may be implemented as a separate chip.

[0081] The input module 30, sensor module 61, camera module 71, etc., can be used to coordinate with the processor 10 to control the operation of the display module 40.

[0082] The processor 10 can output commands or data to the display module 40, audio output module 63, camera module 71, or optical module 72 based on input data received from the input module 30. For example, the processor 10 can generate image data and output the image data to the display module 40 in response to input data applied by a mouse, active pen, etc., or generate command data and output the command data to the camera module 71 or optical module 72 in response to input data. If no input data is received from the input module 30 for a certain period of time (e.g., a set or predetermined period of time), the processor 10 can switch the operating mode of the electronic device 1000 to a low-power mode or a sleep mode to reduce the power consumption of the electronic device 1000.

[0083] The processor 10 can output commands or data to the display module 40, audio output module 63, camera module 71, or optical module 72 based on sensing data received from the sensor module 61. For example, the processor 10 can compare authentication data applied from the fingerprint sensor 61-1 with authentication data stored in the memory 20, and then execute an application based on the comparison result. Based on sensing data sensed by the input sensor 61-2 or digitizer 61-3, the processor 10 can execute commands or output corresponding image data to the display module 40. If the sensor module 61 includes a temperature sensor (e.g., when the sensor module 61 includes a temperature sensor), the processor 10 can receive temperature data about the measured temperature from the sensor module 61, and can further perform brightness correction, etc., on the image data based on the temperature data.

[0084] The processor 10 can receive measurement data from the camera module 71 regarding the presence or absence of a user, the user's position, the user's line of sight, etc. The processor 10 can also perform brightness correction and other functions on the image data based on the measurement data. For example, the processor 10, having determined the presence or absence of a user through input from the camera module 71, can output image data whose brightness has been corrected by the data conversion circuit 12-2 or the gamma correction circuit 12-3 to the display module 40.

[0085] One or more of the aforementioned components can be connected to each other via peripheral communication methods such as a bus, general purpose input / output (GPIO), serial peripheral interface (SPI), mobile industrial processor interface (MIPI), or ultrapath interconnect (UPI) link, and can exchange signals (e.g., commands or data) with each other. Processor 10 can communicate with display module 40 via a mutually agreed interface, and can use, for example, any of the communication methods selected as described herein, and embodiments of this disclosure are not limited to the communication methods described herein.

[0086] The electronic device 1000 according to one or more embodiments of this disclosure may take one or more suitable forms. The electronic device 1000 may include at least one of, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, and a home appliance. The electronic device 1000 according to one or more embodiments of this disclosure is not limited to the devices described herein.

[0087] Figure 2 It is a perspective view of an electronic device according to one or more embodiments.

[0088] refer to Figure 2 The electronic device 1000-1 may include a foldable region FA and multiple non-foldable regions NFA1 and NFA2. The non-foldable regions NFA1 and NFA2 may include a first non-foldable region NFA1 and a second non-foldable region NFA2. The foldable region FA may be disposed or provided between the first non-foldable region NFA1 and the second non-foldable region NFA2. The foldable region FA may be referred to as a foldable region, and the first non-foldable region NFA1 and the second non-foldable region NFA2 may be referred to as a first non-foldable region and a second non-foldable region.

[0089] like Figure 2 As shown, the folding region FA can be folded based on a folding axis FX that is parallel (e.g., substantially parallel) to the second direction DR2. If the electronic device 1000-1 is folded (e.g., when the electronic device 1000-1 is folded), the folding region FA can have a set or predetermined curvature and a set or predetermined radius of curvature. The first non-folding region NFA1 and the second non-folding region NFA2 can be opposite each other (e.g., facing each other), and the electronic device 1000-1 can be folded inward such that (e.g., so that) the display surface DS is not exposed to the outside.

[0090] In one or more embodiments, the electronic device 1000-1 can be folded outwards, such that (e.g.) the display surface DS is exposed to the outside. In one or more embodiments, the electronic device 1000-1 can be folded inwards or outwards in an unfolded state, but the embodiments disclosed herein are not limited thereto.

[0091] Figure 2 The present disclosure shows that an electronic device 1000-1 is defined with a folding axis FX, but the embodiments thereof are not limited thereto. For example, multiple folding axes may be defined in the electronic device 1000-1, and the electronic device 1000-1 may be folded inward or outward in each of the multiple folding axes in an unfolded state.

[0092] Figure 1A and Figure 2Strip-shaped or strip-like electronic device 1000 and foldable or foldable electronic device 1000-1 are shown respectively, but embodiments of this disclosure are not limited thereto. For example, the description provided herein can be applied to one or more suitable electronic devices, such as curved electronic devices, rollable electronic devices, or sliding electronic devices.

[0093] Figure 3 This is a cross-sectional view of a display device according to one or more embodiments. Referring below, reference will be made to... Figure 3 One or more embodiments of this disclosure will be described in more detail.

[0094] In one or more embodiments, the electronic device 1000 may include a display device DD, a first electronic module, a second electronic module, a power supply module, and a housing. The electronic device 1000 may also include a mechanical structure to control the folding operation of the display device DD.

[0095] The display device DD may include a window and an electronic panel. The window may cover the upper surface of the electronic panel and provide the front surface of the electronic device 1000.

[0096] In one or more embodiments, an electronic panel and a window may be configured or provided in a display device DD. In one or more embodiments, the display device DD may be substantially a stacked structure in which multiple components including the electronic panel are stacked. For example, the display device DD may also include at least one component, such as a support plate or damping layer disposed or provided on the rear surface of the electronic panel.

[0097] For example, refer to Figure 3 The display device DD may include a display layer 100, a sensor layer 200, an optical layer 300, and a window 400. In one or more embodiments, the window 400 may correspond to a window as described in one or more embodiments, and the display layer 100, sensor layer 200, and optical layer 300 may correspond to an electronic panel. However, this is merely an example, and the display device DD may not include the optical layer 300 and the window 400.

[0098] Display layer 100 may correspond to display panel 41 as described in one or more embodiments (see [link]). Figure 1B The display layer 100 may include a base layer 110, a circuit layer 120, a component layer 130, and a package layer 140.

[0099] The base layer 110 may be a component that provides a base surface on which the circuit layer 120 is disposed or provided. The base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, a polymer substrate, etc. However, embodiments of this disclosure are not limited thereto, and the base layer 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0100] Circuit layer 120 may be disposed or provided on base layer 110. Circuit layer 120 may include insulating (e.g., electrically insulating) layers, semiconductor patterns, conductive (e.g., electrically conductive) patterns, signal lines, etc. Insulating (e.g., electrically insulating) layers, semiconductor layers, and conductive (e.g., electrically conductive) layers may be formed or provided on base layer 110 by methods such as coating and deposition, and the insulating, semiconductor, and conductive layers may then be selectively patterned by multiple photolithography processes. Subsequently, semiconductor patterns, conductive patterns, and signal lines included in circuit layer 120 may be formed or provided.

[0101] Component layer 130 may be disposed on or provided on circuit layer 120. Component layer 130 may include light-emitting elements. For example, component layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, microLEDs, or nanoLEDs.

[0102] Encapsulation layer 140 may be disposed on or provided on component layer 130. Encapsulation layer 140 can protect component layer 130 from moisture, oxygen and / or impurities such as dust particles.

[0103] Sensor layer 200 may be disposed on or provided on display layer 100. Sensor layer 200 may correspond to sensor module 61 as described in one or more embodiments (see Figure 1B For example, sensor layer 200 may include input sensor 61-2 (see...). Figure 1B However, embodiments of this disclosure are not limited thereto, and may include a fingerprint sensor 61-1 (see [link to relevant documentation]). Figure 1B ), input sensor 61-2 and digitizer 61-3 (see Figure 1B The sensor layer 200 may be formed or provided on the display layer 100 by a continuous process. In this case, the sensor layer 200 may be represented as being directly disposed or provided on the display layer 100. Direct disposal or provision may mean that no third component is disposed or provided between the sensor layer 200 and the display layer 100. For example, no separate adhesive member may be disposed or provided between the sensor layer 200 and the display layer 100. In one or more embodiments, the sensor layer 200 may be coupled to the display layer 100 by an adhesive member. The adhesive member may include commonly available or commonly used adhesives and / or glues.

[0104] The optical layer 300 may be disposed on or provided on the sensor layer 200. The optical layer 300 can reduce the reflectivity of external light incident from outside the electronic device 1000. The optical layer 300 may be directly disposed on or provided on the sensor layer 200. However, it is not limited to this, an adhesive member may be disposed on or provided between the optical layer 300 and the sensor layer 200.

[0105] Window 400 may be disposed or provided on optical layer 300. An adhesive member may be disposed or provided between optical layer 300 and window 400, but embodiments of this disclosure are not particularly limited thereto. Window 400 may include an optically transparent (e.g., substantially transparent) insulating (e.g., electrically insulating) material. For example, window 400 may include glass and / or plastic. Window 400 may have a multilayer or single-layer structure. For example, window 400 may include multiple plastic films bonded to each other with an adhesive, or may include a glass substrate and plastic films bonded to each other with an adhesive.

[0106] In one or more embodiments, the display area of ​​the electronic panel may include a first area and a second area. In one or more embodiments, the first area may have a circular shape (e.g., a substantially circular shape), but may have one or more suitable shapes, such as polygons (e.g., substantially polygonal), ellipses (e.g., substantially elliptical), graphics with at least one curved side, or irregular shapes, and embodiments of this disclosure are not limited thereto. The first area may be referred to as a component area, and the second area may be referred to as a main display area or a general display area.

[0107] For example, the first region may have a higher transmittance than the second region. In one or more embodiments, the resolution of the first region may be lower than the resolution of the second region, but the embodiments of this disclosure are not limited thereto. For example, the first region may have a higher transmittance than the second region, but the resolution of the first region may be substantially the same as the resolution of the second region. The first region may overlap with a camera module. The camera module may correspond to, for example... Figure 1B The camera module 71 shown. In one or more embodiments, the portion of the electronic panel corresponding to the first region can be removed. Therefore, an image may not be displayed in the first region. In one or more embodiments, the electronic panel may correspond to... Figure 3 The display layer 100, sensor layer 200, and optical layer 300 are shown as an example, but this is shown as an example, and in an electronic panel, the sensor layer 200 or optical layer 300 may not be provided, and the embodiments of this disclosure are not limited thereto.

[0108] The driving unit and circuit board may include driving elements for driving pixels of display layer 100. The driving unit may include, for example, gate driving circuitry or data driving circuitry, and the circuit board may include, for example, timing control circuitry or power supply circuitry. In one or more embodiments, the driving unit and circuit board may include driving elements for driving sensor layer 200. However, this is described as an example, and the driving elements for driving sensor layer 200 may be disposed on a substrate separate from the driving unit or circuit board, and embodiments of this disclosure are not limited thereto.

[0109] The driving unit may be located or provided in a non-display area. However, this is shown as an example, and the driving unit may be located or provided in the display area, and the arrangement of the driving unit is not limited thereto. In one or more embodiments, the driving unit may be mounted on the electronic panel as a chip, but the embodiments of this disclosure are not limited thereto. For example, the driving unit may be mounted on a circuit board and connected to the electronic panel via the circuit board.

[0110] The power supply module can supply the power required or desired for the overall operation of the electronic device 1000. The power supply module may correspond to, or be part of, the power supply module 50 as described in one or more embodiments. The power supply module may include a commonly available battery module. In one or more embodiments, a circuit board may be connected to the power supply module to receive power, and the power required or desired by the electronic panel or drive unit may be supplied via the circuit board.

[0111] The first and second electronic modules may include one or more suitable functional modules to operate the electronic device 1000. Each of the first and second electronic modules may be directly mounted on a motherboard electrically connected to the electronic panel, or may be mounted on a separate board and electrically connected to the motherboard via connectors, etc. The motherboard may be provided separately or may correspond to a circuit board. Each of the first and second electronic modules may include at least one of a processor 10, a memory 20, an input module 30, and an external module 70.

[0112] The first electronic module may include a control module, a wireless communication module, an image input module, an audio input module, a memory, and an external interface.

[0113] The control module can control the overall operation of the electronic device 1000. The control module can be a microprocessor. For example, the control module can activate or deactivate the electronic panel. The control module can control other modules, such as image input modules or audio input modules, based on touch signals received from the electronic panel.

[0114] The wireless communication module can communicate with external electronic devices via a first network (e.g., a short-range communication network such as Bluetooth, WiFi Direct, or Infrared Data Association (IrDA)) or a second network (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or WAN)). The communication module included in the wireless communication module can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module can transmit / receive voice signals using a common communication line. The wireless communication module may include a transmitter that modulates and transmits the signal to be transmitted and a receiver that demodulates the received signal.

[0115] The image input module can process image signals and convert them into image data that can be displayed on an electronic panel. The audio input module can receive external audio signals from a microphone in recording mode, voice recognition mode, etc., and convert them into electronic voice data.

[0116] The external interface may include a connector that allows the electronic device 1000 and external electronic devices to be physically connected to each other. For example, the external interface may be used as an interface for connecting the electronic device 1000 to an external charger, a wired / wireless data port, a card (e.g., a memory card, SIM / UIM card, etc.) slot, etc.

[0117] The second electronic module may include an audio output module, a light-emitting module, a light-receiving module, and a camera module. The audio output module can convert audio data received from the wireless communication module or audio data stored in memory and output them externally.

[0118] The light-emitting module can generate and output light. The light-emitting module can output infrared light. The light-emitting module may include LED elements. The light-receiving module can sense infrared light. If infrared light above a set or predetermined level is sensed (e.g., when infrared light above a set or predetermined level is sensed), the light-receiving module can be activated. The light-receiving module may include a complementary metal-oxide-semiconductor (CMOS) sensor. After the infrared light generated from the light-emitting module is output, the infrared light can be reflected by an external object (e.g., a user's finger or face), and the reflected infrared light can be incident on the light-receiving module.

[0119] The camera module can capture both still and moving images. Multiple camera modules can be configured. One or more camera modules can overlap with a first region. External input (e.g., light) can be provided to the camera module through the first region. For example, the camera module can receive natural light through the first region to capture external images.

[0120] The housing provides a receiving space. This receiving space can accommodate the display device DD, the first electronic module, the second electronic module, and the power supply module. The housing protects the components housed within the receiving space. In one or more embodiments, the two housings may be separable from each other, but embodiments of this disclosure are not limited thereto. In one or more embodiments, in addition to the two housings, the electronic device 1000 may also include a hinge unit that connects them to each other. The housings may be connected to the hinge unit to facilitate folding operations. The hinge unit may be disposed or provided between the housings. Furthermore, the electronic device 1000 according to one or more embodiments may include one or more suitable other components, and may not provide any of the components shown, and embodiments of this disclosure are not limited thereto.

[0121] Figure 4 This is an enlarged plan view showing a portion of a display layer according to one or more embodiments. (Reference) Figure 4 The display layer 100 may include multiple pixels PXr, PXg, and PXb. Pixels PXr, PXg, and PXb may include a first pixel PXr, a second pixel PXg, and a third pixel PXb.

[0122] A first light-emitting region PXAR can be defined in the first pixel PXr, a second light-emitting region PXAG can be defined in the second pixel PXg, and a third light-emitting region PXAB can be defined in the third pixel PXb. For example... Figure 4 The circular shape shown (e.g., a substantially circular shape) may correspond to the shapes of the first luminous region PXAR, the second luminous region PXAG, and the third luminous region PXAB, respectively. However, the shape of each of the first luminous region PXAR, the second luminous region PXAG, and the third luminous region PXAB is not limited to this. For example, the first luminous region PXAR, the second luminous region PXAG, and the third luminous region PXAB may have one or more suitable shapes on a plane, such as quadrilaterals (e.g., substantially quadrilaterals), ellipses (e.g., substantially ellipses), triangles (e.g., substantially triangles), other polygons (e.g., other substantially polygons), or atypical shapes.

[0123] In one or more embodiments, the first pixel PXr and the third pixel PXb can be arranged alternately and repeatedly in each of the first direction DR1 and the second direction DR2. The second pixel PXg can be arranged in the space between two diagonally adjacent first pixels PXr and two diagonally adjacent third pixels PXb. However, as... Figure 4The arrangement of the first pixel PXr, the second pixel PXg, and the third pixel PXb shown is an example, and the arrangement of the first pixel PXr, the second pixel PXg, and the third pixel PXb is not particularly limited to this. The diagonal direction described herein can be the direction between the first direction DR1 and the second direction DR2, or the direction opposite to the first direction DR1 and the direction between the second direction DR2.

[0124] In one or more embodiments, the area of ​​the third luminescent region PXAB may be the largest, and the area of ​​the second luminescent region PXAG may be the smallest. However, the embodiments of this disclosure are not limited thereto. For example, the areas of the first luminescent region PXAR, the second luminescent region PXAG, and the third luminescent region PXAB may be substantially the same as each other, or may differ from the example shown.

[0125] Figure 5 This is a cross-sectional view showing a portion of an electronic device according to one or more embodiments. For example, Figure 5 It includes a display layer according to one or more embodiments and along Figure 4 The sectional view shown is taken by line I-I'.

[0126] refer to Figure 5 At least one inorganic layer may be disposed or provided on the upper surface of the base layer 110. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed or provided as multiple layers. Multiple inorganic layers may constitute a barrier layer and / or a buffer layer. In one or more embodiments, the display layer 100 may be shown as including a buffer layer BFL as an inorganic layer.

[0127] The buffer layer BFL can improve or enhance the bonding strength between the base layer 110 and the semiconductor pattern. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are stacked alternately.

[0128] Semiconductor patterns may be formed or provided on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, it is not limited thereto, and the semiconductor pattern may include amorphous (e.g., non-crystalline) silicon, low-temperature polycrystalline silicon, and / or oxide semiconductors.

[0129] Figure 5Only one or more semiconductor patterns are shown, and additional semiconductor patterns may be set or provided in other areas. Semiconductor patterns may be set or provided across pixels according to specific (e.g., set or predetermined) rules. Depending on whether the semiconductor pattern is doped, it may have different electrical properties. A semiconductor pattern may include a first region with high conductivity (e.g., electrical conductivity) and a second region with low conductivity (e.g., electrical conductivity). The first region may be doped with negative or negative-class (N-type or N-type) dopants or positive or positive-class (P-type or P-type) dopants. A P-type or P-type transistor may include a doped region doped with P-type or P-type dopants, and an N-type or N-type transistor may include a doped region doped with N-type or N-type dopants. The second region may be an undoped region or a region doped at a lower concentration than the first region.

[0130] The conductivity of the first region can be greater than that of the second region, and the first region can be used essentially as an electrode or signal line. The second region can essentially correspond to the active (or channel) region of a transistor. For example, a portion of a semiconductor pattern can be the active region of a transistor, another portion can be the source or drain of a transistor, and yet another portion can be a connecting electrode or a connecting signal line.

[0131] Each pixel may include pixel circuitry and a light-emitting element. Pixel circuitry may include multiple transistors and at least one capacitor. Figure 5 The diagram shows a transistor 100PC and a light-emitting element 100PER, 100PEG, or 100PEB included in each of the three pixels.

[0132] The source region SC, active region AL, and drain region DR of transistor 100PC can be formed or provided by a semiconductor pattern. The source region SC and drain region DR can extend from the active region AL in opposite directions in cross-section. Figure 5 A portion of a connection signal line SCL formed or provided from a semiconductor pattern is shown. In one or more embodiments, the connection signal line SCL may be connected in a plane to the drain region DR of transistor 100PC.

[0133] A first insulating layer 101 may be disposed or provided on a buffer layer BFL. The first insulating layer 101 may commonly overlap with multiple pixels and cover a semiconductor pattern. The first insulating layer 101 may be an inorganic and / or organic layer and have a single-layer or multi-layer structure. The first insulating layer 101 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In one or more embodiments, the first insulating layer 101 may be a single-layer silicon oxide layer. Not only the first insulating layer 101, but other insulating layers of the circuit layer 120, as described herein, may be inorganic and / or organic layers and may have a single-layer or multi-layer structure. Inorganic layers may include at least one material selected from those described in one or more embodiments, but embodiments of this disclosure are not limited thereto.

[0134] The gate GT of transistor 100PC can be disposed or provided on the first insulating layer 101. The gate GT can be part of a metal pattern. The gate GT can overlap with the active region AL. In a process of doping semiconductor patterns, the gate GT can be used as a mask.

[0135] The second insulating layer 102 may be disposed or provided on the first insulating layer 101 and may cover the gate GT. The second insulating layer 102 may commonly overlap with the pixel. The second insulating layer 102 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The second insulating layer 102 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In one or more embodiments, the second insulating layer 102 may have a multi-layer structure including silicon oxide layers and silicon nitride layers.

[0136] The third insulating layer 103 may be disposed on or provided on the second insulating layer 102. The third insulating layer 103 may have a single-layer or multi-layer structure. For example, the third insulating layer 103 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0137] The first connection electrode CNE1 may be disposed or provided on the third insulating layer 103. The first connection electrode CNE1 may be connected to the connection signal line SCL through the contact hole CNT-1 passing through the first insulating layer 101, the second insulating layer 102 and the third insulating layer 103.

[0138] A fourth insulating layer 104 may be disposed on or provided on the third insulating layer 103. The fourth insulating layer 104 may be a single-layer silicon oxide layer. A fifth insulating layer 105 may be disposed on or provided on the fourth insulating layer 104. In one or more embodiments, the fifth insulating layer 105 may be an organic layer, but the embodiments disclosed herein are not limited thereto.

[0139] The second connecting electrode CNE2 may be disposed or provided on the fifth insulating layer 105. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 through the contact hole CNT-2 passing through the fourth insulating layer 104 and the fifth insulating layer 105.

[0140] The sixth insulating layer 106 may be disposed on or provided on the fifth insulating layer 105 and may cover the second connection electrode CNE2. In one or more embodiments, the sixth insulating layer 106 may be an organic layer, but the embodiments disclosed herein are not limited thereto.

[0141] Component layer 130 may be disposed or provided on circuit layer 120. Component layer 130 may include light-emitting elements 100PER, 100PEG, and 100PEB. For example, each of light-emitting elements 100PER, 100PEG, and 100PEB may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, microLEDs, or nanoLEDs. In the following description, each of light-emitting elements 100PER, 100PEG, and 100PEB may be described as an organic light-emitting element by way of example, but embodiments of this disclosure are not limited thereto.

[0142] Light-emitting elements 100PER, 100PEG, and 100PEB may include a first light-emitting element 100PER, a second light-emitting element 100PEG, and a third light-emitting element 100PEB. The first light-emitting element 100PER may include a first pixel electrode AER, a first light-emitting layer ELR, and a common electrode CE. The second light-emitting element 100PEG may include a second pixel electrode AEG, a second light-emitting layer ELR, and a common electrode CE. The third light-emitting element 100PEB may include a third pixel electrode AEB, a third light-emitting layer ELR, and a common electrode CE. The common electrode CE included in the first light-emitting element 100PER, the second light-emitting element 100PEG, and the third light-emitting element 100PEB may be provided in a monolithic form. The first pixel electrode AER, the second pixel electrode AEG, and the third pixel electrode AEB may be referred to as the first electrode or the anode. The common electrode CE may be referred to as the second electrode or the cathode.

[0143] In the following text, a first light-emitting element 100PER is described representatively. The descriptions of the second light-emitting element 100PEG and the third light-emitting element 100PEB can be substantially the same as those of the first light-emitting element 100PER. In the following text, the first pixel electrode AER can be referred to as the first electrode AER, the first light-emitting layer ELR can be referred to as the light-emitting layer ELR, and the common electrode CE can be referred to as the second electrode CE.

[0144] The first electrode AER can be disposed or provided on the sixth insulating layer 106. The first electrode AER can be connected to the second connecting electrode CNE2 through the contact hole CNT-3 passing through the sixth insulating layer 106.

[0145] A pixel defining film 107 may be disposed or provided on a sixth insulating layer 106 and may cover a portion of the first electrode AER. A pixel defining opening 107-OP may be defined in the pixel defining film 107. The pixel defining opening 107-OP of the pixel defining film 107 may expose at least a portion of the first electrode AER.

[0146] Active area 1000A (see) Figure 1A The light-emitting region PXAR, PXAG, and PXAB may include light-emitting regions PXAR, PXAG, and PXAB, and non-light-emitting regions adjacent to them. The non-light-emitting regions may surround (e.g., encircle) the light-emitting regions PXAR, PXAG, and PXAB. In one or more embodiments, the light-emitting regions PXAR, PXAG, and PXAB may include a first light-emitting region PXAR, a second light-emitting region PXAG, and a third light-emitting region PXAB. The first light-emitting region PXAR, the second light-emitting region PXAG, and the third light-emitting region PXAB may be defined as portions corresponding to the first electrodes AER, AEG, and AEB, respectively. The first light-emitting region PXAR may emit red light, the second light-emitting region PXAG may emit green light, and the third light-emitting region PXAB may emit blue light.

[0147] The light-emitting layers ELR, ELG, and ELB can be disposed or provided on the first electrodes AER, AEG, and AEB, respectively. The light-emitting layer ELR can be disposed or provided in the region corresponding to the pixel-defined opening 107-OP. For example, the light-emitting layers ELR, ELG, and ELB can be formed or disposed in each of the pixels, respectively. If the light-emitting layers ELR, ELG, and ELB are formed or disposed in each of the pixels (e.g., when the light-emitting layers ELR, ELG, and ELB are formed or disposed in each of the pixels), each of the light-emitting layers ELR, ELG, and ELB can emit light of at least one color among blue, red, and green. However, embodiments of this disclosure are not limited thereto, and the light-emitting layers ELR, ELG, and ELB can be connected to each other and commonly included in a plurality of light-emitting elements. In this case, the light-emitting layers ELR, ELG, and ELB can provide blue light or white light.

[0148] The second electrode CE can be disposed or provided on the light-emitting layers ELR, ELG, and ELB. The second electrode CE can have a monolithic shape and be commonly included in multiple pixels.

[0149] A hole control layer may be disposed or provided between the first electrodes AER, AEG, and AEB and the light-emitting layers ELR, ELG, and ELB. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electronic control layer may be disposed or provided between the light-emitting layers ELR, ELG, and ELB and the second electrode CE. The electronic control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electronic control layer may be commonly formed or provided in multiple pixels using an aperture mask or an inkjet process.

[0150] An encapsulation layer 140 may be disposed on or provided on the component layer 130. The encapsulation layer 140 may include a first inorganic layer 141, an organic layer 142, and a second inorganic layer 143 stacked sequentially, but the layers constituting the encapsulation layer 140 are not limited thereto. The first inorganic layer 141 and the second inorganic layer 143 may protect the component layer 130 from moisture and oxygen, and the organic layer 142 may protect the component layer 130 from foreign matter such as dust particles. The first inorganic layer 141 and the second inorganic layer 143 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, etc. The organic layer 142 may include an acrylic-based organic layer, but embodiments of this disclosure are not limited thereto.

[0151] The sensor layer 200 may be disposed on or provided on the display layer 100. The sensor layer 200 may be referred to as a sensor, an input sensing layer, or an input sensing panel. The sensor layer 200 may include a sensor base layer 210, a first sensor conductive layer 220, a sensor insulating layer 230, a second sensor conductive layer 240, and a sensor protective layer 250.

[0152] The sensor base layer 210 can be directly disposed on or provided on the display layer 100. The sensor base layer 210 can be an inorganic layer comprising at least one of silicon nitride, silicon oxynitride, and silicon oxide. In one or more embodiments, the sensor base layer 210 can be an organic layer comprising epoxy resin, acrylic resin, and / or imide-based resin. The sensor base layer 210 can have a single-layer structure or a multi-layer structure in which the layers are stacked along a third direction DR3.

[0153] Each of the first sensor conductive layer 220 and the second sensor conductive layer 240 may have a single-layer structure or a multi-layer structure in which the layers are stacked along the third direction DR3.

[0154] A conductive layer having a single-layer structure may include a metal layer or a transparent (e.g., substantially transparent) conductive (e.g., electrically conductive) layer. The metal layer may include molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al), or alloys thereof. The transparent conductive layer may include a transparent (e.g., substantially transparent) conductive (e.g., electrically conductive) oxide, such as indium tin oxide, indium zinc oxide, zinc oxide, and / or indium zinc tin oxide. In one or more embodiments, the transparent conductive layer may include a conductive (e.g., electrically conductive) polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, etc.

[0155] A conductive layer having a multilayer structure may include a metal layer. The metal layer may have a three-layer structure, such as titanium / aluminum / titanium. A conductive layer having a multilayer structure may include at least one metal layer and at least one transparent (e.g., substantially transparent) conductive (e.g., electrically conductive) layer.

[0156] The sensor insulating layer 230 may be disposed or provided between the first sensor conductive layer 220 and the second sensor conductive layer 240. The sensor insulating layer 230 may include an inorganic film. The inorganic film may include at least one selected from aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0157] In one or more embodiments, the sensor insulating layer 230 may include an organic film. The organic film may include at least any one of acrylic acid-based resins, methacrylic acid-based resins, polyisoprene-based resins, ethylene-based resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyimide-based resins, polyamide-based resins, and dinoflagellated resins.

[0158] A sensor protective layer 250 may be disposed or provided on the sensor insulating layer 230 and cover the second sensor conductive layer 240. The second sensor conductive layer 240 may include a conductive (e.g., electrically conductive) pattern. The sensor protective layer 250 may cover the conductive (e.g., electrically conductive) pattern and reduce or eliminate the possibility of damage to the conductive pattern in subsequent processes. The sensor protective layer 250 may include an inorganic material. For example, the sensor protective layer 250 may include a silicon nitride, but embodiments of this disclosure are not limited thereto. In one or more embodiments, the sensor protective layer 250 may not be provided.

[0159] Optical layer 300 may be disposed on or provided on sensor layer 200. Optical layer 300 may include light blocking layer 310, multiple color filters 320 and planarization layer 330.

[0160] The light-blocking layer 310 may be disposed or provided to overlap with the conductive pattern of the second sensor conductive layer 240. The sensor protective layer 250 may be disposed or provided between the light-blocking layer 310 and the second sensor conductive layer 240. The light-blocking layer 310 may prevent external light from being reflected by the second sensor conductive layer 240 (or reduce the degree or occurrence of external light reflection). The material constituting the light-blocking layer 310 is not particularly limited, as long as the material is capable of absorbing light. The light-blocking layer 310 may be a black layer, and in one or more embodiments, the light-blocking layer 310 may include a black colorant. The black colorant may include black dyes and / or black pigments. The black colorant may include carbon black, metals such as chromium, and / or oxides thereof.

[0161] Multiple openings, OPR, OPG, and OPB, can be defined in the light-blocking layer 310. The openings OPR, OPG, and OPB can overlap with the first emitting layer ELR, the second emitting layer ELG, and the third emitting layer ELB, respectively, and can be referred to as the first opening OPR, the second opening OPG, and the third opening OPB. The multiple openings OPR, OPG, and OPB can correspond to multiple emitting regions PXAR, PXAG, and PXAB, respectively. The color filter 320 can include a first color filter 320R, a second color filter 320G, and a third color filter 320B. The first color filter 320R, the second color filter 320G, and the third color filter 320B can be configured or provided to correspond to the first opening OPR, the second opening OPG, and the third opening OPB, respectively. The first color filter 320R, the second color filter 320G, and the third color filter 320B can transmit light from the first light-emitting layer ELR, the second light-emitting layer ELG, and the third light-emitting layer ELB that overlap with the first color filter 320R, the second color filter 320G, and the third color filter 320B.

[0162] The planarization layer 330 may cover the light-blocking layer 310 and the color filter 320. The planarization layer 330 may provide a flat (e.g., substantially flat) surface thereon. The planarization layer 330 may comprise an organic material. The planarization layer 330 may have a refractive index similar to that of the first film layer 410 described herein. For example, the difference between the refractive index of the planarization layer 330 and the refractive index of the first film layer 410 may be about 0.05 or less. For example, the planarization layer 330 may have a refractive index of about 1.54.

[0163] In one or more embodiments, optical layer 300 may include a reflection control layer instead of color filter 320. For example, in Figure 5In this configuration, the color filter 320 may not be provided, and a reflection control layer may be added where the color filter 320 is not provided. The reflection control layer may selectively absorb a portion of the frequency band of light reflected from inside the display layer 100 and / or the electronic device 1000 or incident from outside the display layer 100 and / or the electronic device 1000.

[0164] Window 400 may be disposed or provided on optical layer 300. Window 400 may protect display layer 100 from external influences. In one or more embodiments, window 400 may include a plurality of adhesive layers 401 and 402, a first film layer 410, a second film layer 420, and a protective layer 430 (or a first protective layer 430).

[0165] The first film layer 410 can be bonded to the upper surface of the planarization layer 330 using a first adhesive layer 401 between the first film layer 410 and the planarization layer 330. The refractive index of the first film layer 410 can be from about 1.5 to about 1.52. The first film layer 410 can include glass and can be ultrathin glass (UTG). For example, the thickness TK1 of the first film layer 410 can be about 1 mm or less. For example, the thickness TK1 of the first film layer 410 can be about 30 μm. Because the first film layer 410 is designed as a thin film glass layer with a thickness TK1, it is feasible to provide a window 400 with impact resistance, flexibility, and improved or enhanced light transmittance.

[0166] The second film layer 420 can be bonded to the first film layer 410 using a second adhesive layer 402 between the second film layer 420 and the first film layer 410. The thickness TK2 of the second film layer 420 can be set or predetermined to be from about 55 μm to about 75 μm, and can be, for example, about 65 μm. By designing the thickness TK2 of the second film layer 420 to be within a set or predetermined range, the light transmittance of the window 400 can be improved or enhanced, and the non-uniformity of light visible through the window 400 can be reduced, thereby improving or enhancing the external visibility of the image.

[0167] The refractive index of the second film layer 420 can be similar for each wavelength in the visible light range. For example, the minimum and maximum values ​​of the refractive index of the second film layer 420 measured in the visible light range can exist within a similar range with small deviations, and the similarity range can be about 0.2 or less. Therefore, the second film layer 420 can be designed such that (e.g.) the deviation of the refractive index for each wavelength in the visible light range is about 0.2 or less. For example, the difference between the minimum and maximum values ​​of the refractive index of the second film layer 420 measured in the wavelength range of about 450 nm to about 650 nm can be about 0.2 or less. The refractive index of the second film layer 420 can vary depending on the material, the composition ratio and molecular structure of the material, the thickness of the second film layer 420, etc. The second film layer 420 can be a polymer film composed of organic materials. The second film layer 420 can be a film composed of, for example, cellulose triacetate (TAC), acrylic acid, and / or polycarbonate (PC).

[0168] In one or more embodiments, provided that the second film layer 420 has the aforementioned refractive index range, the second film layer 420 may comprise a polyethylene terephthalate (PET) film having an undercoat whose refractive index is controlled or selected. For example, the second film layer 420 may comprise a polyethylene terephthalate film including an undercoat having a refractive index of about 1.47 to about 1.66. For example, if the second film layer 420 comprises a polyethylene terephthalate film (e.g., when the second film layer 420 comprises a polyethylene terephthalate film), the refractive index of the undercoat may be limited to about 1.47 to about 1.66. A more detailed description thereof will be given herein.

[0169] In one or more embodiments, the second film layer 420 may have a refractive index similar to that of an adjacent layer (e.g., the first film layer 410). The difference between the refractive index of the second film layer 420 and the refractive index of the first film layer 410 may be about 0.1 or less, and for example, about 0.05 or less. According to this disclosure, by designing the refractive index of the second film layer 420 to have a low deviation for each wavelength and fall within a range similar to the refractive index of the first film layer 410, the reflectivity of external light can be reduced, and for example, significant reflection of blue light can be reduced, thereby improving or enhancing the visibility of the electronic device 1000.

[0170] The protective layer 430 may be disposed or provided on the second film layer 420. The protective layer 430 may be the uppermost layer among the layers forming or providing the window 400, and may be a layer configured or arranged to provide the outer surface of the window 400. The protective layer 430 may have sufficient or suitable rigidity to protect the display surface of the electronic device 1000.

[0171] The protective layer 430 may include an organic material. In one or more embodiments, the protective layer 430 may be in contact with the second film layer 420. In this case, the protective layer 430 may be formed or provided by depositing and / or coating an organic material on the upper surface of the second film layer 420. Therefore, an adhesive layer may not be provided between the protective layer 430 and the second film layer 420. In one or more embodiments, this is only shown by way of example, and the protective layer 430 may be provided in the form of a film and bonded to the second film layer 420 by an adhesive layer, or it may be provided in the form of a coating on an adhesive layer and attached to the second film layer 420. The protective layer 430 according to one or more embodiments may be provided in one or more embodiments, and the embodiments of this disclosure are not limited thereto.

[0172] The thickness TK3 of the protective layer 430 can be less than the thickness TK2 of the second film layer 420. The thickness TK3 of the protective layer 430 can be set or predetermined to be about 5 μm or less. By designing the thickness TK3 of the protective layer 430 to be within a set or predetermined range, the light transmittance of the window 400 can be improved or enhanced, and the non-uniformity of light visible through the window 400 can be reduced, thereby improving or enhancing the external visibility of the image.

[0173] The protective layer 430 may have a refractive index similar to that of the first film layer 410. The difference between the refractive index of the protective layer 430 and the refractive index of the first film layer 410 may be about 0.1 or less, and for example, about 0.05 or less. According to this disclosure, by designing the refractive index of the protective layer 430 to be within a range similar to that of the first film layer 410, the reflectivity of external light can be reduced, and for example, significant reflection of blue light can be reduced, thereby improving or enhancing the visibility of the electronic device 1000.

[0174] The protective layer 430 may also include a low-reflection layer. The refractive index of the low-reflection layer may be about 1.48 or less. The thickness of the low-reflection layer may be about 10 nm to about 200 nm. In one or more embodiments, the protective layer 430 may also include an anti-fingerprint layer. For example, the protective layer 430 may have a structure in which two or more layers are stacked.

[0175] In one or more embodiments, each of the first adhesive layer 401 and the second adhesive layer 402 constituting the window 400 may be a pressure-sensitive adhesive layer. The thickness TK01 of the first adhesive layer 401 or the thickness TK02 of the second adhesive layer 402 may be less than the thickness of the second film layer 420. Each of the thickness TK01 of the first adhesive layer 401 and the thickness TK02 of the second adhesive layer 402 may be about 50 μm or less, for example, about 50 μm. If the thickness TK01 of the first adhesive layer 401 and the thickness TK02 of the second adhesive layer 402 become too large or considerably large (e.g., when the thickness TK01 of the first adhesive layer 401 and the thickness TK02 of the second adhesive layer 402 become too large or considerably large), the light transmittance may decrease and the bending characteristics may deteriorate. If the thickness TK01 of the first adhesive layer 401 and the thickness TK02 of the second adhesive layer 402 become too small or considerably small (e.g., when the thickness TK01 of the first adhesive layer 401 and the thickness TK02 of the second adhesive layer 402 become too small or considerably small), delamination between the layers may occur or impact resistance may decrease, thereby reducing reliability. According to this disclosure, it is feasible to design the thickness TK01 of the first adhesive layer 401 and the thickness TK02 of the second adhesive layer 402 to provide a window 400 with sufficient or suitable impact resistance and improved or enhanced visibility within a set or predetermined range.

[0176] The first adhesive layer 401 and the second adhesive layer 402 may have refractive indices similar to those of adjacent layers. For example, the first adhesive layer 401 and the second adhesive layer 402 may have refractive indices similar to those of the first film layer 410. The difference between the refractive index of each of the first adhesive layer 401 and the second adhesive layer 402 and the refractive index of the first film layer 410 may be about 0.1 or less, and for example, about 0.05 or less. According to this disclosure, by designing the refractive indices of the first adhesive layer 401 and the second adhesive layer 402 to have low deviations for each wavelength and to be similar to those of adjacent layers, the reflectivity of external light can be reduced, and for example, significant reflection of blue light can be reduced, thereby improving or enhancing the visibility of the electronic device 1000.

[0177] In one or more embodiments, the outermost film of window 400 may have sufficient or suitable hardness to protect underlying components, such as a display panel. For example, in one or more embodiments, the outermost film may be a second film layer 420, and the second film layer 420 may have a nanoindentation Vickers hardness of about 35 Hv or greater and a crack strain of about 2% or greater. By selecting a film with sufficient or suitable hardness as the outermost film, window 400 can stably or appropriately provide the function of protecting the display panel.

[0178] Figure 6It is a cross-sectional view showing a portion of an electronic device according to one or more embodiments. Figure 6 It shows the relationship with Figure 5 The corresponding area. (Similar to...) Figure 5 Compared to the electronic device 1000 shown, such as Figure 6 The electronic device 1000-1 shown may include windows 400-1 with different layer structures. Repeated descriptions are not required below.

[0179] refer to Figure 6 The window 400-1 may also include an additional protective layer 440 (hereinafter referred to as the second protective layer 440) separate from the first protective layer 430. The second protective layer 440 may be disposed or provided between the second adhesive layer 402 and the second film layer 420. The thickness TK4 of the second protective layer 440 may be set or predetermined in the range of about 5 μm to about 50 μm.

[0180] If the second membrane layer 420 is composed of a material with a high water vapor transmission rate (WVTR) (e.g., when the second membrane layer 420 is composed of a material with a high water vapor transmission rate (WVTR), then the second protective layer 440 can prevent defects in the second membrane layer 420 (or reduce the degree or occurrence of defects) and improve or enhance the reliability of the window 400-1. For example, if the second membrane layer 420 is provided as a TAC membrane (e.g., when the second membrane layer 420 is provided as a TAC membrane), then the second membrane layer 420 can have a high water vapor transmission rate of about 1000 or greater, which may reduce durability in high temperature and high humidity environments. According to this disclosure, by further including the second protective layer 440, defects due to moisture permeability can be prevented (or the degree or occurrence of defects due to moisture permeability can be reduced).

[0181] The second protective layer 440 may include an organic material. The second protective layer 440 may be provided in the form of a film. In this case, an additional adhesive layer may be further disposed or provided between the second protective layer 440 and the second film layer 420. The second protective layer 440 may include, for example, polyethylene terephthalate (PET), acrylic acid, cyclic olefin polymer (COP), polyimide (PI), polyethylene naphthalate (PEN), and / or polyamide (PA). However, these are described as examples, and the second protective layer 440 may be formed or provided directly by coating under the second film layer 420.

[0182] In one or more embodiments, the second protective layer 440 may comprise an elastic material, such as polyurethane (PU), polyester, and / or acrylic foam. In this case, the modulus of the second protective layer 440 may be about half or less of the modulus of the second film layer 420. The modulus of the second protective layer 440 may be about 1 GPa or less. Therefore, sufficient or suitable impact resistance can be ensured to protect the underlying layer.

[0183] In this disclosure, modulus may refer to the elastic modulus. For example, modulus may be defined as the ratio of stress to strain. For example, the modulus of the second protective layer 440 may correspond to the slope of the elastic segment below the yield stress value in a stress-strain diagram obtained from a tensile or shear test performed on the second protective layer 440. For example, the modulus of the second protective layer 440 may correspond to a value obtained by dividing stress by strain, where stress is the force applied to the second protective layer 440 per unit area and strain is the strain value per unit length. Hereinafter, the modulus of each layer may correspond to the elastic modulus and will be referred to as modulus for ease of explanation.

[0184] In one or more embodiments, in this case, although no additional protective layer such as a damping layer is further disposed or provided between the optical layer 300 and the first film layer 410, the underlying layers of the electronic device 1000-1, such as the display layer 100 or sensor layer 200, can be stably protected. With the damping layer having a thickness of approximately 100 μm, the addition of the damping layer can improve or enhance the impact resistance of the electronic device 1000-1, but the thickness of the electronic device 1000-1 may increase. According to this disclosure, by including a window 400-1 with improved or enhanced impact resistance, the electronic device 1000-1 can ensure sufficient or suitable impact resistance, thereby enabling the provision of an electronic device 1000-1 with a low thickness.

[0185] In one or more embodiments, the second protective layer 440 may further include fluorine as an additive. Then, as the water resistance of the second protective layer 440 is improved or enhanced, damage to the window 400-1 due to moisture permeability or the like can be prevented (or the extent or occurrence of damage to the window 400-1 due to moisture permeability or the like can be reduced).

[0186] In one or more embodiments, by further including a second protective layer 440, window 400-1 may not require an additional film layer. For example, even without an additional film layer between the first adhesive layer 401 and the optical layer 300, window 400-1 can ensure sufficient or suitable impact resistance and can mitigate the problem of reduced light transmittance due to the addition of a film layer. Therefore, window 400-1 can minimize or reduce the number of second film layers 420, thereby enabling the electronic device 1000-1 to provide improved or enhanced external visibility.

[0187] Figure 7A It is a graph showing the change in refractive index according to the wavelength of the layers that make up the optical layer. Figure 7B This is a graph showing the refractive index variation according to wavelength for a comparative embodiment, and Figure 7C This is a graph showing the variation of reflectivity according to wavelength for a comparative embodiment.

[0188] exist Figure 7A In the diagram, the first curve R1 shows the refractive index change based on the wavelength of the film composed of polyethylene terephthalate (PET), the second curve P1 shows the refractive index change based on the wavelength of the film composed of polyimide (P1), the third curve P2 shows the refractive index change based on the wavelength of the film composed of glass, and the fourth curve P3 shows the refractive index change based on the wavelength of the film composed of cellulose triacetate (TAC). Figure 7B The graph R11 shown illustrates the refractive index variation according to the wavelength of the film composed of polyethylene terephthalate (PET). Figure 7C The graph R12 shown illustrates the change in reflectance based on the wavelength of the film composed of polyethylene terephthalate (PET). Figures 7A to 7C The composition of polyethylene terephthalate (PET) described herein may be a comparative embodiment in which the base coating is not controlled. Hereinafter, reference will be made to... Figures 7A to 7C One or more embodiments of this disclosure will be described in more detail.

[0189] refer to Figure 7A and Figure 7B It can be observed that the film composed of polyethylene terephthalate (PET) exhibits a relatively significant refractive index deviation according to wavelength. The PET film has a refractive index of approximately 1.7 at a wavelength of approximately 450 nm and a refractive index of approximately 1.66 or less at a wavelength of approximately 650 nm. Therefore, the refractive index deviation according to wavelength of the PET film is observed to be approximately 0.04, particularly in the wavelength range from approximately 450 nm to approximately 650 nm. Furthermore, referring to the second curve P1 for the film composed of polyimide (PI), a deviation of approximately 0.15 can be observed. Figure 7C The film composed of polyethylene terephthalate (PET) has a reflectance deviation that varies in the range of about 5% to about 6%.

[0190] refer to Figure 7AThe third curve P2 and the fourth curve P3 have relatively lower deviations than the first curve R1 or the second curve P1. Referring to the third curve P2, it can be observed that the film composed of glass has a uniform (e.g., substantially uniform) refractive index of about 1.5 in the wavelength range of about 400 nm to about 700 nm, and has similar refractive indices with almost no deviation along the wavelength. Referring to the fourth curve P3, it can be observed that the film composed of TAC has a uniform (e.g., substantially uniform) refractive index of about 1.42 in the wavelength range of about 400 nm to about 700 nm, and has similar refractive indices with almost no deviation along the wavelength.

[0191] Table 1 shows the reflectance of films composed of polyethylene terephthalate (PET) and films composed of TAC, as well as the proportion of red light in the light reflected from the films. The ratio of blue light to b .

[0192] Table 1

[0193] Referring to Table 1, it can be observed that the proportion of reflected blue light b The reflectance is significantly lower in both the reflectance measured using the included specular component factor (SCI) method and the reflectance measured using the excluded specular component factor (SCE) method. The reflectance in the SCI method refers to the reflectance measured from light that includes specular reflection, while the reflectance in the SCE method refers to the reflectance measured from light that excludes specular reflection and includes only diffuse reflection (including scattered reflection). index and b The indices represent the proportions of red and blue light in the colorimeter, respectively, and increase with b. As the index decreases, the reflectivity of blue light (e.g., short-wavelength light) increases, causing the reflected light to appear blue. Referring to Table 1, it can be observed that the reflectivity in the SCI method and the SCE method are essentially similar to each other, differing by only about 0.1% in the comparative embodiment and the first embodiment, respectively. However, if we look at b... Index (e.g., when looking at b) When the index is calculated, the SCI method shows an increase of approximately 1.3 and the SCE method shows an increase of approximately 1.9. For example, it can be observed that in the first embodiment, which includes a film layer composed of TAC, the proportion of blue light reflected is relatively significantly reduced, and as a result, although the amount of reflected light itself does not change much, the proportion of short-wavelength light in the reflected light is reduced. Therefore, compared with the comparative embodiment, the phenomenon of reflected light appearing blue in the first embodiment can be reduced.

[0194] According to this disclosure, the window can be formed or provided with a film layer made of a material having a similar refractive index by wavelength. In this case, the problem of prominent reflectivity of short-wavelength light in the reflected light can be improved, such that (e.g.) the reflectivity by wavelength can be relatively or substantially uniform. Therefore, the tendency of reflected light emitted from the window to appear blue can be reduced, thereby enabling the provision of electronic devices with improved or enhanced color uniformity.

[0195] Table 2 shows the results for, such as Figure 5 The results of measuring the refractive index of each layer of the window shown are shown, as well as the reflectivity of the window.

[0196] Table 2

[0197] A comparative embodiment may be a window having the following stacked structure: a planarization layer 330 having a refractive index of about 1.54, a first adhesive layer 401 having a refractive index of about 1.47, a first film layer 410 having a refractive index of about 1.51, a second adhesive layer 402 having a refractive index of about 1.47, a second film layer 420 having a refractive index of about 1.66, and a protective layer 430 having a refractive index of about 1.52. A first embodiment may be a window in which the refractive index of the second film layer 420 is designed to be different from that of the comparative embodiment, and a second embodiment may be a window in which all layers are designed to have a refractive index substantially the same as that of the protective layer of the comparative embodiment. Referring to Table 2, the SCI reflectance, measured by including both specular and diffuse light, is relatively lower in the first and second embodiments than in the comparative embodiment. For example, as in the first embodiment, by controlling the refractive index of the second film layer 420 to have a relatively small deviation from that of adjacent layers (e.g., the second adhesive layer 402 or the protective layer 430), the reflectance of the external light itself is also reduced.

[0198] Furthermore, as in the second embodiment, by controlling that the layers constituting the window have substantially the same refractive index, the reflectivity of external light can be further reduced. For example, according to this disclosure, by reducing the difference in refractive index between adjacent layers or by designing the refractive indices to be similar to each other, the reflectivity of the window can be reduced and the display characteristics can be improved or enhanced.

[0199] In one or more embodiments, the film layer 420 according to one or more embodiments may include polyethylene terephthalate comprising an undercoat whose refractive index is controlled. The film layer 420 may include polyethylene terephthalate comprising an undercoat whose refractive index is controlled in the range of about 1.47 to about 1.66. Table 3 describes the values ​​of reflectance measured by the SCI method and the SCE method and a and b Index. In Table 3, the third embodiment may be a film layer comprising polyethylene terephthalate including an undercoat layer whose refractive index is controlled to be about 1.58, and the comparative embodiment may be a film layer comprising polyethylene terephthalate including an undercoat layer having a refractive index outside the range of about 1.47 to about 1.66.

[0200] Table 3

[0201] Referring to Table 3, the reflectance of both the comparative embodiment and film 420, measured by the SCI method, is approximately 3.8%, and their reflectance, measured by the SCE method, is approximately 0.7%, showing the same results. Conversely, it can be observed that in both the comparative embodiment and film 420, a... index and b The indices differ from one another. For example, for film layer 420, the b value measured by the SCI method... The index was approximately -3.0, which is an increase of approximately 1.4 compared to the comparative embodiment. Furthermore, for film layer 420, the b... (measured by the SCE method) The index is approximately -4.3, which is an increase of approximately 1.1 compared to the comparative embodiment. For example, since the proportion of blue light reflected from the film layer 420, which includes a base coating whose refractive index is controlled, is relatively significantly reduced, it can be observed that although the amount of reflected light itself does not change much, the proportion of short-wavelength light in the reflected light is reduced. Therefore, in the third embodiment, the phenomenon of the reflected light appearing blue can be reduced compared to the comparative embodiment. According to this disclosure, if the refractive index of the base coating is designed to be within a set or predetermined range (e.g., when the refractive index of the base coating is designed to be within a set or predetermined range), polyethylene terephthalate can be used as film layer 420, thereby enabling the provision of electronic devices with improved reflected light color and sufficient or suitable rigidity.

[0202] According to this disclosure, the electronic device can reduce the reflectivity of external light and mitigate the problem of color imbalance caused by increased reflectivity of specific light. Therefore, with improved or enhanced color appearance, the display quality of the electronic device can be enhanced.

[0203] Although one or more embodiments of this disclosure have been described, those skilled in the art will understand that one or more suitable modifications and changes can be made to the embodiments without departing from the spirit and scope of this disclosure. Therefore, the scope of this disclosure should not be limited to the embodiments described in the detailed description of this disclosure, but should be determined by the appended claims and their equivalents.

Claims

1. A display device, comprising: The display layer includes multiple light-emitting elements; An optical layer is located on the display layer. as well as Window, on the optical layer, in: The optical layer includes a light-blocking layer and a plurality of color filters. The light-blocking layer has a plurality of openings defined therein and corresponding to a plurality of light-emitting regions. The plurality of color filters are configured to correspond to the plurality of openings respectively. The window includes a thin-film glass layer, a film layer provided on the thin-film glass layer and having a first refractive index, a first protective layer provided on the film layer and having a second refractive index, and an adhesive layer having a third refractive index in contact with any one of the thin-film glass layer, the film layer, and the first protective layer; and The difference between the maximum and minimum values ​​of the first refractive index measured in the wavelength range of 450 nm to 650 nm is 0.2 or less.

2. The display device according to claim 1, wherein, At the same wavelength, the difference between the refractive index of the thin-film glass layer and each of the first, second, and third refractive indices is 0.05 or less.

3. The display device according to claim 2, wherein: The adhesive layer contacts each of the film layer and the thin-film glass layer; and The thickness of the adhesive layer is 50 μm or less.

4. The display device according to claim 1, wherein, The window also includes a second protective layer beneath the membrane layer, and The membrane layer includes cellulose triacetate.

5. The display device according to claim 4, wherein: The optical layer further includes a planarization layer covering the plurality of color filters and the light-blocking layer; and The adhesive layer is located between the film layer and the planarization layer and is in contact with the planarization layer.

6. The display device according to claim 5, wherein, The second protective layer includes fluorine.

7. The display device according to claim 5, wherein, The second protective layer is elastic.

8. The display device according to claim 7, wherein, The modulus of the second protective layer is half or less of the modulus of the film layer.

9. The display device according to claim 5, wherein, The thickness of the second protective layer is 5 μm to 50 μm.

10. The display device according to claim 5, wherein, At the same wavelength, the difference between the refractive index of the planarization layer and the first refractive index of the film layer is 0.05 or less.

11. The display device according to claim 1, wherein: The first protective layer is in contact with the film layer; and The thickness of the first protective layer is 5 μm or less.

12. The display device according to claim 1, wherein, At the same wavelength, the first refractive index, the second refractive index, and the third refractive index are the same as each other.

13. An electronic device comprising: Multiple housing units, each providing a predetermined accommodation space; A hinge unit is provided between the plurality of housing units and connects the plurality of housing units to each other; as well as The display device is located in the predetermined accommodating space. The display device includes: The display layer includes multiple light-emitting elements; An optical layer, on the display layer; and Window, on the optical layer, in: The optical layer includes a light-blocking layer, a plurality of color filters, and a planarization layer. The light-blocking layer has a plurality of openings defined therein and corresponding to a plurality of light-emitting regions. The plurality of color filters are respectively configured to correspond to the plurality of openings. The planarization layer covers the plurality of color filters. The window includes a thin-film glass layer, a film layer provided on the thin-film glass layer and having a first refractive index, a first protective layer disposed on the film layer and having a second refractive index, and an adhesive layer having a third refractive index and in contact with at least one of the thin-film glass layer, the film layer, and the first protective layer. Wherein, at the same wavelength, each of the difference between the refractive index of the planarization layer and the first refractive index of the film layer, and the difference between the refractive index of the thin film glass layer and the first refractive index of the film layer, is 0.05 or less.

14. The electronic device according to claim 13, wherein, At the same wavelength, the difference between the third refractive index and the refractive index of the thin-film glass layer is 0.05 or less.

15. The electronic device according to claim 13, wherein, The difference between the maximum and minimum values ​​of the first refractive index measured in the wavelength range of 450 nm to 650 nm is 0.2 or less.

16. The electronic device according to claim 13, wherein, The window also includes a second protective layer between the film layer and the optical layer, and The adhesive layer is in contact with each of the second protective layer and the planarization layer.

17. The electronic device according to claim 16, wherein, The thickness of the second protective layer is 5 μm to 50 μm.

18. The electronic device according to claim 13, wherein, The first protective layer is in contact with the film layer.

19. The electronic device according to claim 13, wherein, The thickness of the thin-film glass layer is 1 mm or less.

20. The electronic device according to claim 13, wherein, At the same wavelength, each of the first refractive index, the second refractive index, and the third refractive index is equal to the refractive index of the thin-film glass layer.

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